A heat dissipation device with a microchannel heat sink

Abstract

The present invention discloses a heat dissipation device with a microchannel radiator, specifically relating to the technical field of cooling devices, including a housing. A cabinet door is rotatably connected to the front end of the housing. An isolation pad is fixedly connected to the bottom wall of the inner cavity of the housing. An installation box is fixedly connected to the front part of the upper end of the isolation pad. A cooling structure is jointly arranged at the left and right ends and the rear end of the installation box. A temperature reduction structure is arranged at the rear end of the cooling structure. For the heat dissipation device with a microchannel radiator of the present invention, due to the action of the temperature reduction structure and the principle of heat convection, the coolant in the cooling structure circulates. Then, the heat generated by the operation of the installation box is carried into the temperature reduction structure. The coolant is cooled by the action of the temperature reduction structure. The cooled coolant continues to circulate in the cooling structure, and its heat is dissipated into the air through the temperature reduction structure. The installation box is evenly cooled by the cooling structure, reducing the failure rate and ensuring the stable operation of the equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of cooling devices, and particularly relates to a heat dissipation device with a microchannel radiator. Background Art

[0002] With the continuous increase in power demand, the heat dissipation management problem of power distribution cabinets has become increasingly important. As an important part of the power system, the temperature control effect of power cabinets directly affects the safety and reliability of the system. A large amount of heat is generated by electrical components inside power cabinets during long-term operation. Especially in summer, due to the narrow space inside power cabinets, it is not only unfavorable for construction personnel to repair and process the inside of the substation box, but also makes it difficult for the heat inside the substation box to dissipate into the air. It is very easy for electrical components inside the substation box to be damaged due to high temperature or for circuit connection wires to short-circuit due to high temperature, greatly increasing the usage hazards of conventional power cabinets.

[0003] Currently, the structure of power cabinets is relatively simple. When encountering a relatively hot environment, the temperature inside the power cabinet is not easily dissipated. The electrical equipment inside the power cabinet accelerates aging under the action of high temperature, and the failure rate increases. Some heat dissipation devices of power cabinets dissipate heat through water cooling, but water cooling will generate a large amount of water vapor and water droplets, which need to be collected and processed. Since there are control lines and the like inside the power cabinet, direct water cooling will pose certain safety hazards.

[0004] Due to the narrow space inside the power cabinet, it is not conducive to heat dissipation into the air, causing components inside the power cabinet to be damaged due to high temperature or circuit connection wires to malfunction due to high temperature; some heat dissipation devices of power cabinets dissipate heat through water cooling, and under high-temperature environmental conditions, their heat dissipation effect will be greatly reduced, and the heat dissipation effect is average. Summary of the Invention

[0005] The main purpose of the present invention is to provide a heat dissipation device with a microchannel radiator, which can effectively solve the problems of uneven heat dissipation, low cooling efficiency, and low heat exchange efficiency existing in existing devices.

[0006] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0007] A heat dissipation device with a microchannel radiator, including a housing, a cabinet door is rotatably connected to the front end of the housing, an isolation pad is fixedly connected to the bottom wall of the inner cavity of the housing, an installation box is fixedly connected to the front part of the upper end of the isolation pad, a cooling structure is arranged at the left, right, and rear ends of the installation box, and a temperature reduction structure is arranged at the rear end of the cooling structure.

[0008] Preferably, the cooling structure includes a back plate fixed to the inner cavity of the outer shell and closely attached to the rear end of the installation box. On the front end of the back plate, side contact components are symmetrically and fixedly connected on the left and right. On the upper part of the rear end of the back plate, a second communication pipe communicating with the two side contact components is provided. On the lower part of the rear end of the back plate, a return pipe communicating with the two side contact components is provided. The rear ends of the return pipe and the second communication pipe are both communicated with the temperature reduction structure.

