An adaptive contact test state and jitter fault test device and method
By using an adaptive contact test state and jitter fault test device, and by converting signals using a voltage divider module and a voltage comparison module for detection, the problems of low detection accuracy and complex operation of relay switch contacts are solved. This enables fast and accurate multi-contact detection, improving detection efficiency and reliability.
Patent Information
- Application Number
- CN202510041493.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-10
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2045-01-10
AI Technical Summary
Existing relay switch contact bounce detection equipment has low detection accuracy, complex operation, and a high failure rate due to the influence of the test environment. It cannot meet the needs of rapid, large-scale, and high-quality production of military products. In particular, active contact detection may lead to short circuits or detection failure.
An adaptive contact test state and jitter fault test device is adopted. The voltage divider module converts the signal of the contact under test into a suitable voltage signal UA, and compares it with the set voltage signals UB and UC. It is then converted into a pulse signal for judgment. There is no need to change the power supply method or distinguish the signal source, and multi-contact rapid jitter detection can be performed directly.
It enables rapid and accurate detection of relay switch contacts, improving detection efficiency and reliability. It is applicable to contact detection of contacts from any signal source, significantly enhancing detection accuracy and versatility, eliminating the drawbacks of active switch contact detection, and reducing detection risks.
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Figure CN119805197B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of instrument testing technology, and in particular to an adaptive contact testing state and jitter fault testing device and method. Background Technology
[0002] With the increasing electronification, informatization, and automation of military equipment and weapon systems, the role of relays is becoming increasingly important, their usage is growing rapidly, and their application scope is constantly expanding. For example, a large military transport aircraft requires more than 200 general-purpose relays, a new type of missile uses up to 970 relays of various types, and a high-performance fighter jet can use thousands of relays. As the application scope of relay technology continues to expand, there are increasingly higher requirements for relay performance, reliability, and service life in practical applications. Relays often operate in environments with high levels of vibration, which frequently leads to contact failures and delays in production deadlines. Therefore, effectively solving the problem of contact bounce in relays is of great significance for ensuring the safe and reliable operation of products.
[0003] Existing relay switch contact bounce testing equipment is mostly civilian-grade, with low testing accuracy, few circuits, complex operation, and a high failure rate due to the influence of the test environment. When the switch contacts are active contacts, direct testing may cause short circuits or bounce detection failure. Therefore, contact signal source analysis must be performed in advance before testing, resulting in low efficiency and poor reliability of relay switch contact bounce testing, which cannot meet the current needs of rapid, large-scale, and high-quality production of military products. Summary of the Invention
[0004] This invention provides an adaptive contact testing state and jitter fault testing device and method. The device converts the signal from the contact under test into a suitable voltage signal UA using a voltage divider module. It then compares this voltage signal UA with two preset voltage signals UB and UC to convert it into a pulse signal for judgment. This method eliminates the need to change the power supply method or distinguish the signal source, enabling rapid jitter detection of multiple contacts and accurately identifying the signal source of each contact in a single test. This application also provides corresponding methods and a computer-readable storage medium.
[0005] In a first aspect, embodiments of this application provide an adaptive contact test state and jitter fault test device, including: a voltage divider module, a voltage comparison module, and a contact jitter module;
[0006] The contact under test is connected to the input terminal XIN of the voltage divider module, and the contact under test is also connected to the power supply terminal VIN or GND;
[0007] The input power terminal VIN of the voltage divider module is grounded in series through resistors R1, R2, and R3. The input terminal XIN is connected between resistors R1 and R2. The output terminal A of the voltage divider module is connected between resistors R2 and R3, so that when the contact under test is normally connected, the voltage signal UA at terminal A is R3*XIN / (R2+R3), and when the contact under test is jittering, the voltage signal UA at terminal A is R3*VIN / (R1+R2+R3).
[0008] The input terminals -INA and +INB of the voltage comparison module are connected to terminal A. The input terminal +INA receives the voltage signal UB, and the input terminal -INB receives the voltage signal UC.
[0009] The voltage divider module also includes resistors R4 and R5. The VIN terminal is grounded in series through resistors R4 and R5. The output terminal C of the voltage divider module is connected between resistors R4 and R5. The C terminal is used to output the voltage signal UC = R5 * VIN / (R4 + R5).
[0010] The voltage divider module also includes resistors R6 and R7. The VIN terminal is grounded in series through resistors R6 and R7. The output terminal B of the voltage divider module is connected between resistors R6 and R7. The B terminal is used to output the voltage signal UB = R7 * VIN / (R6 + R7).
[0011] The voltage comparison module has an output terminal OUTA that compares the voltage of -INA and +INA terminals, an output terminal OUTB that compares the voltage of -INB and +INB terminals, and an output terminal OUTW that performs a NAND operation on the voltage of OUTA and OUTB terminals.
[0012] The contact jitter module acquires the jitter detection signal IN1 output from the OUTA terminal, the jitter detection signal IN2 from the OUTB terminal, and the jitter detection signal IN3 from the OUTW terminal, and performs the following discrimination steps:
[0013] When the jitter detection signal IN3 shows a falling edge pulse signal but the pulse width u3 is less than the set threshold u, it is determined that the contact under test has not jittered.
[0014] When the jitter detection signal IN1 shows a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than a set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is VCC.
