Vacuum plating device and plating method

Abstract

The invention relates to the field of electroplating, in particular to a vacuum electroplating device and an electroplating method.The vacuum electroplating device comprises an electroplating cylinder, a circulating pipe used for inputting electroplating liquid into the electroplating cylinder and a liquid discharging pipe used for discharging liquid in the electroplating cylinder are arranged on the electroplating cylinder, and an anode plate is arranged in the electroplating cylinder; the sealing cover is arranged on the electroplating cylinder in a covering manner; the electrode assembly is used for supplying power to the electroplating operation in the electroplating cylinder and providing an electroplating cathode for the electroplating operation; and the vacuum pump is connected to the electroplating cylinder. A to-be-electroplated workpiece is put into the electroplating cylinder, so that the workpiece is immersed in the electroplating liquid, the electroplating cylinder is vacuumized, bubbles on the surface of the workpiece are broken, miscellaneous gas is discharged, and then the electroplating cylinder is subjected to pressure relief and electrification for electroplating. The vacuum plating tank is vacuumized before electroplating, and gas in bubbles on the surface of an electroplated product and bubbles in electroplating liquid are discharged at the same time under the action of air pressure, so that the quality of a plating layer of the electroplated product is improved.

Description

Technical Field

[0001] The present application relates to the field of electroplating, and in particular to a vacuum electroplating device and an electroplating method. Background Art

[0002] In traditional gantry electroplating, after the electroplated product passes through the solution, the solution on its surface falls off naturally, and the solution mixed with air will form some tiny bubbles. These bubbles will last for a long time without the action of external force. When entering the next process, these bubbles will have an adverse effect on the electroplating process, including hindering the formation of the coating, poor adhesion of the coating, and uneven surface of the coating. Summary of the invention

[0003] The technical problem to be solved by the present invention is that: there are tiny bubbles on the workpiece, the coating is uneven after electroplating, the coating adhesion is poor, and the electroplating effect of the workpiece is poor.

[0004] To this end, the present invention provides a vacuum electroplating device and an electroplating method.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A vacuum plating device, comprising

[0007] An electroplating cylinder, wherein the electroplating cylinder is provided with a circulation pipe for inputting electroplating liquid into the electroplating cylinder and a liquid discharge pipe for discharging liquid in the electroplating cylinder, and an anode plate is provided in the electroplating cylinder;

[0008] A sealing cover, wherein the sealing cover is disposed on the electroplating cylinder;

[0009] An electrode assembly, the electrode assembly being used to supply power to the electroplating operation in the electroplating barrel and to provide an electroplating cathode for the electroplating operation;

[0010] A vacuum pump is connected to the electroplating cylinder.

[0011] By adopting the above technical solution, before electroplating, the workpiece is placed in the electroplating cylinder so that the workpiece is immersed in the electroplating solution, and then the electroplating cylinder is evacuated to allow the bubbles in the electroplating solution to rise and discharge impurities, so that the bubbles on the workpiece are burst, thereby facilitating the subsequent electroplating of the workpiece and improving the electroplating effect on the workpiece surface.

[0012] Furthermore, the connection between the vacuum pump and the electroplating cylinder is located above the anode plate.

[0013] Furthermore, two circulating pipes are provided, one end of each of which is connected to the electroplating cylinder, the other end of one of the circulating pipes is connected to a filter pump for extracting the plating liquid in the electroplating cylinder into the filter pump for filtration, and one end of the other circulating pipe is connected to a plating liquid tank, and the filter pump is connected to the plating liquid tank.

[0014] Furthermore, a driver is provided on the sealing cover, and the driver includes a shell, a driving rod, and electrodes arranged at both ends of the shell for powering the driving machine. The driving rod is electrically connected to the electrodes, and the driving rod vertically penetrates the sealing cover and extends into the electroplating cylinder. The driving rod is conductive.

[0015] Furthermore, it also includes a mounting frame, the electroplating cylinder is arranged on the mounting frame and spaced apart from the ground, the mounting frame is provided with a support plate that slides in the vertical direction through a lifter, the support plate is provided with a conductive sheet opposite to the electrode, and the conductive sheet is electrically connected to the electrode.

[0016] Furthermore, a bracket is connected to the bottom of the sealing cover, an inclined support plate is connected to the bracket, a connecting shaft is rotatably connected to the support plate, a material basket is connected to the connecting shaft, an opening of the material basket is set away from the connecting shaft, the material basket is located below the anode plate, a driving motor electrically connected to the electrode is set in the outer shell, the driving rod is coaxially connected to the output shaft of the driving motor, a driving gear is set on the driving rod, a transmission gear is set on the connecting shaft, and the driving gear is meshed with the transmission gear.

[0017] Furthermore, a heater is provided in the electroplating cylinder.

