Flexible circuit board and electronic device including same

Abstract

According to an embodiment of the present disclosure, an electronic device includes a housing including a first housing and a second housing, a hinge structure configured to rotatably connect the first housing and the second housing, and a flexible circuit board at least partially disposed on the hinge structure, wherein the flexible circuit board includes a first region at least partially configured to be bendable and a second region configured to extend from the first region, the first region including a first conductive layer, a (1-1) th cover layer stacked on the first conductive layer, and a (1-2) th cover layer stacked on the (1-1) th cover layer, the second region includes a second conductive layer forming the same conductive layer as the first conductive layer, and a second capping layer forming the same capping layer as the (1-1) th capping layer. Various embodiments are possible.

Description

Technical Field

[0001] Various embodiments disclosed herein relate to an electronic device, and, for example, to a flexible circuit board and an electronic device including the same. Background Art

[0002] With the remarkable development of information / communication technology, semiconductor technology, etc., various electronic devices have been widely used. In particular, recent electronic devices have been developed to be carried and used for communication.

[0003] An electronic device may refer to a device configured to perform a specific function according to an installed program, such as a household appliance, an electronic notepad, a portable multimedia player, a mobile communication terminal, a tablet PC, a video / audio device, a desktop / laptop computer, and a vehicle navigation system. For example, an electronic device may output stored information as sound or an image. In line with the high degree of integration of electronic devices and the widespread use of ultra-fast, high-capacity wireless communications, it has recently become possible to equip a single electronic device (e.g., a mobile communication terminal) with various functions. For example, not only communication functions, but also entertainment functions (e.g., games), multimedia functions (e.g., music / video playback), communication and security functions for mobile banking, etc., scheduling functions, and electronic wallet functions may be integrated into a single electronic device. Such an electronic device has become compact so that the user can conveniently carry the electronic device. Summary of the invention

[0004] Technical Solution

[0005] According to an embodiment of the present disclosure, an electronic device may include a housing, a hinge structure, or a flexible circuit board. The housing may include a first housing and a second housing. The hinge structure may be configured to rotatably connect the first housing and the second housing. The flexible circuit board may be at least partially disposed in the hinge structure. The flexible circuit board may include a first region or a second region. The first region may be at least partially configured to be bendable. The first region may include a first conductive layer, a (1-1)th covering layer, or a (1-2)th covering layer. The (1-1)th covering layer may be stacked on the first conductive layer. The (1-2)th covering layer may be stacked on the (1-1)th covering layer. The second region may be configured to extend from the first region. The second region may include a second conductive layer or a second covering layer. The second conductive layer may be configured to form the same conductive layer as the first conductive layer. The second covering layer may be configured to form the same covering layer as the (1-1)th covering layer.

[0006] According to an embodiment of the present disclosure, a flexible circuit board may include a first region or a second region. The first region may be at least partially configured to be bendable. The first region may include a first conductive layer, a (1-1)th covering layer, or a (1-2)th covering layer. The (1-1)th covering layer may be stacked on the first conductive layer. The (1-2)th covering layer may be stacked on the (1-1)th covering layer. The second region may be configured to extend from the first region. The second region may include a second conductive layer or a second covering layer. The second conductive layer may be configured to form a conductive layer identical to the first conductive layer. The second covering layer may be configured to form a covering layer identical to the (1-1)th covering layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The above and other aspects, features and advantages of the present disclosure will become more apparent through the following detailed description in conjunction with the accompanying drawings, in which:

[0008] Figure 1 A block diagram showing an electronic device in a network environment according to various embodiments is shown.

[0009] Figure 2 A diagram showing an unfolded state of an electronic device according to an embodiment of the present disclosure,

[0010] Figure 3 A diagram showing a folded state of an electronic device according to an embodiment of the present disclosure,

[0011] Figure 4 shows an exploded perspective view of an electronic device according to an embodiment of the present disclosure,

[0012] Figure 5 shows a cross-sectional view of a flexible circuit board and an electronic device according to an embodiment of the present disclosure,

[0013] Figure 6a and Figure 6b A cross-sectional view showing a portion of a flexible circuit board according to an embodiment of the present disclosure is shown,

[0014] Figure 7 A diagram showing a multilayer structure of a flexible circuit board according to an embodiment of the present disclosure,

[0015] Figure 8a , 8b 8c and 8d are diagrams showing a manufacturing process of a flexible circuit board according to an embodiment of the present disclosure, and

[0016] Fig. 9 A diagram showing a multilayer structure of a flexible circuit board according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0017] Figure 1is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0018] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (eg, display module 160).

[0019] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0020] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0021] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0022] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0023] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0024] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0025] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0026] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0027] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0028] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0029] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0030] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0031] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0032] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0033] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0034] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0035] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0036] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 197.

[0037] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0038] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0039] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0040] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0041] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)” or “connected to another element (e.g., the second element)” with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0042] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0043] Various embodiments as described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of a machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute it with or without one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to at least one of the called instructions. One or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between a case where data is semi-permanently stored in the storage medium and a case where data is temporarily stored in the storage medium.

[0044] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or distributed online (e.g., downloaded or uploaded) via an application store (e.g., PlayStoreTM), or distributed directly between two user devices (e.g., smart phones). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as a manufacturer's server, an application store's server, or a memory of a relay server.

[0045] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as the corresponding one component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0046] Figure 2 A diagram showing an unfolded state of an electronic device according to an embodiment of the present disclosure, Figure 3 A diagram illustrating a folded state of an electronic device according to an embodiment of the present disclosure.

[0047] Figure 2 and Figure 3 The configuration of the electronic device 101 in Figure 1 The configuration of the electronic device 101 in is partially or completely the same.

[0048] Figure 2 and Figure 3 The embodiments can be used with Figure 1 Embodiments or Figures 4 to 9 Combination of embodiments.

[0049] refer to Figure 2 and Figure 3 , the electronic device 101 may include a component for accommodating the electronic device 101 (eg, Figure 4 The present invention relates to a housing 202 having a hinge structure 280 in the housing 202 and a flexible display (hereinafter, display 230) disposed in a space formed by the housing 202. According to an embodiment, the housing 202 may also be a foldable housing. According to an embodiment, the display 230 may also be a foldable display.

[0050] According to an embodiment, the housing 202 may include a first housing 210 and a second housing 220 configured to rotate relative to the first housing 210 .

[0051] According to an embodiment, the first housing 210 and / or the second housing 220 may form at least a portion of the exterior of the electronic device 101. According to an embodiment, the surface on which the display 230 is visually exposed is defined as the front surface of the electronic device 101 and / or the housing 202 (e.g., the first front surface 210a and the second front surface 220a). The surface opposite to the front surface is defined as the rear surface of the electronic device 101 (e.g., the first rear surface 210b and the second rear surface 220b). The surface for surrounding at least a portion of the space between the front surface and the rear surface is defined as the side surface of the electronic device 101 (e.g., the first side surface 210c and the second side surface 220c).

[0052] According to an embodiment, the first housing 210 may be hinged by using a hinge structure (eg, Figure 4 The first housing 210 and the second housing 220 may be rotatably connected relative to the hinge structure 280. For example, each of the first housing 210 and the second housing 220 may be rotatably connected relative to the hinge structure 280. Thus, the electronic device 101 may be switched to a folded state (eg, Figure 3 ) or expanded state (for example, Figure 2). The electronic device 101 may be configured such that in the folded state, the first front surface 210a faces the second front surface 220a, and in the unfolded state, the direction in which the first front surface 210a is oriented is substantially the same as the direction in which the second front surface 220a is oriented. For example, in the unfolded state, the first front surface 210a may be positioned on substantially the same plane as the second front surface 220a. According to an embodiment, the second housing 220 may perform relative movement relative to the first housing 210.

