Wafer splicing device

Abstract

According to the wafer splicing device provided by the invention, the splicing jig made of a ceramic material is adopted, so that the surface of the splicing jig has higher flatness, and the splicing jig hardly has deformation after being used for a period of time, so that the wafer splicing precision is improved, and the replacement frequency of the splicing jig is reduced. Besides, the excessive glue baffle plate is arranged around the periphery of the jig body, so that the excessive glue can be received and gaps of the excessive glue can be cleaned regularly when the wafers are spliced, and the phenomenon that the excessive glue overflows to a machine platform and a machine shaft after the wafers are spliced is reduced or even avoided; therefore, the moving precision of the camera table after the colloid is cured due to the fact that the overflowing colloid is not cleaned in time is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of ray detectors, and in particular to a chip splicing device. Background Art

[0002] CMOS X-ray detector is an X-ray imaging device manufactured using CMOS (complementary metal oxide semiconductor) technology. CMOS X-ray detector plays an increasingly important role in modern X-ray imaging technology with its high resolution, high-speed imaging, high sensitivity and wide range of applications. The wafer of CMOS X-ray detector is generally made up of chip units. During the splicing process of the chip units of CMOS X-ray detector, the splicing accuracy is crucial to the performance of the final product. However, the aluminum splicing fixture in the prior art has a large flatness difference and cannot meet the height difference consistency of the product after splicing. Therefore, the splicing fixture cannot meet the splicing accuracy consistency of the current automated splicing equipment. In addition, after a period of use, the flatness and deformation of the aluminum splicing fixture will fluctuate greatly, thus failing to meet the product splicing requirements. Summary of the invention

[0003] In view of the shortcomings of the prior art mentioned above, the object of the present invention is to provide a chip splicing device, which is used to solve the problem that the aluminum splicing jig in the prior art cannot meet the splicing accuracy consistency of the current automated splicing equipment, and the aluminum splicing jig cannot meet the product splicing requirements because the flatness and deformation will fluctuate greatly after a period of use.

[0004] To achieve the above-mentioned and other related purposes, the present invention provides a wafer splicing device, which comprises: a fixture carrier and a ceramic splicing fixture; wherein:

[0005] The ceramic splicing jig comprises: a jig body and an overflow glue baffle surrounding the periphery of the jig body; wherein the jig body is divided into a plurality of jig units, each of the jig units is provided with a plurality of adsorption holes penetrating the jig unit; the overflow glue baffle has a side wall and a bottom wall, a gap is formed between the side wall of the overflow glue baffle and the side wall of the jig body, and the bottom wall of the overflow glue baffle is fixed and connected to the jig body to prevent colloid from overflowing;

[0006] The fixture body is fixedly connected to the fixture carrier, and the lower surface of the fixed connection area between the fixture body and the fixture carrier is higher than the lower surfaces of other areas of the fixture body.

[0007] Optionally, the number of the fixture units is 4.

[0008] Optionally, the upper surface of the fixture body is higher than the upper surface of the glue overflow baffle.

[0009] Optionally, each of the jig units is provided with a fixing hole that penetrates the jig unit, and two adjacent fixing holes are arranged in mirror symmetry, and the jig body is fixed to the jig carrier through bolts connected to the fixing holes.

[0010] Optionally, the fixture carrier is fixed on the machine platform, and the area where the fixture body is located corresponding to the fixed connection area between the fixture carrier and the machine platform is not provided with the adsorption holes, and the lower surface of this area is higher than the lower surface of the area where the fixture body is located where the adsorption holes are provided.

[0011] Furthermore, the jig carrier is fixed to the machine platform through a plurality of mounting holes penetrating the jig carrier, the mounting holes include four bolt connection holes and two latch connection holes, and the four bolt connection holes are symmetrically arranged in the jig carrier, and the two latch connection holes are symmetrically arranged in the jig carrier.

[0012] Optionally, the adsorption holes are not provided on the circumferential edge of the fixture unit, and the lower surface height of this area is higher than the lower surface of the area of ​​the fixture body where the adsorption holes are provided.

[0013] Optionally, the cross-sectional shape of the adsorption hole is circular, and the cross-sectional diameter of the adsorption hole is 0.9 mm to 1.1 mm.

