Silicon wafer rewinding machine and silicon wafer rewinding method

Abstract

The invention discloses a silicon wafer rewinding machine and a silicon wafer rewinding method, and the silicon wafer rewinding machine comprises a workbench which is provided with a first opening position for placing a first material flower basket and a second opening position for placing a second material flower basket; a first lifting mechanism capable of lifting the silicon wafers in the first material basket upwards and a second lifting mechanism capable of bearing the silicon wafers and placing the silicon wafers in the second material basket downwards are respectively positioned below the first opening position and the second opening position; and the silicon wafer conveying mechanism is arranged above the workbench and can convey the silicon wafer lifted above the first opening position to the position above the second opening position. The silicon wafer rewinding machine is simple in structure, the conveying time of the silicon wafer clamping mechanism is short, only one-time conveying is needed, the silicon wafers are not prone to being damaged, and the silicon wafer rewinding efficiency is high.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor equipment, and further relates to a silicon wafer flipping machine and a silicon wafer flipping method. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it is called a round wafer. Silicon wafers are the carriers used in the production of integrated circuits. Generally speaking, silicon wafers refer to single-crystal silicon wafers. Single-crystal silicon wafers are pulled and refined from ordinary silicon sand, and then made into single-crystal silicon rods through a series of measures such as dissolution, purification, and distillation. After polishing and slicing, the single-crystal silicon rods become silicon wafers. In the production and processing of silicon wafers, it is usually necessary to clean and dry the silicon wafers. First, place the silicon wafers in a basket, and then put the basket into the cleaning solution according to the process ratio to clean the silicon wafers. Then, put the cleaned silicon wafers into the oven to bake and dry.

[0003] The silicon wafer basket includes a PP basket made of PP material and a PFA basket made of PFA material. The PP basket is usually used for transporting silicon wafers due to its light weight, but the PP basket does not have the characteristics of acid and alkali resistance or high temperature resistance, so it cannot be directly used for cleaning and other processes of silicon wafers. The PFA basket can be cleaned and other processes with silicon wafers placed therein due to its acid and alkali resistance and high temperature resistance. In this way, the silicon wafers in the PP basket need to be transported to the PFA basket for subsequent cleaning and other processes. In the prior art, a manipulator is usually used to clamp the two opposite sides of the silicon wafer, grab the silicon wafer from the PP basket in the axial direction, and then the transport mechanism removes the PP basket, and other transport mechanisms transport the PFA basket, and then the manipulator puts the grabbed silicon wafer into the PFA basket. On the one hand, the manipulator grabs the silicon wafer and stays in the air for a long time, resulting in low efficiency of flipping the wafer. On the other hand, the silicon wafer is easily damaged when it is grabbed in the air for a long time. Summary of the invention

[0004] Aiming at the technical problem that in the prior art, a manipulator is used to grab silicon wafers, which results in a long wafer rewinding time and easy damage to the silicon wafers, an object is to provide a silicon wafer rewinding machine.

[0005] Another object of the present invention is to provide a silicon wafer flipping machine, the silicon wafer flipping machine having:

[0006] A workbench, the workbench having a first opening position for placing a flower basket of a first material and a second opening position for placing a flower basket of a second material;

[0007] A first lifting mechanism capable of lifting the silicon wafers in the first material basket upwards and a second lifting mechanism capable of receiving the silicon wafers and placing them downwards in the second material basket are respectively located below the first opening position and below the second opening position;

[0008] The silicon wafer conveying mechanism is arranged above the workbench and can convey the silicon wafer lifted above the first opening to above the second opening.

[0009] Preferably, the film rewinding machine further comprises:

[0010] Two parallel and spaced slide rails are arranged above the workbench, one end of which is located above the first opening position, and the other end of which is located above the second opening position;

[0011] The silicon wafer conveying mechanism moves back and forth from one end to the other end of the slide rail.

[0012] Preferably, the silicon wafer conveying mechanism has:

[0013] A silicon wafer clamping mechanism capable of clamping the silicon wafer lifted by the first lifting mechanism and placing the silicon wafer on the second lifting mechanism;

[0014] A transport frame seat can be located above the flower basket and move back and forth on the slide rail, and the silicon wafer clamping mechanism is arranged on the transport frame seat.

