LED display module and manufacturing method thereof

Abstract

The present invention provides an LED display module and a manufacturing method thereof, wherein the LED display module comprises a substrate, a chip and a thermal interface material, wherein the chip and the thermal interface material are arranged in a receiving groove of the substrate. The thermal interface material can form a filling between the chip and the inner wall of the receiving groove, reduce the heat transfer contact thermal resistance between the chip and the substrate, and establish an effective heat conduction channel between the chip and the substrate, so that the heat generated by the chip is conducted to the substrate through the thermal interface material, and then the substrate and the outside air form a heat exchange to dissipate heat, thereby effectively improving the heat dissipation performance of the LED display module, and ensuring the structural stability, functional effectiveness and long service life of the LED display module.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to an LED display module and a manufacturing method thereof. Background Art

[0002] With the rapid development of electronic technology, electronic products are increasingly moving towards miniaturization, integration and high performance. Under this trend, Micro LED (Chip On Board) technology has been widely used due to its many advantages. Micro LED technology directly mounts the light-emitting chip on the printed circuit board (PCB). Compared with traditional packaging methods, it can significantly reduce the size of the product, improve the electrical connection performance between the light-emitting chip and the circuit board, and reduce production costs. This makes Micro LED products occupy an important position in many fields such as lighting, display screens, communication equipment, automotive electronics, etc., and become an indispensable part of the modern electronics industry.

[0003] In the Micro LED packaging structure, the light-emitting chip is in direct and close contact with the PCB. The large amount of heat generated by the light-emitting chip during operation needs to be transferred out through limited heat dissipation channels. Due to the high integration and miniaturization design of Micro LED products, the power density of the light-emitting chip continues to increase, and the heat generated per unit area also increases significantly.

[0004] Difficulties in heat dissipation have brought many negative impacts to Micro LED products. First, excessively high temperatures will seriously affect the performance and stability of the light-emitting chip. When the light-emitting chip works in a high-temperature environment, its electrical parameters will drift, leading to problems such as signal transmission distortion and circuit abnormality, thereby reducing the overall performance and reliability of the product. Secondly, poor heat dissipation may also cause thermal failure of the light-emitting chip, or even cause the light-emitting chip to burn, making the entire product scrapped, which not only increases production costs, but may also pose safety hazards to the equipment and users.

[0005] In order to alleviate the heat dissipation problem to a certain extent, additional heat dissipation measures are usually taken, such as adding heat sinks, fans and other heat dissipation devices. This will not only increase the volume and weight of the product, violating the original design intention of the miniaturization of Micro LED products, but also increase the cost and energy consumption of the product, reducing the market competitiveness of the product. Summary of the invention

[0006] The purpose of the present invention is to solve the technical problem in the prior art that LED display modules have difficulty in heat dissipation, reduce the overall performance and reliability of the product, and affect the normal and effective use of users.

[0007] In order to solve the above technical problems, the present invention provides an LED display module, which includes:

[0008] A substrate, a surface of which is provided with a plurality of receiving grooves, wherein the plurality of receiving grooves are arranged at intervals;

[0009] A chip is arranged in the receiving groove, and the chip can emit light; in the thickness direction of the LED display module, the surface of the chip is higher than or flush with the surface of the substrate provided with the receiving groove;

[0010] A thermal interface material is filled in the gap between the chip and the inner wall of the accommodating groove; the thermal interface material includes a liquid metal thermal conductor, a carbon fiber thermal conductive pad or a thermal conductive silicone sheet.

[0011] In some embodiments of the present application, the two opposite sides of the substrate are respectively a first surface and a second surface, the first surface is provided with the accommodating groove; the second surface of the substrate is provided with a plurality of ventilation holes, and the ventilation holes are connected to the interior of the accommodating groove.

[0012] In some embodiments of the present application, a plurality of the accommodating grooves and a plurality of the vents are provided, and the plurality of vents are arranged in one-to-one correspondence with the plurality of accommodating grooves and are connected.

[0013] In some embodiments of the present application, the LED display module also includes a soldering pad, and each of the accommodating grooves is provided with a plurality of soldering pads arranged at intervals, and the chip is welded to the soldering pads to establish an electrical connection; the vent is arranged between two adjacent soldering pads, and the diameter of the vent is less than or equal to the distance between the two adjacent soldering pads.

