Wafer positioning electrode jig for manufacturing crystal oscillator and auxiliary clamp of wafer positioning electrode jig

Abstract

The invention discloses a wafer positioning electrode jig for crystal oscillator manufacturing and an auxiliary clamp thereof, and relates to the technical field of crystal oscillator manufacturing appliances, the wafer positioning electrode jig comprises a shell, a positioning sheet and a supporting element, the positioning sheet and the supporting element are both installed in the shell, the positioning sheet is located above the supporting element, the upper end of the positioning sheet is used for placing an upper electrode sheet, and the lower end of the positioning sheet is used for placing a lower electrode sheet. A lower electrode slice is placed between the positioning piece and the supporting element, a first positioning hole for positioning the upper electrode slice and a second positioning hole for positioning the lower electrode slice are formed in the positioning piece, a wafer is installed on the surface of the positioning piece, and receding grooves are formed in the edges of the positioning piece, the lower electrode slice and the supporting element. The receding groove can expose part of the edge of the upper electrode plate. According to the invention, accurate positioning can be realized, excessive contact between the wafer and the clamp during operation is avoided, the problem of electrostatic adhesion caused by mistaken contact is solved, and the crystal oscillator manufacturing efficiency and the product quality are improved.

Description

Technical Field

[0001] The invention relates to the technical field of crystal oscillator manufacturing tools, in particular to a wafer positioning electrode jig and an auxiliary clamp for crystal oscillator manufacturing. Background Art

[0002] During the crystal oscillator manufacturing process, wafer quality inspection is often involved. Before the inspection, the wafer fixture needs to be separated. However, during the separation operation of the existing wafer fixture, the wafer in the fixture is often affected, especially static electricity adhesion and accidental touch will cause damage to the crystal. Therefore, it is necessary to design a wafer fixture that can achieve isolation operation. In addition, the existing wafer fixture cannot accurately position the electrode sheet during assembly, and thus cannot be accurately identified during assembly and disassembly. Summary of the invention

[0003] The purpose of the present invention is to provide a chip positioning electrode jig and its auxiliary clamp for crystal oscillator manufacturing, so as to solve the problems existing in the above-mentioned prior art, enable accurate positioning, and avoid excessive contact between the chip and the clamp during operation, so as to improve the problem of accidental contact and electrostatic adhesion, thereby improving the crystal oscillator manufacturing efficiency and product quality.

[0004] To achieve the above object, the present invention provides the following solutions:

[0005] The present invention provides a chip positioning electrode fixture, comprising a shell, a positioning plate and a supporting element, wherein the positioning plate and the supporting element are both installed in the shell, and the positioning plate is located above the supporting element, the upper end of the positioning plate is used to place an upper electrode plate, and the space between the positioning plate and the supporting element is used to place a lower electrode plate, the positioning plate is provided with a first positioning hole for positioning the upper electrode plate, and a second positioning hole for positioning the lower electrode plate, a chip is installed on the surface of the positioning plate, and the edges of the positioning plate, the lower electrode plate and the supporting element are all provided with air avoidance grooves, and the air avoidance grooves can expose part of the edge of the upper electrode plate.

[0006] In one embodiment, the housing includes an upper cover plate and a lower cover plate, the upper cover plate is located at the upper end of the upper electrode sheet, and the upper cover plate is connected to the supporting element, and the lower cover plate is connected to the lower end of the supporting element.

[0007] In one embodiment, the supporting element includes a first frame and a second frame with the same structure, and the first frame is connected to the upper end of the second frame, the first frame can be connected to the upper cover plate, and the second frame can be connected to the lower cover plate.

[0008] In one embodiment, magnets are disposed on both the first frame and the second frame, and the first frame can absorb the upper cover plate, and the second frame can absorb the lower cover plate.

[0009] In one embodiment, the air-avoiding grooves are provided on one side of the positioning sheet, one side of the lower electrode sheet, one side of the first frame, and one side of the second frame, and the air-avoiding grooves correspond to each other in the vertical direction.