[0015] Preferably, the clamping mechanism has at least one pair of silicon wafer clamping members symmetrically arranged on both sides of the transport frame; preferably, each silicon wafer clamping member comprises:

[0016] A clamping drive mechanism is arranged on the transport frame seat;

[0017] The two clamping plates of each pair of silicon wafer clamping members can be relatively movably arranged symmetrically on the two opposite inner sides of the conveying frame seat, and the clamping driving mechanism is connected to the clamping plate driving to drive the clamping plate to move relatively on the inner side of the conveying frame seat to symmetrically clamp the silicon wafer on the first lifting mechanism or place the silicon wafer on the second lifting mechanism.

[0018] Preferably, the transport frame is composed of one or more square frames connected side by side, and the square frame includes:

[0019] The supporting plates are arranged opposite to each other, and the outer sides of the outer supporting plates of the two outer square frames are provided with a plurality of sliding blocks, and the sliding blocks are slidably supported on the slide rails of the film rewinding machine;

[0020] The two fixing plates are arranged opposite to each other, and the two fixing plates and the two supporting plates together form the square frame, and the clamping plate of the silicon wafer clamping member is arranged on the inner side of the fixing plate.

[0021] Preferably, the silicon wafer clamping member further comprises:

[0022] A push-pull shaft is slidably passed through the fixing plate, the inner end of the push-pull shaft is fixedly connected to the clamping plate, and the outer end of the push-pull shaft is directly or indirectly connected to the driving shaft of the clamping driving mechanism;

[0023] A pair of guide shafts are located on both sides of the push-pull shaft and can slidably pass through the fixing plate, and the inner ends of the guide shafts are fixedly connected to the clamping plate.

[0024] Preferably, the clamping drive mechanism is fixed on the fixed plate, and the drive shaft of the clamping drive mechanism is connected to the push-pull shaft by a connecting rod;

[0025] Preferably, the fixing plates between two adjacent square frames are fixedly connected by a connecting plate;

[0026] Preferably, the clamping plate is provided with an inclined clamp, and the inclined clamp is provided with a slot for clamping the silicon wafer.

[0027] Preferably, the wafer rewinding machine further comprises a cylinder linear guide rail driving the wafer conveying mechanism to perform linear reciprocating motion, and a mounting plate connected to the cylinder linear guide rail is provided on the outer side of a support plate on one side of the wafer conveying mechanism.

[0028] Preferably, the first and second lifting mechanisms respectively have:

[0029] A silicon wafer lifting mechanism, wherein the silicon wafer lifting mechanism is a screw slide module that can be lifted longitudinally, and the slide is provided with a mounting platform that can follow the lift of the slide;

[0030] The silicon wafer carrying mechanism comprises a support rod fixed on the mounting platform and passing through the first and second openings, and a silicon wafer carrier arranged at the top of the support rod. Preferably, the silicon wafer carrier has a tilting clamp having a plurality of slots for clamping the silicon wafer.

[0031] Preferably, a flower basket made of a first material is disposed on the first opening position, and a flower basket made of a second material is disposed on the second opening position. Preferably, the flower basket made of the first material is a flower basket made of an ordinary material, and the flower basket made of the second material is an acid- and alkali-resistant and anti-corrosion flower basket. More preferably, the flower basket made of the first material is a PP flower basket, and the flower basket made of the second material is a PFA flower basket.

[0032] Another object of the present invention is to provide a method for flipping a silicon wafer, the method comprising the following steps:

[0033] Step S1, the silicon wafer carrier of the first lifting mechanism lifts the silicon wafer in the first material basket located at the first opening upward;

[0034] Step S2, the silicon wafer gripping member of the silicon wafer conveying mechanism grips the silicon wafer on the silicon wafer carrying platform of the first lifting mechanism, and the conveying frame of the silicon wafer conveying mechanism conveys the silicon wafer gripping member with the silicon wafer to above the second opening position;

[0035] Step S3, the silicon wafer gripping member of the silicon wafer conveying mechanism releases the silicon wafer onto the silicon wafer carrier of the second lifting mechanism;

[0036] Step S4, the silicon wafer carrier of the second lifting mechanism descends downward and places the silicon wafer in the second material basket at the second opening.

