Heat dissipation structure applied to high-heat-consumption integrated circuit of space equipment and satellite equipment

Abstract

The invention relates to a heat dissipation structure applied to a high-heat-consumption integrated circuit of space equipment and satellite equipment, and relates to the technical field of satellite chip heat dissipation. The heat dissipation structure comprises a first structure box body and a second structure box body which are vertically mounted on a space equipment mounting plate surface and are arranged side by side; a first circuit board used for installing a first chip is fixedly arranged in the first structure box body, the first chip is installed at the position close to or close to the installation board face, and a second chip is fixedly arranged in the second structure box body and directly sintered on the second structure box body. And the second chip is fixedly arranged on the second structure box body and is close to or close to the position of the mounting plate surface. The invention further discloses the satellite equipment comprising the heat dissipation structure. According to the technical scheme, the heat dissipation efficiency of the chip in the space equipment is improved, stable work of the high-heat-consumption integrated circuit and the chip in the satellite equipment is ensured, the reliability of the satellite equipment is improved, and the service life of the satellite equipment is prolonged.

Description

Technical Field

[0001] The present application relates to the field of satellite chip heat dissipation technology, and in particular to a heat dissipation structure for high heat consumption integrated circuits used in space equipment and satellite equipment. Background Art

[0002] In the field of space equipment, with the development of technology, the integration of single machines is constantly improving. For example, in some satellite equipment products, there is a situation where the heat is mainly concentrated in several high-heat consumption chips, including digital signal processing chips and power amplifier chips. These chips are usually distributed in different structural boxes, and the power consumption of each chip is relatively large. For example, the power consumption of digital signal processing chips can reach 20W, while the power consumption of power amplifier chips is as high as 50W. In order to ensure that these chips can work stably for a long time in a vacuum environment, effective heat dissipation measures must be taken.

[0003] Since satellites and other space equipment work in a vacuum environment, their heat dissipation mainly relies on contact heat dissipation, that is, the heat of the chip is first conducted to the structural frame of the single machine, and then diffused to the entire satellite through the structural frame of the single machine and the mounting surface of the entire satellite structure. In this process, the larger the heat capacity of the single machine and the smaller the thermal resistance of the conduction path, the more conducive to heat dissipation. However, the current problem is that the temperatures of multiple structural boxes are high and the heat is concentrated. At the same time, space equipment needs to work continuously and uninterruptedly. Limited by the thermal conductivity of current materials, traditional heat dissipation methods are difficult to meet the simultaneous heat dissipation needs of multiple devices, resulting in abnormal operation of the chip when effective heat dissipation measures are not taken. If no measures are taken, the junction temperature of the digital signal processing chip will exceed 125°C after 10 minutes of operation, and it will not be able to operate stably for a long time. Summary of the invention

[0004] In order to improve the heat dissipation effect of high heat consumption integrated circuits of space equipment and thus ensure the stable reliability and service life of the space equipment, the present application provides a heat dissipation structure and satellite equipment applied to high heat consumption integrated circuits of space equipment.

[0005] In the first aspect, the present application provides a heat dissipation structure for high heat consumption integrated circuits used in space equipment, which adopts the following technical solutions: A heat dissipation structure for a space device with high heat consumption integrated circuit, comprising a first structure box and a second structure box both vertically mounted on a mounting plate of the space device, wherein the first structure box and the second structure box are arranged side by side; A first circuit board for mounting a first chip is fixedly disposed in the first structural box body, and the first chip is mounted adjacent to or close to a mounting board surface; a second chip is fixedly disposed in the second structural box body, and the second chip is directly sintered on the second structural box body; and the second chip is fixedly disposed on the second structural box body adjacent to or close to a mounting board surface.

