A grinding device and grinding method for semiconductors

Abstract

The present invention discloses a grinding device for semiconductors, which includes a machine table. A rotatable grinding assembly is arranged on the machine table, and the grinding assembly moves in the YZ plane. A placement table corresponding to the grinding assembly is arranged on the machine table, and a rotatable placement tray is arranged inside the placement table; the grinding assembly includes a grinding disc, and a first grinding disc, a second grinding disc and a third grinding disc are coaxially arranged on the grinding disc in sequence from the inside to the outside. The first grinding disc, the second grinding disc and the third grinding disc are detachably fixed on the side of the grinding disc facing the placement tray. A first grinding surface, a second grinding surface and a third grinding surface are respectively provided on the first grinding disc, the second grinding disc and the third grinding disc. The horizontal heights of the first grinding surface, the second grinding surface and the third grinding surface increase in sequence, and the corresponding mesh numbers also increase in sequence; the first grinding disc and the second grinding disc move towards the material along the Z-axis direction below the grinding disc, and the horizontal height can be adjusted. The present invention avoids frequent replacement of the grinding disc and significantly improves the working efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor material processing, and in particular to a grinding device and a grinding method for semiconductors. Background Art

[0002] Semiconductor silicon wafers are one of the most important materials in modern electronic devices. Their manufacturing process involves multiple steps S, among which grinding is one of the key processes. The main purpose of silicon wafer grinding is to remove the irregularities on the wafer surface, improve its flatness and smoothness, so as to meet the requirements of subsequent processes such as lithography and doping. Grinding equipment usually uses precision grinders, whose working principle is to contact the silicon wafer surface with a high-speed rotating abrasive tool to remove excess material. The key parameters in the grinding process include grinding speed, grinding pressure, and the selection of abrasives, all of which will affect the final quality and production efficiency of the wafer. After grinding, the silicon wafer usually needs to be cleaned and polished to ensure that its surface has no particles and scratches, so as to provide a high-quality substrate for the subsequent manufacture of semiconductor devices. Through efficient grinding equipment, precise processing of silicon wafers can be achieved, the production yield can be improved, the manufacturing cost can be reduced, and the rapid development of the semiconductor industry can be facilitated.

[0003] In the semiconductor manufacturing process, the grinding of silicon wafers is an important process to achieve high flatness and smoothness. However, the existing grinding equipment has the problem of low efficiency. Due to different requirements for surface quality and roughness in different stages of silicon wafer processing, grinding discs of different materials or particle sizes need to be used. For example, coarser-grained grinding discs are required in the rough grinding stage to quickly remove materials, while finer-grained grinding discs are required in the fine grinding stage and the polishing stage to improve surface quality. This multi-stage process requires operators to frequently replace the grinding discs, and the grinding discs will wear out due to long-term use, further exacerbating the replacement frequency. This cumbersome operation not only consumes a large amount of time and manpower, but also reduces the production efficiency.

[0004] Therefore, a grinding device and a grinding method for semiconductors are proposed to solve the above problem of low efficiency. Summary of the Invention

[0005] The purpose of the present invention is to provide a grinding device and a grinding method for semiconductors to solve the above problem of low efficiency.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A grinding device for semiconductors, including a machine table, characterized in that a rotatable grinding assembly is arranged on the machine table, and the grinding assembly moves in the YZ plane. A placement table corresponding to the grinding assembly is arranged on the machine table, and a rotatable placement disc is arranged inside the placement table, and the placement disc is used for placing materials;

[0008] The grinding assembly includes a grinding disc, and a first grinding disc, a second grinding disc and a third grinding disc which are coaxially distributed on the grinding disc in sequence from inside to outside. The first grinding disc, the second grinding disc and the third grinding disc are all detachably fixed on the side of the grinding disc facing the placing disc. The first grinding disc, the second grinding disc and the third grinding disc are respectively provided with a first grinding surface, a second grinding surface and a third grinding surface. The horizontal heights of the first grinding surface, the second grinding surface and the third grinding surface increase in sequence, and the corresponding mesh numbers also increase in sequence. The first grinding disc, the second grinding disc and the third grinding disc are used to grind the materials on the placing disc in sequence;

[0009] The first grinding disc and the second grinding disc move towards the material along the Z-axis direction under the grinding disc and can adjust the horizontal height, so that after the first grinding surface contacts the surface of the placing disc, the second grinding surface contacts the surface of the material; after the second grinding surface contacts the surface of the placing disc, the third grinding surface contacts the surface of the material.

[0010] The third grinding disc is sleeved outside the second grinding disc, and the second grinding disc is sleeved outside the first grinding disc. The widths of the first grinding surface, the second grinding surface and the third grinding surface are all equal and are all larger than the diameter of the placing area on the placing disc.

