Integrated multi-surface complex part electroplating layer thickness control device and method

Abstract

The invention belongs to the technical field of electroplating, and particularly relates to an integrated multi-surface complex part electroplating layer thickness control device and method. The device is applied to the simultaneous electroplating process of different plating layer thickness requirements of all to-be-electroplated surfaces in a to-be-electroplated integrated multi-surface complex part, and is characterized by comprising an electroplating mold, an auxiliary anode, an auxiliary cathode, an electrode fixing mechanism and a current control unit, the electroplating mold is provided with a cavity which is conformal with a to-be-electroplated integrated multi-surface complex part and is used for supporting and fixing the to-be-electroplated integrated multi-surface complex part; the auxiliary anode is in a plate shape, and the auxiliary cathode is in a rod shape; the auxiliary anodes and the auxiliary cathodes are respectively arranged in pairs at a certain distance away from one side of each to-be-plated surface; the auxiliary anodes and the auxiliary cathodes are fixedly connected with the electroplating mold through the electrode fixing mechanism; the current control unit is electrically connected with the auxiliary anodes, and the current density of the auxiliary anodes is independently controlled through the current control unit.

Description

Technical Field

[0001] The invention belongs to the technical field of electroplating, and in particular relates to a device and method for controlling the thickness of electroplated coatings on an integrated multi-faceted complex part. Background Art

[0002] The electroplating process is widely used in the field of industrial manufacturing and can significantly improve the surface properties of parts. However, in the process of electroplating multiple surfaces of a multi-faceted complex part at the same time, it is difficult to control the coating thickness of each surface at the same time. In the prior art, the thickness of the coating on different surfaces is usually controlled by making auxiliary anodes, auxiliary cathodes and using a single electrode system. This traditional electroplating method is often completed by faceted electroplating, and the thickness of the local ultra-thick coating is often completed by later mechanical processing and manual polishing, which is time-consuming and laborious; and the current distribution of each surface cannot be accurately controlled, and there is a difference in the current density allocated to different surfaces, which leads to the inability to accurately control the coating thickness of different surfaces.

[0003] In order to solve the above problems, it is urgent to design a device and method that can simultaneously electroplate multiple areas of a one-piece multi-sided part to ensure that the coating thickness on different surfaces of the part can meet the requirements. Summary of the invention

[0004] Purpose of the invention: In order to solve the above problems, the present invention establishes a device and method for controlling the thickness of electroplating coating of integrated multi-sided complex parts based on finite element simulation, electrochemistry and tooling design.

[0005] Technical solution of the present invention: According to the first aspect of the present invention, a device for controlling the thickness of electroplating coating on an integrated multi-sided complex part is proposed, which is applied to the simultaneous electroplating process of different coating thickness requirements on each electroplated surface of the integrated multi-sided complex part to be electroplated, and includes an electroplating mold, an auxiliary anode, an auxiliary cathode, an electrode fixing mechanism, and a current control unit; the electroplating mold has a cavity conformal to the integrated multi-sided complex part to be electroplated, and is used to support and fix the integrated multi-sided complex part to be electroplated; the auxiliary anode is plate-shaped, and the auxiliary cathode is rod-shaped; the auxiliary anode and the auxiliary cathode are respectively arranged in pairs at a certain distance from one side of each surface to be plated, and the auxiliary anode and the auxiliary cathode are fixedly connected to the electroplating mold through the electrode fixing mechanism; the current control unit is respectively electrically connected to each of the auxiliary anodes, and the current density of each auxiliary anode is separately controlled by the current control unit.

[0006] In a possible embodiment, the electrode fixing mechanism includes a bracket, an electrode fixing frame, an anode support arm, and a cathode ring groove sleeve; one side end face of the bracket is fixedly connected to the electroplating mold, and the other side end face is fixedly connected to the electrode fixing frame, one end of the anode support arm is fixedly connected to the electrode fixing frame, and the other end is fixed to the auxiliary anode through a clamping structure; the cathode ring groove sleeve is fixed on the electrode fixing frame, the ring groove of the cathode ring groove sleeve has a closing structure, and the auxiliary cathode is fixed in the ring groove of the cathode ring groove sleeve.

