Circuit board and electronic component package

Abstract

Embodiments of the present disclosure provide a circuit board and an electronic component package, the circuit board including: an insulating layer having one surface including a first region on which an electronic component is mounted and a second region adjacent to the first region; a connection pad disposed in the first region; and a solder resist layer covering the one surface of the insulating layer and having an opening to expose the connection pad. At least a portion of the solder resist layer extends from the second region to the first region, and in the first region, a portion of the insulating layer is exposed from the solder resist layer.

Description

Technical Field

[0001] The present disclosure relates to a circuit board and an electronic component package. Background Art

[0002] Surface mounting technology is a technology that mounts electronic components such as capacitors and inductors on the surface of a package substrate, and has advantages in improving the electrical performance of electronic component packages and miniaturizing them. Recently, in order to improve package performance, the demand for surface mounting of passive components with a three-terminal structure developed from the existing two-terminal structure is increasing.

[0003] Since surface mounted electronic components are susceptible to physical and chemical impacts from the outside, physical and electrical reliability must be ensured through a molding process that fills empty spaces with a filler such as epoxy resin.

[0004] In the case of the mold void phenomenon, which is a major defect that may occur in the molding process, it may be fatal to the reliability of the package because it is difficult to judge whether it is defective by appearance. Due to the change in the structure of passive components, the filling problem of the mold may occur under the surface mount component, so improvement is needed. Summary of the invention

[0005] One aspect of the present disclosure is to provide a circuit board and an electronic component package, which can ensure sufficient spacing between the circuit board and the components mounted on the surface of the circuit board, improve the cleaning ability under the electronic components mounted in the surface mounting process, and prevent defects caused by flux residues.

[0006] However, the objects of the present disclosure are not limited to the above objects and can be expanded in various ways within the spirit and scope of the present disclosure.

[0007] An embodiment provides a circuit board, the circuit board comprising: an insulating layer, one surface of the insulating layer comprising a first area and a second area adjacent to the first area, an electronic component being mounted on the first area; a connection pad disposed on the first area; and a solder resist layer covering the one surface of the insulating layer and having an opening to expose the connection pad. At least a portion of the solder resist layer extends from the second area to the first area, and in the first area, a portion of the insulating layer is exposed from the solder resist layer.

[0008] The solder resist layer may include a first portion disposed on the first region and a second portion disposed on the second region, and the first portion may be disposed adjacent to one edge of the connection pad.

[0009] The solder resist layer may include a first portion disposed on the first region and a second portion disposed on the second region, and the first portion may be disposed to at least partially overlap the connection pad in a first direction perpendicular to the one surface of the insulating layer.

[0010] The opening may include a first opening exposing at least a portion of the connection pad and a second opening exposing a portion of the insulating layer in the first region, and the first opening and the second opening may be connected as one body.

[0011] The solder resist layer may include: a first portion and a second portion, the first portion being disposed on the first region and the second portion being disposed on the second region; and the opening may include: a first opening exposing at least a portion of the connecting pad, and a second opening exposing a portion of the insulating layer in the first region, and the first opening and the second opening may be separated from each other by the first portion.

[0012] The first portion may extend along an edge of the second opening.

[0013] Another embodiment provides a circuit board, the circuit board comprising: an insulating layer, one surface of the insulating layer comprising a first area and a second area adjacent to the first area, an electronic component being mounted on the first area; a connection pad disposed in the first area; and a solder resist layer covering the one surface of the insulating layer and having an opening to expose the connection pad. A first portion of the solder resist layer covering the first area is thicker along a first direction perpendicular to the one surface of the insulating layer than a second portion of the solder resist layer covering the second area is thicker along the first direction perpendicular to the one surface of the insulating layer.

[0014] The electronic component may include a body and an electrode portion disposed on the body and connected to the connection pad, and at least a portion of the first portion may be disposed to overlap the connection pad along the first direction.

[0015] The solder resist layer may include an opening that exposes a portion of the insulating layer in the first region, the plurality of connection pads may be arranged to be spaced apart from each other by the openings arranged between the plurality of connection pads, and the first portion may be arranged between the plurality of connection pads. The first portion may be arranged to overlap with a corner of the first region along the first direction.

[0016] The first portion may be disposed to be spaced apart from the connection pad on the first region.

[0017] The opening may include a first opening exposing at least a portion of the connection pad, and a second opening exposing a portion of the insulating layer in the first region.

[0018] The first opening and the second opening may be connected as one body.

[0019] The first opening and the second opening may be separated from each other by the first portion.

[0020] A plurality of second openings may be provided, and the first portion may be provided between the plurality of second openings.

[0021] The first portion may extend along an edge of the second opening.

[0022] The solder resist layer may include a first solder resist layer disposed on the one surface of the insulating layer, and a second solder resist layer disposed on the first solder resist layer to protrude from the first solder resist layer in the first direction.

[0023] In a plane parallel to the one surface of the insulating layer, a plane area of ​​the second solder resist layer may be smaller than a plane area of ​​the first solder resist layer.

[0024] Another embodiment provides an electronic component package, comprising: an insulating layer, one surface of which comprises a first region and a second region; an electronic component mounted on the first region; a connecting pad disposed in the first region; and a solder resist layer covering the one surface of the insulating layer, having an opening to expose the connecting pad and configured to support the electronic component.

[0025] The solder resist layer may include a first portion disposed to overlap the electronic component in a first direction perpendicular to the one surface of the insulating layer to support the electronic component.

[0026] The height of the lower surface of the electronic component from the one surface of the insulating layer along the first direction may be equal to the height of the upper surface of the first part from the one surface of the insulating layer along the first direction, or the height of the lower surface of the electronic component from the one surface of the insulating layer along the first direction may be higher than the height of the upper surface of the first part from the one surface of the insulating layer along the first direction.

[0027] The first portion may include a portion in contact with the electronic component.

[0028] The electronic component package may further include a connecting portion arranged to connect the electronic component and the connecting pad to each other, wherein at least a portion of the connecting portion may be disposed between the electronic component and the solder resist layer along a first direction perpendicular to the one surface of the insulating layer.

[0029] The connection pad may be embedded in the insulating layer, and one surface of the connection pad may be exposed from the insulating layer.

[0030] The opening may include: a first opening exposing at least a portion of the connection pad; and a second opening exposing a portion of the insulating layer in the first region.

[0031] The first opening and the second opening may be connected as one body.

[0032] The first opening and the second opening may be separated from each other by the first portion.

[0033] A plurality of second openings may be provided, and the first portion may be provided between the plurality of second openings.

[0034] The electronic component may include a main body and an electrode portion arranged on the main body and connected to the connecting pad, and the solder resist layer may include: a first solder resist layer, arranged on the one surface of the insulating layer; and a second solder resist layer, arranged on the first solder resist layer to protrude from the first solder resist layer in a first direction perpendicular to the one surface of the insulating layer.

[0035] The second solder resist layer may be provided at both ends of the electrode part that are opposite to each other in a second direction perpendicular to the first direction.

[0036] A plurality of electrode portions may be disposed to be opposite to each other in a second direction perpendicular to the first direction, and the second solder resist layer may be disposed at inner end portions of the plurality of electrode portions that are opposite to each other in the second direction.

[0037] A plurality of electrode parts may be disposed to be opposite to each other in a second direction perpendicular to the first direction, and the second solder resist layer may be disposed between the plurality of electrode parts.

[0038] The second solder resist layer may be disposed between the body of the electronic component and the first solder resist layer in the first direction.

[0039] Another embodiment provides a circuit board, the circuit board comprising: an insulating layer; a connection pad at least partially embedded in the insulating layer and having one surface exposed from the insulating layer; a solder resist layer disposed on the insulating layer; and a first electronic component disposed on the insulating layer and connected to the connection pad via a connection portion disposed between the connection pad and the first electronic component. A portion of the solder resist layer overlapping the first electronic component in a first direction perpendicular to the one surface comprises a first opening to expose a portion of the insulating layer.

[0040] The connection portion may be disposed in the first opening of the solder resist layer.

[0041] The connection portion may be disposed in a second opening of the solder resist layer, the second opening being spaced apart from the first opening of the solder resist layer.

[0042] A portion of the solder resist layer overlapping the first electronic component in the first direction may have a thickness greater than a thickness of another portion of the solder resist layer, and the other portion of the solder resist layer is disposed on an area outside the first electronic component when viewed in the first direction.

[0043] The solder resist layer may include a portion disposed on one side of the connection portion and another portion disposed on the other side of the connection portion, and a thickness of the portion disposed on the one side of the connection portion is greater than a thickness of the other portion disposed on the other side of the connection portion.

[0044] The solder resist layer may include other openings that expose a plurality of other connection pads partially embedded in the insulating layer. The circuit board may also include a second electronic component that is disposed on the insulating layer and is connected to the plurality of other connection pads via other connections disposed in the other openings of the solder resist layer.

