Multifunctional intelligent power module
By integrating multifunctional circuits and separate design of high and low pins in the intelligent power module, the problems of single functions, poor anti-interference ability and low reliability are solved, and higher integration, fewer pin counts, smaller product area and lower cost are achieved, while improving the stability and reliability of the system.
Patent Information
- Application Number
- CN202411954756.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-04-11
AI Technical Summary
The existing intelligent power module has single functions, poor anti-interference ability, and complex pin layout, resulting in poor reliability and complex design, which increases design cycle and project costs.
Design a multi-function intelligent power module, integrating inverter controller circuit, rectifier, PFC driver circuit, driver IC chip and bootstrap circuit, and setting the interval between the high-voltage pin zone and the low-voltage pin zone. Through a circuit design with higher integration and more functions, the number of pins is achieved, the number of pins, the product area is smaller, and the cost is lower.
Through the separation design of high and low pins, the anti-interference and reliability are improved, the circuit wiring is optimized, the driving loop area is reduced, the interference source is reduced, the system is more stable and reliable, the design cycle is shortened and the manufacturing cost is reduced.
Smart Images
Figure CN119813786A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of intelligent power modules, and in particular to a multifunctional intelligent power module. Background Art
[0002] Intelligent Power Module (IPM) is a power drive product that combines power electronics and integrated circuit technology. It has the advantages of high current, low saturation voltage and high withstand voltage of GTR (high power transistor), and the advantages of high input impedance, high switching frequency and low driving power of MOSFET (field effect transistor). In addition, IPM integrates logic, control, detection and protection circuits, which is easy to use. It not only reduces the size of the system and shortens the development time, but also enhances the reliability of the system, adapting to the development direction of today's power devices.
[0003] At present, domestic and foreign modules only have inverter functions, and the internal requirements are relatively simple compared to the application requirements, which leads to complex design of the peripheral main control board, inconvenient for miniaturization of the main control board, and increases the client's design cycle and project cost. In addition, the high and low voltage pins of the module are staggered, and power devices are naturally designed to work in a high-voltage and high-current environment. When power devices work at high voltage, low voltage, high frequency, and low frequency, they are prone to crosstalk, false triggering failures, and reliability impact.
[0004] However, with the maturity of electronic control solutions in various fields, how to reduce costs under the premise of miniaturization, intelligence, improved performance, and guaranteed reliability and consistency to form cost-effectiveness and competitiveness has become an important issue. Therefore, based on the single function of the current intelligent power module, the design of the peripheral main control board is complicated, which is not convenient for the miniaturization design of the main control board, and increases the client's design cycle and project cost. When the power device works at high voltage, low voltage, high frequency, and low frequency, it is easy to produce crosstalk, false triggering failures, and affect reliability operation. Summary of the invention
[0005] The present invention provides a multifunctional intelligent power module, aiming to solve the problems of poor anti-interference ability, complex pin layout and poor reliability of the existing multifunctional intelligent power module.
[0006] An embodiment of the present invention provides a multifunctional intelligent power module, comprising: a metal substrate board, an inverter controller circuit, a rectifier, a PFC drive circuit, a drive IC chip, and a bootstrap circuit integrated on the metal substrate board; a high-voltage pin area and a low-voltage pin area are provided on one side of the metal substrate board, the high-voltage pin area is spaced from the low-voltage pin area, and the high-voltage pin area is used to connect a load motor;
[0007] The first end of the inverter controller circuit is used to connect to the power supply, the second end of the inverter controller circuit is used to connect to the driver IC chip, the third end of the inverter controller circuit is connected to the first end of the bootstrap circuit, and the PFC drive circuit is used to connect the power supply and the driver IC chip; the second end of the bootstrap circuit is respectively connected to the second end of the inverter controller circuit and the driver IC chip, and the third end of the bootstrap circuit is used to connect to the high-voltage pin area;
[0008] The rectifier is used to connect to an AC power source and rectify and output the AC power source to form the power supply.
