PCB electroplating orifice copper thickness control method and PCB manufactured by same

Abstract

The invention relates to a PCB electroplating orifice copper thickness control method and a manufactured PCB, and the main points of the technical scheme are that the method comprises the steps: manufacturing a dry film pattern according to the electroplating orifice distribution of the PCB after the whole board electroplating, and cutting a conductive adhesive copper foil according to the dry film pattern; manufacturing a dry film according to the dry film pattern, covering the PCB with the dry film, and performing exposure; the cut conductive adhesive copper foil alignment strips are attached to the dry film, and pattern electroplating and hole plating are carried out; removing the conductive adhesive copper foil and reducing copper; removing the dry film on the PCB and entering a subsequent process; according to the invention, the problem that the copper thickness of the hole is bulged when the hole is electroplated is solved, and the problems that the bulged hole is connected with the lead to generate an open circuit and the resin plug hole cannot be completely plugged into the hole are also solved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and more specifically, to a method for controlling the copper thickness of a PCB electroplating hole and a PCB board manufactured therefrom. Background Art

[0002] In the existing printed circuit board manufacturing technology, the conductor width / spacing of the outer layer circuits is becoming more and more refined. Fine circuits with line / line spacing ≤2.0 / 2.0mil, minimum mechanical drilling hole diameter of 0.15mm / 0.2mm, and printed circuit boards with a thickness greater than 2.0mm have become the norm in engineering design. If the whole board is electroplated according to the conventional positive pattern electroplating tinning process, the surface copper thickness after electroplating will exceed the outer layer etching capacity, resulting in the failure to successfully produce fine circuits. Therefore, the hole plating process came into being. As the name suggests, hole plating is to cover the PCB copper surface with the outer layer of PCB dry film, and only open a window to expose the hole position for electroplating. The advantage is that the surface copper thickness will not increase because the surface copper position is covered with dry film. The thinner the copper thickness, the more conducive to the production of fine circuits.

[0003] According to Faraday's law of electroplating, during graphic electroplating, other positions on the board are covered by dry film and cannot be plated with copper. Only the hole mouth is exposed and plated with copper. All the current is concentrated at the hole mouth, and only the hole mouth is plated with copper, resulting in a hole mouth electroplated copper protrusion. When the hole mouth is connected to the wire, it cannot be filled and leveled after the dry film is pressed on the outer layer of the circuit, resulting in an etched open circuit.

[0004] Moreover, the thick copper plating at the hole mouth will make the hole diameter smaller, which makes it difficult or even impossible to stuff the resin ink into the hole when the resin is plugged, especially for small holes with a mechanical aperture of 0.15mm. The invention of this technology is to solve the problem that the copper thickness at the hole mouth in the electroplating hole process causes the hole diameter to become smaller, resulting in the dry film not being pressed tightly when the outer layer pattern is pressed, and the wire is open. When making the resin plug hole, the resin ink cannot be inserted into the hole 100%, or even the silk screen scraper is difficult to scrape 3 to 4 times. Because the resin cannot fill the hole, cracks in the hole, voids in the hole, and depressions in the hole greater than 25um are caused, which affects the reliability of the finished PCB and the surface mount components are affected by the uneven resin surface and the resin voids. Summary of the invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a method for controlling the copper thickness of a PCB electroplating hole and a PCB board made therefrom, so as to solve the above technical problems.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions: A method for controlling the copper thickness of a PCB electroplating hole, comprising:

[0007] After the whole board is electroplated, a dry film pattern is made according to the distribution of the electroplating holes of the PCB board, and the conductive adhesive copper foil is cut according to the dry film pattern;

[0008] Making a dry film according to the dry film pattern, covering the dry film on a PCB board and exposing it;

[0009] The cut conductive adhesive copper foil alignment strip is attached to the dry film, and pattern electroplating holes is performed;

[0010] Remove the conductive adhesive copper foil and reduce copper;

[0011] Remove the dry film on the PCB board and enter the post-process.

[0012] Specifically, a dry film pattern is made according to the distribution of the electroplating holes of the PCB board, and the single side of the dry film window is increased by 0.1mm compared to the via hole, and the conductive adhesive copper foil is cut according to the hole distribution position in the dry film pattern, so that the conductive adhesive copper foil can avoid the position of the hole that needs to be electroplated. Subsequently, a dry film is made according to the dry film pattern, and the dry film is covered on the PCB board for exposure. At this time, the positions on the PCB board that need to be electroplated are all exposed, and then the cut conductive adhesive copper foil alignment strip is attached to the dry film. At this time, the conductive adhesive copper foil can avoid the hole position on the dry film and can cover the position where the hole is not opened on the dry film. By increasing the exposed copper area, the current on the PCB board surface is dispersed, thereby improving the copper plating uniformity of the hole copper thickness distribution, solving the problem of copper thickness protrusion at the hole during electroplating, and solving the problem of open circuit caused by the protruding hole connection wire and the problem that the resin plug hole cannot be completely plugged into the hole.