[0053] According to an embodiment, the first housing 210 and the second housing 220 may be arranged on both sides around the folding axis A, and may have a substantially symmetrical shape with respect to the folding axis A. The first housing 210 and the second housing 220 may be configured such that an angle between the first housing 210 and the second housing 220 changes depending on whether the state of the electronic device 101 is an unfolded state, a folded state, or an intermediate state between the unfolded state and the folded state.

[0054] According to an embodiment, the electronic device 101 may include a hinge cover 240. At least a portion of the hinge cover 240 may be disposed between the first housing 210 and the second housing 220. According to an embodiment, the hinge cover 240 may be covered by a portion of the first housing 210 and the second housing 220 or exposed to the outside of the electronic device 101 according to the state of the electronic device 101. According to an embodiment, the hinge cover 240 may protect the hinge structure (e.g., Figure 4 The hinge cover 240 is used to protect the hinge structure (eg, the hinge structure 280 in the electronic device 101) from impact applied from the outside of the electronic device 101. Figure 4 The hinge structure 280 in the hinge housing.

[0055] According to an embodiment, Figure 2 As shown, when the electronic device 101 is in the unfolded state, the hinge cover 240 may be covered by the first housing 210 and the second housing 220, and thus may not be exposed. Figure 3 As shown, when the electronic device 101 is in a folded state (e.g., a fully folded state), the hinge cover 240 may be exposed to the outside between the first housing 210 and the second housing 220. As another embodiment, when the first housing 210 and the second housing 220 are in an intermediate state of being folded at a certain angle, the hinge cover 240 may be partially exposed to the outside between the first housing 210 and the second housing 220. However, in this case, the exposed area may be smaller than the exposed area in the fully folded state. In an embodiment, the hinge cover 240 may include a curved surface.

[0056] According to an embodiment, the display 230 may visually provide information to the outside of the electronic device 101 (e.g., a user). For example, the display 230 may include a hologram device or a projector and a control circuit for controlling a corresponding device. According to an embodiment, the display 230 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the strength of a force generated by a touch.

[0057] According to an embodiment, the display 230 may refer to a display whose at least a part of the area can be transformed into a flat surface or a curved surface. For example, the display 230 may be formed to be variable in response to the relative movement of the second shell 220 relative to the first shell 210. According to an embodiment, the display 230 may include a folding area 233, a first display area 231 arranged on one side (e.g., the upper side (+Y axis direction)) relative to the folding area 233, and a second display area 232 arranged on the other side (e.g., the lower side (-Y axis direction)). According to an embodiment, the folding area 233 may be located at a hinge structure (e.g., Figure 4 For example, at least a portion of the folding area 233 may face the hinge structure 280. According to an embodiment, the first display area 231 may be provided on the first housing 210, and the second display area 232 may be provided on the second housing 220. According to an embodiment, the display 230 may be accommodated in the first housing 210 and the second housing 220.

[0058] However, Figure 2 The division of the area of ​​the display 230 shown in may be exemplary, and the area of ​​the display 230 may also be divided into a plurality of (eg, four or more or two) areas according to its structure or function.

[0059] In addition, Figure 2 In the illustrated embodiment, the area of ​​the display 230 may be divided by a folding axis A or a folding area 233 extending parallel to the X axis. However, in another embodiment, the area of ​​the display 230 may also be divided with reference to another folding area (e.g., a folding area parallel to the Y axis) or another folding axis (e.g., a folding axis parallel to the Y axis). According to an embodiment, the display 230 may be coupled to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer configured to detect a magnetic field type stylus or be disposed adjacent to them.

[0060] According to an embodiment, the electronic device 101 may include a rear display 234. The rear display 234 may be disposed to be oriented in a direction different from that of the display 230. For example, the display 230 may be visually exposed through a front surface (e.g., the first front surface 210a and / or the second front surface 220a) of the electronic device 101, and the rear display 234 may be visually exposed through a rear surface (e.g., the first rear surface 210b) of the electronic device 101.

[0061] According to an embodiment, the electronic device 101 may include at least one of the camera module 204 or 206 and the flash 208. According to an embodiment, the electronic device 101 may include a front camera module 204 exposed through a front surface (e.g., a first front surface 210a) and / or a rear camera module 206 exposed through a rear surface (e.g., a first rear surface 210b). The camera module 204 or 206 may include one or more lenses, an image sensor, a flash, and / or an image signal processor. The flash 208 may include a light emitting diode or a xenon lamp. According to an embodiment, two or more lenses (an infrared camera lens, a wide-angle lens, and a telephoto lens) and an image sensor may be arranged on one surface of the electronic device 101. The configuration of the front camera module 204 and / or the rear camera module 206 may be the same as Figure 1 The configuration of the camera module 180 in is partially or completely the same.

[0062] Figure 4 An exploded perspective view of an electronic device according to an embodiment of the present disclosure is shown.

[0063] Figure 4 The embodiments can be used with Figures 1 to 3 Embodiments or Figures 5 to 9 Combination of embodiments.

[0064] refer to Figure 4 , the electronic device 201 may include a first housing 210 , a second housing 220 , a display 230 , a hinge cover 240 , a battery 250 , a printed circuit board 260 , a flexible circuit board 270 , and a hinge structure 280 . Figure 4 The configuration of the first housing 210, the second housing 220, the display 230 and the hinge cover 240 may be the same as Figure 2 and / or Figure 3 The configurations of the first shell 210, the second shell 220, the display 230 and the hinge cover 240 are completely or partially the same.

[0065] According to an embodiment, the electronic device 101 may include a first support member 212 and a second support member 222. For example, the first housing 210 may include the first support member 212, and the second housing 220 may include the second support member 222. According to an embodiment, the first support member 212 and / or the second support member 222 may support components of the electronic device 101 (e.g., the display 230, the battery 250, and the printed circuit board 260).

[0066] According to an embodiment, the first support member 212 and / or the second support member 222 may be formed of a metal material and / or a non-metallic (e.g., polymer) material. According to an embodiment, the first support member 212 may be disposed between the display 230 and the battery 250. For example, the display 230 may be coupled to one surface of the first support member 212, and the battery 250 and the printed circuit board 260 may be arranged on the other surface thereof.

[0067] According to an embodiment, the electronic device 101 may include a first protective member 214 and a second protective member 224. For example, the first housing 210 may include the first protective member 214, and the second housing 220 may include the second protective member 224. According to an embodiment, the protective members 214 and 224 may protect the display 230 from external impact. For example, the first protective member 214 may surround a portion of the display 230 (e.g., Figure 2 The second protective member 224 may surround at least a portion of the first display area 231 in the display 230, and the second protective member 224 may surround another portion of the display 230 (eg, Figure 2 According to an embodiment, the first protective member 214 may be a first cover member, and the second protective member 224 may be a second cover member.

[0068] According to an embodiment, the housings 210 and 220 may include a first rear plate 216 and a second rear plate 226. For example, the first housing 210 may include a first rear plate 216 connected to the first support member 212, and the second housing 220 may include a second rear plate 226 connected to the second support member 222. According to an embodiment, the rear plates 216 and 226 may form a portion of the exterior of the electronic device 101. For example, the first rear plate 216 may form a first rear surface (e.g., Figure 2 and Figure 3 The first rear surface 210b in the embodiment of the present invention, and the second rear plate 226 can form a second rear surface (eg, Figure 2 and Figure 3According to an embodiment, the first battery 252 and the first printed circuit board 262 may be arranged between the first support member 212 and the first rear plate 216, and the second battery 254 and the second printed circuit board 264 may be arranged between the second support member 222 and the second rear plate 226.