[0011] The machine table includes a base, an assembly seat and a mounting seat which are connected in sequence. The mounting seat is slidably connected to the assembly seat and moves linearly along the Y-axis direction. A driving assembly connected to the grinding disc is arranged on the mounting seat.

[0012] The placing disc is hinged to the base and connected to the assembly seat. The assembly seat abuts against the base. A slide rail is arranged on the side surface of the base along the Y-axis direction. A slider is slidably connected in the slide rail. A protruding portion is formed on the side surface of the assembly seat corresponding to the slider. The slider and the protruding portion are hinged to the same connecting plate through a hinge shaft. A pushing cylinder connected to the slider is arranged on the slide rail along the Y-axis direction. A water pipe is arranged on the placing table corresponding to the placing area.

[0013] Rotatable first connecting pieces, second connecting pieces and third connecting pieces are respectively arranged on the first grinding disc, the second grinding disc and the third grinding disc. The first connecting piece and the second connecting piece are both telescopic rods. The tops of the first connecting piece, the second connecting piece and the third connecting piece penetrate and extend to the top surface of the grinding disc. Threaded sleeves are arranged on the grinding disc corresponding to the first connecting piece, the second connecting piece and the third connecting piece. The first connecting piece, the second connecting piece and the third connecting piece are respectively connected to the corresponding threaded sleeves.

[0014] A supporting portion is formed on the outer side of the threaded sleeve along the Z-axis direction. A gap is formed between the threaded sleeve and the grinding disc. The first connecting piece, the second connecting piece and the third connecting piece respectively penetrate through the corresponding gaps and are connected to the corresponding threaded sleeves.

[0015] A telescopic space is formed between the first grinding disc, the second grinding disc and the grinding disc. The first connecting piece and the second connecting piece are respectively located in the telescopic spaces corresponding to the first grinding disc and the second grinding disc. The first grinding disc and the second grinding disc respectively move linearly along the Z-axis direction in the corresponding telescopic spaces. An extendable edge grinding unit is arranged inside the first grinding disc, a second grinding area is arranged outside the first grinding disc, and a third grinding area is arranged outside the second grinding disc.

[0016] The edge grinding unit includes a moving block and an edge grinding sleeve. At least two sliding grooves are equidistantly arranged along the Z-axis direction on the inner side wall of the first grinding disc. The moving block is slidably connected in the sliding groove and is elastically connected to the top wall of the sliding groove. The edge grinding sleeve is connected to the inside of the moving block. The bottom end of the edge grinding sleeve extends to the outside of the first grinding disc. A first grinding area is arranged on the outside of the edge grinding sleeve. The mesh number of the first grinding area, the mesh number of the second grinding area, and the mesh number of the third grinding area are respectively the same as the mesh number of the first grinding surface, the mesh number of the second grinding surface, and the mesh number of the third grinding surface.

[0017] The moving block is connected to the top wall of the sliding groove through a spring, and the moving block moves linearly along the Z-axis direction in the sliding groove.

[0018] A grinding method for semiconductors, characterized in that it is applied to the grinding device for semiconductors as described in any one of the above, and the grinding method includes the following steps:

[0019] Step S1: After placing the material on the placement tray and fixing it, the placement tray and the grinding assembly are made to rotate by the control unit;

[0020] Step S2: Make the rotating grinding assembly contact the material to grind the surface of the material;

[0021] Step S3: Move the grinding assembly in the YZ plane so that the first grinding disc, the second grinding disc, and the third grinding disc sequentially grind the surface of the material, and the rough grinding, fine grinding, and polishing processes are realized at one time.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. For the grinding device and grinding method for semiconductors of the present invention, through the first grinding disc, the second grinding disc, and the third grinding disc on the grinding assembly, rough grinding, fine grinding, and polishing can be realized in one grinding operation, avoiding the cumbersome process of frequently replacing the grinding disc, significantly improving the working efficiency, and reducing the production downtime.

[0024] 2. The grinding device and method for semiconductors of the present invention can tilt the object table hinged on the base through structures such as a pushing cylinder and a connecting plate, enabling the cooling water to flow evenly and cover the entire object tray, thereby effectively reducing the heat generated during the grinding process, preventing the material from overheating. At the same time, after tilting, it can ensure that the cooling water takes away the waste generated during the grinding process, reducing pollution and improving the overall grinding quality.

[0025] 3. The grinding device and method for semiconductors of the present invention can synchronously grind the side surface when the first grinding disc, the second grinding disc, and the third grinding disc grind the surface of the material through the second grinding area, the third grinding area, and the first grinding area on the grinding edge sleeve. By this method, not only can the overall production efficiency be improved, additional processing procedures be reduced, but also the geometric accuracy of the material can be ensured, and the error caused by multiple processing can be reduced.

