Film forming apparatus, driving method of film forming apparatus, and film forming method

Abstract

A film forming apparatus is characterized by being provided with: an electrostatic chuck (31) that sucks a surface on the opposite side of a surface on the film forming side of a substrate (S); a first support member (41) that supports the peripheral edge of the substrate (S) before and / or after the suction of the substrate (S) with respect to the electrostatic chuck (31); a second support member (71) that includes a portion extending along the surface of the substrate (S) on the film formation side and that supports the surface of the substrate (S) on the film formation side; and a rotating / lifting mechanism (70) that rotates the extended portion of the second support member (71) about a shaft member (72) that extends in a direction perpendicular to the surface of the substrate (S) on the film formation side.

Description

Technical Field

[0001] The present invention relates to a film forming device, a driving method of the film forming device and a film forming method. Background Art

[0002] Conventionally, there is known a technique in which a film forming apparatus is provided with a suction member for suctioning a surface of a substrate on the opposite side to the surface on the film forming side.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-99910 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In recent years, the size of substrates has been increasing. If the substrate is greatly bent before being adsorbed onto the adsorption member, it may be difficult to appropriately adsorb the substrate onto the adsorption member.

[0008] Solutions to Solve Problems

[0009] The film forming apparatus of the present invention is characterized by comprising:

[0010] an adsorption member that adsorbs a surface of the substrate on an opposite side to the surface on the film-forming side;

[0011] a first supporting member that supports a peripheral edge of the substrate at least either before or after the substrate is adsorbed by the adsorption member;

[0012] a second supporting member including a portion extending along the surface of the substrate on the film formation side and supporting the surface of the substrate on the film formation side; and

[0013] A driving unit that rotates the extended portion of the second supporting member around an axis that is perpendicular to a surface of the substrate on the film formation side.

[0014] Effects of the Invention

[0015] As described above, according to the present invention, the substrate can be adsorbed to the adsorption member in a stable state. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of a film forming device.

[0017] Figure 2 This is a diagram for explaining the operation of the main parts of the film forming device.

[0018] Figure 3 This is a diagram for explaining the operation of the main parts of the film forming device.

[0019] Figure 4 This is a diagram for explaining the operation of the main parts of the film forming device.

[0020] Figure 5 This is a diagram for explaining the operation of the main parts of the film forming device.

[0021] Figure 6 This is a diagram for explaining the operation of the main parts of the film forming device.

[0022] Figure 7 This is a diagram for explaining the operation of the main parts of the film forming device.

[0023] Figure 8 This is a diagram for explaining the operation of the main parts of the film forming device.

[0024] Fig. 9 It is an explanatory diagram of an organic EL display device. DETAILED DESCRIPTION

[0025] The following is a detailed description of the embodiments of the present invention based on the accompanying drawings. However, the dimensions, materials, shapes, relative configurations, etc. of the components described in the embodiments are not intended to limit the scope of the present invention to these unless otherwise specified.

[0026] (Example)

[0027] Reference Figures 1 to 8 , a film forming apparatus according to an embodiment of the present invention is described. Figures 1 to 4 and Figures 6 to 8 In order to make the operation of each component easier to understand, the components that operate as a whole are marked with the same type of hatching. In these figures, each component is shown in a cross-sectional manner, but each component may be arranged at different positions near the front side and the back side of the paper. Therefore, although hatching is marked, it does not necessarily represent a cross section.

[0028] <Structure of film forming equipment>

[0029] Especially referring to Figure 1 , the overall structure of the film forming device 1 is described. Figure 1 1 is a schematic diagram of the entire film forming apparatus. The film forming apparatus 1 includes a chamber 10 and a film forming source 20 disposed in the chamber 10. The chamber 10 is configured to be able to maintain a vacuum environment or an inert gas environment. As the film forming source 20, in addition to an evaporation source for evaporating or sublimating a film forming material, a sputtering cathode for performing film formation by sputtering can also be used.

