Die bond feeding device and angle correction method thereof

Abstract

The invention discloses a die bonding and feeding device and an angle correction method thereof. The die bonding and feeding device comprises a film expanding mechanism, a die taking swing arm mechanism arranged above the film expanding mechanism, a first visual assembly arranged above the film expanding mechanism, and a second visual assembly arranged below a moving path of the die taking swing arm mechanism after material taking. The film expanding mechanism comprises a film expanding table, and a film expanding rotation driving module, an X-axis driving module and a Y-axis driving module which are sequentially arranged at the bottom of the film expanding table; the first visual assembly is used for detecting position information of a wafer on the film expanding table; the second visual assembly is used for detecting the position information of the wafer after the wafer taking swing arm mechanism takes the wafer. According to the die bonding feeding device provided by the invention, the swing arm lifting driving module is provided with a connecting rod structure, so that the structure is simple and easy to realize, and foreign matters can be effectively prevented from falling into die bonding products. In addition, the invention further provides an angle correction method of the die bonding feeding device, manual intervention is reduced in the automatic detection and correction process, and the die bonding quality problem caused by angle deviation and displacement deviation is avoided by accurately calculating deviation and compensating parameters.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and in particular to a solid crystal feeding device and an angle correction method thereof. Background Art

[0002] In the field of automated equipment technology, especially in the semiconductor packaging process, the die bonding feeder is a key part to achieve accurate wafer placement. As electronic devices develop towards miniaturization and high performance, the requirements for wafer placement accuracy are getting higher and higher.

[0003] In the existing die bonding feeding devices, the die removal manipulators are mostly driven by belts, which are prone to friction between the belts and pulleys, and the materials worn out by the belts are prone to fall into the die bonding products, affecting product quality. In addition, when processing wafers, the existing die bonding feeding devices often face problems with the angle and displacement deviation of the wafers, which may cause the wafers to not match the preset positions, thereby affecting the performance and yield of the entire semiconductor device. Summary of the invention

[0004] The purpose of the present invention is to provide a solid crystal feeding device, wherein the swing arm lifting drive module is simple and easy to implement by setting a connecting rod structure, and can effectively prevent foreign matter from falling into the solid crystal product; the swing arm module is provided with a buffer component, so that the material suction nozzle can flexibly contact the wafer when taking the wafer to avoid damaging the wafer. In addition, the present invention also provides an angle correction method for the solid crystal feeding device, and the automated detection and correction process reduces manual intervention, and avoids solid crystal quality problems caused by angle deviation and displacement deviation by accurately calculating deviations and compensation parameters.

[0005] In order to achieve the above purpose, the following technical solutions are adopted:

[0006] A solid crystal feeding device, comprising a film expansion mechanism, a crystal taking swing arm mechanism arranged above the film expansion mechanism, a first visual component arranged above the film expansion mechanism, and a second visual component arranged below the moving path of the crystal taking swing arm mechanism after taking the material; the film expansion mechanism comprises a film expansion table, and a film expansion rotation drive module, an X-axis drive module, and a Y-axis drive module arranged in sequence at the bottom of the film expansion table; the first visual component is used to detect the position information of the chip on the film expansion table; the second visual component is used to detect the position information of the chip after the crystal taking swing arm mechanism takes the material; the crystal taking swing arm mechanism comprises a swing arm module, a swing arm rotation drive module for driving the swing arm module to rotate, a swing arm lifting drive module for driving the swing arm module to lift, and a swing arm module arranged at the swing arm module. a material picking nozzle at the end; the power output end of the swing arm lifting drive module is connected to the first connecting frame, and the power output end of the swing arm rotation drive module is connected to the second connecting frame; the first connecting frame is detachably connected to the second connecting frame, and the swing arm module is detachably connected to the second connecting frame; the swing arm lifting drive module includes a connecting rod, a swing arm lifting drive motor, a rotating block connected to the swing arm lifting drive motor, and at least one first guide assembly for guiding the first connecting frame to rise and fall; the upper end of the connecting rod is rotatably connected to the rotating block, and the lower end of the connecting rod is rotatably connected to the first connecting frame; the swing arm lifting drive motor is used to drive the rotating block to drive the connecting rod to swing, so that the first connecting frame drives the swing arm module to rise and fall through the first guide assembly.