[0007] In a possible embodiment, for large, integrated, multi-sided complex parts, the auxiliary anode of the same surface to be plated is supported and fixed by multiple electrode fixing skeletons, the multiple electrode fixing skeletons are electrically connected in series through copper electrode plates, and the current control unit is electrically connected to the auxiliary anode through the copper electrode plate.

[0008] In a possible embodiment, when the coating thickness requirements of adjacent multiple surfaces to be plated are the same, the electrode fixing mechanisms corresponding to the adjacent surfaces to be plated are electrically connected in series through the copper electrode plate, and the adjacent auxiliary anode currents are simultaneously controlled by the current control unit.

[0009] In a possible embodiment, the current control unit adopts a ballast, and the set current is set separately through each ballast.

[0010] In a possible embodiment, the relative spatial positions of the auxiliary anode, the auxiliary cathode and each surface to be plated, and the set current density of each current control unit are determined by finite element simulation calculation according to the coating thickness requirements of each surface to be plated.

[0011] According to a second aspect of the present invention, a method for controlling the thickness of an electroplated coating of an integrated multi-sided complex part is provided, using the above-mentioned device for controlling the thickness of an electroplated coating of an integrated multi-sided complex part, comprising the following steps:

[0012] Step 1: Determine the current required for each surface to be plated of a multi-faceted complex part and the size and relative spatial position of the auxiliary anode and auxiliary cathode through finite element simulation calculation;

[0013] Step 2: According to the current required for each surface to be plated as determined in step 1 and the size and relative spatial position of the auxiliary anode and the auxiliary cathode, the electroplating mold and the electrode fixing mechanism are used to clamp and fix the one-piece multi-faceted complex part and the auxiliary anode and the auxiliary cathode corresponding to each surface to be plated, and the current control unit of the auxiliary anode corresponding to each surface to be plated according to the current density determined in step 1 is set;

[0014] Step 3: Set the electroplating conditions and perform electroplating according to the thickness requirements of each electroplated layer.

[0015] In a possible embodiment, in step 1, determining the current required for each surface to be plated of a multi-faceted complex part and the size and relative spatial position of the auxiliary anode and the auxiliary cathode by finite element simulation calculation specifically includes the following steps:

[0016] 1-1 Use CAD software to create a three-dimensional geometric model of the electroplating tank and the parts to be plated. The model size should be consistent with the actual object;

[0017] 1-2 Use the electrochemical workstation to measure the conductivity of the plating solution, the resistivity of the plated metal, the valence state of the electrochemical deposition reaction, the electroplating efficiency, the cathode volt-ampere characteristic data, and the anodic volt-ampere characteristic data of the anode material and the auxiliary anode material for subsequent finite element software calculations;

[0018] 1-3 Use finite element simulation software to divide the grid and set boundary conditions, which are divided into the following two boundaries:

[0019] (1) Solid wall boundary condition: The boundary of the reactor can be considered as an insulator, so the normal current density is 0;

[0020]

[0021] (2) Electrode boundary conditions: potential difference drives electrochemical reaction (polarization)

[0022] η=VUE η =f(c η J η )

[0023]

[0024] U is the electrode potential, V is the metal potential, and E is the electrode equilibrium potential.

[0025] Through the simplification of the theoretical model and the setting of boundary conditions, for a specific solution, the amount of substance deposited by electroplating is only related to the distribution of current density, that is, the calculation of the final simulated coating thickness is converted into the calculation of current density distribution, and then the integrated calculation is performed based on the collected electrochemical performance data of the plating solution to obtain the distribution of the part after plating.

[0026] Firstly, the current required for different surfaces of a one-piece multi-sided complex part and the sizes and distances of the auxiliary anode and auxiliary cathode are calculated through finite element simulation; secondly, the auxiliary anode and auxiliary cathode are manufactured according to the sizes of the auxiliary anode and auxiliary cathode obtained by finite element simulation; then, a multi-electrode system is designed for the one-piece multi-sided part, and the current and voltage control of multiple surfaces is achieved through the electrode system; finally, the fixed fixture design is optimized, and the fixed fixture is used to fix the auxiliary anode and auxiliary cathode to ensure their relative position with the plated part is stable and form a whole with the auxiliary electrode, thus completing the design and manufacture of the electroplating tooling.

