Laser processing device of ceramic substrate for circuit board

Abstract

The invention discloses a laser processing device for a ceramic substrate for a circuit board, which belongs to the technical field of laser processing devices and comprises a device body, a laser arranged on the device body, a displacement driving device connected with the laser and a sleeve mounted at an output port of the laser. Laser emitted by the laser coincides with the axis of the sleeve, and the displacement driving device can drive the laser to move in the axial direction of the sleeve; a lens, an elastic supporting device and a rolling transparent ball are sequentially arranged in the sleeve in the axial direction of the sleeve, and a conical pipe opening used for limiting the rolling transparent ball is formed in an opening of the sleeve. The elastic supporting device is arranged between the annular pressing plate and the rolling transparent ball and used for providing elastic pressure for the rolling transparent ball. According to the device, the ceramic substrate can be well protected, and meanwhile, the laser processing quality of the ceramic substrate is guaranteed.

Description

Technical Field

[0001] The invention belongs to the technical field of laser processing devices, and in particular relates to a laser processing device for a ceramic substrate for a circuit board. Background Art

[0002] Traditional ceramic substrate processing methods are gradually unable to meet industry needs. Mechanical processing methods, such as milling and drilling, rely on direct contact between the tool and the ceramic material. Due to the high hardness and brittleness of ceramics, the tool wears very quickly during processing, which not only increases production costs, but also slows down production efficiency due to frequent tool replacement. In addition, mechanical processing can easily cause defects such as cracks and edge collapse in ceramic substrates, and the yield rate is limited, which is even more difficult to achieve for small-sized, high-precision circuit board structures. Laser processing technology came into being, opening up a new path for ceramic substrate processing. Laser has high energy density and good focusing, and can achieve non-contact processing. Its energy can be accurately focused to a micron-level spot, and ceramic materials can be cut, drilled, and marked. The heat-affected zone is extremely small, which minimizes the risk of cracks in ceramic substrates due to thermal stress. The processing accuracy far exceeds that of traditional processes, and it can easily meet the manufacturing needs of tiny through holes and fine lines on circuit boards.

[0003] When the existing general laser processing device is directly used for processing ceramic substrate circuit boards, some molten impurities are easy to splash and cling to the surroundings of the ceramic substrate, so a plastic protective film is usually pre-coated on the surface of the ceramic substrate to prevent the above situation from happening. However, due to the barrier effect of the plastic protective film, the laser processing effect of the ceramic base surface will be affected. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a laser processing device for a ceramic substrate for a circuit board, which can well protect the ceramic substrate while ensuring the laser processing quality of the ceramic substrate.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] The present invention discloses a laser processing device for a ceramic substrate for a circuit board, comprising a device body, a laser arranged on the device body, a displacement driving device connected to the laser, and a sleeve installed at an output port of the laser, wherein the laser emitted by the laser coincides with the axis of the sleeve, and the displacement driving device can drive the laser to displace along the axial direction of the sleeve; a lens, an elastic supporting device and a rolling transparent ball are sequentially arranged in the sleeve along the axial direction, a conical pipe opening for limiting the rolling transparent ball is formed at the opening of the sleeve, and the elastic supporting device is arranged between the annular pressure plate and the rolling transparent ball to provide elastic pressure to the rolling transparent ball.

[0007] Furthermore, the elastic support device includes an elastic steel sheet, a steel sheet connector, a spring and a pressure plate. A plurality of elastic steel sheets are evenly distributed on the inner surface of the rolling transparent ball along the circumferential direction. The elastic steel sheet is fixedly connected to the tube wall of the sleeve through the steel sheet connector. A plurality of elastic steel sheets are pressed against the inner surface of the rolling transparent ball through the lower end of the spring. The pressure plate is arranged in the middle of the sleeve, and the upper end of the spring is fixedly connected to the pressure plate.