[0006] The first chip can be a digital signal processing chip, and the second chip can be a power amplifier chip. By adopting the above technical solution, the first structural box body and the second structural box body are arranged side by side and perpendicular to the mounting board surface of the space equipment, so that each structural box body has a good heat conduction path, reducing obstacles and interference in the heat conduction process. At the same time, high heat consumption devices such as the first chip and the second chip are placed as close to the bottom mounting board surface as possible, thereby shortening the heat conduction path and improving the thermal conductivity. Furthermore, for the second chip, the method of directly sintering on the structural frame of the second structural box body is adopted to achieve efficient heat conduction between the second chip and the structural frame of the second structural box body, reduce thermal resistance, and enable the heat generated by the second chip to be quickly conducted away. The technical solution of the present application effectively reduces the operating temperature of a variety of different chips, ensures that a variety of chips can work stably for a long time in a vacuum environment, and improves the overall reliability and stability of the space equipment. It was verified through thermal tests that, in a vacuum tank, when the temperature of the heat conducting surface was controlled at 55°C, the junction temperature of the first chip was stabilized below 83°C by adopting the technical solution in this application, effectively avoiding abnormal working conditions caused by excessive junction temperature, and ensuring long-term stable operation of the chip. This is a great improvement compared to the situation where the chip can only work for 10 minutes and the junction temperature exceeds 125°C when no measures are taken.

[0007] Optionally, a heat conductive block is provided on the top of the first chip; one side of the heat conductive block is abutted against the side surface of the structural frame of the first structural box body, and a heat conductive pad is provided between the other side of the heat conductive block and the top surface of the first chip.

[0008] By adopting the above technical solution, the heat conductive block makes large-area contact with the bottom of the structural frame of the first structural box body, and effectively conducts the heat generated by the first chip to the structural frame of the first structural box body, thereby improving the heat dissipation capacity of the first chip.

[0009] Optionally, a gap of 0.25-0.35 mm is reserved between the heat conductive block and the top surface of the first chip, the thickness of the heat conductive pad is 0.45-0.55 mm, and the heat conductive pad is embedded between the heat conductive block and the top surface of the first chip.

[0010] A 0.3mm gap can be reserved between the heat conductive block and the top surface of the first chip, and a 0.5mm thermal pad is embedded in the gap. During assembly, the heat conductive block is first precisely processed to ensure that the flatness of its contact area with the bottom of the structural frame of the first structural box body is within 20μm, and then a 0.5mm thick thermal pad is placed in the 0.3mm gap reserved between the first chip and the heat conductive block. The heat conductive block is fixed to the structural frame of the first structural box body by screws or snaps. During the fixing process, the thermal conductive pad is ensured to be evenly stressed without wrinkles or gaps. By adopting the above technical solution, it is ensured that heat can be smoothly transferred from the first chip to the heat conductive block and then to the structural frame of the first structural box body, thereby improving the heat dissipation efficiency of the first chip.

[0011] Optionally, the heat conductive block is made of graphene-reinforced metal-based composite material; and the heat conductive pad is made of nano-silicone rubber material.

[0012] By adopting the above technical solution, the ultra-high thermal conductivity of graphene can significantly enhance the thermal conductivity of the heat conductive block, so that the heat generated by the first chip can be conducted to the structural frame of the first structural box more quickly. The graphene nanosheets evenly dispersed in the heat conductive block can form an efficient heat conduction network, and its thermal conductivity can be increased by more than 5 times compared with ordinary metal heat conductive blocks. The above-mentioned thermal pad is filled with nano-scale metal heat conductive particles, which can adaptively fill the tiny gap between the chip and the heat conductive block when subjected to a certain pressure to ensure good thermal contact. At the same time, its thermal conductivity can be improved by 60% compared with traditional thermal conductive pads, effectively reducing the interface thermal resistance.

[0013] Optionally, the second chip is sintered on the second structural box body using sintered silver paste, the sintering temperature is 150° C. to 300° C., the pressure applied during sintering is in the range of 15 MPa to 30 MPa, and the sintering time is in the range of 5 to 30 minutes.