[0037] The present invention provides a silicon wafer conveying mechanism for a wafer rewinding machine, wherein the silicon wafer conveying mechanism comprises:

[0038] A silicon wafer clamping mechanism capable of clamping the silicon wafer located above the flower basket of the wafer rewinding machine;

[0039] A transport frame seat can be located above the flower basket and can slide on the wafer rewinding machine, and the silicon wafer clamping mechanism is arranged on the transport frame seat.

[0040] Preferably, the clamping mechanism has at least one pair of silicon wafer clamping members symmetrically arranged on both sides of the transport frame; preferably, each silicon wafer clamping member comprises:

[0041] A clamping drive mechanism is arranged on the transport frame seat;

[0042] The two clamping plates of each pair of silicon wafer clamping members are relatively movably arranged symmetrically on the two opposite inner sides of the conveying frame seat, and the clamping drive mechanism is connected to the clamping plate driving to drive the clamping plate to move relatively on the inner side of the conveying frame seat to symmetrically clamp the silicon wafers above the flower basket.

[0043] Preferably, the transport frame is composed of one or more square frames connected side by side, and the square frame includes:

[0044] The supporting plates are arranged opposite to each other, and the outer sides of the outer supporting plates of the two outer square frames are provided with a plurality of sliding blocks which can be slidably supported on the film rewinding machine;

[0045] The two fixing plates are arranged opposite to each other, and the two fixing plates and the two supporting plates together form the square frame, and the clamping plate of the silicon wafer clamping member is arranged on the inner side of the fixing plate.

[0046] Preferably, the silicon wafer clamping member further comprises:

[0047] The push-pull shaft can slide through the fixed plate, the inner end of the push-pull shaft is fixedly connected to the clamping plate, and the outer end of the push-pull shaft is directly or indirectly connected to the driving shaft of the clamping driving mechanism.

[0048] Preferably, the silicon wafer clamping member further comprises:

[0049] A pair of guide shafts are located on both sides of the push-pull shaft and can slidably pass through the fixing plate, and the inner ends of the guide shafts are fixedly connected to the clamping plate.

[0050] Preferably, the clamping drive mechanism is fixed on the fixed plate, and the drive shaft of the clamping drive mechanism is connected to the push-pull shaft by a connecting rod.

[0051] Preferably, the fixing plates between two adjacent square frames are fixedly connected by connecting plates.

[0052] Preferably, the clamping plate has an inclined clamp, and the inclined clamp has a plurality of slots for clamping the silicon wafer.

[0053] Preferably, slide rails are provided on both sides of the film rewinder, and the sliders on the support plate can be slidably clamped on the slide rails.

[0054] Preferably, the wafer rewinding machine is provided with a cylinder linear guide rail driving the wafer conveying mechanism to perform linear reciprocating motion, and a mounting plate connected to the cylinder linear guide rail is provided on the outer side of a support plate on one side of the wafer conveying mechanism.

[0055] The positive and progressive effect of the present invention is that the silicon wafer conveying mechanism on the silicon wafer flipping machine of the present invention can clamp the silicon wafer lifted from the flower basket by the first lifting mechanism, and the silicon wafer conveying mechanism horizontally transports the silicon wafer above the flower basket to above another flower basket, and the second lifting mechanism receives the silicon wafer clamped by the silicon wafer conveying mechanism and places it in another flower basket. The silicon wafer flipping machine has a simple structure, and the silicon wafer clamping mechanism has a short transportation time, which only takes the time of one trip, is not easy to damage the silicon wafer, and has a high flipping efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 It is a structural schematic diagram of the silicon wafer flipping machine of the present invention;

[0057] Figure 2 and Figure 3 It is a structural schematic diagram of the lifting mechanism of the present invention;

[0058] Figure 4 and Figure 5 It is a structural schematic diagram of the silicon wafer conveying mechanism of the present invention. DETAILED DESCRIPTION

[0059] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0060] like Figure 1As shown, the silicon wafer flipping machine of the present invention comprises a frame on which a workbench 10, a first lifting mechanism 20 and a second lifting mechanism 30 arranged below the workbench, and a silicon wafer conveying mechanism 40 located above the workbench are arranged.

