Chip processing device

Abstract

The invention belongs to the technical field of semiconductor chip processing, and particularly relates to a chip processing device, which comprises a processing main body and a blanking assembly arranged on the processing main body, and further comprises a downward pressing type chip mounting mechanism and a drying mechanism, the downward pressing type chip mounting mechanism is arranged on the processing main body, and the drying mechanism is arranged on the processing main body; through the arrangement of the downward pressing type surface mounting mechanism, the use amount of the conductive slurry can be accurately controlled, and excessive or insufficient conductive slurry possibly generated during manual operation is avoided, so that waste of the slurry is remarkably reduced, it is ensured that the conductive slurry is accurately dropwise added to a designated position only when needed, the utilization rate of the slurry is increased, and the production cost is reduced. And by reducing the waste of the conductive paste and improving the utilization rate, the production cost can be reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor chip processing, and in particular relates to a chip processing device. Background Art

[0002] Integrated circuits are an important part of the semiconductor industry. They are microelectronic devices that integrate transistors, resistors, capacitors and other components and connecting wires on a small semiconductor chip. This miniaturized structure has greatly promoted the development of miniaturization, low power consumption and high reliability of electronic equipment. Integrated circuits are widely used in various electronic devices and are the cornerstone of modern information technology.

[0003] In the processing of semiconductor chips, patch is a key link. At present, most patch devices use a traditional patch method: first, the chip is attached to a packaging substrate using a patch device through silver paste, and then the substrate is placed in a heating furnace for heating and insulation for a period of time to solidify the silver paste, thereby achieving chip fixation. Although this method is technically mature, there is an obvious efficiency bottleneck. Specifically, the traditional patch method requires a lot of time in the process turnover process. This process not only increases production costs, but also limits the overall production capacity of the production line. Summary of the invention

[0004] In order to solve the above problems, the present invention proposes a chip processing device.

[0005] The technical solution adopted by the present invention is as follows: The present invention provides a chip processing device, including a processing body, and a material unloading component arranged on the processing body, and also including a downward pressure patch mechanism and a drying mechanism, the downward pressure patch mechanism is arranged on the processing body, and the drying mechanism is arranged on the processing body; the downward pressure patch mechanism includes a patch component, a patch adsorption component, a pin dripping component and an air pressure supplement component, the patch component is arranged on the downward pressure patch mechanism, the patch adsorption component is arranged on the patch component, the pin dripping component is arranged in the patch component, and the air pressure supplement component is arranged on the patch component.

[0006] Furthermore, the processing body includes a processing table, the upper end of the processing table is provided with a processing cover, the processing table is provided with a base, the inner bottom end of the base is rotatably provided with a rotating tube, the upper end of the rotating tube is provided with a rotating table, the upper end of the base is provided with an annular slide groove, the upper end of the base is provided with a first sliding block sliding in the annular slide groove, the upper end of the first sliding block is connected to the lower end of the rotating table, the inner bottom end of the base is provided with a second motor, the output end of the second motor is provided with a bevel gear 1, the outer wall of the rotating tube is sleeved with a bevel gear 2, the bevel gear 1 and the bevel gear 2 are meshed and rotatably connected, a sliding rod is provided on the inner side wall of the processing cover, the outer side wall of the processing cover is provided with a first motor, one end of the first lead screw is installed on the output end of the first motor, the other end of the first lead screw is rotatably connected to the other inner side wall of the processing cover, the sliding rod is slidably sleeved with a moving block, the first lead screw is sleeved with a moving block, and the first lead screw and the moving block are threadedly connected.

[0007] Furthermore, the patch assembly includes a first lifting cylinder, which is arranged at the lower end of the moving block, and a patch cavity is provided at the output end of the first lifting cylinder, a partition is provided on the inner wall of the patch cavity, a conductive slurry storage cavity is provided above the partition, and the upper end of the patch cavity is connected to the liquid replenishment cavity.

[0008] The patch adsorption assembly includes a cavity, which is arranged at the lower end of the partition, and a first spring is arranged at the inner top end of the cavity, and the lower end of the first spring is connected to a piston, and a second slider is arranged at the lower end of the piston, and the lower end of the second slider is connected to a second connecting rod, and the lower end of the second connecting rod is connected to a vacuum hood, and the lower end of the vacuum hood is connected to the first suction cup through a through connection, and an air pump is arranged on the outer wall of the patch cavity, and the vacuum end of the air pump is connected to one end of a connecting pipe, and the other end of the connecting pipe is connected to the outer wall of the vacuum hood through a through connection, and a flow hole is opened on the partition, and the flow hole is arranged above the cavity, and the piston is slidably arranged on the inner wall of the cavity, and the second slider is slidably arranged on the inner wall of the cavity.

