Wafer conveying carrier

By designing a wafer conveying vehicle including guide slide rails, traction components, storage components, air suspension components and internal push components, the problems of contamination and wear during the conveying process are solved, and efficient protection and stable transportation of the wafer are achieved.

CN119833453AActive Publication Date: 2025-04-15WUXI SUPERTEAM PRECISION MASCH CO LTD
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Patent Information

Application Number
CN202411813110.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-04-15
Estimated Expiration
2044-12-11

AI Technical Summary

Technical Problem

Existing wafers are easily contaminated by dust during the transportation process, and friction with the inner wall at the inner side of the carrier causes wear, affecting device performance.

Method used

A wafer conveying vehicle is designed, using a combination of guide rails and traction components to suspend the wafer outside the inner wall through the storage component and the air suspension component to avoid friction and dust contamination, and to assist in controlling the movement of the wafer through the internal pushing component.

Benefits of technology

It effectively prevents the wafer from adsorbing dust and friction wear during transportation, ensures stable performance of the wafer, and realizes smooth suspension and movement of the wafer by detecting the coordination of the inner rod and the jet pipe.

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Abstract

The invention belongs to the technical field of wafer transportation, and particularly relates to a wafer conveying carrier which comprises a guide sliding rail, the inner wall of the guide sliding rail is slidably connected with a traction component, the top of the traction component is fixedly connected with a storage component, and a transportation wafer is arranged in the storage component; the storage part comprises a protective cover shell, and an air suspension part is fixedly connected to the middle of the outer surface of the protective cover shell. According to the device, the transported wafer can be transported in a relatively sealed mode through the storage part, the transported wafer is prevented from adsorbing dust and impurities in the transportation process, the effective protection effect is achieved, and due to the fact that the transported wafer is in a relatively suspended state when transported in the butt joint shell, the transportation efficiency is improved. Therefore, relative friction of the transported wafer in the butt joint shell is avoided, and the problem that the transported wafer is scrapped and damaged due to abrasion caused by friction force during transportation is solved.
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Description

Technical Field

[0001] The invention belongs to the technical field of wafer transportation, in particular to a wafer conveying carrier. Background Art

[0002] The advanced process of existing wafers has an increasingly lower tolerance for dust particles due to its precision. If they are contaminated by dust particles during transportation, it will have a serious impact on the subsequent device performance. Currently, in the wafer manufacturing process, wafers placed on independent offline machines need to be transported by carriers to protect the chips during transportation.

[0003] However, after the wafer is transported and taken out from the carrier, the side of the wafer is prone to friction with the inner wall of the carrier, which may cause the performance of the wafer to deteriorate due to wear, so improvements are needed. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention solves the technical problems by adopting a technical solution: a wafer conveying carrier comprises a guide rail, the inner wall of the guide rail is slidably connected with a traction component, the top of the traction component is fixedly connected with a storage component, and a transport wafer is arranged inside the storage component;

[0005] The storage component comprises a protective cover shell, an air suspension component is fixedly connected to the middle of the outer surface of the protective cover shell, and an inner pushing component is arranged in the inner cavity of the protective cover shell; the protective cover shell comprises a docking shell, an embedded swivel is fixedly connected to the inner wall of the docking shell, and the inner cavity of the embedded swivel is evenly provided with docking air suction ports, and the inner wall of the embedded swivel is evenly provided with detection inner rods, which can scan whether there are obstructions at the position to ensure that the transported wafer is located in the center position, and after the protective cover shells on the upper and lower sides are merged, the embedded swivels on both sides form negative pressure at the merged gap by suction, thereby tightly sealing the protective cover shells on both sides; vertical through-holes are evenly arranged on the side of the inner cavity of the docking shell close to the embedded swivel, and oblique through-holes are evenly arranged on the side of the inner cavity of the docking shell close to the axis;

[0006] The air suspension component includes a drainage motor, the outer surface of the drainage motor outlet is fixedly connected to a diverter sleeve, the outer surface of the diverter sleeve is fixedly connected to a hollow outer disk through the diverter port, vertical jet pipes are evenly arranged on the top of the inner cavity of the hollow outer disk, and the inner cavity of the hollow outer disk is evenly opened with accommodating through openings, the round crystal is wrapped by the upper and lower sides of the storage components, and the gas blown out by the air suspension component balances its own gravity, and is suspended inside the storage component without contacting the inner wall of the storage component.