[0009] Preferably, the side contact component includes a side plate attached to the side wall of the installation box. On the inner surface of the side plate, a number of heat exchange components are linearly distributed. On the upper side of the inner surface of the side plate, water supply pipes communicating with the second communication pipe are symmetrically provided on the left and right. The left and right sides of a number of the heat exchange components are both communicated with the water supply pipe on the same side. On the rear part of the inner surface of a number of the heat exchange components, a warm water pipe communicating with the return pipe is jointly provided.

[0010] Preferably, the heat exchange component includes a Z-shaped heat exchange groove. On the part of the inner surface of the side plate below the Z-shaped heat exchange groove, a cold water pipe communicating with the adjacent water supply pipe is provided. At the connection of the cold water pipe and the water supply pipe, spring support rings are fixedly connected. At one end of the two spring support rings away from each other, a T-shaped piston valve slidingly connected to the inner surface of the cold water pipe is fixedly connected. On the front and rear sides of the T-shaped piston valve, through holes communicating with the rear end are provided. On the upper part of the inner surface of the cold water pipe, a number of communication pipes one communicating with the inner cavity of the Z-shaped heat exchange groove are linearly distributed. The Z-shaped heat exchange groove located in the upper part and the Z-shaped heat exchange groove located in the lower part overlap left and right, and on the side of the inner surface of the Z-shaped heat exchange groove away from the installation box, they are both communicated with the warm water pipe.

[0011] Preferably, a swirl cap is rotatably connected to the upper end of the communication pipe one. On the inner surface of the swirl cap, a number of spiral grooves communicating with the outer surface are annularly distributed.

[0012] Preferably, heat exchange pipes are symmetrically provided on the left and right on the inner surface of the back plate. The upper sides of the two heat exchange pipes are both communicated with the second communication pipe. The lower sides of the two heat exchange pipes are both communicated with the return pipe. At the connection of the two heat exchange pipes and the return pipe, one-way valves are fixedly connected.

[0013] Preferably, the temperature reduction structure includes a temperature reduction box fixedly connected to the rear end of the back plate and a circulation pump fixedly connected to the bottom wall of the inner cavity of the temperature reduction box. At the lower front end of the temperature reduction box, a water pipe one communicating with the return pipe is fixedly connected. One end of the water pipe one away from the back plate is connected to the input side of the circulation pump and extends to the upper part of the inner cavity of the water pipe two and is fixedly connected with an overflow component. At the upper front end of the temperature reduction box, a water pipe two communicating with the output end of the circulation pump is provided. On the inner surface of the temperature reduction box, a number of baffles are linearly and fixedly connected. The rear ends of the number of baffles are jointly fixedly connected with a semiconductor refrigeration sheet.

[0014] Preferably, the overflow assembly includes branch pipes linearly distributed and fixedly connected to the side of the cooling box. A plurality of the branch pipes are all communicated with the first water pipe, and overflow ports communicated with their inner cavities are opened at the upper ends of the plurality of branch pipes.

[0015] Preferably, a plurality of diversion grooves are linearly distributed and opened at the upper ends of the baffles, and the diversion grooves on adjacent two baffles are staggered with each other in the vertical direction.

[0016] Preferably, a plurality of heat dissipation fins are linearly distributed and fixedly connected to the hot end of the semiconductor refrigeration sheet. A cooling box is fixedly connected to the rear end of the cooling box. An air outlet penetrating through the rear part of the inner cavity of the housing and communicated with the rear end of the housing is opened at the upper part of the rear end of the cooling box. A plurality of fans are linearly distributed and fixedly connected to the rear end of the cooling box. An air inlet is opened at the position corresponding to the fan on the rear end of the housing. A mesh plate communicating the inner cavities of the cooling box and the cooling box is fixedly installed at the lower part of the rear end of the cooling box. A plurality of capillary holes penetrating through the front and rear and provided with one-way valves are opened on the surface of the mesh plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present invention performs heat exchange with the inner wall of the installation box through the cooperation of the cooling structure and the installation box, and makes the coolant in the cooling structure circulate through the action of the cooling structure and the principle of heat convection, and then carries the heat generated by the operation of the installation box into the cooling structure. The coolant is cooled through the action of the cooling structure, and the cooled coolant continues to circulate in the cooling structure, and its heat is dissipated into the air through the cooling structure. The installation box is evenly cooled by the cooling structure, thereby ensuring that the temperature in the installation box is within a safe range, reducing the failure rate, and ensuring the stability of the equipment operation.