[0061] The workbench 10 has a first opening position 11 and a second opening position 12. The first opening position 11 is used to place a first material flower basket 51. In this example, two first material flower baskets 51 are placed side by side on the first opening position 11. The first material flower basket 51 is a common material flower basket, such as a PP flower basket, or other flower baskets different from the second material flower basket. The second opening position 12 is used to place a second material flower basket 52. In this example, two second material flower baskets 52 are placed side by side on the second opening position 12. The second material flower basket 82 is an acid- and alkali-resistant anti-corrosion flower basket, such as a PFA flower basket, or other flower baskets different from the first material flower basket. It should be noted that the number of the first material flower basket 51 and the second material flower basket 52 is not fixed, and two side-by-side flower baskets are used as an example for explanation.

[0062] The first lifting mechanism 20 and the second lifting mechanism 30 are respectively located below the first opening position 11 and below the second opening position 12, and then the first lifting mechanism 20 and the second lifting mechanism 30 are respectively located under the first material flower basket 51 at the first opening position 11 and under the second material flower basket 52 at the second opening position 12, and can be lifted and lowered through the bottom of the first material flower basket 51 and the second material flower basket 52 respectively.

[0063] In this example, the first lifting mechanism 20 lifts the silicon wafers in the first material basket 51 on the first opening position 11 upward, and the silicon wafer conveying mechanism 40 clamps and conveys the silicon wafers lifted by the first lifting mechanism 20 to the top of the second material basket 52 on the second opening position 12, and then the second lifting mechanism 30 receives the silicon wafers released by the silicon wafer conveying mechanism 40 and places them downward in the second material basket 52. Of course, it is also possible that the second lifting mechanism 30 lifts the silicon wafers in the second material basket 52 on the second opening position 12 upward, and the silicon wafer conveying mechanism 40 clamps and conveys the silicon wafers lifted by the second lifting mechanism 30 to the top of the first material basket 51 on the first opening position 11, and then the first lifting mechanism 20 receives the silicon wafers released by the silicon wafer conveying mechanism 40 and places them downward in the first material basket 51.

[0064] The wafer rewinding machine is provided with a guide cylinder 60 that drives the wafer conveying mechanism 40 to perform linear reciprocating motion, and one side of the wafer conveying mechanism 40 is connected to the cylinder linear guide 60. Two parallel and spaced slide rails 70 are also provided above the workbench 10 of the wafer rewinding machine, one end of which is located above the first opening position 11, and the other end is located above the second opening position 12. The wafer conveying mechanism 40 is provided on the slide rail 70, and the cylinder linear guide 60 can drive the wafer conveying mechanism 40 to move back and forth from one end to the other end of the slide rail 70, and then the wafer conveying mechanism 40 on the slide rail 70 drives the wafer to be transported above the first material basket 51 on the first opening position 11 and above the second material basket 52 on the second opening position 12.

[0065] In this example, the first lifting mechanism 20 and the second lifting mechanism 30 are the same lifting mechanism. Figure 2 and Figure 3 As shown, the lifting mechanism has a silicon wafer lifting mechanism 21 and a silicon wafer bearing mechanism 22. The silicon wafer lifting mechanism 21 is fixed below the workbench 10. Further, one side of the silicon wafer lifting mechanism 21 is fixed on the side wall below the workbench 11, and the silicon wafer bearing mechanism 22 is on the other side of the silicon wafer lifting mechanism 21, and is located below the first opening position 11 and the second opening position 12 for lifting and lowering movements. In this example, the silicon wafer lifting mechanism 21 is a screw slide module for longitudinal lifting, and of course it can also be other mechanisms that can be lifted and lowered longitudinally. A mounting platform 211 that can follow the lifting of the slide is provided on the screw linear slide, and the silicon wafer bearing mechanism 22 is fixed on the mounting platform 211, and then the mounting platform 211 of the silicon wafer lifting mechanism 21 drives the silicon wafer bearing mechanism 22 to lift and lower the first opening position 11 and the second opening position 12. The silicon wafer carrying mechanism 22 has a support rod 221 and a silicon wafer carrier 222, the bottom end of the support rod 221 is fixed on the mounting platform 211, and the silicon wafer carrier 222 is fixed on the top of the support rod 221. Further, two support rods 221 and silicon wafer carriers 222 are arranged side by side on the mounting platform 211, and the two silicon wafer carriers 22 are correspondingly located below the first material flower basket 51 arranged side by side or below the second material flower basket 52 arranged side by side. It should be noted that the number of silicon wafer carriers 222 here is not fixed, as long as it can correspond to the number of flower baskets on the workbench 10. The mounting platform 211 on the wafer lifting mechanism 21 drives the wafer carrier 222 on the support rod 221 to pass through the first opening 11 and the bottom of the first material basket 51 to lift the wafer in the first material basket 51 upward, or pass through the second opening 12 and the bottom of the second material basket 52 to receive the wafer on the second material basket 52 and place it downward into the second material basket 52. Furthermore, the top of the wafer carrier 222 has an inclined clamp, and the inclined clamp has a plurality of slots for clamping the wafer, so as to facilitate the fixed support of the wafer.