[0069] According to an embodiment, the hinge cover 240 may accommodate at least a portion of the hinge structure 280. For example, the hinge cover 240 may include a receiving groove 242 for accommodating the hinge structure 280. According to an embodiment, the hinge cover 240 may be coupled to the hinge structure 280. According to an embodiment, when the electronic device 101 is in the unfolded state, at least a portion of the hinge cover 240 may be located between the hinge structure 280 and the housings 210 and 220.

[0070] According to an embodiment, the battery 250 may be a device for supplying power to at least one element of the electronic device 101, and may include a non-rechargeable primary battery, a rechargeable storage battery, or a fuel cell. The battery 250 may also be integrally provided inside the electronic device 101, or may also be provided to be detachable from / attached to the electronic device 101. According to an embodiment, the battery 250 may include a first battery 252 provided in the first housing 210 and a second battery 254 provided in the second housing 220. For example, the first battery 252 may be provided on the first support member 212, and the second battery 254 may be provided on the second support member 222.

[0071] According to an embodiment, a processor (e.g., Figure 1 processor 120 in the processor 120), memory (e.g., Figure 1 130) and / or an interface (e.g., Figure 1 The interface 177 in the first housing 210 may be mounted on the printed circuit board 260. According to an embodiment, the printed circuit board 260 may include a first printed circuit board 262 disposed in the first housing 210 and a second printed circuit board 264 disposed in the second housing 220.

[0072] According to an embodiment, the flexible circuit board 270 may electrically connect a component (e.g., the first printed circuit board 262) located in the first housing 210 and a component (e.g., the second printed circuit board 264) located in the second housing 220. According to an embodiment, the flexible circuit board 270 may be a flexible printed circuit board (FPCB). According to an embodiment, at least a portion of the flexible circuit board 270 may pass through the hinge cover 240 and / or the hinge structure 280. For example, a portion of the flexible circuit board 270 may be provided in the first housing 210, and another portion may be provided in the second housing 220. According to an embodiment, the flexible circuit board 270 may be connected to an antenna or to the display 230. According to an embodiment, the flexible circuit board 270 may have at least a portion configured to be bendable.

[0073] According to an embodiment, the hinge structure 280 may be connected to the first housing 210 and the second housing 220. According to an embodiment, the first housing 210 may be rotated relative to the second housing 220 by using the hinge structure 280. According to an embodiment, the hinge structure 280 may be connected so that the first housing 210 and the second housing 220 can be moved from a folded state (e.g., Figure 3 ) to the expanded state (for example, Figure 2 ).

[0074] According to an embodiment, the hinge structure 280 may include a plurality of hinge structures 280-1 and 280-2 arranged in parallel. For example, the hinge structure 280 may include a first hinge structure 280-1 and a second hinge structure 280-2 spaced apart from the first hinge structure 280-1. According to an embodiment, the first hinge structure 280-1 may be symmetrical with the second hinge structure 280-2 with respect to the longitudinal direction (e.g., Y-axis direction) of the electronic device 101.

[0075] Figure 5 shows a cross-sectional view of a flexible circuit board and an electronic device according to an embodiment of the present disclosure, Figure 6a and Figure 6b A cross-sectional view of a portion of a flexible circuit board according to an embodiment of the present disclosure is shown.

[0076] Figure 5 The diagram shows Figure 2 Cross-sectional view taken along line BB'. Figure 6a The electronic device is shown in the unfolded state (eg, Figure 2 ) in a cross-sectional view of a flexible circuit board. Figure 6b The electronic device is shown in a folded state (eg, Figure 3 ) in the cross-sectional view of the flexible circuit board.

[0077] Figures 5 to 6b The embodiments can be used with Figures 1 to 4 Embodiments or Figures 7 to 9 Combination of embodiments.

[0078] refer to Figures 5 to 6b , the electronic device 101 (eg, Figures 1 to 4 The electronic device 101 in the embodiment may include a first shell 210 , a second shell 220 , a first printed circuit board 262 , a second printed circuit board 264 , a hinge structure 280 or a flexible circuit board 300 .

[0079] Figures 5 to 6b The configuration of the first housing 210, the second housing 220, the first printed circuit board 262, the second printed circuit board 264, the hinge structure 280 or the flexible circuit board 300 may be the same as Figure 4 The configurations of the first housing 210, the second housing 220, the first printed circuit board 262, the second printed circuit board 264, the hinge structure 280 or the flexible circuit board 270 are partially or entirely the same.

[0080] According to an embodiment, the flexible circuit board 300 may be a flexible printed circuit board (FPCB) The flexible circuit board 300 may have at least a portion disposed adjacent to the hinge structure 280 .

[0081] According to an embodiment, the flexible circuit board 300 may be disposed in a direction perpendicular to the folding axis (eg, Figure 2 In the direction of the folding axis A), it intersects with the first shell 210, the hinge structure 280 and the second shell 220.

[0082] According to an embodiment, the flexible circuit board 300 may electrically connect the first printed circuit board 262 and the second printed circuit board 264. According to an embodiment, the flexible circuit board 300 may also be defined and / or referred to as a connector-to-connector flexible printed circuit board (C2C FPCB) for connecting the first printed circuit board 262 and the second printed circuit board 264.

[0083] According to an embodiment, the flexible circuit board 300 may include a first connector 331 for connecting to the first printed circuit board 262, or a second connector 332 for connecting to the second printed circuit board 264. For example, the first connector 331 may be provided in a (1-1)th region (eg, Figure 6a and Figure 6b , and the second connector 332 may be disposed in a (1-2) region (eg, Figure 6a and Figure 6b In the (1-2)th area 312).

[0084] According to an embodiment, the flexible circuit board 300 may have at least a portion configured to be bendable. For example, when the electronic device 101 is in an unfolded state (eg, Figure 2 or Figure 6a ) or folded state (for example, Figure 3 or Figure 6b ), at least a portion of the flexible circuit board 300 can be folded or unfolded.

[0085] According to an embodiment, the flexible circuit board 300 may be a multi-layer circuit board in which one or more conductive layers or one or more insulating layers are stacked on each other. For example, the flexible circuit board 300 may include a multi-layer structure. For example, at least one conductive layer of the flexible circuit board 300 may include a conductive path for electrically connecting the first printed circuit board 262 and the second printed circuit board 264.

[0086] According to an embodiment, the conductive path may be a configuration formed on at least one conductive layer to transmit power from a power management module (eg, Figure 1 power (or power supply) provided by the power management module 188 in the processor (e.g., Figure 1 A signal provided by the processor 120 in the processor.

[0087] According to an embodiment, the conductive path may be used to connect the antenna module (e.g. Figure 1 The communication signal provided by the antenna module 197 in the communication module is delivered to the communication module (e.g., Figure 1 The communication module 190 in the communication module or the configuration of delivering the communication signal of the communication module to the antenna module.

[0088] Reference Figure 6a and Figure 6b , the flexible circuit board 300 may include a first area 301 or a second area 302 extending from the first area 301. According to an embodiment, the first area 301 may also be defined as an area extending from the second area 302.

[0089] According to an embodiment, the first region 301 may include a (1-1)th region 311 , a (1-2)th region 312 , or a (1-3)th region 313 .

[0090] According to an embodiment, at least a portion of the (1-1) region 311 may be disposed on the first housing 210 or disposed inside the first housing 210. According to an embodiment, at least a portion of the (1-2) region 312 may be disposed on the second housing 220 or disposed inside the second housing 220. According to an embodiment, at least a portion of the (1-3) region 313 may be disposed on the hinge structure 280 or disposed adjacent to the hinge structure 280.

[0091] According to an embodiment, the second region 302 may include a (2-1)th region 321 or a (2-2)th region 322 .

