Power converter assembly and method of manufacturing

Abstract

A power converter assembly and method of manufacture are disclosed. The power converter assembly includes a first circuit board and a second circuit board. The first circuit board includes a power converter circuit operable to control conversion of an input voltage to an output voltage. The second circuit board is disposed substantially orthogonal to the first circuit board. The second circuit board is used for receiving the output voltage and transmitting the output voltage to an output of the second circuit board, such as a main circuit board. In addition, the power converter assembly may be configured to include an overmolded assembly operable to provide connectivity between the first circuit board and the second circuit board. In particular, the overmolded assembly may be configured to include an inductor component to output an output voltage to the second circuit board based on a current received by the inductor component from an input voltage received through a first conductive path between the second circuit board and the first circuit board.

Description

Technical Field

[0001] The present disclosure relates generally to the field of electronics, and in particular to the control of multi-phase power supply systems and dynamic loads. Background Art

[0002] One type of conventional power converter is a buck converter. Typically, in order to maintain the output voltage within a desired range, a controller associated with the buck converter compares the magnitude of the generated output voltage to a set point reference voltage. Based on the corresponding error voltage, the controller modifies the corresponding switching frequency and / or pulse width modulation associated with activating the high-side switching circuit and the low-side switching circuit in the buck converter to maintain the magnitude of the output voltage.

[0003] In some cases, conventional controllers control the operation of a buck converter and the generation of an output voltage based on the amount of output current supplied to the load by the generated output voltage. For example, conventional techniques include receiving a so-called VID (voltage identification) from a load such as a processor powered by the output voltage. The VID indicates a set point voltage at which the output voltage is generated to power the load. The amplitude of the VID setting (such as a set point reference voltage) can vary depending on the amplitude of the output current. In the manner described above, the controller of the power supply can be configured to adjust the amplitude of the output voltage supplied to the load based on a target set point voltage derived from the received VID value. Summary of the invention

[0004] The implementation of clean energy (or green technology) is important to reducing humanity's impact on the environment. Generally, clean energy includes any evolving methods and materials to reduce the overall toxicity to the environment caused by energy consumption.

[0005] The present disclosure includes the following observations: Raw energy, such as received from green energy or non-green energy, often needs to be converted into an appropriate form (such as a desired AC voltage, DC voltage, etc.) before it can be used to power terminal devices such as servers, computers, mobile communication devices, etc. Whether the energy is received from green energy or non-green energy, it is desirable to make the most efficient use of the raw energy provided by such a system to reduce our impact on the environment. The present disclosure helps reduce our carbon footprint (and green energy) through more efficient energy conversion.

[0006] The present disclosure also includes the observation that an important aspect of designing a power system is to consider providing optimal delivery of power through control of multiple power converter phases.

[0007] More specifically, a power converter assembly includes: a first circuit board, which includes a power converter circuit for converting an input voltage into an output voltage; and a second circuit board, which is arranged to be approximately orthogonal to the first circuit board, and the second circuit board is used to: i) receive the output voltage, and ii) transmit the output voltage to the output end of the second circuit board.

[0008] The power converter assembly can be configured to include an inductor assembly, the inductor assembly including an input node and an output node, the input node is coupled to the first circuit board to receive an input current derived from an input voltage, and the output node is coupled to the second circuit board to supply an output voltage to the second circuit board. The power converter assembly can also be configured to include a plurality of switches, the plurality of switches are fixed to the first circuit board and / or the second circuit board, and the plurality of switches are used to receive control signals from a controller, and the control signals are used to control the transmission of the input current through the inductor assembly to generate an output voltage supplied to the second circuit board. The inductor assembly can be configured to include: a block of magnetically conductive material; and a first conductive path extending through the block of magnetically conductive material. The inductor assembly can be manufactured in an over-mold assembly, the over-mold assembly including: a first conductive element that provides connectivity between the first circuit board and the second circuit board, the first conductive element being operable to transmit the input voltage from the second circuit board to the first circuit board; and a second conductive element that is disposed between the first circuit board and the second circuit board, the second conductive element being operable to transmit a reference voltage from the second circuit board to the first circuit board.

[0009] According to another example, a power converter component can be configured to include: an inductor component coupled to a first circuit board and a second circuit board, the inductor component being used to convert an input voltage into an output voltage based on control of a current received from the input voltage to the second circuit board through a conductive path of the inductor component; and a heat sink component, a first portion of the heat sink component being coupled to a surface of the first circuit board, the first circuit board being disposed between the first portion of the heat sink component and the inductor component. A second portion of the heat sink component can be disposed to a surface of the inductor component, the inductor component being disposed between the second portion of the heat sink component and the second circuit board.

[0010] In another example, a power converter assembly as discussed herein includes: an overmolded assembly for providing connectivity between a first circuit board and a second circuit board, the overmolded assembly including an inductor assembly and a plurality of connector components; the inductor assembly for outputting an output voltage to the second circuit board based on a current input from an input voltage to the inductor assembly; and the plurality of connector components including: i) a first conductive element that provides transmission of the input voltage from the second circuit board to the first circuit board, and ii) a second conductive element that provides transmission of a reference voltage associated with the input voltage from the second circuit board to the first circuit board.

[0011] According to another example, the second circuit board includes a connector interface that provides connectivity of an edge of the second circuit board to the first circuit board to transmit signals received from the main substrate to the first circuit board.

[0012] In addition, the first circuit board can be configured to include a connector interface that provides connectivity from an edge of the first circuit board to a main substrate, the connector interface being used to transmit a signal received from the main substrate to a power converter circuit on the first circuit board, the second circuit board being attached to the main substrate. The connector interface can be configured to transmit an input voltage from the main substrate to the power converter circuit of the first circuit board.

[0013] According to another example, a power converter assembly includes: an inductor assembly coupled to a first circuit board and a second circuit board, the inductor assembly including a conductive path, the conductive path being used to convert a current received from an input voltage into an output voltage, the inductor assembly including a first magnetic conductive material surrounding a first portion of the conductive path, and the inductor assembly including a second magnetic conductive material surrounding a second portion of the conductive path. The magnetic permeability of the first magnetic conductive material is optionally different from the magnetic permeability of the second magnetic conductive material. The first portion of the inductor assembly extends axially along a first direction; the second portion of the inductor assembly extends axially along a second direction different from the first direction.

[0014] The power converter assembly can also be configured to include: an inductor assembly comprising a magnetically conductive material and a conductive path, the conductive path providing direct connectivity between a first circuit board and a second circuit board; a spacing between the magnetically conductive material and a surface of the second circuit board; and a plurality of circuit components directly coupled to the surface of the second circuit board, the circuit components residing in the spacing between the magnetically conductive material and the surface of the second circuit board.

[0015] Other examples of power converter assemblies as discussed herein include a flexible hinge connector that provides connectivity between an edge of a first circuit board and an edge of a second circuit board, the flexible hinge connector being used to transmit signals between the first circuit board and the second circuit board. The first circuit board includes a first surface plate, a second surface plate, and a third surface plate; the second circuit board includes a fourth surface plate, a fifth surface plate, and a sixth surface plate; the fourth surface plate of the second circuit board is used to output an input voltage from the second circuit board to the third surface plate of the first circuit board through a first conductive path; a second conductive path disposed between the fifth surface plate of the second circuit board and the second surface plate of the first circuit board is used to provide a reference voltage from the second circuit board to the first circuit board; and the first surface plate of the first circuit board is used to output a current derived from the input voltage to the sixth surface plate of the second circuit board through a third conductive path, the third conductive path being an inductor component. Note that the implementation of the six surface plates described above is merely an example, and the implementation may include any number of surface plates and accompanying connectivity desired by the designer. It should also be noted that the designer may include other plates to mount other components as needed.