[0026] 4. The grinding device and method for semiconductors of the present invention can adapt to the heights of different material sides during edge grinding through the telescopic grinding edge sleeve, the first grinding disc, and the second grinding disc, ensuring the best contact between the grinding disc and the material during the grinding process, effectively improving the grinding quality and the surface accuracy of the workpiece, and at the same time meeting the processing requirements of materials with different heights. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor.

[0028] The structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have technical substance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope that can be covered by the technical content disclosed in the present invention without affecting the effects that the present invention can produce and the purposes that can be achieved.

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 It is a schematic diagram of the upward view structure of the grinding assembly in the present invention;

[0031] Figure 3 It is a schematic diagram of the cross-sectional view of the grinding disc in the present invention;

[0032] Figure 4Schematic diagram of the disassembly structure of the first grinding disc and the second grinding disc in the present invention;

[0033] Figure 5 Schematic diagram of the connection structure of the first grinding disc and the first connecting member in the present invention;

[0034] Figure 6 For the present invention Figure 5 Enlarged schematic diagram of the structure at position A in the present invention;

[0035] Figure 7 Bottom view schematic diagram of the third connecting member in the present invention;

[0036] Figure 8 Schematic diagram of the connection structure of the slide rail and the slider in the present invention;

[0037] Figure 9 Internal structure schematic diagram of the assembly seat in the present invention.

[0038] Illustration: 1. Machine platform; 11. Base; 12. Assembly seat; 121. Protruding part; 122. Electric push rod; 123. Support rod; 124. Connection port; 13. Mounting seat; 131. Connection block; 14. Slide rail; 15. Slider; 16. Connection plate; 17. Pushing cylinder; 2. Grinding assembly; 21. Grinding disc; 211. Threaded sleeve; 212. Support part; 22. First grinding disc; 221. First grinding surface; 222. First connecting member; 223. Second grinding edge area; 23. Second grinding disc; 231. Second grinding surface; 232. Second connecting member; 233. Third grinding edge area; 24. Third grinding disc; 241. Third grinding surface; 242. Third connecting member; 25. Telescopic space; 26. Edge grinding unit; 261. Slide groove; 262. Moving block; 263. Edge grinding sleeve; 264. First grinding edge area; 265. Spring; 3. Placing table; 31. Placing tray; 32. Placing area; 33. Water pipe; 4. Driving assembly. Detailed implementation manners

[0039] To make the objectives, features, and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0040] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component present.

[0041] Embodiment 1:

[0042] Please refer to Figures 1-9 , a grinding device for semiconductors in this embodiment includes a machine table 1. A rotatable grinding assembly 2 is provided on the machine table 1, and the grinding assembly 2 moves in the YZ plane. A placement table 3 is provided on the machine table 1 corresponding to the grinding assembly 2. A rotatable placement tray 31 is provided inside the placement table 3, and the placement tray 31 is used to place materials.

[0043] The grinding assembly 2 includes a grinding disc 21, and a first grinding disc 22, a second grinding disc 23, and a third grinding disc 24 are coaxially distributed on the grinding disc 21 in sequence from the inside to the outside. The first grinding disc 22, the second grinding disc 23, and the third grinding disc 24 are all detachably fixed on the side of the grinding disc 21 facing the placement tray 31. First grinding surfaces 221, second grinding surfaces 231, and third grinding surfaces 241 are respectively provided on the first grinding disc 22, the second grinding disc 23, and the third grinding disc 24. The horizontal heights of the first grinding surface 221, the second grinding surface 231, and the third grinding surface 241 increase in sequence, and the corresponding mesh numbers also increase in sequence. The first grinding disc 22, the second grinding disc 23, and the third grinding disc 24 are used to grind the materials on the placement tray 31 in sequence.

[0044] The first grinding disc 22 and the second grinding disc 23 move towards the materials along the Z-axis direction below the grinding disc 21, and the horizontal height can be adjusted so that after the first grinding surface 221 contacts the surface of the placement tray 31, the second grinding surface 231 contacts the surface of the materials; after the second grinding surface 231 contacts the surface of the placement tray 31, the third grinding surface 241 contacts the surface of the materials.

[0045] During application, the material to be processed is placed on the placement area 32, and the material is fixed by the placement tray 31. Then, the grinding assembly 2 and the placement tray 31 are rotated respectively, and the grinding assembly 2 is moved towards the placement tray 31 until it contacts the material, and the surface of the material is ground. During the grinding process, the intermittent horizontal movement of the grinding assembly 2 enables the first grinding disc 22, the second grinding disc 23, and the third grinding disc 24 to grind the surface of the material respectively, so as to rough grind, finish grind, and polish the material at one time, realizing the integration of rough grinding, finish grinding, and polishing. At the same time, when grinding materials of different heights, after the first grinding disc 22 and the second grinding disc 23 move below the grinding disc 21, their horizontal heights are adjusted, so as to avoid that after the first grinding surface 221 contacts the surface of the placement tray 31, the second grinding surface 231 cannot contact the surface of the material due to the first grinding disc 22, and after the second grinding surface 231 contacts the surface of the placement tray 31, the third grinding surface 241 cannot contact the surface of the material due to the second grinding disc 23, so as to improve the adaptability and adapt to materials of different heights.