[0019] The present invention performs contact heat dissipation with the installation box through the Z-shaped heat exchange groove opened in the side contact assembly, and promotes the circulation of the coolant in the Z-shaped heat exchange groove through the action of the water supply pipe and the warm water pipe. Further, the swirl cap arranged in the Z-shaped heat exchange groove promotes the flow of the coolant in the Z-shaped heat exchange groove to form a jet swirl, thereby accelerating the movement of the molecules in the coolant, accelerating its heat exchange rate, and promoting the heat exchange efficiency of the coolant through the side plate and the installation box, so as to improve the heat dissipation efficiency and ensure that the temperature in the installation box is within a safe range.

[0020] The present invention sends the high-temperature coolant to the upper layer of the cooling box through the cooperation of the first water pipe and the circulating pump, and evenly distributes it into the cooling box through the action of the overflow assembly to form a water curtain. The coolant circulates in the cooling box in cooperation with the baffle and the diversion grooves opened on the upper side thereof, and is cooled in cooperation with the baffle and the semiconductor refrigeration sheet. The cooled coolant is sent into the second connecting pipe through the action of the first water pipe and the second water pipe, so as to promote the circulation of the coolant in the second connecting pipe, keep the coolant in a low-temperature state, and ensure that the cooling structure can continuously dissipate heat from the installation box. Brief Description of the Drawings

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 It is a schematic diagram of the positional relationship between the isolation pad and the housing of the present invention;

[0023] Figure 3 It is a schematic diagram of the structure of the cooling structure of the present invention;

[0024] Figure 4 It is a schematic diagram of the structure of the side contact assembly of the present invention;

[0025] Figure 5 It is a schematic diagram of the structure of the heat exchange component of the present invention;

[0026] Figure 6 It is a schematic diagram of the positional relationship between the T-shaped piston valve and the water supply pipe of the present invention;

[0027] Figure 7 It is a schematic diagram of the structure of the swirl cap of the present invention;

[0028] Figure 8 It is a schematic sectional view of the back plate of the present invention;

[0029] Figure 9 It is a schematic diagram of the structure of the temperature reduction structure of the present invention;

[0030] Figure 10 For the present invention Figure 9 Schematic enlarged view of the partial structure at A;

[0031] Figure 11 It is a schematic diagram of the structure of the cooling box of the present invention.

[0032] In the figure: 1. Housing; 2. Cabinet door; 3. Installation box; 4. Cooling structure; 41. Side contact assembly; 411. Side plate; 412. Heat exchange component; 4121. Z-shaped heat exchange groove; 4122. Cold water pipe; 4123. T-shaped piston valve; 4124. Swirl cap; 4125. Spiral groove; 4126. First communication pipe; 4127. Spring support ring; 413. Water supply pipe; 414. Warm water pipe; 42. Back plate; 422. Heat exchange pipe; 423. Check valve; 43. Second communication pipe; 44. Return pipe; 5. Temperature reduction structure; 51. Temperature reduction box; 52. First water pipe; 53. Circulation pump; 54. Semiconductor refrigeration sheet; 541. Cooling box; 542. Air outlet; 543. Heat dissipation fin; 544. Fan; 545. Mesh plate; 55. Baffle; 56. Flow guide groove; 57. Second water pipe; 58. Overflow assembly; 581. Branch pipe; 582. Overflow port; 6. Isolation pad. Detailed Description of the Invention