[0009] Furthermore, the drip assembly at the pin includes a liquid outlet cavity, the upper end of the liquid outlet cavity is connected to the partition, the upper end of the inner wall of the liquid outlet cavity is provided with a first connecting rod, the lower end of the inner wall of the liquid outlet cavity is provided with a first sealing plate, a first blocking hole is opened on the first sealing plate, the lower end of the first connecting rod is provided with a second spring, the lower end of the second spring is provided with a first sealing ball, the lower end of the liquid outlet cavity is connected to the output pipe, and the center of the first sealing ball is arranged below the first blocking hole.

[0010] Furthermore, the air pressure replenishing component includes a tube body, the lower end of the tube body is connected to the upper end of the fluid replenishing chamber, a fixing rod is provided at the upper end of the inner wall of the tube body, a second sealing plate is provided at the lower end of the inner wall of the tube body, a second blocking hole is opened on the second sealing plate, a third spring is provided at the lower end of the fixing rod, a second sealing ball is provided at the lower end of the third spring, and the center of the second sealing ball is arranged below the second blocking hole.

[0011] Furthermore, the drying mechanism includes a slurry heating component and a preheating component, the slurry heating component is arranged on the rotating table, and the preheating component is arranged on the processing cover.

[0012] Furthermore, the slurry heating component includes a patch mold, which is arranged at the upper end of the rotating table, and a substrate placement groove is provided in the patch mold, a first heating plate is provided at the inner bottom end of the substrate placement groove, a first heat conductive plate is provided at the upper end of the first heating plate, a fourth spring is provided at the inner top end of the first suction cup, a heat insulating plate is provided at the lower end of the fourth spring, a second heating plate is provided at the lower end of the heat insulating plate, and a second heat conductive plate is provided at the lower end of the second heating plate.

[0013] Furthermore, the preheating assembly includes a third motor, and a third motor is provided at the rear end of the side wall of the processing cover, and one end of the second lead screw is installed at the output end of the third motor, and the other end of the second lead screw is rotatably connected in the wall of the processing cover, and a sleeve is sleeved on the second lead screw, and the second lead screw and the sleeve are threadedly connected, and one side of the sleeve is connected to the patch moving plate, and the patch moving plate is provided with a patch placement groove, and a third heating plate is provided at the inner bottom end of the patch placement groove, and a third heat conductive plate is provided at the upper end of the third heating plate.

[0014] Furthermore, the unloading assembly includes a base, which is arranged on one side of the upper end of the processing table, and a fourth motor is provided at the inner bottom end of the base, and one end of an L-shaped rod is installed on the output end of the fourth motor, and a second lifting cylinder is provided on the lower side of the other end of the L-shaped rod, and an electric suction cup is provided at the output end of the second lifting cylinder.

[0015] The beneficial effects achieved by the present invention using the above structure are as follows: (1) The setting of the patch mold and the patch moving plate improves the curing efficiency of the patch and shortens the overall processing time through a two-step heating process of preheating and heating.

[0016] (2) The setting of the downward pressure patch mechanism can accurately control the amount of conductive paste, avoiding the excess or insufficient amount that may occur during manual operation, thereby significantly reducing the waste of paste.

[0017] (3) The setting of the downward pressure patch mechanism ensures that the conductive paste is accurately dripped to the designated location only when needed, which improves the utilization rate of the paste and enables each drop of paste to play the maximum effect.

[0018] (4) The setting of the downward pressure patch mechanism helps to reduce production costs by reducing conductive paste waste and improving utilization.

[0019] (5) The setting of the downward pressure patch mechanism reduces the need for manual intervention, thereby speeding up production. At the same time, since the conductive paste can reach the designated position accurately and quickly, it also helps to shorten the overall processing time.

[0020] (6) The setting of the downward pressure patch mechanism and the precise dripping of the conductive paste help ensure that the welding area on each substrate receives the same amount of paste, which enhances the consistency and reliability of the product and improves the quality of the final product.