[0013] Optionally, the step of producing a dry film pattern according to the distribution of electroplating holes on a PCB board includes:

[0014] A dry film pattern is produced by CAM, in which windows are opened for holes that need to be electroplated, windows are opened at the edge of the board to expose the edge clamping area, windows are opened for the spacing between PCSs, and positioning holes are set.

[0015] Specifically, the dry film pattern is made through CAM, and the dry film is opened at the position of the hole that needs to be electroplated on the PCB board. The single side is +0.1mm larger than the Via hole to expose the hole and the hole ring, and the conductive position of the clamping point of the electroplating clip of the board edge pattern is opened to expose a 10*10mm area. By opening the window for the spacing between PCS and PCS, copper can be plated on a larger electroplating area during electroplating, further dispersing the hole mouth current. Positioning holes are usually set at the four ends of the PCB board, which can be positioned when sticking dry film and conductive adhesive copper foil to ensure the accuracy of electroplating.

[0016] Optionally, the windowing distance for opening the interval between PCSs is 1.75 mm, and the windowing edge is 0.125 mm away from the unit.

[0017] For the spacing between PCS and PCS, the panel spacing between the finished PCS and PCS is usually 2mm. By setting the window distance to 1.75mm and the window edge to 0.125mm inside the unit, the panel spacing between PCS and PCS can be fully utilized for electroplating without affecting the circuit on the PCB board, so as to disperse the current on the PCB board surface to improve the copper plating uniformity of the copper thickness distribution at the hole.

[0018] Optionally, the step of cutting the conductive adhesive copper foil according to the dry film pattern includes:

[0019] A cutting program is prepared according to the positions of the holes to be plated in the dry film pattern, avoiding the graphic positions of the holes to be plated, the avoidance distance is set to be not less than 5.0 mm, and alignment holes are set to correspond to the positioning holes in the dry film pattern;

[0020] Conductive adhesive copper foil is laser cut according to the cutting program.

[0021] Specifically, according to the positions of all holes in the dry film graphics, a cutting program is made through AUTOCAD to avoid the image positions of all holes in the dry film graphics, and ensure that the distance between the conductive adhesive copper foil and each hole after cutting is not less than 5.0 mm, so as to avoid the conductive adhesive copper foil affecting the electroplating effect of the electroplated holes. And set alignment holes corresponding to the positioning holes on the conductive adhesive copper foil to facilitate the positioning of the conductive adhesive copper foil and the dry film. Subsequently, the conductive adhesive copper foil can be laser cut to obtain a conductive adhesive copper foil that can avoid all holes on the dry film. By cutting the conductive adhesive copper foil, the conductive adhesive copper foil can be adapted to the distribution of the electroplated holes. Compared with directly applying the conductive adhesive copper foil on the dry film, the hole mouth current of the electroplated hole can be dispersed with a larger area and more uniform distribution, further improving the uniformity of copper plating with red distribution at the hole mouth.

[0022] Optionally, the step of attaching the cut conductive adhesive copper foil alignment strips to the dry film includes:

[0023] Make the alignment holes of the conductive adhesive copper foil face the positioning holes of the dry film, and apply the conductive adhesive copper foil on the dry film; the conductive adhesive copper foil contacts the clamping edge area accordingly.

[0024] Specifically, according to the positioning of the positioning holes and alignment holes, it can ensure that the conductive adhesive copper foil can be accurately applied to the dry film, and the distance between the conductive adhesive copper foil and the electroplating hole meets the avoidance distance. And the two ends of the conductive adhesive copper foil are attached to the clamping area of ​​the PCB, so that the conductive adhesive copper foil can draw electricity from the graphic electroplating clip, thereby achieving the dispersion of the hole mouth current of the electroplating hole.

[0025] Optionally, the full-board electroplated copper thickness of the graphic electroplated holes is 8-12um, and the plated hole copper thickness is 18-20um.