[0014] In some embodiments of the present application, a plurality of the receiving grooves are arranged in an array on the substrate, and the carbon fiber thermal conductive gaskets or the thermal conductive silicone sheets in the receiving grooves are arranged in an array on the substrate.

[0015] In some embodiments of the present application, the LED display module further includes a packaging layer, and the packaging layer is disposed on a surface of the substrate provided with the receiving groove and a surface of the wafer;

[0016] The materials used to prepare the packaging layer include resin material and fiber reinforcement material, the resin material is epoxy resin or polyurethane hot melt adhesive, and the fiber reinforcement material is glass fiber or carbon fiber.

[0017] In some embodiments of the present application, the mass ratio of the resin material to the fiber reinforcement material in the encapsulation layer is 1:(0.1-0.7).

[0018] In some embodiments of the present application, the packaging layer is a mesh structure, and a plurality of mesh holes are spaced apart on the packaging layer, and the mesh holes connect the surface of the chip with the external environment.

[0019] In some embodiments of the present application, in the thickness direction of the LED display module, the depth of the accommodating groove is less than or equal to the thickness of the chip.

[0020] The present invention also provides a method for manufacturing an LED display module, the method comprising the following steps:

[0021] Producing a receiving groove on a substrate;

[0022] A thermal interface material is arranged inside the receiving groove, wherein the thermal interface material includes a liquid metal thermal conductor, a carbon fiber thermal conductive pad or a thermal conductive silicone sheet;

[0023] Fixing the chip at a set position of the receiving groove so that the chip contacts the thermal interface material;

[0024] Mixing the resin material and the fiber reinforcement material to obtain a packaging material, covering the packaging material on the substrate and the wafer, and filling the packaging material into the gap between the substrate and the wafer;

[0025] Curing of substrates, wafers and packaging materials.

[0026] It can be seen from the above technical scheme that the beneficial effects of the present invention are as follows: in the LED display module and the manufacturing method thereof of the present invention, the LED display module includes a substrate, a chip and a thermal interface material, and the chip and the thermal interface material are arranged in the receiving groove of the substrate. The thermal interface material can form a filling between the chip and the inner wall of the receiving groove, reduce the heat transfer contact thermal resistance between the chip and the substrate, and establish an effective heat conduction channel between the chip and the substrate, so that the heat generated by the chip is conducted to the substrate through the thermal interface material, and then the substrate and the outside air form heat exchange to dissipate heat, thereby effectively improving the heat dissipation performance of the LED display module, ensuring the structural stability, functional effectiveness and long service life of the LED display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of an embodiment of an LED display module of the present invention.

[0028] Figure 2 It is a structural schematic diagram of another embodiment of the LED display module of the present invention.

[0029] Figure 3 It is a structural schematic diagram of another embodiment of the LED display module of the present invention.

[0030] Figure 4 It is a flow chart of the steps of the method for manufacturing the LED display module of the present invention.

[0031] The description of the accompanying drawings is as follows: 100, LED display module; 10, substrate; 11, receiving groove; 101, first surface; 102, second surface; 103, ventilation hole; 20, chip; 21, main body; 22, pin part; 30, thermal interface material; 40, pad; 50, packaging layer. DETAILED DESCRIPTION

[0032] Typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and the descriptions and illustrations therein are essentially used for illustration purposes rather than for limiting the present invention.

[0033] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indications of directions or positional relationships (such as up, down, left, right, front and back, etc.) are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions also change accordingly.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] See also Figure 1 An embodiment of the present application provides an LED display module 100 , which includes a substrate 10 , a chip 20 and a thermal interface material 30 .

[0036] Among them, the surface of the substrate 10 is concavely provided with a plurality of receiving grooves 11, and the plurality of receiving grooves 11 are arranged at intervals. The chip 20 is disposed in the receiving groove 11, and the chip 20 can emit light. In the thickness direction of the LED display module 100, the surface of the chip 20 is higher than or flush with the surface of the substrate 10 provided with the receiving groove 11. The thermal interface material 30 is filled in the gap between the chip 20 and the inner wall of the receiving groove 11, and the thermal interface material 30 includes a liquid metal thermal conductive agent, a carbon fiber thermal conductive gasket or a thermal conductive silicone sheet.

[0037] In some embodiments of the present application, the substrate 10 may be a flat substrate, a multi-layer circuit board substrate, or a multi-layer circuit board substrate with a driver IC. The substrate 10 may also be a PCB substrate or a glass substrate.