[0092] According to an embodiment, at least a portion of the (2-1)th region 321 may be disposed on the first housing 210 or disposed inside the first housing 210. According to an embodiment, at least a portion of the (2-2)th region 322 may be disposed on the second housing 220 or disposed inside the second housing 220. According to an embodiment, at least one of the (2-1)th region 321 or the (2-2)th region 322 may be disposed on the hinge structure 280 or disposed adjacent to the hinge structure 280.

[0093] According to an embodiment, the (1-1)th region 311, the (1-2)th region 312, and the (1-3)th region 313 may have substantially the same structure (e.g., the same multilayer structure). According to an embodiment, the (1-1)th region 311 may be connected to the (2-1)th region 321, the (1-2)th region 312 may be connected to the (2-2)th region 322, and the (1-3)th region 313 may be connected to the (2-1)th region 321 and the (2-2)th region 322.

[0094] According to an embodiment, the (2-1)th region 321 and the (2-2)th region 322 may have substantially the same structure (e.g., the same multilayer structure). According to an embodiment, the (2-1)th region 321 may be connected to the (1-1)th region 311 and the (1-3)th region 313, and the (2-2)th region 322 may be connected to the (1-2)th region 312 and the (1-3)th region 313.

[0095] According to an embodiment, the number of the multiple layers in the first region 301 may be different from the number of the multiple layers in the second region 302. A detailed description thereof will be described later.

[0096] For example, the flexible circuit board 300 may be defined as having a structure in which the (1-1)th region 311, the (2-1)th region 321, the (1-3)th region 313, the (2-2)th region 322, and the (1-2)th region 312 are connected to each other in sequence or in reverse order.

[0097] According to an embodiment, when the electronic device 101 is in an unfolded state (eg, Figure 2 or Figure 6a ), at least a portion of the (1-1)th region 311 and / or the (1-2)th region 312 may be deformed by bending or folding. According to an embodiment, when the electronic device 101 is in the unfolded state (for example, Figure 3 or Figure 6a), at least a portion of the (1-1) region 311 and / or the (1-2) region 312 may be deformed by bending or folding.

[0098] When the electronic device is repeatedly unfolded or folded, repeated bending loads may be applied to the deformable portion (e.g., the first portion B1) of the flexible circuit board. At least a portion of the conductive layer located at the first portion B1 may be damaged due to repeated stretching or contraction by the bending load. In addition, when the electronic device is switched from the folded state to the unfolded state, the second portion B2 of the flexible circuit board adjacent to the first portion B1 may be pressed by the first portion B1, so that a repulsive force may be formed in the second portion B2. Therefore, when the electronic device is switched from the folded state to the unfolded state, noise is sometimes generated in the second portion B2 due to the repulsive force.

[0099] According to an embodiment, the flexible circuit board 300 may be configured to provide different multilayer structures of the first region 301 and the second region 302, thereby reducing the occurrence of damage to the conductive layer of the first portion B1 or reducing the occurrence of noise in the second portion B2. A detailed description thereof will be described later.

[0100] Figure 7 A diagram showing a multilayer structure of a flexible circuit board according to an embodiment of the present disclosure.

[0101] Figure 7 The embodiments can be used with Figures 1 to 6b Embodiments or Figures 8a to 9 Combination of embodiments.

[0102] Reference Figure 7 , the electronic device 101 (eg, Figures 1 to 5 The electronic device 101 in the embodiment may include a flexible circuit board 400 (eg, Figures 5 to 6b According to an embodiment, the flexible circuit board 400 may include a first area 401 or a second area 402.

[0103] Figure 7 The configuration of the first region 401 or the second region 402 in Figures 5 to 6b The configuration of the first area 301 or the second area 302 is partially or completely the same.

[0104] Figure 7 The illustrated exemplary embodiment may be used to explain the multi-layer structure of the first region 401 and the second region 402 of the flexible circuit board 400 . Figure 6a and Figure 6b The first region 301, the (1-1)th region 311, the (1-2)th region 312, or the (1-3)th region 313 in the embodiment may have the same Figure 7The multilayer structure of the first region 401 in the embodiment is substantially the same as or similar to the multilayer structure. Figure 6a and Figure 6b The second region 302, the (2-1)th region 321 or the (2-2)th region 322 in Figure 7 The multilayer structure of the second region 402 in the embodiment is substantially the same as or similar to the multilayer structure.

[0105] Reference Figure 7 , the thickness of the first region 401 (eg, in the thickness direction of the electronic device or the flexible circuit board (eg, Figure 7 in the Z-axis direction)) is greater than the thickness of the second region 402.

[0106] According to an embodiment, the first region 401 may have seven layers and the second region 402 may have five layers, but is not limited thereto. According to an embodiment, the number of layers in the first region 401 may be greater than the number of layers in the second region 402.

[0107] According to one embodiment, the flexible circuit board 400 may include a first layer (layer 1) to a seventh layer (layer 7). For example, the first region 401 may include a first layer (layer 1) to a seventh layer (layer 7). In addition, the second region 402 may include a first layer (layer 1) to a fifth layer (layer 5). For example, the number of layers in the second region 402 may be less than the number of layers in the first region 401.

[0108] According to an embodiment, the first region 401 may include a first FCCL layer 411, a first cover layer 414, or a first film layer 419. According to an embodiment, the first FCCL layer 411 may also be defined and / or referred to as a first flexible copper clad laminate.

[0109] According to an embodiment, the second region 402 may include a second FCCL layer 421, a second cover layer 424, or a second film layer 429. According to an embodiment, the second FCCL layer 421 may also be defined and / or referred to as a second flexible copper clad laminate.

[0110] According to an embodiment, the first FCCL layer 411 may include at least one (1-1)th insulating layer 412 and at least one first conductive layer 413 stacked on the at least one (1-1)th insulating layer 412. According to an embodiment, the (1-1)th insulating layer 412 may be a base layer based on polypropylene glycol (PPG) or polyimide (PI). According to an embodiment, the at least one first conductive layer 413 may be stacked on one surface (e.g., Figure 7 A metal thin plate (e.g., copper (Cu)) on a surface oriented in the +Z axis direction.

[0111] According to an embodiment, the second FCCL layer 421 may include at least one (2-1)th insulating layer 422 and at least one second conductive layer 423 stacked on the at least one (2-1)th insulating layer 422. According to an embodiment, the (2-1)th insulating layer 422 may be a base layer based on polypropylene glycol (PPG) or polyimide (PI). According to an embodiment, the at least one second conductive layer 423 may be stacked on one surface (e.g., Figure 7 A metal thin plate (e.g., copper (Cu)) on a surface oriented in the +Z axis direction.

[0112] According to an embodiment, at least one (1-1)th insulating layer 412 and at least one (2-1)th insulating layer 422 may be formed as substantially the same insulating layer. For example, at least one (1-1)th insulating layer 412 and at least one (2-1)th insulating layer 422 may be defined and / or interpreted as substantially the same (or one) insulating layer.

[0113] According to an embodiment, at least one first conductive layer 413 and at least one second conductive layer 423 may be formed as substantially the same conductive layer. For example, at least one first conductive layer 413 and at least one second conductive layer 423 may be defined and / or interpreted as substantially the same (or one) conductive layer.

[0114] According to an embodiment, the first layer (layer 1) may include at least one (1-1)th insulating layer 412 and at least one (2-1)th insulating layer 422. According to an embodiment, the thickness of at least one (1-1)th insulating layer 412 and the thickness of at least one (2-1)th insulating layer 422 (e.g., Figure 7 The thickness in the Z-axis direction (in FIG. 1 ) may be about 11 micrometers (μm) to about 13 μm, for example, about 12 μm.

