Silicon wafer cleaning device, silicon wafer cleaning equipment and silicon wafer cleaning method

Abstract

The invention provides a silicon wafer cleaning device, silicon wafer cleaning equipment and a silicon wafer cleaning method. The silicon wafer cleaning device comprises a base; the first cleaning assembly and the second cleaning assembly are connected to the base, the first cleaning assembly is used for cleaning the surface of a silicon wafer in a polishing and grinding mode, and the second cleaning assembly is used for cleaning the surface of the silicon wafer in a sweeping mode; wherein at least one of the first cleaning assembly and the second cleaning assembly is arranged to be capable of moving relative to the other one, so that only one of the first cleaning assembly and the second cleaning assembly can be selectively in contact with the surface of the silicon wafer.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor manufacturing, and in particular to a silicon wafer cleaning device, a silicon wafer cleaning equipment and a silicon wafer cleaning method. Background Art

[0002] In the silicon wafer manufacturing process, the surface cleanliness of the silicon wafer is very important. Silicon wafers are used in the production of electronic components, and their surfaces need to undergo a variety of complex processes, such as etching, evaporation, and circuit design. Therefore, in order to ensure the accuracy of these processes and product performance, the surface of the silicon wafer must maintain a high level of cleanliness. Any residues or contaminants will affect the quality of subsequent processes and the performance of the overall finished product. This makes silicon wafer cleaning an essential and important part of the entire manufacturing process.

[0003] Since the front side of the silicon wafer is a key part of the subsequent manufacturing process, the subsequent manufacturing process has extremely high requirements for the cleanliness of the front side of the silicon wafer, and any contaminants, particles and residues that may affect the process need to be strictly removed. Currently, the cleaning of silicon wafers is usually carried out by using a brush and a cleaning liquid for physical and chemical cleaning to remove particles and tiny foreign matter attached to the surface.

[0004] Although existing cleaning technologies can remove most surface impurities, there is still a problem of insufficient cleaning for foreign matter with strong adhesion. These residues may affect the stability of subsequent processes and product performance. In addition, the cleaning of the back of silicon wafers is usually less concerned, but the residues on its surface may also cause adverse effects in subsequent use. Therefore, comprehensively improving the cleanliness of the front and back of silicon wafers is a necessary direction for further optimizing manufacturing processes and product quality. Summary of the invention

[0005] The present disclosure provides a silicon wafer cleaning device, a silicon wafer cleaning equipment and a silicon wafer cleaning method. The silicon wafer cleaning device combines two cleaning methods, polishing and sweeping, and can dynamically switch between the two methods, thereby flexibly meeting different cleaning requirements.

[0006] The technical solution of the present disclosure is implemented as follows: In a first aspect, the present disclosure provides a silicon wafer cleaning device, the silicon wafer cleaning device comprising: Pedestal; A first cleaning assembly and a second cleaning assembly connected to the base, wherein the first cleaning assembly is used to clean the surface of the silicon wafer by polishing, and the second cleaning assembly is used to clean the surface of the silicon wafer by sweeping; At least one of the first cleaning assembly and the second cleaning assembly is configured to be movable relative to the other, so as to selectively enable only one of the first cleaning assembly and the second cleaning assembly to contact the surface of the silicon wafer.

[0007] In some optional examples, the silicon wafer cleaning device includes a driving portion connected to at least one of the first cleaning component and the second cleaning component.

[0008] In some optional examples, the first cleaning assembly includes a cleaning portion and a connecting rod, one end of the connecting rod is connected to the cleaning portion and the other end of the connecting rod is connected to the driving portion, so that the driving portion can drive the cleaning portion to move in a direction away from and toward the base via the connecting rod.

[0009] In some optional examples, the cleaning portion is in a cross shape, and the cross is arranged concentrically with the base.

[0010] In some optional examples, the cleaning portion includes a bracket and a polishing portion removably connected to the bracket.

[0011] In some optional examples, the second cleaning component has a lower hardness than the first cleaning component.