[0045] A thickness of a portion of the solder resist layer extending in a region between the first electronic component and the second electronic component may be smaller than a thickness of a portion of the solder resist layer overlapping the first electronic component in the first direction.

[0046] Another embodiment provides a circuit board, the circuit board comprising: an insulating layer; a connection pad, at least partially embedded in the insulating layer and having a surface exposed from the insulating layer; a solder resist layer, disposed on the insulating layer; and a first electronic component, disposed on the insulating layer and connected to the connection pad by a connection portion disposed between the connection pad and the first electronic component. The solder resist layer may include a first opening to expose a portion of the insulating layer overlapping the first electronic component in a first direction perpendicular to the one surface. In the first direction perpendicular to the one surface, the lower surface of the first electronic component is at the same height as or higher than the upper surface of the solder resist layer.

[0047] The connection portion may be in contact with the solder resist layer.

[0048] According to the circuit board and electronic component package according to the embodiment, it is possible to ensure sufficient spacing between the circuit board and components mounted on the surface of the circuit board, improve the cleaning ability under the electronic components mounted in the surface mounting process, and prevent defects caused by flux residues.

[0049] In addition, according to the circuit board and the electronic component package according to the embodiment, a mold gap defect under the surface mount component can be prevented in a molding process, and physical interference influence and electrical interference influence between the surface mount component and the circuit board can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 A schematic cross-sectional view of an electronic component package according to an embodiment is shown.

[0051] Figure 2 A schematic top plan view of a circuit board according to an embodiment is shown.

[0052] Figure 3 A cross-sectional view of a portion of an electronic component package according to an embodiment is shown.

[0053] Figure 4 A cross-sectional view showing a portion of an electronic component package according to a modified example.

[0054] Figure 5 A schematic top plan view of a circuit board according to another embodiment is shown.

[0055] Figure 6 A cross-sectional view of a portion of an electronic component package according to another embodiment is shown.

[0056] Figure 7 A schematic cross-sectional view of an electronic component package according to another embodiment is shown.

[0057] Figure 8 A schematic top plan view of a circuit board according to another embodiment is shown.

[0058] Fig. 9 A cross-sectional view of a portion of an electronic component package according to another embodiment is shown.

[0059] Fig.10 A schematic cross-sectional view of an electronic component package according to another embodiment is shown.

[0060] Fig.11 A schematic top plan view of a circuit board according to another embodiment is shown.

[0061] Fig.12 A cross-sectional view of a portion of an electronic component package according to another embodiment is shown.

[0062] Fig.13 A schematic cross-sectional view of an electronic component package according to another embodiment is shown.

[0063] Fig.14 A schematic top plan view of a circuit board according to another embodiment is shown.

[0064] Fig.15 A cross-sectional view of a portion of an electronic component package according to another embodiment is shown. DETAILED DESCRIPTION

[0065] Hereinafter, the present disclosure will be described more fully with reference to the accompanying drawings showing embodiments of the present disclosure. The accompanying drawings and descriptions are considered to be illustrative in nature and not restrictive. Throughout the specification, the same reference numerals represent the same elements. In addition, in the accompanying drawings, some constituent elements are exaggerated, omitted or briefly shown, and the sizes of the various constituent elements do not reflect the actual sizes.

[0066] The accompanying drawings are provided only to facilitate understanding of the embodiments disclosed in this specification and should not be interpreted as limiting the spirit disclosed in this specification. It should be understood that the present disclosure includes all modifications, equivalents, and alternatives without departing from the scope and spirit of the present disclosure.

[0067] Terms including ordinal numbers such as first, second, etc. may be used to describe various elements, but the elements are not limited by these terms. These terms are only used to distinguish one constituent element from another constituent element.

[0068] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "over" another element, the element may be directly on the other element, or there may be intervening elements. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements. In addition, in the specification, the words "on..." or "above..." refer to being disposed on a target portion or below a target portion, and do not necessarily mean being disposed on the upper side of the target portion based on a direction opposite to the direction of gravity.

[0069] It should be understood that throughout the specification, the terms "include", "comprising", "having" or "configuration" indicate the presence of the features, quantities, steps, operations, constituent elements, components or combinations thereof described in the specification, but do not exclude the presence or addition of one or more other features, quantities, steps, operations, constituent elements, components or combinations thereof. Unless explicitly described to the contrary, the words "include", "comprising", "having" or "configuration" will be understood to imply the inclusion of the elements but not the exclusion of any other elements.

[0070] In addition, throughout the specification, the phrase "in a plan view" or "on a plane" means observing the target portion from the top, and the phrase "in a cross-sectional view" or "on a cross section" means observing a cross section formed by vertically cutting the target portion from the side.

[0071] Throughout the specification and the claims that follow, when it is described that an element is “coupled” to another element, the element may be “directly coupled or physically coupled” to the other element or “indirectly coupled or non-contact coupled” to the other element through a third element.

[0072] Furthermore, throughout the specification, “connected” refers not only to a case where two or more elements are directly connected, but also to a case where two or more elements are indirectly connected through other elements, and a case where two or more elements are physically or electrically connected. Furthermore, different names may be used according to position or function, and it may also refer to a case where the components are substantially integrally connected to each other.

[0073] Figure 1 shows a schematic cross-sectional view of an electronic component package according to an embodiment, Figure 2 shows a schematic top plan view of a circuit board according to an embodiment, Figure 3 A cross-sectional view of a portion of an electronic component package according to an embodiment is shown, and Figure 4 A cross-sectional view showing a portion of an electronic component package according to a modified example.

[0074] Figure 2 Shows Figure 1 A top plan view of portion “A” (excluding electronic components). Figure 3The electronic components are shown in a state where they are arranged on a circuit board according to an embodiment. Figure 2 A cross-sectional view taken along line III-III'. Figure 4 FIG. 1 shows a state where an electronic component is arranged on a circuit board according to a modified exemplary embodiment. Figure 2 A cross-sectional view taken along line III-III'.

[0075] Reference Figure 1 , the electronic component package 10A according to the embodiment may include a circuit board 100A, a first electronic component 20 mounted on one surface of the circuit board 100A, and a second electronic component 11. The electronic component package 10A according to the embodiment may include: a first connection portion 12 connecting the first electronic component 20 and the circuit board 100A; a second connection portion 13 connecting the second electronic component 11 and the circuit board 100A; and a third connection portion 14 connecting the circuit board 100A to the outside. In addition, the electronic component package 10A according to the embodiment may include a third electronic component 15 mounted on another surface of the circuit board 100A.

[0076] The first electronic component 20 may be mounted on one surface of the insulating layer 110 of the circuit board 100A. The first electronic component 20 may include a chip passive component, for example, a chip inductor or a chip capacitor, but is not limited thereto.

[0077] The first electronic component 20 may include a body 22 and an electrode portion 21 disposed on the body 22 and electrically connected to the circuit board 100A. Figure 1 , the electrode portion 21 is shown as being disposed on both sides of the body 22, but is not limited thereto, and only one electrode portion 21 may be disposed on the body 22, or three or more electrode portions 21 may be disposed on the body 22. The body 22 may include a dielectric material. The body 22 may include a plurality of surfaces opposite to each other. The electrode portion 21 of the first electronic component 20 may include a metal material such as copper (Cu) or aluminum (Al). The electrode portion 21 may be electrically connected to the circuit board 100A through the first connection portion 12.

[0078] The second electronic component 11 may be an integrated circuit (IC) die in which hundreds to millions of components are integrated into one chip. For example, the second electronic component 11 may be a processor chip (such as a central processing unit (e.g., CPU), a graphics processor (e.g., GPU), a field programmable gate array (FPGA), a digital signal processor, a cryptographic processor, a microprocessor, a microcontroller, etc.), specifically, the second electronic component 11 may be an application processor (AP), but is not limited thereto, and may be a memory (such as a volatile memory (e.g., DRAM), a non-volatile memory (e.g., ROM, flash memory)) or a logic chip (such as an analog-to-digital converter, an application-specific IC (ASIC)). As required, the second electronic component 11 may be a chip passive component, such as a chip inductor or a chip capacitor. The second electronic component 11 may be electrically connected to the circuit board 100A via the second connection portion 13. The second electronic component 11 may be attached to one surface of the circuit board 100A using an adhesive film or the like as required.

[0079] The third electronic component 15 may include chip passive components such as chip inductors or chip capacitors, but is not limited thereto, and may be an integrated circuit (IC) die in which hundreds to millions of components are integrated into a single chip. The third electronic component 15 may be electrically connected to the circuit board 100A.