[0009] Preferably, the inverter controller circuit includes a first inverter bridge circuit, a second inverter bridge circuit and a third inverter bridge circuit, the first end of the first inverter bridge circuit is respectively connected to the first end of the second inverter bridge circuit and the first end of the third inverter bridge circuit and then connected to the power supply, the second end of the first inverter bridge circuit, the second end of the second inverter bridge circuit and the second end of the third inverter bridge circuit are respectively connected to the driving IC chip; the third end of the first inverter bridge circuit is respectively connected to the third end of the second inverter bridge circuit and the third end of the third inverter bridge circuit.
[0010] Preferably, the first inverter bridge circuit includes a first upper bridge arm and a first lower bridge arm, the second inverter bridge circuit includes a second upper bridge arm and a second lower bridge arm, and the third inverter circuit includes a third upper bridge arm and a third lower bridge arm;
[0011] The drain of the first upper bridge arm serves as the first end of the first inverter bridge circuit, the drain of the second upper bridge arm serves as the first end of the second inverter bridge circuit, the drain of the third upper bridge arm serves as the first end of the third inverter bridge circuit, the source of the first upper bridge arm is connected to the drain of the first lower bridge arm, the source of the second upper bridge arm is connected to the drain of the second lower bridge arm, the source of the third upper bridge arm is connected to the drain of the third lower bridge arm, the source of the first lower bridge arm is connected to the source of the second lower bridge arm and the source of the third lower bridge arm and serves as the third end of the first inverter bridge circuit, the third end of the second inverter bridge circuit and the third end of the third inverter bridge circuit respectively; the gate of the first upper bridge arm, the gate of the second upper bridge arm and the gate of the third upper bridge arm serve as the second end of the first inverter bridge circuit, the second end of the second inverter bridge circuit and the second end of the third inverter bridge circuit respectively; the gate of the first lower bridge arm, the gate of the second lower bridge arm and the gate of the third lower bridge arm are connected to the driving IC chip respectively.
[0012] Preferably, the bootstrap circuit comprises a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor and a sixth capacitor;
[0013] The first end of the first capacitor and the first end of the fourth capacitor are respectively connected to the source of the first upper bridge arm, and the second end of the first capacitor and the second end of the fourth capacitor are connected to the driver IC chip;
[0014] The first end of the second capacitor and the first end of the fifth capacitor are respectively connected to the source of the second upper bridge arm, and the second end of the second capacitor and the second end of the fifth capacitor are connected to the driver IC chip;
[0015] The first end of the third capacitor and the first end of the sixth capacitor are respectively connected to the source of the third upper bridge arm, and the second end of the third capacitor and the second end of the sixth capacitor are connected to the driver IC chip.
[0016] Preferably, the PFC drive circuit includes a first diode and a fourth upper bridge arm, the anode of the first diode is connected to the drain of the fourth upper bridge arm, the cathode of the first diode and the source of the fourth upper bridge arm are respectively connected to the power supply, and the gate of the fourth upper bridge arm is connected to the drive IC chip.
[0017] Preferably, the rectifier includes a second diode, a third diode, a fourth diode and a fifth diode; the anode of the second diode is connected to the anode of the third diode, the cathode of the second diode is connected to the anode of the fourth diode, the cathode of the third diode is connected to the anode of the fifth diode, the cathode of the fourth diode is connected to the cathode of the fifth diode, and the cathode of the second diode and the cathode of the third diode are used to connect to the power supply.
[0018] Preferably, the multifunctional intelligent power module further comprises a module plastic package body, and the module plastic package body is fixed to the outer side of the metal substrate plate.
[0019] Preferably, the high-voltage pin area is provided with a plurality of high-voltage pins, the low-voltage pin area is provided with a plurality of low-voltage pins, and the load motor is connected to the plurality of high-voltage pins.