[0012] In some optional examples, the silicon wafer cleaning device further includes a control unit connected to the driving unit.

[0013] In some optional examples, the control unit controls the driving unit to drive the first cleaning component to clean the surface of the silicon wafer, and drives the second cleaning component to clean the surface of the silicon wafer after the first cleaning component cleans the surface of the silicon wafer.

[0014] In some optional examples, the silicon wafer cleaning device further includes a supply device for supplying a cleaning liquid.

[0015] In a second aspect, the present disclosure provides a silicon wafer cleaning device, the silicon wafer cleaning device comprising: The silicon wafer cleaning device according to the first aspect; A driving module is used to drive the silicon wafer cleaning device to rotate and translate.

[0016] In some optional examples, the silicon wafer cleaning equipment includes two silicon wafer cleaning devices arranged opposite to each other, so as to clean the front side and the back side of the silicon wafer at the same time.

[0017] In a third aspect, the present disclosure provides a silicon wafer cleaning method, which is performed by using the silicon wafer cleaning apparatus according to the second aspect.

[0018] In some optional examples, the silicon wafer cleaning method includes: driving a first cleaning component of a silicon wafer cleaning device of the silicon wafer cleaning equipment to clean the surface of the silicon wafer, and after the first cleaning component cleans the surface of the silicon wafer, driving a second cleaning component of the silicon wafer cleaning device to clean the surface of the silicon wafer.

[0019] The present disclosure provides a silicon wafer cleaning device and a silicon wafer cleaning equipment. The silicon wafer cleaning device includes two cleaning components. Since the two cleaning components can clean the surface of the silicon wafer in a polishing manner and a sweeping manner respectively, the silicon wafer cleaning device including the two cleaning components has different degrees of cleaning capabilities to meet the cleaning requirements for different types of pollutants, thereby effectively removing pollutants with strong adhesion and avoiding unnecessary over-cleaning. In addition, since the two cleaning components can alternately contact the silicon wafer by moving relative to each other, the silicon wafer cleaning device is allowed to dynamically switch between different cleaning modes according to cleaning requirements, which significantly improves the cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of a brush provided in accordance with an embodiment of the present disclosure.

[0021] Figure 2 for Figure 1 Schematic diagram of the bottom of the brush.

[0022] Figure 3 A half-sectional view of a silicon wafer cleaning device provided in an embodiment of the present disclosure.

[0023] Figure 4 A cross-sectional schematic diagram of a silicon wafer cleaning device provided in an embodiment of the present disclosure.

[0024] Figure 5 A cross-sectional schematic diagram of a silicon wafer cleaning device provided in accordance with another embodiment of the present disclosure.

[0025] Figure 6 A bottom schematic diagram of a silicon wafer cleaning device provided in an embodiment of the present disclosure.

[0026] Figure 7 A schematic cross-sectional view of a portion of a silicon wafer cleaning device provided in an embodiment of the present disclosure.

[0027] Figure 8 A cross-sectional schematic diagram of a silicon wafer cleaning device provided in accordance with another embodiment of the present disclosure.

[0028] Fig. 9 A cross-sectional schematic diagram of a silicon wafer cleaning device provided in yet another embodiment of the present disclosure.

[0029] Fig.10 A schematic diagram of a silicon wafer cleaning device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0030] The technical solutions in the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings in the present disclosure.

[0031] During the silicon wafer processing, in order to ensure its surface quality and meet the requirements of subsequent processes, the silicon wafer needs to be cleaned multiple times. The main purpose of cleaning is to remove various contaminants in the processing process, including particulate impurities, chemical residues, metal ions and other organic or inorganic contaminants. After each processing step of the silicon wafer, the surface may be attached with new impurities due to exposure to different environments and process media, so multiple cleanings are essential.