[0038] In some examples, the two opposite sides of the substrate 10 are respectively a first surface 101 and a second surface 102. The first surface 101 of the substrate 10 is concavely provided with a plurality of receiving grooves 11, and the plurality of receiving grooves 11 are arranged at intervals. The contour shape of the receiving groove 11 can be a regular shape such as a square, a semicircle, a trapezoid, or other irregular shapes.

[0039] The receiving grooves 11 on the substrate 10 can provide installation positions for the chip 20 and the thermal interface material 30, and a chip 20 can be arranged in each receiving groove 11. The arrangement of the plurality of receiving grooves 11 on the substrate 10 can correspond to the arrangement of the chips 20, such as being arranged in a matrix.

[0040] In some examples, in the thickness direction of the LED display module 100, the depth of the accommodating groove 11 is less than or equal to the thickness of the chip 20. This arrangement can not only stably fix the chip 20 in the accommodating groove 11, thereby fixing the chip 20 on the substrate 10, but also prevent the groove wall of the accommodating groove 11 from blocking the light emitting curve of the chip 20, thereby ensuring that the light emitting curve of the chip 20 can be normally emitted, thereby ensuring the display effect of the LED display module 100.

[0041] The receiving groove 11 forms an open notch corresponding to the first surface 101 of the substrate 10, through which the wafer 20 and the thermal interface material 30 can be placed in the receiving groove 11. Specifically, in the actual manufacturing process, the thermal interface material 30 is first filled into the receiving groove 11, and then the wafer 20 is fixed at the bottom of the receiving groove 11.

[0042] In some examples, each receiving groove 11 on the substrate 10 is provided with a pad 40. Multiple pads 40 can be provided inside each receiving groove 11, and multiple pads 40 are arranged at intervals at the groove bottom of the receiving groove 11, and the pads 40 are used to weld and connect the wafer 20 so that the wafer 20 is fixed inside the receiving groove 11.

[0043] The chip 20 is disposed in the receiving groove 11, and the chip 20 can emit light. The chip 20 can be either a common light-emitting diode chip or a micron-sized micro-light-emitting diode chip (i.e., Mini-LED). Compared with mainstream display technologies such as OLED and LCD, Mini-LED has higher brightness, resolution and color saturation, lower energy consumption, longer life and faster response speed.

[0044] In some embodiments of the present application, the chip 20 may include a main body 21 and a pin portion 22 connected to the main body 21. The main body 21 is a light-emitting unit of the chip 20, and the main body 21 is welded and fixed to the pad 40 inside the accommodating groove 11 through the pin portion 22, so that the chip 20 is fixed inside the accommodating groove 11 and forms an electrical connection relationship with the substrate 10.

[0045] In some examples, the chip 20 may include four pins 22. The main body 21 may include an R chip, a G chip, and a B chip, and the four pins 22 may be a cathode corresponding to the R chip, a cathode corresponding to the G chip, a cathode corresponding to the B chip, and a common anode.

[0046] Four pads 40 arranged at intervals may be correspondingly disposed in each receiving groove 11 on the substrate 10. The four pins 22 of each chip 20 are welded and fixed on the four pads 40 in the receiving groove 11 one by one, thereby achieving the fixation and electrical connection of the chip 20 on the substrate 10.

[0047] In some examples, the four pads 40 in each receiving groove 11 are arranged in a field shape at the bottom of the groove, which is adapted to the arrangement of the four pin portions 22 on the main body portion 21 of the wafer 20, thereby ensuring that each pin portion 22 can be fixed inside the receiving groove 11 through a pad 40. Solder paste can be provided on the pad 40, and the wafer 20 in each receiving groove 11 is soldered to the pad 40 through the solder paste.

[0048] In some embodiments of the present application, the surface of the chip 20 is higher than the first surface 101 of the substrate 10, that is, the surface of the main body 21 away from the pin part 22 is higher than the first surface 101 of the substrate 10. This arrangement allows most of the chip 20 to be accommodated in the accommodating groove 11 and in contact with the thermal interface material 30 to ensure heat conduction efficiency, and allows the main body 21 of the chip 20 to partially extend out of the first surface 101 of the substrate 10 to ensure the light extraction efficiency of the chip 20.