[0080] The first connection portion 12 may be disposed in the first opening 211 of the solder resist layer 200 of the circuit board 100A. The first connection portion 12 may electrically connect the exposed first wiring layer 121 to the first electronic component 20. The first connection portion 12 may electrically connect the exposed first wiring layer 121 to the electrode portion 21 of the first electronic component 20. The first connection portion 12 may physically and / or electrically connect the first electronic component 20 surface-mounted on the circuit board 100A to the circuit board 100A. The first connection portion 12 may be made of solder, for example, the first connection portion 12 may be made of tin (Sn) or an alloy containing tin (Sn), etc., but is not limited thereto. The first connection portion 12 may be disposed between the electrode portion 21 of the first electronic component 20 and the first wiring layer 121. The first connection portion 12 may be disposed between the electrode portion 21 of the first electronic component 20 and the connection pad 1211. The electrode portion 21 may be electrically connected to the connection pad 1211. At least a portion of the first connection portion 12 may be disposed between the first electronic component 20 and the solder resist layer 200 in a first direction perpendicular to one surface of the insulating layer 110 .

[0081] The second connection portion 13 may be disposed in another opening of the solder resist layer 200 of the circuit board 100A. The second connection portion 13 may electrically connect the exposed first wiring layer 121 to the second electronic component 11. The second connection portion 13 may physically and / or electrically connect the second electronic component 11 surface-mounted on the circuit board 100A to the circuit board 100A. The second connection portion 13 may be made of solder, for example, the second connection portion 13 may be made of tin (Sn) or an alloy containing tin (Sn), etc., but is not limited thereto. For example, the second connection portion 13 may have a spherical shape, but is not limited thereto, and may have a shape such as a pad, a pin, a columnar metal column.

[0082] Each of the plurality of third connection portions 14 may be electrically connected to the exposed second wiring layer 122. The third connection portion 14 may physically connect and / or electrically connect the circuit board 100A to the outside. For example, the circuit board 100A may be mounted on a main board or other BGA substrate of an electronic component through the third connection portion 14. Each of the plurality of third connection portions 14 may be formed using solder, for example, each of the plurality of third connection portions 14 may be made of tin (Sn) or an alloy containing tin (Sn), etc., but is not limited thereto. For example, the third connection portion 14 may have a ball shape, but is not limited thereto, and may have a shape such as a pad, a pin, or a columnar metal column.

[0083] Hereinafter, the circuit board 100A according to the embodiment will be described in more detail.

[0084] Reference Figure 1 , the circuit board 100A according to the embodiment may include an insulating layer 110, first and second wiring layers 121 and 122 provided on one surface and the other surface of the insulating layer 110, and a third wiring layer 123 provided between the first and second wiring layers 121 and 122 and embedded in the insulating layer 110. In addition, the circuit board 100A according to the embodiment may include a first via layer 131 passing through at least a portion of the insulating layer 110 and connected to the first wiring layer 121, and a second via layer 132 passing through at least a portion of the insulating layer 110 and connected to the second wiring layer 122.

[0085] The insulating layer 110 may include a plurality of insulating layers 111 and 112. For example, the insulating layer 110 may include a first insulating layer 111 and a second insulating layer 112.

[0086] An insulating material may be used as the material of the plurality of insulating layers 111 and 112, and a thermosetting resin such as an epoxy resin or a thermoplastic resin such as polyimide may be used as the insulating material. In addition, a resin including an inorganic filler such as silica and a reinforcing material such as glass fiber may be used as the insulating material. For example, a prepreg and an Ajinomoto deposited film (ABF) may be used, but the present disclosure is not limited thereto. In addition, the insulating material may be provided in the form of resin coated copper (RCC), but is not limited thereto. As required, a photosensitive material such as photosensitive dielectric (PIE) may be used.

[0087] Reference Figure 1 , the insulating layer 110 is illustrated as a two-layer structure including a first insulating layer 111 and a second insulating layer 112 , but the insulating layer 110 may also utilize a single-layer structure and may include a greater number of layers.

[0088] The circuit board 100A according to the present embodiment may include a plurality of wiring layers 121, 122, and 123. The plurality of wiring layers 121, 122, and 123 may include a first wiring layer 121, a second wiring layer 122, and a third wiring layer 123. Each of the first wiring layer 121, the second wiring layer 122, and the third wiring layer 123 may be provided on the inner side or the outer side of the insulating layer 110.

[0089] Wiring layers 121, 122, and 123 may transmit signals inside circuit board 100A. Metal materials may be used as materials for wiring layers 121, 122, and 123. Metal materials may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. Wiring layers 121, 122, and 123 may perform various functions according to designs such as ground patterns, power patterns, and signal patterns. These patterns may each have a line shape, a plane shape, or a pad shape. A portion of a wiring layer disposed on the outermost layer of a plurality of wiring layers 121, 122, and 123 may be used as a pad connected to other boards or components.

[0090] Each of the plurality of wiring layers 121 , 122 , and 123 may be formed by a plating process such as an additive process (AP), a semi-AP (SAP), a modified SAP (MSAP), and a via sealing (TT) process.

[0091] The first wiring layer 121 may be disposed on the first insulating layer 111. For example, the circuit board 100A according to the embodiment may be manufactured using an embedded trace substrate (ETS) method. The insulating layer 110 may have one surface and another surface opposite to each other, and in this case, the first wiring layer 121 may be embedded in one surface side of the insulating layer 110 or disposed on one surface side of the insulating layer 110. That is, the first wiring layer 121 may be embedded from one surface of the insulating layer 110.

[0092] The first wiring layer 121 may include a portion embedded in one surface of the insulating layer 110 such that an upper surface of the portion is exposed. The first wiring layer 121 may include a connection pad 1211 embedded in one surface of the insulating layer 110 such that an upper surface of the connection pad 1211 is exposed. The connection pad 1211 may be embedded in the insulating layer 110 such that one surface of the connection pad 1211 may be exposed from the insulating layer 110. The first wiring layer 121 may include a plurality of connection pads 1211.

[0093] The second wiring layer 122 may be disposed on the other surface of the insulating layer 110. The second wiring layer 122 may be disposed to protrude from the other surface of the insulating layer 110. The second wiring layer 122 may be disposed on the second insulating layer 112. At least a portion of the second wiring layer 122 may be used as a pad for connection to other boards or components.

[0094] The third wiring layer 123 may be disposed on one surface of the first insulating layer 111. The third wiring layer 123 may be embedded in the second insulating layer 112. Figure 1 , the third wiring layer 123 is shown to be provided between the first wiring layer 121 and the second wiring layer 122, but this is an example, and the third wiring layer 123 may not be provided, or a plurality of wiring layers may exist.

[0095] Reference Figure 1 , a first wiring layer 121 , a second wiring layer 122 , and a third wiring layer 123 are shown, but the present disclosure is not limited thereto, and a greater number of wiring layers or a smaller number of wiring layers may be provided.

[0096] The circuit board 100A according to the embodiment may include a first via layer 131 that passes through the first insulating layer 111 and electrically connects the first wiring layer 121 and the third wiring layer 123, and a second via layer 132 that passes through the second insulating layer 112 and electrically connects the second wiring layer 122 and the third wiring layer 123. Each via layer may include a plurality of vias formed by filling a plurality of via holes with a conductor.

[0097] Metal materials may be used as materials for the plurality of via layers 131 and 132, and copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) or alloys thereof may be used as metal materials. Depending on the design, the plurality of via layers 131 and 132 may include signal vias, ground vias, power vias, and the like. Each of the vias of the plurality of via layers 131 and 132 may be formed by completely filling the via hole with a metal material, or may be formed by partially filling the via hole along the wall of the via hole with a metal material. The plurality of via layers 131 and 132 may also be formed by a plating process, for example, processes such as AP, SAP, MSAP, TT, and the like, and may include a seed layer as an electroless plating layer and an electrolytic plating layer formed based on the seed layer. The via of each of the first via layer 131 and the second via layer 132 may have a tapered shape in which the width of one surface is smaller than the width of the other surface.

[0098] In addition, Figure 1 , the plurality of via layers are illustrated as having two layers (a first via layer 131 and a second via layer 132 ), but the via layer may be configured as a single layer or may have more layers depending on the configuration of the insulating layer 110 and the design of the wiring layer.

[0099] The circuit board 100A according to the embodiment may include a solder resist layer 200. The solder resist layer 200 may protect internal components from external physical and chemical damages.

[0100] The solder resist layer 200 may have at least one first opening 211. The solder resist layer 200 may cover one surface of the insulating layer 110, and the solder resist layer 200 may be opened to expose at least a portion of the connecting pads 1211. The at least one first opening 211 of the solder resist layer 200 may expose at least a portion of the first wiring layer 121, respectively. At least a portion of the connecting pads 1211 may be exposed from the solder resist layer 200 through the first opening 211 of the solder resist layer 200. The solder resist layer 200 may include a photosensitive resin material.

[0101] The circuit board 100A according to the embodiment may include a passivation layer 140. The passivation layer 140 may protect the internal components from external physical damage and chemical damage. The passivation layer 140 may be a solder resist layer. The passivation layer 140 may have at least one opening. The passivation layer 140 may cover the other surface of the insulating layer 110, and the passivation layer 140 may be opened to expose the second wiring layer 122. The at least one opening of the passivation layer 140 may expose at least a portion of the second wiring layer 122, respectively. The passivation layer 140 may include a photosensitive resin material.

