An ultrasonic gas-phase cleaning machine for chip processing

Abstract

The present invention discloses an ultrasonic gas-phase cleaning machine for chip processing, which relates to the field of ultrasonic gas-phase cleaning. It includes a chassis with a storage bin arranged on the front. A storage bin is provided on the outer surface of the chassis for temporarily placing chips and cleaning liquid. One end of the chassis close to the placement table is fixedly connected with a button board. It further includes: a cleaning chamber, which provides a closed environment for cleaning chips; a cover unit, which is used to cover the cleaning chamber and has the function of isolating larger stains; a bearing unit, which is used to place the chips and ensure the stable placement of the chips during the cleaning process; a gas-phase circulation unit, which is used to release the steam of the cleaning liquid, condense and purify the recycled cleaning liquid and realize recycling. During operation, the gas-phase circulation unit will heat and evaporate the cleaning liquid and spray it in a spray state. With the assistance of ultrasonic waves, the impurities on the chips to be processed are removed. At the same time, the gas-phase circulation unit will also purify the condensed cleaning liquid and realize recycling.

Description

Technical Field

[0001] The present invention relates to the technical field of ultrasonic gas-phase cleaning, and particularly to an ultrasonic gas-phase cleaning machine for chip processing. Background Art

[0002] Ultrasonic gas-phase cleaning is an advanced cleaning process that combines the advantages of ultrasonic technology and gas-phase cleaning. It first heats the cleaning liquid to evaporate it into a gas phase, making it easier for the cleaning liquid molecules to penetrate into the fine gaps and complex structures of the objects to be cleaned. At the same time, an ultrasonic generator is used to generate high-frequency vibrations, which are converted into mechanical vibrations through a transducer, causing cavitation effects in the gas-phase environment. Countless tiny bubbles are rapidly generated, expanded, and burst on the surface of the object, generating a strong impact force to peel off and disperse dirt and impurities. This cleaning method combines the penetration advantage of the gas phase and the high-efficiency peeling ability of ultrasonic waves, and can effectively remove various types of grease, particulate pollutants, and organic residues on the surfaces of precision components such as chips and optical lenses. Moreover, it causes little damage to the objects, has a high cleaning efficiency, and is particularly suitable for fields with extremely high requirements for cleanliness and precision.

[0003] During the process of ultrasonic gas-phase cleaning, it is necessary to condense and recover the cleaning liquid. However, during the recovery process, there are substances such as dust and grease in the chip in the cleaning liquid. If it is directly used without purification, these substances will adhere to the surface of the subsequent chips. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, the technical solution adopted by the present invention to solve its technical problems is: An ultrasonic gas-phase cleaning machine for chip processing according to the present invention includes a chassis with a storage bin provided on the front. The outer surface of the chassis is provided with a storage bin for temporarily placing chips and cleaning liquid. One end of the chassis close to the placement table is fixedly connected with a button board, and further includes:

[0005] A cleaning chamber, which provides a closed environment for cleaning the chips;

[0006] A cover unit, which is used to cover the cleaning chamber and has the function of isolating larger stains;

[0007] A carrying unit, which is used to place the chips and ensure that the chips are stably placed during the cleaning process;

[0008] A gas-phase circulation unit, which is used to release the steam of the cleaning liquid, and condense, purify, and recycle the cleaning liquid to achieve circular utilization;

[0009] The cleaning chamber includes a partition plate disposed in the middle section, which separates the cleaning chamber into upper and lower chambers. The upper chamber is used for cleaning the chip, and the lower chamber is used for condensing and recovering the cleaning liquid. At the top of the partition plate, support plates I are symmetrically arranged. On the support plates I, there are ultrasonic reflector plates with reflecting surfaces having specific arcs and textures, which are used to reflect and focus the ultrasonic waves to each corner of the chamber, ensuring that every part of the chip can be subjected to uniform ultrasonic action. The outer surface of the partition plate is fixedly connected with a water inlet, and the lower chamber is provided with an inclined surface.

[0010] Preferably, the cleaning chamber is disposed at the top of the chassis, the cover plate unit is placed on the top of the cleaning chamber, and the gas phase circulation unit is disposed on the inner wall of the cleaning chamber.