[0020] Compared with the prior art, the beneficial effect of the present invention is that a high-voltage pin area and a low-voltage pin area are provided on one side of the metal substrate plate, the high-voltage pin area and the low-voltage pin area are arranged at intervals, and the high-voltage pin area is used to connect the load motor; the first end of the inverter controller circuit is used to connect the power supply, the second end of the inverter controller circuit is used to connect to the driver IC chip, the third end of the inverter controller circuit is connected to the first end of the bootstrap circuit, and the PFC drive circuit is used to connect the power supply and the driver IC chip; the second end of the bootstrap circuit is respectively connected to the second end of the inverter controller circuit and the driver IC chip, and the third end of the bootstrap circuit is used to connect to the high-voltage pin area; the rectifier is used to connect the AC power supply and rectify the AC power supply to form the power supply. In this way, the rectifier, power factor correction, and inverter integrated intelligent power module have good integration; and the high and low pins are separated. Under the premise of higher integration and more functions, fewer pins, smaller product area, and lower cost can be achieved, which can effectively shorten the design cycle, reduce the number of assembly workers at the manufacturing end, and improve energy efficiency, so as to achieve gain and efficiency improvement. The high and low pins are separated to improve the anti-interference performance; the circuit wiring is optimized, the driving loop area is reduced, and the interference source is reduced, so that the system can work more stably and reliably. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The present invention will be described in detail below in conjunction with the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. In the accompanying drawings:
[0022] Figure 1 is a schematic diagram of the structure of a multifunctional intelligent power module provided by an embodiment of the present invention;
[0023] Figure 2 It is a control logic diagram of a multifunctional intelligent power module provided by an embodiment of the present invention. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0025] Combined with Figure 1-Figure 2 As shown, an embodiment of the present invention provides a multifunctional intelligent power module, including: a metal substrate plate 409, an inverter controller circuit 2, a rectifier 208, a PFC drive circuit 206, a drive IC chip 207 and a bootstrap circuit 3 integrated on the metal substrate plate 409; a high-voltage pin area 4 and a low-voltage pin area 5 are provided on one side of the metal substrate plate 409, the high-voltage pin area 4 is spaced apart from the low-voltage pin area 5, and the high-voltage pin area 4 is used to connect a load motor 408.
[0026] The first end of the inverter controller circuit 2 is used to connect the power supply VCC, the second end of the inverter controller circuit 2 is used to connect to the driver IC chip 207, the third end of the inverter controller circuit 2 is connected to the first end of the bootstrap circuit 3, and the PFC drive circuit 206 is used to connect the power supply VCC and the driver IC chip 207; the second end of the bootstrap circuit 3 is respectively connected to the second end of the inverter controller circuit 2 and the driver IC chip 207, and the third end of the bootstrap circuit 3 is used to connect to the high-voltage pin area 4; the rectifier 208 is used to connect the AC power supply and rectify the AC power supply to form the power supply VCC. By adopting a separate design for high and low pins, under the premise of higher integration and more functions, fewer pins, smaller product area, and lower cost can be achieved, which can effectively shorten the design cycle, reduce the number of assembly workers at the manufacturing end, and improve energy efficiency, so as to achieve gain and efficiency improvement. By adopting a separate design for high and low pins, the anti-interference performance is better; and the circuit wiring is optimized.
[0027] In this embodiment, the inverter controller circuit 2 includes a first inverter bridge circuit 21, a second inverter bridge circuit 22 and a third inverter bridge circuit 23. The first end of the first inverter bridge circuit 21 is respectively connected to the first end of the second inverter bridge circuit 22 and the first end of the third inverter bridge circuit 23 and then connected to the power supply VCC. The second end of the first inverter bridge circuit 21, the second end of the second inverter bridge circuit 22 and the second end of the third inverter bridge circuit 23 are respectively connected to the driving IC chip 207; the third end of the first inverter bridge circuit 21 is respectively connected to the third end of the second inverter bridge circuit 22 and the third end of the third inverter bridge circuit 23.
[0028] In this embodiment, the first inverter bridge circuit 21 includes a first upper bridge arm 200 and a first lower bridge arm 203, the second inverter bridge circuit 22 includes a second upper bridge arm 201 and a second lower bridge arm 204, and the third inverter circuit includes a third upper bridge arm 202 and a third lower bridge arm 205; the drain of the first upper bridge arm 200 serves as the first end of the first inverter bridge circuit 21, the drain of the second upper bridge arm 201 serves as the first end of the second inverter bridge circuit 22, the drain of the third upper bridge arm 202 serves as the first end of the third inverter bridge circuit 23, the source of the first upper bridge arm 200 is connected to the drain of the first lower bridge arm 203, the source of the second upper bridge arm 201 is connected to the drain of the second lower bridge arm 204, and the source of the third upper bridge arm 202 is connected to the drain of the third lower bridge arm 205. The drain of the third lower bridge arm 205 is connected, the source of the first lower bridge arm 203 is connected to the source of the second lower bridge arm 204 and the source of the third lower bridge arm 205 and respectively serve as the third end of the first inverter bridge circuit 21, the third end of the second inverter bridge circuit 22 and the third end of the third inverter bridge circuit 23; the gate of the first upper bridge arm 200, the gate of the second upper bridge arm 201 and the gate of the third upper bridge arm 202 serve as the second end of the first inverter bridge circuit 21, the second end of the second inverter bridge circuit 22 and the second end of the third inverter bridge circuit 23 respectively; the gate of the first lower bridge arm 203, the gate of the second lower bridge arm 204 and the gate of the third lower bridge arm 205 are respectively connected to the driving IC chip 207.