[0007] Preferably, the swing arm module includes a swing arm arranged in the horizontal direction, a swing arm frame provided between the swing arm and the second connecting frame, and a buffer assembly connected between the swing arm and the swing arm frame; the buffer assembly includes a buffer rod, a fixed block mounted on the top of the swing arm frame, and a buffer spring sleeved on the buffer rod; an opening is provided at one end of the swing arm frame for one end of the swing arm to extend into, and the height of the opening is slightly greater than the thickness of the end of the swing arm; the buffer rod vertically penetrates the fixed block, the swing arm frame, and the swing arm setting in sequence; a limit block is also provided on the upper part of the buffer rod, and the buffer spring abuts between the limit block and the swing arm.

[0008] Preferably, the film expanding platform includes a film expanding plate, a top plate, a film expanding lifting drive module, a bottom plate, and a film expanding ring that is sequentially arranged from top to bottom and moves through the film expanding plate and the top plate and is detachably connected to the film expanding lifting drive module; the film expanding lifting drive module includes a driving carrier plate, a film expanding lifting drive motor, a driving wheel connected to the film expanding lifting drive motor, a plurality of driven wheels spaced apart at the top of the driving carrier plate, a transmission belt connected between the driving wheel and the driven wheels, a lifting sleeve passing through the driven wheel, and a lifting slide rod slidably connected to the lifting sleeve; the lifting sleeve is fixedly connected to the top plate, and the lifting slide rod is fixedly connected to the bottom plate.

[0009] Preferably, the X-axis driving module and the Y-axis driving module both include a driving motor and a slide rail and slider assembly.

[0010] In addition, a method for correcting the angle of a solid crystal feeding device is provided, which is applied to the solid crystal feeding device and comprises the following steps:

[0011] Step S1: the film expansion stage stretches the blue film so that the horizontal and vertical spacings of the wafers carried on the blue film are expanded;

[0012] Step S2: The swing arm rotation driving module drives the swing arm module to drive the material taking nozzle to rotate above the film expansion table, and detects the position information of the wafer on the blue film through the first visual component;

[0013] Step S3: The background determines whether there is an angle deviation between the current position of the wafer and the preset position; if there is an angle deviation, the background calculates the angle deviation and controls the angle compensation; if there is no angle deviation, the process proceeds to step S4;

[0014] Step S4: the background determines whether there is a displacement deviation between the current position of the chip and the preset position; if there is a displacement deviation, the background calculates the displacement deviation and controls the displacement compensation; if there is no displacement deviation, the process proceeds to step S5;

[0015] Step S5: The swing arm lifting drive module drives the swing arm module to drive the material picking nozzle to descend, and the material picking nozzle rises after sucking the wafer;

[0016] Step S6: The swing arm rotation driving module drives the swing arm module to drive the material pickup nozzle to rotate and transfer the wafer. During the transfer process, the second visual component detects the position information of the wafer picked up by the material pickup nozzle;

[0017] Step S7: If the background determines that there is an angle and / or displacement deviation between the current position of the chip and the preset position, the chip is discarded; if the background determines that there is no angle and / or displacement deviation between the current position of the chip and the preset position, it is sent to the crystal bonding process.

[0018] Preferably, in step S3, after the background calculates the angle deviation, controlling the angle compensation includes the following steps:

[0019] Step S31: Compare the detected wafer angle position with the preset position and calculate the angle deviation:

[0020]

[0021] Step S32: Control the film expansion stage to rotate around the central axis by an angle θ through the film expansion rotation drive module to compensate for the wafer angle.

[0022] Preferably, in step S4, after the displacement deviation is calculated in the background, the displacement compensation is controlled, including the following steps:

[0023] Step S41: The detected chip displacement position P actual =(x actual ,y actual ) and the preset position P target =(x target ,y target ) to compare and calculate the displacement deviations Δx and Δy; where Δx = x target -x actual , Δy=y target -y actual ;

[0024] Step S42: Calculate the distance and direction that the film expansion platform needs to move according to the displacement deviation. Assume that the moving distances of the film expansion platform on the X-axis and Y-axis are d x and d y , and d x =k x· Δx, d y =k y· Δy, where k x and k y is the proportionality coefficient;

[0025] Step S43: Drive the film expansion platform to move horizontally by the X-axis driving module and the Y-axis driving module, so that the film expansion platform moves along the X-axis by d x Distance, move along the Y axis d y distance.