[0015] When the jitter detection signal IN1 remains unchanged, the jitter detection signal IN2 shows a rising edge pulse width signal, the jitter detection signal IN3 shows a falling edge pulse signal, and the pulse width u3 is greater than the set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is GND.
[0016] In conjunction with the first aspect, in one implementation of this application, when the signal source of the contact under test is GND, the input terminal XIN of the voltage divider module is GND, and the input power terminal VIN of the voltage divider module is +B.
[0017] The voltage value of the voltage signal UB is For a certain value,
[0018] The voltage value of the voltage signal UC is For a certain value,
[0019] When the contact under test is working normally, the voltage value of the voltage signal UA is R3*GND / (R2+R3)=0V. At this time, the voltage signal UA is less than the voltage signal UC.
[0020] When the contact under test vibrates abnormally, the voltage value of the voltage signal UA is At this time, the voltage signal UA is greater than the voltage signal UC.
[0021] When the contact under test returns to normal operation, the voltage value of the voltage signal UA is R3*GND / (R2+R3)=0V. At this time, the voltage signal UA is less than the voltage signal UC. During the jittering process of the contact under test, the jitter detection signal IN2 at the OUTB terminal shows a rising edge pulse width signal, and the jitter detection signal IN3 at the OUTW terminal begins to show a falling edge pulse signal.
[0022] It is understood that, in the embodiments of this application, the resistors R1, R2, R3, R4, R5, R6, and R7 satisfy the following conditions:
[0023]
[0024] When the signal source of the contact under test is +B, the input terminal XIN of the voltage divider module is +B, and the input power terminal VIN of the voltage divider module is +B.
[0025] The voltage value of the voltage signal UB is For a certain value,
[0026] The voltage value of the voltage signal UC is For a certain value,
[0027] When the contact under test is working properly, the voltage value of the voltage signal UA is At this time, the voltage signal UA is greater than the voltage signal UB, and the voltage value of the voltage signal UA when the contact under test is abnormally jittering. The voltage signal UA is less than the voltage signal UB.
[0028] When the contact under test returns to normal operation, the voltage value of the voltage signal UA is At this time, the voltage signal UA is greater than the voltage signal UB. During the jittering process of the contact under test, the jitter detection signal IN1 at the OUTA terminal shows a rising edge pulse width signal, and the jitter detection signal IN3 at the OUTW terminal begins to show a falling edge pulse signal.
[0029] It is understood that, in the embodiments of this application, the resistors R1, R2, R3, R4, R5, R6, and R7 satisfy the following conditions:
[0030]
[0031] In conjunction with the first aspect, in one implementation of the embodiments of this application, the ratio of resistor R1, resistor R2, resistor R3, resistor R4, resistor R5, resistor R6 and resistor R7 is 28:26.7:1.5:28:0.51:27:1.
[0032] In conjunction with the first aspect, in one implementation of the embodiments of this application, the resistor R1 is 28KΩ, the resistor R2 is 26.7KΩ, the resistor R3 is 1.5KΩ, the resistor R4 is 28KΩ, the resistor R5 is 0.51KΩ, the resistor R6 is 27KΩ, and the resistor R7 is 1KΩ.
[0033] In conjunction with the first aspect, in one implementation of this application embodiment, the contact bounce module is further used for:
[0034] When the jitter detection signal IN1 has a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 has a falling edge pulse signal with a pulse width u3 greater than a set threshold u, the time when the jitter detection signal IN1 has a rising edge pulse width signal is the contact jitter time, or the time when the jitter detection signal IN3 starts to have a falling edge pulse signal is the contact jitter time.
[0035] In conjunction with the first aspect, in one implementation of this application embodiment, the contact bounce module is further used for:
[0036] When the jitter detection signal IN1 remains unchanged, the jitter detection signal IN2 shows a rising edge pulse width signal, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than a set threshold u, the time when the jitter detection signal IN2 shows a rising edge pulse width signal is the contact jitter time, or the time when the jitter detection signal IN3 starts to show a falling edge pulse signal is the contact jitter time.
[0037] In conjunction with the first aspect, in one implementation of the embodiments of this application, the device further includes a communication module and a host computer;
[0038] The host computer connects to multiple contact jitter modules through the communication module to simultaneously monitor multiple contacts to be tested.
[0039] Secondly, embodiments of this application provide an adaptive contact test state and jitter fault test method, executed based on the aforementioned adaptive contact test state and jitter fault test device, including the following steps:
[0040] Acquire the voltage signal of the contact point to be tested;
[0041] The voltage signal of the contact under test is divided by the voltage divider module to obtain voltage signal UA, voltage signal UB and voltage signal UC;
[0042] The voltage signals UA, UB, and UC are processed by the voltage comparison module to obtain jitter detection signals IN1, IN2, and IN3.
[0043] The following judgments are made using the contact bounce module:
[0044] When the jitter detection signal IN3 shows a falling edge pulse signal but the pulse width u3 is less than the set threshold u, it is determined that the contact under test has not jittered.
[0045] When the jitter detection signal IN1 shows a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than a set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is VCC.
[0046] When the jitter detection signal IN1 remains unchanged, the jitter detection signal IN2 shows a rising edge pulse width signal, the jitter detection signal IN3 shows a falling edge pulse signal, and the pulse width u3 is greater than the set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is GND.