[0011] Preferably, the cover plate unit includes a sealing cover wrapped with a high-precision rubber sealing ring to ensure the sealing effect. At the top of the sealing cover, a handle is fixedly connected. At the bottom of the sealing cover, a support rod I is fixedly connected. At the bottom of the support rod I, a filter plate that can cover the water inlet is fixedly connected, which is used to separate larger impurities in the cleaning liquid.

[0012] Preferably, the bottom of the sealing cover is in contact with the top of the cleaning chamber, and the bottom of the filter plate is in contact with the top of the water inlet.

[0013] Preferably, the carrying unit includes a servo motor. The output end of the servo motor is fixedly connected with a rotating shaft. At the end of the rotating shaft far from the servo motor, a placement plate is fixedly connected. The placement plate is provided with grooves on its surface designed to precisely match the shape of the chip. Inside the wall of the placement plate, there are clamping blocks. On both sides of the placement plate, magnetic blocks I are symmetrically arranged. The clamping blocks are used to place the chip to be processed, which can ensure that the chip to be processed is stably placed during the cleaning process and avoid displacement due to ultrasonic vibration. The outer surface of the placement plate is fixedly connected with a water brushing mechanism.

[0014] Preferably, the water brushing mechanism includes a support rod II. The outer surface of the support rod II is slidably connected with a sliding block. On the outer surface of the sliding block, there is a support plate II. Inside the wall of the support plate II, a telescopic spring is fixedly connected. At the end of the telescopic spring close to the placed chip, a moving plate is fixedly connected. On the outer surface of the moving plate, a soft brush is fixedly connected. At both ends of the moving plate, magnetic blocks II that attract each other with the magnetic blocks I are fixedly connected.

[0015] Preferably, the outer surface of the servo motor I is fixedly connected with the inner wall of the cleaning chamber, and the upper and lower ends of the support rod II are fixedly connected with the outer surface of the placement plate.

[0016] Preferably, the gas-phase circulation unit includes a liquid extractor, which is provided with a water inlet end. The cleaning liquid on the inclined plane will flow into the liquid extractor through the water inlet end. A transmission pipe is fixedly connected to the outer surface of the liquid extractor, and a purification mechanism is arranged on the transmission pipe. A heating evaporator is fixedly connected to the top of the transmission pipe. The heating evaporator adopts microchannel heating technology, which can quickly heat the cleaning liquid to the boiling point and generate uniform steam. A spraying device is arranged on the outer surface of the heating evaporator. The spraying device is composed of multiple high-precision atomizing nozzles, which can evenly spray the steam in the form of extremely fine droplets into the chamber and make full contact with the surface of the chip.

[0017] Preferably, the purification mechanism includes a third support plate. A separation block fixedly connected by screws is arranged at the bottom of the third support plate, and the separation block can be disassembled. Side plates are symmetrically arranged at both ends of the third support plate. A sliding rod is fixedly connected to the inner wall of the side plate, and a moving block is slidably connected to the outer surface of the sliding rod. A membrane clamping plate is fixedly connected to the outer surface of the moving block, and multiple filter membranes are placed on the inner wall of the membrane clamping plate.

[0018] Preferably, the outer surface of the liquid extractor is fixedly connected to the bottom of the chassis, and the third support plate is arranged on the outer surface of the transmission pipe.

[0019] The beneficial effects of the present invention are as follows:

[0020] 1. By setting the cover plate unit, after covering the sealing cover on the cleaning chamber and simultaneously cleaning the chip to be processed, the stains on the chip will be washed off and fall onto the partition plate. At the same time, since the steam in the cleaning chamber will eventually cool and condense into cleaning liquid and flow into the inclined plane through the water inlet, after covering the sealing cover, the filter plate will also cover the water inlet, thereby preventing larger impurity particles from flowing into the water inlet along with the water flow and causing the water inlet to be blocked. When taking the sealing cover, the filter plate will also be taken away, which is convenient for cleaning.

[0021] 2. By setting the bearing unit, when placing the chip to be processed between the clamping blocks, the servo motor will drive the rotating shaft to rotate, thereby driving the placing plate and the chip to be processed to rotate steplessly within the range of 0 - 360°. This rotational design enables all surfaces of the chip to be fully exposed to the ultrasonic field and the cleaning liquid steam, improving the uniformity of cleaning.