[0030] Various mechanisms for aligning the substrate S to be film-formed with the mask M disposed on the film-forming side of the substrate S in order to form a thin film of a desired pattern with respect to the substrate S are provided at the upper portion of the chamber 10. In addition, in the present embodiment, a structure in which the various mechanisms are provided in the chamber 10 in which the film-forming source 20 is provided is shown, but a structure in which a chamber for aligning the substrate S with the mask M and a chamber in which the film-forming source is provided are provided separately may be adopted. In this case, after the substrate S and the mask M are aligned in the chamber for alignment, the substrate S and the mask M are transported to the chamber equipped with the film-forming source to perform film formation.

[0031] Hereinafter, various mechanisms for aligning the substrate S and the mask M will be described. A base member 11 and a support plate 12 for supporting the various mechanisms are fixed to a ceiling portion of the chamber 10 .

[0032] A first lifting mechanism 30 is installed on the base member 11 to lift and lower the electrostatic suction cup 31 as an adsorption member in the vertical direction. The first lifting mechanism 30 includes a holding member 32 for holding the electrostatic suction cup 31, a shaft member 33 for lifting and lowering the holding member 32, and a driving source 34 for lifting and lowering the shaft member 33. The holding member 32 includes a lifting plate 32a perpendicular to the vertical direction. As for the specific structure of the lifting mechanism, various known technologies such as a ball screw mechanism can be adopted, so its detailed description is omitted. The electrostatic suction cup 31 has an electrode 31a inside, and is configured to generate an electrostatic adsorption force by applying a voltage to the electrode 31a. In addition, as a method of generating the electrostatic adsorption force, various known methods such as a Coulomb force type, a Johnson-Rabbeck force type, and a gradient force type can be adopted. The electrostatic suction cup 31 is used to adsorb the surface on the opposite side of the film-forming side of the substrate S, and the substrate S is held.

[0033] The lifting plate 32a of the holding member 32 in the first lifting mechanism 30 is provided with a second lifting mechanism (lifting part) 40 for lifting the substrate S in the vertical direction. The second lifting mechanism 40 includes a first supporting member 41 for supporting the periphery of the surface on the film-forming side of the substrate S, a shaft member 42 for lifting the first supporting member 41, and a driving source 43 for lifting the shaft member 42. As for the specific structure of the lifting mechanism, various well-known technologies such as a ball screw mechanism can be adopted, so the detailed description thereof is omitted. When the lifting plate 32a is lifted and lowered by the first lifting mechanism 30 without operating the second lifting mechanism 40, the electrostatic suction cup 31 and the substrate S are lifted and lowered as a whole. On the other hand, by operating the second lifting mechanism 40, the substrate S can be lifted and lowered relative to the electrostatic suction cup 31.

[0034] In addition, the film forming apparatus 1 includes a mask adjustment mechanism 50 as a mask driving unit for adjusting the position of the mask M. The mask adjustment mechanism 50 includes a support portion 51 fixed to the ceiling portion of the chamber 10, a mask stage receiving portion 52 provided at the lower end of the support portion 51, and a magnetic generation coil box 53 fixed to the support portion 51. A magnet 55 is provided on the periphery of a mask stage 54 as a mask holding portion for holding the mask M. The mask stage 54 is arranged so that the magnet 55 is arranged in the gap between the mask stage receiving portion 52 and the magnetic generation coil box 53. And, by controlling the magnetic field generated by the magnetic generation coil box 53, the position of the mask stage 54 in the horizontal direction is adjusted in a state of being floated by magnetic levitation. That is, if the directions perpendicular to the vertical direction and orthogonal to each other are set as X and Y directions, and the direction rotating around the vertical direction is set as θ direction, then by controlling the magnetic field generated by the magnetic generation coil box 53, the position of the mask stage 54 can be adjusted in the X, Y, and θ directions.