[0047] In conjunction with the second aspect, in one implementation of the embodiments of this application, the method further includes:
[0048] When the jitter detection signal IN1 has a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 has a falling edge pulse signal with a pulse width u3 greater than a set threshold u, the time when the jitter detection signal IN1 has a rising edge pulse width signal is the contact jitter time, or the time when the jitter detection signal IN3 starts to have a falling edge pulse signal is the contact jitter time.
[0049] In conjunction with the second aspect, in one implementation of the embodiments of this application, the method further includes:
[0050] When the jitter detection signal IN1 remains unchanged, the jitter detection signal IN2 shows a rising edge pulse width signal, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than a set threshold u, the time when the jitter detection signal IN2 shows a rising edge pulse width signal is the contact jitter time, or the time when the jitter detection signal IN3 starts to show a falling edge pulse signal is the contact jitter time.
[0051] Thirdly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method as described in the second aspect.
[0052] As can be seen from the above technical solutions, the embodiments of the present invention have the following advantages:
[0053] This invention provides an adaptive contact testing state and jitter fault testing device and method. The device converts the signal from the contact under test into a suitable voltage signal UA using a voltage divider module. It then compares this voltage signal UA with two preset voltage signals UB and UC to convert it into a pulse signal for judgment. This method eliminates the need to change the power supply method or distinguish the signal source, enabling rapid jitter detection of multiple contacts and accurately identifying the signal source of each contact in a single test. It offers strong versatility and high testing efficiency for relay contact detection, enabling rapid jitter detection of contacts with any signal source. This eliminates the drawbacks of using existing equipment for relay active switch contact jitter detection, as it requires no change in the power supply method or signal source distinction, significantly improving the efficiency, reliability, and versatility of relay switch contact jitter detection. Attached Figure Description
[0054] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0055] Figure 1 A schematic diagram of an adaptive contact test state and jitter fault test device provided in an embodiment of this application;
[0056] Figure 2 This is a schematic diagram of one implementation of the voltage divider module 102 in this application embodiment;
[0057] Figure 3 This is a schematic diagram of the external wiring of one embodiment of the voltage comparison module 103 in this application.
[0058] Figure 4 This is an internal schematic diagram of one embodiment of the voltage comparison module 103 in this application.
[0059] Figure 5 The schematic diagram of the steps provided in the embodiments of this application;
[0060] Figure 6 This is a schematic diagram of the system principle framework for simultaneously monitoring multiple contacts to be tested using a host computer and a communication module, as described in an embodiment of this application.
[0061] Figure 7 This application provides an embodiment of an adaptive contact test state and jitter fault test method.
[0062] Figure 8 A schematic diagram of the terminal device provided in the embodiments of this application;
[0063] The attached diagram is labeled as follows: 101, product under test; 102, voltage divider module; 103, voltage to comparator module; 104, contact bounce module; 105, communication module; 106, host computer. Detailed Implementation
[0064] This invention provides an adaptive contact test state and jitter fault test device and method. The device converts the signal of the contact under test into a suitable voltage signal UA through a voltage divider module, and compares the voltage signal UA with two set voltage signals UB and UC to convert it into a pulse signal for judgment.
[0065] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.
[0066] Figure 1 A schematic diagram of an adaptive contact test state and jitter fault test device provided in an embodiment of this application is shown below. Figure 1 As shown, the adaptive contact test state and jitter fault test device includes at least: a voltage divider module 102, a voltage comparison module 103, and a contact jitter module 104;
[0067] In this embodiment of the application, the test contact of the product under test 101 is connected to the input terminal XIN of the voltage divider module 102;
[0068] The input power terminal VIN of the voltage divider module 102 is grounded in series through resistors R1, R2 and R3. The input terminal XIN is connected between resistors R1 and R2. The output terminal A of the voltage divider module is connected between resistors R2 and R3, so that when the contact under test is normally connected, the voltage signal UA at terminal A is R3*XIN / (R2+R3), and when the contact under test is jittering, the voltage signal UA at terminal A is R3*VIN / (R1+R2+R3).
[0069] Figure 2 This is a schematic diagram of one implementation of the voltage divider module 102 in an embodiment of this application. Figure 2 As shown, the VIN terminal is grounded in series through resistors R1, R2, and R3. The XIN terminal is connected between resistors R1 and R2, and the A terminal is connected between resistors R2 and R3. Therefore, when voltage is applied to the XIN terminal (the contact under test is normally connected), the output voltage of the A terminal is determined by the voltage at the XIN terminal, i.e., the voltage signal UA at the A terminal is UA = R3 * XIN / (R2 + R3). When the XIN terminal is not connected (the contact under test is bouncing), the output voltage of the A terminal is determined by the voltage at the VIN terminal, i.e., the voltage signal UA at the A terminal is UA = R3 * VIN / (R1 + R2 + R3).
[0070] Figure 3 This is a schematic diagram of the external wiring of one embodiment of the voltage comparison module 103 in this application. Figure 4 This is an internal schematic diagram of one embodiment of the voltage comparison module 103 in this application. (In conjunction with...) Figure 3 and Figure 4In this embodiment of the application, the input terminal -INA and the input terminal +INB of the voltage comparison module 103 are connected to terminal A. The input terminal +INA receives the voltage signal UB, and the input terminal -INB receives the voltage signal UC.