[0026] Specifically, electroplating the entire board at 8-12um can ensure that the copper thickness in the plated hole reaches 18-20um. And because the copper surface with the conductive adhesive copper foil and the gap between PCS and PCS is copper plated at the same time, the copper thickness bulge at the plated hole opening can be avoided.

[0027] Optionally, removing the conductive adhesive copper foil and reducing copper includes:

[0028] Remove the conductive adhesive copper foil on the dry film to expose the spacing between PCS and PCS, perform CNC gong processing on the spacing between PCS and PCS, and reduce the surface copper thickness between PCS and PCS by 12-18um to ensure that the copper surface thickness of the entire board is consistent after film removal.

[0029] Specifically, CNC is used to remove 12-18um of the copper layer on the spacing between PCS and PCS to ensure that the thickness of the copper surface of the entire layout is consistent, so as to ensure that the dry film can be pressed tightly on the PCB board during the graphic transfer, and to prevent the solution from penetrating between the dry film and the PCB board and causing an open circuit.

[0030] The present invention also provides a PCB board, which is manufactured by adopting the above-mentioned method for controlling the copper thickness of the PCB electroplating hole.

[0031] The PCB board made by the above-mentioned PCB electroplating hole copper thickness control method increases the exposed copper area (exposing the copper surface of the panel spacing and the conductive adhesive copper foil strip), thereby increasing the plating area of ​​the pattern electroplating, so it can evenly disperse the current on the PCB board surface and will not be concentrated in the hole with only dry film openings, thereby improving the copper plating uniformity of the hole copper thickness distribution, and solving the problem of copper thickness protrusion at the hole during electroplating. At the same time, it also solves the problem of open circuit caused by the protruding hole connection wire and the problem that the resin plug hole cannot be 100% plugged into the hole.

[0032] In summary, the present invention has the following beneficial effects:

[0033] By exposing the copper surface and pasting conductive adhesive copper foil on the panel spacing, the exposed copper area can be increased, thereby increasing the area of ​​pattern electroplating. Therefore, the current on the PCB board surface can be evenly dispersed and will not be concentrated at the hole openings with only dry film windows, thereby improving the copper plating uniformity of the hole copper thickness distribution and solving the problem of copper thickness protrusion at the hole during electroplating. At the same time, it also solves the open circuit caused by the protruding hole connection wire and the problem that the resin plug hole cannot be 100% plugged into the hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a flow chart of the method of the present invention;

[0035] Figure 2It is a schematic diagram of the structure of the spacing window between PCSs in the present invention;

[0036] Figure 3 It is a schematic diagram of the structure of the conductive adhesive copper foil pasted in the present invention;

[0037] Figure 4 This is a schematic diagram of the structure of the copper thickness of a normal electroplated hole;

[0038] Figure 5 It is a schematic diagram of the structure of the copper thickness protrusion at the opening of the electroplated hole.

[0039] In the figure: 1. Dry film pattern; 2. Conductive adhesive copper foil; 3. Electroplated holes; 4. Panel spacing window; 5. Hole copper layer; 6. Conductive position of the clamping point. DETAILED DESCRIPTION

[0040] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings. Several embodiments of the present invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0042] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments.

[0043] Embodiment 1

[0044] This embodiment provides a method for controlling the copper thickness of a PCB electroplating hole. Figure 1-5 As shown, including:

[0045] After the whole board is electroplated, a dry film pattern is made according to the distribution of the electroplating holes of the PCB board, and the conductive adhesive copper foil is cut according to the dry film pattern;

[0046] Making a dry film according to the dry film pattern, covering the dry film on a PCB board and exposing it;

[0047] The cut conductive adhesive copper foil alignment strip is attached to the dry film, and pattern electroplating holes are performed;

[0048] Remove the conductive adhesive copper foil and reduce copper;

[0049] Remove the dry film on the PCB board and enter the post-process.

[0050] Specifically, a dry film pattern is made according to the distribution of the electroplating holes of the PCB board, and the single side of the dry film window is increased by 0.1mm compared to the via hole, and the conductive adhesive copper foil is cut according to the hole distribution position in the dry film pattern, so that the conductive adhesive copper foil can avoid the position of the hole that needs to be electroplated. Subsequently, a dry film is made according to the dry film pattern, and the dry film is covered on the PCB board for exposure. At this time, the positions on the PCB board that need to be electroplated are all exposed, and then the cut conductive adhesive copper foil alignment strip is attached to the dry film. At this time, the conductive adhesive copper foil can avoid the hole position on the dry film and can cover the position where the hole is not opened on the dry film. By increasing the exposed copper area, the current on the PCB board surface is dispersed, thereby improving the copper plating uniformity of the hole copper thickness distribution, solving the problem of copper thickness protrusion at the hole during electroplating, and solving the problem of open circuit caused by the protruding hole connection wire and the problem that the resin plug hole cannot be completely plugged into the hole.