[0049] In other examples, such as Figure 2 As shown, the surface of the chip 20 can also be set to be flush with the first surface 101 of the substrate 10, that is, the surface of the main body 21 away from the pin part 22 is flush with the first surface 101 of the substrate 10. This arrangement can ensure that the chip 20 can emit light smoothly, and can also increase the thermal contact area between the chip 20 and the substrate 10 through the thermal interface material 30 in the accommodating groove 11, so that the heat generated by the chip 20 during operation is quickly transferred to the substrate 10, so as to be effectively dissipated through the substrate 10, thereby reducing the operating temperature of the chip 20, improving the overall stability of the LED display module 100 and extending the service life of the product.

[0050] Furthermore, combined with Figure 1 and Figure 2 As shown, the LED display module 100 of the present application further includes a thermal interface material 30 , which is disposed in the receiving groove 11 of the substrate 10 before the chip 20 .

[0051] In some embodiments of the present application, the thermal interface material 30 may include a liquid metal thermal conductor, a carbon fiber thermal conductive gasket, or a thermal conductive silicone sheet.

[0052] A thermal interface material 30 is provided in each receiving groove 11 of the substrate 10, and the chip 20 welded in the receiving groove 11 can contact the thermal interface material 30. The thermal interface material 30 can fill the gap between the chip 20 and the inner wall of the receiving groove 11, reduce the heat transfer contact thermal resistance between the chip 20 and the substrate 10, establish an effective heat conduction channel between the chip 20 and the substrate 10, and improve the heat dissipation performance of the LED display module 100.

[0053] In some examples, the thermal interface material 30 may be a liquid metal thermal conductor, which has a thermal conductivity of up to 73 W / (m·K), and can conduct heat more quickly and efficiently, thereby effectively ensuring that heat is dissipated when the chip 20 is working.

[0054] The liquid metal thermal conductor can be made of gallium metal alloy. Gallium metal alloy has a low melting point and is liquid at room temperature. It can better penetrate into the gap between the chip 20 and the inner wall of the accommodating groove 11 on the substrate 10 to achieve a better filling effect, thereby quickly conducting the heat generated by the chip 20 to the external environment, thereby effectively controlling the temperature of the LED display module 100.

[0055] In addition, the liquid metal thermal conductor has a higher boiling point and is more durable, and can effectively ensure the overall structural strength of the LED display module 100 and ensure the service life of the LED display module 100 .

[0056] In some examples, the thermal interface material 30 may be a carbon fiber thermal conductive pad, which is a thermal conductive pad made by adding carbon fiber filler into a polymer matrix.

[0057] Among them, carbon fiber as a filler has good dispersion performance in the polymer matrix, and will not cause problems such as high viscosity, low elasticity, and poor mechanical properties of the system. At the same time, when carbon fiber is filled into the polymer matrix, it can be array-oriented through flow field, electric field, magnetic field, etc., to achieve excellent thermal conductivity in a specific direction. In this example, a plurality of accommodating grooves 11 are arranged in an array on the substrate 10, and the carbon fiber gaskets in the accommodating grooves 11 can be arranged in an array on the substrate 10 to enhance the thermal conductivity of the carbon fiber gaskets between the chip 20 and the substrate 10.

[0058] The carbon fiber thermal conductive gasket can fill the space between the chip 20 and the inner wall of the accommodating groove 11 , reduce the heat transfer contact thermal resistance between the chip 20 and the substrate 10 , establish an effective heat conduction channel between the chip 20 and the substrate 10 , and improve the heat dissipation performance of the LED display module 100 .

[0059] In some examples, the thermal interface material 30 may also be a thermally conductive silicone sheet. The thermally conductive silicone sheet has good insulation, fire resistance, cushioning and self-adhesive properties, and its thermal conductivity can reach 0.8W / (m·K) to 5.0W / (m·K), which can effectively fill the gap between the chip 20 and the inner wall of the receiving groove 11 in the substrate 10 to form good heat conduction between the two. In this example, a plurality of receiving grooves 11 are arranged in an array on the substrate 10, and the thermally conductive silicone sheets in the receiving grooves 11 can be arranged in an array on the substrate 10 to enhance the thermal conductivity of the thermally conductive silicone sheet between the chip 20 and the substrate 10.

[0060] In addition, the thermal interface material 30 of the present application may also be thermally conductive paste, thermally conductive gel, thermally conductive silicone grease, thermally conductive graphite sheet, etc.