[0071] In the embodiments of this application, voltage signals UB and UC are constant voltages, with voltage signal UB = R7 * VIN / (R6 + R7) and voltage signal UC = R5 * VIN / (R4 + R5);
[0072] The voltage signal UC is provided by the voltage divider module 102, such as Figure 2 As shown, the voltage divider module 102 also includes resistors R4 and R5, and has the following circuit structure: the VIN terminal is grounded in series through resistors R4 and R5, and the output terminal C of the voltage divider module 102 is connected between resistors R4 and R5. Terminal C is used to output the voltage signal UC = R5 * VIN / (R4 + R5). By adjusting the voltage at the VIN terminal and the resistance values of resistors R4 and R5, the fixed value of the voltage signal UC can be made less than R3 * VIN / (R1 + R2 + R3).
[0073] Specifically, voltage signal The following conditions must be met:
[0074]
[0075] The voltage at the VIN terminal in the above formula can be omitted, meaning the resistance values of resistors R1, R2, R3, R4, and R5 must satisfy the following condition:
[0076]
[0077] Therefore, the effect of the embodiment of this application can be achieved by the resistors in the voltage divider module meeting the above conditions.
[0078] In this implementation, the voltage signal UC is provided by the voltage divider module 102, which can simplify the module, improve integration, and reduce costs.
[0079] The voltage signal UB is provided by the voltage divider module 102, such as Figure 2 As shown, the voltage divider module 102 also includes resistors R6 and R7. The VIN terminal is grounded in series through resistors R6 and R7. The output terminal B of the voltage divider module 102 is connected between resistors R6 and R7, and terminal B is used to output the voltage signal UB = R7 * VIN / (R6 + R7). By adjusting the resistance values of resistors R1, R2, R3, R6, and R7, the fixed value of the voltage signal UB can be greater than R3 * VIN / (R1 + R2 + R3) and less than R3 * VIN / (R2 + R3).
[0080] Specifically, voltage signal The following conditions must be met:
[0081]
[0082] The voltage at the VIN terminal in the above formula can be omitted, meaning the resistance values of resistors R1, R2, R3, R6, and R7 must satisfy the following condition:
[0083]
[0084] Therefore, the effect of the embodiment of this application can be achieved by the resistors in the voltage divider module meeting the above conditions.
[0085] In this implementation, the voltage signal UB is provided by the voltage divider module 102, which can simplify the module, improve integration, and reduce costs.
[0086] Please refer to Figure 4 As can be seen, the output terminal OUTA of the voltage comparison module 103 is a voltage comparison output between the -INA terminal (connected to voltage signal UA) and the +INA terminal (connected to voltage signal UB), the output terminal OUTB is a voltage comparison output between the -INB terminal (connected to voltage signal UC) and the +INB terminal (connected to voltage signal UA), and the output terminal OUTW is a NAND output between the OUTA terminal and the OUTB terminal.
[0087] The principles of the embodiments of this application are explained below:
[0088] Scenario 1: The XIN contact under test is connected to the -B power supply (or GND).
[0089] When a normal connection is established, the combination Figure 2 , Figure 3 , Figure 4 It can be seen that the voltage signal UA = R3 * XIN / (R2 + R3) = 0. At this time, both the voltage signal UB and the voltage signal UC are greater than the voltage signal UA. Therefore, the OUTA terminal outputs a high level, the OUTB terminal outputs a low level, and the OUTW terminal outputs a high level.
[0090] When the contacts bounce abnormally (the contacts open), the voltage signal UA = R3 * VIN / (R1 + R2 + R3). At this time, according to the setting of the voltage signal UB, if the voltage signal UB is greater than the voltage signal UA, the OUTA terminal outputs a high level; according to the setting of the voltage signal UC, if the voltage signal UC is less than the voltage signal UA, the OUTB terminal outputs a high level. Therefore, the OUTW terminal outputs a low level.
[0091] When the contacts are restored, the voltage returns to the normal connection state. Then, the OUTA terminal outputs a high level, the OUTB terminal outputs a low level, and the OUTW terminal outputs a high level.
[0092] This can be seen from Table 1:
[0093]
[0094]
[0095] Table 1
[0096] Therefore, the state of the contact under test can be determined by analyzing the jitter detection signal IN1 output from OUTA, the jitter detection signal IN2 from OUTB, and the jitter detection signal IN3 from OUTW.
[0097] The second scenario: The XIN contact under test is connected to the +B power supply (or connected to VIN).
[0098] When a normal connection is established, the combination Figure 2 , Figure 3 , Figure 4 It can be seen that the voltage signal UA = R3 * VIN / (R2 + R3). At this time, both the voltage signal UB and the voltage signal UC are less than the voltage signal UA. Therefore, the OUTA terminal outputs a low level, the OUTB terminal outputs a high level, and the OUTW terminal outputs a high level.
[0099] When the contacts bounce abnormally (the contacts open), the voltage signal UA = R3 * VIN / (R1 + R2 + R3). At this time, according to the setting of the voltage signal UB, if the voltage signal UB is greater than the voltage signal UA, the OUTA terminal outputs a high level; according to the setting of the voltage signal UC, if the voltage signal UC is less than the voltage signal UA, the OUTB terminal outputs a high level. Therefore, the OUTW terminal outputs a low level.
[0100] When the contacts are restored, the voltage returns to the normal connection state. Then, the OUTA terminal outputs a low level, the OUTB terminal outputs a high level, and the OUTW terminal outputs a high level.