[0027] Beneficial effects of the invention: The invention establishes a method for controlling the uniformity of the electroplating coating thickness of a one-piece multi-sided part through finite element simulation calculation and experimental measurement, including: bath liquid data collection, part and bath body modeling, fixture design and manufacturing, and controlling the current and voltage on different surfaces of the one-piece multi-sided complex part to obtain the required coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the electroplating mold structure of an integrated multi-faceted complex part electroplating coating thickness control device according to a preferred embodiment of the present invention;

[0029] Figure 2 It is a partial enlarged view of a device for controlling the thickness of electroplating coating on a one-piece multi-faceted complex part according to a preferred embodiment of the present invention;

[0030] Figure 3 It is a schematic diagram of an electrode fixing mechanism 4 of a device for controlling the thickness of electroplating coating of an integrated multi-faceted complex part according to a preferred embodiment of the present invention;

[0031] Figure 4 A schematic diagram of a parts model of a preferred embodiment of the present invention;

[0032] Figure 5 Divide the grid by the finite element simulation software in step 1 of the method for controlling the thickness of electroplating coating on a multi-faceted complex part of a preferred embodiment of the present invention;

[0033] Figure 6 The positions and sizes of the auxiliary anode and the auxiliary cathode calculated by finite element in step 1 of a method for controlling the thickness of electroplating coating on a one-piece multi-faceted complex part according to a preferred embodiment of the present invention;

[0034] Figure 7 This is a schematic diagram of the coating thickness distribution on the surface of a one-piece multi-faceted complex part in step 1 of a method for controlling the coating thickness of an electroplated one-piece multi-faceted complex part according to a preferred embodiment of the present invention.

[0035] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] like Figure 1 , Figure 2As shown, a device for controlling the thickness of electroplating coating of an integrated multi-sided complex part is applied to the simultaneous electroplating process of different coating thickness requirements on each electroplated surface of the integrated multi-sided complex part to be electroplated, comprising an electroplating mold 1, an auxiliary anode 2, an auxiliary cathode 3, an electrode fixing mechanism 4, and a current control unit; the electroplating mold has a cavity conformal to the integrated multi-sided complex part to be electroplated, and is used to support and fix the integrated multi-sided complex part to be electroplated; the auxiliary anode 2 is plate-shaped, and the auxiliary cathode 3 is rod-shaped; the auxiliary anode 2 and the auxiliary cathode 3 are respectively arranged in pairs at a certain distance from one side of each surface to be plated, and the auxiliary anode 2 and the auxiliary cathode 3 are fixedly connected to the electroplating mold 1 through the electrode fixing mechanism 4; the current control unit is respectively electrically connected to each of the auxiliary anodes 2, and the current density of each of the auxiliary anodes 2 is separately controlled by the current control unit.

[0037] like Figure 3 As shown, the electrode fixing mechanism 4 includes a bracket 4-1, an electrode fixing skeleton 4-2, an anode support arm 4-3, and a cathode ring groove sleeve 4-4; one side end face of the bracket 4-1 is fixedly connected to the electroplating mold 1, and the other side end face is fixedly connected to the electrode fixing skeleton 4-2, one end of the anode support arm 4-3 is fixedly connected to the electrode fixing skeleton 4-2, and the other end is fixed to the auxiliary anode 2 through a clamping structure; the cathode ring groove sleeve 4-4 is sleeved and fixed on the electrode fixing skeleton 4-2, the ring groove of the cathode ring groove sleeve 4-4 has a closing structure, and the auxiliary cathode 3 is fixed in the ring groove of the cathode ring groove sleeve.

[0038] For large, integrated, multi-faceted complex parts, the auxiliary anode of the same surface to be plated is supported and fixed by multiple electrode fixing frames, and the multiple electrode fixing frames are electrically connected in series through copper electrode plates. The current control unit is electrically connected to the auxiliary anode through the copper electrode plates.

[0039] When the coating thickness requirements of adjacent multiple surfaces to be plated are the same, the electrode fixing mechanisms corresponding to the adjacent surfaces to be plated are electrically connected in series through the copper electrode plate, and the adjacent auxiliary anode currents are simultaneously controlled by the current control unit.