[0022] 3. By setting the water brushing mechanism, when the second support plate moves to the chip to be processed, the first magnet will adsorb the second magnet, so that the telescopic spring is stretched. The moving plate will drive the soft brush to contact the chip to be processed. The soft brush can not only further remove the impurities from the surface of the chip, but also brush off the water layer attached to the surface of the chip after the bubbles are broken. The water layer will hinder the contact between the bubbles and the impurities, thereby affecting the effect of gas-phase cleaning.

[0023] 4. In the present invention, by providing a purification mechanism, after the cleaning liquid enters the third support plate, it will come into contact with the multi-layer filter membrane. The water flow impact force of the cleaning liquid will cause the moving block and the multi-layer filter membrane to be at the top of the sliding rod. However, with the long-term adsorption and purification of the multi-layer filter membrane, impurities will adhere to the multi-layer filter membrane, thereby deteriorating the filtering effect of the multi-layer filter membrane. At the same time, the gravity of the multi-layer filter membrane will also become larger and larger until the water flow impact force can no longer move the moving block. At this time, the multi-layer filter membrane will be at the separation block, and then the separation block can be disassembled to replace the multi-layer filter membrane. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic structural diagram of the present invention.

[0025] Figure 2 is a top view of the structure of the present invention.

[0026] Figure 3 is a schematic structural diagram of the cover plate unit of the present invention.

[0027] Figure 4 is a schematic structural diagram of the cleaning bin of the present invention.

[0028] Figure 5 is a schematic structural diagram of the bearing unit of the present invention.

[0029] Figure 6 is a schematic structural diagram of the water brushing mechanism of the present invention.

[0030] Figure 7 is a cross-sectional view of the structure of the water brushing mechanism of the present invention.

[0031] Figure 8 is a schematic structural diagram of the gas phase circulation unit of the present invention.

[0032] Figure 9 is a schematic structural diagram of the purification mechanism of the present invention.

[0033] Figure 10 is a cross-sectional view of the structure of the purification mechanism of the present invention.

[0034] In the figure: 1, chassis; 2, placement table; 3, storage bin; 4, cleaning bin; 5, cover unit; 6, bearing unit; 7, gas-phase circulation unit; 8, button board; 51, sealing cover; 52, handle; 53, first support rod; 54, filter plate; 41, partition board; 42, first support plate; 43, water inlet; 44, high-frequency ultrasonic transducer; 45, inclined plane; 46, ultrasonic reflector; 61, servo motor; 62, rotating shaft; 63, placement plate; 64, clamping block; 65, first magnetic block; 66, chip to be processed; 67, water-brushing mechanism; 671, second support rod; 672, sliding block; 673, second support plate; 674, telescopic spring; 675, moving plate; 676, second magnetic block; 677, soft brush; 71, liquid extractor; 72, transmission pipe; 73, water inlet end; 74, purification mechanism; 75, heating evaporator; 76, spraying device; 741, third support plate; 742, side plate; 743, separation block; 744, screw; 745, sliding rod; 746, moving block; 747, membrane clamping plate; 748, multi-layer filter membrane. Detailed implementation mode

[0035] The present invention will be further described in detail below with reference to the accompanying drawings and specific implementation modes. The embodiments of the present invention are given for the purpose of illustration and description, and are not exhaustive or limited to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific purposes.

[0036] Embodiment 1, use Figures 1 - 10 A description is given below of an ultrasonic gas-phase cleaning machine for chip processing according to an embodiment of the present invention.

[0037] As Figures 1 - 2 shown, an ultrasonic gas-phase cleaning machine for chip processing according to the present invention includes a chassis 1 with a storage bin 3 provided on the front surface. The outer surface of the chassis 1 is provided with a storage bin 3 for temporarily placing chips and cleaning liquid. One end of the chassis 1 close to the placement table 2 is fixedly connected with a button board 8, and further includes:

[0038] A cleaning bin 4, which provides a closed environment for cleaning chips;

[0039] A cover unit 5, which is used to cover the cleaning bin 4 and has the function of isolating larger stains. The size of the isolated stains is related to the pore size of the filter plate 54;

[0040] A bearing unit 6, which is used to place the chips and ensure the stable placement of the chips during the cleaning process;

[0041] The gas-phase circulation unit 7 is used to release the cleaning liquid vapor, condense and purify the recycled cleaning liquid, and achieve recycling.