[0101] This can be seen from Table 2:
[0102]
[0103] Table 2
[0104] Therefore, the state of the contact under test can be determined by analyzing the jitter detection signal IN1 output from OUTA, the jitter detection signal IN2 from OUTB, and the jitter detection signal IN3 from OUTW.
[0105] The specific analysis steps are executed by the contact bounce module. Figure 5 The schematic diagram of the steps provided in the embodiments of this application, combined with Figure 5 As shown, the specific process includes the following:
[0106] The contact bounce module acquires the bounce detection signal IN1 output from OUTA, the bounce detection signal IN2 from OUTB, and the bounce detection signal IN3 from OUTW, and performs the following discrimination steps:
[0107] When the jitter detection signal IN3 shows a falling edge pulse signal but the pulse width u3 is less than the set threshold u, it is determined that the contact under test has not jittered. It should be noted that the reasoning principle is that since the pulse width u3 is less than the set threshold u, it may be a measurement error, so it is still determined that the contact has not jittered.
[0108] When the jitter detection signal IN1 shows a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than the set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is VCC. It should be noted that, according to the inferences in Tables 1 and 2, the jitter detection signal IN1 showing a rising edge pulse width signal, the jitter detection signal IN2 remaining unchanged, and the jitter detection signal IN3 showing a falling edge pulse signal belong to the state of the contact transitioning from normal operation to abnormal jittering in Table 2. Therefore, it can be determined that the active contact is jittering and the signal source of the contact under test is VCC.
[0109] When the jitter detection signal IN1 remains unchanged, the jitter detection signal IN2 shows a rising edge pulse width signal, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than the set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is GND. It should be noted that, based on the inferences in Tables 1 and 2, the occurrence of a rising edge pulse width signal in the jitter detection signal IN1, the unchanged jitter detection signal IN1, the rising edge pulse width signal in the jitter detection signal IN2, and the falling edge pulse signal in the jitter detection signal IN3 all fall under the state of contact transitioning from normal operation to abnormal jittering as described in Table 1. Therefore, it can be determined that the active contact is jittering and the signal source of the contact under test is GND.
[0110] In some embodiments, the device can also detect contact jitter time.
[0111] Specifically, when the jitter detection signal IN1 remains unchanged, and the jitter detection signal IN2 shows a rising edge pulse width signal, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than the set threshold u, the time when the jitter detection signal IN2 shows a rising edge pulse width signal is defined as the contact jitter time, or the time when the jitter detection signal IN3 begins to show a pulse signal is defined as the contact jitter time. It should be noted that the time when the jitter detection signal IN2 shows a rising edge pulse width signal and the time when the jitter detection signal IN3 begins to show a falling edge pulse signal are generally the same.
[0112] When the jitter detection signal IN1 shows a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than the set threshold u, the time when the jitter detection signal IN1 shows a rising edge pulse width signal is defined as the contact jitter time, or the time when the jitter detection signal IN3 begins to show a falling edge pulse signal is defined as the contact jitter time. It should be noted that the time when the jitter detection signal IN1 shows a rising edge pulse width signal and the time when the jitter detection signal IN3 begins to show a falling edge pulse signal are generally the same.
[0113] In some embodiments, simultaneous monitoring of multiple contacts under test can be achieved via a host computer and a communication module. Specifically, the host computer connects to multiple contact jitter modules via the communication module to achieve simultaneous monitoring of multiple contacts under test. Figure 6 This is a system principle framework diagram illustrating the simultaneous monitoring of multiple contacts under test using a host computer and a communication module, as described in an embodiment of this application. Figure 6 As shown, the contacts of cables or instruments are connected to a multiplexer unit, which in turn is connected to a jitter interface module via a jitter interface module, and then connected to a jitter control module via a board connector. Specifically, the multiplexer unit may include the aforementioned voltage divider module 102, the jitter interface module may include the aforementioned voltage comparison module 103, and the jitter control module may include the aforementioned contact jitter module 104. Of course, in practical applications, other circuit configurations may be used depending on the actual situation, and this embodiment does not limit this. It is understood that in... Figure 6 In the schematic diagram shown, multiple jitter interface units can be connected to a single jitter control module, enabling one jitter control module to identify multiple jitter interface units, i.e., to simultaneously detect and monitor multiple cables or instruments. In this embodiment, the host computer can also communicate via a communication module ( Figure 6 (The text is omitted here.) The device can be connected to multiple jitter control modules, enabling simultaneous detection and monitoring of more cables or instruments. In this embodiment, the jitter control module can also be connected to a smart serial port capacitive LCD display to display various voltage signals for easy adjustment.
[0114] In practical applications, the contact bounce module 104 can be implemented using an FPGA core board, specifically the AC4040. The AC4040 FPGA core board code is designed using Verilog. The AC4040 FPGA core board discriminates 50 input signals, calculates the contact bounce time, and sends the bounce data to the bounce control board via serial port and inter-board connector. By calling multiple contact bounce modules, the operating status of multiple (e.g., 500) contacts can be monitored simultaneously.
[0115] The following is a description of an application example provided in this application:
[0116] Please combine Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 In the application example of this application, the VIN terminal of the voltage divider module 2 is connected to a 28V voltage, the resistor R1 is 28KΩ, the resistor R2 is 26.7KΩ, the resistor R3 is 1.5KΩ, the resistor R4 is 28KΩ, the resistor R5 is 0.51KΩ, the resistor R6 is 27KΩ, and the resistor R7 is 1.0KΩ.