[0029] In this embodiment, the bootstrap circuit 3 includes a first capacitor 209, a second capacitor 210, a third capacitor 211, a fourth capacitor 212, a fifth capacitor 213 and a sixth capacitor 214; the first end of the first capacitor 209 and the first end of the fourth capacitor 212 are respectively connected to the source of the first upper bridge arm 200, and the second end of the first capacitor 209 and the second end of the fourth capacitor 212 are connected to the driver IC chip 207; the first end of the second capacitor 210 and the first end of the fifth capacitor 213 are respectively connected to the source of the second upper bridge arm 201, and the second end of the second capacitor 210 and the second end of the fifth capacitor 213 are connected to the driver IC chip 207; the first end of the third capacitor 211 and the first end of the sixth capacitor 214 are respectively connected to the source of the third upper bridge arm 202, and the second end of the third capacitor 211 and the second end of the sixth capacitor 214 are connected to the driver IC chip 207.
[0030] Specifically, the inverter controller part is composed of three groups of half bridges, each group of inverter parts includes two triode transistors, wherein 200 and 203 are a group, 201 and 204 are a group, and 202 and 205 are a group, and each group of two triode transistors is divided into an upper bridge arm and a lower bridge arm, wherein the triode transistor 200 is the upper bridge arm, the triode transistor 203 is the lower bridge arm, the triode transistor 201 is the upper bridge arm, the triode transistor 204 is the lower bridge arm, the triode transistor 202 is the upper bridge arm, and the triode transistor 205 is the lower bridge arm. The drains of the triode transistors 200, 201, and 202 of the upper bridge arm are all connected to the high-voltage input terminal VCC2 bus of the module, and the source of the triode transistor 200 of the upper bridge arm is connected to the source of the lower bridge arm. The drain of the triode transistor 203 is connected, the source of the triode transistor 203 of the lower bridge arm is connected to the module external pin -U end, the gates of the two triode transistors are connected to the control chip 207, the source of the triode transistor 201 of the upper bridge arm is connected to the drain of the triode transistor 204 of the lower bridge arm, the source of the triode transistor 204 of the lower bridge arm is connected to the module external pin -V end, the gates of the two triode transistors are connected to the control chip 207, the source of the triode transistor 202 of the upper bridge arm is connected to the drain of the triode transistor 205 of the lower bridge arm, the source of the triode transistor 205 of the lower bridge arm is connected to the module external pin -W end, and the gates of the two triode transistors are connected to the driver IC chip 207.
[0031] In this embodiment, the PFC driving circuit 206 includes a first diode D1 and a fourth upper bridge arm G7, the anode of the first diode D1 is connected to the drain of the fourth upper bridge arm G7, the cathode of the first diode D1 and the source of the fourth upper bridge arm G7 are respectively connected to the power supply VCC, and the gate of the fourth upper bridge arm G7 is connected to the driving IC chip 207.