[0018] An electroplating method comprises placing a workpiece to be electroplated into an electroplating cylinder, inputting electroplating liquid into the electroplating cylinder so that the electroplating liquid covers the workpiece, evacuating the electroplating cylinder so that bubbles on the surface of the workpiece burst and impurities are discharged, then depressurizing the electroplating cylinder and applying power to carry out electroplating.

[0019] Furthermore, when evacuating, the air pressure in the electroplating cylinder reaches -0.1MPa and the pressure is maintained.

[0020] Furthermore, the pressure holding time is 30-120s.

[0021] The beneficial effect of the present invention is that, in the electroplating process, the present invention combines the vacuum pumping device with the plating tank, which can effectively improve the efficiency and quality of electroplating. The vacuum plating tank is first vacuumed before electroplating, and under the action of air pressure, the gas in the bubbles on the surface of the electroplated product and the bubbles in the electroplating solution are discharged at the same time, thereby improving the coating quality of the electroplated product. In addition, after the vacuum pumping is completed, the vacuum plating tank immediately performs electroplating, which can improve the electroplating efficiency and reduce the tank replacement time. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0023] Figure 1 It is a schematic diagram of the overall structure of the vacuum plating device in the present invention.

[0024] Figure 2 It is a schematic diagram of the structure of the electroplating cylinder in the present invention.

[0025] Figure 3 It is a schematic diagram of the positional relationship between the roller device and the electroplating cylinder in the present invention.

[0026] Figure 4 It is a structural schematic diagram of the roller device in the present invention.

[0027] Figure 5 It is a schematic diagram of the positional relationship between the discharge pipe and the circulation pipe in the present invention.

[0028] In the figure: 1. mounting frame; 2. electroplating cylinder; 20. anode plate; 21. sealing cover; 22. sealing rubber ring; 23. heater; 24. connecting pipe; 25. high liquid level sensor; 26. low liquid level sensor; 27. temperature sensor; 28. through hole; 3. roller device; 30. basket; 31. mounting plate; 32. bracket; 33. connecting shaft; 34. support plate; 35. electrode assembly; 350. lifter; 351. support plate; 352. conductive sheet; 353. housing; 354. driving rod; 355. electrode; 4. vacuum assembly; 40. pressure relief valve; 41. vacuum pump; 5. electroplating assembly; 50. circulation pipe; 51. drain pipe. DETAILED DESCRIPTION

[0029] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] Reference Figure 1 A vacuum electroplating device includes a mounting frame 1, an electroplating cylinder 2, a roller device 3, a vacuum assembly 4 and an electroplating assembly 5. An anode plate 20 is connected to the electroplating cylinder 2, and multiple anode plates 20 are arranged along the circumference of the inner wall of the electroplating cylinder 2.

[0033] Reference Figure 1 and Figure 2 The electroplating cylinder 2 is connected to the mounting frame 1 so that the bottom of the electroplating cylinder 2 is spaced apart from the ground. A sealing cover 21 is connected to the electroplating cylinder 2 by bolts. A sealing rubber ring 22 is provided between the sealing cover 21 and the electroplating cylinder 2. The sealing rubber ring 22 is embedded in the end of the electroplating cylinder 2. The drum device 3 includes a material basket 30 and an electrode assembly 35. A mounting port is provided on the sealing cover 21. A mounting plate 31 is connected to the mounting port on the sealing cover 21. A sealing rubber ring 22 is also provided between the mounting plate 31 and the sealing cover 21. The sealing rubber ring 22 is embedded in the sealing cover 21. A bracket 32 ​​is connected to the mounting plate 31. The bracket 32 ​​is located in the electroplating cylinder 2. A support plate 34 is connected to the bracket 32. The support plate 34 is tilted. There is an angle between the plane where the support plate 34 is located and the horizontal plane. The angle is between 30-50 degrees. A connecting shaft 33 is connected to the support plate 34. The axial direction of the connecting shaft 33 is arranged along the normal direction of the support plate 34. The bottom of the material basket 30 is coaxially connected to the connecting shaft 33. The material basket 30 is arranged to be a drum with a hexagonal cross-section. Its opening is arranged away from the connecting shaft 33. In the vertical direction, the material basket 30 is located below the top of the anode plate 20.

[0034] Reference Figure 3 and Figure 4 The electrode assembly 35 includes a driver and a lifter 350. The driver is connected to the end of the sealing cover 21 away from the bracket 32. The driver includes a shell 353, a driving rod 354, a driving machine arranged inside the shell 353, and electrodes 355 arranged at both ends of the shell 353 for powering the driving machine. The electrode 355 is electrically connected to the driving machine. The lifter 350 is connected to the bracket 32 ​​and is symmetrically arranged on both sides of the electroplating cylinder 2. The lifter 350 is a cylinder, and the piston rod of the cylinder is arranged vertically upward. A support plate 351 is connected to the piston rod of the cylinder. The support plate 351 is provided with a bracket opposite to the electrode 355 at the end of the driver. A conductive sheet 352 is provided on the support plate 351, and the conductive sheet 352 is arranged in the bracket.

