Chip inductor preparation method

Abstract

The invention provides a preparation method of an AI high-computing-power chip inductor. The preparation method comprises the following steps of copper sheet forming, primary powder filling, copper sheet implanting, secondary powder filling, hot press forming, curing, chamfering, coating, electrode forming and electrode metallization. After the scheme is adopted, the copper sheet is adopted to replace a coil, the coil does not need to be wound, and after the copper sheet is adopted, the inductance is high in saturability, current resistance and bearing current; the copper sheet is of a U-shaped structure when being overlooked, so that the shape of the product is utilized to the greatest extent, and meanwhile, the middle column is enlarged; the cross-section area of the center pillar is increased to the maximum extent, the magnetic permeability of the center pillar is increased, the borne current is large, the inductance value is higher, and the circuit stability, filtering and signal adjustment are better after the center pillar is used.

Description

Technical Field

[0001] The present invention relates to the technical field of inductor preparation, and in particular to a method for preparing a chip inductor. Background Art

[0002] As the development of intelligence and wisdom in all walks of life around the world becomes increasingly clear, in order to meet the development requirements of multi-function and high performance, the number of components in the circuit board is required to be more and the size is smaller. The inductor is a component that can convert electrical energy into magnetic energy and store it. Its main function is to isolate and filter AC signals or form resonant circuits with capacitors and resistors. Most inductors on the market need to be wound with special equipment, and then filled and pressed into shape. The production cost is high, the technical difficulty is high, and the process is complex. The cross-section of the middle column of this type of inductor is small, the current it carries is small, the inductance value is low, the magnetic permeability is low, the current it carries is small, and there are also pain points such as low insulation resistance and low magnetic saturation. Summary of the invention

[0003] The object of the present invention is to provide a method for preparing a chip inductor with reasonable structure, high inductance value and good stability.

[0004] To achieve the above purpose, the technical solution provided by the present invention is: a chip inductor preparation method, which includes the following steps: copper sheet forming, primary powder filling, copper sheet implantation, secondary powder filling, hot pressing forming, curing, chamfering, coating, electrode formation, and electrode metallization.

[0005] The preparation method comprises the following steps: Copper sheet forming: the cut sheet is processed into a U shape; One-time powder filling: fill the magnetic powder into the mold cavity with a thickness of one-fifth to one-third of the thickness of the magnetic core; Copper sheet implantation: implant the formed copper sheet into the mold cavity, and the implanted copper sheet is U-shaped when viewed from above; Secondary powder filling: filling magnetic powder into the mold cavity; Solidification: solidify the blank to form a body; Chamfering: Chamfering is to add chamfering medium into the chamfering container and chamfer the body to remove the burrs and sharp angles on the surface of the body; Coating: Use high-voltage resistant nano insulating material, coat it on the body surface by spraying, and form a high-voltage resistant insulating coating layer after baking and curing; Electrode formation: Remove the coating layer by laser or flat grinding to expose the conductive base layer; Electrode metallization: Use ion sputtering or electroplating to form metallized electrodes on the conductive base layer.

[0006] Copper sheet forming includes the following steps: 1) Cut the copper sheet into long strips, and extend the two ends of the same side of the sheet to form electrode positions; 2) Place the sheet into the mold and punch it into a U shape, with the electrode located on one side of the top of the U shape.

[0007] The hot pressing molding is to heat and press in the mold cavity to solidify the blank, the temperature is 80-200℃; The curing is to take out the blank after hot pressing and put it on a hot press for hot pressing curing, the hot pressing temperature is 80-200℃, the pressure is 20-45kg / cm2, or directly put the mold together with the blank into the hot press for hot pressing curing, or take out the molded blank and put it into a baking oven for heating and curing, the temperature is controlled within 200℃, and the time is 3-8 hours.

[0008] The electrode is formed by removing the coating layer on the surface of the electrode by laser or flat grinding, and the end of the electrode is exposed to form a conductive base layer.

[0009] The electrode metallization is to form a metallized electrode on a conductive base layer by ion sputtering or electroplating.