[0032] For example, in the final polishing (FP) process, once the equipment is down, the surface of the silicon wafer may be exposed to residual polishing liquid for a long time. This situation will cause the particles in the polishing liquid to crystallize, forming raised crystals on the surface of the silicon wafer. Although continuing to perform FP operations on these silicon wafers can largely remove these crystals, a small amount of residue may still exist on the front of the silicon wafer. In addition, since the FP process is usually only performed on the front of the silicon wafer, the back of the silicon wafer will not undergo any processing and fine polishing, so the crystals remaining on the back cannot be eliminated. Once this kind of crystal residue is formed, it may cause a series of problems during the subsequent use of the silicon wafer. For example, the raised crystals formed on the back of the silicon wafer will cause the silicon wafer to be unable to be placed flat in the subsequent manufacturing process.

[0033] In order to solve the above problems, the art proposes to add a cleaning process after the FP process. In this cleaning process, a brush is used with a cleaning liquid such as pure water or a specific chemical solution to remove foreign matter on the surface of the silicon wafer, such as pollutants, particles and residues. Figure 1 and Figure 2 The brush 1 provided by some embodiments of the present disclosure is shown in the figure. The brush 1 is disc-shaped as a whole, and includes a main body 11 and a brush portion 12. The brush portion 12 is arranged on a circular surface of the disc-shaped main body, and has a substantially flat cleaning surface 12A. The brush portion 12 can be made of a flexible material, such as a PVC material, to avoid scratching the surface of the silicon wafer while cleaning. When the brush 1 is used, the flat cleaning surface 12A of the brush portion 12 of the brush 1 can be used to contact the surface to be cleaned of the silicon wafer, and the brush 1 can be used to apply a certain pressure to the surface to be cleaned of the silicon wafer while rotating the brush 1 around its axis, thereby achieving the purpose of cleaning the surface of the silicon wafer. In the above cleaning process, a cleaning liquid can be supplied to the surface to be cleaned of the silicon wafer to improve the cleaning ability.

[0034] However, the inventors noticed during the production process that the above cleaning method may face the problem of low removal efficiency when encountering foreign matter with strong adhesion, such as crystals caused by polishing liquid. This is because the brush portion 12 of the brush 1 is too soft to remove foreign matter with strong adhesion. Although multiple cleanings can help reduce the residual foreign matter, for foreign matter with strong adhesion, even with a cleaning liquid with strong cleaning power, it is impossible to achieve an ideal cleaning effect.

[0035] In addition, as mentioned above, the main focus in this field is on the cleaning of the front side of the silicon wafer, while less attention is paid to the cleaning of the back side of the silicon wafer. Moreover, due to the lack of a fine polishing process, there are often more foreign matter with strong adhesion on the back side of the silicon wafer. The inventors have found through practice that the contaminants remaining on the back side of the silicon wafer may also have a negative impact on the performance and stability of the product in subsequent use. For example, impurities and residues on the back side of the silicon wafer may cause problems such as unstable equipment clamping and poor back contact, further affecting process accuracy and product reliability. Therefore, ensuring comprehensive cleaning of the front and back sides of the silicon wafer is crucial to improving the quality of the manufacturing process and product performance.

[0036] To this end, some embodiments of the present disclosure provide a silicon wafer cleaning device, a silicon wafer cleaning equipment and a silicon wafer cleaning method. The silicon wafer cleaning device combines two cleaning methods, polishing and sweeping, and can dynamically switch between the two methods, thereby flexibly meeting different cleaning requirements.

[0037] The following describes various embodiments of the present disclosure in detail with reference to the accompanying drawings.

[0038] See also Figure 3 Some embodiments of the present disclosure provide a silicon wafer cleaning device 2. The silicon wafer cleaning device 2 may include a base 21, a first cleaning assembly 22 connected to the base 21, and a second cleaning assembly 23. The first cleaning assembly 22 is used to clean the surface of the silicon wafer by polishing. The second cleaning assembly 23 is used to clean the surface of the silicon wafer by sweeping.

[0039] At least one of the first cleaning assembly 22 and the second cleaning assembly 23 is configured to be movable relative to the other, so as to selectively enable only one of the first cleaning assembly 22 and the second cleaning assembly 23 to contact the surface of the silicon wafer.