[0117] Therefore, when the contacts are normal:
[0118] UA=R3*XIN / (R2+R3)=0.0532*0=0V State 1 active contact connected to -B(GND)
[0119] UA = R3 * XIN / (R2 + R3) = 0.0532 * 28 = 1.5V. State 2 active contact is connected to +B (VIN) (28V in this application example).
[0120] UB=R7*VIN / (R6+R7)=0.0357*28=1V
[0121] UC=R5*VIN / (R4+R5)=0.0179*28=0.5V
[0122] When the contact bounces abnormally:
[0123] UA = R3 * VIN / (R1 + R2 + R3) = 0.0267 * 28 = 0.75V (State 1 or State 2)
[0124] UB=R7*VIN / (R6+R7)=0.0357*28=1V
[0125] UC=R5*VIN / (R4+R5)=0.0179*28=0.5V
[0126] In this application example, the voltage comparator module can be the SGM8772 model, specifically powered by 3.3V. Therefore, if the OUTA, OUTB, and OUTW terminals output a high level, the corresponding voltage is 3.3V. The various voltage signals are shown in Table 3 below:
[0127]
[0128]
[0129] Table 3
[0130] Since the SGM8772 is powered by 3.3V in this application example, the UA, UB, and UC input voltages of the SGM8772 should not exceed 3.3V.
[0131] Because when the active contact is connected to +B(VIN), VIN and XIN are the same input voltage.
[0132] When UA = 3.3V, XIN = 62.04V, VIN = 62.04V, UB = 2.21V, and UC = 1.11V.
[0133] When UB=3.3V, VIN=92.4V, XIN=92.4V, UA=4.9V, UC=1.65V
[0134] When UC = 3.3V, VIN = 184.3V, XIN = 184.3V, UA = 9.8V, UB = 6.58V.
[0135] Therefore, when the SGM8772 is powered by 3.3V:
[0136] The maximum value of VIN and XIN inputs can reach 62.04V.
[0137] The following comparison with traditional solutions illustrates the beneficial effects of the embodiments of this application:
[0138] The first traditional approach involves starting the jitter test software on a microcomputer to initialize the FPGA. It then continuously samples the state values of the mechanical switch contacts and accumulates the jitter time, sending the data to a host computer for analysis and processing. This method achieves mechanical switch contact jitter detection. However, this approach has poor versatility, is complex to operate, and can only detect passive mechanical switch contacts. For active contacts, signal source identification is required beforehand, resulting in low testing efficiency. It cannot achieve rapid jitter detection for multiple types of active contacts. If the source signal carried by the contact is GND and is not effectively identified beforehand, direct testing will cause jitter detection failure or even damage to the tested product.
[0139] The second traditional approach achieves signal source conversion for relay switch contacts by changing the relay power supply method. It then utilizes an interconnected optocoupler group composed of a first and a second optocoupler, redundantly connecting them to create equal but opposite voltage differences across them. This allows for rapid multi-contact jitter detection without prior identification, accurately identifying the signal source of each contact in a single test. While this method has some advantages, avoiding the risk of jitter detection failure or even direct damage to the test product caused by direct testing, it requires manual adjustment of the power supply method and ΔV based on the product's power supply voltage. This is complex and cumbersome, and the manual adjustment increases the risk of product damage due to voltage incompatibility.
[0140]
[0141] Table 4
[0142] Table 4 is a comparison table of advantages and disadvantages. As can be seen from Table 4, in the first traditional solution (first row of Table 4), when the product uses a conventional single power supply, the signal source type of the relay switch contact is VCC, GND or passive. When the relay switch contact bounces, if the signal source of the relay switch contact is VCC, the optocoupler is turned on, and the FPGA module inputs a low-level signal. The signal pulse width can be obtained by the host computer to evaluate the bounce of the relay switch contact. However, once the signal source of the relay switch is GND, even if the relay has a bounce fault, the optocoupler is still not turned on, which will cause the bounce detection to fail. Moreover, due to the limitations of related circuits, it may directly short-circuit and damage the product.
[0143] The second traditional solution (second row of Table 4) involves changing the product's power supply to a dual power supply. The signal source type of the relay switch contact is V+ and V-. When the relay switch contact bounces, regardless of whether the signal source is V+ or V-, one of the first optocoupler and the second optocoupler will conduct. By simultaneously obtaining the signal pulse width through the upper computer monitoring module, the bounce of the relay switch contact can be accurately identified, and the signal source type of the relay switch contact can be directly determined. However, this method requires manually changing the product's power supply from a single power supply to a dual power supply. If the power supply is incompatible, it may cause product damage.
[0144] The method provided in this application embodiment (third row of Table 4) converts the input signal (.B / +B) into UA, UB and UC voltage signals through a voltage divider module, and then sends them to a voltage comparison module to convert the voltage into corresponding pulse signals and send them to the core board of the jitter interface board for judgment. There is no need to change the power supply method or distinguish the signal source. It can directly perform fast jitter detection of multiple contacts and accurately identify the signal source of the contact in one detection.
[0145] Figure 7 An embodiment of an adaptive contact test state and jitter fault test method provided in this application includes the following steps:
[0146] 701. Obtain the voltage signal of the contact to be tested;
[0147] 702. The voltage signal of the contact under test is divided by the voltage divider module to obtain voltage signal UA, voltage signal UB and voltage signal UC;
[0148] Specifically, the active contact (-B / +B) can be connected to the XIN input terminal of the voltage divider module to convert the input signal into UA, UB, and UC voltage signals.