[0040] The current control unit adopts a ballast, and the set current is set individually through each ballast.

[0041] The relative spatial positions of the auxiliary anode 2, the auxiliary cathode 3 and each surface to be plated, and the set current density of each current control unit are determined by finite element simulation calculation according to the coating thickness requirements of each surface to be plated.

[0042] like Figure 4-7 As shown, a method for controlling the thickness of electroplating coating on a one-piece multi-sided part comprises the following steps:

[0043] Step 1 Finite element simulation calculates the size and position of the auxiliary anode and auxiliary cathode, as well as the current required in different areas of the part.

[0044] 1-1 Use CAD software to create a three-dimensional geometric model of the electroplating tank and the parts to be plated. The model size should be consistent with the actual object. The part model should be as follows: Figure 4 As shown;

[0045] 1-2 Use the electrochemical workstation to measure the conductivity of the plating solution, the resistivity of the plated metal, the valence state of the electrochemical deposition reaction, the electroplating efficiency, the cathode volt-ampere characteristic data, and the anodic volt-ampere characteristic data of the anode material and the auxiliary anode material for subsequent finite element software calculations;

[0046] 1-3 Use finite element simulation software to divide the grid and set boundary conditions, which are divided into the following two boundaries:

[0047] (1) Solid wall boundary condition: The boundary of the reactor can be considered as an insulator, so the normal current density is 0.

[0048]

[0049] (2) Electrode boundary conditions: potential difference drives electrochemical reaction (polarization)

[0050] η=VUE η =f(c η J η )

[0051]

[0052] U is the electrode potential, V is the metal potential, and E is the electrode equilibrium potential.

[0053] Through the simplification of the theoretical model and the setting of boundary conditions, for a specific solution, the amount of substance deposited by electroplating is only related to the distribution of current density, that is, the calculation of the final simulated coating thickness is converted into the calculation of current density distribution, and then the integrated calculation is performed based on the collected electrochemical performance data of the plating solution to obtain the distribution of the part after plating.

[0054] Finite element simulation software mesh division see Figure 5 , the position and size of auxiliary anode and auxiliary cathode are shown in Figure 6 , the distribution of the coating after simulation is shown in Figure 7 .

[0055] Step 2: Design and manufacture a multi-channel electroplating tool according to the size and distance of the pictographic anode and the pictographic cathode obtained by simulation calculation in step 1, characterized in that it includes a tool body, an electrode system, and a module fixing system. The tool body is a part pictographic structure, the electrode system includes an auxiliary anode and an auxiliary cathode, and the fixing fixture is used to fix the position of the auxiliary anode and the auxiliary cathode to limit the relative position of the motor system and the plated part.

[0056] 2-1 Design an electrode system to independently adjust the current and voltage of each surface through the electrode system;

[0057] 2-2 Manufacture the anode and cathode according to the dimensions of the auxiliary anode and auxiliary cathode obtained by simulation calculation in step 1;

[0058] 2-3 Fix the position of the auxiliary anode and the auxiliary cathode by fixing the fixture, limit the relative position of the motor system and the plated parts, and form an electroplating tool. The structure of the electroplating tool is as follows: Figure 1 shown.

Claims

1. A device for controlling the thickness of electroplated coating on a complex multi-faceted part, which is applied to the simultaneous electroplating process of a complex multi-faceted part with different coating thickness requirements on each surface to be plated, characterized in that: It includes an electroplating mold, an auxiliary anode, an auxiliary cathode, an electrode fixing mechanism, and a current control unit; the electroplating mold has a cavity conformal to the multi-faceted complex part to be electroplated, and is used to support and fix the multi-faceted complex part to be electroplated; the auxiliary anode is plate-shaped, and the auxiliary cathode is rod-shaped; the auxiliary anode and the auxiliary cathode are respectively arranged in pairs at a certain distance from one side of each surface to be plated, and the auxiliary anode and the auxiliary cathode are fixedly connected to the electroplating mold through the electrode fixing mechanism; the current control unit is electrically connected to each of the auxiliary anodes, and the current density of each auxiliary anode is separately controlled by the current control unit.