[0032] Specifically, the PFC driving circuit is composed of a transistor and a first diode D1, wherein the drain of the transistor is connected to the PFC terminal and the anode terminal of D1, the source of the transistor is connected to the -VCC terminal, and the cathode of D1 is connected to VCC2. The bootstrap circuit part is composed of 6 capacitors: a first capacitor 209 and a third capacitor 212, a second capacitor 210 and a fourth capacitor 213, a fifth capacitor 211 and a sixth capacitor 214, and the two ends of the capacitors are respectively connected to VB1 and UVS1, VB2 and VVS2, and VB3 and WVS3. Among them, Q1-R is the driving resistance of the triode transistor of the first upper bridge arm 100, Q2-R is the driving resistance of the triode transistor of the second upper bridge arm 201, Q3-R is the driving resistance of the triode transistor of the third upper bridge arm 202, Q4-R is the driving resistance of the triode transistor of the first lower bridge arm 203, Q5-R is the driving resistance of the triode transistor of the second lower bridge arm 204, Q6-R is the driving resistance of the triode transistor of the third lower bridge arm 205, and Q7-R is the driving resistance of the triode transistor of the fourth upper bridge arm 206.
[0033] In this embodiment, the rectifier 208 includes a second diode D2, a third diode D3, a fourth diode D4 and a fifth diode D5; the anode of the second diode D2 is connected to the anode of the third diode D3, the cathode of the second diode D2 is connected to the anode of the fourth diode D4, the cathode of the third diode D3 is connected to the anode of the fifth diode D5, the cathode of the fourth diode D4 is connected to the cathode of the fifth diode D5, and the cathode of the second diode D2 and the cathode of the third diode D3 are used to connect to the power supply VCC.
[0034] In this embodiment, the multifunctional intelligent power module further includes a module plastic package body 410 , and the module plastic package body 410 is fixed to the outer side of the metal substrate plate 409 .
[0035] In this embodiment, the high-voltage pin area 4 is provided with a plurality of high-voltage pins, the low-voltage pin area 5 is provided with a plurality of low-voltage pins, and the load motor 408 is connected to the plurality of high-voltage pins.
[0036] Specifically, the bootstrap VB1 / U port of the internal driver IC of the module is connected to the corresponding functional routing through a binding jumper, and is internally connected to a filter capacitor 401, a bootstrap capacitor 402, and a load motor 408. The bootstrap VB2&V port of the internal driver IC of the module is connected to the corresponding functional routing through a binding jumper, and is internally connected to a filter capacitor 403, a bootstrap capacitor 404, and a load motor 408. The bootstrap VB3 / W port of the internal driver IC of the module is connected to the corresponding functional routing through a binding jumper, and is internally connected to a filter capacitor 405, a bootstrap capacitor 406, and a load motor 408. The bootstrap capacitor is selected in the 1206 package type with a capacitance of 22nf, and the filter capacitor is selected in the 0402 package type with a capacitance of 1nf.
[0037] High voltage pin part: AC1\AC2\DP\PFC\VCC\W\V\U.
[0038] Low voltage pin:
[0039] -DN\-PFC\-UVW\ITRIP\HIN1\HIN2\HIN3\LIN1\LIN2\LIN3\PFCIN\FLT / EN\VDD\VSS.
[0040] The high-voltage and low-voltage pins are separated and concentrated, which has better anti-interference performance; the circuit wiring is optimized, the drive loop area is reduced, and the interference source is reduced, so that the system can work more stably and reliably.
[0041] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, article or device. In the absence of more restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, article or device including the element.
[0042] The embodiments of the present invention are described above in conjunction with the accompanying drawings. What is disclosed is only the preferred embodiment of the present invention. However, the present invention is not limited to the above-mentioned specific implementation manner. The above-mentioned specific implementation manner is only illustrative rather than restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms and equivalent changes without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.
Claims
1. A multifunctional intelligent power module, characterized in that: include: A metal substrate board, an inverter controller circuit, a rectifier, a PFC drive circuit, a drive IC chip and a bootstrap circuit integrated on the metal substrate board; a high-voltage pin area and a low-voltage pin area are provided on one side of the metal substrate board, the high-voltage pin area is spaced from the low-voltage pin area, and the high-voltage pin area is used to connect a load motor; The first end of the inverter controller circuit is used to connect to the power supply, the second end of the inverter controller circuit is used to connect to the driver IC chip, the third end of the inverter controller circuit is connected to the first end of the bootstrap circuit, and the PFC drive circuit is used to connect the power supply and the driver IC chip; the second end of the bootstrap circuit is respectively connected to the second end of the inverter controller circuit and the driver IC chip, and the third end of the bootstrap circuit is used to connect to the high-voltage pin area; The rectifier is used to connect to an AC power source and rectify and output the AC power source to form the power supply.