[0010] The advantages of the present invention are: First, copper sheets are used instead of coils, so there is no need to wind coils or sinter at high temperatures; Second, the copper sheet is formed by stamping, which has low equipment cost and low mold opening cost; Third, the copper sheet has high magnetic saturation intensity and large carrying current; Fourth, the copper sheet adopts a U-shaped structure when viewed from above, which makes the most of the shape of the product, makes more effective use of space, and maximizes the cross-sectional area of ​​the center column; Fifth, the expansion of the center column area increases the magnetic permeability of the center column, making the electromagnetic characteristics more stable, the impact resistance better, the current it carries is large, and the inductance value is higher. After use, the circuit stability, filtering and signal regulation are better.

[0011] Sixth, the copper sheet and the magnetic core are pressed together to make the copper sheet fit closely to the magnetic core, which effectively improves the heat dissipation effect and anti-interference ability, helps to reduce the volume of the inductor and reduce the occurrence of product leakage.

[0012] Seventh, vertically implanted copper sheets are used to reduce the direct squeezing effect of the pressure on the copper sheets during molding, thereby reducing the squeezing force on the copper sheets during the molding process. Even under a greater molding pressure, the copper sheets will not be damaged or deformed, which is beneficial to increasing the molding pressure, effectively increasing the density of the prepared inductor and the volume ratio of the magnetic material, and thus increasing the density and magnetic permeability of the magnetic core. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1It is a schematic diagram of the overall structure of the present invention.

[0014] Figure 2 It is a schematic diagram of the present invention.

[0015] Figure 3 It is the internal structure principle diagram of the present invention.

[0016] Figure 4 It is a lateral structural principle diagram of the present invention. DETAILED DESCRIPTION

[0017] The present invention will be further described below in conjunction with all the accompanying drawings. The preferred embodiments of the present invention are as follows: Figure 1 To Attachment Figure 4 The present embodiment of the present invention provides a method for preparing a chip inductor, which comprises the following steps: copper sheet forming, primary powder filling, copper sheet implantation, secondary powder filling, hot pressing, curing, chamfering, coating, electrode formation, and electrode metallization, wherein: Copper sheet forming: The cut copper sheet is processed into a U shape; the copper sheet forming includes the following steps: 1) Cut the copper sheet into a long strip, and extend the two ends of the same side of the sheet to form electrode positions 1, and the width of the electrode position 1 is equal to or greater than the width of the sheet; 2) Place the sheet into the mold and punch it into a U shape, with electrode position 1 located on one side of the top of the U shape; One-time powder filling: fill the magnetic powder into the mold cavity with a thickness of one-fifth to one-third of the thickness of the magnetic core; Copper sheet implantation: implant the formed copper sheet into the mold cavity. The implanted copper sheet is U-shaped when viewed from above (electrode position 1 is vertically upward); Secondary powder filling: filling magnetic powder into the mold cavity; Hot pressing is to heat and press the blank in the mold cavity to solidify the blank at a temperature of 80-200℃; After the blank is molded, it is taken out and put into a hot press for hot pressing and curing. The hot pressing temperature is 80-200℃ and the pressure is 20-45kg / cm 2 , or directly put the mold together with the blank into the hot press for hot pressing and curing, or take out the molded blank and put it into the baking oven for heating and curing, with the temperature controlled within 200℃ for 3-8 hours. After using high pressure, the magnetic permeability, tensile strength and other properties of the magnetic core are effectively increased; Chamfering: Chamfering is to add chamfering medium into the chamfering container and chamfer the body to remove the burrs and sharp angles on the surface of the body; Coating: Use high-voltage resistant nano insulating material, coat it on the body surface by spraying, and form a high-voltage resistant insulating coating layer after baking and curing; Electrode formation: The electrode formation is to remove the coating layer on the surface of the electrode by laser or flat grinding, and the end of the electrode is exposed to form a conductive base layer; Electrode metallization: Electrode metallization is the process of forming a metallized electrode 3 on a conductive base layer by ion sputtering or electroplating.