[0033] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0034] Example 1, as Figure 1 and Figure 2 shown, a heat dissipation device with a microchannel heat sink includes a housing 1, a cabinet door 2 is rotatably connected to the front end of the housing 1, an isolation pad 6 is fixedly connected to the bottom wall of the inner cavity of the housing 1, an installation box 3 is fixedly connected to the front part of the upper end of the isolation pad 6, a cooling structure 4 is arranged at the left and right ends and the rear end of the installation box 3 together, and a temperature reduction structure 5 is arranged at the rear end of the cooling structure 4.

[0035] Among them, the isolation pad 6 is used to lift the installation box 3. The isolation pad 6 has a certain water absorption capacity to avoid damage to the equipment in the installation box 3 caused by leakage of internal coolant due to external impact or other impacts.

[0036] During the operation of this embodiment, first, heat exchange is carried out with the inner wall of the installation box 3 through the cooperation of the cooling structure 4 and the installation box 3, and the coolant in the cooling structure 4 is circulated through the action of the temperature reduction structure 5 and the principle of heat convection. Then, the heat generated by the operation of the installation box 3 is carried into the temperature reduction structure 5. The coolant is cooled through the action of the temperature reduction structure 5, and the cooled coolant continues to circulate in the cooling structure 4. Its heat is dissipated into the air through the temperature reduction structure 5, and the installation box 3 is evenly cooled through the cooling structure 4, thereby ensuring that the temperature in the installation box 3 is within a safe range, reducing the failure rate, and ensuring the stability of the equipment operation.

[0037] Example 2, on the basis of Example 1, this embodiment conducts contact heat dissipation with the installation box 3 through the Z-shaped heat exchange groove 4121 opened in the side contact component 41, and promotes the circulation of the coolant in the Z-shaped heat exchange groove 4121 through the action of the water supply pipe 413 and the warm water pipe 414. Further, the swirl cap 4124 arranged in the Z-shaped heat exchange groove 4121 promotes the flow of the coolant in the Z-shaped heat exchange groove 4121 to form a jet swirl, thereby accelerating the movement of molecules in the coolant, accelerating its heat exchange rate, and promoting the heat exchange efficiency between the coolant and the installation box 3 through the side plate 411, so as to improve the heat dissipation efficiency and ensure that the temperature in the installation box 3 is within a safe range.

[0038] Specifically, in order to achieve contact heat exchange with the equipment, refer to Figure 3, the cooling structure 4 includes a back plate 42 fixed to the inner cavity of the housing 1 and closely attached to the rear end of the installation box 3. On the front end of the back plate 42, side contact components 41 are symmetrically and fixedly connected on the left and right. On the upper part of the rear end of the back plate 42, a second connecting pipe 43 communicating with the two side contact members 41 is provided. On the lower part of the rear end of the back plate 42, a return pipe 44 communicating with the two side contact members 41 is provided. The rear ends of the return pipe 44 and the second connecting pipe 43 are both connected to the temperature reduction structure 5.

[0039] The back plate 42 is in contact with the rear side of the installation box 3, and heat exchange is thus carried out from the rear side of the installation box 3. Synchronously, the second connecting pipe 43 and the return pipe 44 connected to the two side contact components 41 on both sides promote the circulation of the coolant in the back plate 42 and the side contact components 41, so as to keep the installation box 3 in a low-temperature operating state. At the same time, the second connecting pipe 43 and the return pipe 44 cooperate with the temperature reduction structure 5 to keep the coolant in a low-temperature state.