[0046] It can be understood that during the grinding process of the material, the first grinding surface 221, the second grinding surface 231, and the third grinding surface 241 with gradually increasing mesh numbers on the grinding assembly 2 can complete the rough grinding, finish grinding, and polishing processes of the material in one grinding operation without stopping to replace abrasives with different mesh numbers. Grinding the material in this way effectively improves the work efficiency, reduces the work intensity of the staff, and at the same time, the continuous grinding work can also improve the grinding quality of the material surface, thereby improving the material quality.

[0047] It should be noted that the horizontal heights of the first grinding surface 221, the second grinding surface 231, and the third grinding surface 241 increase in sequence, so that the first grinding disc 22, the second grinding disc 23, and the third grinding disc 24 are distributed in a stepped manner. During the grinding process, the first grinding disc 22 grinds first, and the second grinding disc 23 and the third grinding disc 24 do not contact the material or the placement tray 31, which can avoid unnecessary wear. At the same time, since the placement area 32 is located at the outer part of the placement tray 31, when the first grinding disc 22 finishes grinding and the second grinding disc 23 starts grinding, the first grinding disc 22 moving away from the placement tray 31 can also avoid unnecessary wear;

[0048] Through the setting positions of the first grinding disc 22, the second grinding disc 23, the third grinding disc 24, and the placement area 32, it can be avoided that when any one of the first grinding disc 22, the second grinding disc 23, and the third grinding disc 24 is performing grinding work, the other grinding discs are worn, effectively improving the service life and indirectly reducing the production cost.

[0049] It can be understood that the storage tray 31 is driven to rotate by a rotating motor arranged in the storage table 3. The storage tray 31 fixes the materials through adsorption. The specific adsorption structure is well-known to those skilled in the art and will not be described in this embodiment.

[0050] Further, the third grinding disc 24 is sleeved outside the second grinding disc 23, the second grinding disc 23 is sleeved outside the first grinding disc 22. The widths of the first grinding surface 221, the second grinding surface 231 and the third grinding surface 241 are all equal, and are all larger than the diameter of the storage area 32 on the storage tray 31.

[0051] It should be noted that the widths of the first grinding surface 221, the second grinding surface 231 and the third grinding surface 241 are all slightly larger than the diameter of the storage area 32. By this setting method, while meeting the grinding effect, it can avoid increasing the moving stroke of the grinding disc 21 due to too large a grinding surface, thereby reducing the error rate during grinding.

[0052] Further, the machine table 1 includes a base 11, an assembly seat 12 and an installation seat 13 connected in sequence. The installation seat 13 is slidably connected to the assembly seat 12 and moves linearly along the Y-axis direction. A driving component 4 connected to the grinding disc 21 is arranged on the installation seat 13; specifically, the storage tray 31, the grinding component 2 and the installation seat 13 are distributed in sequence along the Y-axis direction.

[0053] It should be noted that after the materials are placed, the driving component 4 will move the grinding component 2 along the Z-axis direction, so that the grinding component 2 rotates to grind the materials. And after the first grinding disc 22 or the second grinding disc 23 finishes the grinding work, the moving installation seat 13 drives the grinding component 2 to move for grinding in the next process; specifically, the driving component 4 includes a driving cylinder and a driving motor. The driving cylinder is used to drive the grinding component 2 to move along the Z-axis direction, and the driving motor is used to drive the grinding component 2 to rotate. The installation positions of the driving cylinder and the driving motor are well-known to those skilled in the art and will not be described in this embodiment.

[0054] In a specific embodiment, please refer to Figure 9 , a connecting block 131 is fixed to the bottom surface of the installation seat 13. A connecting port 124 is opened along the Y-axis direction on the top surface of the assembly seat 12 corresponding to the connecting block 131. A support rod 123 is fixed in the assembly seat 12 corresponding to the connecting port 124. The connecting block 131 penetrates through the connecting port 124 and extends into the assembly seat 12. The connecting block 131 is sleeved on the support rod 123, and an electric push rod 122 is arranged between the connecting block 131 and the inner side wall of the assembly seat 12 along the Y-axis direction.

[0055] During application, the telescopic movement of the electric push rod 122 drives the connecting block 131 to move on the support rod 123. After the connecting block 131 moves, it can drive the grinding assembly 2 to move in the Y-axis direction through the mounting block, enabling the first grinding disc 22, the second grinding disc 23, and the third grinding disc 24 to grind the material respectively, so as to realize the integration of rough grinding, fine grinding, and polishing.