[0115] According to an embodiment, the second layer (layer 2) may include at least one first conductive layer 413 and at least one second conductive layer 423. According to an embodiment, the thickness of the at least one first conductive layer 413 and the thickness of the at least one second conductive layer 423 (e.g., Figure 7 The thickness in the Z-axis direction (in FIG. 1 ) can be about 11 micrometers (μm) to about 13 μm, for example, about 12 μm.

[0116] According to an embodiment, the first capping layer 414 may be stacked on one surface (eg, on the first FCCL layer 411). Figure 7 The first conductive layer 414 may be a surface oriented in the +Z-axis direction of the conductive layer 410 or a surface of the first conductive layer 413. According to an embodiment, the first cover layer 414 may include (1-1)th cover layers 415 and 416 or (1-2)th cover layers 417 and 418.

[0117] According to an embodiment, the (1-1)th capping layers 415 and 416 may include a first conductive layer 413 stacked on one surface (eg, Figure 7 The (1-1)th adhesive layer 415 on the surface oriented in the +Z axis direction in the embodiment of the present invention, or the (1-2)th insulating layer 416 stacked on one surface of the (1-1)th adhesive layer 415.

[0118] According to an embodiment, the (1-1)th adhesive layer 415 may include an adhesive or a double-sided tape. According to an embodiment, the (1-1)th adhesive layer 415 may be configured to bond the first conductive layer 413 and the (1-2)th insulating layer 416 .

[0119] According to an embodiment, the (1-2)th insulating layer 416 may be a base layer based on polypropylene glycol (PPG) or polyimide (PI).

[0120] According to an embodiment, the (1-2)th capping layers 417 and 418 may include a layer stacked on one surface (eg, Figure 7 The (1-2)th adhesive layer 417 on the surface oriented in the +Z axis direction in the embodiment of the present invention, or the (1-3)th insulating layer 418 stacked on one surface of the (1-2) adhesive layer 417.

[0121] According to an embodiment, the (1-2)th adhesive layer 417 may include an adhesive or a double-sided tape. According to an embodiment, the (1-2)th adhesive layer 417 may be configured to bond the (1-2)th insulating layer 416 and the (1-3)th insulating layer 418.

[0122] According to an embodiment, the (1-3)th insulating layer 418 may be a base layer based on polypropylene glycol (PPG) or polyimide (PI).

[0123] According to an embodiment, the second capping layer 424 may be stacked on one surface (eg, at Figure 7 A surface oriented in the +Z axis direction) or a surface of the second conductive layer 423.

[0124] According to an embodiment, the second cover layer 424 may include a layer stacked on one surface (eg, Figure 7 A second adhesive layer 425 on a surface oriented in the +Z axis direction) or a (2-2) insulating layer 426 stacked on one surface of the second adhesive layer 425 is bonded.

[0125] According to an embodiment, the second adhesive layer 425 may include an adhesive or a double-sided tape. According to an embodiment, the second adhesive layer 425 may be configured to bond the second conductive layer 423 and the (2-2)th insulating layer 426 .

[0126] According to an embodiment, the (2-2)th insulating layer 426 may be a base layer based on polypropylene glycol (PPG) or polyimide (PI).

[0127] According to an embodiment, the (1-1)th adhesive layer 415 and the second adhesive layer 425 may be formed as substantially the same adhesive layer. For example, the (1-1)th adhesive layer 415 and the second adhesive layer 425 may be defined and / or interpreted as substantially the same (or one) adhesive layer.

[0128] According to an embodiment, the (1-2)th insulating layer 416 and the (2-2)th insulating layer 426 may be formed as substantially the same insulating layer. For example, the (1-2)th insulating layer 416 and the (2-2)th insulating layer 426 may be defined and / or interpreted as substantially the same (or one) insulating layer.

[0129] According to an embodiment, the third layer (layer 3) may include a (1-1)th adhesive layer 415 and a second adhesive layer 425. According to an embodiment, the thickness of the (1-1)th adhesive layer 415 and the thickness of the second adhesive layer 425 (eg, Figure 7 The thickness in the Z-axis direction (in FIG. 1 ) may be about 9 micrometers (μm) to about 11 μm, for example, about 10 μm.

[0130] According to an embodiment, the fourth layer (layer 4) may include a (1-2)th insulating layer 416 and a (2-2)th insulating layer 426. According to an embodiment, the thickness of the (1-2)th insulating layer 416 and the thickness of the (2-2)th insulating layer 426 (e.g., Figure 7 The thickness in the Z-axis direction (in FIG. 1 ) can be about 6.5 micrometers (μm) to about 8.5 μm, for example, about 7.5 μm.

[0131] According to an embodiment, the (1-1)th adhesive layer 415 of the first region 401 and the second adhesive layer 425 of the second region 402 and the (1-2)th insulating layer 416 of the first region 401 and the (2-2)th insulating layer 426 of the second region 402 may be formed as substantially the same covering layer. For example, the (1-1)th adhesive layer 415 and the second adhesive layer 425 and the (1-2)th insulating layer 416 and the (2-2)th insulating layer 426 may be defined and / or interpreted as substantially the same (or one) covering layer. For example, the (1-1)th covering layers 415 and 416 of the first region 401 and the second covering layers 425 and 426 of the second region 402 may be defined and / or interpreted as substantially the same (or one) covering layer.

[0132] According to an embodiment, the second region 402 may not have a cover layer corresponding to the (1-2)th cover layers 417 and 418 of the first region 401, compared to the first region 401. In other words, the first region 401 may include additional cover layers (e.g., the (1-2)th cover layers 417 and 418) compared to the second region 402.

[0133] According to an embodiment, the first film layer 419 may be stacked on one surface of the (1-2)th cover layer 417 and 418 (eg, on Figure 7 For example, the first film layer 419 may be stacked on one surface of the (1-3)th insulating layer 418. According to an embodiment, the first film layer 419 may be an EMI film for shielding electromagnetic waves generated from electronic components around the flexible circuit board 400.

[0134] According to an embodiment, the second film layer 429 may be stacked on one surface of the second cover layers 425 and 426 (eg, on Figure 7 For example, the second film layer 429 may be stacked on one surface of the (2-2)th insulating layer 426. According to an embodiment, the second film layer 429 may be an EMI film for shielding electromagnetic waves generated from electronic components around the flexible circuit board 400.

[0135] According to an embodiment, the fifth layer (layer 5) may include a (1-2)th adhesive layer 417 and a second film layer 429. According to an embodiment, the thickness (eg, Figure 7 The thickness in the Z-axis direction of the film 429 may be about 7 micrometers (μm) to about 9 μm, for example, about 8 μm. According to an embodiment, the thickness of the second film layer 429 (for example, Figure 7 The thickness in the Z-axis direction (in FIG. 1 ) may be approximately 14.5 μm to 16.5 μm, for example, approximately 15.5 μm.

[0136] According to an embodiment, the sixth layer (layer 6) may include a (1-3)th insulating layer 418. According to an embodiment, the thickness (eg, Figure 7 The thickness in the Z-axis direction (in FIG. 1 ) can be about 4 micrometers (μm) to about 6 μm, for example, about 5 μm.

[0137] According to an embodiment, the seventh layer (layer 7) may include a first film layer 419. According to an embodiment, the thickness of the first film layer 419 (eg, Figure 7 The thickness in the Z-axis direction (in FIG. 1 ) can be about 14.5 micrometers (μm) to about 16.5 μm, for example, about 15.5 μm.

[0138] According to an embodiment, the first region 401 may include additional cover layers (eg, (1-2)th cover layers 417 and 418) compared to the second region 402. Therefore, the thickness of the first region 401 (eg, Figure 7 The thickness in the Z-axis direction of the structure can be greater than the thickness of the second region 402.

