LED display system-in-package structure and preparation method

Abstract

The invention discloses an LED display system-in-package structure and a preparation method, and belongs to the technical field of semiconductors, the LED display system-in-package structure comprises a control wafer, the first surface and the second surface of the control wafer are respectively provided with a first electrode and a second electrode; a control wafer layer insulating material, wherein the control wafer layer insulating material coats the control wafer; the first rewiring layer is stacked on the control wafer and the control wafer layer insulating material, and the first rewiring layer is connected with a first electrode of the first surface of the control wafer; the LED display structure is stacked on the first rewiring layer, and the first rewiring layer is further connected with a third electrode on the surface of the LED display structure. Based on the above technical scheme, through vertical packaging, the overall miniaturization can be realized, and the occupation of too large space is avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an LED display system-level packaging structure and a preparation method thereof. Background Art

[0002] For LED, a semiconductor device, packaging is the intermediate link between upstream chips and downstream applications, with key functions such as mechanical protection, electrical signal connection, optical parameter regulation and heat dissipation. The quality of the packaging link directly determines the final optical performance and reliability of LED products.

[0003] In the related art, when packaging the LED display system-level packaging structure, the control chip 20 and the LED display structure 10 are arranged horizontally. Specifically, Figure 1 As shown, the LED display structure 10 and the control chip 20 are horizontally fixed on the same carrier board 30 , and then the LED display structure 10 and the control chip 20 are connected using a gold wire 40 .

[0004] This packaging method requires a large horizontal space, making the overall structure larger. Summary of the invention

[0005] The object of the present invention is to provide an LED display system-level packaging structure and a preparation method, which can miniaturize the entire structure through vertical packaging to avoid occupying too much space.

[0006] In order to achieve the above-mentioned invention object, the present invention proposes the following technical solutions:

[0007] In one aspect, an LED display system-level packaging structure is provided, the LED display system-level packaging structure comprising:

[0008] A control chip, wherein the first surface and the second surface of the control chip are respectively provided with a first electrode and a second electrode;

[0009] A control chip layer insulating material, wherein the control chip layer insulating material covers the control chip;

[0010] A first rewiring layer, the first rewiring layer is stacked on the control wafer and the control wafer layer insulating material, and the first rewiring layer is connected to a first electrode on a first surface of the control wafer;

[0011] The LED display structure is stacked on the first rewiring layer, and the first rewiring layer is also connected to a third electrode on the surface of the LED display structure.

[0012] In a possible implementation, the first rewiring layer includes: at least one first wiring layer, and an insulating material surrounding the at least one first wiring layer;

[0013] The at least one first circuit layer is in contact with a third electrode on a side surface of the LED display structure close to the control chip and a first electrode on a first surface of the control chip respectively.

[0014] In a possible implementation manner, a second surface of the control wafer is in contact with a second rewiring layer, and the second surface is a surface arranged opposite to the first surface.

[0015] In a possible implementation, the second rewiring layer includes: at least one second wiring layer, and an insulating material surrounding the at least one second wiring layer;

[0016] A side of the at least one second circuit layer close to the control chip contacts the second electrode on the second surface of the control chip.

[0017] In a possible implementation manner, a surface of the at least one second circuit layer away from the control chip is also in contact with the fourth electrode.

[0018] In a possible implementation, the thickness of the first rewiring layer is not greater than the thickness of the control wafer layer insulating material;

[0019] and / or,

[0020] The thickness of the second rewiring layer is not greater than the thickness of the control wafer layer insulating material.

[0021] In a possible implementation manner, the outer periphery of the LED display structure is wrapped with a surface protection material.

[0022] In a possible implementation, the LED display structure includes:

[0023] A single LED chip; or

[0024] LED chip array; or,

[0025] LED package.

[0026] On the other hand, a method for preparing an LED display system-level packaging structure is provided, the method comprising:

[0027] Prepare a control chip, wherein the first surface and the second surface of the control chip are provided with a first electrode and a second electrode respectively;

[0028] Preparing a control chip layer insulating material to wrap the control chip around the outer periphery of the control chip;

[0029] A first rewiring layer is prepared on the first surface of the control wafer and on the surface of the control wafer layer insulating material on the same side as the first surface, wherein the first rewiring layer is in electrical contact with the control wafer;

[0030] An LED display structure is prepared on the first rewiring layer, and the LED display structure is in electrical contact with the first rewiring layer.