[0010] In one embodiment, a protrusion is provided on one side of the upper electrode sheet, and the protrusion corresponds to the position of the air-avoiding groove in the vertical direction.

[0011] In one embodiment, the upper electrode sheet is provided with an upper positioning hole, and the upper positioning hole is used to align with the first positioning hole in the vertical direction. The lower electrode sheet is provided with a lower positioning hole, and the lower positioning hole is used to align with the second positioning hole in the vertical direction.

[0012] In one embodiment, there are four of the first positioning hole, the second positioning hole, the upper positioning hole and the lower positioning hole, and the four first positioning holes are respectively opened at the four corners of the positioning sheet, the four second positioning holes are respectively opened at the four corners of the positioning sheet, and the first positioning hole is located on the inner side of the second positioning hole, the four first positioning holes are respectively opened at the four corners of the upper electrode sheet, and the four lower positioning holes are respectively opened at the four corners of the lower electrode sheet.

[0013] The present invention also provides an auxiliary clamp for a chip positioning electrode fixture, which is used to fix the chip positioning electrode fixture described in any of the above technical solutions, including a main body with an opening at the upper end, and a suction hole is provided on one side of the main body, and the suction hole is used for externally connecting a negative pressure device.

[0014] In one embodiment, the main body is a cubic shell, and a limit bar is provided on the outer edge of the upper end of the main body, and the limit bar is distributed on the upper ends of three of the side walls of the main body, and the chip positioning electrode fixture can slide into the upper end of the main body through the side of the upper end of the main body where the limit bar is not provided, and be embedded in the groove formed by the limit bar and the upper end of the main body.

[0015] Compared with the prior art, the present invention has achieved the following technical effects:

[0016] The wafer positioning electrode jig and its auxiliary clamp for crystal oscillator manufacturing provided by the present invention are used in the process of crystal oscillator manufacturing. The positioning sheet and the supporting element are both installed in the shell, and the positioning sheet is located above the supporting element. The upper end of the positioning sheet is used to place the upper electrode sheet, and the space between the positioning sheet and the supporting element is used to place the lower electrode sheet. The positioning sheet is provided with a first positioning hole for positioning the upper electrode sheet, and a second positioning hole for positioning the lower electrode sheet. Whether the overall positioning is correct is determined based on whether the first positioning hole is aligned with the upper electrode sheet and whether the second positioning hole is aligned with the lower electrode sheet, and then in the operation process of assembling and disassembling the whole set of wafer positioning electrode jigs in crystal oscillator manufacturing. They can all play the role of identification and positioning, and the positioning sheet can be used to complete the simultaneous positioning of the upper electrode sheet and the lower electrode sheet. The structure is simple and the operation is convenient. The surface of the positioning sheet is installed with a chip, and the edges of the positioning sheet, the lower electrode sheet and the supporting element are all provided with air avoidance grooves. The air avoidance grooves can expose part of the edge of the upper electrode sheet, and then when the chip needs to be fully inspected, the upper electrode sheet can be directly lifted through the exposed part of the upper electrode sheet, avoiding excessive contact with the chip positioning electrode fixture during operation, and changing the way the upper electrode sheet and the lower electrode sheet are separated, and then cooperating with the actual situation during operation to improve the accidental touch and electrostatic adhesion, thereby improving the crystal oscillator production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a structural schematic diagram of the upper cover plate in the first embodiment;

[0019] Figure 2 is a schematic structural diagram of the upper electrode sheet in Example 1;

[0020] Figure 3 It is a structural schematic diagram of the positioning sheet in the first embodiment;

[0021] Figure 4 is a schematic structural diagram of the lower electrode sheet in Example 1;

[0022] Figure 5 is a schematic structural diagram of the first skeleton in Example 1;

[0023] Figure 6 is a schematic structural diagram of the second skeleton in Example 1;