[0040] The base 21 can provide necessary stable support for each component of the silicon wafer cleaning device 2, and can facilitate the connection of the cleaning assembly with other devices such as a robot. The base 21 can be roughly cylindrical, or can be in other shapes, which is not limited in the present disclosure.

[0041] The first cleaning assembly 22 and the second cleaning assembly 23 may be disposed on the same side of the base 21. Figure 3 and Figure 4 As shown, the first cleaning assembly 22 and the second cleaning assembly 23 may be disposed on the lower side of the base 21 and extend from the lower surface of the base 21 in a direction substantially perpendicular to the lower surface of the base 21. For each of the first cleaning assembly 22 and the second cleaning assembly 23, one end is connected to the base 21, and the other end, that is, the end away from the base 21, serves as a cleaning end for performing a cleaning operation. Figure 3 and Figure 4 In the figure, the lower ends of the first cleaning component 22 and the second cleaning component 23 are cleaning ends.

[0042] The two cleaning components can perform cleaning operations in different ways. The first cleaning component 22 can remove foreign matter on the surface of the silicon wafer by grinding or polishing, especially foreign matter with strong adhesion, such as polishing liquid crystals and residues with strong adhesion. The second cleaning component 23 can remove particulate contaminants or impurities with weak adhesion on the surface of the silicon wafer by sweeping the surface of the silicon wafer.

[0043] The two cleaning components give the silicon wafer cleaning device 2 a significant advantage over the brush 1. The first cleaning component 22 can remove strongly adhered pollutants, making up for the insufficient cleaning power of the brush 1, while the second cleaning component 23 can quickly remove lightly adhered pollutants, avoiding unnecessary over-cleaning and improving the overall cleaning efficiency of the silicon wafer cleaning device 2.

[0044] One of the first cleaning assembly 22 and the second cleaning assembly 23 can be configured to be movable relative to the other, or both the first cleaning assembly 22 and the second cleaning assembly 23 can be movable relative to each other to achieve two positional relationships relative to each other. The two positional relationships are respectively Figure 3 and Figure 4 It is shown as an example in FIG.

[0045] exist Figure 3 In the embodiment, the second cleaning component 23 extends longer from the lower surface of the base 21 than the first cleaning component 22. In this state, when the silicon wafer cleaning device 2 continuously approaches the surface of the silicon wafer to be cleaned in order to clean the silicon wafer, only the cleaning end of the second cleaning component 23, i.e. Figure 3 The lower end of the second cleaning assembly 23 can contact the surface of the silicon wafer to be cleaned, while the cleaning end of the first cleaning assembly 22 cannot contact the silicon wafer. Figure 3 1 and 2. The positional relationship between the first cleaning assembly 22 and the second cleaning assembly 23 is shown in FIG. 1 , and only the second cleaning assembly 23 can perform the cleaning operation.

[0046] exist Figure 4In the embodiment, the first cleaning assembly 22 extends longer from the lower surface of the base 21 than the second cleaning assembly 23. In this state, when the silicon wafer cleaning device 2 is constantly approaching the surface of the silicon wafer to be cleaned in order to clean the silicon wafer, only the cleaning end of the first cleaning assembly 22, i.e., Figure 3 The lower end of the first cleaning component 22 can contact the surface of the silicon wafer to be cleaned, while the cleaning end of the second cleaning component 23 cannot contact the silicon wafer. Figure 3 The positional relationship between the first cleaning assembly 22 and the second cleaning assembly 23 is shown in FIG. 1 , and only the first cleaning assembly 22 can perform the cleaning operation.

[0047] By changing the extension length of the first cleaning component 22 and the second cleaning component 23 from the base 21 through relative movement, flexible switching for different types of pollutants and cleaning requirements can be achieved, that is, the cleaning device is allowed to select an appropriate cleaning method according to the requirements of different silicon wafer surface states, such as the type and intensity of attached pollutants, thereby enhancing the flexibility and applicability of the equipment. Moreover, the switching method allows the polishing method of the first cleaning component and the cleaning method of the second cleaning component to be performed separately, ensuring cleaning efficiency and avoiding unnecessary interference and waste of resources.