[0008] Furthermore, the elastic steel sheet includes an arc segment, a reverse bending segment and a connecting segment. The arc segment is an arc-shaped sheet structure and its curvature is adapted to the rolling transparent ball. The arc segment is integrally connected to the connecting segment through the reverse bending segment. The connecting segment is fixedly connected to the tube wall of the sleeve through a steel sheet connector. The lower end of the spring is simultaneously pressed against the arc segment of each elastic steel sheet.

[0009] Furthermore, a heat dissipation pipeline is also arranged on the back side of the arc segment, and each heat dissipation pipeline is connected through a connecting pipe, wherein two heat dissipation pipelines are respectively connected with a water inlet pipe and a water outlet pipe, and the water inlet pipe extends out of the outer side of the sleeve and is connected to the water supply device.

[0010] Furthermore, a pressure frame is provided on the upper side of the pressure plate, and the pressure frame and the pressure plate are both slidably matched with the inner side of the sleeve. A sliding groove is opened on the outer wall of the sleeve corresponding to the pressure frame, and a locking screw is provided in the sliding groove. The inner end of the locking screw extends into the sleeve to position the pressure frame.

[0011] Furthermore, the inner ends of the plurality of elastic steel sheets are spaced apart to form an irradiation area for the laser to pass through, and a positioning column is fixed on the inner surface of the rolling transparent ball, and the positioning column is limited in the space of the irradiation area.

[0012] Furthermore, a guide rail is fixed to the inner wall of the sleeve, and a slider is connected to the guide rail. The slider is fixedly connected to the edge of the lens, and a first rack is arranged on the outer side of the slider. The first rack is meshed with a first gear. The first gear is driven by a first motor, and the first motor is fixed on the outer side of the sleeve.

[0013] Furthermore, the rolling transparent ball comprises a glass sphere, a cavity is formed inside the glass sphere, and the cavity is filled with cooling liquid.

[0014] Furthermore, a plurality of pillars are integrally arranged on the inner side of the glass sphere, and the pillars extend radially inwardly along the glass sphere. A water injection channel is opened on one of the pillars, and the water injection channel is blocked by a plunger.

[0015] The beneficial effects of the present invention are:

[0016] The present invention discloses a laser processing device for a ceramic substrate for a circuit board. A lens and a rolling transparent ball are sequentially arranged in a sleeve at the emission end of a laser. The laser constrains the light through the lens, and then the light is focused on a product through the rolling transparent ball to process the product. At the same time, the rolling transparent ball is pressed against a plastic protective film of the ceramic substrate through an elastic supporting device, which can form a certain pressure on the processing position of the product, and helps to quickly melt the plastic protective film, thereby improving the laser processing efficiency and quality of the ceramic substrate.

[0017] In the device of the present invention, by using a rolling transparent ball instead of a conventional focusing lens, it can generate pressure on the product processing part without affecting the normal processing of the product. The rolling transparent ball can also achieve focusing through its own function, which has high practicality. Since the rolling glass ball is in contact with the product at all times, the distance between the center of the rolling glass ball and the surface of the product is determined, so the degree of focusing, that is, the processing temperature, is stably controlled, which can improve the quality of the product and make the processing effect more standardized.

[0018] Other advantages, objectives and features of the present invention will be described in the following description and will be apparent to those skilled in the art to some extent, or those skilled in the art may be taught from the practice of the present invention. The objectives and other advantages of the present invention may be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to make the purpose, technical solution and beneficial effects of the present invention clearer, the present invention provides the following drawings for illustration:

[0020] Figure 1 It is a structural schematic diagram of the device of the present invention;

[0021] Figure 2 is a cross-sectional view of the device of the present invention;

[0022] Figure 3 for Figure 2 A magnified view at point A;

[0023] Figure 4 for Figure 2 Enlarged view at B;

[0024] Figure 5 for Figure 2 Enlarged view at C;

[0025] Figure 6 It is a schematic diagram of the structure of the elastic steel sheet.