[0024] Figure 7 This is a schematic diagram of the structure of the lower cover plate in Embodiment 1;

[0025] Figure 8 It is a structural schematic diagram of the auxiliary clamp in the second embodiment;

[0026] In the figure: 1-upper cover plate, 2-upper electrode sheet, 21-protrusion, 22-upper positioning hole, 3-positioning sheet, 31-first positioning hole, 32-second positioning hole, 4-lower electrode sheet, 41-lower positioning hole, 5-first frame, 6-second frame, 7-lower cover plate, 8-avoidance groove, 9-body, 91-intake hole, 92-limiting strip. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] The purpose of the present invention is to provide a chip positioning electrode fixture and its auxiliary clamp for crystal oscillator manufacturing, so as to solve the problems existing in the prior art, enable accurate positioning, and avoid excessive contact between the chip and the clamp during operation, so as to improve the problem of accidental contact and electrostatic adhesion, thereby improving the crystal oscillator manufacturing efficiency and product quality.

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Embodiment 1

[0031] like Figure 1-Figure 7As shown, this embodiment provides a wafer positioning electrode fixture for use in the crystal oscillator manufacturing process. The wafer positioning electrode fixture includes a shell, a positioning piece 3 and a supporting element. The positioning piece 3 and the supporting element are both installed in the shell, and the positioning piece 3 is located above the supporting element. The upper end of the positioning piece 3 is used to place the upper electrode piece 2, and the space between the positioning piece 3 and the supporting element is used to place the lower electrode piece 4. The positioning piece 3 is provided with a first positioning hole 31 for positioning the upper electrode piece 2, and a second positioning hole 32 for positioning the lower electrode piece 4. Then, according to whether the first positioning hole 31 is aligned with the upper electrode piece 2, and whether the second positioning hole 32 is aligned with the lower electrode piece 4, it is determined whether the overall positioning is correct, and then the whole set of wafers can be assembled and disassembled in the crystal oscillator manufacturing process. The positioning electrode fixture can play the role of identification and positioning in the operation process, and the positioning piece 3 can be used to complete the simultaneous positioning of the upper electrode piece 2 and the lower electrode piece 4. It has a simple structure and is easy to operate. A chip is installed on the surface of the positioning piece 3, and the edges of the positioning piece 3, the lower electrode piece 4 and the supporting element are provided with an air avoidance groove 8. The air avoidance groove 8 can expose part of the edge of the upper electrode piece 2, and then when the chip needs to be fully inspected, the upper electrode piece 2 can be directly lifted through the exposed part of the upper electrode piece 2, avoiding excessive contact with the chip positioning electrode fixture during operation, and changing the separation method of the upper electrode piece 2 and the lower electrode piece 4, and then cooperating with the actual situation during operation to improve the accidental touch and electrostatic adhesion, thereby improving the crystal oscillator production efficiency and product quality.

[0032] Specifically, the housing includes an upper cover plate 1 and a lower cover plate 7. The upper cover plate 1 is located at the upper end of the upper electrode sheet 2 and is connected to the supporting element. The lower cover plate 7 is connected to the lower end of the supporting element. By setting a multi-layer structure, installation and disassembly are facilitated.

[0033] The supporting element includes a first frame 5 and a second frame 6 of the same structure. The first frame 5 and the second frame 6 play the role of supporting and realizing the overall connection. The first frame 5 is connected to the upper end of the second frame 6. The first frame 5 can be connected to the upper cover plate 1, and the second frame 6 can be connected to the lower cover plate 7, thereby realizing an indirect connection between the upper cover plate 1 and the lower cover plate 7.

[0034] Magnets are provided on the first skeleton 5 and the second skeleton 6. The first skeleton 5 can absorb the upper cover plate 1, and the second skeleton 6 can absorb the lower cover plate 7, which is convenient for overall installation and disassembly. When the chip needs to be inspected, the upper electrode sheet 2 and the upper cover plate 1 can be directly opened to facilitate the separation of the upper electrode sheet 2.