[0014] Optionally, at least one adsorption blind hole is provided on the surface of the jig carrier area corresponding to each of the jig units, and the adsorption blind holes under different jig units are connected to different adsorption gas paths, and the adsorption gas paths are penetrated inside the jig carrier and led out from the side of the jig carrier, so that the adsorption gas paths can independently adsorb the corresponding jig units to form negative pressure on the surface of each jig unit away from the jig carrier.

[0015] Furthermore, one adsorption blind hole is arranged on the surface of the jig carrier area corresponding to each jig unit, and the adsorption blind hole is located at the center of the jig unit.

[0016] Optionally, the chip splicing device further includes a plurality of motor mechanisms, the projections of the motor mechanisms in the vertical direction are located one-to-one under each of the jig units, and the motor mechanisms are used to adjust the height of the upper surface of the area where each of the jig units is located.

[0017] As described above, the chip splicing device of the present invention has the following beneficial effects: the chip splicing device of the present invention uses a splicing jig made of ceramic material to make the surface of the splicing jig have a higher flatness, and there is almost no deformation after a period of use, thereby improving the accuracy of chip splicing and reducing the replacement frequency of the splicing jig. In addition, the chip splicing device of the present invention arranges an overflowing glue baffle around the periphery of the jig body, which can catch excess colloid during chip splicing and regularly clean its gaps, reducing or even avoiding the excess colloid after chip splicing from overflowing onto the machine platform and the machine axis, thereby preventing the movement accuracy of the imaging machine after the colloid is solidified due to the overflowing colloid not being cleaned in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is a schematic diagram of a ceramic splicing jig of the present invention.

[0019] Figure 2 Shown is a schematic diagram of the bottom surface of the ceramic splicing jig of the present invention.

[0020] Figure 3 Shown is a schematic diagram of a fixture carrier of the present invention.

[0021] Component number description

[0022] 1 Ceramic splicing fixture

[0023] 10 Fixture body

[0024] 11 Glue overflow baffle

[0025] 12 Fixture Unit

[0026] 13 Adsorption holes

[0027] 14 Gap

[0028] 15. Circumferential area of ​​fixture unit

[0029] 16 Assembly Area

[0030] 161 Jig assembly area

[0031] 162 Carrier bolt assembly area

[0032] 163 Carrier latch assembly area

[0033] 17 Fixing holes

[0034] 18 Baffle connection hole

[0035] 2 Jig carrier

[0036] 21 Adsorption blind hole

[0037] 22 Adsorption gas path

[0038] 23 Mounting holes

[0039] 231 Bolt connection hole

[0040] 232 Pin connection hole

[0041] 24 Jig fixing holes DETAILED DESCRIPTION

[0042] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0043] See also Figures 1 to 3 It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0044] This embodiment provides a wafer splicing device, such as Figures 1 to 3 As shown, the wafer splicing device comprises: a fixture carrier 2 and a ceramic splicing fixture 1; wherein,

[0045] like Figure 1 As shown, the ceramic splicing jig 1 comprises: a jig body 10 and a glue overflow baffle 11 surrounding the periphery of the jig body 10; wherein the jig body 10 is divided into a plurality of jig units 12, each of the jig units 12 is provided with a plurality of adsorption holes 13 penetrating the jig unit 12; the glue overflow baffle 11 has a side wall and a bottom wall, a gap 14 is formed between the side wall of the glue overflow baffle 11 and the side wall of the jig body 10, and the bottom wall of the glue overflow baffle 11 is fixed and connected to the jig body 10 to prevent colloid from overflowing;

[0046] The fixture body 10 is fixedly connected to the fixture carrier 2 , and the lower surface of the area where the fixture body 10 is fixedly connected to the fixture carrier 2 is higher than the lower surfaces of other areas of the fixture body 10 .

[0047] The chip splicing device of this embodiment adopts a splicing jig made of ceramic material to make the surface of the splicing jig have higher flatness and almost no deformation after being used for a period of time, thereby improving the accuracy of chip splicing and reducing the replacement frequency of the splicing jig. In addition, an overflow glue baffle is arranged around the periphery of the jig body to catch excess colloid during chip splicing and regularly clean the gaps, thereby reducing or even avoiding excess colloid after chip splicing from overflowing onto the machine platform and machine axis, thereby preventing the movement accuracy of the imaging machine after the colloid is solidified due to the overflowed colloid not being cleaned in time.