[0014] By adopting the above technical solution, the thermal conductivity of sintered silver can reach 220W / m / K, which is much higher than that of traditional solder alloys and conductive adhesives. This enables the first chip using sintered silver paste to accelerate heat conduction and has significant advantages in heat dissipation performance and efficiency; and the sintered silver paste has good adhesion and can maintain the stability and reliability of the first chip at high temperatures. In addition, the sintered silver paste is non-flammable and non-explosive during use, and is non-toxic and environmentally friendly.

[0015] Optionally, the structural frames of the first structural box body and the second structural box body are both made of carbon / aluminum composite material or carbon fiber reinforced copper-based composite material.

[0016] By adopting the above technical solution, new lightweight and highly thermally conductive composite materials such as carbon / aluminum or carbon fiber reinforced copper are selected as the basic materials of the structural frame. They have the low density characteristics of carbon fiber, which can effectively reduce the overall weight of the satellite, and have high thermal conductivity, which can further improve the heat conduction efficiency. Compared with traditional pure metal structural frames, their thermal conductivity can be increased by more than 30% and their weight can be reduced by more than 20%.

[0017] Optionally, auxiliary heat conduction channels are provided in the structural frames of the first structural box body and the second structural box body, and low-boiling-point working fluid is provided in the auxiliary heat conduction channels.

[0018] By adopting the above technical solution, a microchannel structure is designed inside the structural frame of the first structural box body and the second structural box body, and a low-boiling-point working fluid is filled in the microchannel. When the heat of the chip is transferred to the structural frame of the first structural box body and the second structural box body, the low-boiling-point working fluid is heated and boils and vaporizes, quickly taking away the heat, and re-condenses in the low-temperature area of ​​the structural frame, forming an efficient gas-liquid two-phase circulation heat dissipation system.

[0019] Optionally, at least three groups of the auxiliary heat-conducting channels are arranged on the structural frames of the first structural box body and the second structural box body, and the interval between two adjacent groups of the auxiliary heat-conducting channels is 2mm to 6mm. Each group of the auxiliary heat-conducting channels is arranged in a ring shape along the circumference of the structural frame of the first structural box body or the second structural box body. The cross-section of each group of the auxiliary heat-conducting channels is circular and the inner diameter of the auxiliary heat-conducting channels is 0.5mm to 1.8mm; the low-boiling-point working fluid is ammonia or acetone.

[0020] By adopting the above technical solution, according to thermal test verification, the heat dissipation efficiency of the chip can be improved by more than 80%.

[0021] Optionally, a graphene one-way heat dissipation plate is further arranged between the first structural box body, the second structural box body and the space equipment installation board surface, the graphene one-way heat conduction plate includes a heat dissipation layer, a heat transfer layer and a heat absorption layer, the heat transfer layer is arranged between the heat dissipation layer and the heat absorption layer, the heat absorption layer is close to the structural frame of the first structural box body and the second structural box body, and the heat dissipation layer is close to the space equipment installation board surface; the heat transfer layer includes a heat insulation material layer and heat conductive microcapsules, the heat insulation material layer forms a honeycomb structure, and the heat conductive microcapsules are arranged in the honeycomb holes of the heat insulation material layer and are filled with gas or liquid.

[0022] By adopting the above technical solution, one-way heat conduction and heat dissipation can be achieved, avoiding two-way heat transfer. Thus, the heat generated by the chip can be efficiently dissipated, and when the space equipment as a whole faces the sun and is subject to greater heat radiation, the heat will not be transferred to the chip.

[0023] In a second aspect, a satellite device provided by the present application adopts the following technical solution: A satellite device includes a frame and a plurality of groups of solar panels arranged on the frame. The satellite device also includes the above-mentioned heat dissipation structure. The space equipment mounting panel surface is located on the inner side surface of the frame. The first structural box body and the second structural box body are arranged in the frame.