[0061] For the LED display module 100 of the present application, a chip 20 and a thermal interface material 30 are provided in the receiving groove 11 of the substrate 10. The thermal interface material 30 can form a filling between the chip 20 and the inner wall of the receiving groove 11, reduce the heat transfer contact thermal resistance between the chip 20 and the substrate 10, and establish an effective heat conduction channel between the chip 20 and the substrate 10, so that the heat generated by the chip 20 is conducted to the substrate 10 through the thermal interface material 30, and then the substrate 10 forms a heat exchange with the outside air to dissipate heat, thereby effectively improving the heat dissipation performance of the LED display module 100, and ensuring the structural stability, functional effectiveness and long service life of the LED display module 100.

[0062] Furthermore, in some embodiments of the present application, Figure 3 As shown, the second surface 102 of the substrate 10 may be provided with a vent 103, which is provided corresponding to the receiving groove 11 and communicates with the interior of the receiving groove 11. In some examples, the second surface 102 of the substrate 10 may be provided with a plurality of vents 103, the plurality of vents 103 are arranged one-to-one with the plurality of receiving grooves 11, and the corresponding vents 103 are communicated with the receiving grooves 11.

[0063] By providing a vent 103 on the substrate 10 that is connected to the interior of the receiving groove 11, when the chip 20 is working, the heat generated on the periphery of the main body 21 can be conducted to the substrate 10 by the thermal interface material 30 filled in the receiving groove 11 and discharged through the substrate 10, and the heat generated at the bottom of the main body 21 can be directly discharged through the vent 103, thereby improving the heat dissipation performance of the LED display module 100.

[0064] In some examples, the vent 103 may be disposed between two adjacent pads 40 to face the bottom of the main body 21 of the chip 20 , thereby effectively dissipating the heat generated at the bottom of the main body 21 .

[0065] The diameter of the vent 103 can be less than or equal to the distance between two adjacent pads 40. This arrangement can ensure the arrangement of the pads 40 inside the receiving groove 11, so that the wafer 20 can be firmly welded inside the receiving groove 11, and can also ensure that the vent 103 effectively discharges heat to avoid heat accumulation inside the wafer 20 and the receiving groove 11.

[0066] Furthermore, if Figure 1 and Figure 3 As shown, in some embodiments of the present application, the LED display module 100 further includes a packaging layer 50 , which is disposed on the surface of the substrate 10 having the accommodating groove 11 and the surface of the chip 20 , that is, the packaging layer 50 is disposed on the first surface 101 of the substrate 10 .

[0067] In some examples, the material used to prepare the encapsulation layer 50 includes a resin material and a fiber-reinforced material, wherein the resin material may be epoxy resin or polyurethane hot melt adhesive, and the fiber-reinforced material may be glass fiber or carbon fiber.

[0068] In some examples, the mass ratio of the resin material to the fiber reinforcement material in the encapsulation layer 50 can be 1:(0.1-0.7). This configuration not only enables the encapsulation layer 50 to have good mechanical properties and form good protection on the surface of the substrate 10, but also enables the material of the encapsulation layer 50 to have a certain ductility, and can effectively cover the surface of the substrate 10, forming a comprehensive protection for the substrate 10 and the wafer 20.

[0069] By arranging a packaging layer 50 made of resin material and fiber reinforced material on the surface of the substrate 10, not only can good physical protection be provided for the chip 20 so that it can withstand external mechanical shock and vibration, but also the overall mechanical strength of the LED display module 100 can be improved, making it more suitable for use in various complex working environments, thereby expanding the scope of application of the product.

[0070] Specifically, epoxy resin has high mechanical strength and bonding strength. After curing, epoxy resin can form a solid three-dimensional network structure, providing good mechanical support and protection for the chip 20. In addition, epoxy resin also has good electrical insulation performance, chemical corrosion resistance and good heat resistance, which can effectively meet the packaging requirements of the LED display module 100. In addition, the cost of epoxy resin is relatively low and it is easy to process and shape.

[0071] The polyurethane hot melt adhesive has high bonding strength and certain flexibility. It can melt and flow quickly after heating, and is encapsulated on the surface of the substrate 10 and in the gap between the substrate 10 and the wafer 20, and forms a strong bond after cooling, thereby forming effective protection on the surface of the substrate 10.