[0102] In the following, reference will be made to Figures 1 to 3 The solder resist layer 200 of the circuit board 100A according to the embodiment is described in more detail.

[0103] Reference Figure 2 and Figure 3 , the insulating layer 110 may include a first region 1101 and a second region 1102. The first region 1101 may be provided for mounting the first electronic component 20. The second region 1102 may be a region adjacent to the first region 1101.

[0104] For example, the first region 1101 may refer to a region on one surface of the insulating layer 110 in which the insulating layer 110 and the first electronic component 20 are overlapped in a first direction perpendicular to the one surface of the insulating layer 110. The first electronic component 20 may be mounted on the first region 1101. The second region 1102 may refer to a region in which the first electronic component 20 is not mounted. The second region 1102 may be connected to the first region 1101. The second region 1102 may include a portion surrounding the first region 1101.

[0105] The connection pad 1211 may be disposed in the first region 1101. In the first region 1101, at least a portion of the connection pad 1211 may be exposed from the insulating layer 110.

[0106] At least one connection pad 1211 may be disposed on the first region 1101 of the insulating layer 110. The connection pad 1211 may be disposed at a position corresponding to a portion where the electrode portion 21 of the first electronic component 20 and the first region 1101 overlap. For example, when the electrode portion 21 is disposed on both sides of the first region 1101, the connection pad 1211 may be disposed on both sides of the first region 1101.

[0107] In the first region 1101, there may be a portion where neither the connection pad 1211 nor the solder resist layer 200 is disposed on the insulating layer 110. Therefore, a portion of one surface of the insulating layer 110 in the first region 1101 may be exposed from the solder resist layer 200.

[0108] A portion of the solder resist layer 200 may be disposed on the second region 1102. At least a portion of the solder resist layer 200 may extend from the second region 1102 to the first region 1101. In other words, the solder resist layer 200 may include a first portion 200a disposed on the first region 1101 and a second portion 200b disposed on the second region 1102. The first portion 200a may cover a portion of the first region 1101. The second portion 200b may cover at least a portion of the second region 1102.

[0109] The first portion 200a of the solder resist layer 200 may be disposed on the first region 1101. The first portion 200a may overlap the first electronic component 20 along the first direction. The first portion 200a may be disposed to overlap a corner of the first electronic component 20. The first portion 200a may be disposed to at least partially overlap the connection pad 1211 along the first direction. The first portion 200a may be disposed on the connection pad 1211.

[0110] The solder resist layer 200 may be provided to support the first electronic component 20. The first portion 200a may be provided to support the first electronic component 20. Along the first direction, the first connection portion 12 may be provided between the first portion 200a and the first electronic component 20. Along the first direction, there may be a portion where the first electronic component 20, the first connection portion 12, and the first portion 200a are provided in sequence. Figure 3 , the height of the lower surface of the first electronic component 20 may be higher than the height of the upper surface of the first portion 200a relative to one surface of the insulating layer 110, that is, in the first direction, the lower surface of the first electronic component 20 is at a height higher than the upper surface of the solder resist layer 200. The first portion 200a may contact the first connection portion 12.

[0111] Reference Figure 4 , the first portion 200a of the circuit board 100A according to the modified example may include a portion in contact with the first electronic component 20. The height of the lower surface of the first electronic component 20 relative to one surface of the insulating layer 110 may be the same as the height of the upper surface of the first portion 200a, that is, in the first direction, the lower surface of the first electronic component 20 is at the same height as the upper surface of the solder resist layer 200. The first portion 200a may be in contact with the first connection portion 12.

[0112] The first portion 200a may be disposed adjacent to one edge of the connection pad 1211, where the first portion being disposed adjacent to one edge of the connection pad and similar expressions mean that the first portion includes a portion disposed adjacent to one edge of the connection pad, and does not mean that the first portion is disposed adjacent to only one edge of one connection pad. The first portion 200a may be disposed along one edge of the connection pad 1211. The first portion 200a may extend along one edge of the connection pad 1211 disposed in the first region 1101. Along the first direction, the first portion 200a may be disposed between the first electronic component 20 and the connection pad 1211. The first portion 200a may be disposed between the electrode portion 21 of the first electronic component 20 and the connection pad 1211 along the first direction.

[0113] The second direction may be perpendicular to the first direction and parallel to the direction in which the plurality of electrode portions 21 of the first electronic component 20 are relative to each other. The third direction may be a direction perpendicular to the first direction and the second direction. The first portion 200a may have a shape that extends a portion of the second portion 200b in the third direction. The first portion 200a may have a shape that extends a portion of the second portion 200b disposed in the edge region of the connecting pad 1211 along the third direction in the third direction. The first portion 200a may extend from the second portion 200b toward the inner side of the electrode portion 21 of the first electronic component 20. The first portion 200a may be disposed adjacent to the outer end portion of the electrode portion 21 in the second direction.

[0114] The solder resist layer 200 may have a second opening 212 that exposes the insulating layer 110 from the solder resist layer 200. The second opening 212 may expose a portion of one surface of the insulating layer 110 in the first region 1101. The second opening 212 may be surrounded by one side of the connection pad 1211 and the solder resist layer 200. The second opening 212 may be connected to the first opening 211 as a whole.

[0115] The plurality of first portions 200a may be disposed on the first region 1101. The plurality of first portions 200a may be disposed to be opposite to each other in the third direction. The plurality of first portions 200a may be disposed adjacent to both end portions of the electrode part 21 in the third direction.

[0116] In the following, reference will be made to Figure 5 and Figure 6 as well as Figure 1 Description A solder resist layer 200 of a circuit board 100B according to another embodiment will be described.

[0117] Figure 5 shows a schematic top plan view of a circuit board according to another embodiment, and Figure 6 A cross-sectional view of a portion of an electronic component package according to another embodiment is shown.

[0118] Figure 5 Shows Figure 1 A top plan view of portion “A” (excluding electronic components). Figure 6 The electronic components are shown in a state where they are arranged on a circuit board according to another embodiment. Figure 5 A cross-sectional view taken along line VI-VI'.

[0119] Reference Figure 5 and Figure 6, compared with the circuit board 100A according to the embodiment of the present disclosure, in the circuit board 100B according to another embodiment, the solder resist layer 200 may include a first solder resist layer 201 and a second solder resist layer 202. Therefore, when describing the structure of the circuit board 100B according to another embodiment, only the changed configuration compared with the configuration of the circuit board 100A according to the embodiment will be described. The description of the remaining configuration of the circuit board 100A according to the above-mentioned embodiment may be applied to the circuit board 100B according to another embodiment.

[0120] A portion of the solder resist layer 200 may be disposed on the second region 1102. At least a portion of the solder resist layer 200 may extend from the second region 1102 to the first region 1101. In other words, the solder resist layer 200 may include a first portion 200a disposed on the first region 1101 and a second portion 200b disposed on the second region 1102.

[0121] The first portion 200a of the solder resist layer 200 may be disposed on the first region 1101. The first portion 200a may overlap the first electronic component 20 along the first direction. The first portion 200a may be disposed to overlap a corner of the first electronic component 20. The first portion 200a may be disposed to at least partially overlap the connection pad 1211 along the first direction. The first portion 200a may be disposed on the connection pad 1211.

[0122] The solder resist layer 200 may be provided to support the first electronic component 20. The first portion 200a may be provided to support the first electronic component 20. Along the first direction, the first connection portion 12 may be provided between the first portion 200a and the first electronic component 20. Along the first direction, there may be a portion where the first electronic component 20, the first connection portion 12, and the first portion 200a are provided in sequence. With respect to one surface of the insulating layer 110, the height of the lower surface of the first electronic component 20 may be higher than the height of the upper surface of the first portion 200a. The first portion 200a may be in contact with the first connection portion 12.

[0123] The first portion 200a may include a portion contacting the first electronic component 20. The lower surface of the first electronic component 20 may have the same height as the upper surface of the first portion 200a relative to one surface of the insulating layer 110. The first portion 200a may contact the first connection portion 12.

[0124] The first portion 200a may be disposed adjacent to one edge of the connection pad 1211. The first portion 200a may be disposed along one edge of the connection pad 1211. The first portion 200a may extend along one edge of the connection pad 1211 disposed in the first region 1101. The first portion 200a may be disposed between the first electronic component 20 and the connection pad 1211 along the first direction. The first portion 200a may be disposed between the electrode portion 21 of the first electronic component 20 and the connection pad 1211 along the first direction.

[0125] The second direction may be perpendicular to the first direction and parallel to the direction in which the electrode portions 21 of the first electronic component 20 are relative to each other. The third direction may be a direction perpendicular to the first direction and the second direction. The first portion 200a may have a shape that extends a portion of the second portion 200b in the third direction. The first portion 200a may have a shape that extends a portion of the second portion 200b disposed in the edge region along the third direction of the connecting pad 1211 in the third direction. The first portion 200a may extend from the second portion 200b toward the inner side of the electrode portion 21 of the first electronic component 20. The first portion 200a may be disposed adjacent to the outer end portion of the electrode portion 21 in the second direction.