[0056] Furthermore, the storage tray 31 is hinged to the base 11 and connected to the assembly seat 12. The assembly seat 12 abuts against the base 11. A slide rail 14 is arranged on the side of the base 11 in the Y-axis direction. A slider 15 is slidably connected in the slide rail 14. A protruding portion 121 is formed on the side of the assembly seat 12 corresponding to the slider 15. The slider 15 and the protruding portion 121 are hinged to the same connecting plate 16 through a hinge shaft. A pushing cylinder 17 connected to the slider 15 is arranged on the slide rail 14 in the Y-axis direction. A water pipe 33 is arranged on the storage tray 31 corresponding to the storage area 32.

[0057] During application, before grinding the material, the pushing cylinder 17 is operated. After it operates, its output shaft extends. At this time, the slider 15 will move towards the storage table 3 in the slide rail 14. After the slider 15 moves, the slider 15 will drive the connecting plate 16 to rotate. When the connecting plate 16 rotates to be perpendicular to the slider 15, the connecting plate 16 will push up the assembly seat 12 through the protruding portion 121. Under the restriction of the hinge of the assembly seat 12 on the storage table 3, the assembly seat 12 and the storage table 3 will be inclined together. After the storage table 3 is inclined, the grinding work can be started. And during grinding, the water pipe 33 will also discharge cooling water to cool the material and the grinding assembly 2 during grinding. And because the storage table 3 is inclined, the discharged cooling water can completely cover the entire storage tray 31 after flowing out, cooling all the materials on the storage tray 31 and taking away the waste generated by grinding. And after the cooling water circulates, under the action of the inclined state of the storage table 3, it can also gather together, so as to facilitate the collection of the cooling water and the waste together.

[0058] It should be noted that through the inclined storage table 3 and the water pipe 33, the flow of the cooling water can be promoted, the accumulation of the cooling water on the storage tray 31 can be reduced, and the uneven grinding or pollution caused by the accumulation of the cooling water can be avoided. And through the inclined flushing, the waste on the storage table 3 can be effectively cleaned, improving the cleaning effect of the waste, and thus ensuring the grinding quality.

[0059] Furthermore, rotatable first connecting members 222, second connecting members 232 and third connecting members 242 are respectively provided on the first grinding disc 22, the second grinding disc 23 and the third grinding disc 24. The first connecting member 222 and the second connecting member 232 are both telescopic rods. The tops of the first connecting member 222, the second connecting member 232 and the third connecting member 242 penetrate and extend to the top surface of the grinding disc 21. Threaded sleeves 211 are provided on the grinding disc 21 corresponding to the first connecting member 222, the second connecting member 232 and the third connecting member 242. The first connecting member 222, the second connecting member 232 and the third connecting member 242 are respectively connected to the corresponding threaded sleeves 211.

[0060] It should be noted that by providing the first connecting member 222, the second connecting member 232 and the third connecting member 242, it is convenient to replace the first grinding disc 22, the second grinding disc 23 and the third grinding disc 24 after wear.

[0061] During application, the first connecting member 222, the second connecting member 232 and the third connecting member 242 are rotated to be connected or separated from the corresponding threaded sleeves 211, realizing the connection or separation between the first grinding disc 22, the second grinding disc 23, the third grinding disc 24 and the grinding disc 21. By this way, connecting or separating the first grinding disc 22, the second grinding disc 23, the third grinding disc 24 and the grinding disc 21 greatly improves the efficiency of replacing the first grinding disc 22, the second grinding disc 23 and the third grinding disc 24.

[0062] It should also be noted that during the process of grinding the material, the first connecting member 222 and the second connecting member 232 which are telescopic rods are compressed by extrusion, ensuring that after the first grinding surface 221 contacts the surface of the placement disc 31, the second grinding surface 231 contacts the surface of the material; after the second grinding surface 231 contacts the surface of the placement disc 31, the third grinding surface 241 contacts the surface of the material, ensuring the grinding effect. At the same time, after the first grinding disc 22 and the second grinding disc 23 complete grinding, the first connecting member 222 and the second connecting member 232 which are telescopic rods can be reset through their reset function, enabling the first grinding disc 22 and the second grinding disc 23 to facilitate subsequent work. And during the specific grinding process, the first connecting member 222 and the second connecting member 232 which are telescopic rods can also adjust the heights of the first grinding disc 22 and the second grinding disc 23 in real time according to the height of different materials.

[0063] In a specific embodiment, the first connecting member 222 and the second connecting member 232 are screw rods. Through their cooperation with the threaded sleeves 211, the first grinding disc 22 and the second grinding disc can move along the Z-axis towards the material.