[0007] Furthermore, the number of the docking shells is two, the top of the vertical jet pipe extends to the inside of the docking shell through the vertical through-hole, the outer surface of the hollow outer disk is fixedly connected to the middle of the outer surface of the docking shell, and the top of the outer surface of the diverter sleeve is fixedly connected to the axis of the outer surface of the docking shell. One end of the detection inner rod is fixedly connected to the inner wall of the embedded swivel, and the other end of the detection inner rod extends to the inside of the docking shell, and the top of the outer surface of the embedded swivel is fixedly connected to the top of the outer surface of the protective cover shell.

[0008] Furthermore, the inner push component includes a control outer ring, the upper surface of which is evenly provided with vertical inserts, the top of the inner cavity of the vertical insert is fixedly connected with an oblique insert, and the top of the oblique insert extends to the inside of the docking shell through an oblique through-hole. A transfer rod is fixedly connected to the bottom of the inner cavity of the control outer ring, and a pressure-sensitive button is slidably connected to the end of the inner cavity of the transfer rod away from the control outer ring. The pressure-sensitive button can be pressed toward the inside of the transfer rod and is relatively sensitive. After the pressure-sensitive button at the corresponding position is pressed, the control outer ring will trigger the vertical insert in this area, and spray air into the device through the oblique insert. The outer surface of the transfer rod is fixedly connected to a closed disk shell on the side away from the control outer ring, and a balancing slider is slidably connected to the inner wall of the closed disk shell. Auxiliary balls are symmetrically arranged on the upper and lower sides of the outer surface of the balancing slider, the outer surface of the balancing slider is slidably connected to the inner wall of the closed disk shell through the auxiliary balls, the side surface of the balancing slider and the outer surface of the pressure-sensitive button are squeezed against each other, and the outer surface of the control outer ring is fixedly connected to the outer surface of the hollow outer disk.

[0009] Furthermore, the traction component includes a sliding base, the top of the sliding base is fixedly connected to a height adjustment lifting platform, the top of the height adjustment lifting platform is fixedly connected to a rotating side plate, a segmented push rod is arranged at the axis of the inner wall of the rotating side plate, and traction slide plates are symmetrically arranged on the upper and lower sides of the outer surface of the segmented push rod, and spring connecting belts are symmetrically arranged on the left and right sides of the inner wall of the traction slide plate. The number of the traction components is two, the outer surface of the sliding base is slidably connected to the inner wall of the guide rail, the outer surface of the traction slide plate is slidably connected to the axis of the inner wall of the rotating side plate, and one end of the traction slide plate away from the rotating side plate is fixedly connected to the side of the docking shell. The upper and lower sides of the segmented push rod are both slidably connected to the inner cavity of the rotating side plate through the accommodating groove, and the side of the inner cavity of the traction slide plate away from the docking shell is fixedly connected to one end of the segmented push rod through the plug interface, and the upper and lower sides of the spring connecting belt are fixedly connected to the inner wall of the traction slide plate.

[0010] The beneficial effects of the present invention are as follows:

[0011] 1. The device can transport the transported wafer in a relatively sealed form through the storage component, preventing the transported wafer from absorbing dust and impurities during transportation, thereby playing an effective protective role. Since the transported wafer is in a relatively suspended state when being transported inside the docking shell, no relative friction will occur to the transported wafer inside the docking shell, thereby preventing the transported wafer from being scratched and damaged due to friction during transportation.

[0012] 2. Before transporting, place the transport wafer inside the docking shell. After the docking shells on the upper and lower sides are combined, adjust the height of the transport wafer by jetting to avoid the problem of the transport wafer being thrown out due to excessive impact of the airflow ejected from the vertical jet pipe. It is difficult to observe the state of the transport wafer inside the closed storage component, so a detection inner rod is provided to detect the actual height of the wafer to ensure that the wafer is always in a suspended state, and then adjust the jet force of the vertical jet pipe to the most appropriate parameters.