[0026] The markings in the accompanying drawings are as follows: device body 1, laser 2, displacement drive device 3, sleeve 4, lens 5, pressure plate 6, elastic support device 7, rolling transparent ball 8, tapered pipe mouth 9, elastic steel sheet 10, steel sheet connector 11, spring 12, arc section 13, reverse bending section 14, connecting section 15, heat dissipation pipeline 16, connecting pipe 17, water inlet pipe 18, water outlet pipe 19, pressure frame 20, slide groove 21, locking screw 22, positioning column 23, guide rail 24, slider 25, first rack 26, first gear 27, first motor 28, glass sphere 29, cooling liquid 30, pillar 31, water injection channel 32, plunger 33. DETAILED DESCRIPTION

[0027] like Figures 1 to 6 As shown, the laser processing device of a ceramic substrate for a circuit board of the present invention comprises a device body 1, a laser 2 arranged on the device body 1, a displacement driving device 3 connected to the laser 2, and a sleeve 4 installed at the output port of the laser 2. The device body 1 can be connected to an existing manipulator to perform linear or rotational displacements in multiple directions as required. The displacement driving device 3 comprises a second motor, a second gear, a second rack and a slideway. The laser 2 is fixedly connected to the slideway. A second rack is arranged on the side of the slideway. The second rack meshes with a second gear driven to rotate by a second motor. The second motor is fixed on the device body 1. When the second motor rotates, it can drive the laser 2 to be displaced as a whole.

[0028] Specifically, the laser emitted by the laser 2 coincides with the axis of the sleeve 4, so the laser emitted by the laser 2 can pass through the lower opening of the sleeve 4 to achieve processing. The displacement drive device 3 can drive the laser 2 to move along the axial direction of the sleeve 4 to adjust the distance between the lower end of the sleeve 4 and the product; along the axial direction of the sleeve 4, a lens 5, an elastic support device 7 and a rolling transparent ball 8 are sequentially arranged in the sleeve 4, and the laser passes through the lens 5 and the rolling transparent ball 8 in turn, and the annular pressure plate 6 and the elastic support device 7 are both avoided. A conical pipe mouth 9 for limiting the rolling transparent ball 8 is formed at the opening of the sleeve 4 to prevent the rolling transparent ball 8 from rolling out from the lower end. The elastic support device 7 is arranged between the annular pressure plate 6 and the rolling transparent ball 8 to provide elastic pressure to the rolling transparent ball 8. The device of the present invention can form a certain pressure on the processing position of the product by arranging the rolling transparent ball 8, and the rolling transparent ball 8 is pressed against the plastic protective film of the ceramic substrate through the elastic support device 7, which helps the plastic protective film to melt quickly, thereby improving the laser processing efficiency and quality of the ceramic substrate.

[0029] In this embodiment, the elastic support device 7 includes an elastic steel sheet 10, a steel sheet connector 11, a spring 12 and a pressure plate 6. The surface of the elastic steel sheet 10 is polished to achieve better cooperation between it and the rolling transparent ball 8 and reduce the friction as much as possible. With the axis of the sleeve 4 as the center, a number of elastic steel sheets 10 are evenly distributed on the inner surface of the rolling transparent ball 8 along the circumferential direction. Through reasonable arrangement, the elastic steel sheet 10 is prevented from blocking the laser light. The elastic steel sheet 10 is fixedly connected to the tube wall of the sleeve 4 through the steel sheet connector 11, and its own structural setting also makes it have a certain elastic pre-pressure. A number of elastic steel sheets 10 are pressed against the inner surface of the rolling transparent ball 8 through the lower end of the spring 12, which can press the rolling transparent ball 8 downward. The pressure plate 6 is arranged in the middle of the sleeve 4, and the upper end of the spring 12 is fixedly connected to the pressure plate 6, and the pressure plate 6 has a limiting effect on the rear end of the spring 12.