[0021] (7) The patch adsorption component is set up, and the patch is adsorbed by the negative pressure in the first suction cup, which ensures the stability of the patch during movement and avoids the patch from falling off or being misplaced. At the same time, the patch is continuously heated by the second heating plate and the second thermal conductive plate, which helps the conductive paste to solidify quickly.

[0022] (8) During the patch process, the second heating plate continues to heat the patch, ensuring that the conductive paste can solidify quickly when it contacts the substrate, thereby improving the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the present invention, the accompanying drawings required for use in the description will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0024] Figure 1 This is a front view of a chip processing device of the present invention; Figure 2 This is a schematic diagram of the structure of a chip processing device of the present invention; Figure 3 It is a schematic diagram of the internal structure of the left wall of the processing cover; Figure 4 It is a schematic diagram of the structure of the downward pressure patch mechanism; Figure 5 for Figure 4 A partial enlarged view of part A; Figure 6 for Figure 4 A partial enlarged view of part B; Figure 7 for Figure 4A partial enlarged view of part C in the middle; Figure 8 It is a schematic diagram of the structure of the patch mold; Fig. 9 It is a schematic diagram of the structure of the patch moving board; Fig.10 This is a top view of the rotating table.

[0025] Among them, 1. processing body, 2. downward pressure patch mechanism, 3. drying mechanism, 4. unloading assembly, 5. processing table, 6. processing cover, 7. base, 8. rotating table, 9. rotating tube, 10. first motor, 11. first lead screw, 12. slide bar, 13. moving block, 14. second motor, 15. bevel gear one, 16. bevel gear two, 17. annular slide groove, 18. first slider, 19. patch assembly, 20. patch adsorption assembly, 21. drip assembly at pin, 22. air pressure supplement assembly, 23. first lifting cylinder, 24. patch cavity, 25. partition, 26. liquid replenishment cavity, 27. conductive slurry storage cavity, 28. cavity, 29. first spring, 30. second slider, 31. piston, 32. flow hole, 33. vacuum hood, 34. first suction cup, 35. air pump, 36. connecting pipe, 37. liquid outlet cavity, 38 , output tube, 39, first connecting rod, 40, second spring, 41, first sealing plate, 42, first sealing ball, 43, first plugging hole, 44, tube body, 45, fixing rod, 46, third spring, 47, second sealing plate, 48, second sealing ball, 49, second plugging hole, 50, slurry heating component, 51, preheating component, 52, substrate placement groove, 53, patch mold, 54, first thermal conductive plate, 55, first heating plate, 56, fourth spring, 57, second thermal conductive plate, 58, second heating plate, 59, third motor, 60, second lead screw, 61, sleeve, 62, patch moving plate, 63, patch placement groove, 64, third thermal conductive plate, 65, third heating plate, 66, fourth motor, 67, base, 68, L-shaped rod, 69, electric suction cup, 70, second lifting cylinder, 71, second connecting rod, 72, thermal insulation plate. DETAILED DESCRIPTION

[0026] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical scheme of the present invention will be clearly and completely described below in conjunction with the drawings in this specific embodiment. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] like Figure 1-Figure 10As shown, the present invention proposes a chip processing device, including a processing body 1, and a material unloading component 4 arranged on the processing body 1, and also includes a downward pressure type chip placement mechanism 2 and a drying mechanism 3, the downward pressure type chip placement mechanism 2 is arranged on the processing body 1, and the drying mechanism 3 is arranged on the processing body 1.

[0028] The processing body 1 includes a processing table 5, a processing cover 6, a base 7, a rotating table 8, a rotating tube 9, a first motor 10, a first lead screw 11, a slide bar 12, a moving block 13, a second motor 14, a bevel gear 15, a bevel gear 2 16, an annular slide 17 and a first slider 18. The upper end of the processing table 5 is provided with a processing cover 6, and the processing table 5 is provided with a base 7. The inner bottom end of the base 7 is rotatably provided with a rotating tube 9, and the upper end of the rotating tube 9 is provided with a rotating table 8. The upper end of the base 7 is provided with an annular slide 17, and the first slider 18 is slidably provided in the annular slide 17. The upper end of the first slider 18 is connected to the lower end of the rotating table 8. A second motor 14 is provided at the inner bottom end of 7, and a bevel gear 15 is provided at the output end of the second motor 14. A bevel gear 16 is sleeved on the outer wall of the rotating tube 9, and the bevel gear 15 and the bevel gear 16 are meshed and rotated to be connected. A slide bar 12 is provided on the inner wall of the processing cover 6, and a first motor 10 is provided on the outer wall of the processing cover 6. One end of the first lead screw 11 is installed on the output end of the first motor 10, and the other end of the first lead screw 11 is rotatably connected to the other inner wall of the processing cover 6. A moving block 13 is slidably sleeved on the slide bar 12, and the moving block 13 is sleeved on the first lead screw 11. The first lead screw 11 and the moving block 13 are threadedly connected.