[0013] 3. When the storage component moves, turning, acceleration and deceleration and other movements will inevitably occur. At this time, the internal transport wafer cannot perform the above movements because it has no direct contact with the storage component, which will cause the inner wall of the docking shell to contact the side of the transport wafer, thereby squeezing the transport wafer. In severe cases, it will collide with the transport wafer, causing the transport wafer to break. Therefore, an internal push component is set to assist in the work, providing the internal wafer with acceleration in the corresponding direction, to avoid the wafer from contacting and colliding with the inner wall of the docking shell.

[0014] 4. The segmented push rod can drive the docking shells on both sides to slide up and down by pulling the traction slide plates on both sides, thereby controlling the separation and merging of the docking shells on the upper and lower sides. The rotating side plate can relatively raise the lifting platform to rotate, so that the horizontal storage component can be rotated to a vertical state. In this way, when the protective cover shell is separated, the transport wafer can automatically fall out from the inside of the docking shell, avoiding the problem that the jet force of the vertical jet pipes on the upper and lower sides is unbalanced when the cover is opened, resulting in the transport wafer cannot be taken out smoothly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view of the present invention;

[0016] Figure 2 is a cross-sectional view of the present invention;

[0017] Figure 3 is a cross-sectional view of the storage component of the present invention;

[0018] Figure 4 is a cross-sectional view of the protective cover shell of the present invention;

[0019] Figure 5 is a cross-sectional view of the air suspension component of the present invention;

[0020] Figure 6 is a cross-sectional view of the inner push component of the present invention;

[0021] Figure 7 It is a structural schematic diagram of the traction component of the present invention.

[0022] In the figure: 1, guide rail; 2, traction component; 3, storage component; 4, transport wafer; 31, protective cover shell; 32, air suspension component; 33, inner push component; 311, docking shell; 312, vertical through-hole; 313, oblique through-hole; 314, built-in swivel; 315, docking air inlet; 316, detection inner rod; 321, drainage motor; 322, diverter sleeve; 323, hollow outer disk; 3 24. Vertical jet pipe; 325. Accommodating through-hole; 331. Control outer ring; 332. Vertical insert tube; 333. Oblique insert tube; 334. Closed disk shell; 335. Balance slider; 336. Auxiliary ball; 337. Transfer connecting rod; 338. Pressure-sensitive button; 21. Sliding base; 22. Heightening lifting platform; 23. Rotating side disk; 24. Segmented push rod; 25. Traction slide plate; 26. Spring connecting belt. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0024] Example 1, please refer to Figure 1-Figure 5 The present invention provides a technical solution: a wafer conveying carrier, comprising a guide rail 1, a traction component 2 is slidably connected to the inner wall of the guide rail 1, a storage component 3 is fixedly connected to the top of the traction component 2, and a transport wafer 4 is arranged inside the storage component 3;

[0025] The storage component 3 includes a protective cover shell 31, an air suspension component 32 is fixedly connected to the middle of the outer surface of the protective cover shell 31, and an inner pushing component 33 is provided in the inner cavity of the protective cover shell 31; the protective cover shell 31 includes a docking shell 311, an embedded swivel 314 is fixedly connected to the inner wall of the docking shell 311, and the inner cavity of the embedded swivel 314 is evenly provided with docking suction ports 315, and the inner wall of the embedded swivel 314 is evenly provided with detection inner rods 316, which can scan whether there are obstructions at the position to ensure that the transported wafer 4 is located at the center. After the protective cover shells 31 on the upper and lower sides are merged, the embedded swivels 314 on both sides form a negative pressure at the merged gap by suction, thereby tightly sealing the protective cover shells 31 on both sides; a vertical through-hole 312 is evenly provided on the side of the inner cavity of the docking shell 311 close to the embedded swivel 314, and an oblique through-hole 313 is evenly provided on the side of the inner cavity of the docking shell 311 close to the axis;

[0026] The air suspension component 32 includes a drainage motor 321, and the outer surface of the air outlet of the drainage motor 321 is fixedly connected to a diverter sleeve 322, and the outer surface of the diverter sleeve 322 is fixedly connected to a hollow outer disk 323 through the diverter port. Vertical jet pipes 324 are evenly arranged on the top of the inner cavity of the hollow outer disk 323, and the inner cavity of the hollow outer disk 323 is evenly opened with accommodating through-ports 325. The round crystal is wrapped by the storage components 3 on the upper and lower sides, and the gas blown out by the air suspension component 32 balances its own gravity, and is suspended inside the storage component 3 without contacting the inner wall of the storage component 3.