[0048] It should be noted here that the lower surface of the jig body 10 is the side close to the jig carrier 2. The jig body 10 is divided into a plurality of jig units 12, and there are dividing seams between the jig units 12, which can provide reference lines for the subsequent placement of chip units. The size, shape and number of the jig units 12 can be adjusted according to specific splicing requirements to adapt to chip units of different sizes, shapes and numbers. The jig units 12 can be flexibly set to enable the chip splicing device to adapt to different production scales and splicing tasks. The number of the jig units 12 can be, for example, 4, 6, 8 or 10. Figure 1 As shown, this embodiment is described by taking the fixture body 10 divided into four fixture units 12 as an example.

[0049] The upper surface of the fixture body 10 is not lower than the upper surface of the overflow baffle 11. Preferably, Figure 1 As shown, in this embodiment, the upper surface of the fixture body 10 is arranged to be higher than the upper surface of the overflow glue baffle 11 to prevent the overflow glue baffle 11 from scratching the chip unit 12 or affecting the splicing effect during the chip splicing process.

[0050] As an example, Figure 1 As shown, the bottom wall of the overflow glue baffle 11 can be fixed and connected to the fixture body 10 through the baffle connecting hole 18, and the formed gap 14 can be right-angled or V-shaped. In this embodiment, the gap 14 is preferably set to be V-shaped to reduce the difficulty of cleaning the gap 14. The specific shape of the overflow glue baffle 11 and the gap 14 formed is not overly limited here.

[0051] As an example, Figure 2 As shown, each of the fixture units 12 is provided with a fixing hole 17 that penetrates the fixture unit 12, and two adjacent fixing holes 17 are arranged in mirror symmetry, and the fixture body 10 is fixed to the fixture carrier 2 through the fixing holes 17 with bolts, as shown in FIG. Figure 3As shown, a plurality of fixture fixing holes 24 are correspondingly arranged in the fixture carrier 2. In other embodiments, the position and number of the fixing holes 17 can be designed and adjusted according to actual conditions. In this embodiment, a fixing hole 17 is arranged in each fixture unit 12, and sufficient area for setting the adsorption hole 13 can be reserved to prevent displacement or damage of the chip unit due to insufficient adsorption force, and the mirror symmetry between two adjacent fixing holes 17 can achieve uniform adsorption force between each fixture unit 12, making the surface height of each chip unit as consistent as possible, and further improving the splicing accuracy.

[0052] As an example, Figure 2 and Figure 3 As shown, the jig carrier 2 is fixed on the machine platform, and the area where the jig body 10 is located corresponding to the fixed connection area between the jig carrier 2 and the machine platform is not provided with the adsorption holes 13, and the lower surface of this area is higher than the lower surface of the area where the jig body 10 is located where the adsorption holes 13 are provided. It should be noted here that the higher the height of the lower surface of the jig body 10, the farther it will be from the jig carrier 2. The above-mentioned arrangement can make the lower surface of the area where the jig body 10 is located where the adsorption holes 13 are provided abut against the jig carrier 2, thereby avoiding pressure leakage during the chip splicing process and affecting the adsorption effect.

[0053] Furthermore, if Figure 3 As shown, the jig carrier 2 is exemplarily fixed to the machine platform through a plurality of mounting holes 23 that penetrate the jig carrier 2, and the mounting holes 23 include four bolt connection holes 231 and two latch connection holes 232, and the four bolt connection holes 231 are symmetrically arranged in the jig carrier 2, and the two latch connection holes 232 are symmetrically arranged in the jig carrier 2. The jig carrier 2 is fixed to the machine platform by a combination of bolts and latches, which ensures the stability of the jig carrier 2 and the convenience of operation. The evenly distributed bolt connection holes 231 and the latch connection holes 232 help to disperse the load and ensure the uniform force and stability of the jig carrier 2 during use. In addition, the design of the latch connection holes 232, in addition to being used to fix the jig carrier 2 on the machine platform, also takes into account the needs of adapting to other splicing platforms, so that the application range of the jig carrier 2 is wider and the operation is more flexible and convenient.