[0066] like Figure 4 and Figure 5 As shown, the silicon wafer transport mechanism 40 has a transport frame seat 41 and a silicon wafer clamping mechanism 42. The silicon wafer clamping mechanism 42 is arranged on the transport frame seat 41. The transport frame seat 41 is located above the first material flower basket 51 and the second material flower basket 52 and moves back and forth on the slide rail 70, driving the silicon wafer clamping mechanism 42 to clamp the silicon wafer supported on the silicon wafer carrier 222 of the first lifting mechanism 20 and move the silicon wafer and place the silicon wafer on the silicon wafer carrier 222 of the second lifting mechanism 30.

[0067] The transport frame 41 is composed of one or more square frames connected side by side. Here, the transport frame 41 is composed of two square frames connected side by side. Of course, it can also be one or more square frames, as long as the clamping mechanism 42 on the transport frame 41 can clamp and support all the silicon wafers in the first material flower basket 51 or the second material flower basket 52. The square frame includes a supporting plate 411 and a fixing plate 412 arranged opposite to each other. The two fixing plates 412 and the two supporting plates 411 are combined to form a square frame. In this example, the fixing plates 412 between two adjacent square frames are fixedly connected by a connecting plate 413 to form the transport frame 41. A mounting plate 414 is provided on the outer support plate 411 of the outer square frame of the transport frame 41. The transport frame 41 is connected to the cylinder linear guide 60 through the mounting plate 414. A plurality of sliders 4111 are provided on the outer sides of the outer support plates 411 of the two outer square frames of the transport frame 41. Furthermore, two sliders 4111 are respectively provided on the outer sides of the outer support plates 411. The sliders 4111 can be slidably supported on the slide rail 70, thereby realizing the movement of the transport frame 41 on the slide rail 70 through the cylinder linear guide 60.