[0035] The mask adjustment mechanism 50 also has a third lifting mechanism for lifting the mask M. The third lifting mechanism is mounted on the support plate 12 fixed to the top plate of the chamber 10, and includes a support member 56 for supporting the mask M, a shaft member 57 for lifting the support member 56, and a drive source 58 for lifting the shaft member 57. As for the specific structure of the lifting mechanism, various well-known technologies such as a ball screw mechanism can be adopted, so the detailed description thereof is omitted. The mask lifting mechanism is used to receive the mask M transported into the chamber 10 and place the mask M on the mask stage 54. Figure 1 , a state where the mask M is placed on the mask stage 54 is shown.

[0036] In addition, a fourth lifting mechanism 60 is mounted on the base member 11 to lift and lower a magnetic attraction member 61 in a vertical direction. After the substrate S and the mask M are aligned, the magnetic attraction member 61 uses magnetic force to attract the mask M via the substrate S and the electrostatic chuck 31. The fourth lifting mechanism 60 includes a holding member 62 that holds the magnetic attraction member 61 and a driving source 63 that lifts and lowers the holding member 62. As for the specific structure of the lifting mechanism, various known technologies such as a ball screw mechanism can be adopted, and therefore, a detailed description thereof is omitted.

[0037] In addition, in this embodiment, a rotary lifting mechanism 70 is provided as a driving unit that can rotate the second supporting member 71 located at a position inside the periphery of the film-forming side surface of the supporting substrate S and lift the second supporting member 71. The rotary lifting mechanism 70 is mounted on the supporting plate 12 fixed to the top plate of the chamber 10. In addition, the rotary lifting mechanism 70 includes a second supporting member 71, a shaft member 72 for rotating and lifting the second supporting member 71, and a driving source 73 that can rotate and lift the shaft member 72. In addition, various known technologies such as a combination of a known rotating mechanism composed of a motor and a lifting mechanism composed of a ball screw mechanism can be adopted for the specific structure of the rotary lifting mechanism, so the detailed description thereof is omitted. In addition, the second supporting member 71 of this embodiment includes a portion extending from the front end of the shaft member 72 along the film-forming side surface of the substrate S (a portion extending in the horizontal direction), and includes a portion extending from the front end thereof in the vertical direction. The front end of the portion extending in the vertical direction can support the film-forming side surface of the substrate S by contacting the substrate S. In addition, the shaft member 72 is configured to extend in a direction perpendicular to the surface of the film-forming side of the substrate S. The "portion extending along the surface of the film-forming side of the substrate S" in the second support member 71 is rotated around the shaft member 72 by the rotary lifting mechanism 70. The contact portion with the substrate S is preferably set to a non-film-forming portion such as a boundary portion between film-forming areas. In addition, the shape of the second support member 71 is not necessarily limited to such a shape. In addition, in the present embodiment, a structure in which the second support member 71 is provided at two locations is shown, but the number of the second support members 71 is not limited.

[0038] In addition, the film forming apparatus 1 further includes a control device 90 for controlling the operation of the film forming source 20 and the various mechanisms described above. The control device for controlling the various devices is a known technology, so a detailed description is omitted, but the control device 90 includes a processor such as a CPU, a storage device such as a semiconductor memory and a hard disk, and an input / output interface.

[0039] <Operation of the film forming apparatus until the substrate and mask are aligned>

[0040] Especially referring to Figures 2 to 8 , the operation of the film forming apparatus 1 until the substrate and the mask are aligned (a method of driving the film forming apparatus) will be described. Figures 2 to 4 and Figures 6 to 8 Yes means Figure 1 FIG. 2 is a diagram of a portion of the chamber 10 where various mechanisms are provided near the top plate portion. Figure 5 The diagram shows the positional relationship among the substrate S, the first supporting member 41, and the rotary lifting mechanism 70 as viewed from above in the order of operation.