[0031] In a possible implementation manner, before preparing the first rewiring layer, the method further includes:

[0032] A second redistribution layer is prepared on the second surface of the control wafer and on the surface of the control wafer layer insulating material on the same side as the second surface, wherein the second redistribution layer is in electrical contact with the control wafer.

[0033] In a possible implementation, after the LED display structure is prepared, the method further includes:

[0034] A surface protection material is prepared around the outer periphery of the LED display structure to wrap the LED display structure.

[0035] Compared with the prior art, the present invention has the following beneficial effects:

[0036] A control chip, wherein both the first and second surfaces of the control chip are provided with electrodes; a control chip layer insulating material, wherein the control chip layer insulating material covers the control chip; a first rewiring layer, wherein the first rewiring layer is stacked on the control chip and the control chip layer insulating material, and the first rewiring layer is connected to the electrodes on the first surface of the control chip; an LED display structure, wherein the LED display structure is stacked on the first rewiring layer, and the first rewiring layer is also connected to the electrodes on the surface of the LED display structure; the LED display structure and the control chip are packaged together in a package body, so that a single package body can display LEDs, and the vertical package structure can be used to miniaturize the entire package to avoid occupying too much space, and the control chip is designed to have electrodes on both sides, and this type of control chip is thinner, thereby further reducing the thickness of the package structure.

[0037] Furthermore, the first rewiring layer and the second rewiring layer replace the function of the traditional carrier board, thereby further miniaturizing the whole.

[0038] It should be noted that the present invention only needs to achieve at least one of the above-mentioned technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a structural schematic diagram of an LED display system-level packaging structure provided in the related art;

[0040] Figure 2 It is a structural schematic diagram of an LED display system-level packaging structure provided in an embodiment of the present application;

[0041] Figure 3 It is a structural schematic diagram of another LED display system-level packaging structure provided in an embodiment of the present application;

[0042] Figure 4 It is a structural schematic diagram of another LED display system-level packaging structure provided in an embodiment of the present application;

[0043] Figure 5 It is a method flow chart of a method for preparing an LED display system-level packaging structure provided in an embodiment of the present application.

[0044] Markings in the figure: 10-LED display structure, 11-surface protection material, 12-third electrode, 20-control chip, 21-control chip layer insulating material, 22-first electrode, 23-second electrode, 30-carrier, 40-gold wire, 50-first rewiring layer, 60-second rewiring layer, 61-fourth electrode. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0046] In the description of the present invention, it should be understood that the terms "vertical", "upper", "lower", "top", "side", "inner", "outer", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0047] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In order to solve the problem that the packaging structure with a horizontal layout in the related art affects miniaturization, in an embodiment of the present application, a packaging structure with a vertical packaging is provided, which can miniaturize the entire structure and avoid occupying too much space.

[0049] The following is an introduction to the technical solutions provided in the embodiments of the present application.

[0050] Combined with reference Figures 2 to 4 , the embodiment of the present application provides an LED display system-level packaging structure, including:

[0051] A control chip 20, wherein the first surface and the second surface of the control chip 20 are respectively provided with a first electrode 22 and a second electrode 23; a control chip layer insulating material 21, wherein the control chip layer insulating material 21 covers the control chip 20; a first rewiring layer 50, wherein the first rewiring layer 50 is stacked on the control chip 20 and the control chip layer insulating material 21, and the first rewiring layer 50 is connected to the first electrode 22 on the first surface of the control chip 20; an LED display structure 10, wherein the LED display structure 10 is stacked on the first rewiring layer 50, and the first rewiring layer 50 is also connected to the third electrode 12 on the surface of the LED display structure 10.