[0064] Furthermore, a support portion 212 is formed on the outer side of the threaded sleeve 211 along the Z-axis direction. A gap is formed between the threaded sleeve 211 and the grinding disc 21. The first connecting member 222, the second connecting member 232, and the third connecting member 242 respectively pass through the corresponding gaps and are connected to the corresponding threaded sleeves 211.

[0065] During application, when the first connecting member 222, the second connecting member 232, and the third connecting member 242 are connected to the corresponding threaded sleeves 211, the first connecting member 222, the second connecting member 232, and the third connecting member 242 can rotate through the gaps, so that the first connecting member 222, the second connecting member 232, and the third connecting member 242 are connected to or separated from the corresponding threaded sleeves 211. Under the action of the gaps, not only the connection or separation speed is improved, but also the operation process is made more convenient and fast.

[0066] Further, a telescopic space 25 is formed between the first grinding disc 22, the second grinding disc 23, and the grinding disc 21. The first connecting member 222 and the second connecting member 232 are respectively located in the corresponding telescopic spaces 25 of the first grinding disc 22 and the second grinding disc 23. The first grinding disc 22 and the second grinding disc 23 respectively move linearly along the Z-axis direction in the corresponding telescopic spaces 25. A telescopic grinding edge unit 26 is provided on the inner side of the first grinding disc 22, a second grinding edge area 223 is provided on the outer side of the first grinding disc 22, and a third grinding edge area 233 is provided on the outer side of the second grinding disc 23.

[0067] During application, when the first grinding disc 22 grinds the surface of the material, the side surface of the material will be ground synchronously by the grinding edge unit 26, and the grinding edge unit 26 will adaptively adjust its height according to the height of the material; when the second grinding disc 23 grinds the surface of the material, the side surface of the material will be ground synchronously by the second grinding edge area 223 on the first grinding disc 22, and the first grinding disc 22 will move in the corresponding telescopic space 25 according to the height of the material, squeezing the first connecting member 222, and adaptively adjusting its height to avoid affecting the grinding work of the second grinding disc 23 due to the height mismatch between the first grinding disc 22 and the material height; when the third grinding disc 24 grinds the surface of the material, the side surface of the material will be ground synchronously by the third grinding edge area 233 on the second grinding disc 23, and the second grinding disc 23 will move in the corresponding telescopic space 25 according to the height of the material, squeezing the second connecting member 232, and adaptively adjusting its height to avoid affecting the grinding work of the third grinding disc 24 due to the height mismatch between the second grinding disc 23 and the material height.

[0068] Specifically, when the second grinding disc 23 performs grinding work, as the grinding disc 21 moves towards the surface of the material, it will first make contact with the surface of the placement disc 31 by the first grinding disc 22, squeezing the first grinding disc 22, causing the first grinding disc 22 to move into the corresponding telescopic space 25, and allowing the first connecting member 222 to expand and contract to achieve adaptive height adjustment. At the same time, when the third grinding disc 24 performs grinding work, the moving grinding disc 21 will first make contact with the surface of the placement disc 31 by the second grinding disc 23, squeezing the second grinding disc 23, causing the second grinding disc 23 to move into the corresponding telescopic space 25, and allowing the second connecting member 232 to expand and contract to achieve adaptive height adjustment.

[0069] It should be noted that by grinding the material in the above manner, not only can the surface of the material be ground, but also the side surface of the material can be ground, reducing the subsequent additional processing procedures required, lowering the overall processing cost, improving the production efficiency, and by simultaneously performing surface and side surface grinding work, the errors caused by multiple processing can be reduced, and the overall processing accuracy can be improved.

[0070] It should also be noted that when the side surface of the material needs to be ground, when the grinding disc 21 moves in the Y-axis direction, it is not necessary to move the first grinding disc 22 and the second grinding disc 23 away from above the placement disc 31, but it is still necessary to ensure that the first grinding disc 22 and the second grinding disc 23 do not contact the placement disc 31 to avoid abrasion of the first grinding surface 221 and the second grinding surface 231.

[0071] It should be known that since the heights of the materials to be ground are different, when performing side surface grinding synchronously, restricting the positions of the first grinding disc 22 and the second grinding disc 23 will affect the grinding work on the surface. By using the first connecting member 222 and the second connecting member 232 of the telescopic rod, the first grinding disc 22 and the second grinding disc 23 can move in the corresponding telescopic space 25, thereby adjusting the height to adapt to the height of the material whose side surface needs to be ground.