[0027] There are two docking shells 311, the top of the vertical jet pipe 324 extends to the inside of the docking shell 311 through the vertical through hole 312, the outer surface of the hollow outer disk 323 is fixedly connected to the middle of the outer surface of the docking shell 311, and the top of the outer surface of the diverter sleeve 322 is fixedly connected to the axis of the outer surface of the docking shell 311. One end of the detection inner rod 316 is fixedly connected to the inner wall of the embedded swivel 314, and the other end of the detection inner rod 316 extends to the inside of the docking shell 311, and the top of the outer surface of the embedded swivel 314 is fixedly connected to the top of the outer surface of the protective cover shell 31.

[0028] When using the device, the transport wafer 4 is placed inside the storage component 3 through special clamps, and then the traction components 2 on both sides buckle the upper and lower shells of the storage component 3 together to form a complete storage component 3, wrapping the transport wafer 4, and then the bottom of the traction component 2 slides along the guide rail 1 to transport it to the designated position, and then the storage component 3 is opened to take out the transport wafer 4 to complete the transportation work.

[0029] After opening the protective cover shell 31, the drainage motor 321 located below will pressurize the gas in the room and fill it into the diversion sleeve 322, and then evenly supply it to the vertical jet pipes 324 on all sides. At this time, the vertical jet pipes 324 will spray from bottom to top to offset the gravity of the transported wafer 4, so that the transported wafer 4 is suspended on the inner side of the docking shell 311 without contacting the parts on the inner wall of the docking shell 311, thereby preventing the transported wafer 4 from being scratched during transportation.

[0030] The upper and lower protective covers 31 are provided with a plurality of air suspension components 321, 322 and 324, respectively, which are used to suspend the transport wafer 4. The upper and lower protective covers 31 are provided with a plurality of air suspension components 321, 322 and 324, respectively.

[0031] Example 2, please refer to Figure 1-Figure 7 The present invention provides a technical solution: on the basis of Example 1, the inner push component 33 includes a control outer ring 331, and the upper surface of the control outer ring 331 is evenly provided with vertical plug tubes 332. The top of the inner cavity of the vertical plug tube 332 is fixedly connected with an oblique plug tube 333, and the top end of the oblique plug tube 333 extends to the interior of the docking shell 311 through the oblique through-hole 313. A transfer link 337 is fixedly connected to the bottom of the inner cavity of the control outer ring 331, and a pressure-sensitive button 338 is slidably connected to the end of the inner cavity of the transfer link 337 away from the control outer ring 331. The pressure-sensitive button 338 can be pressed toward the inside of the transfer link 337 and is relatively sensitive. After the pressure-sensitive button 338 at the corresponding position is pressed, the control outer ring 331 will trigger the vertical insertion tube 332 in this area, and spray air into the device through the oblique insertion tube 333. A closed disk shell 334 is fixedly connected to the outer surface of the transfer link 337 away from the control outer ring 331, and a balancing slider 335 is slidably connected to the inner wall of the closed disk shell 334. Auxiliary balls 336 are symmetrically arranged on the upper and lower sides of the outer surface of the balancing slider 335. The outer surface of the balancing slider 335 is slidingly connected to the inner wall of the closed disk shell 334 through the auxiliary balls 336. The side surface of the balancing slider 335 and the outer surface of the pressure-sensitive button 338 are squeezed against each other, and the outer surface of the control outer ring 331 is fixedly connected to the outer surface of the hollow outer disk 323.