[0052] In the present application, the control chip 20 and the LED display structure 10 present a vertically packaged packaging structure, and both surfaces of the control chip 20 have electrodes. Therefore, one of the surfaces of the control chip 20 (i.e., the first surface) can be connected to the first rewiring layer 50, and this first rewiring layer 50 can be further connected to the LED display structure 10, thereby completing the vertical packaging of the control chip 20 and the LED display structure 10.

[0053] The control chip layer insulating material 21 is used to insulate and protect the control chip 20, and its bottom can be lower than the bottom of the control chip 20 or flush with the bottom of the control chip 20, and its top can be higher than the top of the control chip 20 or flush with the top of the control chip 20. Further, the control chip layer insulating material 21 can be specifically made of one or more materials such as resin, silicone, rubber, silicon dioxide, silicon nitride, aluminum oxide, etc.

[0054] A first rewiring layer 50 is disposed between the control chip 20 and the LED display structure 10 . The first rewiring layer 50 is used to connect with electrodes of the LED display structure 10 and the control chip 20 , respectively.

[0055] Furthermore, the first rewiring layer 50 includes: at least one first wiring layer, and an insulating material surrounding the at least one first wiring layer; the at least one first wiring layer is respectively in contact with the third electrode 12 on the side surface of the LED display structure 10 close to the control chip 20 and the first electrode 22 on the first surface of the control chip 20. Through the first rewiring layer 50, the control chip 20 and the LED display structure 10 are connected.

[0056] Furthermore, the thickness of the first rewiring layer 50 is not greater than the thickness of the control wafer layer insulating material 21. By controlling the thickness of the first rewiring layer 50, the problem of the overall structure being too thick can be avoided.

[0057] In a possible implementation, the second surface of the control wafer 20 contacts the second rewiring layer 60 , and the second surface is a surface disposed opposite to the first surface.

[0058] like Figures 2 to 4 As shown, the two surfaces of the control chip 20 that are relatively arranged have electrodes, and the control chip 20 has upper and lower electrodes. Therefore, in addition to the top being connected to the first rewiring layer 50, a second rewiring layer 60 is arranged at the bottom of the control chip 20. This second rewiring layer 60 is used to replace the function of the carrier 30 in the prior art, and is connected to the second electrode 23 on the side surface (i.e., the second surface) of the control chip 20 away from the LED display structure 10. This second rewiring layer 60 is located below the control chip 20 and is not higher than the control chip 20.

[0059] It can be understood that the second electrode 23 on the second surface of the control chip 20 is mainly used to receive or send control signals to achieve communication between the control chip 20 and the main control circuit outside the package, or communication between different control chips 20. The first electrode 22 on the first surface of the control chip 20 is mainly used to output power to the LED display structure 10, and can also be used to control the brightness function of the LED display structure 10.

[0060] Furthermore, the second rewiring layer 60 includes: at least one second wiring layer, and an insulating material surrounding the at least one second wiring layer; the at least one second wiring layer is close to a side of the control chip 20 and contacts the electrode on the second surface of the control chip 20. The second electrode 23 on the second surface of the control chip 20 is electrically connected through the second rewiring layer 60.

[0061] Furthermore, at least one second wiring layer further away from the control chip 20 is in contact with the fourth electrode 61. The fourth electrode 61 can be specifically implemented as a surface mount technology (SMT) process electrode, and through the second rewiring layer 60, it can also be used for electrical connection of the electrode under the SMT process.

[0062] Furthermore, the thickness of the second rewiring layer 60 is not greater than the thickness of the control wafer layer insulating material 21. By controlling the thickness of the second rewiring layer 60, the problem of the overall structure being too thick can be avoided.

[0063] It is understood that the first rewiring layer 50 or the second rewiring layer 60 can be prepared in the following manner: a layer of insulating material is applied on the top of a packaged package or a wafer, and a hole is made at the electrode, and then a conductive material is plated on the top by electroplating to connect the electrode, and the circuit is carved out by exposure, development and etching, and then a layer of conductive material is applied and a hole is made, and then a conductive material is plated by electroplating to connect the circuit layer below, and the circuit is carved out by exposure, development and etching, and thus a multi-layer circuit layer is made by reciprocating. In addition, the above-mentioned hole processing can be carried out by development exposure or masking.