[0040] Furthermore, to achieve contact heat exchange with the side wall of the device and ensure that the temperature is within a safe range, refer to Figure 4 、 Figure 5 、 Figure 6 and Figure 8 , the side contact component 41 includes a side plate 411 attached to the side wall of the installation box 3. On the inner surface of the side plate 411, a number of heat exchange components 412 are linearly distributed. On the upper side of the inner surface of the side plate 411, a water supply pipe 413 communicating with the second connecting pipe 43 is symmetrically provided on the left and right. The left and right sides of a number of heat exchange components 412 are both connected to the water supply pipe 413 on the same side. On the rear part of the inner surface of a number of heat exchange components 412, a warm water pipe 414 communicating with the return pipe 44 is jointly provided.

[0041] The side plate 411 is a copper plate and is attached to the side wall of the installation box 3. The heat exchange components 412 provided on its inner side are filled with coolant, and the circulation of the coolant is realized through the water supply pipe 413 and the warm water pipe 414, so as to keep the coolant in the heat exchange components 412 in a low-temperature state and ensure the heat exchange efficiency with the installation box 3.

[0042] Furthermore, to achieve heat exchange between the coolant and the device and promote the flow of the coolant in the Z-shaped heat exchange groove 4121, and further promote the heat exchange rate, refer to Figure 5 、 Figure 6 and Figure 7, the heat exchange component 412 includes a Z-shaped heat exchange groove 4121. A cold water pipe 4122 communicating with the adjacent water supply pipe 413 is provided on the inner surface of the side plate 411 at the lower side of the Z-shaped heat exchange groove 4121. Spring support rings 4127 are fixedly connected to the joints of the cold water pipe 4122 and the water supply pipe 413. T-shaped piston valves 4123 slidably connected to the inner surface of the cold water pipe 4122 are fixedly connected to the mutually remote ends of the two side spring support rings 4127. Through holes communicating with the rear end are provided on both the front and rear sides of the T-shaped piston valve 4123. A plurality of first communication pipes 4126 communicating with the inner cavity of the Z-shaped heat exchange groove 4121 are linearly distributed on the upper part of the inner surface of the cold water pipe 4122. The upper Z-shaped heat exchange groove 4121 and the lower Z-shaped heat exchange groove 4121 overlap left and right, and the sides of the inner surface of the Z-shaped heat exchange groove 4121 away from the installation box 3 are both communicated with the warm water pipe 414; a swirl cap 4124 is rotatably connected to the upper end of the first communication pipe 4126, and a plurality of spiral grooves 4125 communicating with the outer surface are annularly distributed on the inner surface of the swirl cap 4124.

[0043] The Z-shaped heat exchange groove 4121 is a vertical Z shape. The front vertical parts and the rear vertical parts of two adjacent Z-shaped heat exchange grooves 4121 overlap. Due to the molecular thermal effect and the principle of heat convection, the high-temperature liquid will flow relatively upward. Therefore, the temperature in the Z-shaped heat exchange groove 4121 will be stratified, which can be regarded as two chambers with different temperatures. Among them, the side of the upper Z-shaped heat exchange groove 4121 away from the installation box 3 is communicated with the warm water pipe 414. Among them, the high-temperature coolant will overflow from the warm water pipe 414 and return to the return pipe 44 through the warm water pipe 414;

[0044] During this process, the water supply pipe 413 will continuously supply coolant to the cold water pipe 4122. When in use, the coolant in the water supply pipe 413 is full. Only when the water supply pipe 413 is filled with coolant can the pressure of the spring support ring 4127 on the T-shaped piston valve 4123 be offset, the T-shaped piston valves 4123 in all the cold water pipes 4122 be pushed open and enter the cold water pipe 4122, and then enter the swirl cap 4124 through the first communication pipe 4126. The coolant in the swirl cap 4124 will be ejected outward along the path of the spiral groove 4125 under the action of pressure. At the same time, since the path of the spiral groove 4125 is spiral, the ejected water flow has an initial angle, which will stir the coolant originally in the Z-shaped heat exchange groove 4121 to generate swirl, accelerate the molecular collision rate, thereby improving the heat exchange efficiency between the coolant and the side plate 411, and further increasing the cooling rate of the side plate 411 to the installation box 3.