[0051] Optionally, the step of producing a dry film pattern according to the distribution of electroplating holes on a PCB board includes:

[0052] A dry film pattern is produced by CAM, in which windows are opened for holes that need to be electroplated, windows are opened at the edge of the board to expose the edge clamping area, windows are opened for the spacing between PCSs, and positioning holes are set.

[0053] Specifically, the dry film pattern is made through CAM, and the dry film is opened at the position of the hole that needs to be electroplated on the PCB board. The single side is +0.1mm larger than the Via hole to expose the hole and the hole ring, and the conductive position of the clamping point of the electroplating clip of the board edge pattern is opened to expose a 10*10mm area. By opening the window for the spacing between PCS and PCS, copper can be plated on a larger electroplating area during electroplating, further dispersing the hole mouth current. Positioning holes are usually set at the four ends of the PCB board, which can be positioned when sticking dry film and conductive adhesive copper foil to ensure the accuracy of electroplating.

[0054] Optionally, the windowing distance for opening the interval between PCSs is 1.75 mm, and the windowing edge is 0.125 mm away from the unit.

[0055] For the spacing between PCS and PCS, the panel spacing between the finished PCS and PCS is usually 2mm. By setting the window distance to 1.75mm and the window edge to 0.125mm inside the unit, the panel spacing between PCS and PCS can be fully utilized for electroplating without affecting the circuit on the PCB board, so as to disperse the current on the PCB board surface to improve the copper plating uniformity of the copper thickness distribution at the hole.

[0056] Optionally, the step of cutting the conductive adhesive copper foil according to the dry film pattern includes:

[0057] A cutting program is prepared according to the positions of the holes to be plated in the dry film pattern, avoiding the graphic positions of the holes to be plated, the avoidance distance is set to be not less than 5.0 mm, and alignment holes are set to correspond to the positioning holes in the dry film pattern;

[0058] Conductive adhesive copper foil is laser cut according to the cutting program.

[0059] Specifically, according to the positions of all holes in the dry film graphics, a cutting program is made through AUTOCAD to avoid the image positions of all holes in the dry film graphics, and ensure that the distance between the conductive adhesive copper foil and each hole after cutting is not less than 5.0 mm, so as to avoid the conductive adhesive copper foil affecting the electroplating effect of the electroplated holes. And set alignment holes corresponding to the positioning holes on the conductive adhesive copper foil to facilitate the positioning of the conductive adhesive copper foil and the dry film. Subsequently, the conductive adhesive copper foil can be laser cut to obtain a conductive adhesive copper foil that can avoid all holes on the dry film. By cutting the conductive adhesive copper foil, the conductive adhesive copper foil can be adapted to the distribution of the electroplated holes. Compared with directly applying the conductive adhesive copper foil on the dry film, the hole mouth current of the electroplated hole can be dispersed with a larger area and more uniform distribution, further improving the uniformity of copper plating with red distribution at the hole mouth.

[0060] Embodiment 2

[0061] This embodiment provides a method for controlling the copper thickness of a PCB electroplating hole. Figure 1-5 As shown, including:

[0062] After the whole board is electroplated, a dry film pattern is made according to the distribution of the electroplating holes of the PCB board, and the conductive adhesive copper foil is cut according to the dry film pattern;

[0063] Making a dry film according to the dry film pattern, covering the dry film on a PCB board and exposing it;

[0064] The cut conductive adhesive copper foil alignment strip is attached to the dry film, and pattern electroplating holes are performed;

[0065] Remove the conductive adhesive copper foil and reduce copper;

[0066] Remove the dry film on the PCB board and enter the post-process.

[0067] Specifically, a dry film pattern is made according to the distribution of the electroplating holes of the PCB board, and the single side of the dry film window is increased by 0.1mm compared to the via hole, and the conductive adhesive copper foil is cut according to the hole distribution position in the dry film pattern, so that the conductive adhesive copper foil can avoid the position of the hole that needs to be electroplated. Subsequently, a dry film is made according to the dry film pattern, and the dry film is covered on the PCB board for exposure. At this time, the positions on the PCB board that need to be electroplated are all exposed, and then the cut conductive adhesive copper foil alignment strip is attached to the dry film. At this time, the conductive adhesive copper foil can avoid the hole position on the dry film and can cover the position where the hole is not opened on the dry film. By increasing the exposed copper area, the current on the PCB board surface is dispersed, thereby improving the copper plating uniformity of the hole copper thickness distribution, solving the problem of copper thickness protrusion at the hole during electroplating, and solving the problem of open circuit caused by the protruding hole connection wire and the problem that the resin plug hole cannot be completely plugged into the hole.