[0072] In some examples, the packaging layer 50 may be a mesh structure, with a plurality of mesh holes spaced apart on the packaging layer 50, the mesh holes connecting the surface of the wafer 20 with the external environment.

[0073] The mesh-structured packaging layer 50 can not only provide effective physical protection for the substrate 10 and the chip 20, but also connect the surface of the chip 20 and the external environment through the mesh holes, thereby ensuring that the heat generated by the chip 20 can be effectively dissipated to avoid heat accumulation on the chip 20, ensuring that the chip 20 can be used effectively and normally, and improving the overall structural stability and heat dissipation performance of the LED display module 100.

[0074] Further, see Figure 4 One embodiment of the present application further provides a method for manufacturing an LED display module 100. The manufacturing method of the present application can manufacture the LED display module 100 of the above structure, and the manufacturing method includes the following steps:

[0075] Step S10, forming a receiving groove 11 on the substrate 10;

[0076] Step S20, disposing a thermal interface material 30 inside the receiving groove 11, wherein the thermal interface material 30 includes a liquid metal thermal conductor, a carbon fiber thermal conductive pad, or a thermal conductive silicone sheet;

[0077] Step S30, fixing the wafer 20 at a set position of the receiving groove 11, so that the wafer 20 is in contact with the thermal interface material 30;

[0078] Step S40, mixing the resin material and the fiber reinforcement material to obtain a packaging material, covering the substrate 10 and the wafer 20 with the packaging material, and filling the gap between the substrate 10 and the wafer 20 with the packaging material;

[0079] Step S50 , curing the substrate 10 , the wafer 20 and the packaging material.

[0080] In step S10, the receiving groove 11 is formed on the surface of the substrate 10 by photolithography, etching and other processes, so that the size and precision of the receiving groove 11 meet the installation requirements of the wafer 20. For the substrate 10 with the vent 103, the vent 103 can be formed on the side of the substrate 10 away from the receiving groove 11 while the receiving groove 11 is formed, so that the vent 103 is connected to the inside of the receiving groove 11.

[0081] Before the wafer 20 is assembled to the substrate 10 , the surface of the wafer 20 may be cleaned to remove impurities and oxides on the surface of the wafer 20 , so as to improve the bonding performance between the wafer 20 and the thermal interface material 30 .

[0082] In step S20, a liquid metal thermal conductor can be used as the thermal interface material 30, and a layer of the liquid metal thermal conductor can be evenly applied to the inner wall of the receiving groove 11 of the substrate 10. When a carbon fiber thermal conductive pad or a thermal conductive silicone sheet is used as the thermal interface material 30, the carbon fiber thermal conductive pad or the thermal conductive silicone sheet can be fixed inside the receiving groove 11.

[0083] When the thermal interface material 30 is arranged in the receiving groove 11 , the position of the soldering pad 40 can be avoided so that the soldering pad 40 is exposed in the receiving groove 11 , so as to facilitate the subsequent soldering and fixing of the wafer 20 .

[0084] In step S30 , the wafer 20 is fixed on the pad 40 inside the receiving groove 11 by welding, and it is ensured that the wafer 20 is in full contact with the thermal interface material 30 , and there are no bubbles or gaps between the two.

[0085] Specifically, the wafer 20 may be cured using appropriate pressure and temperature to ensure that the wafer 20 is tightly bonded to the thermal interface material 30 , thereby forming a good heat conduction channel.

[0086] When performing step S40 , packaging materials may be prepared first, and the resin material and the fiber-reinforced material may be uniformly mixed in a set ratio, and a proper amount of curing agent and catalyst may be added to obtain packaging materials for preparing the packaging layer 50 .

[0087] Then, the packaging material is slowly poured into the mold with the wafer 20 and the substrate 10 placed thereon, ensuring that the packaging material completely covers the wafer 20 and the substrate 10 and fills the gap between the wafer 20 and the substrate 10 and the surrounding space.

[0088] In step S50 , the entire mold is placed in a heating device for curing. The curing temperature and time are controlled according to the characteristics of the packaging material and product requirements, so that the packaging material is fully cured to form a packaging layer 50 , thereby obtaining an LED display module 100 .

[0089] After the LED display module 100 of the present application is manufactured, the temperature of the LED display module 100 of the present application in the working state can be measured. According to experimental tests, under the same working conditions, the temperature of the LED display module 100 of the present application is reduced by 5°C to 10°C compared with traditional products.