[0045] Further, to achieve heat exchange with the device from the rear and assist the coolant circulation, refer to Figure 8, on the inner surface of the back plate 42, heat exchange tubes 422 are symmetrically arranged on the left and right. The upper sides of the two heat exchange tubes 422 are both connected to the second connecting pipe 43, and the lower sides of the two heat exchange tubes 422 are both connected to the return pipe 44. One-way valves 423 are fixedly connected to the joints of the two heat exchange tubes 422 and the return pipe 44.

[0046] In addition to being diverted to the side contact assembly 41, the coolant in the second connecting pipe 43 also enters the heat exchange tubes 422, and the heat exchange between the heat exchange tubes 422 and the back plate 42 cools the installation box 3 from the rear side of the installation box 3, thereby assisting the side contact assembly 41 to cool and dissipate heat from the installation box 3.

[0047] Embodiment 3: On the basis of Embodiment 2, this embodiment further sends the high-temperature coolant to the upper layer of the cooling box 51 through the cooperation of the first water pipe 52 and the circulation pump 53. Through the action of the overflow assembly 58, it is evenly distributed into the cooling box 51 to form a water curtain. The cooperation of the baffle 55 and the diversion groove 56 opened on its upper side enables the coolant to circulate in the cooling box 51, and the baffle 55 and the semiconductor refrigeration chip 54 cooperate to cool down. The cooled coolant is sent into the second connecting pipe 43 through the action of the first water pipe 52 and the second water pipe 57, promoting the circulation of the coolant in the second connecting pipe 43, keeping the coolant in a low-temperature state, and ensuring that the cooling structure 4 can continuously dissipate heat from the installation box 3.

[0048] Specifically, to cool down the coolant, refer to Figure 9 and Figure 10 , the cooling structure 5 includes a cooling box 51 fixedly connected to the rear end of the back plate 42 and a circulation pump 53 fixedly connected to the bottom wall of the inner cavity of the cooling box 51. The lower part of the front end of the cooling box 51 is fixedly connected with a first water pipe 52 communicating with the return pipe 44. One end of the first water pipe 52 away from the back plate 42 is connected to the input side of the circulation pump 53 and extends to the upper part of the inner cavity of the second water pipe 57 and is fixedly connected with an overflow assembly 58. The upper part of the front end of the cooling box 51 is provided with a second water pipe 57 communicating with the output end of the circulation pump 53. A plurality of baffles 55 are linearly and fixedly connected to the inner surface of the cooling box 51, and a semiconductor refrigeration chip 54 is fixedly connected to the common rear end of the plurality of baffles 55.

[0049] It should be particularly noted that the above-mentioned circulation pump 53 is a conventional double-input and double-output water pump in the prior art, which can suck the high-temperature coolant and send it to the upper side of the cooling box 51 through the first water pipe 52, and absorb the coolant at the bottom of the cooling box 51 and send it into the second connecting pipe 43 through the second water pipe 57. This structure has been widely used in the prior art. In the present invention, only its function of promoting the circulation of the coolant is utilized, and its internal structure, operating principle, wiring, and control method will not be elaborated further.

[0050] Furthermore, to make the coolant flow downward evenly, refer to Figure 10, the overflow assembly 58 includes branch pipes 581 linearly distributed and fixedly connected to the side of the cooling box 51. A plurality of branch pipes 581 are all connected to the first water pipe 52. Overflow ports 582 communicating with their inner cavities are provided at the upper ends of the plurality of branch pipes 581; a plurality of diversion grooves 56 are linearly distributed and provided at the upper ends of the baffles 55, and the diversion grooves 56 on adjacent two baffles 55 are staggered with each other in the vertical direction.