[0024] By adopting the above technical solution, the satellite equipment has a better chip heat dissipation effect, ensuring the stable operation of high heat consumption integrated circuits and chips in the satellite equipment, reducing equipment failures caused by overheating, improving the overall reliability of the satellite equipment, extending the service life of the satellite equipment, and reducing the maintenance cost and risk of the satellite equipment.

[0025] In summary, the present application includes at least one of the following beneficial technical effects: 1. In this application, by optimizing the heat dissipation structure of chips in space equipment, the stable operation of high heat consumption integrated circuits and chips in satellites and other space equipment is ensured, equipment failures caused by overheating are reduced, the service life of the equipment is extended, and the equipment maintenance costs and risks are reduced, providing strong support for the reliable operation of space equipment in complex tasks. 2. In this application, the first structural box and the second structural box are arranged side by side and perpendicular to the installation board of the space equipment, so that each structural box has a good heat conduction path, reducing obstacles and interference in the heat conduction process.

[0026] 3. In the present application, high heat consumption components such as the first chip and the second chip are placed as close to the bottom mounting board surface as possible, thereby shortening the heat conduction path and improving the heat conduction efficiency.

[0027] 4. In the present application, the second chip is directly sintered on the structural frame of the second structural box body to achieve efficient heat conduction between the second chip and the structural frame of the second structural box body, reduce thermal resistance, and enable the heat generated by the second chip to be quickly conducted away.

[0028] 5. In the present application, by arranging a heat-conducting block and a heat-conducting pad on the first chip, the heat generated by the first chip is effectively conducted to the structural frame of the first structural box body, thereby improving the heat dissipation capacity of the first chip.

[0029] 6. In this application, a microchannel structure is designed inside the structural frame of the first structural box and the second structural box, and a low-boiling-point working fluid is filled in the microchannel. When the heat of the chip is transferred to the structural frame of the first structural box and the second structural box, the low-boiling-point working fluid is heated and boils and vaporizes, quickly taking away the heat, and re-condenses in the low-temperature area of ​​the structural frame, forming an efficient gas-liquid two-phase circulation heat dissipation system, which greatly improves the heat dissipation efficiency of the chip in a vacuum environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1It is a schematic diagram of the three-dimensional structure of the satellite equipment in this application.

[0031] Figure 2 It is a schematic diagram of the internal structure of the satellite equipment in this application.

[0032] Figure 3 yes Figure 2 Schematic diagram of the local enlarged structure in.

[0033] Figure 4 It is a structural schematic diagram of the auxiliary heat conduction channel in the heat dissipation structure of the present application.

[0034] Figure 5 It is a structural schematic diagram of the graphene unidirectional heat dissipation plate in the heat dissipation structure of the present application.

[0035] In the figure: 10. Solar cell panel; 20. Frame; 21. Mounting board surface; 30. First structural box; 40. Second structural box; 50. First circuit board; 60. First chip; 70. Second chip; 80. Heat-conducting block; 90. Heat-conducting pad; 100. Auxiliary heat-conducting channel; 110. Graphene unidirectional heat sink; 111. Heat dissipation layer; 112. Heat transfer layer; 1121. Heat-insulating material layer; 1122. Heat-conducting microcapsules; 113. Heat-absorbing layer. DETAILED DESCRIPTION

[0036] The following will be combined with the attached Figure 1 -Attached Figure 5 , the technical solutions in the embodiments of the present invention are clearly and completely described. The described embodiments are only possible technical implementations of the present invention, not all possible implementations. Those skilled in the art can completely combine the embodiments of the present invention to obtain other embodiments without creative work, and these embodiments are also within the scope of protection of the present invention.