[0068] The silicon wafer clamping mechanism 42 has at least one pair of silicon wafer clamping members symmetrically arranged on both sides of the transport frame seat 41. In this example, there are two pairs of silicon wafer clamping members symmetrically arranged on both sides of the two square frames. Each silicon wafer clamping member includes a clamping drive mechanism 421 and a clamping plate 422. The clamping drive mechanism 421 of each silicon wafer clamping member is connected to the clamping plate 422 to drive the clamping plate 422 to move relatively on the inner side of the transport frame seat 41 to clamp the silicon wafer on the silicon wafer carrier 222 of the first lifting mechanism 20 or place the silicon wafer on the silicon wafer carrier 222 of the second lifting mechanism 30. The clamping drive mechanism 421 is fixed on the transport frame seat 41. Further, the clamping drive mechanism 421 is fixed on the fixed plate 412. The position of the clamping drive mechanism 421 is not fixed, as long as it can drive the clamping plate to move relatively to clamp the silicon wafer. In this example, the clamping drive mechanism 421 is an example of a cylinder. The two clamping plates 422 of each pair of silicon wafer clamping members can be relatively movably symmetrically arranged on the two opposite inner sides of the conveying frame seat 41, and further arranged on the inner side of the fixed plate 412. Furthermore, there is an inclined clamp on the clamping plate 422, and the inclined clamp has a clamping groove for clamping the silicon wafer, which is convenient for fixing and supporting the bottom side of the silicon wafer and is not easy to damage the silicon wafer. The silicon wafer clamping member also includes a push-pull shaft 423 and a pair of guide shafts 424. The push-pull shaft 423 can slide through the fixed plate 412, the inner end of the push-pull shaft 423 is fixedly connected to the clamping plate 422, and the outer end of the push-pull shaft 423 is directly or indirectly connected to the drive shaft of the clamping drive mechanism 421. Further, the outer end of the push-pull shaft 423 is connected to the drive shaft of the clamping drive mechanism 421 by a connecting rod, and the connecting rod is a straight rod in this example. In this example, the outer end of the push-pull shaft 423 is fixedly connected to the piston rod of the cylinder through a connecting rod, and the piston rod of the cylinder drives the push-pull shaft 423 to slide through the fixed plate 412, thereby driving the splint 422 to move back and forth on the inner side of the fixed plate 412. The inner end of the guide shaft 424 is fixedly connected to the splint 422, and the outer end of the guide shaft 424 slides through the fixed plate 412, which can enhance the stability of the splint 422 and prevent the splint 422 from shaking or shifting during movement. It should be noted that the number and position of the guide shafts 424 are not limited, and here the example of two guide shafts 424 symmetrically located on both sides of the push-pull shaft 423 is used for illustration.

[0069] The present invention also provides a silicon wafer flipping method, comprising the following steps:

[0070] Step S1, lifting the silicon wafer in the first material basket 51 located at the first opening position 11 upwardly by the silicon wafer carrier 222 of the first lifting mechanism 20;

[0071] Step S2, the silicon wafer on the silicon wafer carrying platform 222 of the first lifting mechanism 20 is clamped by the silicon wafer clamping member of the silicon wafer conveying mechanism 40, and the conveying frame 41 of the silicon wafer conveying mechanism 40 conveys the silicon wafer clamping member with the silicon wafer to the upper side of the second opening position 12;

[0072] Step S3, the silicon wafer gripping member of the silicon wafer conveying mechanism 40 releases the silicon wafer onto the silicon wafer carrier 222 of the second lifting mechanism 30;

[0073] In step S4, the silicon wafer carrier 222 of the second lifting mechanism 30 descends downward and places the silicon wafer in the second material basket 52 of the second opening 12 to wait for subsequent process steps such as cleaning of the silicon wafer.

[0074] The present invention is described in detail above in conjunction with the embodiments of the accompanying drawings. A person skilled in the art can make various variations of the present invention according to the above description. Therefore, some details in the embodiments should not be construed as limiting the present invention, and the present invention shall be protected by the scope defined by the attached claims.

Claims

1. A silicon wafer rewinding machine, characterized in that The silicon wafer flipping machine has: A workbench, the workbench having a first opening position for placing a flower basket of a first material and a second opening position for placing a flower basket of a second material; A first lifting mechanism capable of lifting the silicon wafers in the first material basket upwards and a second lifting mechanism capable of receiving the silicon wafers and placing them downwards in the second material basket are respectively located below the first opening position and below the second opening position; The silicon wafer conveying mechanism is arranged above the workbench and can convey the silicon wafer lifted above the first opening to above the second opening.

2. The silicon wafer flipping machine according to claim 1, characterized in that The film rewinding machine also has: Two parallel and spaced slide rails are arranged above the workbench, one end of which is located above the first opening position, and the other end of which is located above the second opening position; The silicon wafer conveying mechanism moves back and forth from one end to the other end of the slide rail.

3. The silicon wafer flipping machine as claimed in claim 2, characterized in that The silicon wafer conveying mechanism comprises: A silicon wafer clamping mechanism capable of clamping the silicon wafer lifted by the first lifting mechanism and placing the silicon wafer on the second lifting mechanism; A transport frame seat can be located above the flower basket and move back and forth on the slide rail, and the silicon wafer clamping mechanism is arranged on the transport frame seat.