[0064] In a possible implementation, the outer periphery of the LED display structure 10 is wrapped with a surface protection material 11 .

[0065] The surface protection material 11 is used to insulate and protect the LED display structure 10 and realize optical functions. It can be a transparent or colored protection material, and its bottom can be lower than the bottom of the LED display structure 10 or flush with the bottom of the LED display structure 10, and its top can be higher than the top of the LED display structure 10 or flush with the top of the LED display structure 10. Further, the surface protection material 11 can be specifically made of one or more materials such as epoxy resin, silicone, polyurethane glue, acrylic glue, polyvinyl chloride glue, etc.

[0066] Exemplary, with reference to Figure 2 , wherein the LED display structure 10 can be an LED chip array.

[0067] Exemplary, with reference to Figure 3 , wherein the LED display structure 10 can be a single LED chip.

[0068] Exemplary, with reference to Figure 4 , wherein the LED display structure 10 can be an LED package.

[0069] In summary, the technical solution provided by the embodiment of the present application, the LED display system-level packaging structure includes: a control chip, the first surface and the second surface of the control chip are both provided with electrodes; a control chip layer insulating material, the control chip layer insulating material covers the control chip; a first rewiring layer, the first rewiring layer is stacked on the control chip and the control chip layer insulating material, the first rewiring layer is connected to the electrode on the first surface of the control chip; an LED display structure, the LED display structure is stacked on the first rewiring layer, and the first rewiring layer is also connected to the electrode on the surface of the LED display structure; the LED display structure and the control chip are packaged together in a packaging body, so that a single packaging body can display LEDs, and the vertical packaging packaging structure can make the overall miniaturization possible to avoid occupying too much space, and the control chip is designed to have electrodes on both sides, and the thickness of this type of control chip is thinner, thereby further reducing the thickness of the packaging structure.

[0070] Furthermore, based on the above structure, the present application also provides a method for preparing a LED display system-level packaging structure, such as Figure 5 As shown, the method includes:

[0071] S1: Prepare a control wafer, wherein the first surface and the second surface of the control wafer are provided with a first electrode and a second electrode, respectively.

[0072] The first surface and the second surface may be two surfaces arranged opposite to each other, that is, the upper and lower surfaces of the control chip are both provided with electrode structures.

[0073] S2: Prepare a control wafer layer insulating material wrapping the control wafer around the outer periphery of the control wafer.

[0074] The control chip is insulated and protected by the prepared control chip layer insulating material.

[0075] S3: preparing a first rewiring layer on the first surface of the control wafer and on the surface of the control wafer layer insulating material on the same side as the first surface, wherein the first rewiring layer is in electrical contact with the control wafer.

[0076] A redistribution layer (ie, the first redistribution layer) is applied on the same side surface of the control chip and the insulating material of the control chip layer to connect the control chip.

[0077] In a possible implementation, before preparing the first rewiring layer, the following step is also included: preparing a second rewiring layer on the second surface of the control chip and on the surface on the same side of the control chip layer insulating material and the second surface, and the second rewiring layer is in electrical contact with the control chip.

[0078] On the other side surface of the control chip and the control chip layer insulating material, a rewiring layer (i.e., the second rewiring layer) is first applied to connect to the control chip and serve as an electrode for the underlying chips.

[0079] S4: preparing an LED display structure on the first rewiring layer, wherein the LED display structure is in electrical contact with the first rewiring layer.

[0080] On the other side of the first rewiring layer away from the control chip, an LED display structure is prepared, which is not limited to a single LED chip, an LED chip array, or an LED package.

[0081] Exemplarily, the first rewiring layer and the LED display structure may be bonded via a solder pad, so that the LED display structure is disposed on the first rewiring layer, and the first rewiring layer and the LED display structure are in electrical contact.

[0082] In a possible implementation, after the LED display structure is prepared, the following step is further included: a surface protection material is prepared around the outer periphery of the LED display structure to wrap the LED display structure. By preparing the surface protection material, the LED display structure is insulated and protected and optical functions are achieved.