[0042] When the present invention works, first, the chip 66 to be processed is placed into the carrying unit 6, and then the cover plate unit 5 is covered on the cleaning chamber 4. After that, the gas-phase circulation unit 7 will heat and evaporate the cleaning liquid and spray it in a spray state. With the assistance of ultrasonic waves, the impurities on the chip 66 to be processed are removed. At the same time, the gas-phase circulation unit 7 will also purify the condensed cleaning liquid and achieve recycling.

[0043] As Figure 4 shown, the cleaning chamber 4 includes a partition plate 41 arranged in the middle section. The partition plate 41 separates the cleaning chamber 4 into upper and lower chambers. The upper chamber is used to clean the chip, and the lower chamber is used to condense and recycle the cleaning liquid. At the top of the partition plate 41, support plates 42 are symmetrically arranged. On the support plates 42, there are ultrasonic reflectors 46 with reflecting surfaces having specific arcs and textures, which are used to reflect and focus the ultrasonic waves to each corner of the chamber, ensuring that every part of the chip can be subjected to uniform ultrasonic action. The outer surface of the partition plate 41 is fixedly connected with a water inlet 43, and an inclined surface 45 is arranged on the lower chamber.

[0044] The cleaning chamber 4 is arranged at the top of the chassis 1. The cover plate unit 5 is placed on the top of the cleaning chamber 4. The gas-phase circulation unit 7 is arranged on the inner wall of the cleaning chamber 4.

[0045] As Figure 3 shown, the cover plate unit 5 includes a sealing cover 51 wrapped with a high-precision rubber sealing ring to ensure the sealing effect. At the top of the sealing cover 51, a handle 52 is fixedly connected. At the bottom of the sealing cover 51, a support rod 53 is fixedly connected. At the bottom of the support rod 53, a filter plate 54 that can cover the water inlet 43 is fixedly connected, which is used to separate larger impurities in the cleaning liquid.

[0046] After the sealing cover 51 is covered on the cleaning chamber 4 and the chip 66 to be processed is cleaned simultaneously, the stains on the chip will be washed off and fall onto the partition plate 41. At the same time, since the steam in the cleaning chamber 4 will eventually cool and condense into cleaning liquid and flow onto the inclined surface 45 through the water inlet 43. After the sealing cover 51 is covered, the filter plate 54 will also cover the water inlet 43, thereby preventing larger impurity particles from flowing into the water inlet 43 along with the water flow and causing the water inlet 43 to be blocked. When the sealing cover 51 is taken, the filter plate 54 will also be taken away, which is convenient for cleaning.

[0047] The bottom of the sealing cover 51 is in contact with the top of the cleaning chamber 4, and the bottom of the filter plate 54 is in contact with the top of the water inlet 43.

[0048] The specific working process is as follows:

[0049] During operation, first place the chip 66 to be processed into the loading unit 6, then cover the sealing cover 51, and set parameters such as the frequency of the ultrasonic generating system, the rotation speed of the servo motor 61 in the loading unit 6, and the steam flow rate and temperature of the gas-phase cleaning liquid supply system. The high-frequency ultrasonic transducer 44 emits high-frequency ultrasonic waves to form a strong ultrasonic field in the cleaning chamber. The cavitation effect of the ultrasonic field generates a large number of tiny bubbles near the chip surface. During the formation, growth, and rupture of these bubbles, a powerful impact force is generated, which destroys the adhesion between the impurities on the chip surface and the chip, causing the impurities to fall off from the chip surface. The rotating chip to be processed ensures that all parts of the chip can be uniformly affected by ultrasonic waves and cleaning liquid steam, further improving the cleaning effect.

[0050] Example 2, use Figures 1 - 10 A description is given below of an ultrasonic gas-phase cleaning machine for chip processing according to an embodiment of the present invention.