[0026] Preferably, in step S42, k x and k y The optimal value of is as follows:

[0027]

[0028] Among them, ω x and ω y are the natural frequencies of the X-axis drive module and the Y-axis drive module, ζ x and y They are the damping ratios of the X-axis drive module and the Y-axis drive module respectively.

[0029] By adopting the above scheme, the beneficial effects of the present invention are:

[0030] The present invention provides a solid crystal feeding device, wherein the swing arm lifting drive module is simple in structure and easy to implement by providing a connecting rod structure, and can effectively prevent foreign matter from falling into the solid crystal product. In a preferred embodiment, the swing arm module is provided with a buffer component so that the material taking nozzle can flexibly contact the wafer when taking the wafer to avoid damaging the wafer. In addition, the present invention also provides an angle correction method for a solid crystal feeding device, wherein the automated detection and correction process reduces manual intervention, and by accurately calculating deviations and compensation parameters, solid crystal quality problems caused by angle deviations and displacement deviations are avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A perspective view of the present invention;

[0032] Figure 2 A three-dimensional diagram of the crystal retrieval swing arm mechanism of the present invention;

[0033] Figure 3 An exploded view of the swing arm module of the present invention;

[0034] Figure 4 An exploded view of the film expansion mechanism of the present invention;

[0035] Figure 5 A three-dimensional diagram of the film expansion platform and the film expansion rotation drive module of the present invention;

[0036] The accompanying drawings illustrate:

[0037] 1—film expansion mechanism, 2—crystal taking swing arm mechanism,

[0038] 11—film expansion platform, 12—film expansion rotation drive module,

[0039] 13—X-axis drive module, 14—Y-axis drive module,

[0040] 21—swing arm module, 22—swing arm rotation drive module,

[0041] 23—swing arm lifting drive module, 24—material taking suction nozzle,

[0042] 25 - first connecting frame, 26 - second connecting frame,

[0043] 111 - expansion plate, 112 - top plate,

[0044] 113—film expansion lifting drive module, 114—bottom plate,

[0045] 115—expanding ring, 116—lifting sleeve,

[0046] 117—lifting slide bar, 211—swing arm,

[0047] 212—swing arm frame, 213—buffer rod,

[0048] 214—fixed block, 215—buffer spring,

[0049] 216—limit block, 231—connecting rod,

[0050] 232—swing arm lifting drive motor, 233—rotating block,

[0051] 234—First guide assembly. DETAILED DESCRIPTION

[0052] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0053] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0054] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0055] Reference Figures 1 to 5As shown, the present invention provides a solid crystal feeding device, including a film expansion mechanism 1, a crystal taking swing arm mechanism 2 arranged above the film expansion mechanism 1, a first visual component arranged above the film expansion mechanism 1, and a second visual component arranged below the moving path of the crystal taking swing arm mechanism 2 after taking the material; the film expansion mechanism 1 includes a film expansion platform 11, and a film expansion rotation drive module 12, an X-axis drive module 13, and a Y-axis drive module 14 arranged at the bottom of the film expansion platform 11 in sequence; the first visual component is used to detect the position information of the wafer on the film expansion platform 11; the second visual component is used to detect the position information of the wafer after the crystal taking swing arm mechanism 2 takes the material; specifically, the first visual component and the second visual component both include a camera, a lens, a light source, a visual system, etc. The film expansion rotation drive module 12 includes a film expansion rotation shaft arranged at the bottom of the film expansion platform 11, and a film expansion rotation drive motor used to drive the film expansion rotation shaft to rotate.

[0056] Among them, the crystal retrieval swing arm mechanism 2 includes a swing arm module 21, a swing arm rotation drive module 22 for driving the swing arm module 21 to rotate, a swing arm lifting drive module 23 for driving the swing arm module 21 to rise and fall, and a material retrieval nozzle 24 arranged at the end of the swing arm module 21; specifically, the swing arm rotation drive module 22 includes a swing arm rotation shaft connected to the second connecting frame 26, and a swing arm rotation drive motor drivingly connected to the swing arm rotation shaft.