[0041] First, the mask M is transported into the chamber 10, and the mask M is placed on the mask stage 54 by the third lifting mechanism. Then, the substrate S is transported into the chamber 10 by the hand 80 of the transport robot, and the substrate S is placed on the first supporting member 41 (see FIG. 4 ) in the second lifting mechanism 40. Figure 5 (a)). Thus, the first supporting member 41 supports the periphery of the surface of the substrate S on the film forming side (see Figure 2 and Figure 5 (b)). The above is the supporting step. At this time, the substrate S is bent in a manner such that its center is bent downward in the vertical direction due to its own weight. In addition, during this series of actions, the second supporting member 71 is moved to a position that does not hinder the lifting and lowering action of the substrate S by the rotary lifting mechanism 70 (refer to Figure 2 and Figure 5 (a) (b)).

[0042] After the supporting process, an approaching process is performed, in which the substrate S supported by the first supporting member 41 is brought close to the electrostatic suction cup 31 while the second supporting member 71 is moved to a position that does not hinder the movement of the substrate S supported by the first supporting member 41. In the present embodiment, the substrate S supported by the first supporting member 41 is raised by the second lifting mechanism 40, and the periphery of the substrate S is brought into contact with the electrostatic suction cup 31. After the approaching process, a rotating process is performed, in which the second supporting member 71 is moved to a position supporting the substrate S by rotating the "portion extending along the surface on the film forming side of the substrate S" in the second supporting member 71 around the shaft member 72 in a direction perpendicular to the surface on the film forming side of the substrate S. That is, the second supporting member 71 is rotated by the rotating lifting mechanism 70, and the portion supporting the substrate S is moved to directly below the center (a position inside the periphery) of the substrate S (refer to Figure 3 ). Then, the second supporting member 71 is raised by the rotary lifting mechanism 70 to be in contact with the center of the substrate S (see Figure 4 and Figure 5 (c)). That is, the portion of the second supporting member 71 that supports the substrate S supports the substrate S at a position on the surface of the film-forming side of the substrate S that is closer to the inside than the periphery. In this way, the swiveling step also includes a step of raising and lowering the second supporting member 71. Through the above steps, the center of the substrate S is lifted by the second supporting member 71, thereby achieving a state in which the bending of the substrate S is suppressed. In addition, "a position on the surface of the film-forming side of the substrate S that is closer to the inside than the periphery" is not limited to the center of gravity (center) of the substrate S, but refers to the position of the center (the area excluding the periphery) of the substrate.

[0043] Then, after the swirling step, an adsorption step of adsorbing the substrate S by the electrostatic chuck 31 is performed. That is, a voltage is applied to the electrode 31a provided on the electrostatic chuck 31 in a state where the deflection of the substrate S is suppressed, so that the substrate S is adsorbed to the electrostatic chuck 31 under the action of the electrostatic adsorption force. In this way, the first supporting member 41 supports the periphery of the substrate S at least one of before and after the adsorption of the substrate S relative to the electrostatic chuck 31 as the adsorption member. In addition, the second supporting member 71 supports the film-forming side of the substrate S at a position closer to the inside than the periphery before the adsorption of the substrate S relative to the electrostatic chuck 31. Then, after the substrate S is adsorbed to the electrostatic chuck 31, an alignment operation for aligning the substrate S with the mask M is performed.

[0044] Various well-known methods can be used for the alignment operation of aligning the substrate S with the mask M, and a representative example is described here. Generally speaking, in order to perform alignment, alignment marks (not shown) are respectively provided on the substrate S and the mask M. Then, the marks of the two are photographed by a camera C fixed to the chamber 10, and the positional offset of the two is determined. Then, the horizontal position of at least one of the substrate S and the mask M is adjusted to eliminate their positional offset (usually so that the positional offset falls within a threshold). In addition, in order to achieve high-precision alignment in a short time, coarse alignment for rough alignment and fine alignment for high-precision alignment are generally performed. In coarse alignment, a camera C with a low resolution but a wide field of view is used, and in fine alignment, a camera C with a narrow field of view but a high resolution is used. In addition, the above-mentioned alignment marks also usually use different marks for coarse alignment and fine alignment.