2. The device for controlling the thickness of electroplating layer of a complex multi-faceted part according to claim 1, characterized in that: The electrode fixing mechanism includes a bracket, an electrode fixing frame, an anode support arm, and a cathode ring groove sleeve; one side end face of the bracket is fixedly connected to the electroplating mold, and the other side end face is fixedly connected to the electrode fixing frame, one end of the anode support arm is fixedly connected to the electrode fixing frame, and the other end is fixed to the auxiliary anode through a clamping structure; the cathode ring groove sleeve is fixed on the electrode fixing frame, the ring groove of the cathode ring groove sleeve has a closing structure, and the auxiliary cathode is fixed in the ring groove of the cathode ring groove sleeve.

3. The device for controlling the thickness of electroplating layer of a complex multi-faceted part according to claim 2, characterized in that: For large, integrated, multi-faceted complex parts, the auxiliary anode of the same surface to be plated is supported and fixed by multiple electrode fixing frames, and the multiple electrode fixing frames are electrically connected in series through copper electrode plates. The current control unit is electrically connected to the auxiliary anode through the copper electrode plates.

4. The device for controlling the thickness of electroplating layer of a complex multi-faceted part according to claim 3 is characterized in that: When the coating thickness requirements of adjacent multiple surfaces to be plated are the same, the electrode fixing mechanisms corresponding to the adjacent surfaces to be plated are electrically connected in series through the copper electrode plate, and the adjacent auxiliary anode currents are simultaneously controlled by the current control unit.

5. The device for controlling the thickness of electroplating layer of a complex multi-faceted part according to claim 1, characterized in that: The current control unit adopts a ballast.

6. The device for controlling the thickness of electroplating layer of a complex multi-faceted part according to claim 1, characterized in that: The relative spatial positions of the auxiliary anode, the auxiliary cathode and each surface to be plated, as well as the set current density of each current control unit, are determined by finite element simulation calculation according to the coating thickness requirements of each surface to be plated.

7. A method for controlling the thickness of electroplating coating on a one-piece multi-sided complex part, using a device for controlling the thickness of electroplating coating on a one-piece multi-sided complex part according to any one of claims 1 to 6, characterized in that: The steps include: Step 1: Determine the current required for each surface to be plated of a multi-faceted complex part and the size and relative spatial position of the auxiliary anode and auxiliary cathode through finite element simulation calculation; Step 2: According to the current required for each surface to be plated as determined in step 1 and the size and relative spatial position of the auxiliary anode and the auxiliary cathode, the electroplating mold and the electrode fixing mechanism are used to clamp and fix the one-piece multi-faceted complex part and the auxiliary anode and the auxiliary cathode corresponding to each surface to be plated, and the current control unit of the auxiliary anode corresponding to each surface to be plated according to the current density determined in step 1 is set; Step 3: Set the electroplating conditions and perform electroplating according to the thickness requirements of each electroplated layer.

8. The method for controlling the thickness of electroplating layer of a complex multi-faceted part according to claim 7, characterized in that: In step 1, determining the current required for each surface to be plated of a multi-faceted complex part and the size and relative spatial position of the auxiliary anode and the auxiliary cathode by finite element simulation calculation specifically includes the following steps: 1-1 Use CAD software to create a three-dimensional geometric model of the electroplating tank and the parts to be plated. The model size should be consistent with the actual object; 1-2 Use the electrochemical workstation to measure the conductivity of the plating solution, the resistivity of the plated metal, the valence state of the electrochemical deposition reaction, the electroplating efficiency, the cathode volt-ampere characteristic data, and the anodic volt-ampere characteristic data of the anode material and the auxiliary anode material for subsequent finite element software calculations; 1-3 Use finite element simulation software to divide the grid and set boundary conditions, which are divided into the following two boundaries: (1) Solid wall boundary condition: The boundary of the reactor can be considered as an insulator, so the normal current density is 0; (2) Electrode boundary conditions: potential difference drives electrochemical reaction (polarization) η = VUE η =f(c η J η ) U is the electrode potential, V is the metal potential, and E is the electrode equilibrium potential.

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