[0068] Optionally, the step of producing a dry film pattern according to the distribution of electroplating holes on a PCB board includes:

[0069] A dry film pattern is produced by CAM, in which windows are opened for holes that need to be electroplated, windows are opened at the edge of the board to expose the edge clamping area, windows are opened for the spacing between PCSs, and positioning holes are set.

[0070] Specifically, the dry film pattern is made through CAM, and the dry film is opened at the position of the hole that needs to be electroplated on the PCB board. The single side is +0.1mm larger than the Via hole to expose the hole and the hole ring, and the conductive position of the clamping point of the electroplating clip of the board edge pattern is opened to expose a 10*10mm area. By opening the window for the spacing between PCS and PCS, copper can be plated on a larger electroplating area during electroplating, further dispersing the hole mouth current. Positioning holes are usually set at the four ends of the PCB board, which can be positioned when sticking dry film and conductive adhesive copper foil to ensure the accuracy of electroplating.

[0071] Optionally, the windowing distance for opening the interval between PCSs is 1.75 mm, and the windowing edge is 0.125 mm away from the unit.

[0072] For the spacing between PCS and PCS, the panel spacing between the finished PCS and PCS is usually 2mm. By setting the window distance to 1.75mm and the window edge to 0.125mm inside the unit, the panel spacing between PCS and PCS can be fully utilized for electroplating without affecting the circuit on the PCB board, so as to disperse the current on the PCB board surface to improve the copper plating uniformity of the copper thickness distribution at the hole.

[0073] Optionally, the step of cutting the conductive adhesive copper foil according to the dry film pattern includes:

[0074] A cutting program is prepared according to the positions of the holes to be plated in the dry film pattern, avoiding the graphic positions of the holes to be plated, the avoidance distance is set to be not less than 5.0 mm, and alignment holes are set to correspond to the positioning holes in the dry film pattern;

[0075] Conductive adhesive copper foil is laser cut according to the cutting program.

[0076] Specifically, according to the positions of all holes in the dry film graphics, a cutting program is made through AUTOCAD to avoid the image positions of all holes in the dry film graphics, and ensure that the distance between the conductive adhesive copper foil and each hole after cutting is not less than 5.0 mm, so as to avoid the conductive adhesive copper foil affecting the electroplating effect of the electroplated holes. And set alignment holes corresponding to the positioning holes on the conductive adhesive copper foil to facilitate the positioning of the conductive adhesive copper foil and the dry film. Subsequently, the conductive adhesive copper foil can be laser cut to obtain a conductive adhesive copper foil that can avoid all holes on the dry film. By cutting the conductive adhesive copper foil, the conductive adhesive copper foil can be adapted to the distribution of the electroplated holes. Compared with directly applying the conductive adhesive copper foil on the dry film, the hole mouth current of the electroplated hole can be dispersed with a larger area and more uniform distribution, further improving the uniformity of copper plating with red distribution at the hole mouth.

[0077] Optionally, the step of attaching the cut conductive adhesive copper foil alignment strips to the dry film includes:

[0078] Make the alignment holes of the conductive adhesive copper foil face the positioning holes of the dry film, and apply the conductive adhesive copper foil on the dry film; the conductive adhesive copper foil contacts the clamping edge area accordingly.

[0079] Specifically, according to the positioning of the positioning holes and alignment holes, it can ensure that the conductive adhesive copper foil can be accurately applied to the dry film, and the distance between the conductive adhesive copper foil and the electroplating hole meets the avoidance distance. And the two ends of the conductive adhesive copper foil are attached to the clamping area of ​​the PCB, so that the conductive adhesive copper foil can draw electricity from the graphic electroplating clip, thereby achieving the dispersion of the hole mouth current of the electroplating hole.

[0080] Optionally, the full-board electroplated copper thickness of the graphic electroplated holes is 8-12um, and the plated hole copper thickness is 18-20um.