[0045] Specifically, after the substrate S is adsorbed on the electrostatic chuck 31, the electrostatic chuck 31 and the substrate S are lowered together by the first lifting mechanism 30, so that the substrate S is in contact with the mask M (see Figure 6 ). In this state, the control device 90 determines the positional offset between the substrate S and the mask M based on the photographing information obtained from the camera C. Then, the electrostatic chuck 31 and the substrate S are raised together by the first lifting mechanism 30, and the substrate S and the mask M are slightly separated (refer to Figure 7 In this state, rough alignment is performed. That is, based on the positional deviation, in the present embodiment, the mask stage 54 is adjusted in the horizontal direction (X, Y, θ directions) by the mask adjustment mechanism 50, thereby performing rough alignment between the substrate S and the mask M.

[0046] After the rough alignment is performed, the electrostatic chuck 31 and the substrate S are lowered integrally again by the first lifting mechanism 30, so that the substrate S and the mask M are in contact. Thereafter, fine alignment is performed in the same order as the rough alignment. Generally speaking, fine alignment is repeated until the positional offset between the substrate S and the mask M falls within the range of a threshold. In addition, here, a case is described in which the substrate S and the mask M are separated after determining their positional offset while being in contact with each other, and then the rough alignment and fine alignment are performed. However, it is also possible to lower the electrostatic chuck 31 and the substrate S integrally by the first lifting mechanism 30 so that the substrate S and the mask M are slightly separated, determine their positional offset, and directly perform the rough alignment and fine alignment.

[0047] After the fine alignment is completed, the magnetic adsorption member 61 is lowered by the fourth lifting mechanism 60. As a result, the mask M is adsorbed by the magnetic adsorption member 61 via the substrate S and the electrostatic chuck 31. As a result, the substrate S and the mask M are fixed in a state of contact (see Figure 8 ). Then, a film of a desired pattern (opening) formed on the mask M is formed on the surface (film forming surface) of the substrate S by the film forming source 20. In this way, a film forming process is performed after the adsorption process. In addition, after the adsorption process and before the film forming process is started, a retreat process is performed, in which the second support member 71 is moved to the retreat position by rotating the "part extending along the film forming side of the substrate S" in the second support member 71 around the shaft member 72.

[0048] <Method for manufacturing electronic device>

[0049] Next, an example of a method for manufacturing an electronic device using the film-forming apparatus of this embodiment will be described. Next, the structure of an organic EL display device will be described as an example of an electronic device, and a method for manufacturing the organic EL display device will be described.

[0050] First, the organic EL display device to be manufactured will be described. Fig. 9 (a) shows an overall view of the organic EL display device 150 , Fig. 9 (b) shows the cross-sectional structure of one pixel.

[0051] like Fig. 9As shown in (a), in the display area 151 of the organic EL display device 150, a plurality of pixels 152 having a plurality of light-emitting elements are arranged in a matrix. The details will be described later, but the light-emitting elements each have a structure having an organic layer clamped by a pair of electrodes. In addition, the pixel mentioned here refers to the smallest unit that can display the desired color in the display area 151. In the case of the organic EL display device of this embodiment, the pixel 152 is formed by a combination of a first light-emitting element 152R, a second light-emitting element 152G, and a third light-emitting element 152B that display different light. The pixel 152 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but it can also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and there is no particular limitation as long as it is at least one color.

[0052] Fig. 9 (b) is Fig. 9 Schematic diagram of partial cross-section along line AB of (a). The pixel 152 is composed of a plurality of light-emitting elements, each of which has a first electrode (anode) 154, a hole transport layer 155, any one of the light-emitting layers 156R, 156G, and 156B, an electron transport layer 157, and a second electrode (cathode) 158 on a substrate 153. Among them, the hole transport layer 155, the light-emitting layers 156R, 156G, 156B, and the electron transport layer 157 are equivalent to organic layers. In addition, in the present embodiment, the light-emitting layer 156R is an organic EL layer that emits red, the light-emitting layer 156G is an organic EL layer that emits green, and the light-emitting layer 156B is an organic EL layer that emits blue. The light-emitting layers 156R, 156G, and 156B are respectively formed into patterns corresponding to light-emitting elements (sometimes also described as organic EL elements) that emit red, green, and blue. In addition, the first electrode 154 is formed separately for each light-emitting element. The hole transport layer 155, the electron transport layer 157, and the second electrode 158 may be formed in common with the plurality of light-emitting elements 152R, 152G, and 152B, or may be formed for each light-emitting element. In addition, in order to prevent the first electrode 154 and the second electrode 158 from being short-circuited due to foreign matter, an insulating layer 159 is provided between the first electrode 154. Furthermore, since the organic EL layer is degraded by moisture or oxygen, a protective layer 140 is provided to protect the organic EL element from moisture or oxygen.