[0035] One side of the positioning sheet 3, one side of the lower electrode sheet 4, one side of the first skeleton 5 and one side of the second skeleton 6 are all provided with air avoidance grooves 8, and the positions of the air avoidance grooves 8 in the vertical direction correspond to each other, thereby forming an operating area on one side of the chip positioning electrode fixture, ensuring that when the upper electrode sheet 2 is lifted up, it can accurately act on the corresponding position on the upper electrode sheet 2 to achieve the intact separation of the upper electrode sheet 2.

[0036] A protrusion 21 is provided on one side of the upper electrode sheet 2 , and the protrusion 21 corresponds to the position of the air-avoiding groove 8 in the vertical direction. When the upper electrode sheet 2 needs to be opened, the protrusion 21 can be directly operated.

[0037] An upper positioning hole 22 is provided on the upper electrode sheet 2, and the upper positioning hole 22 is used to align with the first positioning hole 31 in the vertical direction. A lower positioning hole 41 is provided on the lower electrode sheet 4, and the lower positioning hole 41 is used to align with the second positioning hole 32 in the vertical direction. Then, by checking whether each upper positioning hole 22 is aligned with each first positioning hole 31 up and down, and whether each lower positioning hole 41 is aligned with each second positioning hole 32, it is determined whether the upper electrode sheet 2 and the lower electrode sheet 4 are aligned. When some holes are not accurately aligned, the position of each layer is adjusted until each hole is accurately aligned.

[0038] There are four first positioning holes 31, four second positioning holes 32, upper positioning holes 22 and lower positioning holes 41, and the four first positioning holes 31 are respectively opened at the four corners of the positioning sheet 3, the four second positioning holes 32 are respectively opened at the four corners of the positioning sheet 3, and the first positioning hole 31 is located on the inner side of the second positioning holes 32, the four first positioning holes 31 are respectively opened at the four corners of the upper electrode sheet 2, and the four lower positioning holes 41 are respectively opened at the four corners of the lower electrode sheet 4. While using one positioning sheet 3 to simultaneously position the upper electrode sheet 2 and the lower electrode sheet 4, it also ensures that the upper electrode sheet 2 and the lower electrode sheet 4 are accurately positioned in all directions.

[0039] This embodiment can be applied to the chip quality inspection and chip arrangement process in the crystal oscillator manufacturing process. Through the above design, the chip inspection method is clarified, and the process improvement of crystal oscillator manufacturing is provided, so that the multi-layer positioning of the fixture in daily operations is more accurate, the crystal oscillator preparation quality is improved, and the crystal oscillator manufacturing efficiency is also improved.

[0040] Embodiment 2

[0041] like Figure 8As shown, the present embodiment provides an auxiliary fixture of a wafer positioning electrode fixture, which is used to fix the wafer positioning electrode fixture in the first embodiment, including a main body 9 with an upper opening, and a suction hole 91 is provided on one side of the main body 9. The suction hole 91 is used for externally connecting a negative pressure device, and then after the wafer positioning electrode fixture is placed on the upper end of the main body 9, the negative pressure device provides negative pressure to the inside of the main body 9 through the suction hole 91 to adsorb the lower cover plate 7, so as to avoid that when the upper electrode sheet 2 is opened, the lower cover plate 7, the wafer, and the supporting elements follow the upper electrode sheet 2 upward, affecting the separation of the upper electrode sheet 2, and at the same time, it can also avoid causing structural damage.

[0042] Specifically, the main body 9 is a cubic shell, and a limiting bar 92 is provided on the outer edge of the upper end of the main body 9. The limiting bar 92 is distributed on the upper ends of three side walls of the main body 9, and the chip positioning electrode jig can slide into the upper end of the main body 9 through the side of the upper end of the main body 9 where the limiting bar 92 is not provided, and be embedded in the groove formed by the limiting bar 92 and the upper end of the main body 9, so that the chip positioning electrode jig can be stably adsorbed by the auxiliary clamp of the chip positioning electrode jig, and at the same time, it also avoids affecting the lifting of the upper electrode sheet 2.