[0051] As Figure 5 As shown, an ultrasonic gas-phase cleaning machine for chip processing according to the present invention, on the basis of Example 1, the loading unit 6 includes a servo motor 61. The output end of the servo motor 61 is fixedly connected to a rotating shaft 62. One end of the rotating shaft 62 away from the servo motor 61 is fixedly connected to a placement plate 63. The placement plate 63 is provided with grooves on its surface designed to precisely match the shape of the chip. The inner wall of the placement plate 63 is provided with clamping blocks 64. The placement plate 63 is symmetrically provided with magnetic blocks 65 on both sides. The clamping blocks 64 are used to place the chip 66 to be processed, which can ensure that the chip to be processed is stably placed during the cleaning process and avoid displacement due to ultrasonic vibration. The outer surface of the placement plate 63 is fixedly connected to a water-brushing mechanism 67.

[0052] When placing the chip 66 to be processed between the clamping blocks 64, the servo motor 61 drives the rotating shaft 62 to rotate, thereby driving the placement plate 63 and the chip 66 to be processed to rotate steplessly within a range of 0 - 360°. The rotation speed can be adjusted between 1 - 10 revolutions per minute according to the cleaning requirements. This rotation design enables all surfaces of the chip to be fully exposed to the ultrasonic field and cleaning liquid steam, improving the cleaning uniformity. During the rotation, every once in a while when the placement plate 63 is in a vertical state, the servo motor 61 stops operating, causing the water-brushing mechanism 67 to start working.

[0053] As Figures 6 - 7As shown, the water-brushing mechanism 67 includes a second support rod 671. A sliding block 672 is slidably connected to the outer surface of the second support rod 671. A second support plate 673 is provided on the outer surface of the sliding block 672. A telescopic spring 674 is fixedly connected to the inner wall of the second support plate 673. One end of the telescopic spring 674 close to the placed chip is fixedly connected to a moving plate 675. A soft brush 677 is fixedly connected to the outer surface of the moving plate 675. Two ends of the moving plate 675 are fixedly connected to second magnets 676 that attract the first magnets 65.

[0054] When the second support plate 673 is in a vertical state, the gravity of the sliding block 672 and the second support plate 673 will cause the sliding block 672 to move downward along the second support rod 671. When the second support plate 673 moves to the chip 66 to be processed, the first magnet 65 will attract the second magnet 676, so that the telescopic spring 674 is stretched. The moving plate 675 will drive the soft brush 677 to contact the chip 66 to be processed. The soft brush 677 can not only further remove impurities from the chip surface, but also brush off the water layer attached to the surface of the chip 66 to be processed after breaking the bubbles. The water layer will hinder the contact between the bubbles and the impurities, thus affecting the effect of gas-phase cleaning.

[0055] The outer surface of the first servo motor 61 is fixedly connected to the inner wall of the cleaning chamber 4. The upper and lower ends of the second support rod 671 are fixedly connected to the outer surface of the placement plate 63.

[0056] As Figure 8 shown, the gas-phase circulation unit 7 includes a liquid pump 71. A water inlet end 73 is provided on the liquid pump 71. The cleaning liquid on the inclined plane 45 will flow into the liquid pump 71 through the water inlet end 73. A transmission pipe 72 is fixedly connected to the outer surface of the liquid pump 71. A purification mechanism 74 is provided on the transmission pipe 72. A heating evaporator 75 is fixedly connected to the top of the transmission pipe 72. The heating evaporator 75 adopts a microchannel heating technology, which can quickly heat the cleaning liquid to the boiling point to generate uniform steam. A spraying device 76 is provided on the outer surface of the heating evaporator 75. The spraying device 76 is composed of a plurality of high-precision atomizing nozzles, which can uniformly spray the steam in the form of extremely fine droplets into the chamber and make full contact with the chip surface.

[0057] Although the filter plate 54 can remove larger impurities in the condensed cleaning liquid, tiny particulate impurities cannot be separated. After the cleaning liquid enters the water inlet end 73, the liquid pump will pump the cleaning liquid into the purification mechanism 74 for purification, and then it will enter the heating evaporator 75 to be heated into steam and sprayed out through the spraying device 76.