[0054] Specifically, Figure 2As shown, the area where the jig body 10 is located corresponding to the fixed connection area between the jig carrier 2 and the machine platform is the assembly area 16, and the assembly area 16 includes a jig assembly area 161 where the fixing hole 17 is located, a carrier bolt assembly area 162 corresponding to the four bolt connection holes 231, and a carrier pin assembly area 163 corresponding to the two pin connection holes 232, and the adsorption hole 13 is not set in the assembly area 16.

[0055] As an example, Figure 2 As shown, the circumferential edge of the fixture unit 12 is not provided with the adsorption hole 13, and the lower surface height of this area is higher than the lower surface height of the fixture body 10 where the adsorption hole 13 is provided. It should be noted here that the higher the height of the lower surface of the fixture unit 12 and the fixture body 10, the farther away from the fixture carrier 2. Specifically, the circumferential edge of the fixture unit 12 is Figure 2 The jig unit circumferential area 15 in the above arrangement can make the lower surface of the area where the adsorption holes 13 are arranged on the jig body 10 abut against the jig carrier 2, thereby avoiding pressure leakage during the wafer splicing process and affecting the adsorption effect.

[0056] The cross-sectional shape of the adsorption hole 13 can be set according to actual needs. As an example, the cross-sectional shape of the adsorption hole 13 can be circular, and in this embodiment, the cross-sectional diameter of the adsorption hole 13 is further set to 0.9 mm to 1.1 mm. The adsorption hole 13 with a circular cross-section can provide a more uniform adsorption force distribution, and the geometric characteristics of the circle make the gas flow more uniform, thereby forming a consistent negative pressure area around the adsorption hole 13. In addition, the manufacturing process of the adsorption hole 13 with a circular cross-section is relatively simple, which can simplify the molding process and reduce the manufacturing cost.

[0057] As an example, Figure 3 As shown, at least one adsorption blind hole 21 is provided on the surface of the area of ​​the jig carrier 2 corresponding to each jig unit 12, and the adsorption blind holes 21 under different jig units 12 are connected to different adsorption gas paths 22, and the adsorption gas paths 22 are arranged inside the jig carrier 2 and lead out from the side of the jig carrier 2, so that the adsorption gas paths 22 can independently adsorb the corresponding jig unit 12, so as to form a negative pressure on the surface of each jig unit 12 away from the jig carrier 2. Specifically, as Figure 1As shown, when the wafer splicing device is splicing the chip units 12, the adsorption gas path 22 independently adsorbs the corresponding jig unit 12, and forms a negative pressure on the surface of the jig unit 12 away from the jig carrier 2 through the adsorption hole 13, thereby independently adsorbing the chip unit located on the surface of the jig unit 12 away from the jig carrier 2, and can quickly respond to adsorption needs, thereby improving the efficiency of the overall adsorption process.

[0058] like Figure 3 As shown, in this embodiment, an adsorption blind hole 21 is set on the surface of the jig carrier 2 area corresponding to each of the jig units 12, and the adsorption blind hole 21 is located at the center of the jig unit 12, so as to achieve uniform distribution of the adsorption force on the jig unit 12 away from the surface of the jig carrier 2, thereby providing better balance and stability in the process of adsorbing the chip unit, reducing the risk of displacement or damage caused by uneven adsorption force on the surface of the chip unit, and the adsorption blind hole 21 below the corresponding position of the jig unit 12 can independently and quickly respond to the adsorption demand, thereby improving the efficiency of the overall adsorption process.

[0059] During the chip splicing process, the surface height difference between the jig units 12 needs to be controlled within a preset range to ensure that the spliced ​​chips have extremely high consistency and flatness in height, thereby improving product quality and reducing potential product defects caused by height differences. Generally, the surface height difference that meets the preset requirements is within 10μm. In order to meet this requirement, as an example, the chip splicing device also includes a plurality of motor mechanisms, and the projections of the motor mechanisms in the vertical direction are located one by one under each of the jig units 12. The motor mechanisms are used to adjust the upper surface height of the area where each of the jig units 12 is located, and then cooperate with a laser automatic altimeter for automatic measurement to achieve precise adjustment of the upper surface height of the area where each of the jig units 12 is located. The type of the motor mechanism and the method of measuring the surface height of the jig unit 12 are not overly limited here.