4. The silicon wafer flipping machine as claimed in claim 3, characterized in that The clamping mechanism has at least one pair of silicon wafer clamping members symmetrically arranged on both sides of the transport frame; preferably, each silicon wafer clamping member comprises: A clamping drive mechanism is arranged on the transport frame seat; The two clamping plates of each pair of silicon wafer clamping members can be relatively movably arranged symmetrically on the two opposite inner sides of the conveying frame seat, and the clamping driving mechanism is connected to the clamping plate driving to drive the clamping plate to move relatively on the inner side of the conveying frame seat to symmetrically clamp the silicon wafer on the first lifting mechanism or place the silicon wafer on the second lifting mechanism.

5. The silicon wafer flipping machine as claimed in claim 4, characterized in that The transport frame is composed of one or more square frames connected side by side, and the square frame includes: The supporting plates are arranged opposite to each other, and the outer sides of the outer supporting plates of the two outer square frames are provided with a plurality of sliding blocks, and the sliding blocks are slidably supported on the slide rails of the film rewinding machine; The two fixing plates are arranged opposite to each other, and the two fixing plates and the two supporting plates together form the square frame, and the clamping plate of the silicon wafer clamping member is arranged on the inner side of the fixing plate.

6. The silicon wafer flipping machine as claimed in claim 5, characterized in that The silicon wafer clamping member also includes: A push-pull shaft is slidably passed through the fixing plate, the inner end of the push-pull shaft is fixedly connected to the clamping plate, and the outer end of the push-pull shaft is directly or indirectly connected to the driving shaft of the clamping driving mechanism; A pair of guide shafts are located on both sides of the push-pull shaft and can slidably pass through the fixing plate, and the inner ends of the guide shafts are fixedly connected to the clamping plate.

7. The silicon wafer flipping machine as claimed in claim 5, characterized in that The clamping drive mechanism is fixed on the fixed plate, and the driving shaft of the clamping drive mechanism is connected to the push-pull shaft by a connecting rod; Preferably, the fixing plates between two adjacent square frames are fixedly connected by a connecting plate; Preferably, the clamping plate is provided with an inclined clamp, and the inclined clamp is provided with a slot for clamping the silicon wafer. Preferably, the wafer rewinding machine further comprises a cylinder linear guide rail driving the wafer conveying mechanism to perform linear reciprocating motion, and a mounting plate connected to the cylinder linear guide rail is provided on the outer side of a support plate on one side of the wafer conveying mechanism.

8. The silicon wafer flipping machine as claimed in claim 1, characterized in that The first and second lifting mechanisms respectively have: A silicon wafer lifting mechanism, wherein the silicon wafer lifting mechanism is a screw slide module that can be lifted longitudinally, and the slide is provided with a mounting platform that can follow the lift of the slide; The silicon wafer carrying mechanism comprises a support rod fixed on the mounting platform and passing through the first and second openings, and a silicon wafer carrier arranged at the top of the support rod. Preferably, the silicon wafer carrier has a tilting clamp having a plurality of slots for clamping the silicon wafer.

9. The silicon wafer flipping machine as claimed in claim 1, characterized in that A flower basket made of a first material is disposed on the first opening position, and a flower basket made of a second material is disposed on the second opening position. Preferably, the flower basket made of the first material is a flower basket made of an ordinary material, and the flower basket made of the second material is an acid- and alkali-resistant and anti-corrosion flower basket. More preferably, the flower basket made of the first material is a PP flower basket, and the flower basket made of the second material is a PFA flower basket.

10. A method for flipping a silicon wafer, characterized in that The method comprises the following steps: Step S1, the silicon wafer carrier of the first lifting mechanism lifts the silicon wafer in the first material basket located at the first opening upward; Step S2, the silicon wafer gripping member of the silicon wafer conveying mechanism grips the silicon wafer on the silicon wafer carrying platform of the first lifting mechanism, and the conveying frame of the silicon wafer conveying mechanism conveys the silicon wafer gripping member with the silicon wafer to above the second opening position; Step S3, the silicon wafer gripping member of the silicon wafer conveying mechanism releases the silicon wafer onto the silicon wafer carrier of the second lifting mechanism; Step S4, the silicon wafer carrier of the second lifting mechanism descends downward and places the silicon wafer in the second material basket at the second opening.

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