[0037] Reference Figure 1 and Figure 2As shown, the heat dissipation structure of the high heat consumption integrated circuit used in the space equipment in the present application can be specifically used in satellite equipment. The satellite equipment in the present application includes a frame 20 and a plurality of groups of solar panels 10 arranged on the frame 20. The frame 20 is a rectangular parallelepiped or cube structure. The solar panels 10 can be two or four groups, symmetrically arranged on both sides of the frame 20, and used to power the entire satellite equipment; the solar panels 10 can be folded and folded. A mounting plate surface 21 is provided on the inner wall of one side of the frame 20. A single machine with different functions is arranged in the frame 20, and each single machine corresponds to a structural box body, such as a single machine as a digital signal processing function module and a single machine as a signal modulation and demodulation processing function module. In the present application, taking the setting of two single machines as an example, a first structural box body 30 and a second structural box body 40 are respectively arranged in the frame 20. The first structural box body 30 corresponds to the single machine of the digital signal processing function module, and the second structural box body 40 corresponds to the single machine of the signal modulation and demodulation processing function module.

[0038] In the present application, the installation structure of the first structural box body 30 and the second structural box body 40 is reasonably designed, and the heat dissipation path of the chip is optimized to form a complete set of efficient heat dissipation structures, thereby ensuring the stable operation of high heat consumption integrated circuits and chips in satellite equipment, reducing equipment failures caused by overheating, extending the service life of satellite equipment, reducing the maintenance cost and risk of satellite equipment, and providing strong support for the reliable operation of satellite equipment in complex tasks.

[0039] Specifically, refer to Figure 2 and Figure 3As shown, the inner side of the frame 20 in the present application has a space equipment mounting board 21; the first structure box body 30 and the second structure box body 40 are both vertically mounted on the space equipment mounting board 21, and the first structure box body 30 and the second structure box body 40 are arranged side by side; the first structure box body 30 is fixed with a first circuit board 50 for mounting a first chip 60, and the first chip 60 is mounted in a position close to or near the mounting board 21, the second structure box body 40 is fixed with a second chip 70, and the second chip 70 is directly sintered on the second structure box body 40, and the second chip 70 is fixed on the second structure box body 40 in a position close to or near the mounting board 21. In this embodiment, the first chip 60 is a digital signal processing chip, and the second chip 70 is a power amplifier chip. In the present application, the second chip 70 can be sintered on the second structure box body 40 using sintered silver paste, the sintering temperature is 150°C to 300°C, the pressure applied during sintering is in the range of 15MPa to 30MPa; the sintering time range is 5 to 30 minutes. The thermal conductivity of sintered silver can reach 220W / m / K, which is much higher than that of traditional solder alloys and conductive adhesives. This enables the first chip 60 using sintered silver paste to accelerate heat conduction, and has significant advantages in heat dissipation performance and heat dissipation efficiency; and the sintered silver paste has good adhesion and can maintain the stability and reliability of the first chip 60 at high temperatures. In addition, the sintered silver paste is non-flammable and non-explosive during use, and is non-toxic and environmentally friendly.

[0040] Further, see Figure 3As shown, a heat conducting block 80 is provided on the top of the first chip 60; one side of the heat conducting block 80 is abutted against the side of the structural frame of the first structural box body 30, and a heat conducting pad 90 is provided between the other side of the heat conducting block 80 and the top surface of the first chip 60; the heat conducting block 80 makes large-area contact with the bottom of the structural frame of the first structural box body 30, and effectively conducts the heat generated by the first chip 60 to the structural frame of the first structural box body 30, thereby improving the heat dissipation capacity of the first chip 60. In the present application, a gap of 0.25 to 0.35 mm is reserved between the heat conducting block 80 and the top surface of the first chip 60, and the thickness of the heat conducting pad 90 is 0.45 to 0.55 mm, and the heat conducting pad 90 is embedded between the heat conducting block 80 and the top surface of the first chip 60. Preferably, a gap of 0.3 mm can be reserved between the heat conducting block 80 and the top surface of the first chip 60, and a heat conducting pad 90 of 0.5 mm is embedded in the gap. During assembly, the heat conducting block 80 is first precisely processed to ensure that the flatness of the contact area between the heat conducting block 80 and the bottom of the structural frame of the first structural box body 30 is within 20 μm, and then the 0.5 mm thick heat conducting pad 90 is placed in the 0.3 mm gap reserved between the first chip 60 and the heat conducting block 80, and the heat conducting block 80 is fixed to the structural frame of the first structural box body 30 by screws or snaps. During the fixing process, the heat conducting pad 90 is ensured to be evenly stressed without wrinkles or gaps. It is ensured that heat can be smoothly transferred from the first chip 60 to the heat conducting block 80, and then to the structural frame of the first structural box body 30, thereby improving the heat dissipation efficiency of the first chip 60.