[0035] The driving rod 354 is coaxially connected to the output shaft of the driving machine, the driving rod 354 is electrically connected to the electrode 355, the driving rod 354 is conductive, the driving rod 354 passes through the sealing cover 21 and extends into the electroplating cylinder 2, the driving rod 354 is vertically arranged, a driving gear is coaxially connected to the driving rod 354, a transmission gear is coaxially connected to the connecting shaft 33, the driving gear and the transmission gear are meshed with each other, the driving gear and the transmission gear can both be bevel gears, or one can be a spur gear and the other can be a bevel gear.

[0036] The piston rod of the cylinder rises, and the conductive sheet contacts the electrode 355, so that the driver is energized. At this time, the driving rod 354 extends into the electroplating solution. The driving rod 354 transfers the current to the workpiece through the driving gear, the transmission gear, the connecting shaft 33, and the material basket 30, providing a cathode for electroplating. The driving machine drives the driving rod 354 to rotate, and the driving rod 354 can drive the material basket 30 to rotate through the transmission between the driving gear and the transmission gear.

[0037] Reference Figure 1 and Figure 5 The electroplating assembly 5 includes two circulation pipes 50 and a drainage pipe 51. One end of each circulation pipe 50 is connected to the electroplating barrel 2. The other end of one circulation pipe 50 is connected to a filter pump. One end of the other circulation pipe 50 is connected to a plating liquid tank. The filter pump is connected to the plating liquid tank. The drainage pipe 51 is connected to the bottom of the electroplating barrel 2. A circulation pipe 50 draws the plating liquid in the electroplating barrel 2 to the filter pump for filtration. The filtered plating liquid enters the plating liquid tank and then returns to the electroplating barrel 2 through the circulation pipe 50, thereby realizing the recycling of the plating liquid.

[0038] Reference Figure 2 and Figure 5 The vacuum assembly 4 includes a vacuum pump 41 and a pressure relief valve 40, both of which are connected to the electroplating cylinder 2, and both of which are located above the anode plate 20. A heater 23 is also connected to the electroplating cylinder 2, and the heater 23 is set in a disc shape. The heater 23 is set at the bottom of the electroplating cylinder 2, and a connecting pipe 24 is connected to the heater 23. The connecting pipe 24 extends vertically to the top of the anode plate 20 and then bends to pass through the side wall of the electroplating cylinder 2. A sealing ring is set between the connecting pipe 24 and the electroplating cylinder 2. The wires on the heater 23 are wrapped in the connecting pipe 24. The wires pass through the electroplating cylinder 2 and can be connected to the existing external controller, so as to adjust the heating temperature of the heater 23.

[0039] Reference Figure 2 and Figure 5A high liquid level sensor 25, a low liquid level sensor 26 and a temperature sensor 27 are connected to the electroplating cylinder 2. A plurality of through holes 28 are arranged on the sealing cover 21. A thread is arranged on the inner wall of the through hole 28. The high liquid level sensor 25, the low liquid level sensor 26, the temperature sensor 27 and the wires on the anode plate 20 pass through the through hole 28 through the sealing joint. The sealing joint is threadedly connected to the sealing cover 21 through the through hole 28.

[0040] An electroplating method comprises the following steps:

[0041] Step 1: After washing the workpiece to be electroplated, put it into the material basket 30, and then cover it with the sealing cover 21, so that the workpiece enters the electroplating cylinder 2; then input the electroplating solution into the electroplating cylinder 2 through the circulation pipe 50, so that the electroplating solution covers the workpiece.

[0042] Step 2: Close the pressure relief valve 40, start the vacuum pump 41 to evacuate the electroplating cylinder 2, so that the air pressure in the electroplating cylinder 2 reaches -0.1MPa, and then maintain the pressure for 30-120s, preferably 60s. As the air pressure in the electroplating cylinder 2 decreases, the bubbles in the electroplating solution and the gas in the bubbles on the workpiece move toward the surface of the electroplating solution, and the bubbles on the workpiece burst, so that the bubbles on the surface of the workpiece burst to discharge impurities, and the bubbles in the electroplating solution are discharged, so as to facilitate the subsequent electroplating of the workpiece, and improve the electroplating effect on the surface of the workpiece.

[0043] Step three: turn off the vacuum pump 41, open the pressure relief valve 40, relieve the pressure on the electroplating cylinder 2, start the cylinder, and the cylinder moves the support plate 351 toward the motor at the end of the driver until the conductive sheet 352 abuts against the electrode 355. The driver is energized, and the driver drives the drive rod 354 to rotate. Through the transmission relationship between the drive gear and the transmission gear, the material basket 30 is driven to rotate, and a cathode is provided for the electroplating operation to implement electroplating.