[0032] The traction component 2 includes a sliding base 21, a height adjustment lifting platform 22 is fixedly connected to the top of the sliding base 21, a rotating side plate 23 is fixedly connected to the top of the height adjustment lifting platform 22, a segmented push rod 24 is arranged at the axis of the inner wall of the rotating side plate 23, a traction slide plate 25 is symmetrically arranged on the upper and lower sides of the outer surface of the segmented push rod 24, and a spring connection belt 26 is symmetrically arranged on the left and right sides of the inner wall of the traction slide plate 25. There are two traction components 2, the outer surface of the sliding base 21 is slidably connected to the inner wall of the guide rail 1, the outer surface of the traction slide plate 25 is slidably connected to the axis of the inner wall of the rotating side plate 23, and one end of the traction slide plate 25 away from the rotating side plate 23 is fixedly connected to the side of the docking shell 311. The upper and lower sides of the segmented push rod 24 are both slidably connected to the inner cavity of the rotating side plate 23 through the accommodating groove, and the side of the inner cavity of the traction slide plate 25 away from the docking shell 311 is fixedly connected to one end of the segmented push rod 24 through the plug interface, and the upper and lower sides of the spring connection belt 26 are fixedly connected to the inner wall of the traction slide plate 25.

[0033] When the storage component 3 moves, turning, acceleration, deceleration and other movements will inevitably occur. At this time, the internal transport wafer 4 cannot perform the above movements because it has no direct contact with the storage component 3, which will cause the inner wall of the docking shell 311 to contact the side of the transport wafer 4, thereby squeezing the transport wafer 4. In severe cases, the transport wafer 4 will be collided, resulting in the transport wafer 4 being broken, so an inner push component 33 is provided to assist in the work.

[0034] Taking acceleration as an example, when the traction component 2 accelerates along the guide rail 1, the balancing slider 335 at the bottom will slide backward relative to the closed disk shell 334 due to the accelerated movement of the closed disk shell 334. At this time, the balancing slider 335 presses the pressure-sensitive button 338 in the rear area. The connecting rod 337 here controls the vertical plug 332 at the corresponding position through the vertical plug 332 to spray. The oblique airflow will generate a forward component force, so that the transported circular wafer 4 that is also lagging behind has a forward acceleration, preventing the transported circular wafer 4 from contacting the inner wall of the docking shell 311. Similarly, when performing steering and deceleration and other operations, the inner push component 33 can also generate corresponding force on the transported circular wafer 4 inside the protective cover shell 31.

[0035] The segmented push rod 24 can drive the docking shells 311 on both sides to slide up and down by pulling the traction slide plates 25 on both sides, thereby controlling the separation and merging of the docking shells 311 on the upper and lower sides. The rotating side plate 23 can relatively adjust the lifting platform 22 to rotate, so that the horizontal storage component 3 is rotated to a vertical state. In this way, when the protective cover shell 31 is separated, the transport wafer 4 can automatically fall out from the inside of the docking shell 311, avoiding the problem that the jet force of the vertical jet pipes 324 on the upper and lower sides is unbalanced when the cover is opened, resulting in the transport wafer 4 cannot be taken out smoothly.

[0036] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A wafer conveying carrier, comprising a guide rail (1), the inner wall of the guide rail (1) being slidably connected to a traction component (2), the top of the traction component (2) being fixedly connected to a storage component (3), the interior of the storage component (3) being provided with a transport wafer (4), characterized in that: The storage component (3) comprises a protective cover shell (31), an air suspension component (32) is fixedly connected to the middle of the outer surface of the protective cover shell (31), and an inner pushing component (33) is provided in the inner cavity of the protective cover shell (31); The protective cover shell (31) comprises a docking shell (311), the inner wall of the docking shell (311) is fixedly connected with an embedded swivel (314), the inner cavity of the embedded swivel (314) is evenly provided with docking air intake ports (315), and the inner wall of the embedded swivel (314) is evenly provided with detection inner rods (316); A vertical through-hole (312) is evenly provided on one side of the inner cavity of the docking shell (311) close to the embedded rotating ring (314), and an oblique through-hole (313) is evenly provided on one side of the inner cavity of the docking shell (311) close to the axis. The air suspension component (32) comprises a drainage motor (321), the outer surface of the air outlet of the drainage motor (321) is fixedly connected to a diversion sleeve (322), the outer surface of the diversion sleeve (322) is fixedly connected to a hollow outer disk (323) via the diversion port, the top of the inner cavity of the hollow outer disk (323) is evenly provided with vertical air injection pipes (324), and the inner cavity of the hollow outer disk (323) is evenly provided with accommodating through openings (325).