[0041] In the present application, the heat conductive block 80 is made of graphene-enhanced metal-based composite material; the heat conductive pad 90 is made of nano-silicone rubber material. The ultra-high thermal conductivity of graphene can significantly enhance the thermal conductivity of the heat conductive block 80, so that the heat generated by the first chip 60 can be more quickly conducted to the structural frame of the first structural box body 30. The graphene nanosheets evenly dispersed in the heat conductive block 80 can form an efficient heat conduction network, and its thermal conductivity can be increased by more than 5 times compared with ordinary metal heat conductive blocks 80. The above-mentioned heat conductive pad 90 is filled with nano-scale metal heat conductive particles, which can adaptively fill the tiny gap between the chip and the heat conductive block 80 when subjected to a certain pressure, ensuring good thermal contact. At the same time, its thermal conductivity can be improved by 60% compared with the traditional heat conductive pad 90, effectively reducing the interface thermal resistance.

[0042] In the present application, the structural frames of the first structural box body 30 and the second structural box body 40 are made of carbon / aluminum composite materials or carbon fiber reinforced copper-based composite materials. The structural frames of the first structural box body 30 and the second structural box body 40 have the low-density characteristics of carbon fiber, which can effectively reduce the overall weight of the satellite, and have high thermal conductivity, which can further improve the heat conduction efficiency. Compared with the traditional pure metal structural frame, its thermal conductivity can be increased by more than 30% and the weight can be reduced by more than 20%.

[0043] Reference Figure 2 and Figure 4 As shown, in the present application, auxiliary heat conduction channels 100 are provided in the structural frames of the first structural box body 30 and the second structural box body 40, and low-boiling-point working fluid is provided in the auxiliary heat conduction channels 100. A microchannel structure is designed inside the structural frames of the first structural box body 30 and the second structural box body 40, and the low-boiling-point working fluid is filled in the microchannel. When the heat of the chip is transferred to the structural frames of the first structural box body 30 and the second structural box body 40, the low-boiling-point working fluid is heated, boils and vaporizes, quickly takes away the heat, and re-condenses in the low-temperature area of ​​the structural frame, forming an efficient gas-liquid two-phase circulation heat dissipation system. At least three groups of auxiliary heat conduction channels 100 are arranged on the structural frames of the first structural box body 30 and the second structural box body 40 at intervals, and the interval between two adjacent groups of auxiliary heat conduction channels 100 is 2mm to 6mm. Each group of auxiliary heat conduction channels 100 is arranged in a ring shape along the circumference of the structural frame of the first structural box body 30 or the second structural box body 40. The cross section of each group of auxiliary heat conduction channels 100 is circular and the inner diameter of the auxiliary heat conduction channels 100 is 0.5mm to 1.8mm; the low boiling point working fluid is ammonia or acetone. According to thermal test verification, the above structure can improve the heat dissipation efficiency of the chip by more than 80%.