[0126] The solder resist layer 200 may have a second opening 212, and the second opening 212 exposes the insulating layer 110 from the solder resist layer 200. The second opening 212 may expose a portion of one surface of the insulating layer 110 in the first region 1101. The second opening 212 may be connected to the first opening 211 as a whole. In other words, the connection pad 1211 and the insulating layer 110 may be exposed together through one opening (including the first opening 211 and the second opening 212).

[0127] The plurality of first portions 200a may be disposed on the first region 1101. The plurality of first portions 200a may be disposed to be opposite to each other in the third direction. The plurality of first portions 200a may be disposed adjacent to both end portions of the electrode part 21 in the third direction.

[0128] Reference Figure 5 and Figure 6, in terms of thickness along the first direction, the thickness of the first part 200a of the solder resist layer 200 may be greater than the thickness of at least a portion of the second part 200b. Specifically, the solder resist layer 200 may include a protrusion in an area adjacent to the first electronic component 20, the thickness of the protrusion being greater than the thickness of the remaining part in the first direction. In other words, the solder resist layer 200 may include a first solder resist layer 201 disposed on the insulating layer 110 and a second solder resist layer 202 disposed on the first solder resist layer 201. The second solder resist layer 202 may include at least one solder resist patch. The first solder resist layer 201 may have an extended shape to cover a surface of the insulating layer 110. The first solder resist layer 201 may have a first opening 211 that exposes at least a portion of the connecting pad 1211.

[0129] The second solder resist layer 202 may be arranged to protrude from the first solder resist layer 201 in the first direction. The second solder resist layer 202 may be arranged between the first electronic component 20 and the first solder resist layer 201 along the first direction. The second solder resist layer 202 may be arranged to be opposite to each other in the second direction. The second solder resist layer 202 may be respectively arranged at the opposite ends of the electrode portion 21 in the third direction. Along the first direction, the first connection portion 12 may be arranged between the first electronic component 20 and the second solder resist layer 202. Along the first direction, there may be a portion where the first electronic component 20, the first connection portion 12, the second solder resist layer 202 and the first solder resist layer 201 are arranged in sequence.

[0130] In a plane parallel to one surface of the insulating layer 110, the plane area of ​​the second solder resist layer 202 may be smaller than the plane area of ​​the first solder resist layer 201. The second solder resist layer 202 may be made of the same material as the first solder resist layer 201, but is not limited thereto, and may be made of a material different from that of the first solder resist layer 201.

[0131] The first portion 200a may include a portion of the first solder resist layer 201 and a portion of the second solder resist layer 202. The second portion 200b may include another portion of the first solder resist layer 201 and another portion of the second solder resist layer 202.

[0132] At least a portion of the first portion 200a may be disposed to support the first electronic component 20. At least a portion of the first portion 200a may be disposed to overlap the first electronic component 20 in the first direction. At least a portion of the first portion 200a may be disposed to overlap the electrode portion 21 in the first direction. At least a portion of the first portion 200a may be disposed to at least partially overlap the connection pad 1211 in the first direction.

[0133] The first portion 200a may be arranged to overlap with one corner of the first electronic component 20 in the first direction, where the first portion overlapping with one corner of the first electronic component in the first direction means that the first portion includes a portion overlapping with one corner of the first electronic component in the first direction, and does not mean that the first portion overlaps only with one corner of the first electronic component in the first direction. In other words, the first portion 200a may be arranged to overlap with one corner of the first region 1101 in the first direction.

[0134] The step portion in the first direction may be provided at one edge of the first portion 200a in the third direction. However, the present disclosure is not limited thereto, and portions of the first and second solder resist layers 201 and 202 configuring the first portion 200a may have the same width in the third direction.

[0135] In the following, reference will be made to Figures 7 to 9 An electronic component package 10B and a circuit board 100C according to another embodiment will be described.

[0136] Figure 7 shows a schematic cross-sectional view of an electronic component package according to another embodiment, Figure 8 shows a schematic top plan view of a circuit board according to another embodiment, and Fig. 9 A cross-sectional view of a portion of an electronic component package according to another embodiment is shown.

[0137] Figure 8 Shows Figure 7 A top plan view of portion “A” (excluding electronic components). Fig. 9 The electronic components are shown in a state where they are arranged on a circuit board according to another embodiment. Figure 8 A cross-sectional view taken along line IX-IX'.

[0138] Reference Figures 7 to 9 , and reference Figures 1 to 3 Compared with the circuit board 100A according to the embodiment described above, the solder resist layer 200 of the circuit board 100C according to another embodiment may have a different arrangement or shape. Therefore, when describing the structure of the circuit board 100C according to another embodiment, only the changed structure compared with the structure of the circuit board 100A according to the embodiment will be described. The description of the remaining structure of the electronic component package 10A according to the above-mentioned embodiment can be applied to the electronic component package 10B according to another embodiment.

[0139] Reference Figures 7 to 9 , the insulating layer 110 may include a first region 1101 and a second region 1102. The insulating layer 110 may include the first region 1101 on which the first electronic component 20 is mounted and the second region 1102 adjacent to the first region 1101.

[0140] For example, the first region 1101 may refer to a region on one surface of the insulating layer 110 in which the insulating layer 110 and the first electronic component 20 are overlapped in a first direction perpendicular to the one surface of the insulating layer 110. The first electronic component 20 may be mounted on the first region 1101. The second region 1102 may refer to a region where the first electronic component 20 is not mounted. The second region 1102 may be connected to the first region 1101. The second region 1102 may include a portion surrounding the first region 1101.

[0141] The connection pad 1211 may be disposed on the first region 1101. At least a portion of the connection pad 1211 may be exposed from the insulating layer 110 on the first region 1101.

[0142] At least one connection pad 1211 may be disposed on the first region 1101 of the insulating layer 110. The connection pad 1211 may be disposed at a position corresponding to a portion where the electrode portion 21 of the first electronic component 20 and the first region 1101 overlap. For example, when the electrode portion 21 is disposed on both sides of the first region 1101, the connection pad 1211 may be disposed on both sides of the first region 1101.

[0143] In the first region 1101, there may be a portion where neither the connection pad 1211 nor the solder resist layer 200 is disposed on the insulating layer 110. Therefore, a portion of one surface of the insulating layer 110 in the first region 1101 may be exposed from the solder resist layer 200.

[0144] A portion of the solder resist layer 200 may be disposed on the second region 1102. At least a portion of the solder resist layer 200 may extend from the second region 1102 to the first region 1101. In other words, the solder resist layer 200 may include a first portion 200a disposed on the first region 1101 and a second portion 200b disposed on the second region 1102.

[0145] The first portion 200a of the solder resist layer 200 may be disposed on the first region 1101. The first portion 200a may overlap the first electronic component 20 along the first direction. The first portion 200a may be disposed to overlap a corner of the first electronic component 20. The first portion 200a may be disposed to at least partially overlap the connection pad 1211 along the first direction. The first portion 200a may be disposed on the connection pad 1211.

[0146] The solder resist layer 200 may be provided to support the first electronic component 20. The first portion 200a may be provided to support the first electronic component 20. Along the first direction, the first connection portion 12 may be provided between the first portion 200a and the first electronic component 20. Along the first direction, there may be a portion where the first electronic component 20, the first connection portion 12, and the first portion 200a are provided in sequence. With respect to one surface of the insulating layer 110, the height of the lower surface of the first electronic component 20 may be higher than the height of the upper surface of the first portion 200a. The first portion 200a may be in contact with the first connection portion 12.

[0147] The first portion 200a may include a portion contacting the first electronic component 20. The lower surface of the first electronic component 20 may have the same height as the upper surface of the first portion 200a relative to one surface of the insulating layer 110. The first portion 200a may contact the first connection portion 12.

[0148] The first portion 200a may be disposed adjacent to one edge of the connection pad 1211. The first portion 200a may be disposed along one edge of the connection pad 1211. The first portion 200a may extend along one edge of the connection pad 1211 disposed in the first region 1101. The first portion 200a may be disposed between the first electronic component 20 and the connection pad 1211 along the first direction. The first portion 200a may be disposed between the electrode portion 21 of the first electronic component 20 and the connection pad 1211 along the first direction.

[0149] On a plane parallel to one surface of the insulating layer 110, the first portion 200a may be disposed between the connection pad 1211 and the insulating layer 110 in the second direction. On a plane parallel to one surface of the insulating layer 110, the connection pad 1211 and the insulating layer 110 may be disposed along the second direction relative to the first portion 200a. On a plane parallel to one surface of the insulating layer 110, the first portion 200a may extend along one edge of a portion of one surface of the insulating layer 110 exposed from the solder resist layer 200 in the first region 1101. The first portion 200a may extend in a third direction.