[0149] 703. The voltage signals UA, UB, and UC are processed by the voltage comparison module to obtain jitter detection signals IN1, IN2, and IN3.
[0150] Specifically, as described in the voltage comparison module 103 above, the UA, UB and UC voltage signals are converted into OUTA, OUTB and OUTW output signals by the voltage comparator.
[0151] Connect the OUTA, OUTB, and OUTW output signals to the IN1, IN2, and IN3 input terminals of the contact bounce module, respectively, obtain their output states, and then perform the following judgments through the contact bounce module:
[0152] 704. When the jitter detection signal IN3 shows a falling edge pulse signal but the pulse width u3 is less than the set threshold u, it is determined that the contact under test has not jittered.
[0153] 705. When the jitter detection signal IN1 shows a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than the set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is VCC.
[0154] When the IN2 signal remains unchanged, the IN1 signal shows a rising edge pulse width signal, and the IN3 signal shows a falling edge pulse width signal, it indicates that the signal source type connected to the active contact is +B. Furthermore, the rising edge pulse width time T1 of the IN1 signal and the falling edge pulse width time T3 of the IN3 signal should satisfy T1 = T3, which is the contact bounce time. Alternatively, it can be expressed as follows: when the bounce detection signal IN1 shows a rising edge pulse width signal, the bounce detection signal IN2 remains unchanged, and the bounce detection signal IN3 shows a falling edge pulse width signal with a pulse width u3 greater than the set threshold u, the time when the rising edge pulse width signal of the bounce detection signal IN1 appears is the contact bounce time, or the time when the falling edge pulse width signal of the bounce detection signal IN3 begins to appear is the contact bounce time.
[0155] 706. When the jitter detection signal IN1 remains unchanged, the jitter detection signal IN2 shows a rising edge pulse width signal, the jitter detection signal IN3 shows a falling edge pulse signal, and the pulse width u3 is greater than the set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is GND.
[0156] When the IN1 signal remains unchanged, the IN2 signal shows a rising edge pulse width signal, and the IN3 signal shows a falling edge pulse width signal, it indicates that the signal source type connected to the active contact is -B, and the rising edge pulse width time T2 of the IN2 signal and the falling edge pulse width time T3 of the IN3 signal should meet T2 = T3, which is the contact bounce time; or it can be expressed as the contact bounce time when the bounce detection signal IN2 shows a rising edge pulse width signal, the bounce detection signal IN1 remains unchanged, the bounce detection signal IN3 shows a falling edge pulse signal and the pulse width u3 is greater than the set threshold u, the time when the bounce detection signal IN2 shows a rising edge pulse width signal is the contact bounce time, or the time when the bounce detection signal IN3 starts to show a falling edge pulse signal is the contact bounce time.
[0157] Figure 8 This is a schematic diagram of a terminal device provided in an embodiment of this application. The terminal device 800 includes a memory 802, a processor 801, and a computer program 803 stored in the memory 802 and executable on the processor 801. When the processor 801 executes the computer program 803, it implements... Figure 1 The methods of the corresponding embodiments.
[0158] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.
[0159] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between apparatuses or units through some interfaces, and may be electrical, mechanical, or other forms.
[0160] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0161] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.
[0162] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0163] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. An adaptive contact testing state and jitter fault testing device, characterized in that, include: Voltage divider module, voltage comparator module, contact bounce module; The contact under test is connected to the input terminal XIN of the voltage divider module, and the contact under test is also connected to the power supply terminal VIN or GND; The input power terminal VIN of the voltage divider module is grounded in series through resistors R1, R2, and R3. The input terminal XIN is connected between resistors R1 and R2. The output terminal A of the voltage divider module is connected between resistors R2 and R3, so that when the contact under test is normally connected, the voltage signal UA at terminal A is R3*XIN / (R2+R3), and when the contact under test is jittering, the voltage signal UA at terminal A is R3*VIN / (R1+R2+R3). The input terminals -INA and +INB of the voltage comparison module are connected to terminal A. The input terminal +INA receives the voltage signal UB, and the input terminal -INB receives the voltage signal UC. The voltage divider module also includes resistors R4 and R5. The VIN terminal is grounded in series through resistors R4 and R5. The output terminal C of the voltage divider module is connected between resistors R4 and R5. The C terminal is used to output the voltage signal UC = R5 * VIN / (R4 + R5). The voltage divider module also includes resistors R6 and R7. The VIN terminal is grounded in series through resistors R6 and R7. The output terminal B of the voltage divider module is connected between resistors R6 and R7. The B terminal is used to output the voltage signal UB = R7 * VIN / (R6 + R7). The voltage comparison module has an output terminal OUTA that compares the voltage of -INA and +INA terminals, an output terminal OUTB that compares the voltage of -INB and +INB terminals, and an output terminal OUTW that performs a NAND operation on the voltage of OUTA and OUTB terminals. The contact jitter module acquires the jitter detection signal IN1 output from the OUTA terminal, the jitter detection signal IN2 from the OUTB terminal, and the jitter detection signal IN3 from the OUTW terminal, and performs the following discrimination steps: When the jitter detection signal IN3 shows a falling edge pulse signal but the pulse width u3 is less than the set threshold u, it is determined that the contact under test has not jittered. When the jitter detection signal IN1 shows a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than a set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is VCC. When the jitter detection signal IN1 remains unchanged, the jitter detection signal IN2 shows a rising edge pulse width signal, the jitter detection signal IN3 shows a falling edge pulse signal, and the pulse width u3 is greater than the set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is GND.