[0016] In another example, a power converter assembly includes a transformer assembly coupled to a first circuit board and a second circuit board, the transformer assembly including: i) a first conductive path extending through a magnetically conductive material, the first conductive path being a primary winding for converting a current received from an input voltage into an output voltage, and ii) a second conductive path disposed in parallel with the first conductive path and extending through the magnetically conductive material, the second conductive path being a secondary winding magnetically coupled to the primary winding. The secondary winding may be disposed in a circuit path that connects a plurality of secondary windings in series.

[0017] In another example, a power converter assembly as described herein includes a heat sink assembly directly coupled to a surface of a first circuit board, the heat sink assembly including a conduit through which a fluid is operable to receive heat dissipated from the first circuit board. The power converter assembly can be configured to include: a third circuit board including a power converter circuit for controlling conversion of an input voltage to an output voltage; a fourth circuit board disposed substantially orthogonal to the third circuit board, the fourth circuit board being configured to: i) receive the output voltage, and ii) transmit the output voltage to an output terminal of the fourth circuit board; and wherein the heat sink assembly is directly coupled to a surface of the third circuit board, and the fluid is operable to receive heat dissipated from the third circuit board.

[0018] Another example discussed herein includes a method comprising: accommodating a first circuit board, the first circuit board including a power converter circuit for controlling conversion of an input voltage to an output voltage; accommodating a second circuit board, the second circuit board being used to: i) receive the output voltage, and ii) transmit the output voltage to an output terminal of the second circuit board; and manufacturing the second circuit board to be substantially orthogonal to the first circuit board.

[0019] Note that although the examples discussed herein apply to power converters, the concepts disclosed herein may be advantageously applied to any other suitable topology as well as general power supply control applications.

[0020] Note that any resource discussed herein may include one or more computerized devices, controllers, mobile communication equipment, servers, base stations, wireless communication equipment, communication management systems, workstations, user equipment, handheld or laptop computers, etc. to perform and / or support any or all of the method operations disclosed herein. In other words, one or more computerized devices or processors may be programmed and / or configured to operate as explained herein to perform the different examples described herein.

[0021] Other examples herein include software programs that perform the steps and operations outlined above and disclosed in detail below. One such example includes a computer program product, which includes a non-transient computer-readable storage medium (i.e., any computer-readable hardware storage medium), on which software instructions are encoded for subsequent execution. When executed in a computerized device (hardware) with a processor, the instruction programs the processor (hardware) and / or causes the processor (hardware) to perform the operations disclosed herein. Such an arrangement is generally provided as software, code, instruction and / or other data (e.g., data structure), which is arranged or encoded in a non-transient computer-readable storage medium such as an optical medium (e.g., CD-ROM), a floppy disk, a hard disk, a memory stick, a memory device, etc., or other media such as firmware in one or more ROMs, RAMs, PROMs, etc., or as an application-specific integrated circuit (ASIC), etc. Software or firmware or other such configurations can be installed on a computerized device to enable the computerized device to perform the technology described herein.

[0022] Accordingly, examples herein are directed to methods, systems, computer program products, etc., that support the operations discussed herein.

[0023] An example herein includes a computer-readable storage medium and / or system having instructions stored thereon. When executed by computer processor hardware, the instructions cause the computer processor hardware (such as one or more processor devices located in the same location or in a different location) to: determine the magnitude of a first output current supplied from a first power converter to a dynamic load; determine the magnitude of a second output current supplied from a second power converter to power the dynamic load; and control the magnitude of the first output current relative to the magnitude of the second output current based on the magnitude of the total output current consumed by the dynamic load.

[0024] The order of the steps above has been added for clarity. It should be noted that any processing operations as discussed herein may be performed in any suitable order.

[0025] Other examples of the present disclosure include software programs and / or corresponding hardware for performing any of the method example steps and operations summarized above and disclosed in detail below.

[0026] It should be understood that the systems, methods, devices, instructions on computer-readable storage media, etc. discussed herein may also be strictly implemented as software programs, firmware, as a hybrid of software, hardware and / or firmware, or solely as hardware, such as within a processor (hardware or software) or within an operating system or software application.

[0027] As discussed herein, the techniques herein are well suited for use in the field of implementing one or more power converters to deliver current to a load. However, it should be noted that the examples herein are not limited to use in such applications, and the techniques discussed herein are also well suited for other applications.

[0028] In addition, it is noted that although each of the different features, techniques, configurations, etc. herein may be discussed in different places of the present disclosure, it is intended that each of these concepts may be optionally performed independently of each other or in combination with each other, where appropriate. Thus, one or more of the present inventions as described herein may be implemented and observed in many different ways.

[0029] In addition, note that this preliminary discussion of examples (Summary of the Invention) herein purposefully does not specify every example and / or additional novel aspect of the present disclosure or claimed invention. Instead, this brief description presents only general examples and points of novelty relative to conventional techniques. For additional details and / or possible viewpoints (arrangements) of the present invention, the reader is referred to the Detailed Description of the Disclosure section (which is a summary of the examples) and corresponding drawings discussed further below. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1A is an example side view of a power supply assembly as described herein including a first circuit board disposed orthogonally to a second circuit board.

[0031] Figure 1B is an example 3-D (three-dimensional) diagram of an inductor assembly as described herein.

[0032] Figure 2 is an example diagram illustrating an implementation of power converter phases for providing power to a dynamic load as discussed herein.

[0033] Figure 3 is an example side view of a power supply assembly as described herein.

[0034] Figure 4 is an example diagram illustrating power supply components as described herein.

[0035] Figure 5A is a side view of a power supply assembly as described herein.

[0036] Figure 5B is a top view of a power supply assembly as described herein.

[0037] Figure 5C is an example first side view of a power supply assembly as described herein.

[0038] Figure 5D is an example second side view of a power supply assembly as described herein.

[0039] Fig. 6A is an example 3-D diagram of a circuit path component as described herein.

[0040] Figure 6B is described in this article Fig. 6A An example side view of a circuit path component.

[0041] Figure 7 is an example side view illustrating an implementation of a power supply assembly as described herein.

[0042] Fig. 8A is an example side view illustrating an implementation of a power supply assembly as described herein.

[0043] Figure 8B are example diagrams of input-output disks associated with power supply assemblies as described by them.

[0044] Figure 8C is an example diagram showing a side view of a circuit path assembly as described herein.

[0045] Fig. 9is an example side view illustrating an implementation of a power supply assembly including multiple instances of magnetic permeability of magnetically conductive materials as described herein.

[0046] Fig.10 is an example side view illustrating an implementation of a power supply assembly as described herein.

[0047] Fig.11 is an example side view illustrating an implementation of a power supply assembly as described herein.

[0048] Fig. 12A is an example side view illustrating an implementation of a power supply assembly as described herein.

[0049] Fig. 12B is an example diagram illustrating an implementation of multiple circuit boards and corresponding flexible connectors as described herein.

[0050] Fig.13A , Fig. 13B and Fig. 13C is an example diagram illustrating the fabrication of a power supply assembly as described herein.

[0051] Fig.14 is an example 3-D diagram illustrating a transformer assembly as described herein.

[0052] Fig.15 is an example diagram illustrating connectivity between various power supply components to provide a trans-inductor voltage regulator as described herein.

[0053] Fig.16A is an example top view showing a power supply assembly prior to making winding connections as described herein.