[0060] In summary, the chip splicing device of the present invention uses a ceramic splicing jig to make the surface of the splicing jig have a higher flatness, and there is almost no deformation after a period of use, thereby improving the accuracy of chip splicing and reducing the replacement frequency of the splicing jig. In addition, the chip splicing device of the present invention arranges an overflow baffle around the periphery of the jig body, which can catch excess colloid during chip splicing and regularly clean the gaps, thereby reducing or even avoiding excess colloid after chip splicing from overflowing onto the machine platform and the machine axis, thereby preventing the overflowed colloid from being cleaned in time, resulting in the accuracy of the imaging machine movement after the colloid is solidified. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0061] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer splicing device, characterized in that: The wafer splicing device comprises: a fixture carrier and a ceramic splicing fixture; wherein, The ceramic splicing jig comprises: a jig body and an overflow glue baffle surrounding the periphery of the jig body; wherein the jig body is divided into a plurality of jig units, each of the jig units is provided with a plurality of adsorption holes penetrating the jig unit; the overflow glue baffle has a side wall and a bottom wall, a gap is formed between the side wall of the overflow glue baffle and the side wall of the jig body, and the bottom wall of the overflow glue baffle is fixed and connected to the jig body to prevent colloid from overflowing; The fixture body is fixedly connected to the fixture carrier, and the lower surface of the fixed connection area between the fixture body and the fixture carrier is higher than the lower surfaces of other areas of the fixture body.

2. The wafer splicing device according to claim 1, characterized in that: The number of the fixture units is 4.

3. The wafer splicing device according to claim 1, characterized in that: The upper surface of the fixture body is higher than the upper surface of the overflow glue baffle.

4. The wafer splicing device according to claim 1, characterized in that: Each of the jig units is provided with a fixing hole that penetrates the jig unit, and two adjacent fixing holes are arranged in mirror symmetry, and the jig body is fixed to the jig carrier through bolts connected to the fixing holes.

5. The wafer splicing device according to claim 1, characterized in that: The fixture carrier is fixed on the machine platform, and the area where the fixture body is located corresponding to the fixed connection area between the fixture carrier and the machine platform is not provided with the adsorption holes, and the lower surface of this area is higher than the lower surface of the area where the fixture body is located where the adsorption holes are provided.

6. The wafer splicing device according to claim 5, characterized in that: The jig carrier is fixed to the machine platform through a plurality of mounting holes penetrating the jig carrier, the mounting holes comprising four bolt connection holes and two latch connection holes, and the four bolt connection holes are symmetrically arranged in the jig carrier, and the two latch connection holes are symmetrically arranged in the jig carrier.

7. The wafer splicing device according to claim 1, characterized in that: The adsorption holes are not provided on the peripheral edge of the fixture unit, and the lower surface height of this area is higher than the lower surface of the area where the adsorption holes are provided on the fixture body.

8. The wafer splicing device according to claim 1, characterized in that: The cross-sectional shape of the adsorption hole is circular, and the cross-sectional diameter of the adsorption hole is 0.9 mm to 1.1 mm.

9. The wafer splicing device according to claim 1, characterized in that: At least one adsorption blind hole is arranged on the surface of the jig carrier area corresponding to each of the jig units, and the adsorption blind holes under different jig units are connected to different adsorption gas paths, and the adsorption gas paths are penetrated inside the jig carrier and led out from the side of the jig carrier, so that the adsorption gas paths can independently adsorb the corresponding jig units to form negative pressure on the surface of each jig unit away from the jig carrier.

10. The wafer splicing device according to claim 9, characterized in that: An adsorption blind hole is arranged on the surface of the fixture carrier area corresponding to each fixture unit, and the adsorption blind hole is located at the center of the fixture unit.

11. The wafer splicing device according to claim 1, characterized in that: The wafer splicing device further comprises a plurality of motor mechanisms, the projections of the motor mechanisms in the vertical direction are located one by one below each of the jig units, and the motor mechanisms are used to adjust the height of the upper surface of the area where each of the jig units is located.

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