[0150] The solder resist layer 200 may have a second opening 212 that exposes the insulating layer 110 from the solder resist layer 200. The second opening 212 may expose a portion of one surface of the insulating layer 110 in the first region 1101. The first portion 200a may extend along one edge of the second opening 212. The second opening 212 may be separated from the first opening 211 by the first portion 200a. The second opening 212 may be spaced apart from the first opening 211.

[0151] The first portion 200a may extend along an edge of the connection pad 1211 parallel to the third direction. The first portion 200a may extend in the third direction from a second portion 200b adjacent to one end of the connection pad 1211 in the third direction to a second portion 200b adjacent to the other end of the connection pad 1211 in the third direction. The first portion 200a may be disposed adjacent to the second opening 212 of the solder resist layer 200 that exposes the insulating layer 110. The first portion 200a may be disposed adjacent to the inner end portion of the electrode portion 21 in the second direction. The first portion 200a may be disposed on an inner side surface of the first connection portion 12.

[0152] The plurality of first portions 200 a may be disposed on the first region 1101 . The plurality of first portions 200 a may be disposed opposite to each other in the second direction. The plurality of first portions 200 a may be disposed inside the first electronic component 20 .

[0153] In the following, reference will be made to Figures 10 to 12 An electronic component package 10C and a circuit board 100D according to another embodiment will be described.

[0154] Fig.10 shows a schematic cross-sectional view of an electronic component package according to another embodiment, Fig.11 shows a schematic top plan view of a circuit board according to another embodiment, and Fig.12 A cross-sectional view of a portion of an electronic component package according to another embodiment is shown.

[0155] Fig.11 Shows Fig.10 A top plan view of portion “A” (excluding electronic components). Fig.12 The electronic components are shown in a state where they are arranged on a circuit board according to another embodiment. Fig.11 A cross-sectional view taken along line ⅩⅡ-ⅩⅡ'.

[0156] Reference Figures 10 to 12 , and reference Figures 7 to 9 Compared with the circuit board 100C according to another embodiment described above, in the circuit board 100D according to another embodiment, the solder resist layer 200 may include a first solder resist layer 201 and a second solder resist layer 202. Therefore, when describing the structure of the circuit board 100D according to the present embodiment, only the changed configuration compared with the configuration of the circuit board 100C according to another embodiment will be described. The description of the remaining configuration of the circuit board 100C according to the above-described embodiment may be applied to the circuit board 100D according to another embodiment.

[0157] A portion of the solder resist layer 200 may be disposed on the second region 1102. At least a portion of the solder resist layer 200 disposed on the second region 1102 may extend from the second region 1102 to the first region 1101. In other words, the solder resist layer 200 may include a first portion 200a disposed on the first region 1101 and a second portion 200b disposed on the second region 1102.

[0158] The first portion 200a of the solder resist layer 200 may be disposed on the first region 1101. The first portion 200a may overlap the first electronic component 20 along the first direction. The first portion 200a may be disposed to overlap a corner of the first electronic component 20. The first portion 200a may be disposed to at least partially overlap the connection pad 1211 along the first direction. The first portion 200a may be disposed on the connection pad 1211.

[0159] The solder resist layer 200 may be provided to support the first electronic component 20. The first portion 200a may be provided to support the first electronic component 20. Along the first direction, the first connection portion 12 may be provided between the first portion 200a and the first electronic component 20. Along the first direction, there may be a portion where the first electronic component 20, the first connection portion 12, and the first portion 200a are provided in sequence. With respect to one surface of the insulating layer 110, the height of the lower surface of the first electronic component 20 may be higher than the height of the upper surface of the first portion 200a. The first portion 200a may be in contact with the first connection portion 12.

[0160] The first portion 200a may include a portion contacting the first electronic component 20. The lower surface of the first electronic component 20 may have the same height as the upper surface of the first portion 200a relative to one surface of the insulating layer 110. The first portion 200a may contact the first connection portion 12.

[0161] The first portion 200a may be disposed adjacent to one edge of the connection pad 1211. The first portion 200a may be disposed along one edge of the connection pad 1211. The first portion 200a may extend along one edge of the connection pad 1211 disposed in the first region 1101. The first portion 200a may be disposed between the first electronic component 20 and the connection pad 1211 along the first direction. The first portion 200a may be disposed between the electrode portion 21 of the first electronic component 20 and the connection pad 1211 along the first direction.

[0162] On a plane parallel to one surface of the insulating layer 110, the first portion 200a may be disposed between the connection pad 1211 and the insulating layer 110 in the second direction. On a plane parallel to one surface of the insulating layer 110, the connection pad 1211 and the insulating layer 110 may be disposed along the second direction relative to the first portion 200a. On a plane parallel to one surface of the insulating layer 110, the first portion 200a may extend along one edge of a portion of one surface of the insulating layer 110 exposed from the solder resist layer 200 in the first region 1101. The first portion 200a may extend in a third direction.

[0163] The solder resist layer 200 may have a second opening 212 that exposes the insulating layer 110 from the solder resist layer 200. The second opening 212 may expose a portion of one surface of the insulating layer 110 in the first region 1101. The second opening 212 may be separated from the first opening 211 by the first portion 200a. The second opening 212 may be disposed to be spaced apart from the first opening 211. The first portion 200a may extend along one edge of the second opening 212.

[0164] The plurality of connection pads 1211 may be disposed to be spaced apart from each other, with the second opening 212 interposed between the plurality of connection pads 1211. The first portion 200a may be disposed between the plurality of connection pads 1211.

[0165] The first portion 200a may extend along an edge of the connection pad 1211 parallel to the third direction. The first portion 200a may extend in the third direction from a second portion 200b adjacent to one end of the connection pad 1211 in the third direction to a second portion 200b adjacent to the other end of the connection pad 1211 in the third direction. The first portion 200a may be disposed adjacent to the second opening 212 of the solder resist layer 200 that exposes the insulating layer 110. The first portion 200a may be disposed adjacent to the inner end portion of the electrode portion 21 in the second direction. The first portion 200a may be disposed on one inner side surface of the first connection portion 12.

[0166] The plurality of first portions 200 a may be disposed on the first region 1101 . The plurality of first portions 200 a may be disposed opposite to each other in the second direction. The plurality of first portions 200 a may be disposed inside the first electronic component 20 .

[0167] Reference Figures 10 to 12, in terms of thickness along the first direction, the thickness of the first part 200a of the solder resist layer 200 may be greater than the thickness of the second part 200b. Specifically, the solder resist layer 200 may include a protrusion in an area adjacent to the first electronic component 20, the thickness of the protrusion being greater than the thickness of the remaining part in the first direction. In other words, the solder resist layer 200 may include a first solder resist layer 201 disposed on the insulating layer 110 and a second solder resist layer 202 disposed on the first solder resist layer 201. The second solder resist layer 202 may include at least one solder resist patch. The first solder resist layer 201 may have an extended shape to cover a surface of the insulating layer 110. The first solder resist layer 201 may have a first opening 211 that exposes at least a portion of the connecting pad 1211 from the first solder resist layer 201.

[0168] The second solder resist layer 202 may be arranged to protrude from the first solder resist layer 201 in the first direction. The second solder resist layer 202 may be arranged between the first electronic component 20 and the first solder resist layer 201 along the first direction. The second solder resist layer 202 may be arranged to be opposite to each other in the second direction. The second solder resist layer 202 may be arranged at the inner end portion of the electrode portion 21 in the second direction. The second solder resist layer 202 may be arranged between a plurality of electrode portions 21 facing the second direction.

[0169] Along the first direction, the first connection portion 12 may be disposed between the first electronic component 20 and the second solder resist layer 202. Along the first direction, there may be a portion where the first electronic component 20, the first connection portion 12, the second solder resist layer 202, and the first solder resist layer 201 are sequentially disposed.

[0170] In a plane parallel to one surface of the insulating layer 110, the plane area of ​​the second solder resist layer 202 may be smaller than the plane area of ​​the first solder resist layer 201. The second solder resist layer 202 may be made of the same material as the first solder resist layer 201, but is not limited thereto, and the second solder resist layer 202 may be made of a material different from that of the first solder resist layer 201.

[0171] The first portion 200a may include a portion of the first solder resist layer 201 and the second solder resist layer 202. The second portion 200b may include another portion of the first solder resist layer 201.

[0172] The first portion 200a may be disposed to support the first electronic component 20. The first portion 200a may be disposed to overlap the first electronic component 20 along the first direction. At least a portion of the first portion 200a may be disposed to overlap the electrode portion 21 in the first direction. At least a portion of the first portion 200a may be disposed to overlap the connection pad 1211 in the first direction. At least a portion of the first portion 200a may be disposed to overlap the body 22 in the first direction.

[0173] The first portion 200a may be disposed to overlap one corner of the first electronic component 20 in the first direction. In other words, the first portion 200a may be disposed to overlap one corner of the first region 1101 in the first direction.