2. The wafer transfer carrier according to claim 1, characterized in that: The number of the docking shells (311) is two, the top end of the vertical jet pipe (324) extends to the interior of the docking shell (311) through the vertical through-hole (312), the outer surface of the hollow outer disk (323) is fixedly connected to the middle of the outer surface of the docking shell (311), and the top of the outer surface of the diverter sleeve (322) is fixedly connected to the axis of the outer surface of the docking shell (311).

3. The wafer transfer carrier according to claim 2, characterized in that: One end of the detection inner rod (316) is fixedly connected to the inner wall of the embedded swivel (314), the other end of the detection inner rod (316) extends to the interior of the docking shell (311), and the top of the outer surface of the embedded swivel (314) is fixedly connected to the top of the outer surface of the protective cover shell (31).

4. The wafer transfer carrier according to claim 1, characterized in that: The inner pushing component (33) comprises a control outer ring (331), the upper surface of which is evenly provided with vertical insert tubes (332), the top of the inner cavity of the vertical insert tube (332) is fixedly connected with an oblique insert tube (333), and the top end of the oblique insert tube (333) extends to the interior of the docking shell (311) through an oblique through-hole (313).

5. The wafer transfer carrier according to claim 4, characterized in that: A transfer rod (337) is fixedly connected to the bottom of the inner cavity of the control outer ring (331), and a pressure-sensitive button (338) is slidably connected to one end of the inner cavity of the transfer rod (337) away from the control outer ring (331). A closed disk shell (334) is fixedly connected to the side of the outer surface of the transfer rod (337) away from the control outer ring (331), and a balancing slider (335) is slidably connected to the inner wall of the closed disk shell (334).

6. The wafer transfer carrier according to claim 5, characterized in that: Auxiliary balls (336) are symmetrically arranged on the upper and lower sides of the outer surface of the balancing slider (335), and the outer surface of the balancing slider (335) is slidably connected to the inner wall of the closed disk shell (334) through the auxiliary balls (336). The side surface of the balancing slider (335) and the outer surface of the pressure-sensitive button (338) are pressed against each other, and the outer surface of the control outer ring (331) is fixedly connected to the outer surface of the hollow outer disk (323).

7. The wafer transfer carrier according to claim 1, characterized in that: The traction component (2) comprises a sliding base (21), the top of the sliding base (21) is fixedly connected to a height-adjusting lifting platform (22), the top of the height-adjusting lifting platform (22) is fixedly connected to a rotating side plate (23), a segmented push rod (24) is arranged at the axis of the inner wall of the rotating side plate (23), a traction slide plate (25) is symmetrically arranged on the upper and lower sides of the outer surface of the segmented push rod (24), and a spring connection belt (26) is symmetrically arranged on the left and right sides of the inner wall of the traction slide plate (25).

8. The wafer transfer carrier according to claim 7, characterized in that: The number of the traction components (2) is two, the outer surface of the sliding base (21) is slidably connected to the inner wall of the guide rail (1), the outer surface of the traction slide plate (25) is slidably connected to the axis of the inner wall of the rotating side plate (23), and the end of the traction slide plate (25) away from the rotating side plate (23) is fixedly connected to the side of the docking shell (311).

9. The wafer transfer carrier according to claim 8, characterized in that: The upper and lower sides of the segmented push rod (24) are slidably connected to the inner cavity of the rotating side plate (23) through the accommodating groove, the side of the inner cavity of the traction slide plate (25) away from the docking shell (311) is fixedly connected to one end of the segmented push rod (24) through the plug interface, and the upper and lower sides of the spring connecting belt (26) are fixedly connected to the inner wall of the traction slide plate (25).

Citation Information

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