[0030] In this embodiment, the elastic steel sheet 10 specifically includes an arc segment 13, a reverse bending segment 14 and a connecting segment 15. The bending direction of the reverse bending segment 14 is opposite to that of the arc segment 13 to provide elastic pre-pressure. The arc segment 13 is an arc-shaped sheet structure and its curvature is adapted to the rolling transparent ball 8 to better cooperate with the rolling transparent ball 8. The arc segment 13 is integrally connected with the connecting segment 15 through the reverse bending segment 14, which can be easily processed, maintained and replaced. The connecting segment 15 is fixedly connected to the tube wall of the sleeve 4 through the steel sheet connector 11, which can be easily disassembled. The lower end of the spring 12 is pressed against the arc segment 13 of each elastic steel sheet 10 at the same time.

[0031] In this embodiment, a heat dissipation pipeline 16 is also provided on the back side of the arc segment 13, which can be used to dissipate heat from the arc segment 13. Of course, the arc segment 13 is used to cool the transparent glass ball. By generating a certain temperature difference with the ablated part of the product, it can reduce the adhesion to the melted part of the product, making the processing of the product smoother. Each heat dissipation pipeline 16 is connected through a connecting pipe 17, and two heat dissipation pipelines 16 are respectively connected to a water inlet pipe 18 and a water outlet pipe 19. The water inlet pipe 18 extends out of the outer side of the sleeve 4 and is connected to the water supply device to achieve normal supply of cooling water.

[0032] In this embodiment, a pressing frame 20 is provided on the upper side of the pressing plate 6, and a central leaf of the pressing frame 20 is provided with a central through hole. The middle part of the sleeve is cylindrical, and the outer surface of the pressing frame 20 completely corresponds to the sleeve, which can ensure that the pressing frame 20 can be accurately displaced along the axis. The pressing frame 20 and the pressing plate 6 are both slidably matched with the inner side of the sleeve 4, and a sliding groove 21 is provided on the outer wall of the sleeve 4 corresponding to the pressing frame 20. A locking screw 22 is provided in the sliding groove 21, and the inner end of the locking screw 22 is extended into the sleeve 4 to position the pressing frame 20. By adjusting the position of the locking screw 22, the compression degree of the spring 12 can be adjusted as needed, thereby adjusting the pressure applied by the rolling transparent ball 8.

[0033] In this embodiment, the inner ends of several elastic steel sheets 10 are spaced apart to form an irradiation area for the laser to pass through, so as to prevent the laser light from being blocked. A positioning column 23 is fixed on the inner surface of the rolling transparent ball 8, and the positioning column 23 is limited in the space of the irradiation area. By setting the positioning column 23, the rolling angle range of the rolling transparent ball 8 can be determined, and the fused plastic bonded to the outer side of the rolling transparent ball 8 will not enter the inner side of the sleeve through the rolling transparent ball 8, which can ensure the cleaning effect of the device to a certain extent and improve the life of the device.

[0034] In this embodiment, a guide rail 24 is fixed to the inner wall of the sleeve 4, and a slider 25 is connected to the guide rail 24. The slider 25 can slide in the guide rail 24, and the guide rail 24 limits its position. The slider 25 is fixedly connected to the edge of the lens 5, and a first rack 26 is arranged on the outer side of the slider 25. The first rack 26 is meshed with a first gear 27, and the first gear 27 is driven by a first motor 28. The first motor 28 is fixed to the outer side of the sleeve 4. By rotating the first motor 28, the slider 25 can be driven to move along the axial direction to adjust the axial position of the lens 5, thereby adjusting the degree of focusing. Those skilled in the art should be able to understand.

[0035] In this embodiment, the rolling transparent ball 8 includes a glass sphere 29, a cavity is formed inside the glass sphere 29, and the cavity is filled with a cooling liquid 30. The cooling liquid 30 can be water. The glass sphere 29 is made of organic glass to ensure a certain rigidity, and its refractive index is set to be the same as the refractive index of water. A plurality of pillars 31 are integrally arranged inside the glass sphere 29 to better transfer heat. The pillars 31 extend radially inwardly along the glass sphere 29. One of the pillars 31 is provided with a water injection channel 32 to facilitate the water injection operation. The water injection channel 32 is blocked by a plunger 33.