[0044] Reference Figure 2 and Figure 5 As shown, a graphene unidirectional heat sink 110 is also arranged between the first structural box body 30, the second structural box body 40 and the space equipment installation board surface 21. The graphene unidirectional heat conduction plate includes a heat dissipation layer 111, a heat transfer layer 112 and a heat absorption layer 113. The heat transfer layer 112 is arranged between the heat dissipation layer 111 and the heat absorption layer 113. The heat absorption layer 113 is close to the structural frame of the first structural box body 30 and the second structural box body 40, and the heat dissipation layer 111 is close to the space equipment installation board surface 21; the heat transfer layer 112 includes a heat insulation material layer 1121 and a heat conductive microcapsule 1122. The heat insulation material layer 1121 forms a honeycomb structure. The heat conductive microcapsule 1122 is arranged in the honeycomb holes of the heat insulation material layer 1121 and filled with gas or liquid; in this way, unidirectional heat conduction and heat dissipation can be achieved, and two-way heat transfer can be avoided. Thus, the heat generated by the chip can be efficiently dissipated, and when the space equipment as a whole faces the sun and is subjected to greater heat radiation, the heat will not be transferred to the chip.

[0045] The implementation principle is as follows: In the present application, the first structural box body 30 and the second structural box body 40 are arranged side by side and perpendicular to the space equipment mounting board surface 21, so that each structural box body has a good heat conduction path, reducing obstacles and interference in the heat conduction process. At the same time, high heat consumption devices such as the first chip 60 and the second chip 70 are placed as close as possible to the bottom mounting board surface 21, thereby shortening the heat conduction path and improving the thermal conductivity. Furthermore, for the second chip 70, a method of direct sintering on the structural frame of the second structural box body 40 is adopted to achieve efficient heat conduction between the second chip 70 and the structural frame of the second structural box body 40, reduce thermal resistance, and enable the heat generated by the second chip 70 to be quickly conducted away. The technical solution of the present application effectively reduces the operating temperature of a variety of different chips, ensures that a variety of chips can work stably for a long time in a vacuum environment, and improves the overall reliability and stability of the space equipment. It was verified through thermal tests that, in a vacuum tank, when the temperature of the heat-conducting surface was controlled at 55°C, the junction temperature of the first chip 60 was stabilized below 83°C by adopting the technical solution in the present application, effectively avoiding abnormal working conditions caused by excessively high junction temperature and ensuring long-term stable operation of the chip. This is a significant improvement compared to the situation where the chip can only work for 10 minutes and the junction temperature exceeds 125°C when no measures are taken.

[0046] In this application, the thermal conductivity of the PCB circuit board is poor. Even if the surface is copper-clad, the overall equivalent thermal conductivity is less than 1W / (m·K). In this application, by optimizing the heat dissipation structure, the PCB circuit board is not relied on for heat conduction, and thus the satellite equipment has a better chip heat dissipation effect by changing the heat transfer medium and the heat transfer path, ensuring the stable operation of high heat consumption integrated circuits and chips in the satellite equipment, reducing equipment failures caused by overheating, improving the overall reliability of the satellite equipment, extending the service life of the satellite equipment, and reducing the maintenance cost and risk of the satellite equipment.

[0047] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A heat dissipation structure for high heat consumption integrated circuits used in space equipment, characterized in that: It comprises a first structural box body (30) and a second structural box body (40) both of which are vertically mounted on a spatial equipment mounting plate surface (21), wherein the first structural box body (30) and the second structural box body (40) are arranged side by side; A first circuit board (50) for mounting a first chip (60) is fixedly arranged in the first structural box body (30), and the first chip (60) is mounted in a position close to or near the mounting board surface (21); a second chip (70) is fixedly arranged in the second structural box body (40), and the second chip (70) is directly sintered on the second structural box body (40); the second chip (70) is fixedly arranged on the second structural box body (40) in a position close to or near the mounting board surface (21).