[0083] In summary, the technical solution provided by the embodiment of the present application is to prepare a control chip, wherein the first surface and the second surface of the control chip are both provided with electrodes; prepare a control chip layer insulating material that wraps the control chip around the outer periphery of the control chip; prepare a first rewiring layer on the first surface of the control chip and on the surface on the same side of the control chip layer insulating material and the first surface, wherein the first rewiring layer is electrically in contact with the control chip; prepare an LED display structure on the first rewiring layer, wherein the LED display structure is electrically in contact with the first rewiring layer; encapsulate the LED display structure and the control chip together in a package body, thereby realizing that a single package body can display LEDs, and through the vertical package structure, the overall miniaturization can be achieved to avoid occupying too much space, and the control chip is designed to have electrodes on both sides, and this type of control chip is thinner, thereby further reducing the thickness of the package structure.

[0084] All of the above optional technical solutions can be combined in any way to form optional embodiments of the present invention, that is, any multiple embodiments can be combined to meet the needs of different application scenarios. They are all within the protection scope of this application and will not be described one by one here.

[0085] It should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED display system-level packaging structure, characterized in that: The LED display system-level packaging structure includes: A control chip, wherein the first surface and the second surface of the control chip are respectively provided with a first electrode and a second electrode; A control chip layer insulating material, wherein the control chip layer insulating material covers the control chip; A first rewiring layer, the first rewiring layer is stacked on the control wafer and the control wafer layer insulating material, and the first rewiring layer is connected to a first electrode on a first surface of the control wafer; The LED display structure is stacked on the first rewiring layer, and the first rewiring layer is also connected to a third electrode on the surface of the LED display structure.

2. The packaging structure according to claim 1, characterized in that: The first rewiring layer comprises: at least one first wiring layer, and an insulating material surrounding the at least one first wiring layer; The at least one first circuit layer is in contact with a third electrode on a side surface of the LED display structure close to the control chip and a first electrode on a first surface of the control chip respectively.

3. The packaging structure according to claim 1, characterized in that: The second surface of the control wafer contacts the second rewiring layer, and the second surface is a surface arranged opposite to the first surface.

4. The packaging structure according to claim 3, characterized in that: The second rewiring layer comprises: at least one second wiring layer, and an insulating material surrounding the at least one second wiring layer; A side of the at least one second circuit layer close to the control chip contacts the second electrode on the second surface of the control chip.

5. The packaging structure according to claim 4, characterized in that: A side of the at least one second circuit layer away from the control chip is also in contact with the fourth electrode.

6. The packaging structure according to claim 3, characterized in that: The thickness of the first rewiring layer is not greater than the thickness of the insulating material of the control wafer layer; and / or, The thickness of the second rewiring layer is not greater than the thickness of the control wafer layer insulating material.

7. The packaging structure according to claim 1, characterized in that: The outer periphery of the LED display structure is wrapped with a surface protection material.

8. The packaging structure according to claim 1, characterized in that: The LED display structure comprises: A single LED chip; or LED chip array; or, LED package.

9. A method for preparing an LED display system-level packaging structure, characterized in that: The method comprises: Prepare a control chip, wherein the first surface and the second surface of the control chip are provided with a first electrode and a second electrode respectively; Preparing a control chip layer insulating material to wrap the control chip around the outer periphery of the control chip; A first rewiring layer is prepared on the first surface of the control wafer and on the surface of the control wafer layer insulating material on the same side as the first surface, wherein the first rewiring layer is in electrical contact with the control wafer; An LED display structure is prepared on the first rewiring layer, and the LED display structure is in electrical contact with the first rewiring layer.

10. The preparation method according to claim 9, characterized in that: Before preparing the first rewiring layer, the method further comprises: A second redistribution layer is prepared on the second surface of the control wafer and on the surface of the control wafer layer insulating material on the same side as the second surface, wherein the second redistribution layer is in electrical contact with the control wafer.

11. The method according to claim 9, characterized in that After the LED display structure is prepared, the method further comprises: A surface protection material is prepared around the outer periphery of the LED display structure to wrap the LED display structure.

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