[0058] As Figures 9 - 10As shown in the figure, the purification mechanism 74 includes a third support plate 741. At the bottom of the third support plate 741, there is a separation block 743 fixedly connected by screws 744. The separation block 743 is detachable. At both ends of the third support plate 741, side plates 742 are symmetrically arranged. Inside the side plates 742, sliding rods 745 are fixedly connected. On the outer surface of the sliding rods 745, moving blocks 746 are slidably connected. On the outer surface of the moving blocks 746, membrane clamping plates 747 are fixedly connected. Inside the membrane clamping plates 747, multiple filter membranes 748 are placed.

[0059] After the cleaning liquid enters the third support plate 741, it will come into contact with the multiple filter membranes 748. The water flow impact force of the cleaning liquid will make the moving blocks 746 and the multiple filter membranes 748 move to the top of the sliding rods 745. However, with the long-term adsorption and purification of the multiple filter membranes 748, impurities will adhere to the multiple filter membranes 748, thus deteriorating the filtering effect of the multiple filter membranes 748. At the same time, the gravity of the multiple filter membranes 748 will also become larger and larger until the water flow impact force can no longer make the moving blocks 746 move. Then the multiple filter membranes 748 will be at the separation block 743. At this time, the separation block 743 can be disassembled to replace the multiple filter membranes 748.

[0060] The outer surface of the liquid extraction pump 71 is fixedly connected to the bottom of the chassis 1. The third support plate 741 is arranged on the outer surface of the transmission pipe 72.

[0061] The specific working process is as follows:

[0062] During operation, first, while the servo motor 61 drives the chip to be processed 66 to rotate, all surfaces of the chip can be fully exposed to the ultrasonic field and the cleaning liquid vapor, improving the uniformity of cleaning. Every once in a while, when the placement plate 63 is in the vertical state, the servo motor 61 will stop running. The gravity of the slider 672 and the second support plate 673 will cause the slider 672 to move downward along the second support rod 671. When the second support plate 673 moves to the chip to be processed 66, the first magnet 65 will adsorb the second magnet 676, so that the telescopic spring 674 is stretched. The moving plate 675 will drive the soft brush 677 to contact the chip to be processed 66. The soft brush 677 can not only further remove impurities from the chip surface, but also brush off the water layer attached to the surface of the chip to be processed 66 after the bubbles are broken. Finally, after the cleaning liquid is condensed, it will enter the water inlet 73 and be pumped into the purification mechanism 74 by the water pump for purification, and then it will enter the heating evaporator 75 to be heated into steam and sprayed out through the spraying device 76. During the purification process, impurities will adhere to the multi-layer filter membrane 748, resulting in a deterioration of the filtering effect of the multi-layer filter membrane 748. At the same time, the gravity of the multi-layer filter membrane 748 will become larger and larger until the impact force of the water flow cannot make the moving block 746 move. The multi-layer filter membrane 748 will be at the separation block 743, and at this time, the separation block 743 can be disassembled to replace the multi-layer filter membrane 748.

[0063] Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art and related fields without making creative efforts shall fall within the protection scope of the present invention. The structures, devices, and operation methods not specifically described and explained in the present invention, unless otherwise specified and limited, shall be implemented according to the conventional means in the art.