[0054] Fig. 16B is an example top view showing a manufactured power supply assembly including winding connections as described herein.

[0055] Fig. 16C is an example side view showing a power supply assembly as described herein.

[0056] Fig.16D is an example side view showing a power supply assembly as described.

[0057] Fig.17A is an example top view showing a power supply assembly prior to making winding connections as described herein.

[0058] Fig. 17B is an example top view showing a manufactured power supply assembly including winding connections as described herein.

[0059] Fig.18 is an example diagram showing the flow of a cooling tube as described herein.

[0060] Fig.19 is an example diagram showing cooling tubes disposed between multiple instances of power supply assemblies as described herein.

[0061] Fig. 20 is an example diagram illustrating an implementation of cooling tubes disposed between multiple instances of a power supply assembly as described herein.

[0062] Fig.21A is an example top view illustrating a corresponding heat sink assembly providing cooling to any of the assemblies as discussed herein.

[0063] Fig. 21B is an example side view showing a corresponding heat sink assembly providing cooling to any of the assemblies as discussed herein.

[0064] Fig. 22 is an example diagram illustrating a method as discussed herein.

[0065] The above and other objects, features and advantages of the present invention will be apparent from the following more particular description of the preferred examples herein as illustrated in the accompanying drawings, in which like reference numerals refer to the same parts throughout the different figures. The drawings are not necessarily drawn to scale, but emphasis is placed on illustrating examples, principles, concepts, etc. DETAILED DESCRIPTION

[0066] A power converter assembly includes a first circuit board and a second circuit board. The first circuit board includes a power converter circuit for controlling the conversion of an input voltage to an output voltage. The second circuit board is arranged substantially orthogonal to the first circuit board. The second circuit board is used to: i) receive the output voltage, and ii) transmit the output voltage to an output of a second circuit board such as a main circuit board.

[0067] Additionally, note that the power converter assembly as discussed herein can be configured to include an overmold assembly for providing connectivity between a first circuit board and a second circuit board. More specifically, the overmold assembly can be configured to include an inductor component to output an output voltage to the second circuit board based on a current received by the inductor component from an input voltage.

[0068] Now, more specifically, Figure 1A is an example side view of a power supply assembly as described herein including a first circuit board disposed orthogonally to a second circuit board. Figure 1B As described in this article Figure 1A An example 3-D (three-dimensional) diagram of an inductor component in a power supply component.

[0069] As shown, the power circuit assembly 102 (such as a power converter circuit) includes an assembly 106 mounted on a corresponding circuit board 133 (such as a main substrate). A controller 140, such as one or more circuit components, is mounted to or embedded in the circuit board 133 or other suitable entity. Alternatively, the controller 140 is mounted to or embedded in the circuit board 131 or the circuit board 132. Therefore, the controller 140 can be optionally mounted to and / or embedded in the circuit board 131 or the circuit board 132.

[0070] Furthermore, in this example, assembly 106 includes circuit board 131, circuit board 132, one or more circuit components 171, conductive path 121, conductive element 121-INP, conductive element 122, and conductive element 123. Assembly 106 also includes magnetically conductive material 111.

[0071] It should also be noted that assembly 106 may be configured to include insulating materials, such as plastic (non-conductive), between components such as conductive element 122 , conductive element 123 , conductive element 121 -INP, magnetically conductive material 111 , and the like.

[0072] Each conductive element or conductive path as described herein is made of metal or other suitable material.

[0073] The component 106 is mounted on (secured to) a surface 138 of the circuit board 133 .

[0074] The circuit board 131 includes one or more circuit components 171, such as component 171-1, component 171-2, etc. As previously described, the component 171 may be mounted to or embedded in the circuit board 131. One or more components 171 including component 171-1, component 171-2, etc. may be configured to control the conversion of the input voltage Vin to the output voltage Vout supplied from the node 121-2 to the circuit board 132.

[0075] As further shown, circuit board 132 (such as disposed in an XY plane) is disposed substantially orthogonal to circuit board 131 (such as disposed in an XZ plane). Thus, circuit board 131 is disposed along the Y axis. Circuit board 132 is disposed along the Z axis.

[0076] In one example, the circuit board 132 is used to: i) receive the output voltage Vout from the output node 121-2 (such as the axial end) of the conductive path 121 and transmit the output voltage Vout to the output node 183 of the circuit board 132 and to the circuit board 133 through the circuit board 132. The output voltage can be configured to power a corresponding load associated with the circuit board 133.

[0077] The inductor assembly 103 (e.g., disposed in the assembly 106) includes a conductive path 121 disposed in a magnetically conductive material 111. For example, for a majority of the link between the node 121-1 and the node 121-2, the conductive path 121 is surrounded by the magnetically conductive material 111. An input node 121-1 of the conductive path 121 is directly coupled to a node VSW of the circuit board 131 through a conductive element 121-INP.

[0078] The circuit board 131 and corresponding components control the amplitude of the input current 159 (such as derived from the input voltage Vin and / or the ground reference potential GND) supplied from the node VSW to the input node 121-1 through the conductive element 121-INP, and supplied to the output node 121-2 through the conductive path 121 and then to the circuit board 132.

[0079] It should also be noted that the assembly 106 can be configured to also include a plurality of switches (such as component 171-1, component 171-2, etc.) for receiving control signals from the controller 140. The control signal from the controller 140 can be transmitted to the circuit board 132 via the circuit board 133. The edge connector 108 can be configured to transmit information such as the magnitude of the input current 159, the magnitude of the output voltage, etc. from the circuit board 131 to the circuit board 133 and the controller 140 via the circuit board 132.

[0080] Furthermore, as previously described, circuit board 132 provides a conductive path from node 121 - 2 through circuit board 132 to output voltage node 183 (such as a pad).

[0081] Furthermore, as previously described, the inductor component 103 (such as all or part of the conductive path 121 (such as made of metal or other suitable material)) is surrounded by the magnetic conductive material block 111. Figure 1B As shown, the inductor assembly 103 includes a conductive path extending through a block of magnetically conductive material 111 along the Y-axis.

[0082] As further discussed herein, it should be noted that the inductor assembly 103 (also referred to as an inductor component) and the corresponding conductive elements 121-INP, conductive elements 122, and conductive elements 123 can be manufactured in the overmolded assembly 102. In other words, the overmolded assembly 102 can be configured to include the conductive element 123 (such as providing connectivity between the circuit board 131 and the circuit board 132), the conductive element 121-INP and the conductive path 121 (such as providing connectivity between the circuit board 131 and the circuit board 132), and the magnetically conductive material 111. As further discussed herein, the overmolded assembly 102 can also be configured to include one or more components, such as the corresponding conductive element 122, the conductive element 123, etc.

[0083] Circuit board 132 receives input voltage from circuit board 133 via input voltage node 181. Circuit board 132 transmits received input voltage Vin received from circuit board 133 to conductive element 123 (such as a clamp or other suitable entity). Conductive element 123 is used to transmit input voltage VIN from circuit board 132 to circuit board 131.

[0084] In addition, the overmold assembly 102 can be configured to include a conductive element 122 (such as to provide connectivity between the circuit board 131 and the circuit board 132). The circuit board 132 receives a ground reference potential from the circuit board 133 through the ground reference node 182. Through a corresponding circuit path, the circuit board 132 transmits the received reference voltage GND from the circuit board 133 to the conductive element 122. As previously described, the conductive element 122 transmits the GND reference voltage to the circuit board 131.