[0048] Some embodiments of the present disclosure provide a silicon wafer cleaning device 2. The silicon wafer cleaning device 2 includes two cleaning components. Since the two cleaning components can clean the surface of the silicon wafer in a polishing manner and a sweeping manner respectively, the silicon wafer cleaning device including the two cleaning components has different degrees of cleaning capabilities to meet the cleaning requirements for different types of pollutants, thereby effectively removing pollutants with strong adhesion and avoiding unnecessary over-cleaning. In addition, since the two cleaning components can alternately contact the silicon wafer by moving relative to each other, the silicon wafer cleaning device is allowed to dynamically switch between different cleaning modes according to cleaning needs, so as to independently perform cleaning operations without interfering with each other, thereby ensuring cleaning efficiency and avoiding unnecessary interference and waste of resources.

[0049] To achieve movement of the first cleaning assembly 22 and / or the second cleaning assembly 23 relative to each other, according to some embodiments of the present disclosure, the wafer cleaning device 2 may include a driving portion 24 connected to at least one of the first cleaning assembly 22 and the second cleaning assembly 23 .

[0050] See also Figure 5 The driving part 24 may be disposed in the base 2 and may be connected to at least one of the first cleaning assembly 22 and the second cleaning assembly 23. That is, the driving part 24 may be connected to the first cleaning assembly 22 or to the second cleaning assembly 23, or the driving part 24 may be connected to both the first cleaning assembly 22 and the second cleaning assembly 23 to drive the assembly connected thereto to move accordingly.

[0051] As an example, the driving unit 24 may include a motor and a guide rail, so as to drive the first cleaning assembly 22 and / or the second cleaning assembly 23 to move linearly along the guide rail by the motor. Alternatively, the driving unit 24 may also include other driving or transmission components such as a cylinder, a hydraulic cylinder, a worm, etc., as long as the movement of the cleaning assembly can be achieved, and the present disclosure does not limit this.

[0052] In addition, the drive unit 24 may also include a mechanical locking or limiting function to prevent accidental movement of a cleaning component due to external vibration or drive misoperation when the cleaning component is in the working position, thereby making the operation of the cleaning component in the working position more stable and also preventing the non-working cleaning component from entering the cleaning state.

[0053] The driving unit 24 can realize automatic switching of the cleaning mode of the silicon wafer cleaning device 2 and can also make the states of the two cleaning components more stable when performing the cleaning operation.

[0054] According to further embodiments of the present disclosure, see Figure 5 The first cleaning assembly 22 may include a cleaning portion 22A and a connecting rod 22B. One end of the connecting rod 22B is connected to the cleaning portion 22A and the other end of the connecting rod is connected to the driving portion 24, so that the driving portion 24 can drive the cleaning portion 22A to move away from and toward the base 21 via the connecting rod 22B.

[0055] The cleaning part 22A, as the core component of the first cleaning assembly 22, can directly perform the cleaning task on the surface of the silicon wafer. The connecting rod 22B is used to transmit the driving force provided by the driving part 24. Therefore, in this embodiment, at least the first cleaning assembly 22 is movable between the working position and the non-working position relative to the second cleaning assembly 23, thereby switching the cleaning mode of the silicon wafer cleaning device 2.

[0056] by Figure 5 For example, the connecting rod 22B is vertically arranged in the silicon wafer cleaning device 2, wherein the lower end of the connecting rod 22B can be fixedly connected to the cleaning part 22A and the upper end of the connecting rod 22B is connected to the driving part 24 in a transmission manner. The driving part 24 can push or pull the cleaning part 22A through the connecting rod 22B to achieve precise movement of the cleaning part 22A. Figure 5 In the description, the expression “moving in a direction away from and toward the base 21 ” may refer to moving in a vertical direction relative to the lower side of the base 21 .