[0036] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present invention.

Claims

1. A laser processing device for a ceramic substrate for a circuit board, characterized in that: The device comprises a device body, a laser arranged on the device body, a displacement driving device connected to the laser, and a sleeve installed at the output port of the laser. The laser emitted by the laser coincides with the axis of the sleeve, and the displacement driving device can drive the laser to move along the axial direction of the sleeve. A lens, an elastic supporting device and a rolling transparent ball are sequentially arranged in the sleeve along the axial direction. A conical pipe mouth for limiting the rolling transparent ball is formed at the opening of the sleeve. The elastic supporting device is arranged between the annular pressure plate and the rolling transparent ball to provide elastic pressure to the rolling transparent ball.

2. The laser processing device for a ceramic substrate for a circuit board according to claim 1, characterized in that: The elastic support device includes an elastic steel sheet, a steel sheet connector, a spring and a pressure plate. A plurality of elastic steel sheets are evenly distributed on the inner surface of the rolling transparent ball along the circumferential direction. The elastic steel sheet is fixedly connected to the tube wall of the sleeve through the steel sheet connector. A plurality of elastic steel sheets are pressed against the inner surface of the rolling transparent ball through the lower end of the spring. The pressure plate is arranged in the middle of the sleeve, and the upper end of the spring is fixedly connected to the pressure plate.

3. The laser processing device for a ceramic substrate for a circuit board according to claim 2, characterized in that: The elastic steel sheet includes an arc segment, a reverse bending segment and a connecting segment. The arc segment is an arc-shaped sheet structure and its curvature is adapted to the rolling transparent ball. The arc segment is integrally connected to the connecting segment through the reverse bending segment. The connecting segment is fixedly connected to the tube wall of the sleeve through a steel sheet connector. The lower end of the spring is simultaneously pressed against the arc segment of each elastic steel sheet.

4. The laser processing device for a ceramic substrate for a circuit board according to claim 3, characterized in that: A heat dissipation pipeline is also arranged on the back side of the arc segment, and each heat dissipation pipeline is connected through a connecting pipe, wherein two heat dissipation pipelines are respectively connected with a water inlet pipe and a water outlet pipe, and the water inlet pipe extends out of the outer side of the sleeve and is connected to a water supply device.

5. The laser processing device for a ceramic substrate for a circuit board according to claim 4, characterized in that: A pressing frame is arranged on the upper side of the pressing plate, and both the pressing frame and the pressing plate are slidably matched with the inner side of the sleeve, and a sliding groove is opened on the outer wall of the sleeve corresponding to the pressing frame, and a locking screw is arranged in the sliding groove, and the inner end of the locking screw extends into the sleeve to position the pressing frame.

6. The laser processing device for a ceramic substrate for a circuit board according to claim 2, characterized in that: The inner ends of the plurality of elastic steel sheets are spaced apart to form an irradiation area for the laser to pass through. A positioning column is fixed on the inner surface of the rolling transparent ball, and the positioning column is limited in the space of the irradiation area.

7. The laser processing device for a ceramic substrate for a circuit board according to claim 1, characterized in that: A guide rail is fixed to the inner wall of the sleeve, and a slider is connected to the guide rail. The slider is fixedly connected to the edge of the lens, and a first rack is arranged on the outer side of the slider. The first rack is meshed with a first gear. The first gear is driven by a first motor, and the first motor is fixed on the outer side of the sleeve.

8. A laser processing device for a ceramic substrate for a circuit board according to any one of claims 1 to 7, characterized in that: The rolling transparent ball comprises a glass sphere, a cavity is formed inside the glass sphere, and the cavity is filled with cooling liquid.

9. A laser processing device for a ceramic substrate for a circuit board according to claim 8, characterized in that: A plurality of pillars are integrally arranged on the inner side of the glass sphere, and the pillars extend radially inwardly along the glass sphere. A water injection channel is opened on one of the pillars, and the water injection channel is blocked by a plunger.

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