[0085] therefore, Figure 1A and Figure 1B A power stage PCB (such as hosting semiconductor devices such as component 171) is shown mounted vertically on circuit board 131. I / O signals associated with controller 140 are transmitted from circuit board 133 via circuit board traces and routed to the power stage (such as circuit board 131) via the plated edge (edge ​​connector 108) of the redistribution board (circuit board 132). In such a case, a third printed circuit board is not required, allowing assembly 102 to be easily manufactured. Vin and GND copper clips (such as conductive elements 122 and conductive elements 123 made of metal) provide low resistance paths for input power and ground return paths, thereby producing higher efficiency relative to traditional power stage cooling modules that provide these paths via thin PCB layers.

[0086] Therefore, in Figure 1A In the cross-sectional view of FIG. 1 , a so-called power stage, such as a combination of a circuit board 131 and corresponding components, is mounted vertically relative to a circuit board 132. The corresponding I / O signals between the circuit boards 131 and 133 are routed from the circuit board 133 (such as a so-called motherboard) to the power stage circuit board 131 through the plated edge connector 108 of the (redistributed) circuit board 132. If necessary, the input voltage power path and the ground power path are provided with solid, low resistance, copper clips or other suitable entities that provide low impedance.

[0087] One advantage of assembly 106 is that circuit board 131 and corresponding circuitry (such as a so-called power stage) are directly thermally accessible without giving up other important features such as ease of manufacture and high efficiency. Multiple instances of assembly 106 can be implemented in parallel to convert corresponding input voltages to output voltages.

[0088] Figure 1B As described in this article Figure 1A An example 3-D (three-dimensional) diagram of an inductor component in a power supply component.

[0089] As previously mentioned, the inductor assembly 103 as described herein includes a conductive path 121 extending from a first axial end (such as input node 121 - 1 ), through magnetically permeable material 111 , to a second axial end (such as output node 121 - 2 ).

[0090] Figure 2 is an example diagram illustrating an implementation of power converter phases for providing power to a dynamic load as discussed herein.

[0091] In this non-limiting example, the power circuit assembly 106 or power converter 102 is configured as a buck converter, which includes an input voltage source 220 (such as from or on the circuit board 133), a switch Q11 (such as the assembly 170-1), a switch Q12 (such as the assembly 170-2), an inductor 225 (such as the inductor assembly 103 or the conductive path 121), and an output capacitor 235 (such as disposed on the circuit board 132 or the circuit board 133). Note that the input voltage source 220 may include any number of input capacitors 299 disposed between the ground potential (GND) and the drain node (D) of the switch Q11. Such input capacitors may be mounted on the circuit board 131, the circuit board 132, or a combination of both.

[0092] although Figure 2 The power converter 102 in FIG. 1 is a buck converter configuration, but note that the power converter 102 may be instantiated as any suitable type of voltage converter that provides regulation as described herein.

[0093] As shown, the switch Q11 is connected in series with the switch Q12 on the circuit board 131 or the input voltage source 220 and the corresponding ground reference potential or other suitable entity between the voltage. By switching the switches Q11 and Q12 based on the control signals 104-1 and 104-2, the node (also referred to as the VSW node) coupling the source node of the switch Q11 and the drain node of the switch Q12 provides a current 159 through the inductor 225 (also referred to as the conductive path 121), resulting in the generation of an output voltage 223 (also referred to as VOUT) supplied to the circuit board 132, and the circuit board 132 outputs the output voltage 223 (VOUT) to the circuit board 133.

[0094] In one example, a pulse width modulation controller 260 associated with the controller 140 or other suitable entity controls the switching of the switches Q11 and Q12 based on one or more feedback parameters. For example, as previously described, the controller 140 receives an output voltage feedback signal 223-1 derived from the output voltage 223 supplied to power the load 118. Through the amplifier 240, the controller 140 compares the output voltage feedback signal 223-1 (such as the output voltage 223 or VOUT itself or a derived signal) with a reference voltage 203. As previously described, the reference voltage 203 is a desired set point for controlling the magnitude of the output voltage 223.

[0095] Based on the comparison as provided by amplifier 240, amplifier 240 generates a corresponding error voltage 255 based on the difference between output voltage feedback signal 223-1 and reference voltage 203. The magnitude of the variation in error voltage 255 depends on the degree to which the magnitude of output voltage 223 is in regulation or out of regulation (relative to reference voltage 203).

[0096] As further shown, the PWM controller 260 of the controller 140 controls the switching operation of the switches Q11 and Q12 based on the magnitude of the error voltage 255. For example, if the error voltage 255 indicates that the output voltage 223 (of the power converter 102) is less than the magnitude of the reference voltage 203, the PWM controller 260 increases the duty cycle of activating the high-side switch Q11 (and thus decreases the duty cycle of activating the low-side switch Q12) in the corresponding switching control cycle.

[0097] Conversely, if the error voltage 255 indicates that the output voltage 223 (of the power converter 112 ) is greater than the magnitude of the reference voltage 203 , the PWM controller 260 reduces the duty cycle of activating the high-side switch Q11 (and thus increases the duty cycle of activating the low-side switch Q12 ) in the corresponding switching control cycle.

[0098] As is known in the art, the controller 140 can be configured to control each of the switches Q11 and Q12 to be turned on and off at different times to prevent the input voltage 221 (also referred to as VIN) from being shorted to the ground reference voltage. For example, when the switch Q11 is activated to the on state, the switch Q12 is deactivated to the off state. Conversely, when the switch Q11 is deactivated to the off state, the switch Q12 is activated to the on state.

[0099] By controlling the variation of the modulation pulses of the corresponding switches Q11 and Q12 , the controller 140 controls the generation of the output voltage 121 so that the output voltage 223 is maintained within a desired voltage range.

[0100] Figure 3 is an example side view of a power supply assembly as described herein.

[0101] In this example, heat sink 115 is directly connected to circuit board 133 via thermal interface material 116 .

[0102] In this case, the circuit 300 includes an inductor assembly 103 (such as a combination of a conductive path 121 and a magnetically conductive material 111 and a conductive element 121-INP) coupled to both the circuit board 131 and the circuit board 132. As previously described, the inductor assembly 103 is used to convert the input voltage VIN into an output voltage VOUT based on the control of the current 159 from the input voltage VIN and the GND reference, through the conductive path 121 of the inductor assembly 103, and to the circuit board 102.

[0103] The circuit 300 also includes a heat sink assembly, wherein a first portion (surface 323) of the heat sink 115 is coupled to the circuit board 131 via a thermal interface material 116 (such as a thermally conductive material) that provides good heat flow from the circuit board 131 to the heat sink 115. As shown, the circuit board 131 is disposed between the heat sink 115 and the inductor assembly 103. A second portion (surface 323) of the heat sink 115 is also directly coupled to the circuit board 133.

[0104] Figure 4 is an example diagram illustrating power supply components as described herein.

[0105] In this example, heat sink assembly 415 associated with assembly 106 is L-shaped to cool the module from both sides, resulting in even better thermal performance. A first portion of heat sink 415-1 is directly connected to circuit board 131 through thermal interface material 116 in a similar manner as previously discussed.

[0106] Furthermore, the circuit 400 includes an inductor assembly 103 (such as a combination of a conductive path 121 and a magnetically conductive material 111 and a conductive element 121 -INP) coupled to both the circuit boards 131 and 132 .