[0057] The force of the driving unit 24 transmitted by the connecting rod 22B can make the movement of the cleaning unit 22A more stable and accurate. That is, the cleaning unit 22A can be moved within a predetermined range according to a preset path, ensuring the effectiveness of the cleaning operation. In particular, the cleaning requirements of silicon wafers of different thicknesses can be met by adjusting the moving range of the cleaning unit 22A. In addition, the structure of this force transmission is simple and direct, reducing unnecessary energy loss.

[0058] Considering that the silicon wafer cleaning device 2 can perform rotational motion around its own central axis and / or translational motion on the surface of the silicon wafer when performing the cleaning operation, therefore, in some embodiments of the present disclosure, see Figure 6 The cleaning portion 22A may be cross-shaped, and the cross-shape and the base 21 may be arranged concentrically, so that when the silicon wafer cleaning device 2 rotates around its own central axis, the cross-shaped cleaning portion 22A may also rotate around its center, thereby maximizing coverage of the surface of the silicon wafer being cleaned.

[0059] like Figure 6 As shown, the cross-shaped structure of the cleaning part 22A can extend in four directions. It is understandable that this significantly improves the coverage of the cleaning part 22A on the surface of the silicon wafer. Especially when cleaning large-diameter silicon wafers, the cross shape can effectively cover the center and edge areas and reduce dead angles. The concentric arrangement of the cleaning part 22A and the base 21 can make the distribution of the cleaning force on the surface of the silicon wafer more uniform, avoiding local excessive cleaning or insufficient cleaning due to uneven force. In particular, the symmetry advantage of the cross-shaped structure can reduce the vibration or deformation of the cleaning part caused by unbalanced force during movement, thereby improving the stability and durability of the cleaning part 22A in high-intensity work.

[0060] Since the first cleaning component 22 cleans the surface of the silicon wafer by polishing, the first cleaning component 22 is also easily worn out after use. Frequent replacement or repair of the first cleaning component 22 not only affects the working efficiency, but also brings hidden dangers to the overall stability of the silicon wafer cleaning device 2. Considering this problem, the inventor proposes a modular design of the first cleaning component 22, especially the cleaning part 22A. Specifically, in some embodiments of the present disclosure, see Figure 7 The cleaning portion 22A may include a bracket 221 and a polishing portion 222 removably connected to the bracket 221 .

[0061] The bracket 221 can be used as the main body of the cleaning part 22A, and is used to provide stable support and connection with the connecting rod 22B. The polishing part 222 is used to actually perform the polishing and cleaning task. As an example, the polishing part 222 can be removably connected to the bracket 221 by means of a snap, a threaded connection, a magnetic attraction, etc. This disclosure does not limit this.

[0062] Since only the polishing part 222 can directly contact the surface of the silicon wafer when the first cleaning component 22 performs the cleaning task, only the polishing part 222 is worn out. Through the above structure, the first cleaning component 22 can be quickly restored to its cleaning function by conveniently disassembling, replacing or cleaning the polishing part 222 according to the cleaning requirements. It is worth mentioning that the polishing part 222 can be designed as a module that meets different silicon wafer cleaning requirements. For example, according to the type of pollutants on the silicon wafer or the cleaning task requirements, the polishing part 222 with different functions or different materials can be easily replaced, thereby improving the applicability of the silicon wafer cleaning device 2.

[0063] In some embodiments of the present disclosure, the second cleaning component 23 may have a lower hardness than the first cleaning component 22 .

[0064] The second cleaning component 23 with lower hardness is conducive to gently cleaning particles or lightly attached contaminants on the surface of the silicon wafer, avoiding surface damage caused by excessive cleaning force. In contrast, the first cleaning component 22 with higher hardness is suitable for applying higher cleaning force to contaminants that are difficult to remove to ensure the cleaning effect. As an example, the first cleaning component 22, especially the cleaning part 22A of the first cleaning component 22, can be made of PET material. For example, the cleaning part 22A can be made of the same material as the polishing pad used for double-sided polishing of silicon wafers; the second cleaning component 23 can be made of PVC sponge. For example, the second cleaning component 23 can be made of the same material as the brush used for final polishing and cleaning.