Claims

1. An ultrasonic gas phase cleaning machine for chip processing, comprising a chassis with a storage bin on the front, a storage bin on the outer surface of the chassis for temporarily placing chips and cleaning liquid, a button board fixedly connected to one end of the chassis close to the placement table, characterized in that: Also includes: The cleaning chamber provides a closed environment for cleaning chips; The cover unit is used to cover the cleaning chamber and has the function of isolating stains; The carrier unit is used to place the chip and ensure that the chip is firmly placed during the cleaning process; A gas phase circulation unit, used to release the cleaning liquid vapor, condense and purify the recovered cleaning liquid and realize recycling; The cleaning chamber includes a partition arranged in the middle section, the partition separates the cleaning chamber into an upper chamber and an lower chamber, the upper chamber is used for cleaning the chip, and the lower chamber is used for condensing and recovering the cleaning liquid, a support plate 1 is symmetrically arranged on the top of the partition, an ultrasonic reflector with a reflective surface having a curvature and a texture is arranged on the support plate 1, and is used to reflect and focus the ultrasonic wave to every corner of the chamber, ensuring that every part of the chip can be uniformly subjected to the ultrasonic effect, a water inlet is fixedly connected to the outer surface of the partition, and an inclined surface is arranged on the lower chamber; The carrying unit includes a servo motor, the output end of the servo motor is fixedly connected to a rotating shaft, the end of the rotating shaft away from the servo motor is fixedly connected to a placement plate, the placement plate is provided with a groove designed on its surface to match the chip shape, the inner wall of the placement plate is provided with a clamping block, and magnetic blocks 1 are symmetrically provided on both sides of the placement plate. The clamping block is used to place the processed chip, which can ensure that the processed chip is firmly placed during the cleaning process to avoid displacement due to ultrasonic vibration, and the outer surface of the placement plate is fixedly connected to a water brushing mechanism; The water brushing mechanism includes a second support rod, the outer surface of the second support rod is slidably connected to a sliding block, the outer surface of the sliding block is provided with a second support plate, the inner wall of the second support plate is fixedly connected to a telescopic spring, the end of the telescopic spring close to the chip is fixedly connected to a movable plate, the outer surface of the movable plate is fixedly connected to a soft brush, and both ends of the movable plate are fixedly connected to a second magnetic block that attracts the first magnetic block.

2. The ultrasonic gas phase cleaning machine for chip processing according to claim 1, characterized in that: The cleaning chamber is arranged on the top of the chassis, the cover plate unit is placed on the top of the cleaning chamber, and the gas phase circulation unit is arranged on the inner wall of the cleaning chamber.

3. The ultrasonic gas phase cleaning machine for chip processing according to claim 1, characterized in that: The cover unit includes a sealing cover wrapped with a rubber sealing ring to ensure the sealing effect. The top of the sealing cover is fixedly connected to a handle, the bottom of the sealing cover is fixedly connected to a support rod 1, and the bottom of the support rod 1 is fixedly connected to a filter plate that can cover the water inlet to separate impurities in the cleaning liquid.

4. The ultrasonic gas phase cleaning machine for chip processing according to claim 3, characterized in that: The bottom of the sealing cover contacts the top of the cleaning bin, and the bottom of the filter plate contacts the top of the water inlet.

5. The ultrasonic gas phase cleaning machine for chip processing according to claim 1, characterized in that: The outer surface of the servo motor 1 is fixedly connected to the inner wall of the cleaning chamber, and the upper and lower ends of the support rod 2 are fixedly connected to the outer surface of the placement plate.

6. The ultrasonic gas phase cleaning machine for chip processing according to claim 1, characterized in that: The gas phase circulation unit includes a pumping machine, which is provided with a water inlet end. The cleaning liquid on the inclined surface will flow into the pumping machine through the water inlet end. The outer surface of the pumping machine is fixedly connected with a transmission pipe, and a purification mechanism is provided on the transmission pipe. The top of the transmission pipe is fixedly connected with a heating evaporator. The heating evaporator adopts microchannel heating technology, which can heat the cleaning liquid to boiling point and generate uniform steam. The outer surface of the heating evaporator is provided with a spray device, which is composed of multiple atomizing nozzles, and can evenly spray steam into the chamber in the form of droplets to fully contact the chip surface.

7. The ultrasonic gas phase cleaning machine for chip processing according to claim 6, characterized in that: The purification mechanism includes a support plate three, a separation block fixedly connected by screws is arranged at the bottom of the support plate three, and the separation block can be removed. Side panels are symmetrically arranged at both ends of the support plate three, and the side panels are made of transparent glass. The inner wall of the side panel is fixedly connected with a sliding rod, and the outer surface of the sliding rod is slidably connected with a moving block, and the outer surface of the moving block is fixedly connected with a membrane clamping plate, and the inner wall of the membrane clamping plate is placed with multiple layers of filter membranes.

8. The ultrasonic gas phase cleaning machine for chip processing according to claim 7, characterized in that: The outer surface of the pumping machine is fixedly connected to the bottom of the chassis, and the support plate three is arranged on the outer surface of the transmission pipe.

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