[0053] exist Fig. 9In (b), the hole transport layer 155 and the electron transport layer 157 are represented as one layer, but depending on the structure of the organic EL display element, they can also be formed by multiple layers including a hole blocking layer and an electron blocking layer. In addition, a hole injection layer having an energy band structure can be formed between the first electrode 154 and the hole transport layer 155 so that holes can be smoothly injected from the first electrode 154 to the hole transport layer 155. Similarly, an electron injection layer can also be formed between the second electrode 158 and the electron transport layer 157.

[0054] Next, an example of a method for manufacturing an organic EL display device will be described in detail.

[0055] First, a substrate 153 on which a circuit (not shown) for driving the organic EL display device and the first electrode 154 are formed is prepared.

[0056] An acrylic resin is formed by spin coating on the substrate 153 having the first electrode 154 formed thereon, and the acrylic resin is patterned by photolithography to form an opening in the portion having the first electrode 154 formed thereon, thereby forming the insulating layer 159. The opening corresponds to a light emitting region where the light emitting element actually emits light.

[0057] The substrate 153 with the patterned insulating layer 159 is fed into the first organic material film forming device, and the substrate is held by the substrate support table and the electrostatic chuck, so that the hole transport layer 155 is formed as a common layer on the first electrode 154 in the display area. The hole transport layer 155 is formed by vacuum evaporation. In fact, the hole transport layer 155 is formed to a larger size than the display area 151, so a high-precision mask is not required.

[0058] Next, the substrate 153 formed up to the hole transport layer 155 is sent to the second organic material film forming device and held by the substrate support table and the electrostatic chuck. The substrate and the mask are aligned, the substrate is placed on the mask, and the red light-emitting layer 156R is formed on the portion of the substrate 153 where the red light-emitting element is arranged.

[0059] Similar to the film formation of the light-emitting layer 156R, the green light-emitting layer 156G is formed by the third organic material film-forming device, and then the blue light-emitting layer 156B is formed by the fourth organic material film-forming device. After the film formation of the light-emitting layers 156R, 156G, and 156B is completed, the electron transport layer 157 is formed in the entire display area 151 by the fifth film-forming device. The electron transport layer 157 is formed as a common layer on the three-color light-emitting layers 156R, 156G, and 156B.

[0060] The substrate on which the electron transport layer 157 has been formed is moved in a metallic vapor deposition material film forming apparatus to form a film of the second electrode 158 .

[0061] Thereafter, the process moves to a plasma CVD device to form a protective layer 140 , thereby completing the organic EL display device 150 .

[0062] From the time when the substrate 153 with the patterned insulating layer 159 is sent into the film forming device until the film forming of the protective layer 140 is completed, if the substrate is exposed to an environment containing moisture or oxygen, the light-emitting layer composed of the organic EL material may be degraded by moisture or oxygen. Therefore, in this embodiment, the substrate is sent in and out between the film forming devices in a vacuum environment or an inert gas environment.

[0063] <Advantages of the film forming apparatus of this embodiment>

[0064] According to the film forming apparatus 1 of the present embodiment, by providing the second supporting member 71, it is possible to suppress the bending of the substrate S before the substrate S is adsorbed onto the electrostatic chuck 31. Thus, the substrate S can be adsorbed onto the electrostatic chuck 31 in a stable state. That is, it is possible to suppress the substrate S from being adsorbed onto the electrostatic chuck 31 in a state of undulation or partial deformation.