[0090] In addition, the LED display module 100 of the present application can also be subjected to mechanical shock test and vibration test. Specifically, in the vibration test, the sample can be fixed and lit in a normal connection state. The vibration frequency range can be set to 5Hz to 55Hz, and the amplitude is 0.19mm. After the test, check whether the sample has poor contact or falls off.

[0091] After testing, the LED display module 100 of the present application did not have faults such as chip 20 falling off and solder joint cracking, while traditional products had varying degrees of damage under the same test conditions.

[0092] For the LED display module and its manufacturing method of the present application, the LED display module includes a substrate, a chip and a thermal interface material, and the chip and the thermal interface material are arranged in a receiving groove of the substrate. The thermal interface material can form a filling between the chip and the inner wall of the receiving groove, reduce the heat transfer contact thermal resistance between the chip and the substrate, and establish an effective heat conduction channel between the chip and the substrate, so that the heat generated by the chip is conducted to the substrate through the thermal interface material, and then the substrate and the outside air form heat exchange to dissipate heat, thereby effectively improving the heat dissipation performance of the LED display module, ensuring the structural stability, functional effectiveness and long service life of the LED display module.

[0093] Although the present invention has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in a variety of forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. An LED display module, characterized in that: include: A substrate, a surface of which is provided with a plurality of receiving grooves, wherein the plurality of receiving grooves are arranged at intervals; A chip is arranged in the receiving groove, and the chip can emit light; in the thickness direction of the LED display module, the surface of the chip is higher than or flush with the surface of the substrate provided with the receiving groove; A thermal interface material is filled in the gap between the chip and the inner wall of the accommodating groove; the thermal interface material includes a liquid metal thermal conductor, a carbon fiber thermal conductive pad or a thermal conductive silicone sheet.

2. The LED display module according to claim 1, characterized in that: The two opposite surfaces of the substrate are respectively a first surface and a second surface, the first surface is provided with the containing groove; the second surface of the substrate is provided with a plurality of vents, and the vents are communicated with the interior of the containing groove.

3. The LED display module according to claim 2, characterized in that: The accommodating grooves and the vents are both provided in plurality, and the vents are arranged in one-to-one correspondence with the accommodating grooves and are in communication with each other.

4. The LED display module according to claim 2, characterized in that: The LED display module also includes a soldering pad, and each of the accommodating grooves is provided with a plurality of soldering pads arranged at intervals, and the chip is welded to the soldering pads to establish an electrical connection; the vent is arranged between two adjacent soldering pads, and the diameter of the vent is less than or equal to the distance between the two adjacent soldering pads.

5. The LED display module according to claim 1, characterized in that: The plurality of receiving grooves are arranged in an array on the substrate, and the carbon fiber thermal conductive pads or the thermal conductive silicone sheets in the receiving grooves are arranged in an array on the substrate.

6. The LED display module according to claim 1, characterized in that: The LED display module further comprises a packaging layer, and the packaging layer is arranged on the surface of the substrate provided with the containing groove and the surface of the wafer; The materials used to prepare the packaging layer include resin material and fiber reinforcement material, the resin material is epoxy resin or polyurethane hot melt adhesive, and the fiber reinforcement material is glass fiber or carbon fiber.

7. The LED display module according to claim 6, characterized in that: The mass ratio of the resin material to the fiber reinforcement material in the encapsulation layer is 1:(0.1-0.7).

8. The LED display module according to claim 6, characterized in that: The packaging layer is a mesh structure, and a plurality of mesh holes are arranged at intervals on the packaging layer, and the mesh holes connect the surface of the wafer with the external environment.

9. The LED display module according to claim 1, characterized in that: In the thickness direction of the LED display module, the depth of the accommodating groove is less than or equal to the thickness of the chip.

10. A method for manufacturing an LED display module, characterized in that: The production method comprises the following steps: Producing a receiving groove on a substrate; A thermal interface material is arranged inside the receiving groove, wherein the thermal interface material includes a liquid metal thermal conductor, a carbon fiber thermal conductive pad or a thermal conductive silicone sheet; Fixing the chip at a set position of the receiving groove so that the chip contacts the thermal interface material; Mixing the resin material and the fiber reinforcement material to obtain a packaging material, covering the packaging material on the substrate and the wafer, and filling the packaging material into the gap between the substrate and the wafer; Curing of substrates, wafers and packaging materials.

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