[0107] The circuit 400 in this example includes a heat sink assembly in which a first portion of a heat sink 415-1 is coupled to a circuit board 131 via a thermal interface material 116 (such as an insulating material) that provides heat flow from the circuit board 131 to the heat sink 415-1. As shown, the circuit board 131 is disposed between the heat sink 415-1 and the inductor assembly 103. A second portion of the heat sink 415-2 is directly coupled to the thermal interface material 116 of the assembly 106. In such a case, the second portion of the heat sink 415-2 is coupled to a surface of the inductor assembly 103, wherein the inductor assembly 103 is disposed between a portion of the heat sink 415-2 and the circuit board 132.

[0108] Figure 5Ais a side view of a power supply assembly as described herein. Figure 5B is a top view of a power supply assembly as described herein. Figure 5C is an exemplary first side view of a power supply assembly as described herein. Figure 5D is an exemplary second side view of a power supply assembly as described herein.

[0109] In this example, a single phase module is shown. Multiple instances of a single phase implementation can be expanded to multiple phases in parallel.

[0110] As previously described, the overmolded assembly 102 provides connectivity between the circuit board 131 and the circuit board 132. The overmolded assembly 102 (also referred to as the molded assembly 102) includes an inductor component (such as a conductive path surrounded by a magnetically conductive material 111) and a plurality of connector components including a conductive element 123, a conductive element 122, and a conductive element 121-INP. The inductor component (also referred to as the conductive path 121) is used to output an output voltage VOUT or an output voltage 223 to the circuit board 132 based on a current 159 input to the inductor component from the input voltage VIN, as previously described. The plurality of connector components in the overmolded assembly 102 include: i) a conductive element 122, which provides for the transmission of the input voltage VIN from the circuit board 132 to the circuit board 131, and ii) a conductive element 123, which provides for the transmission of a GND reference voltage associated with the input voltage VIN from the circuit board 132 to the circuit board 131.

[0111] Fig. 6A is an example 3-D diagram of a circuit path component as described herein. Figure 6B is described in this article Fig. 6A An example side view of a circuit path component.

[0112] In this example, the overmold assembly 102 includes six nodes (such as terminals or pads) associated with corresponding conductive paths therethrough.

[0113] For example, the overmolded component 102 includes a combination of a conductive element 121-INP and a conductive path 121 that extends between a node 61-1 disposed on a surface 603 of the overmolded component 102 to a node 61-2 disposed on a surface 604 of the overmolded component 102. Thus, the combination of the conductive element 121-INP and the conductive path 121 disposed in the overmolded component 102 provides connectivity and transmission of an electric current 159 between the node 61-1 and the node 61-2.

[0114] In addition, the overmolded component 102 includes a conductive element 122 extending between a node 62-1 disposed on a surface 603 of the overmolded component 102 to a node 62-2 disposed on a surface 604 of the overmolded component 102. Thus, the conductive element 122 disposed in the overmolded component 102 provides connectivity and transmission of a GND reference voltage between the node 62-2 and the node 62-1.

[0115] In addition, the overmold component 102 includes a conductive element 123 extending between a node 63-1 disposed on a surface 603 of the overmold component 102 to a node 63-2 disposed on a surface 604 of the overmold component 102. Therefore, the conductive element 123 disposed in the overmold component 102 provides connectivity and transmission of the input voltage VIN between the node 63-2 to the node 63-1.

[0116] Such an assembly 102 is useful because the assembly 102 itself can be used to provide connectivity between the circuit board 131 and the circuit board 132, as previously described.

[0117] Figure 7 is an example side view illustrating an implementation of a power supply assembly as described herein.

[0118] In this example, the bottom surface of the power stage PCB (circuit board 131) is edge plated to include edge connector 708. In such a case, the I / O signals are routed directly between circuit board 131 and either circuit board 133 or circuit board 132. This alleviates the need to have to route signals between circuit board 131 and circuit board 133. In other words, circuit board 132 can be bypassed.

[0119] In such a case, the circuit board 131 can be configured to include a corresponding connector interface, such as an edge connector 708, which provides connectivity from the edge of the circuit board to the circuit board 133 (such as a main substrate). The connector interface (also referred to as the edge connector 708) transmits any signals received from the circuit board 133 (such as a main substrate) to the power converter circuit on the circuit board 131. In the opposite direction, the connector interface (also referred to as the edge connector 708) transmits the signals received from the circuit board 131 to the circuit board 133.

[0120] Fig. 8A is an example side view illustrating an implementation of a power supply assembly as described herein. Figure 8B is an example schematic diagram of an input-output disk associated with a power supply assembly as described herein. More specifically, Figure 8B is a view of edge connector 808 that provides connectivity to a circuit board. Figure 8Cis an example diagram showing a side view of a circuit path assembly as described herein.

[0121] exist Fig. 8A , Figure 8B and Figure 8C In yet another example shown, the edge plated bottom of the power stage PCB (circuit board 131) includes Vin and GND connections, as well as I / O signals. In this way, the use of a VIN clip in assembly 106 can be avoided because the input voltage is transmitted directly from circuit board 133 to circuit board 131 at edge connector 808 to save valuable space, which can be used to increase the size of the inductor or make the module (such as assembly 106) smaller. Another advantage is that the VIN loop is now so small that the parasitic inductance of such a loop is also minimized, so that the low impedance allows lower frequency decoupling input capacitors to be placed directly on the motherboard, thereby reducing the bill of materials and complexity of the power module (i.e., only high frequency decoupling capacitors need to be mounted on the module).

[0122] More specifically, the overmolded component 102-2 includes a combination of a conductive element 121-INP and a conductive path 121 extending between a node 81-1 disposed on a surface 803 of the overmolded component 102-2 to a node 81-2 disposed on a surface 804 of the overmolded component 102-2. Thus, the combination of the conductive element 121-INP and the conductive path 121 disposed in the overmolded component 102-2 provides connectivity and transmission of an electric current 159 between the node 81-1 and the node 81-2.

[0123] In addition, the overmolded component 102-2 includes a conductive element 122 extending between a node 82-1 disposed on a surface 803 of the overmolded component 102-2 to a node 82-2 disposed on a surface 804 of the overmolded component 102-2. Thus, the conductive element 122 disposed in the overmolded component 102-2 provides connectivity and transmission of a GND reference voltage between the node 82-2 and the node 82-1.

[0124] Additionally, circuit board 131 may be configured to include a connector interface 808 (such as an edge connector 808) that provides connectivity from an edge of circuit board 131 to circuit board 133 (such as a main substrate), bypassing circuit board 132. The connector interface (also referred to as edge connector 808) is used to transmit signals (such as including input voltage) received from circuit board 133 to power converter circuitry on circuit board 131 and / or vice versa.

[0125] If desired, the connector interface may be configured to transmit input voltage VIN from circuit board 133 to the power converter circuit of circuit board 131 .

[0126] Fig. 9 is an example side view illustrating an implementation of a power supply assembly including multiple instances of magnetic permeability as described herein.

[0127] In yet another example, the horizontal portion of the switch node connection or conductive element 121 -INP may be surrounded by additional magnetic material 112 in the form of a solid block or sheet to provide more inductance to the system. Fig. 9 The implementation of the circuit 900 in FIG. 1 includes two inductors arranged in series. For example, the first inductor is formed by a combination of a conductive path 121 surrounded by a magnetic conductive material 111. The second inductor is formed by a combination of a conductive element 121-INP surrounded by a magnetic conductive material 112.

[0128] The magnetic permeability of the magnetic material 111 may be the same as or different from that of the magnetic permeability of the magnetic material 112 .