[0018] After adopting the above scheme, the present invention uses copper sheets to replace coils, and there is no need to wind coils or sinter at high temperature. The copper sheets are formed by stamping, and the equipment cost and mold opening cost are low. The magnetic saturation intensity after using the copper sheets is high and the carrying current is large. The copper sheets adopt a U-shaped structure when viewed from above, which makes maximum use of the shape of the product, more effectively utilizes the space, maximizes the cross-sectional area of ​​the center column, increases the magnetic permeability of the center column, has stable electromagnetic characteristics, good impact resistance, large carrying current, and higher inductance value. After use, the circuit stability, filtering and signal adjustment are better. The copper sheet and the magnetic core are pressed and formed as one body, so that the copper sheet fits the magnetic core tightly, which effectively improves the heat dissipation effect and anti-interference ability. It helps to reduce the volume of the inductor and reduce the occurrence of product leakage magnetic phenomena.

[0019] The use of vertically implanted copper sheets can reduce the direct squeezing effect of the pressure on the copper sheets during molding, thereby reducing the squeezing force on the copper sheets during the molding process. Even under a greater molding pressure, the copper sheets will not be damaged or deformed, which is beneficial to increasing the molding pressure, effectively increasing the density of the prepared inductor and the volume ratio of the magnetic material, and thus increasing the density and magnetic permeability of the magnetic core.

[0020] The embodiments described above are only preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. Therefore, all changes made according to the shape and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for preparing a chip inductor, characterized in that: The method comprises the following steps: copper sheet forming, primary powder filling, copper sheet implantation, secondary powder filling, hot pressing forming, curing, chamfering, coating, electrode forming and electrode metallization.

2. The method for preparing a chip inductor according to claim 1, characterized in that: The preparation method comprises the following steps: Copper sheet forming: the cut sheet is processed into a U shape; One-time powder filling: fill the magnetic powder into the mold cavity with a thickness of one-fifth to one-third of the thickness of the magnetic core; Copper sheet implantation: implant the formed copper sheet into the mold cavity, and the implanted copper sheet is U-shaped when viewed from above; Secondary powder filling: filling magnetic powder into the mold cavity; Solidification: solidify the blank to form a body; Chamfering: Chamfering is to add chamfering medium into the chamfering container and chamfer the body to remove the burrs and sharp angles on the surface of the body; Coating: Use high-voltage resistant nano insulating material, coat it on the body surface by spraying, and form a high-voltage resistant insulating coating layer after baking and curing; Electrode formation: Remove the coating layer by laser or flat grinding to expose the conductive base layer; Electrode metallization: Use ion sputtering or electroplating to form metallized electrodes on the conductive base layer.

3. The method for preparing a chip inductor according to claim 1, characterized in that: Copper sheet forming includes the following steps: 1) Cut the copper sheet into long strips, and extend the two ends of the same side of the sheet to form electrode positions; 2) Place the sheet into the mold and punch it into a U shape, with the electrode located on one side of the top of the U shape.

4. The method for preparing a chip inductor according to claim 1, characterized in that: Hot pressing is a process of heating and pressing the blank in the mold cavity to solidify the blank at a temperature of 80-200°C.

5. The method for preparing a chip inductor according to claim 1, characterized in that: After the blank is molded, it is taken out and put into a hot press for hot pressing and curing. The hot pressing temperature is 80-200℃ and the pressure is 20-45kg / cm 2 , or directly put the mold together with the blank into a hot press for hot pressing and curing, or take out the molded blank and put it into a baking oven for heating and curing, with the temperature controlled within 200°C for 3-8 hours.

6. The method for preparing a chip inductor according to claim 1, characterized in that: The electrode is formed by removing the coating layer on the surface of the electrode by laser or flat grinding, and the end of the electrode is exposed to form a conductive base layer.

7. The method for preparing a chip inductor according to claim 1, characterized in that: The electrode metallization is to form a metallized electrode on a conductive base layer by ion sputtering or electroplating.

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