[0044] During the above-mentioned electroplating process, the liquid level status of the plating liquid in the electroplating cylinder 2 is monitored in real time through the high liquid level sensor 25, the low liquid level sensor 26 and the temperature sensor 27, so as to facilitate the replenishment of the plating liquid in the electroplating cylinder 2. The heater 23 can adjust the temperature of the plating liquid, so as to provide a suitable temperature for the electroplating process. The monitoring temperature sensor 27 facilitates the staff to adjust the heating temperature of the heater 23 in time.

[0045] The present invention combines a vacuum pumping device with a plating tank during the electroplating process, which can effectively improve the efficiency and quality of electroplating. The vacuum plating tank is first vacuumed before electroplating, and under the action of air pressure, the gas in the bubbles on the surface of the electroplated product and the bubbles in the electroplating solution are discharged at the same time, thereby improving the coating quality of the electroplated product. In addition, after the vacuum plating tank is vacuumed, electroplating is immediately performed, which can improve the electroplating efficiency and reduce the tank replacement time.

[0046] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A vacuum plating device, characterized in that: include An electroplating cylinder (2), wherein the electroplating cylinder (2) is provided with a circulation pipe (50) for inputting electroplating liquid into the electroplating cylinder (2) and a liquid discharge pipe (51) for discharging liquid in the electroplating cylinder (2), and an anode plate (20) is provided in the electroplating cylinder (2); A sealing cover (21), wherein the sealing cover (21) is disposed on the electroplating cylinder (2); An electrode assembly (35), the electrode assembly (35) being used to supply power to the electroplating operation in the electroplating cylinder (2) and to provide an electroplating cathode for the electroplating operation; A vacuum pump (41), wherein the vacuum pump (41) is connected to the electroplating cylinder (2).

2. The vacuum plating device according to claim 1, characterized in that: The connection between the vacuum pump (41) and the electroplating cylinder (2) is located above the anode plate (20).

3. The vacuum plating device according to claim 1, characterized in that: Two circulation pipes (50) are provided, one end of each of the circulation pipes (50) is connected to the electroplating cylinder (2), the other end of one of the circulation pipes (50) is connected to a filter pump for extracting the electroplating liquid in the electroplating cylinder (2) into the filter pump for filtering, and one end of the other circulation pipe (50) is connected to a plating liquid tank, and the filter pump is connected to the plating liquid tank.

4. The vacuum plating device according to claim 1, characterized in that: The sealing cover (21) is provided with a driver, which comprises a housing (353), a driving rod (354), and electrodes (355) provided at both ends of the housing (353) for supplying power to the driver, the driving rod (354) being electrically connected to the electrodes (355), the driving rod (354) vertically penetrating the sealing cover (21) and extending into the electroplating cylinder (2), and the driving rod (354) is conductive.

5. The vacuum plating device according to claim 4, characterized in that: It also includes a mounting frame (1), the electroplating cylinder (2) is arranged on the mounting frame (1) and spaced apart from the ground, a support plate (351) is arranged on the mounting frame (1) to slide in the vertical direction through a lifter (350), and a conductive sheet (352) opposite to the electrode (355) is arranged on the support plate (351), and the conductive sheet (352) is electrically connected to the electrode (355).

6. The vacuum plating device according to claim 4, characterized in that: The bottom of the sealing cover (21) is connected to a bracket (32), and an inclined support plate (34) is connected to the bracket (32). A connecting shaft (33) is rotatably connected to the support plate (34), and a material basket (30) is connected to the connecting shaft (33). The opening of the material basket (30) is arranged away from the connecting shaft (33), and the material basket (30) is located below the anode plate (20). A driving machine electrically connected to the electrode (355) is arranged in the housing (353), and the driving rod (354) is coaxially connected to the output shaft of the driving machine. A driving gear is arranged on the driving rod (354), and a transmission gear is arranged on the connecting shaft (33), and the driving gear is meshed with the transmission gear.

7. The vacuum plating device according to claim 1, characterized in that: A heater (23) is arranged in the electroplating cylinder (2).

8. An electroplating method, characterized in that: The method comprises placing a workpiece to be electroplated into an electroplating cylinder (2), injecting electroplating liquid into the electroplating cylinder (2) so that the electroplating liquid covers the workpiece, evacuating the electroplating cylinder (2) so that bubbles on the surface of the workpiece burst and impurities are discharged, then depressurizing the electroplating cylinder (2) and energizing to carry out electroplating.

9. The electroplating method according to claim 8, characterized in that: When vacuuming, the air pressure in the electroplating cylinder (2) reaches -0.1MPa and the pressure is maintained.

10. The electroplating method according to claim 9, characterized in that: The pressure holding time is 30-120s.

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