[0043] Through the above design, this embodiment can avoid the chip deviation phenomenon, and the success rate can reach about 99%. By controlling the opening and closing of the negative pressure device, the chip positioning electrode fixture can be easily taken.

[0044] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A wafer positioning electrode fixture, characterized in that: It includes a shell, a positioning plate and a supporting element, wherein the positioning plate and the supporting element are both installed in the shell, and the positioning plate is located above the supporting element, the upper end of the positioning plate is used to place an upper electrode plate, and the space between the positioning plate and the supporting element is used to place a lower electrode plate, the positioning plate is provided with a first positioning hole for positioning the upper electrode plate, and a second positioning hole for positioning the lower electrode plate, a chip is installed on the surface of the positioning plate, and the edges of the positioning plate, the lower electrode plate and the supporting element are all provided with air avoidance grooves, and the air avoidance grooves can expose part of the edge of the upper electrode plate.

2. The wafer positioning electrode fixture according to claim 1, characterized in that: The housing comprises an upper cover plate and a lower cover plate, wherein the upper cover plate is located at the upper end of the upper electrode sheet and is connected to the supporting element, and the lower cover plate is connected to the lower end of the supporting element.

3. The wafer positioning electrode fixture according to claim 2, characterized in that: The supporting element includes a first frame and a second frame with the same structure, and the first frame is connected to the upper end of the second frame. The first frame can be connected to the upper cover plate, and the second frame can be connected to the lower cover plate.

4. The wafer positioning electrode fixture according to claim 3, characterized in that: Magnets are disposed on the first frame and the second frame. The first frame can absorb the upper cover plate, and the second frame can absorb the lower cover plate.

5. The wafer positioning electrode fixture according to claim 3, characterized in that: The air-avoiding grooves are provided on one side of the positioning sheet, one side of the lower electrode sheet, one side of the first frame and one side of the second frame, and the air-avoiding grooves correspond to each other in the vertical direction.

6. The wafer positioning electrode fixture according to claim 5, characterized in that: A protrusion is provided on one side of the upper electrode sheet, and the protrusion corresponds to the position of the air-avoiding groove in the vertical direction.

7. The wafer positioning electrode fixture according to claim 1, characterized in that: The upper electrode sheet is provided with an upper positioning hole, and the upper positioning hole is used to align with the first positioning hole in the vertical direction. The lower electrode sheet is provided with a lower positioning hole, and the lower positioning hole is used to align with the second positioning hole in the vertical direction.

8. The wafer positioning electrode fixture according to claim 7, characterized in that: There are four of the first positioning hole, the second positioning hole, the upper positioning hole and the lower positioning hole, and the four first positioning holes are respectively opened at the four corners of the positioning sheet, the four second positioning holes are respectively opened at the four corners of the positioning sheet, and the first positioning hole is located on the inner side of the second positioning hole, the four first positioning holes are respectively opened at the four corners of the upper electrode sheet, and the four lower positioning holes are respectively opened at the four corners of the lower electrode sheet.

9. An auxiliary fixture for a wafer positioning electrode fixture, characterized in that: A wafer positioning electrode fixture for fixing any one of claims 1 to 8 comprises a main body with an opening at the upper end, a suction hole being provided on one side of the main body, and the suction hole being used for connecting an external negative pressure device.

10. The auxiliary fixture for wafer positioning electrode jig according to claim 9, characterized in that: The main body is a cubic shell, and a limit bar is provided on the outer edge of the upper end of the main body. The limit bar is distributed on the upper ends of three side walls of the main body, and the chip positioning electrode fixture can slide into the upper end of the main body through the side of the upper end of the main body where the limit bar is not provided, and be embedded in the groove formed by the limit bar and the upper end of the main body.

Images