[0072] Furthermore, the edge grinding unit 26 includes a moving block 262 and an edge grinding sleeve 263. Along the Z-axis direction, not less than two sliding grooves 261 are equally spaced on the inner side wall of the first grinding disc 22. The moving block 262 is slidably connected in the sliding groove 261, and the moving block 262 is elastically connected to the inner top wall of the sliding groove 261. The edge grinding sleeve 263 is connected to the inner side of the moving block 262. The bottom end of the edge grinding sleeve 263 extends to the outside of the first grinding disc 22. A first edge grinding area 264 is provided on the outside of the edge grinding sleeve 263. The mesh number of the first edge grinding area 264, the mesh number of the second edge grinding area 223, and the mesh number of the third edge grinding area 233 are the same as the mesh number of the first grinding surface 221, the mesh number of the second grinding surface 231, and the mesh number of the third grinding surface 241, respectively.

[0073] More specifically, the moving block 262 is connected to the inner top wall of the sliding groove 261 through a spring 265, and the moving block 262 moves linearly along the Z-axis direction within the sliding groove 261.

[0074] During application, when the first grinding disc 22 performs grinding, side synchronous grinding will be carried out through the first grinding edge area 264. Before the first grinding disc 22 contacts the surface of the material, the grinding edge sleeve 263 will contact the placement tray 31. The grinding edge sleeve 263 also moves into the first grinding disc 22 as the first grinding disc 22 contacts the surface of the material. When the grinding edge sleeve 263 moves, it will drive the moving block 262 to move within the sliding groove 261 and squeeze the spring 265, so that the grinding edge sleeve 263 can adapt to the height of the side of the material.

[0075] It should be noted that through the first grinding disc 22, the second grinding disc 23, the third grinding disc 24, the first grinding edge on the grinding edge unit 26, the second grinding edge area 223, and the third grinding edge area 233, not only can the surface of the material be ground, but also the side of the material can be ground, effectively reducing the subsequent required additional processes. At the same time, the first grinding disc 22, the second grinding disc 23 that can be telescoped, and the grinding edge sleeve 263 can also adapt to materials of different heights during grinding, improving the applicability.

[0076] Embodiment 2:

[0077] A grinding method for semiconductors in this embodiment is applied to a grinding device for semiconductors as in Embodiment 1. The grinding method includes the following steps:

[0078] Step S1: After placing the material on the placement tray 31 and fixing it, the control unit makes the placement tray 31 and the grinding assembly 2 rotate.

[0079] Step S11: After placing the material, push the cylinder 17 to operate, making the placement table 3 inclined with the assembly table.

[0080] Step S21: The control unit controls the rotation motor and the drive assembly 4 to operate, making the placement tray 31 and the grinding assembly 2 rotate and perform grinding work.

[0081] Step S2: Make the rotating grinding assembly 2 contact the material to grind the surface of the material.

[0082] Step S21: Through the drive cylinder and the drive motor in the drive assembly 4, make the grinding assembly 2 rotate and approach the material direction to polish the material.

[0083] Step S3: Make the grinding assembly 2 move in the YZ plane, so that the first grinding disc 22, the second grinding disc 23, and the third grinding disc 24 sequentially grind the surface of the material, achieving rough grinding, fine grinding, and polishing processes at one time.

[0084] Step S31: When grinding, the first grinding surface 221 of the first grinding disc 22 grinds the surface of the material, and the first grinding area 264 of the grinding edge sleeve 263 grinds the side surface of the material;

[0085] Step S32: The grinding disc 21 is moved by the cooperation of the driving assembly 4 and the electric push rod 122, so that the second grinding surface 231 of the second grinding disc 23 grinds the surface of the material, and the second grinding area 223 on the first grinding disc 22 grinds the side surface of the material;

[0086] Step S33: The grinding disc 21 moves again, so that the third grinding surface 241 of the third grinding disc 24 grinds the surface of the material, and the third grinding area 233 on the second grinding disc 23 grinds the side surface of the material.

[0087] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A grinding device for semiconductors, comprising a machine platform (1), characterized in that: The machine platform (1) is provided with a rotatable grinding component (2), and the grinding component (2) moves on a YZ plane. The machine platform (1) is provided with a storage table (3) corresponding to the grinding component (2), and a rotatable storage tray (31) is provided in the storage table (3), and the storage tray (31) is used to place materials; The grinding assembly (2) comprises a grinding disc (21) and a first grinding disc (22), a second grinding disc (23) and a third grinding disc (24) which are coaxially distributed on the grinding disc (21) from the inside to the outside. The first grinding disc (22), the second grinding disc (23) and the third grinding disc (24) are all detachably fixed on a side of the grinding disc (21) facing the storage disc (31). The first grinding disc (22), the second grinding disc (23) and the third grinding disc (24) are respectively provided with a first grinding surface (221), a second grinding surface (231) and a third grinding surface (241). The horizontal heights of the first grinding surface (221), the second grinding surface (231) and the third grinding surface (241) are increased in sequence, and the corresponding mesh numbers are also increased in sequence. The first grinding disc (22), the second grinding disc (23) and the third grinding disc (24) are used to grind the material on the storage disc (31) in sequence. The first grinding disc (22), the second grinding disc (23) and the third grinding disc (24) are respectively provided with a rotatable first connecting member (222), a second connecting member (232) and a third connecting member (242), and the first connecting member (222) and the second connecting member (232) are both telescopic rods, and the top ends of the first connecting member (222), the second connecting member (232) and the third connecting member (242) penetrate and extend to the top surface of the grinding disc (21), and the grinding disc (21) is provided with a threaded sleeve (211) corresponding to the first connecting member (222), the second connecting member (232) and the third connecting member (242), and the first connecting member (222), the second connecting member (232) and the third connecting member (242) are respectively connected to the corresponding threaded sleeve (211); A telescopic space (25) is formed between the first grinding disc (22), the second grinding disc (23) and the grinding disc (21); the first connecting member (222) and the second connecting member (232) are respectively located in the corresponding telescopic space (25); the first grinding disc (22) and the second grinding disc (23) respectively move linearly along the Z-axis direction in the corresponding telescopic space (25); a telescopic edge grinding unit (26) is arranged on the inner side of the first grinding disc (22); a second edge grinding area (223) is arranged on the outer side of the first grinding disc (22); and a third edge grinding area (233) is arranged on the outer side of the second grinding disc (23).