[0174] The first solder resist layer 201 and the second solder resist layer 202 may have the same width in the third direction. However, the present disclosure is not limited thereto, and the first solder resist layer 201 and the second solder resist layer 202 may have different widths in the third direction, so that the step portion in the first direction may be provided at an edge of the first portion 200a in the third direction.

[0175] In the following, reference will be made to Figures 13 to 15 An electronic component package 10D and a circuit board 100E according to another embodiment will be described.

[0176] Fig.13 shows a schematic cross-sectional view of an electronic component package according to another embodiment, Fig.14 shows a schematic top plan view of a circuit board according to another embodiment, and Fig.15 A cross-sectional view of a portion of an electronic component package according to another embodiment is shown.

[0177] Fig.14 Shows Fig.13 A top plan view of portion “A” (excluding electronic components). Fig.15 The electronic components are shown in a state where they are arranged on a circuit board according to another embodiment. Fig.14 A cross-sectional view taken along line XV-XV'.

[0178] Reference Figures 13 to 15 , and reference Figures 10 to 12 Compared with the circuit board 100D according to another embodiment described in the present invention, the first solder resist layer 201 and the second solder resist layer 202 of the circuit board 100E according to another embodiment may have different arrangements or shapes. Therefore, when describing the structure of the circuit board 100E according to the present embodiment, only the changed structure compared with the structure of the circuit board 100D according to another embodiment will be described. The description of the remaining structure of the circuit board 100D according to the above-mentioned embodiment can be applied to the circuit board 100E according to another embodiment.

[0179] A portion of the solder resist layer 200 may be disposed on the second region 1102. At least a portion of the solder resist layer 200 may extend from the second region 1102 to the first region 1101. In other words, the solder resist layer 200 may include a first portion 200a disposed on the first region 1101 and a second portion 200b disposed on the second region 1102.

[0180] The first portion 200a of the solder resist layer 200 may be disposed on the first region 1101. The first portion 200a may overlap with the first electronic component 20 along the first direction. The first portion 200a may be disposed to overlap with the central portion of the first electronic component 20. The first portion 200a may be disposed to overlap with the body 22 along the first direction. The first portion 200a may be disposed to support the first electronic component 20. The first portion 200a may be disposed to overlap with the first electronic component 20 along the first direction. The first portion 200a may be spaced apart from the connection pad 1211 on the first region 1101. The connection pad 1211 may include a plurality of connection pads, and the first portion 200a may be disposed between the plurality of connection pads.

[0181] The solder resist layer 200 may be provided to support the first electronic component 20. The first portion 200a may be provided to support the first electronic component 20. The first portion 200a may include a portion in contact with the first electronic component 20. The height of the lower surface of the body 22 of the first electronic component 20 may be the same as the height of the upper surface of the first portion 200a relative to one surface of the insulating layer 110. The first portion 200a may be provided to be spaced apart from the first connection portion 12.

[0182] The first portion 200a may be disposed on the insulating layer 110. The first portion 200a may extend in the third direction. The first portion 200a may be disposed between the body 22 of the first electronic component 20 and the insulating layer 110 along the first direction.

[0183] The insulating layer 110 may be disposed at edges of the first portion 200a that are opposite to each other in the second direction on a plane parallel to one surface of the insulating layer 110. The insulating layer 110 may be disposed at both sides of the first portion 200a in the second direction on a plane parallel to one surface of the insulating layer 110. The first portion 200a may extend along a central area of ​​a portion of one surface of the insulating layer 110 that is exposed from the solder resist layer 200 in the first area 1101 on a plane parallel to one surface of the insulating layer 110.

[0184] The solder resist layer 200 may have a second opening 212, and the second opening 212 exposes the insulating layer 110 from the solder resist layer 200. The second opening 212 may expose a portion of one surface of the insulating layer 110 in the first region 1101. The second opening 212 may be surrounded by one side of the connection pad 1211 and the solder resist layer 200. The second opening 212 may be connected to the first opening 211 as a whole. The first portion 200a may extend along an edge of the second opening 212. A plurality of second openings 212 may be provided. The first portion 200a may be provided between the plurality of second openings 212.

[0185] The plurality of connection pads 1211 may be disposed to be spaced apart from each other, with the second opening 212 interposed between the plurality of connection pads 1211. The first portion 200a may be disposed between the plurality of connection pads 1211.

[0186] The first portion 200a may extend in the third direction to connect two regions of the second portion 200b that are opposite to each other in the third direction. The first portion 200a may be disposed adjacent to the second opening 212 of the solder resist layer 200 that exposes the insulating layer 110. The first electronic component 20 may include a plurality of electrode portions 21 that are opposite to each other in the second direction. The first portion 200a may be disposed between the plurality of electrode portions 21 that are opposite to each other in the second direction.

[0187] exist Fig.14 , the first portion 200a is shown in the singular, but the present disclosure is not limited thereto, and a plurality of first portions 200a may be provided to support the body 22 of the first electronic component 20. The plurality of first portions 200a may be provided between the plurality of electrode portions 21 opposing each other in the second direction.

[0188] Reference Figures 13 to 15 , in terms of thickness along the first direction, the thickness of the first part 200a of the solder resist layer 200 may be greater than the thickness of the second part 200b. Specifically, the solder resist layer 200 may include a protrusion in an area adjacent to the first electronic component 20, the thickness of the protrusion being greater than the thickness of the remaining part in the first direction. In other words, the solder resist layer 200 may include a first solder resist layer 201 disposed on the insulating layer 110 and a second solder resist layer 202 disposed on the first solder resist layer 201. The second solder resist layer 202 may include at least one solder resist patch. The first solder resist layer 201 may have an extended shape to cover a surface of the insulating layer 110. The first solder resist layer 201 may have a first opening 211, and the first opening 211 exposes at least a portion of the connecting pad 1211 from the first solder resist layer 201.

[0189] The second solder resist layer 202 may be arranged to protrude from the first solder resist layer 201 in the first direction. The second solder resist layer 202 may be arranged between the first electronic component 20 and the first solder resist layer 201 along the first direction. The second solder resist layer 202 may be arranged between the body 22 of the first electronic component 20 and the first solder resist layer 201 along the first direction. The second solder resist layer 202 may be arranged to contact the body 22. The second solder resist layer 202 may be arranged between a plurality of electrode portions 21 that are opposite to each other in the second direction.

[0190] In a plane parallel to one surface of the insulating layer 110, the plane area of ​​the second solder resist layer 202 may be smaller than the plane area of ​​the first solder resist layer 201. The second solder resist layer 202 may be made of the same material as the first solder resist layer 201, but is not limited thereto, and the second solder resist layer 202 may be made of a material different from that of the first solder resist layer 201.

[0191] The first portion 200a may include a portion of the first solder resist layer 201 and the second solder resist layer 202. The second portion 200b may include another portion of the first solder resist layer 201.

[0192] The first solder resist layer 201 and the second solder resist layer 202 may be configured to have the same width in the third direction. However, the present disclosure is not limited thereto, and the first solder resist layer 201 and the second solder resist layer 202 may have different widths in the third direction, so that the step portion in the first direction may be provided at an edge of the first portion 200a in the third direction.

[0193] According to the circuit boards and electronic component packages of some of the above-mentioned embodiments, by providing a solder mask layer to support the electronic components, it is possible to ensure that the spacing between the circuit board and the components mounted on the surface of the circuit board is sufficient, improve the cleaning ability under the electronic components installed in the surface mounting process, and prevent defects caused by residual solder flux. In addition, it is possible to prevent mold gap defects under the surface mounted components in the molding process, and to suppress the physical interference and electrical interference between the surface mounted components and the circuit board.

[0194] While the present disclosure has been described in connection with what are presently considered to be practical embodiments, it should be understood that the present disclosure is not limited to the disclosed embodiments, but on the contrary is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A circuit board, comprising: an insulating layer, wherein one surface of the insulating layer includes a first region and a second region adjacent to the first region, and the electronic component is mounted on the first region; A connecting pad is arranged in the first area; as well as a solder resist layer covering the one surface of the insulating layer and having an opening to expose the connection pad, wherein at least a portion of the solder resist layer extends from the second region to the first region, and In the first region, a portion of the insulating layer is exposed from the solder resist layer.

2. The circuit board according to claim 1, wherein: The solder resist layer includes a first portion disposed on the first area and a second portion disposed on the second area, and The first portion is disposed adjacent to one edge of the connection pad.

3. The circuit board according to claim 1, wherein: The solder resist layer includes a first portion disposed on the first area and a second portion disposed on the second area, and The first portion is disposed to at least partially overlap the connection pad in a first direction perpendicular to the one surface of the insulating layer.

4. The circuit board according to claim 1, wherein: The opening comprises: a first opening exposing at least a portion of the connection pad, and a second opening exposing a portion of the insulating layer in the first region, and The first opening and the second opening are connected as one body.

5. The circuit board according to claim 1, wherein: The solder resist layer comprises: a first portion and a second portion, the first portion being disposed on the first region and the second portion being disposed on the second region, and The opening comprises: a first opening exposing at least a portion of the connection pad; and a second opening exposing a portion of the insulating layer in the first region, and The first opening and the second opening are separated from each other by the first portion.