[0065] In order to further improve the automation level of the silicon wafer cleaning device 2, see Figure 8 The silicon wafer cleaning device may further include a control unit 25 connected to the driving unit 24 .

[0066] In the actual production process, for the same silicon wafer, the silicon wafer cleaning device 2 may need to perform two cleaning modes. The control unit 25 can control the driving unit 24 to drive the two cleaning components to perform cleaning operations alternately in a predetermined order according to a predetermined cleaning strategy, and can also control the cleaning time of each cleaning component, thereby avoiding manual intervention in the cleaning process.

[0067] As an example of a cleaning strategy, the control unit 25 may control the driving unit 24 to drive the first cleaning assembly 22 to clean the surface of the silicon wafer, and after the first cleaning assembly 22 cleans the surface of the silicon wafer, drive the second cleaning assembly 23 to clean the surface of the silicon wafer.

[0068] According to the above example, the cleaning operation performed by the silicon wafer cleaning device 2 can be divided into two stages. The control unit 25 can switch the operation of the driving unit 24 by sensing the cleaning state of the first cleaning component 22, such as a completion signal, and sequentially drive the second cleaning component 23 to perform the cleaning task. After the cleaning task is completed, the control unit 25 can return to the initial state and wait for the next cleaning cycle to start.

[0069] The control unit 25 can reduce repeated operations and make the cleaning process more efficient by controlling the two cleaning components to perform polishing cleaning and sweeping cleaning in sequence. Moreover, polishing preferentially removes strongly adherent contaminants, providing a cleaner surface condition for the sweeping component to remove residual particles, thereby enhancing the overall cleaning effect. The control unit 25 coordinates the working order of the two cleaning methods to give full play to the advantages of polishing and sweeping, achieving a synergistic effect of mechanical and particulate contaminant cleaning, thereby significantly improving the surface flatness and particle cleanliness of the silicon wafer.

[0070] According to some embodiments of the present disclosure, see Fig. 9 The silicon wafer cleaning device 2 may further include a supply device 26 for supplying the cleaning liquid.

[0071] The cleaning liquid cooperates with the first cleaning component 22 and the second cleaning component 23 to improve the removal effect of strongly adherent pollutants and particulate impurities, wherein the chemical solution can dissolve or decompose pollutants that are difficult to remove mechanically. The supply device 26 can ensure the same cleaning effect of each area on the surface of the silicon wafer by uniformly spraying the cleaning liquid to avoid insufficient local cleaning. Moreover, the cleaning liquid can also reduce the surface damage caused by mechanical friction, especially for the precision-machined silicon wafer surface, such as the front surface, which has a protective effect.

[0072] See also Fig.10 Some embodiments of the present disclosure further provide a silicon wafer cleaning device 3. The silicon wafer cleaning device 3 may include: the silicon wafer cleaning device 2 described above; and a driving module 31 for driving the silicon wafer cleaning device 2 to rotate and translate.

[0073] In some embodiments of the present disclosure, Fig.10 As shown, the silicon wafer cleaning device 3 may include two silicon wafer cleaning devices 2 arranged opposite to each other, so as to clean the front side and the back side of the silicon wafer S at the same time.

[0074] As mentioned above, the back side of the silicon wafer S is usually not subjected to the final polishing process, so there are more foreign matters with strong adhesion on the back side. Fig.10In the structure shown in FIG. 1 , the two silicon wafer cleaning devices 2 can work synchronously, thereby ensuring that both the front and back sides of the silicon wafer S reach a high degree of cleanliness. The cleaning of the back side of the silicon wafer by the silicon wafer cleaning device 2 can effectively remove particles and strongly adherent contaminants, avoid problems such as unstable clamping of the equipment or poor contact, and ensure the stability of subsequent processes.