[0029] The downward pressure patch mechanism 2 includes a patch component 19, a patch adsorption component 20, a pin drip component 21 and an air pressure supplement component 22. The patch component 19 is arranged on the downward pressure patch mechanism 2, the patch adsorption component 20 is arranged on the patch component 19, the pin drip component 21 is arranged in the patch component 19, and the air pressure supplement component 22 is arranged on the patch component 19.

[0030] The patch assembly 19 includes a first lifting cylinder 23, a patch cavity 24, a partition 25, a fluid replenishment cavity 26 and a conductive slurry storage cavity 27. The first lifting cylinder 23 is arranged at the lower end of the moving block 13. The patch cavity 24 is arranged at the output end of the first lifting cylinder 23. A partition 25 is arranged on the inner side wall of the patch cavity 24. A conductive slurry storage cavity 27 is arranged above the partition 25. The upper end of the patch cavity 24 is connected to the fluid replenishment cavity 26.

[0031] The patch adsorption assembly 20 includes a cavity 28, a first spring 29, a second slider 30, a piston 31, a flow hole 32, an exhaust cover 33, a first suction cup 34, an air pump 35, a connecting pipe 36 and a second connecting rod 71. The cavity 28 is arranged at the lower end of the partition 25, and the inner top of the cavity 28 is provided with a first spring 29, the lower end of the first spring 29 is connected to the piston 31, and the lower end of the piston 31 is provided with a second slider 30, and the lower end of the second slider 30 is connected to the second connecting rod 71. The second connecting rod 71 is provided with a second slider 30, and the second connecting rod 71 is provided with a second slider 30. The lower end of the rod 71 is connected to the vacuum hood 33, and the lower end of the vacuum hood 33 is connected to the first suction cup 34. An air pump 35 is provided on the outer wall of the patch cavity 24. The vacuum end of the air pump 35 is connected to one end of a connecting pipe 36, and the other end of the connecting pipe 36 is connected to the outer wall of the vacuum hood 33. A flow hole 32 is provided on the partition 25, and the flow hole 32 is provided above the cavity 28. The piston 31 is slidably provided on the inner wall of the cavity 28, and the second slider 30 is slidably provided on the inner wall of the cavity 28.

[0032] The drip assembly 21 at the pin includes a liquid outlet chamber 37, an output tube 38, a first connecting rod 39, a second spring 40, a first sealing plate 41, a first sealing ball 42 and a first blocking hole 43. The upper end of the liquid outlet chamber 37 is connected to the partition 25, the upper end of the inner wall of the liquid outlet chamber 37 is provided with a first connecting rod 39, the lower end of the inner wall of the liquid outlet chamber 37 is provided with a first sealing plate 41, the first blocking hole 43 is opened on the first sealing plate 41, the lower end of the first connecting rod 39 is provided with a second spring 40, the lower end of the second spring 40 is provided with a first sealing ball 42, the lower end of the liquid outlet chamber 37 is connected to the output tube 38, and the center of the first sealing ball 42 is arranged below the first blocking hole 43.

[0033] The air pressure replenishing component 22 includes a tube body 44, a fixed rod 45, a third spring 46, a second sealing plate 47, a second sealing ball 48 and a second blocking hole 49. The lower end of the tube body 44 is connected to the upper end of the fluid replenishing chamber 26. The upper end of the inner wall of the tube body 44 is provided with a fixed rod 45, the lower end of the inner wall of the tube body 44 is provided with a second sealing plate 47, and a second blocking hole 49 is opened on the second sealing plate 47. The lower end of the fixed rod 45 is provided with a third spring 46, and the lower end of the third spring 46 is provided with a second sealing ball 48. The center of the second sealing ball 48 is arranged below the second blocking hole 49.

[0034] The drying mechanism 3 includes a slurry heating component 50 and a preheating component 51 . The slurry heating component 50 is disposed on the rotating table 8 , and the preheating component 51 is disposed on the processing cover 6 .