[0057] The power output end of the swing arm lifting drive module 23 is connected to the first connecting frame 25, and the power output end of the swing arm rotation drive module 22 is connected to the second connecting frame 26; the first connecting frame 25 and the second connecting frame 26 are detachably connected, and the swing arm module 21 and the second connecting frame 26 are detachably connected; specifically, the cross-sections of the first connecting frame 25 and the second connecting frame 26 are both L-shaped, the L-shaped vertical end of the first connecting frame 25 is arranged opposite to the L-shaped vertical end of the second connecting frame 26, the L-shaped horizontal end of the first connecting frame 25 is stacked on the bottom of the L-shaped horizontal end of the second connecting frame 26, and the swing arm module 21 and the L-shaped vertical end of the second connecting frame 26 are detachably connected.

[0058] The swing arm lifting drive module 23 includes a connecting rod 231, a swing arm lifting drive motor 232, a rotating block 233 drivingly connected to the swing arm lifting drive motor 232, and at least one first guide component 234 for guiding the first connecting frame 25 to rise and fall; the upper end of the connecting rod 231 is rotatably connected to the rotating block 233, and the lower end of the connecting rod 231 is rotatably connected to the first connecting frame 25; the swing arm lifting drive motor 232 is used to drive the rotating block 233 to drive the connecting rod 231 to swing, so that the first connecting frame 25 drives the swing arm module 21 to rise and fall through the first guide component 234.

[0059] Furthermore, the crystal retrieval swing arm mechanism 2 also includes a third connecting frame, and the cross section of the third connecting frame is an inverted L-shaped structure. The swing arm rotation drive module 22 is arranged on the inverted L-shaped horizontal end of the third connecting frame, and the swing arm lifting drive module 23 is arranged on the inverted L-shaped vertical end of the third connecting frame. In a specific embodiment, the first guide assembly 234 is provided in two pieces and is installed on both sides of the connecting rod 231. The first guide assembly 234 includes a first roller guide fixed to the third connecting frame, and a second roller guide fixed to the first connecting frame 25. When the swing arm lifting drive motor 232 drives the connecting rod 231 to move, the connecting rod 231 drives the first connecting frame 25 to cooperate with the first roller guide through the second roller guide to achieve the lifting movement of the swing arm module 21.

[0060] Among them, the swing arm module 21 includes a swing arm 211 arranged in the horizontal direction, a swing arm frame 212 arranged between the swing arm 211 and the second connecting frame 26, and a buffer component connected between the swing arm 211 and the swing arm frame 212; the buffer component includes a buffer rod 213, a fixed block 214 mounted on the top of the swing arm frame 212, and a buffer spring 215 sleeved on the buffer rod 213; one end of the swing arm frame 212 is provided with an opening for one end of the swing arm 211 to extend into, and the height of the opening is slightly greater than the thickness of the end of the swing arm 211; when the material picking nozzle 24 picks up the chip, the opening at one end of the swing arm frame 212 reserves space for the swing arm 211 to move up and down, and by setting the buffer component, the rigid contact between the material picking nozzle 24 and the chip is converted into flexible contact to avoid accidental damage to the chip during material picking. The buffer rod 213 is vertically inserted into the fixing block 214 , the swing arm frame 212 , and the swing arm 211 in sequence; a limit block 216 is also provided on the upper portion of the buffer rod 213 , and the buffer spring 215 abuts between the limit block 216 and the swing arm 211 .