[0139] According to an embodiment, the second region 402 may have a thinner thickness than the first region 401, and thus may have a lower rigidity than the first region 401. According to an embodiment, when an electronic device (e.g., Figures 2 to 5 When the electronic device 101 in the embodiment is repeatedly switched (for example, folded or unfolded), since the second region 402 has a relatively lower rigidity than the first region 401, a small repulsive force can be formed. Figure 6a The noise generated in the second part B2) of the circuit.

[0140] In addition, the first region 401 may have a thickness thicker than the second region 402, and thus may have a higher rigidity than the second region 402. According to an embodiment, the first region 401 may include an additional cover layer (e.g., the (1-2)th cover layers 417 and 418) compared to the second region 402, and thus, in an electronic device (e.g., Figures 2 to 5 In the case where the electronic device 101 in the flexible circuit board 400 is repeatedly switched (e.g., folded or unfolded), the repeated load delivered to the first conductive layer 413 can be reduced. For example, the first region 401 may include the (1-2)th covering layers 417 and 418, so that when the flexible circuit board 400 is switched, a neutral surface or neutral axis for shear deformation can be formed on the first conductive layer 413. Therefore, in the case of repeated switching of the electronic device, damage to the first conductive layer 413 can be reduced or prevented.

[0141] Figure 8a , 8b 8c and 8d are diagrams showing a manufacturing process of a flexible circuit board according to an embodiment of the present disclosure, and Fig. 9 A diagram showing a multilayer structure of a flexible circuit board according to an embodiment of the present disclosure.

[0142] Figures 8a to 9 The embodiments can be used with Figures 1 to 7 Combination of embodiments.

[0143] refer to Figures 8a to 9 , electronic devices (e.g. Figures 1 to 5 The flexible circuit board 500 of the electronic device 101 in FIG. 1 may include a first insulating region 512 , a first conductive region 513 , a first adhesive region 515 , a second insulating region 516 , a second adhesive region 517 , a third insulating region 518 , or a film region 519 .

[0144] refer to Figure 8a and Figure 8b , the manufacturing process of the flexible circuit board may include a process of coupling the first cover areas 515 and 516 and the second cover areas 517 and 518 or a process of laminating the first cover areas 515 and 516 and the second cover areas 517 and 518 .

[0145] According to an embodiment, the second coverage areas 517 and 518 may have a smaller width than the first coverage areas 515 and 516. For example, Figure 8a As shown, the second coverage areas 517 and 518 may be defined as remaining areas from which the partial area D has been removed compared to the first coverage areas 515 and 516, or alternatively, may be defined as having a smaller size than the first coverage areas 515 and 516 minus the size of the partial area D.

[0146] According to an embodiment, the first covering regions 515 and 516 may include a first adhesive region 515 and a second insulating region 516. According to an embodiment, the first adhesive region 515 may include a (1-1)th adhesive layer (eg, Figure 7 The first (1-1) adhesive layer 415) and the second adhesive layer (eg, Figure 7 In addition, the first adhesive region 515 may form a flexible circuit board (eg, Figure 7 The third layer (eg, Figure 7 According to an embodiment, the second insulating region 516 may include a (1-2)th insulating layer (eg, Figure 7 The (1-2)th insulating layer 416) and the (2-2)th insulating layer (for example, Figure 7 In addition, the second insulating region 516 may form a fourth layer of the flexible circuit board (eg, Figure 7 The fourth layer (layer 4) in FIG.

[0147] According to an embodiment, the second cover regions 517 and 518 may include a second adhesive region 517 and a third insulating region 518. According to an embodiment, the second adhesive region 517 may include a (1-2)th adhesive layer (eg, Figure 7 In addition, the second adhesive region 517 may form a fifth layer of the flexible circuit board (eg, Figure 7 According to an embodiment, the third insulating region 518 may include the (1-3)th insulating layer (eg, Figure 7In addition, the third insulating region 518 may form a sixth layer of the flexible circuit board (eg, Figure 7 at least a portion of a sixth layer (layer 6)) in.

[0148] refer to Figure 8c and Figure 8d The manufacturing process of the flexible circuit board may include a process of coupling the FCCL regions 512 and 513 and the film region 519 or laminating the FCCL regions 512 and 513 and the film region 519 to Figure 8b Process on a laminate as shown in FIG.

[0149] According to an embodiment, the FCCL regions 512 and 513 may include a first insulating region 512 and a conductive region 513. According to an embodiment, the first insulating region 512 may include a (1-1)th insulating layer (eg, Figure 7 The (1-1)th insulating layer 412) and the (2-1)th insulating layer (for example, Figure 7 In addition, the first insulating region 512 may form a first layer of a flexible circuit board (eg, Figure 7 According to an embodiment, the conductive region 513 may include a first conductive layer (eg, Figure 7 The first conductive layer 413 in the embodiment and the second conductive layer (eg, Figure 7 In addition, the conductive region 513 may form a second layer of the flexible circuit board (eg, Figure 7 The second layer (layer 2) in the.

[0150] According to an embodiment, the film region 519 may include a first film region 519a and a second film region 519b. According to an embodiment, the first film region 519a may include a first film layer (eg, Figure 7 According to an embodiment, the first film region 519a may form the seventh layer of the flexible circuit board (eg, Figure 7 According to an embodiment, the second film region 519b may include a second film layer (eg, Figure 7 According to an embodiment, the second film region 519b may form a fifth layer of the flexible circuit board (eg, Figure 7 at least a portion of the fifth layer (layer 5)) in.

[0151] refer to Figure 8d and Fig. 9 The flexible circuit board 500 on which the above-mentioned lamination process has been completed may include a first area 501 (eg, Figure 7 401 in the first region 401) and the second region 502 (for example, Figure 7The second area 402 in the FIG.

[0152] refer to Figure 8d , the film region 519 may have a first film region 519a and a second film region 519b formed as separate regions. For example, in the case of stacking the film region 519, the film region 519 may be divided into the first film region 519a and the second film region 519b to be stacked on the third insulating region 518 and the second insulating region 516, respectively.

[0153] refer to Fig. 9 , the film region 519 may have a first film region 519a and a second film region 519b formed as an integral region. For example, the first film region 519a and the second film region 519b may be connected by a third film region 519c. The first film region 519a, the second film region 519b, and the third film region 519c may be formed integrally. For example, in the case of stacking the film region 519, a portion of the film region 519 may be stacked to cover a portion of the side surface of the second adhesive region 517 and a portion of the side surface of the third insulating region 518 so as to form the third film region 519c.

[0154] An electronic device (e.g., a mobile terminal) may include a display having a flat surface or a flat surface and a curved surface. Due to the fixed structure of the display, an electronic device including a display of an existing type may require other terminals in order to implement a screen larger than the size of the electronic device. Therefore, an electronic device including a foldable or rollable display is being studied.

[0155] An electronic device including a foldable display may include at least one flexible circuit board (e.g., FPCB) disposed to intersect a folding axis of the foldable electronic device. The flexible circuit board may be configured to electrically connect a circuit board (e.g., PCB) or an electrical component disposed in a housing on one side thereof with a circuit board or an electrical component disposed in a housing on the other side.

[0156] The flexible circuit board may be configured so that when the electronic device is folded or unfolded, at least a portion thereof is unfolded or folded. When at least a portion of the flexible circuit board is repeatedly deformed, the conductive path of the flexible circuit board may be damaged by the load repeatedly applied thereto. In addition, when the flexible circuit board is repeatedly deformed, noise may be generated due to the repulsive force formed in a portion of the flexible circuit board.

[0157] According to an embodiment of the present disclosure, a flexible circuit board capable of preventing a conductive layer of the flexible circuit board from being damaged and an electronic device including the same may be provided.

[0158] According to an embodiment of the present disclosure, a flexible circuit board capable of reducing noise generation in a portion of the flexible circuit board when at least a portion of the flexible circuit board is folded or unfolded, and an electronic device including the same may be provided.