[0075] In addition, the two silicon wafer cleaning devices 2 can be controlled independently, which means that the two silicon wafer cleaning devices 2 can respectively select different cleaning methods, such as sweeping the front side and polishing the back side, so as to meet different cleaning requirements of the front and back sides of the silicon wafer.

[0076] Some embodiments of the present disclosure also provide a silicon wafer cleaning method, which is performed by using the silicon wafer cleaning device 3 described above.

[0077] In some embodiments of the present disclosure, the silicon wafer cleaning method may include: driving the first cleaning component 22 of the silicon wafer cleaning device 2 of the silicon wafer cleaning equipment 3 to clean the surface of the silicon wafer S, and after the first cleaning component 22 cleans the surface of the silicon wafer S, driving the second cleaning component 23 of the silicon wafer cleaning device 2 to clean the surface of the silicon wafer.

[0078] It should be noted that the technical solutions described in the present disclosure can be combined arbitrarily without conflict.

[0079] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A silicon wafer cleaning device, characterized in that: The silicon wafer cleaning device comprises: Pedestal; A first cleaning assembly and a second cleaning assembly connected to the base, wherein the first cleaning assembly is used to clean the surface of the silicon wafer by polishing, and the second cleaning assembly is used to clean the surface of the silicon wafer by sweeping; At least one of the first cleaning assembly and the second cleaning assembly is configured to be movable relative to the other, so as to selectively enable only one of the first cleaning assembly and the second cleaning assembly to contact the surface of the silicon wafer.

2. The silicon wafer cleaning device according to claim 1, characterized in that: The silicon wafer cleaning device includes a driving portion connected to at least one of the first cleaning assembly and the second cleaning assembly.

3. The silicon wafer cleaning device according to claim 2, characterized in that: The first cleaning assembly includes a cleaning portion and a connecting rod, one end of the connecting rod is connected to the cleaning portion and the other end of the connecting rod is connected to the driving portion, so that the driving portion can drive the cleaning portion to move away from and toward the base via the connecting rod.

4. The silicon wafer cleaning device according to claim 3, characterized in that: The cleaning portion is in a cross shape, and the cross is arranged concentrically with the base.

5. The silicon wafer cleaning device according to claim 3, characterized in that: The cleaning part includes a bracket and a polishing part removably connected to the bracket.

6. The silicon wafer cleaning device according to any one of claims 2 to 5, characterized in that: The second cleaning component has a lower hardness than the first cleaning component.

7. The silicon wafer cleaning device according to any one of claims 2 to 5, characterized in that: The silicon wafer cleaning device further includes a control unit connected to the driving unit.

8. The silicon wafer cleaning device according to claim 7, characterized in that: The control unit controls the driving unit to drive the first cleaning assembly to clean the surface of the silicon wafer, and drives the second cleaning assembly to clean the surface of the silicon wafer after the first cleaning assembly cleans the surface of the silicon wafer.

9. The silicon wafer cleaning device according to any one of claims 1 to 5, characterized in that: The silicon wafer cleaning device further comprises a supply device for supplying a cleaning liquid.

10. A silicon wafer cleaning device, characterized in that: The silicon wafer cleaning equipment comprises: The silicon wafer cleaning device according to any one of claims 1 to 9; A driving module is used to drive the silicon wafer cleaning device to rotate and translate.

11. The silicon wafer cleaning device according to claim 10, characterized in that: The silicon wafer cleaning equipment comprises two silicon wafer cleaning devices arranged opposite to each other, so as to clean the front side and the back side of the silicon wafer at the same time.

12. A silicon wafer cleaning method, characterized in that: The silicon wafer cleaning method is performed by using the silicon wafer cleaning apparatus according to claim 10 .

13. The silicon wafer cleaning method according to claim 12, characterized in that: The silicon wafer cleaning method comprises: driving a first cleaning component of a silicon wafer cleaning device of the silicon wafer cleaning equipment to clean the surface of the silicon wafer, and after the first cleaning component cleans the surface of the silicon wafer, driving a second cleaning component of the silicon wafer cleaning device to clean the surface of the silicon wafer.

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