[0129] Thus, an example of a circuit 900 such as a power converter assembly can be configured to include an inductor component coupled to both circuit boards 131 and 132. The inductor component includes a conductive path, such as a conductive path 121 including a conductive element 121-INP and converting a current received from an input voltage into an output voltage output from the conductive path 121. The inductor component includes a first magnetically conductive material 111 surrounding a first portion of the conductive path 121. The inductor component also includes a second magnetically conductive material 112 surrounding a second portion of the conductive path (i.e., the conductive element 121-INP).

[0130] As described above, in one example, the magnetic permeability of the first magnetic conductive material 111 is different from the magnetic permeability of the second magnetic conductive material 112; the first portion of the inductor component (such as the conductive path 121) extends axially in a first direction such as along the Y-axis; the second portion of the inductor component (such as the conductive element 121-INP) extends axially in a second direction different from the first direction (such as along the z-axis).

[0131] Fig.10 is an example side view illustrating an implementation of a power supply assembly as described herein.

[0132] As shown in this example, a circuit board 131, such as a power stage PCB, is placed on a circuit board 132, such as a redistribution board. Switch node connectivity is achieved on the top plated side of the circuit board 131. The conductive paths 121 (also referred to as die inductors) and corresponding magnetically conductive materials 111 are elevated or spaced apart from the circuit board 132 to accommodate output and input components 941 and 942 (such as capacitors or other suitable components).

[0133] Thus, assembly 901 can be configured to include an inductor assembly that includes a magnetically conductive material 111 and a conductive path 121. Conductive path 121 and corresponding conductive element 121-INP provide direct connectivity between circuit board 131 and circuit board 132. The space 1010 between the magnetically conductive material 111 and the surface of circuit board 132 is filled with corresponding components 941 and components 942. A plurality of circuit components (such as 941 and 942) are directly coupled to the surface of the second circuit board 132. As previously described, circuit components 941 and 942 reside in the space 1010 between the magnetically conductive material and the surface of the second circuit board 132.

[0134] therefore, Fig.10 An example is shown in which the power stage board (circuit board 131) is edge plated on both the bottom and top sides and is placed on top of the redistribution board (rather than on the motherboard or circuit board 133). In this way, the total footprint of the module is limited to one of the redistribution boards, so the redistribution board can follow market standards without requiring the customer to change the layout of its motherboard. Another difference from the previous example is that the power stage PCB (circuit board 131) also includes VIN and GND layers, and no external fixture is required, making the module more compact. In addition, the switch node connection is completed on the top plated side of the power stage PCB. Finally, the core inductor (such as a conductive path 121 surrounded by a magnetically conductive material 111) is raised to create a space 1010 to accommodate components 941 and 942. Accommodate input and output capacitors. Alternatively, with appropriate capacitor size and PCB layout, these components 941 and 942 can also be directly embedded in any PCB associated with component 901.

[0135] Fig.11 is an example side view illustrating an implementation of a power supply assembly as described herein.

[0136] In this case, it is desirable to use a discrete power stage 1131 (similar to a lead frame based on providing functions such as circuit board 131) rather than embedding semiconductor devices (such as components 171, 172, etc.) into the power stage PCB (circuit board 131). Note that Fig.11 The presented aspects of the component 1101 and the corresponding discrete power stage 1131 can be applied to all previously shown examples.

[0137] Fig. 12A is an example side view illustrating an implementation of a power supply assembly as described herein. Fig. 12B is an example diagram illustrating an implementation of multiple circuit boards and corresponding flexible connectors as described herein.

[0138] like Fig. 12A and Fig. 12BAs shown, the power stage PCB and the redistribution PCB may be connected via a flexible portion of the PCB (such as flexible connector 1201) that embeds copper circuit paths that carry the power stage I / O signals.

[0139] The main benefit of this implementation is that the power stage PCB (such as circuit board 131) and the redistribution PCB (such as circuit board 132) are provided as a single pre-connected component (see Fig. 12B ). This way, fewer soldering connections need to be performed and the module can be assembled in only a few steps.

[0140] Therefore, refer again to Fig. 12A , the example power converter assembly 1200 includes a flexible hinge connector 1201 connected to an edge 1208 of a circuit board 131 and an edge 1209 of a second circuit board 132. The flexible hinge connector 1201 transmits signals between the first circuit board 131 and the second circuit board 132.

[0141] As further shown, the first circuit board 131 can be configured to include a first surface pad 91-1, a second surface pad 92-1, and a third surface pad 93-1. The second circuit board 132 includes a fourth surface pad 93-2, a fifth surface pad 92-2, and a sixth surface pad 91-2. Each surface pad is a corresponding node.

[0142] In the corresponding assembly 106 , the surface pad 93 - 2 of the second circuit board 132 is used to receive the input voltage VIN from the circuit board 133 and transmit it to the third surface pad 93 - 1 of the first circuit board 131 through the first conductive element 123 (conductive path).

[0143] The surface pad 92 - 2 of the second circuit board 132 is used to receive the input ground reference voltage potential and transmit it to the surface pad 92 - 1 of the first circuit board 131 through the second conductive element 122 (conductive path).

[0144] In another example, the circuit board 132 can be configured to receive an input voltage VIN and a ground reference potential (ground or GND) from the circuit board 133 via an input voltage node 181 and a ground reference node 182, respectively, as previously described in Figure 1A discussed in . Fig. 12A The circuit board 132 in the embodiment may be configured to transmit VIN and GND to the circuit board 131 through the flexible connector 1201. Therefore, the assembly 102 may not need to include the conductive element 122 and the conductive element 123 because the flexible connector 1201 transmits these voltages from the circuit board 132 to the circuit board 131.

[0145] If desired, both the flexible connector 1201 and the conductive elements 122 and 123 (present in the assembly 102) can be configured to transfer the input voltage and ground reference from the circuit board 132 to the circuit board 131. The surface pad 91-1 of the circuit board 131 is used to output the current 159 derived from the input voltage VIN and / or the ground reference potential. The output current 159 is transferred to the surface pad 91-2 of the circuit board 132 through a third conductive path (such as a combination of conductive elements 121-INP in the conductive path 121). As previously described, the conductive path 121 is an inductor component.

[0146] Fig.13A is a side view of a corresponding flexible circuit assembly as discussed herein. Fig. 13B is a three-dimensional view of a corresponding component as described herein. Fig. 13C is an example diagram illustrating fabrication of a power supply assembly or power converter phase as described herein.Any number of power converter phases may be implemented in parallel to convert respective input voltages into output voltages.

[0147] In this example, the manufacturer applies corresponding solder paste to each surface pad of the circuit board 131 and the circuit board 132 connected by the flexible hinge connector 1201.

[0148] In addition, the manufacturer electrically connects the surface pad 61-1 of the component 102 to the surface pad 91-1 of the circuit board 131. The manufacturer electrically connects the surface pad 62-1 of the component 102 to the surface pad 92-1 of the circuit board 131. The manufacturer electrically connects the surface pad 63-1 of the component 102 to the surface pad 93-1 of the circuit board 131.

[0149] The manufacturer electrically connects the surface pad 61-2 of the component 102 to the surface pad 91-2 of the circuit board 131. The manufacturer electrically connects the surface pad 62-2 of the component 102 to the surface pad 92-2 of the circuit board 131. The manufacturer electrically connects the surface pad 63-2 of the component 102 to the surface pad 93-2 of the circuit board 131.

[0150] Fig.14 An example of a single-phase die for a TLVR system is shown, the size and mutual position of the two windings are in accordance with the needs of the designer, and it must be noted that in order to avoid any short circuit between the two windings, an electrical insulator must be present. Multiple instances of transformer 1520 can be implemented in a trans-inductor voltage regulator, such as FIG. 16A to FIG. 16D As further shown in .