[0061] The film expansion platform 11 includes a film expansion plate 111, a top plate 112, a film expansion lifting driving module 113, and a bottom plate 114, which are arranged in sequence from top to bottom, and a film expansion ring 115 that moves through the film expansion plate 111 and the top plate 112 in sequence and is detachably connected to the film expansion lifting driving module 113; the film expansion lifting driving module 113 includes a driving carrier, a film expansion lifting driving motor, a driving wheel connected to the film expansion lifting driving motor, a plurality of driven wheels arranged at intervals on the top of the driving carrier, a transmission belt connected between the driving wheel and the driven wheel, a lifting sleeve 16 arranged through the driven wheel, and a lifting slide bar 117 slidably connected to the lifting sleeve 116; the lifting sleeve 116 is fixedly connected to the top plate 112, and the lifting slide bar 117 is fixedly connected to the bottom plate 114. The film expansion lifting driving motor drives the driving wheel to rotate, and the lifting sleeve 116 can be lifted and slid relative to the lifting slide bar 117. When the film expansion lifting drive motor drives the lifting sleeve 116 to make the top plate 112 drive the film expansion plate 111 to descend, the blue film loaded on the film expansion plate 111 is blocked by the film expansion ring 115 below it, and the blue film will be stretched to the surroundings by an appropriate amount after being subjected to force, and the horizontal and vertical spacing of the wafers carried on the blue film will be expanded accordingly. When the film expansion plate 111 descends to a suitable height, the film expansion lifting drive motor stops running, and the expanded blue film is tightened on the film expansion ring 115.

[0062] The X-axis driving module 13 and the Y-axis driving module 14 both include a driving motor and a slide rail and slider assembly.

[0063] In addition, a method for correcting the angle of a solid crystal feeding device is provided, which is applied to the solid crystal feeding device and comprises the following steps:

[0064] Step S1: the film expansion stage 11 is operated to stretch the blue film so that the horizontal and vertical spacings of the wafers carried on the blue film are expanded;

[0065] Step S2: The swing arm rotation driving module 22 drives the swing arm module 21 to drive the material taking nozzle 24 to rotate to the top of the film expansion platform 11, and detects the position information of the wafer on the blue film through the first visual component;

[0066] Step S3: The background determines whether there is an angle deviation between the current position of the wafer and the preset position; if there is an angle deviation, the background calculates the angle deviation and controls the angle compensation; if there is no angle deviation, the process proceeds to step S4;

[0067] Furthermore, after the background calculates the angle deviation, the control for angle compensation includes the following steps:

[0068] Step S31: Compare the detected wafer angle position with the preset position and calculate the angle deviation:

[0069]

[0070] Step S32: The film expansion stage 11 is controlled to rotate around the central axis by an angle θ through the film expansion rotation drive module 12 to compensate for the wafer angle.

[0071] Step S4: the background determines whether there is a displacement deviation between the current position of the chip and the preset position; if there is a displacement deviation, the background calculates the displacement deviation and controls the displacement compensation; if there is no displacement deviation, the process proceeds to step S5;

[0072] Furthermore, after the background calculates the displacement deviation, the control to perform displacement compensation includes the following steps:

[0073] Step S41: The detected chip displacement position P actual =(x actual ,y actual ) and the preset position P target =(x target ,y target ) to compare and calculate the displacement deviations Δx and Δy; where Δx = x target -x actual , Δy=y target -y actual ;

[0074] Step S42: Calculate the distance and direction that the film expansion platform 11 needs to move according to the displacement deviation. Assume that the moving distances of the film expansion platform 11 on the X-axis and Y-axis are d x and d y , and d x =k x· Δx, d y =k y· Δy, where k x and k y is the proportionality coefficient;

[0075] Step S43: Drive the film expansion platform 11 to move horizontally by the X-axis driving module 13 and the Y-axis driving module 14, so that the film expansion platform 11 moves along the X-axis by d x Distance, move along the Y axis d y distance.

[0076] Step S5: The swing arm lifting driving module 23 drives the swing arm module 21 to drive the material taking suction nozzle 24 to descend, and the material taking suction nozzle 24 rises after sucking the wafer;

[0077] Step S6: The swing arm rotation driving module 22 drives the swing arm module 21 to drive the material pickup nozzle 24 to rotate and transfer the wafer. During the transfer process, the second visual component detects the position information of the wafer sucked by the material pickup nozzle 24;

[0078] Step S7: If the background determines that there is an angle and / or displacement deviation between the current position of the chip and the preset position, the chip is discarded; if the background determines that there is no angle and / or displacement deviation between the current position of the chip and the preset position, it is sent to the crystal bonding process.

[0079] Furthermore, in step S42, k x and k y The optimal value of is as follows:

[0080]

[0081] Among them, ω x and ω y are the natural frequencies of the X-axis drive module 13 and the Y-axis drive module 24, respectively, x and y They are the damping ratios of the X-axis driving module 13 and the Y-axis driving module 14 respectively.