[0035] The slurry heating component 50 includes a substrate placement groove 52, a patch mold 53, a first heat conductive sheet 54, a first heating sheet 55, a fourth spring 56, a second heat conductive sheet 57, a second heating sheet 58 and a heat insulating sheet 72. The patch mold 53 is arranged at the upper end of the rotating table 8. The patch mold 53 is provided with a substrate placement groove 52, the inner bottom end of the substrate placement groove 52 is provided with a first heating sheet 55, the upper end of the first heating sheet 55 is provided with a first heat conductive sheet 54, the inner top end of the first suction cup 34 is provided with a fourth spring 56, the lower end of the fourth spring 56 is provided with a heat insulating sheet 72, the lower end of the heat insulating sheet 72 is provided with a second heating sheet 58, and the lower end of the second heating sheet 58 is provided with a second heat conductive sheet 57.

[0036] The preheating assembly 51 includes a third motor 59, a second lead screw 60, a sleeve 61, a patch moving plate 62, a patch placement groove 63, a third heat conductive plate 64 and a third heating plate 65. The third motor 59 is provided at the rear end of the side wall of the processing cover 6, and one end of the second lead screw 60 is installed on the output end of the third motor 59. The other end of the second lead screw 60 is rotatably connected to the wall of the processing cover 6. The second lead screw 60 is sleeved with a sleeve 61, and the second lead screw 60 and the sleeve 61 are threadedly connected. One side of the sleeve 61 is connected to the patch moving plate 62, and a patch placement groove 63 is provided on the patch moving plate 62. The inner bottom end of the patch placement groove 63 is provided with a third heating plate 65, and the upper end of the third heating plate 65 is provided with a third heat conductive plate 64.

[0037] The unloading assembly 4 includes a fourth motor 66, a base 67, an L-shaped rod 68, an electric suction cup 69 and a second lifting cylinder 70. The base 67 is arranged on one side of the upper end of the processing table 5. The fourth motor 66 is provided at the inner bottom end of the base 67. One end of the L-shaped rod 68 is installed at the output end of the fourth motor 66. A second lifting cylinder 70 is provided on the lower side of the other end of the L-shaped rod 68. The output end of the second lifting cylinder 70 is provided with an electric suction cup 69.

[0038] When in use, first place the patch in the patch placement slot 63, start the third heating plate 65, the heat generated by the third heating plate 65 is transferred to the patch through the third heat conductive plate 64, and the patch is preheated, the substrate is placed in the substrate placement slot 52, the first heating plate 55 is started, the heat generated by the first heating plate 55 heats the substrate through the first heat conductive plate 54, the output end of the first motor 10 rotates to drive the first lead screw 11 to rotate, the rotation of the first lead screw 11 drives the moving block 13 to move, the movement of the moving block 13 drives the downward pressing patch mechanism 2 to move, the first suction cup 34 in the downward pressing patch mechanism 2 is aligned with the patch in the patch placement slot 63, the output end of the first lifting cylinder 23 moves downward to drive the patch cavity 24 to move downward, and the patch cavity 24 moves downward The first suction cup 34 is driven to move downward. When the first suction cup 34 moves downward, the air pump 35 and the second heating plate 58 are started, and the negative pressure generated in the first suction cup 34 is used to adsorb the patch. At this time, the fourth spring 56 is compressed, and the heat generated by the second heating plate 58 is used to continue to heat the patch through the second heat conductive plate 57. After the first lifting cylinder 23 is reset, the output end of the first motor 10 rotates, and the moving block 13 is reset. At this time, the patch adsorbed by the first suction cup 34 is aligned with the substrate in the substrate placement groove 52. The output end of the first lifting cylinder 23 moves downward to drive the cavity 28 to move downward. The cavity 28 moves downward to drive the first spring 29 to move downward. The first spring 29 moves downward to drive the piston 31 and the second slider 30 to move downward, thereby driving The second connecting rod 71 and the vacuum hood 33 move downward until the patch contacts the substrate. At this time, the output end of the first suction cup 34 continues to move downward. At this time, the first spring 29 is compressed, and the conductive slurry above the piston 31 enters the conductive slurry storage chamber 27 through the flow hole 32. At this time, the first sealing ball 42 is pushed open, and the second spring 40 is stretched. The conductive slurry enters the output pipe 38 through the first blocking hole 43 and drips on the connection between the welding area of ​​the substrate and the pin of the patch. Since both the substrate and the patch are in a heated state, the conductive slurry is quickly solidified. At this time, the air pump 35 is stopped, the first lifting cylinder 23 is reset, and then the first spring 29 is reset. Negative pressure is generated in the conductive slurry storage chamber 27, and the second sealing ball 48 is pushed downward. At this time, the third spring 46 is stretched, and the air is The air enters the liquid replenishing chamber 26 through the second blocking hole 49, the output end of the second motor 14 rotates to drive the bevel gear 15 to rotate, the bevel gear 15 rotates to drive the bevel gear 2 16 to rotate, the bevel gear 2 16 rotates to drive the rotating tube 9 to rotate, the rotating tube 9 rotates to drive the rotating table 8 to rotate, the rotating table 8 rotates to drive the patch mold 53 to rotate, and the patch mold 53 is rotated to the bottom of the second lifting cylinder 70, the output end of the electric suction cup 69 moves downward to drive the second lifting cylinder 70 to move downward, and the substrate after the patch is adsorbed and reset, and the output end of the fourth motor 66 rotates to drive the L-shaped rod 68 to rotate, and the substrate after the patch is placed in the collection box, the output end of the third motor 59 rotates to drive the second lead screw 60 to rotate, and the second lead screw 60 rotates to drive the sleeve 61 to move,The movement of the sleeve 61 drives the patch moving plate 62 to move, so that the position of the patch moving plate 62 can be adjusted forward and backward to facilitate the absorption of the patch. The above is the overall workflow of the present invention. Repeat this step next time you use it.