[0151] Fig.15 is an example diagram illustrating connectivity between various power supply components to provide a trans-inductor voltage regulator as described herein.

[0152] The proposed power supply as discussed in this article can also be extended to a trans-inductor voltage regulator TLVR. A TLVR system as a voltage regulator (e.g. a buck converter) in which the magnetic device is no longer a single-winding inductor, but a transformer with two windings; where the primary winding constitutes the phase inductor. The secondary winding is the so-called TLVR winding, which is used to improve transient performance. The secondary windings of each phase must be connected in series and their wiring to the PCB must guarantee that the current flowing through each of the phases always has the same direction. The operating functions of the TLVR system are described in detail in the literature. However, Fig.15 The circuit to be implemented for the two-phase case is shown in .

[0153] For example, Fig.15 As shown, the power converter component 200, such as part of a trans-inductor voltage regulator circuit, has a conductive path 121 (such as a first phase inductor) extending between a node VSW1 and a node VOUT (generating an output voltage 223); a conductive path 122 (such as a second phase inductor) extending between a node VSW2 and a node VOUT (generating an output voltage 123).

[0154] Power converter 200 includes a series circuit path between nodes TLVR1-in and TLVR2-out. Series circuit path 160 (also referred to as conductive path 123) includes conductive path 123-1 and conductive path 123-2 connected in series, wherein conductive path 223-P1 provides connectivity between node E2 (such as node TLVR1-OUT) and node E3 (such as node TLVR2-IN).

[0155] In one example, as further discussed herein, a transformer assembly is coupled to a first circuit board and a second circuit board, the transformer component comprising: i) a first conductive path extending through a magnetically conductive material, the first conductive path being a primary winding for converting a current received from an input voltage into an output voltage, and ii) a second conductive path disposed in parallel with the first conductive path and extending through the magnetically conductive material, the second conductive path being a secondary winding magnetically coupled to the primary winding.

[0156] Fig.16A is an example top view showing a power supply assembly prior to making winding connections as described herein. Fig. 16B is an example top view showing a manufactured power supply assembly including winding connections as described herein. Fig. 16C is an example side view showing a power supply assembly as described herein. Fig.16D is an example side view showing a power supply assembly as described.

[0157] FIG. 16A to FIG. 16DOne way to implement the TLVR system in the proposed example is shown. In this example, the primary winding VSW is connected to the power stage PCB in each instance, as shown before, while the TLVR winding is connected to the redistribution PCB through an external copper clip. The series connection between the two TLVR windings is done through copper traces within the redistribution PCB. As mentioned before, there is a spacing (such as including an insulator material) between the phase winding and the TLVR winding.

[0158] Fig.17A is an example top view showing a power supply assembly prior to making winding connections as described herein. Fig. 17B is an example top view showing a manufactured power supply assembly including winding connections as described herein.

[0159] Another TLVR circuit includes a TLVR connection through the power stage PCB to the redistribution PCB.

[0160] To simplify the assembly process, the die TLVR inductor circuit group (i.e. FIG. 16A to FIG. 16D The circuit shown) can be embedded as shown in Fig. 6A and Figure 6B The die shown in the single overmolded component, however, now the TLVR inductor will additionally have a TLVR_1 IN and TLVR_2 out Network (ie, TLVR_1 out and TLVR_2 in The connection is done within the overmolded TLVR inductor magnetic device).

[0161] Fig.18 is an example diagram showing the flow of a cooling tube as described herein.

[0162] In this example, the system includes cooling tubes 1910 extending between adjacent instances of power converter assemblies 1901 and 1902. Cooling tubes 1910 transport fluid to carry heat away from the respective power converter assemblies.

[0163] Fig.19 is an example top view showing cooling tubes disposed between multiple instances of power supply assemblies as described herein.

[0164] In this example, circuit board 1991 is populated with an array of one or more power converter assemblies 1901, a CPU, and an array of one or more power converter assemblies 1902. Circuit board 1992 is populated with an array of one or more power converter assemblies 1903, a CPU, and an array of one or more power converter assemblies 1904. Circuit board 1993 is populated with an array of one or more power converter assemblies 1905, a CPU, and an array of one or more power converter assemblies 1906, and so on.

[0165] Cooling tube 1910 snakes through a back-to-back array of power converter components in a corresponding circuit board, such as Fig.19 Any suitable fluid flows through cooling tube 1910 to remove heat from the corresponding circuit.

[0166] Fig. 20 is an example diagram illustrating an implementation of cooling tubes disposed between multiple instances of a power supply assembly as described herein.

[0167] In this example, cooling tube 1910 provides stepped connectivity between any number of circuit boards.

[0168] Fig.21A is an example top view showing a respective heat sink providing cooling to any of the components as discussed herein. Fig. 21B is an example side view showing a respective heat sink providing cooling to any of the components as discussed herein.

[0169] like Fig. 21B As shown in this example, the assembly 2100 includes a heat sink 2140 and an assembly 2130. Note that the assembly 2130 (such as any of the assemblies discussed herein) is in contact with the heat sink 2140. The heat sink 2140 includes corresponding fluid channels 2120 to transport fluid. The heat sink 2140 removes heat from the assembly 2130 through the fluid flow through the fluid channels 2120. The clamp 2110-1 can be configured to hold the assembly 2130 to the heat sink 2140.

[0170] like Fig.21A As shown, assembly 2100 may include any number of fixtures, including fixture 2110-1, fixture 2110-2, fixture 2110-3, etc. As further shown, assembly 2100 may be configured to include mounting holes 2191, 2192, etc. to mount the corresponding assembly 2100 to a circuit board or other entity.

[0171] Fig. 22 is an example diagram illustrating a method of controlling a power converter according to examples herein.

[0172] In process operation 2210 , the manufacturer houses a first circuit board 131 that includes a power converter circuit (such as component 170 ) for supporting conversion of an input voltage into an output voltage.

[0173] In process operation 2220, the manufacturer accommodates a second circuit board 132 for: i) receiving the output voltage, and ii) transmitting the output voltage to an output of the second circuit board 132; and

[0174] In process operation 2230 , the manufacturer manufactures the assembly 102 such that the second circuit board 132 in the assembly 106 is substantially orthogonal to the first circuit board 131 .

[0175] Again, it should be noted that the techniques herein are well suited for use in circuit applications, such as those implementing power conversion. However, it should be noted that the examples herein are not limited to use in such applications, and the techniques discussed herein are also well suited for other applications.

[0176] Based on the description set forth herein, many specific details have been set forth to provide a thorough understanding of the subject matter claimed. However, it should be understood by those skilled in the art that the subject matter claimed can be practiced without these specific details. In other cases, methods, devices, systems, etc. known to ordinary technicians are not described in detail to avoid blurring the subject matter claimed. Some parts of the detailed description have been presented in the form of algorithms or symbolic representations of data bits or binary digital signals stored in a computing system memory (such as a computer memory) for operation. These algorithm descriptions or representations are examples of techniques used by ordinary technicians in the field of data processing to convey the essence of their work to other technicians in the field. The algorithms described herein are generally considered to be self-consistent sequences of operations or similar processes that produce desired results. In this context, operations or processes involve physical manipulation of physical quantities. Generally, although not required, these quantities can take the form of electrical or magnetic signals that can be stored, transmitted, combined, compared, or otherwise manipulated. Sometimes, mainly for general reasons, it is convenient to refer to such signals as bits, data, values, elements, symbols, characters, items, numbers, numbers, etc. However, it should be understood that all these terms and similar terms are associated with appropriate physical quantities and are only convenient labels. Unless otherwise expressly stated, as will be apparent from the following discussion, it should be understood that throughout the specification, discussions utilizing terms such as "processing," "computing," "calculating," "determining," and the like refer to the actions or processes of a computing platform (such as a computer or similar electronic computing device) that manipulate or transform data represented as physical electronic or magnetic quantities within a memory, register, or other information storage device, transmission device, or display device of the computing platform.