[0159] However, the problems to be solved in the present disclosure are not limited to the mentioned problems, and various extensions can be made within the scope not departing from the concept and scope of the present disclosure.

[0160] A flexible circuit board and an electronic device including the same according to an embodiment of the present disclosure may be provided to alleviate a load applied to a conductive layer in a case where the flexible circuit board is repeatedly deformed by bending.

[0161] A flexible circuit board and an electronic device including the same according to an embodiment of the present disclosure may reduce noise generated in a portion of a flexible circuit board when the flexible circuit board is deformed due to bending.

[0162] Effects obtainable from the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood from the following description by those skilled in the art to which the present disclosure pertains.

[0163] According to an embodiment of the present disclosure, an electronic device (eg, Figures 1 to 5 The electronic device 101 in the embodiment may include a housing (eg, Figure 2 The housing 202 in the embodiment of the present invention), the hinge structure (eg, Figure 4 The hinge structure 280 in the embodiment of the present invention) or a flexible circuit board (eg, Figures 5 to 6b The flexible circuit board 300 or Figure 7 The housing may include a first housing (eg, Figures 2 to 5 The first shell 210 and the second shell (eg, Figures 2 to 5 The hinge structure may be configured to rotatably connect the first shell and the second shell. The flexible circuit board may be at least partially disposed in the hinge structure. The flexible circuit board may include a first region (e.g., Figure 7 401) or the second region (e.g., Figure 7 The first region may be configured at least in part to be bendable. The first region may include a first conductive layer (e.g., Figure 7 The first conductive layer 413 in the embodiment of the present invention), the (1-1)th covering layer (for example, Figure 7 ), or the (1-2)th covering layer (e.g., Figure 7The (1-2)th covering layer 417 and 418 in the embodiment of the present invention). The (1-1)th covering layer may be stacked on the first conductive layer. The (1-2)th covering layer may be stacked on the (1-1)th covering layer. The second region may be configured to extend from the first region. The second region may include a second conductive layer (e.g., Figure 7 The second conductive layer 423 in the embodiment of the present invention) or the second covering layer (eg, Figure 7 The second conductive layer may be configured to form the same conductive layer as the first conductive layer. The second conductive layer may be configured to form the same conductive layer as the (1-1)th conductive layer.

[0164] According to an embodiment, a thickness of the first region may be greater than a thickness of the second region.

[0165] According to an embodiment, the flexible circuit board may further include a (1-1)th insulating layer (eg, Figure 7 The (1-1)th insulating layer 412) or the (2-1)th insulating layer (for example, Figure 7 The (2-1)th insulating layer 422 in the embodiment of the present invention). The (1-1)th insulating layer may be stacked on the first conductive layer. The (1-1)th insulating layer may be arranged to face a direction opposite to the (1-1)th covering layer. The (2-1)th insulating layer may be stacked on the second conductive layer. The (2-1)th insulating layer may be arranged to face a direction opposite to the second covering layer. The (2-1)th insulating layer may be configured to form the same insulating layer as the (1-1)th insulating layer.

[0166] According to an embodiment, the thickness of the first conductive layer may be substantially the same as the thickness of the (1-1)th insulating layer. The thickness of the second conductive layer may be substantially the same as the thickness of the (2-1)th insulating layer.

[0167] According to an embodiment, the flexible circuit board may further include a first film layer (eg, Figure 7 The first film layer 419) or the second film layer (for example, Figure 7 The first film layer may be stacked on the (1-2)th covering layer. The first film layer may be arranged to face a direction opposite to the (1-1)th covering layer. The second film layer may be stacked on the second covering layer. The second film layer may be arranged to face a direction opposite to the second conductive layer.

[0168] According to an embodiment, a thickness of the first film layer may be substantially the same as a thickness of the second film layer.

[0169] According to an embodiment, the first film layer and the second film layer may be formed as separate film layers.

[0170] According to an embodiment, the first film layer and the second film layer may be formed as an integral film layer.

[0171] According to an embodiment, the (1-1)th covering layer may include a (1-1)th adhesive layer (eg, Figure 7 The (1-1) adhesive layer 415) or the (1-2) insulating layer (eg, Figure 7 The (1-2)th insulating layer 416 in the embodiment of the present invention). The (1-1)th adhesive layer may be stacked on the first conductive layer. The (1-2)th insulating layer may be stacked on the (1-1)th adhesive layer. The (1-2)th insulating layer may be arranged to face a direction opposite to the first conductive layer.

[0172] According to an embodiment, the second cover layer may include a second adhesive layer (eg, Figure 7 The second adhesive layer 425 in the embodiment) or the (2-2) insulating layer (eg, Figure 7 The second adhesive layer may be stacked on the second conductive layer. The second adhesive layer may be configured to form the same adhesive layer as the (1-1) adhesive layer. The (2-2) insulating layer may be stacked on the second adhesive layer. The (2-2) insulating layer may be arranged to face a direction opposite to the second conductive layer. The (2-2) insulating layer may be configured to form the same insulating layer as the (1-2) insulating layer.

[0173] According to an embodiment, a thickness of the (1-1)th adhesive layer may be greater than a thickness of the (1-2)th insulating layer.

[0174] According to an embodiment, the (1-2)th covering layer may include a (1-2)th adhesive layer (eg, Figure 7 The (1-2) adhesive layer 417) or the (1-3) insulating layer (e.g., Figure 7 The (1-3) insulating layer 418 in the (1-2) adhesive layer may be stacked on the (1-2) insulating layer. The (1-2) adhesive layer may be arranged to face a direction opposite to the (1-1) adhesive layer. The (1-3) insulating layer may be stacked on the (1-2) adhesive layer. The (1-3) insulating layer may be arranged to face a direction opposite to the (1-2) insulating layer.

[0175] According to an embodiment, a thickness of the (1-2)th adhesive layer may be greater than a thickness of the (1-3)th insulating layer.

[0176] According to an embodiment, a thickness of the (1-1)th adhesive layer may be greater than a thickness of the (1-2)th adhesive layer.

[0177] According to an embodiment, a thickness of the (1-2)th insulating layer may be greater than a thickness of the (1-3)th insulating layer.

[0178] According to an embodiment of the present disclosure, a flexible circuit board (eg, Figure 5 and Figure 6b The flexible circuit board 300, or Figure 7 The flexible circuit board 400 in the embodiment may include a first region (eg, Figure 7 401) or the second region (e.g., Figure 7 The first region may be configured at least in part to be bendable. The first region may include a first conductive layer (e.g., Figure 7 The first conductive layer 413 in the embodiment of the present invention), the (1-1)th covering layer (for example, Figure 7 The (1-1)th covering layer 415 and 416) or the (1-2)th covering layer (e.g., Figure 7 The (1-2)th covering layer 417 and 418 in the embodiment of the present invention). The (1-1)th covering layer may be stacked on the first conductive layer. The (1-2)th covering layer may be stacked on the (1-1)th covering layer. The second region may be configured to extend from the first region. The second region may include a second conductive layer (e.g., Figure 7 The second conductive layer 423 in the embodiment of the present invention) or the second covering layer (eg, Figure 7 The second conductive layer may be configured to form the same conductive layer as the first conductive layer. The second conductive layer may be configured to form the same conductive layer as the (1-1)th conductive layer.

[0179] According to an embodiment, the flexible circuit board may further include a first film layer (eg, Figure 7 The first film layer 419) or the second film layer (for example, Figure 7 The first film layer may be stacked on the (1-2)th covering layer. The second film layer may be stacked on the second covering layer.