[0039] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip processing device, comprising a processing body (1), and a material unloading assembly (4) arranged on the processing body (1), characterized in that: The invention also comprises a downward pressure patch mechanism (2) and a drying mechanism (3), wherein the downward pressure patch mechanism (2) is arranged on the processing body (1), and the drying mechanism (3) is arranged on the processing body (1); the downward pressure patch mechanism (2) comprises a patch component (19), a patch adsorption component (20), a pin drop component (21) and an air pressure supplement component (22), wherein the patch component (19) is arranged on the downward pressure patch mechanism (2), the patch adsorption component (20) is arranged on the patch component (19), the pin drop component (21) is arranged in the patch component (19), and the air pressure supplement component (22) is arranged on the patch component (19).

2. A chip processing device according to claim 1, characterized in that: The processing body (1) comprises a processing table (5), the upper end of the processing table (5) is provided with a processing cover (6), the processing table (5) is provided with a base (7), the inner bottom end of the base (7) is provided with a rotating tube (9) for rotation, the upper end of the rotating tube (9) is provided with a rotating table (8), the upper end of the base (7) is provided with an annular slide groove (17), a first slider (18) is slidably provided in the annular slide groove (17), the upper end of the first slider (18) is connected to the lower end of the rotating table (8), the inner bottom end of the base (7) is provided with a second motor (14), the output end of the second motor (14) is provided with a bevel gear 1 (15), the A bevel gear 2 (16) is sleeved on the outer wall of the rotating tube (9), and the bevel gear 1 (15) and the bevel gear 2 (16) are meshed and rotatably connected. A sliding rod (12) is provided on the inner wall of the processing cover (6), and a first motor (10) is provided on the outer wall of the processing cover (6). One end of a first lead screw (11) is installed on the output end of the first motor (10), and the other end of the first lead screw (11) is rotatably connected to the other inner wall of the processing cover (6). A moving block (13) is slidably sleeved on the sliding rod (12), and the moving block (13) is sleeved on the first lead screw (11), and the first lead screw (11) and the moving block (13) are threadedly connected.

3. A chip processing device according to claim 2, characterized in that: The patch assembly (19) comprises a first lifting cylinder (23), the first lifting cylinder (23) being arranged at the lower end of the moving block (13), the output end of the first lifting cylinder (23) being provided with a patch cavity (24), a partition (25) being provided on the inner side wall of the patch cavity (24), a conductive paste storage cavity (27) being provided above the partition (25), and the upper end of the patch cavity (24) being connected to the liquid replenishing cavity (26).