[0081] Specifically, electroplating the entire board at 8-12um can ensure that the copper thickness in the plated hole reaches 18-20um. And because the copper surface with the conductive adhesive copper foil and the gap between PCS and PCS is copper plated at the same time, the copper thickness bulge at the plated hole opening can be avoided.

[0082] Optionally, removing the conductive adhesive copper foil and reducing copper includes:

[0083] Remove the conductive adhesive copper foil on the dry film to expose the spacing between PCS and PCS, perform CNC gong processing on the spacing between PCS and PCS, and reduce the surface copper thickness between PCS and PCS by 12-18um to ensure that the copper surface thickness of the entire board is consistent after film removal.

[0084] Specifically, CNC is used to remove 12-18um of the copper layer on the spacing between PCS and PCS to ensure that the thickness of the copper surface of the entire layout is consistent, so as to ensure that the dry film can be pressed tightly on the PCB board during the graphic transfer, and to prevent the solution from penetrating between the dry film and the PCB board and causing an open circuit.

[0085] Embodiment 3

[0086] This embodiment also provides a PCB board, which is manufactured using the PCB electroplating hole copper thickness control method as described in the second embodiment.

[0087] The PCB board made by the above-mentioned PCB electroplating hole copper thickness control method increases the exposed copper area (exposing the copper surface of the panel spacing and the conductive adhesive copper foil strip), thereby increasing the plating area of ​​the pattern electroplating, so it can evenly disperse the current on the PCB board surface and will not be concentrated in the hole with only dry film openings, thereby improving the copper plating uniformity of the hole copper thickness distribution, and solving the problem of copper thickness protrusion at the hole during electroplating. At the same time, it also solves the problem of open circuit caused by the protruding hole connection wire and the problem that the resin plug hole cannot be 100% plugged into the hole.

[0088] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A method for controlling the copper thickness of a PCB electroplating hole, characterized in that: include: After the whole board is electroplated, a dry film pattern is made according to the distribution of the electroplating holes of the PCB board, and the conductive adhesive copper foil is cut according to the dry film pattern; Making a dry film according to the dry film pattern, covering the dry film on a PCB board and exposing it; The cut conductive adhesive copper foil alignment strip is attached to the dry film, and pattern electroplating holes is performed; Remove the conductive adhesive copper foil and reduce copper; Remove the dry film on the PCB board and enter the post-process.

2. A method for controlling copper thickness of a PCB electroplating hole according to claim 1, characterized in that: The method of making a dry film pattern according to the distribution of the electroplating holes of the PCB board includes: A dry film pattern is produced by CAM, in which windows are opened for holes that need to be electroplated, windows are opened at the edge of the board to expose the edge clamping area, windows are opened for the spacing between PCSs, and positioning holes are set.

3. A PCB electroplating hole copper thickness control method according to claim 2, characterized in that: The windowing distance for opening the interval between PCSs is 1.75 mm, and the windowing edge is 0.125 mm away from the unit.

4. A method for controlling copper thickness of a PCB electroplating hole according to claim 2, characterized in that: The step of cutting the conductive adhesive copper foil according to the dry film pattern comprises: A cutting program is prepared according to the positions of the holes to be plated in the dry film pattern, avoiding the graphic positions of the holes to be plated, the avoidance distance is set to be not less than 5.0 mm, and alignment holes are set to correspond to the positioning holes in the dry film pattern; Conductive adhesive copper foil is laser cut according to the cutting program.

5. A method for controlling copper thickness of a PCB electroplating hole according to claim 4, characterized in that: The step of attaching the cut conductive adhesive copper foil alignment strips to the dry film comprises: Make the alignment holes of the conductive adhesive copper foil face the positioning holes of the dry film, and apply the conductive adhesive copper foil on the dry film; the conductive adhesive copper foil contacts the clamping edge area accordingly.

6. A method for controlling copper thickness of a PCB electroplating hole according to claim 2, characterized in that: The copper thickness of the whole plate of the pattern-plated holes is 8-12um, and the copper thickness of the plated holes is 18-20um.

7. A method for controlling copper thickness of a PCB electroplating hole according to claim 6, characterized in that: The removing of the conductive adhesive copper foil and reducing copper comprises: Remove the conductive adhesive copper foil on the dry film to expose the spacing between PCS and PCS, perform CNC gong processing on the spacing between PCS and PCS, and reduce the surface copper thickness between PCS and PCS by 12-18um to ensure that the copper surface thickness of the entire board is consistent after film removal.

8. A PCB board, characterized in that: The method is manufactured by using a PCB electroplating hole copper thickness control method as described in any one of claims 1 to 7.

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