2. The apparatus according to claim 1, characterized in that, The contact bounce module is also used for: When the jitter detection signal IN1 has a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 has a falling edge pulse signal with a pulse width u3 greater than a set threshold u, the time when the jitter detection signal IN1 has a rising edge pulse width signal is the contact jitter time, or the time when the jitter detection signal IN3 starts to have a falling edge pulse signal is the contact jitter time.
3. The apparatus according to claim 1, characterized in that, The contact bounce module is also used for: When the jitter detection signal IN1 remains unchanged, the jitter detection signal IN2 shows a rising edge pulse width signal, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than a set threshold u, the time when the jitter detection signal IN2 shows a rising edge pulse width signal is the contact jitter time, or the time when the jitter detection signal IN3 starts to show a falling edge pulse signal is the contact jitter time.
4. The apparatus according to claim 1, characterized in that, When the signal source of the contact under test is GND, the input terminal XIN of the voltage divider module is GND, and the input power terminal VIN of the voltage divider module is +B. The voltage value of the voltage signal UB is For a certain value, The voltage value of the voltage signal UC is For a certain value, When the contact under test is working normally, the voltage value of the voltage signal UA is R3*GND / (R2+R3)=0V. At this time, the voltage signal UA is less than the voltage signal UC. When the contact under test vibrates abnormally, the voltage value of the voltage signal UA is At this time, the voltage signal UA is greater than the voltage signal UC. When the contact under test returns to normal operation, the voltage value of the voltage signal UA is R3*GND / (R2+R3)=0V. At this time, the voltage signal UA is less than the voltage signal UC. During the jittering process of the contact under test, the jitter detection signal IN2 at the OUTB terminal shows a rising edge pulse width signal, and the jitter detection signal IN3 at the OUTW terminal begins to show a falling edge pulse signal. When the signal source of the contact under test is +B, the input terminal XIN of the voltage divider module is +B, and the input power terminal VIN of the voltage divider module is +B. The voltage value of the voltage signal UB is For a certain value, The voltage value of the voltage signal UC is For a certain value, When the contact under test is working properly, the voltage value of the voltage signal UA is At this time, the voltage signal UA is greater than the voltage signal UB, and the voltage value of the voltage signal UA when the contact under test is abnormally jittering. The voltage signal UA is less than the voltage signal UB. When the contact under test returns to normal operation, the voltage value of the voltage signal UA is At this time, the voltage signal UA is greater than the voltage signal UB. During the jittering process of the contact under test, the jitter detection signal IN1 at the OUTA terminal shows a rising edge pulse width signal, and the jitter detection signal IN3 at the OUTW terminal begins to show a falling edge pulse signal.
5. The apparatus according to claim 1, characterized in that, The ratio of resistors R1, R2, R3, R4, R5, R6, and R7 is 28: 26.7:1.5:28:0.51:27:1。 6. The apparatus according to claim 1, characterized in that, It also includes a communication module and a host computer; The host computer connects to multiple contact jitter modules through the communication module to simultaneously monitor multiple contacts to be tested.
7. An adaptive contact test state and jitter fault test method, executed based on the adaptive contact test state and jitter fault test device as described in any one of claims 1 to 6, characterized in that, include: Acquire the voltage signal of the contact point to be tested; The voltage signal of the contact under test is divided by the voltage divider module to obtain voltage signal UA, voltage signal UB and voltage signal UC; The voltage signals UA, UB, and UC are processed by the voltage comparison module to obtain jitter detection signals IN1, IN2, and IN3. The following judgments are made using the contact bounce module: When the jitter detection signal IN3 shows a falling edge pulse signal but the pulse width u3 is less than the set threshold u, it is determined that the contact under test has not jittered. When the jitter detection signal IN1 shows a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than a set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is VCC. When the jitter detection signal IN1 remains unchanged, the jitter detection signal IN2 shows a rising edge pulse width signal, the jitter detection signal IN3 shows a falling edge pulse signal, and the pulse width u3 is greater than the set threshold u, it is determined that the contact under test is jittering and the signal source of the contact under test is GND.
8. The method according to claim 7, characterized in that, The method further includes: When the jitter detection signal IN1 has a rising edge pulse width signal, the jitter detection signal IN2 remains unchanged, and the jitter detection signal IN3 has a falling edge pulse signal with a pulse width u3 greater than a set threshold u, the time when the jitter detection signal IN1 has a rising edge pulse width signal is the contact jitter time, or the time when the jitter detection signal IN3 starts to have a falling edge pulse signal is the contact jitter time.
9. The method according to claim 7, characterized in that, The method further includes: When the jitter detection signal IN1 remains unchanged, the jitter detection signal IN2 shows a rising edge pulse width signal, and the jitter detection signal IN3 shows a falling edge pulse signal with a pulse width u3 greater than a set threshold u, the time when the jitter detection signal IN2 shows a rising edge pulse width signal is the contact jitter time, or the time when the jitter detection signal IN3 starts to show a falling edge pulse signal is the contact jitter time.
10. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the method as described in any one of claims 7 to 9.
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