[0051] The semiconductor refrigeration sheet 54 is used to cool the coolant in the cooling box 51 through the baffle 55. The diversion grooves 56 provided in the upper part of the baffle 55 can extend the flowing time of the coolant in the cooling box 51, improve the cooling efficiency, and ensure that the coolant returned to the second connecting pipe 43 is in a low-temperature state;

[0052] Furthermore, by the action of the second water pipe 57 and the overflow assembly 58, the coolant is evenly fed into the branch pipes 581 and overflows through the overflow ports 582. The overflowed coolant is no longer scattered and discontinuous, but can form a water curtain, so as to be laid flat above the baffle 55, ensuring the contact area between the coolant and the baffle 55 and improving the cooling efficiency of the coolant.

[0053] Furthermore, to achieve the cooling of the coolant and ensure that the semiconductor refrigeration sheet 54 is in an efficient cooling state, refer to Figure 11 , a plurality of heat dissipation fins 543 are linearly distributed and fixedly connected to the hot end of the semiconductor refrigeration sheet 54. A cooling box 541 is fixedly connected to the rear end of the cooling box 51. An air outlet 542 penetrating through the rear part of the inner cavity of the housing 1 and communicating with the rear end of the housing 1 is provided at the upper part of the rear end of the cooling box 541. A plurality of fans 544 are linearly distributed and fixedly connected to the rear end of the cooling box 541. An air inlet is provided at the rear end of the housing 1 corresponding to the position where the fans 544 are located. A mesh plate 545 connecting the cooling box 541 and the inner cavity of the cooling box 51 is fixedly installed at the lower part of the rear end of the cooling box 51. A plurality of capillary holes penetrating through the front and rear and installed with one-way valves are provided on the surface of the mesh plate 545.

[0054] When the semiconductor refrigeration sheet 54 is in use, heat will be generated at its hot end. If the hot end is not continuously cooled, the refrigeration efficiency of its cold end cannot be guaranteed. Therefore, heat dissipation fins 543 are installed at its hot end, air is blown into the cooling box 541 through the fans 544, and the air flow is driven to flow between the heat dissipation fins 543 and the hot air is discharged through the air outlet 542 to maintain the cooling efficiency of the cold end of the semiconductor refrigeration sheet 54;

[0055] Synchronous. The air intake rate of the fan 544 is greater than the air outlet rate of the air outlet 542, which will generate a certain pressure in the cooling box 541. These pressures will enter the inner cavity of the cooling box 51 through the micropores opened on the mesh plate 545, forming bubbles in the coolant in the cooling box 51. These bubbles will follow the coolant into the cooling structure 4, thereby further accelerating the molecular movement of the coolant in the Z-shaped heat exchange groove 4121 through the agitation and rupture of the bubbles, thus accelerating the heat exchange efficiency. To avoid excessive pressure, a through hole communicating with the cooling box 541 is opened above the cooling box 51, and a one-way valve is installed in the through hole for releasing the pressure in the cooling box 51.