6. The circuit board according to claim 5, wherein: The first portion extends along an edge of the second opening.

7. A circuit board, comprising: an insulating layer, wherein one surface of the insulating layer includes a first region and a second region adjacent to the first region, and the electronic component is mounted on the first region; A connecting pad is arranged in the first area; as well as a solder resist layer covering the one surface of the insulating layer and having an opening to expose the connection pad, wherein the thickness of the first portion of the solder resist layer covering the first area along a first direction perpendicular to the one surface of the insulating layer is thicker than the thickness of at least a portion of the second portion of the solder resist layer covering the second area along the first direction perpendicular to the one surface of the insulating layer.

8. The circuit board according to claim 7, wherein: The electronic component includes a main body and an electrode portion provided on the main body and connected to the connection pad, and At least a portion of the first portion is disposed to overlap the connection pad along the first direction.

9. The circuit board according to claim 7, wherein: The solder resist layer includes an opening that exposes a portion of the insulating layer in the first region, The plurality of connection pads are arranged to be spaced apart from each other by openings arranged between the plurality of connection pads, and The first portion is disposed between the plurality of connection pads.

10. The circuit board according to claim 7, wherein: The first portion is disposed to overlap with a corner of the first region along the first direction.

11. The circuit board according to claim 7, wherein: The first portion is disposed to be spaced apart from the connection pad on the first region.

12. The circuit board according to claim 7, wherein: The opening comprises: a first opening exposing at least a portion of the connection pad, and The second opening exposes a portion of the insulating layer in the first region.

13. The circuit board according to claim 12, wherein: The first opening and the second opening are connected as one body.

14. The circuit board according to claim 12, wherein: The first opening and the second opening are separated from each other by the first portion.

15. The circuit board according to claim 12, wherein: A plurality of second openings are provided, and The first portion is disposed between the plurality of second openings.

16. The circuit board according to claim 12, wherein: The first portion extends along an edge of the second opening.

17. The circuit board according to claim 7, wherein: The solder resist layer comprises: a first solder resist layer disposed on the one surface of the insulating layer, and The second solder resist layer is disposed on the first solder resist layer to protrude from the first solder resist layer in the first direction.

18. The circuit board according to claim 17, wherein: In a plane parallel to the one surface of the insulating layer, a plane area of ​​the second solder resist layer is smaller than a plane area of ​​the first solder resist layer.

19. An electronic component package, comprising: an insulating layer, wherein one surface of the insulating layer includes a first region and a second region; an electronic component mounted on the first area; A connecting pad is arranged in the first area; as well as A solder resist layer covers the one surface of the insulating layer, has an opening to expose the connection pad, and is configured to support the electronic component.

20. The electronic component package according to claim 19, wherein: The solder resist layer includes a first portion disposed to overlap the electronic component in a first direction perpendicular to the one surface of the insulating layer to support the electronic component.

21. The electronic component package according to claim 20, wherein: The height of the lower surface of the electronic component from the one surface of the insulating layer along the first direction is equal to the height of the upper surface of the first part from the one surface of the insulating layer along the first direction, or the height of the lower surface of the electronic component from the one surface of the insulating layer along the first direction is higher than the height of the upper surface of the first part from the one surface of the insulating layer along the first direction.

22. The electronic component package according to claim 20, wherein: The first portion includes a portion that contacts the electronic component.

23. The electronic component package according to claim 19, further comprising a connection portion arranged to connect the electronic component and the connection pad to each other, in, At least a portion of the connection portion is disposed between the electronic component and the solder resist layer along a first direction perpendicular to the one surface of the insulating layer.

24. The electronic component package according to claim 19, wherein: The connection pad is embedded in the insulating layer, and one surface of the connection pad is exposed from the insulating layer.

25. The electronic component package of claim 19, wherein: The opening comprises: a first opening exposing at least a portion of the connection pad, and The second opening exposes a portion of the insulating layer in the first region.

26. The electronic component package according to claim 25, wherein: The first opening and the second opening are connected as one body.

27. The electronic component package according to claim 25, wherein: The first opening and the second opening are separated from each other by the first portion.

28. The electronic component package of claim 25, wherein: A plurality of second openings are provided, and The first portion is disposed between the plurality of second openings.

29. The electronic component package according to claim 19, wherein: The electronic component includes a main body and an electrode portion provided on the main body and connected to the connection pad, and The solder resist layer comprises: A first solder resist layer is disposed on the one surface of the insulating layer; and A second solder resist layer is disposed on the first solder resist layer to protrude from the first solder resist layer in a first direction perpendicular to the one surface of the insulating layer.

30. The electronic component package of claim 29, wherein: The second solder resist layer is provided at both ends of the electrode portion that are opposite to each other in a second direction perpendicular to the first direction.

31. The electronic component package of claim 29, wherein: The plurality of electrode portions are arranged to be opposite to each other in a second direction perpendicular to the first direction, and The second solder resist layer is provided at inner end portions of the plurality of electrode portions that are opposite to each other in the second direction.

32. The electronic component package of claim 29, wherein: The plurality of electrode portions are arranged to be opposite to each other in a second direction perpendicular to the first direction, and The second solder resist layer is provided between the plurality of electrode portions.

33. The electronic component package of claim 29, wherein: The second solder resist layer is disposed between the body of the electronic component and the first solder resist layer in the first direction.

34. A circuit board comprising: Insulation layer; a connection pad at least partially embedded in the insulating layer and having a surface exposed from the insulating layer; A solder resist layer, disposed on the insulating layer; as well as a first electronic component disposed on the insulating layer and connected to the connection pad via a connection portion disposed between the connection pad and the first electronic component, A portion of the solder resist layer overlapping the first electronic component in a first direction perpendicular to the one surface includes a first opening to expose a portion of the insulating layer.

35. The circuit board according to claim 34, wherein: The connection portion is disposed in the first opening of the solder resist layer.

36. The circuit board of claim 34, wherein: The connection portion is disposed in a second opening of the solder resist layer, and the second opening is spaced apart from the first opening of the solder resist layer.

37. The circuit board according to claim 34, wherein: A portion of the solder resist layer overlapping the first electronic component in the first direction has a thickness greater than a thickness of another portion of the solder resist layer, and the other portion of the solder resist layer is disposed on an area outside the first electronic component when viewed in the first direction.

38. The circuit board according to claim 34, wherein: The solder resist layer includes a portion disposed at one side of the connection portion and another portion disposed at the other side of the connection portion, and a thickness of the portion disposed at one side of the connection portion is greater than a thickness of the other portion disposed at the other side of the connection portion.

39. The circuit board according to claim 34, wherein: The solder resist layer includes other openings exposing a plurality of other connection pads partially embedded in the insulating layer, and, The circuit board further includes a second electronic component disposed on the insulating layer and connected to the plurality of other connection pads through other connection portions disposed in the other openings of the solder resist layer.

40. The circuit board according to claim 39, wherein A thickness of a portion of the solder resist layer extending in a region between the first electronic component and the second electronic component is smaller than a thickness of a portion of the solder resist layer overlapping the first electronic component in the first direction.

41. A circuit board comprising: Insulation layer; a connection pad at least partially embedded in the insulating layer and having a surface exposed from the insulating layer; A solder resist layer, disposed on the insulating layer; as well as a first electronic component disposed on the insulating layer and connected to the connection pad via a connection portion disposed between the connection pad and the first electronic component, wherein the solder resist layer comprises a first opening to expose a portion of the insulating layer overlapping the first electronic component in a first direction perpendicular to the one surface, and In the first direction perpendicular to the one surface, a lower surface of the first electronic component is at the same height as or higher than an upper surface of the solder resist layer.

42. The circuit board according to claim 41, wherein The connection portion is disposed in the first opening of the solder resist layer.

43. The circuit board according to claim 41, wherein The connection portion is disposed in a second opening of the solder resist layer, and the second opening is spaced apart from the first opening of the solder resist layer.

44. The circuit board according to claim 41, wherein A portion of the solder resist layer overlapping the first electronic component in the first direction has a thickness greater than a thickness of another portion of the solder resist layer, and the other portion of the solder resist layer is disposed on an area outside the first electronic component when viewed in the first direction.

45. The circuit board of claim 41, wherein: The solder resist layer includes a portion disposed at one side of the connection portion and another portion disposed at the other side of the connection portion, and a thickness of the portion disposed at one side of the connection portion is greater than a thickness of the other portion disposed at the other side of the connection portion.

46. ​​The circuit board of claim 41, wherein: The solder resist layer includes other openings exposing a plurality of other connection pads partially embedded in the insulating layer, and, The circuit board further includes a second electronic component disposed on the insulating layer and connected to the plurality of other connection pads through other connection portions disposed in the other openings of the solder resist layer.

47. The circuit board of claim 41, wherein: The connection portion is in contact with the solder resist layer.

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