[0082] Proportional coefficient k x and k y The selection of needs to comprehensively consider factors such as equipment characteristics, system stability, correction accuracy, response speed and adjustability. Adjustability can be adjusted according to different equipment characteristics and correction requirements to ensure that the solid crystal feeding device can efficiently and accurately perform displacement correction. By determining the optimal value of the proportional coefficient, the following beneficial effects are achieved: 1) ensuring that the system remains stable during displacement correction; 2) ensuring the accuracy of displacement compensation and improving the accuracy of solid crystal; 3) improving the response speed of the system, thereby improving production efficiency.

[0083] In a specific embodiment, k is determined x and k y The optimal value method is as follows:

[0084] 1) System modeling: A mathematical model of the solid crystal feeding device is established, including the dynamic characteristics of the X-axis driving module 13 and the Y-axis driving module 14, and the system state variables of position, velocity and acceleration are set.

[0085] 2) Response analysis: Analyze the system's dynamic response in terms of overshoot, oscillation frequency and settling time under different proportional coefficients, and use transfer functions to describe the system's response.

[0086] 3) Parameter optimization: According to the results of the system response analysis, the optimization goal is to minimize the stabilization time, determine the optimal value of the proportional coefficient, and ensure the correction accuracy. Use the following formula to calculate the optimal value of the proportional coefficient:

[0087]

[0088] Among them, ω x and ω yare the natural frequencies of the X-axis drive module 13 and the Y-axis drive module 14, respectively, x and y They are the damping ratios of the X-axis driving module 13 and the Y-axis driving module 14 respectively.

[0089] 4) Experimental verification: Conduct experiments on actual die bonding feeders to verify the optimal value of the proportional coefficient. Adjust the proportional coefficient based on the experimental results until the system stability and calibration accuracy requirements are met.

[0090] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention. Obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A solid crystal feeding device, characterized in that: It includes a film expanding mechanism, a crystal taking swing arm mechanism arranged above the film expanding mechanism, a first visual component arranged above the film expanding mechanism, and a second visual component arranged below the moving path of the crystal taking swing arm mechanism after taking the material; the film expanding mechanism includes a film expanding table, and a film expanding rotation drive module, an X-axis drive module, and a Y-axis drive module arranged at the bottom of the film expanding table in sequence; the first visual component is used to detect the position information of the chip on the film expanding table; the second visual component is used to detect the position information of the chip after the crystal taking swing arm mechanism takes the material; the crystal taking swing arm mechanism includes a swing arm module, a swing arm rotation drive module for driving the swing arm module to rotate, a swing arm lifting drive module for driving the swing arm module to lift, and a taking material suction nozzle; the power output end of the swing arm lifting drive module is connected to the first connecting frame, and the power output end of the swing arm rotation drive module is connected to the second connecting frame; the first connecting frame is detachably connected to the second connecting frame, and the swing arm module is detachably connected to the second connecting frame; the swing arm lifting drive module includes a connecting rod, a swing arm lifting drive motor, a rotating block driven and connected to the swing arm lifting drive motor, and at least one first guide assembly for guiding the first connecting frame to rise and fall; the upper end of the connecting rod is rotatably connected to the rotating block, and the lower end of the connecting rod is rotatably connected to the first connecting frame; the swing arm lifting drive motor is used to drive the rotating block to drive the connecting rod to swing, so that the first connecting frame drives the swing arm module to rise and fall through the first guide assembly.

2. The solid crystal feeding device according to claim 1, characterized in that: The swing arm module includes a swing arm arranged in the horizontal direction, a swing arm frame arranged between the swing arm and the second connecting frame, and a buffer assembly connected between the swing arm and the swing arm frame; the buffer assembly includes a buffer rod, a fixed block mounted on the top of the swing arm frame, and a buffer spring sleeved on the buffer rod; an opening is provided at one end of the swing arm frame for one end of the swing arm to extend into, and the height of the opening is slightly greater than the thickness of the end of the swing arm; the buffer rod vertically penetrates the fixed block, the swing arm frame, and the swing arm setting in sequence; a limit block is also provided on the upper part of the buffer rod, and the buffer spring abuts between the limit block and the swing arm.