[0056] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device with a microchannel heat sink, comprising a housing, a cabinet door is rotatably connected to the front end of the housing, an isolation pad is fixedly connected to the bottom wall of the inner cavity of the housing, and an installation box is fixedly connected to the front part of the upper end of the isolation pad, characterized in that: A cooling structure is jointly arranged at the left and right ends and the rear end of the installation box, and a temperature reduction structure is arranged at the rear end of the cooling structure; The cooling structure includes a back plate fixed to the inner cavity of the housing and closely attached to the rear end of the installation box, and side contact components are symmetrically and fixedly connected to the front end of the back plate on the left and right; The side contact component includes a side plate that fits against the side wall of the installation box, and a number of heat exchange components are linearly distributed on the inner surface of the side plate; The heat exchange component includes a Z-shaped heat exchange groove. A cold water pipe communicating with an adjacent water supply pipe is arranged on the part of the inner surface of the side plate below the Z-shaped heat exchange groove. A number of communication pipes one communicating with the inner cavity of the Z-shaped heat exchange groove are linearly distributed on the upper part of the inner surface of the cold water pipe. The Z-shaped heat exchange groove located in the upper part and the Z-shaped heat exchange groove located in the lower part overlap left and right, and the side of the inner surface of the Z-shaped heat exchange groove away from the installation box is communicated with a warm water pipe; The Z-shaped heat exchange grooves are vertically distributed. The front vertical parts and the rear vertical parts of two adjacent Z-shaped heat exchange grooves overlap, and the side away from the side plate is at a high position; A swirl cap is rotatably connected to the upper end of the communication pipe one, and a number of spiral grooves communicating with the outer surface are annularly distributed on the inner surface of the swirl cap; A communication pipe two communicating with the side contact components on both sides is arranged in the upper part of the rear end of the back plate, and a return pipe communicating with the side contact components on both sides is arranged in the lower part of the rear end of the back plate. The rear ends of the return pipe and the communication pipe two are both communicated with the temperature reduction structure; Water supply pipes communicating with the communication pipe two are symmetrically arranged on the upper side of the inner surface of the side plate on the left and right. The left and right sides of a number of the heat exchange components are communicated with the water supply pipe on the same side, and a warm water pipe communicating with the return pipe is jointly arranged on the rear part of the inner surface of a number of the heat exchange components; Spring support rings are fixedly connected to the joints of the cold water pipes and the water supply pipes. T-shaped piston valves that are slidably connected to the inner surface of the cold water pipes are fixedly connected to the ends of the two spring support rings away from each other. Through holes communicating with the rear end are arranged on the front and rear sides of the T-shaped piston valves; The temperature reduction structure includes a temperature reduction box fixedly connected to the rear end of the back plate and a circulation pump fixedly connected to the bottom wall of the inner cavity of the temperature reduction box. A water pipe one communicating with the return pipe is fixedly connected to the lower part of the front end of the temperature reduction box. One end of the water pipe one away from the back plate is connected to the input side of the circulation pump and extends to the upper part of the inner cavity of the water pipe two and is fixedly connected with an overflow component. A water pipe two communicating with the output end of the circulation pump is arranged in the upper part of the front end of the temperature reduction box. A number of baffles are fixedly connected to the inner surface of the temperature reduction box in a linear distribution, and a semiconductor refrigeration sheet is fixedly connected to the rear ends of a number of the baffles; The overflow component includes branch pipes fixedly connected to the side surface of the temperature reduction box in a linear distribution. A number of the branch pipes are all communicated with the water pipe one. Overflow ports communicating with their inner cavities are arranged at the upper ends of a number of the branch pipes. A number of diversion grooves are linearly distributed at the upper ends of the baffles, and the diversion grooves on two adjacent baffles are staggered in the vertical direction; 2. The heat dissipation device with a microchannel heat sink according to claim 1, wherein: Heat exchange pipes are symmetrically arranged on the inner surface of the back plate. The upper sides of the two heat exchange pipes are both communicated with the communication pipe two, and the lower sides of the two heat exchange pipes are both communicated with the return pipe. Check valves are fixedly connected to the joints of the two heat exchange pipes and the return pipe.

3. The heat dissipation device with a microchannel heat sink according to claim 1, wherein: A number of heat dissipation fins are fixedly connected to the hot end of the semiconductor refrigeration chip in a linear distribution. A cooling box is fixedly connected to the rear end of the temperature reduction box. An air outlet is provided at the upper part of the rear end of the cooling box, which penetrates through the rear part of the inner cavity of the housing and communicates with the rear end of the housing. A number of fans are fixedly connected to the rear end of the cooling box in a linear distribution. An air inlet is provided at the rear end of the housing corresponding to the position where the fans are located. A mesh plate communicating with the inner cavities of the cooling box and the temperature reduction box is fixedly installed at the lower part of the rear end of the temperature reduction box. A number of capillary pores that penetrate through the front and rear and are equipped with one-way valves are provided on the surface of the mesh plate.

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