[0065] Description of Reference Numerals

[0066] 1: Film forming device 10: Chamber 11: Base member 12: Support plate 20: Film forming source 30: First lifting mechanism 31: Electrostatic suction cup 31a: Electrode 32: Holding member 32a: Lifting plate 33: Shaft member 34: Driving source 40: Second lifting mechanism 41: First supporting member 42: Shaft member 43: Driving source 50: Mask adjustment mechanism 51: Support column 52: Mask stage receiving portion 53: Coil box for magnetic generation 54: Mask stage 55: Magnet 56: Support member 57: Shaft member 58: Driving source 60: Fourth lifting mechanism 61: Magnetic adsorption member 62: Holding member 63: Driving source 70: Rotating lifting mechanism 71: Second supporting member 72: Shaft member 73: Driving source 80: Hand 90: Control device C: Camera M: Mask S: Substrate.

Claims

1. A film forming device, characterized in that: The film forming device comprises: an adsorption member that adsorbs a surface of the substrate on an opposite side to the surface on the film-forming side; a first supporting member that supports a peripheral edge of the substrate at least either before or after the substrate is adsorbed by the adsorption member; a second supporting member including a portion extending along the surface of the substrate on the film forming side and supporting the surface of the substrate on the film forming side; as well as A driving unit that rotates the extended portion of the second supporting member around an axis that is perpendicular to a surface of the substrate on the film formation side.

2. The film forming device according to claim 1, characterized in that: The driving unit moves the second supporting member upward and downward.

3. The film forming device according to claim 1, characterized in that: The film forming device includes a lifting unit for lifting and lowering the first supporting member. The driving unit moves the second supporting member to a position that does not hinder movement of the substrate when the first supporting member is raised and lowered by the lifting unit, and moves the second supporting member to a position that supports the substrate before the substrate is adsorbed by the adsorption member.

4. The film forming device according to claim 1, characterized in that: The adsorption member has an electrode inside and is configured to generate an electrostatic adsorption force by applying a voltage to the electrode.

5. The film forming device according to claim 1, characterized in that: The film forming device comprises: a mask holding portion that holds a mask; as well as a mask driving unit that moves the mask holding unit in a state of being suspended by magnetic levitation, The mask driving unit moves the mask holding unit in a state where the adsorption member adsorbs the substrate, thereby aligning the substrate and the mask.

6. The film forming apparatus according to any one of claims 1 to 5, characterized in that: The film forming device includes a film forming source that forms a thin film on the substrate adsorbed by the adsorption member.

7. A method for driving a film forming device, the film forming device comprising: an adsorption member that adsorbs a surface of the substrate on an opposite side to the surface on the film-forming side; a first supporting member, the first supporting member supporting a periphery of the substrate; as well as a second supporting member including a portion extending along the film-forming side surface of the substrate and supporting the film-forming side surface of the substrate, The driving method of the film forming device is characterized by comprising: A supporting step of supporting the periphery of the substrate by the first supporting member; After the supporting step, an approaching step of moving the second supporting member to a position that does not hinder movement of the substrate supported by the first supporting member, and bringing the substrate supported by the first supporting member closer to the adsorption member; After the approaching step, a rotating step of moving the second supporting member to a position supporting the substrate by rotating the extended portion of the second supporting member around an axis extending in a direction perpendicular to a surface of the substrate on the film forming side; After the swirling step, a suction step of suctioning the substrate by the suction member; and After the adsorption step, a film forming step of forming a film is performed.

8. The method for driving a film forming device according to claim 7, wherein: The rotating step further includes a step of moving the second supporting member upward and downward.

9. The method for driving a film forming device according to claim 7, wherein: After the adsorption step and before the film forming step is started, there is a retracting step of moving the second supporting member to a retracted position by rotating the extended portion of the second supporting member about the axis.

10. A film forming method, characterized in that: By using the driving method of a film forming apparatus according to any one of claims 7 to 9, a film is formed on a substrate.

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