4. A chip processing device according to claim 3, characterized in that: The patch adsorption assembly (20) comprises a cavity (28), wherein the cavity (28) is arranged at the lower end of the partition (25), a first spring (29) is arranged at the inner top end of the cavity (28), the lower end of the first spring (29) is connected to a piston (31), the lower end of the piston (31) is provided with a second slider (30), the lower end of the second slider (30) is connected to a second connecting rod (71), the lower end of the second connecting rod (71) is connected to an exhaust hood (33), and the lower end of the exhaust hood (33) is connected to the first connecting rod (71), and the lower end of the exhaust hood (33) is connected to the second connecting rod (71). A suction cup (34), an air pump (35) is provided on the outer wall of the patch cavity (24), an air suction end of the air pump (35) is connected to one end of a connecting pipe (36), the other end of the connecting pipe (36) is connected to the outer wall of the suction hood (33), a flow hole (32) is provided on the partition (25), the flow hole (32) is provided above the cavity (28), the piston (31) is slidably provided on the inner wall of the cavity (28), and the second slider (30) is slidably provided on the inner wall of the cavity (28).

5. A chip processing device according to claim 4, characterized in that: The pin-side drip assembly (21) comprises a liquid outlet cavity (37), the upper end of the liquid outlet cavity (37) is connected to the partition (25), the upper end of the inner wall of the liquid outlet cavity (37) is provided with a first connecting rod (39), the lower end of the inner wall of the liquid outlet cavity (37) is provided with a first sealing plate (41), a first blocking hole (43) is opened on the first sealing plate (41), the lower end of the first connecting rod (39) is provided with a second spring (40), the lower end of the second spring (40) is provided with a first sealing ball (42), the lower end of the liquid outlet cavity (37) is connected to the output pipe (38), and the center of the first sealing ball (42) is arranged below the first blocking hole (43).

6. A chip processing device according to claim 5, characterized in that: The air pressure replenishing component (22) includes a tube body (44), the lower end of the tube body (44) is connected to the upper end of the fluid replenishing chamber (26), a fixing rod (45) is provided at the upper end of the inner wall of the tube body (44), a second sealing plate (47) is provided at the lower end of the inner wall of the tube body (44), a second blocking hole (49) is opened on the second sealing plate (47), a third spring (46) is provided at the lower end of the fixing rod (45), a second sealing ball (48) is provided at the lower end of the third spring (46), and the center of the second sealing ball (48) is arranged below the second blocking hole (49).

7. A chip processing device according to claim 6, characterized in that: The drying mechanism (3) comprises a slurry heating component (50) and a preheating component (51); the slurry heating component (50) is arranged on a rotating table (8), and the preheating component (51) is arranged on a processing cover (6).

8. A chip processing device according to claim 7, characterized in that: The slurry heating component (50) comprises a patch mold (53), wherein the patch mold (53) is arranged at the upper end of the rotating table (8), wherein a substrate placement groove (52) is arranged in the patch mold (53), wherein a first heating plate (55) is arranged at the inner bottom end of the substrate placement groove (52), wherein a first heat conducting plate (54) is arranged at the upper end of the first heating plate (55), wherein a fourth spring (56) is arranged at the inner top end of the first suction cup (34), wherein a heat insulating plate (72) is arranged at the lower end of the fourth spring (56), wherein a second heating plate (58) is arranged at the lower end of the heat insulating plate (72), and wherein a second heat conducting plate (57) is arranged at the lower end of the second heating plate (58).

9. A chip processing device according to claim 8, characterized in that: The preheating assembly (51) comprises a third motor (59), the rear end of the side wall of the processing cover (6) is provided with the third motor (59), one end of a second lead screw (60) is mounted on the output end of the third motor (59), the other end of the second lead screw (60) is rotatably connected to the wall of the processing cover (6), a sleeve (61) is sleeved on the second lead screw (60), the second lead screw (60) and the sleeve (61) are threadedly connected, one side of the sleeve (61) is connected to a patch moving plate (62), a patch placement groove (63) is provided on the patch moving plate (62), a third heating plate (65) is provided at the inner bottom end of the patch placement groove (63), and a third heat conducting plate (64) is provided at the upper end of the third heating plate (65).

10. A chip processing device according to claim 9, characterized in that: The material unloading assembly (4) comprises a base (67), wherein the base (67) is arranged on one side of the upper end of the processing table (5), and a fourth motor (66) is arranged at the inner bottom end of the base (67), and one end of an L-shaped rod (68) is installed at the output end of the fourth motor (66), and a second lifting cylinder (70) is arranged at the lower side of the other end of the L-shaped rod (68), and an electric suction cup (69) is arranged at the output end of the second lifting cylinder (70).

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