[0180] According to an embodiment, the (1-1)th covering layer may include a (1-1)th adhesive layer (eg, Figure 7 The (1-1) adhesive layer 415) or the (1-2) insulating layer (eg, Figure 7 The (1-2)th insulating layer 416 in the embodiment of the present invention). The (1-1)th adhesive layer may be stacked on the first conductive layer. The (1-2)th insulating layer may be stacked on the (1-1)th adhesive layer. The (1-2)th insulating layer may be arranged to face in a direction opposite to the first conductive layer. The second covering layer may include a second adhesive layer (e.g., Figure 7 The second adhesive layer 425 in the embodiment) or the (2-2) insulating layer (eg, Figure 7The second adhesive layer may be stacked on the second conductive layer. The second adhesive layer may be configured to form the same adhesive layer as the (1-1) adhesive layer. The (2-2) insulating layer may be stacked on the second adhesive layer. The (2-2) insulating layer may be arranged to face a direction opposite to the second conductive layer. The (2-2) insulating layer may be configured to form the same insulating layer as the (1-2) insulating layer.

[0181] According to an embodiment, the (1-2)th covering layer may include a (1-2)th adhesive layer (eg, Figure 7 The (1-2) adhesive layer 417) or the (1-3) insulating layer (e.g., Figure 7 The (1-3) insulating layer 418 in the (1-2) adhesive layer may be stacked on the (1-2) insulating layer. The (1-2) adhesive layer may be arranged to face a direction opposite to the (1-1) adhesive layer. The (1-3) insulating layer may be stacked on the (1-2) adhesive layer. The (1-3) insulating layer may be arranged to face a direction opposite to the (1-2) insulating layer.

[0182] According to an embodiment, a thickness of the first region may be greater than a thickness of the second region.

[0183] In the above description, although specific embodiments have been described in the detailed description of the document, it is obvious to those skilled in the art that various changes can be made within the scope without departing from the scope of the document.

Claims

1. An electronic device (101), comprising: A housing (202) comprising a first housing (210) and a second housing (220); a hinge structure (280) configured to rotatably connect the first housing (210) and the second housing (220); and a flexible circuit board (400) which is at least partially disposed on the hinge structure (280), The flexible circuit board (400) comprises: A first region (401) at least partially configured to be bendable, the first region (401) comprising a first conductive layer (413), a (1-1)th covering layer (415, 416) stacked on the first conductive layer (413), and a (1-2)th covering layer (417, 418) stacked on the (1-1)th covering layer (415, 416); and A second region (402) is configured to extend from the first region (401), the second region (402) includes a second conductive layer (423) configured to form a conductive layer identical to the first conductive layer (413) and a second covering layer (425, 426) configured to form a covering layer identical to the (1-1)th covering layer (415, 416).

2. The electronic device according to claim 1, wherein: The thickness of the first region (401) is greater than the thickness of the second region (402).

3. The electronic device according to any one of claims 1 and 2, wherein: The flexible circuit board (400) further includes: a (1-1)th insulating layer (412) stacked on the first conductive layer (413) and arranged to face a direction opposite to the (1-1)th covering layer (415, 416); and The (2-1)th insulating layer (422), which is stacked on the second conductive layer (423), is arranged to face a direction opposite to the second covering layer (425, 426), and is configured to form the same insulating layer as the (1-1)th insulating layer (412).

4. The electronic device according to any one of claims 1 to 3, wherein the thickness of the first conductive layer (413) is substantially the same as the thickness of the (1-1)th insulating layer (412), and The thickness of the second conductive layer (423) is substantially the same as the thickness of the (2-1)th insulating layer (422).

5. The electronic device according to any one of claims 1 to 4, wherein: The flexible circuit board (400) further includes: a first film layer (419) stacked on the (1-2)th covering layer (417, 418) and arranged to face a direction opposite to the (1-1)th covering layer (415, 416); and a second film layer (429) stacked on the second cover layers (425, 426) and arranged to face a direction opposite to the second conductive layer (423), The thickness of the first film layer (419) is substantially the same as the thickness of the second film layer (429).

6. The electronic device according to any one of claims 1 to 5, wherein the (1-1)th covering layer (415, 416) comprises: a (1-1)th adhesive layer (415) stacked on the first conductive layer (413); and A (1-2)th insulating layer (416) is stacked on the (1-1)th adhesive layer (415) and is disposed to face a direction opposite to the first conductive layer (413).

7. The electronic device according to any one of claims 1 to 6, wherein the second cover layer (425, 426) comprises: a second adhesive layer (425) stacked on the second conductive layer (423) and configured to form the same adhesive layer as the (1-1)th adhesive layer (415); and The (2-2)th insulating layer (426), which is stacked on the second adhesive layer (425), is disposed to face a direction opposite to the second conductive layer (423), and is configured to form the same insulating layer as the (1-2)th insulating layer (416).

8. The electronic device according to any one of claims 1 to 7, wherein the thickness of the (1-1)th adhesive layer (415) is greater than the thickness of the (1-2)th insulating layer (416).

9. The electronic device according to any one of claims 1 to 8, wherein: The (1-2) covering layer (417, 418) comprises: a (1-2)th adhesive layer (417) stacked on the (1-2)th insulating layer (416) and arranged to face in a direction opposite to the (1-1)th adhesive layer (415); and a (1-3)th insulating layer (418) stacked on the (1-2)th adhesive layer (417) and arranged to face in a direction opposite to the (1-2)th insulating layer (416), The thickness of the (1-2)th adhesive layer (417) is greater than the thickness of the (1-3)th insulating layer (418).

10. The electronic device according to any one of claims 1 to 9, wherein the thickness of the (1-1)th adhesive layer (415) is greater than the thickness of the (1-2)th adhesive layer (417).

11. The electronic device according to any one of claims 1 to 10, wherein the thickness of the (1-2)th insulating layer (416) is greater than the thickness of the (1-3)th insulating layer (418).

12. A flexible circuit board (400), comprising: A first region (401) at least partially configured to be bendable, the first region comprising a first conductive layer (413), a (1-1)th covering layer (415, 416) stacked on the first conductive layer, and a (1-2)th covering layer (417, 418) stacked on the (1-1)th covering layer (415, 416); and A second region (402) is configured to extend from the first region, the second region includes a second conductive layer (423) and a second covering layer (425, 426), the second conductive layer (423) is configured to form a conductive layer identical to the first conductive layer (413), and the second covering layer (425, 426) is configured to form a covering layer identical to the (1-1)th covering layer (415, 416).

13. The flexible circuit board according to claim 12, wherein the first region (401) further comprises a first film layer (419) stacked on the (1-2)th covering layer (417, 418), and The second region (402) further includes a second film layer (429) stacked on the second cover layers (425, 426).

14. The flexible circuit board according to any one of claims 12 and 13, wherein the (1-1)th covering layer (415, 416) comprises: a (1-1)th adhesive layer (415) stacked on the first conductive layer (413); and a (1-2)th insulating layer (416) stacked on the (1-1)th adhesive layer (415) and facing in a direction opposite to the first conductive layer (413), and The second covering layer (425, 426) comprises: a second adhesive layer (425) stacked on the second conductive layer (423) and forming the same adhesive layer as the (1-1)th adhesive layer (415); and The (2-2)th insulating layer (426), which is stacked on the second adhesive layer (425), faces a direction opposite to the second conductive layer (423), and is configured to form the same insulating layer as the (1-2)th insulating layer (416).

15. The flexible circuit board according to any one of claims 12 to 14, wherein the (1-2)th covering layer (417, 418) comprises: a (1-2)th adhesive layer (417) stacked on the (1-2)th insulating layer (416) and facing in a direction opposite to the (1-1)th adhesive layer (415); and A (1-3)th insulating layer (418) is bonded to the (1-2)th adhesive layer (417) and faces in a direction opposite to the (1-2)th insulating layer (416).

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