3. The solid crystal feeding device according to claim 1, characterized in that: The film expanding platform includes a film expanding plate, a top plate, a film expanding lifting drive module, and a bottom plate which are arranged in sequence from top to bottom, and a film expanding ring which moves through the film expanding plate and the top plate in sequence and is detachably connected to the film expanding lifting drive module; the film expanding lifting drive module includes a driving carrier plate, a film expanding lifting drive motor, a driving wheel connected to the film expanding lifting drive motor, a plurality of driven wheels arranged at intervals on the top of the driving carrier plate, a transmission belt connected between the driving wheel and the driven wheels, a lifting sleeve arranged through the driven wheel, and a lifting slide rod slidably connected to the lifting sleeve; the lifting sleeve is fixedly connected to the top plate, and the lifting slide rod is fixedly connected to the bottom plate.

4. The solid crystal feeding device according to claim 1, characterized in that: The X-axis driving module and the Y-axis driving module both include a driving motor and a slide rail and slider assembly.

5. A method for correcting the angle of a solid crystal feeding device, characterized in that: The die bonding feeding device according to any one of claims 1 to 4 comprises the following steps: Step S1: the film expansion stage stretches the blue film so that the horizontal and vertical spacings of the wafers carried on the blue film are expanded; Step S2: The swing arm rotation driving module drives the swing arm module to drive the material taking nozzle to rotate above the film expansion table, and detects the position information of the wafer on the blue film through the first visual component; Step S3: The background determines whether there is an angle deviation between the current position of the wafer and the preset position; if there is an angle deviation, the background calculates the angle deviation and controls the angle compensation; if there is no angle deviation, the process proceeds to step S4; Step S4: the background determines whether there is a displacement deviation between the current position of the chip and the preset position; if there is a displacement deviation, the background calculates the displacement deviation and controls the displacement compensation; if there is no displacement deviation, the process proceeds to step S5; Step S5: The swing arm lifting drive module drives the swing arm module to drive the material picking nozzle to descend, and the material picking nozzle rises after sucking the wafer; Step S6: The swing arm rotation driving module drives the swing arm module to drive the material pickup nozzle to rotate and transfer the wafer. During the transfer process, the second visual component detects the position information of the wafer picked up by the material pickup nozzle; Step S7: If the background determines that there is an angle and / or displacement deviation between the current position of the chip and the preset position, the chip is discarded; if the background determines that there is no angle and / or displacement deviation between the current position of the chip and the preset position, it is sent to the crystal bonding process.

6. The angle correction method of the die bonding feeding device according to claim 5, characterized in that: In step S3, after the background calculates the angle deviation, the control is performed to perform angle compensation, including the following steps: Step S31: Compare the detected wafer angle position with the preset position and calculate the angle deviation: Step S32: Control the film expansion stage to rotate around the central axis by an angle θ through the film expansion rotation drive module to compensate for the wafer angle.

7. The angle correction method of the die bonding feeding device according to claim 5, characterized in that: After the displacement deviation is calculated in the background in step S4, the displacement compensation is controlled, including the following steps: Step S41: The detected chip displacement position P actual =(x actual ,y actual ) and the preset position P target =(x target ,y target ) to compare and calculate the displacement deviations Δx and Δy; where Δx = x target -x actual , Δy=y target -y actual ; Step S42: Calculate the distance and direction that the film expansion platform needs to move according to the displacement deviation. Assume that the moving distances of the film expansion platform on the X-axis and Y-axis are d x and d y , and d x =k x· Δx, d y =k y· Δy, where k x and k y is the proportionality coefficient; Step S43: Drive the film expansion platform to move horizontally by the X-axis driving module and the Y-axis driving module, so that the film expansion platform moves along the X-axis by d x Distance, move along the Y axis d y distance.

8. The angle correction method of the die bonding feeding device according to claim 7, characterized in that: In step S42, k x and k y The optimal value of is as follows: Among them, ω x and ω y are the natural frequencies of the X-axis drive module and the Y-axis drive module, ζ x and y They are the damping ratios of the X-axis drive module and the Y-axis drive module respectively.

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