2. The multifunctional intelligent power module according to claim 1, characterized in that: The inverter controller circuit includes a first inverter bridge circuit, a second inverter bridge circuit and a third inverter bridge circuit. The first end of the first inverter bridge circuit is respectively connected to the first end of the second inverter bridge circuit and the first end of the third inverter bridge circuit and then connected to the power supply. The second end of the first inverter bridge circuit, the second end of the second inverter bridge circuit and the second end of the third inverter bridge circuit are respectively connected to the drive IC chip; the third end of the first inverter bridge circuit is respectively connected to the third end of the second inverter bridge circuit and the third end of the third inverter bridge circuit.
3. The multifunctional intelligent power module according to claim 2, characterized in that: The first inverter bridge circuit includes a first upper bridge arm and a first lower bridge arm, the second inverter bridge circuit includes a second upper bridge arm and a second lower bridge arm, and the third inverter circuit includes a third upper bridge arm and a third lower bridge arm; The drain of the first upper bridge arm serves as the first end of the first inverter bridge circuit, the drain of the second upper bridge arm serves as the first end of the second inverter bridge circuit, the drain of the third upper bridge arm serves as the first end of the third inverter bridge circuit, the source of the first upper bridge arm is connected to the drain of the first lower bridge arm, the source of the second upper bridge arm is connected to the drain of the second lower bridge arm, the source of the third upper bridge arm is connected to the drain of the third lower bridge arm, the source of the first lower bridge arm is connected to the source of the second lower bridge arm and the source of the third lower bridge arm and serves as the third end of the first inverter bridge circuit, the third end of the second inverter bridge circuit and the third end of the third inverter bridge circuit respectively; the gate of the first upper bridge arm, the gate of the second upper bridge arm and the gate of the third upper bridge arm serve as the second end of the first inverter bridge circuit, the second end of the second inverter bridge circuit and the second end of the third inverter bridge circuit respectively; the gate of the first lower bridge arm, the gate of the second lower bridge arm and the gate of the third lower bridge arm are connected to the driving IC chip respectively.
4. The multifunctional intelligent power module according to claim 3, characterized in that: The bootstrap circuit comprises a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor and a sixth capacitor; The first end of the first capacitor and the first end of the fourth capacitor are respectively connected to the source of the first upper bridge arm, and the second end of the first capacitor and the second end of the fourth capacitor are connected to the driver IC chip; The first end of the second capacitor and the first end of the fifth capacitor are respectively connected to the source of the second upper bridge arm, and the second end of the second capacitor and the second end of the fifth capacitor are connected to the driver IC chip; The first end of the third capacitor and the first end of the sixth capacitor are respectively connected to the source of the third upper bridge arm, and the second end of the third capacitor and the second end of the sixth capacitor are connected to the driver IC chip.
5. The multifunctional intelligent power module according to claim 1, characterized in that: The PFC driving circuit includes a first diode and a fourth upper bridge arm, the anode of the first diode is connected to the drain of the fourth upper bridge arm, the cathode of the first diode and the source of the fourth upper bridge arm are respectively connected to the power supply, and the gate of the fourth upper bridge arm is connected to the driving IC chip.
6. The multifunctional intelligent power module according to claim 1, characterized in that: The rectifier includes a second diode, a third diode, a fourth diode and a fifth diode; the anode of the second diode is connected to the anode of the third diode, the cathode of the second diode is connected to the anode of the fourth diode, the cathode of the third diode is connected to the anode of the fifth diode, the cathode of the fourth diode is connected to the cathode of the fifth diode, and the cathode of the second diode and the cathode of the third diode are used to connect to the power supply.
7. The multifunctional intelligent power module according to claim 1, characterized in that: The multifunctional intelligent power module further comprises a module plastic package body, and the module plastic package body is fixed on the outer side of the metal substrate plate.
8. The multifunctional intelligent power module according to claim 1, characterized in that: The high-voltage pin area is provided with a plurality of high-voltage pins, the low-voltage pin area is provided with a plurality of low-voltage pins, and the load motor is connected to the plurality of high-voltage pins.