2. A grinding device for semiconductors according to claim 1, characterized in that: The third grinding disc (24) is sleeved on the outside of the second grinding disc (23), and the second grinding disc (23) is sleeved on the outside of the first grinding disc (22); the width of the first grinding surface (221), the width of the second grinding surface (231) and the width of the third grinding surface (241) are all equal and are all greater than the diameter of the storage area (32) on the storage disc (31).

3. A grinding device for semiconductors according to claim 2, characterized in that: The machine platform (1) comprises a base (11), an assembly seat (12) and a mounting seat (13) which are connected in sequence; the mounting seat (13) is slidably connected to the assembly seat (12) and moves linearly along the Y-axis direction; and a driving component (4) connected to the grinding disc (21) is arranged on the mounting seat (13).

4. A grinding device for semiconductors according to claim 3, characterized in that: The storage tray (31) is hinged on the base (11) and connected to the assembly seat (12). The assembly seat (12) abuts against the base (11). A slide rail (14) is provided on the side of the base (11) along the Y-axis direction. A slider (15) is slidably connected in the slide rail (14). A protrusion (121) is formed on the side of the assembly seat (12) corresponding to the slider (15). The slider (15) and the protrusion (121) are hingedly connected to the same connecting plate (16) via a hinge shaft. A pushing cylinder (17) connected to the slider (15) is provided on the slide rail (14) along the Y-axis direction. A water pipe (33) is provided on the storage platform (3) corresponding to the storage area (32).

5. A grinding device for semiconductors according to claim 1, characterized in that: A support portion (212) is formed on the outer side of the threaded sleeve (211) along the Z-axis direction, a gap is formed between the threaded sleeve (211) and the grinding disc (21), and the first connecting member (222), the second connecting member (232) and the third connecting member (242) respectively penetrate the corresponding gaps and are connected to the corresponding threaded sleeve (211).

6. A grinding device for semiconductors according to claim 1, characterized in that: The edge grinding unit (26) comprises a moving block (262) and an edge grinding sleeve (263); at least two slide grooves (261) are provided on the inner side wall of the first grinding disc (22) at equal intervals along the Z-axis direction; the moving block (262) is slidably connected in the slide groove (261); the moving block (262) is elastically connected to the inner top wall of the slide groove (261); the edge grinding sleeve (263) is connected to the inner side of the moving block (262); the bottom end of the edge grinding sleeve (263) extends to the outer side of the first grinding disc (22); a first edge grinding area (264) is provided on the outer side of the edge grinding sleeve (263); the mesh number of the first edge grinding area (264), the mesh number of the second edge grinding area (223), and the mesh number of the third edge grinding area (233) are respectively the same as the mesh number of the first grinding surface (221), the mesh number of the second grinding surface (231), and the mesh number of the third grinding surface (241).

7. A grinding device for semiconductors according to claim 6, characterized in that: The moving block (262) is connected to the inner top wall of the slide groove (261) via a spring (265), and the moving block (262) moves linearly along the Z-axis direction in the slide groove (261).

8. A grinding method for semiconductors, characterized in that: Applied to the grinding device for semiconductors as claimed in any one of claims 1 to 7, the grinding method comprises the following steps: Step S1, after placing the material on the placing plate and fixing it, the placing plate and the grinding assembly are rotated by the control unit; Step S2, making the rotating grinding component contact with the material to grind the surface of the material; Step S3, moving the grinding assembly on the YZ plane, allowing the first grinding disc, the second grinding disc and the third grinding disc to grind the surface of the material in turn, and realizing the rough grinding, fine grinding and polishing processes at one time.

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