[0177] Although the present invention has been specifically shown and described with reference to the preferred examples of the present invention, it will be appreciated by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the present invention as defined by the appended claims. Such changes are intended to be covered by the scope of the present application. Thus, the foregoing description of the examples of the present application is not intended to be restrictive. Rather, any limitations to the present invention are presented in the appended claims.

Claims

1. A power converter assembly comprising: a first circuit board including a power converter circuit operable to control conversion of an input voltage to an output voltage; as well as A second circuit board is disposed substantially orthogonal to the first circuit board, the second circuit board being operable to receive the output voltage and to transmit the output voltage to an output of the second circuit board.

2. The power converter assembly of claim 1 , further comprising: An inductor assembly includes an input node coupled to the first circuit board to receive an input current derived from the input voltage and an output node coupled to the second circuit board to supply the output voltage to the second circuit board.

3. The power converter assembly according to claim 2, wherein: The power converter circuit comprises: A plurality of switches are secured to the first circuit board, the plurality of switches being operable to receive control signals from a controller, the control signals being operable to control the delivery of the input current through the inductor assembly to generate the output voltage supplied to the second circuit board.

4. The power converter assembly according to claim 3, wherein: The inductor assembly comprises: A block of magnetically conductive material; and A first conductive path extends through the block of magnetically conductive material.

5. The power converter assembly of claim 4, wherein: The inductor assembly is manufactured in an overmolded assembly, the overmolded assembly comprising: a first conductive element providing connectivity between the first circuit board and the second circuit board, the first conductive element being operable to transfer the input voltage from the second circuit board to the first circuit board; and A second conductive element is disposed between the first circuit board and the second circuit board, the second conductive element being operable to transmit a reference voltage from the second circuit board to the first circuit board.

6. The power converter assembly of claim 1 , further comprising: an inductor assembly coupled to the first circuit board and the second circuit board, the inductor assembly operable to convert the input voltage to the output voltage by controlling a current derived from the input voltage to pass through a conductive path of the inductor assembly to the second circuit board; as well as A heat sink assembly has a first portion coupled to a surface of the first circuit board, the first circuit board being disposed between the first portion of the heat sink assembly and the inductor assembly.

7. The power converter assembly of claim 6, wherein: The second portion of the heat sink assembly is coupled to a surface of the inductor assembly, and the inductor assembly is disposed between the second portion of the heat sink assembly and the second circuit board.

8. The power converter assembly of claim 1 , further comprising: an overmold assembly operable to provide connectivity between the first circuit board and the second circuit board, the overmold assembly comprising an inductor assembly and a plurality of connector components, wherein the inductor assembly is operable to output the output voltage to the second circuit board based on a current input to the inductor assembly derived from the input voltage; and Wherein, the plurality of connector components include: a first conductive element, which provides transmission of the input voltage from the second circuit board to the first circuit board, and a second conductive element, which provides transmission of a reference voltage associated with the input voltage from the second circuit board to the first circuit board.

9. The power converter assembly of claim 1, wherein: The second circuit board includes a connector interface that provides connectivity from an edge of the second circuit board to the first circuit board to transmit signals received from the main substrate to the first circuit board.

10. The power converter assembly of claim 1, wherein: The first circuit board includes a connector interface that provides connectivity from an edge of the first circuit board to a main substrate, the connector interface being used to transmit a signal received from the main substrate to the power converter circuit on the first circuit board, and the second circuit board is attached to the main substrate.

11. The power converter assembly of claim 10, wherein: The connector interface is used to transmit the input voltage from the main substrate to the power converter circuit of the first circuit board.

12. The power converter assembly of claim 1 , further comprising: An inductor assembly is coupled to the first circuit board and the second circuit board, the inductor assembly comprising a conductive path operable to convert a current originating from the input voltage into the output voltage, the inductor assembly comprising a first magnetically conductive material surrounding a first portion of the conductive path, and the inductor assembly comprising a second magnetically conductive material surrounding a second portion of the conductive path.

13. The power converter assembly of claim 12, wherein: The magnetic permeability of the first magnetic conductive material is different from the magnetic permeability of the second magnetic conductive material; wherein the first portion of the inductor assembly extends axially in a first direction; and Wherein, the second portion of the inductor assembly extends axially in a second direction different from the first direction.

14. The power converter assembly of claim 1 , further comprising: an inductor assembly comprising a magnetically conductive material and a conductive path providing direct connectivity between the first circuit board and the second circuit board; The distance between the magnetic conductive material and the surface of the second circuit board; as well as A plurality of circuit components are directly coupled to the surface of the second circuit board, the circuit components residing in the space between the magnetically conductive material and the surface of the second circuit board.

15. The power converter assembly of claim 1 further comprising: A flexible hinge connector provides connectivity between an edge of the first circuit board and an edge of the second circuit board, the flexible hinge connector being operable to transmit signals between the first circuit board and the second circuit board.

16. The power converter assembly of claim 15, wherein: The first circuit board includes a first surface plate, a second surface plate and a third surface plate; Wherein, the second circuit board includes a fourth surface plate, a fifth surface plate and a sixth surface plate; wherein the fourth surface pad of the second circuit board is operable to output the input voltage from the second circuit board to the third surface pad of the first circuit board through a first conductive path; wherein a second conductive path disposed between a fifth surface pad of the second circuit board and a second surface pad of the first circuit board is operable to provide a reference voltage from the second circuit board to the first circuit board; and The first surface pad of the first circuit board is operable to output a current derived from the input voltage to a sixth surface pad of the second circuit board through a third conductive path, wherein the third conductive path is an inductor component.

17. The power converter assembly of claim 1 further comprising: A transformer assembly coupled to the first circuit board and the second circuit board, the transformer assembly comprising: a first conductive path extending through a magnetically conductive material, the first conductive path being a primary winding operable to convert a current originating from the input voltage into the output voltage; and a second conductive path arranged in parallel with the first conductive path and extending through the magnetically conductive material, the second conductive path being a secondary winding magnetically coupled to the primary winding.

18. The power converter assembly of claim 17, wherein: The secondary winding is provided in a circuit path connecting a plurality of secondary windings in series.

19. The power converter assembly of claim 1 further comprising: A heat sink assembly is directly coupled to a surface of the first circuit board, the heat sink assembly including a conduit through which a fluid is operable to receive heat dissipated from the first circuit board.

20. The power converter assembly of claim 19, further comprising: a third circuit board including a power converter circuit operable to control conversion of the input voltage to the output voltage; and a fourth circuit board disposed substantially orthogonally to the third circuit board, the fourth circuit board being operable to receive the output voltage and to transmit the output voltage to an output of the fourth circuit board, The heat sink assembly is directly coupled to the surface of the third circuit board, and the fluid flowing through the conduit is operable to receive heat dissipated from the third circuit board.

21. A manufacturing method comprising: housing a first circuit board including a power converter circuit operable to control conversion of an input voltage to an output voltage; housing a second circuit board operable to receive the output voltage and to transmit the output voltage to an output of the second circuit board; as well as The second circuit board is manufactured to be substantially orthogonal to the first circuit board.

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