2. The heat dissipation structure for high heat consumption integrated circuits used in space equipment according to claim 1 is characterized in that: A heat-conducting block (80) is provided on the top of the first chip (60); one side of the heat-conducting block (80) is abutted against the side surface of the structural frame of the first structural box body (30), and a heat-conducting pad (90) is provided between the other side of the heat-conducting block (80) and the top surface of the first chip (60).

3. The heat dissipation structure for high heat consumption integrated circuits used in space equipment according to claim 2 is characterized in that: A gap of 0.25 to 0.35 mm is reserved between the heat conductive block (80) and the top surface of the first chip (60); the thickness of the heat conductive pad (90) is 0.45 to 0.55 mm; and the heat conductive pad (90) is embedded between the heat conductive block (80) and the top surface of the first chip (60).

4. The heat dissipation structure for high heat consumption integrated circuits used in space equipment according to claim 2 or 3, characterized in that: The heat conducting block (80) is made of a graphene-reinforced metal-based composite material; and the heat conducting pad (90) is made of a nano-silicon rubber material.

5. The heat dissipation structure for high heat consumption integrated circuits used in space equipment according to claim 1, characterized in that: The second chip is sintered on the second structural box body (40) using sintered silver paste, the sintering temperature is between 150°C and 300°C, the pressure applied during sintering is between 15MPa and 30MPa, and the sintering time is between 5 and 30 minutes.

6. The heat dissipation structure for high heat consumption integrated circuits used in space equipment according to claim 1, characterized in that: The structural frames of the first structural box body (30) and the second structural box body (40) are both made of carbon / aluminum composite material or carbon fiber reinforced copper-based composite material.

7. The heat dissipation structure for high heat consumption integrated circuits used in space equipment according to claim 1, characterized in that: Auxiliary heat conduction channels (100) are arranged in the structural frames of the first structural box body (30) and the second structural box body (40), and low-boiling-point working fluid is arranged in the auxiliary heat conduction channels (100).

8. The heat dissipation structure for high heat consumption integrated circuits used in space equipment according to claim 7, characterized in that: At least three groups of auxiliary heat-conducting channels (100) are arranged at intervals on the structural frames of the first structural box body (30) and the second structural box body (40), and the interval between two adjacent groups of auxiliary heat-conducting channels (100) is 2 mm to 6 mm. Each group of auxiliary heat-conducting channels (100) is arranged in a ring shape along the circumference of the structural frame of the first structural box body (30) or the second structural box body (40), and the cross-section of each group of auxiliary heat-conducting channels (100) is circular, and the inner diameter of the auxiliary heat-conducting channels (100) is 0.5 mm to 1.8 mm; the low-boiling-point working fluid is ammonia or acetone.

9. The heat dissipation structure for high heat consumption integrated circuits used in space equipment according to claim 1, characterized in that: A graphene one-way heat dissipation plate (110) is also arranged between the first structural box body (30) and the second structural box body (40) and the space equipment installation board surface (21); the graphene one-way heat conduction plate comprises a heat dissipation layer (111), a heat transfer layer (112) and a heat absorption layer (113); the heat transfer layer (112) is arranged between the heat dissipation layer (111) and the heat absorption layer (113); the heat absorption layer (113) is closely attached to the structural frames of the first structural box body (30) and the second structural box body (40); the heat dissipation layer (111) is closely attached to the space equipment installation board surface (21); the heat transfer layer (112) comprises a heat insulation material layer (1121) and heat conductive microcapsules (1122); the heat insulation material layer (1121) forms a honeycomb structure; the heat conductive microcapsules (1122) are arranged in the honeycomb holes of the heat insulation material layer (1121) and are filled with gas or liquid.

10. A satellite device, comprising a frame (20) and a plurality of solar panels (10) arranged on the frame (20), characterized in that: The satellite equipment also includes the heat dissipation structure described in any one of claims 1 to 9 above, the space equipment mounting panel surface (21) is located on the inner side surface of the frame (20), and the first structural box body (30) and the second structural box body (40) are arranged in the frame (20).

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