Embedded vapor chamber assembly and electronic device

Abstract

The invention provides an embedded uniform temperature plate assembly and an electronic device, and the embedded uniform temperature plate assembly comprises a circuit board, a power chip, a uniform temperature plate, and a cooling fin. The circuit board comprises a first circuit board layer used for attaching the power chip, a second circuit board layer used as a bottom plate, and a third circuit board layer clamped between the first circuit board layer and the second circuit board layer; the uniform temperature plate is clamped between the first circuit board layer and the second circuit board layer and is arranged on the same layer as the third circuit board layer, and the projection of the uniform temperature plate towards the direction of the first circuit board layer covers the power chip; the uniform temperature plate comprises a closed cavity, a capillary structure arranged in the cavity and phase change liquid filled in the cavity; and the cooling fin is attached to one side, far away from the third circuit board layer, of the first circuit board layer, and is at least attached to the surface of a part of the power chip. Compared with the prior art, the embedded vapor chamber assembly is better in heat dissipation performance.

Description

[Technical field]

[0001] The present invention relates to the field of heat dissipation technology, and in particular to an embedded temperature vapor chamber component and an electronic device. [Background technology]

[0002] With the development of electronic and electrical technology and the improvement of user needs, various electronic products in daily life, scientific research and education have more and more functions and higher power, and the heating of electronic products is becoming more and more serious. Vapor Chamber (VC) is a thin heat dissipation component. Due to its divergent vapor path and good 2D surface thermal conductivity, it can be used in various electronic products and enhance the heat dissipation effect of the products. It is currently an ideal solution to solve the heat dissipation problems of various electronic products.

[0003] The existing technology provides a heat spreader solution, which is generally placed between the power chip and the metal shell of the product. After the heat of the power chip is transferred to the heat spreader, the heat is dissipated through the heat conduction of the metal shell. However, the existing technology relies on the passive heat dissipation of the metal shell of the product, and there is an inevitable gap between the heat spreader and the power chip due to the packaging process, resulting in poor heat dissipation effect.

[0004] Therefore, it is necessary to provide a new temperature dispersion plate solution to solve the above problems. [Summary of the invention]

[0005] The technical problem to be solved by the present invention is to provide an embedded temperature vapor chamber component and an electronic device with better heat dissipation effect.

[0006] In order to solve the above technical problems, the present invention provides an embedded temperature vapor chamber assembly, which includes a circuit board, a power chip, a temperature vapor chamber and a heat sink:

[0007] The circuit board is a multi-layer circuit board, comprising a first circuit board layer for mounting the power chip, a second circuit board layer for serving as a base plate, and a third circuit board layer sandwiched between the first circuit board layer and the second circuit board layer;

[0008] The temperature averaging plate is sandwiched between the first circuit board layer and the second circuit board layer and is arranged on the same layer as the third circuit board layer, and the orthographic projection of the temperature averaging plate toward the first circuit board layer covers the power chip; the temperature averaging plate includes a closed cavity, a capillary structure arranged in the cavity, and a phase change liquid filled in the cavity;

[0009] The heat sink is attached to a side of the first circuit board layer away from the third circuit board layer and is in contact with at least a portion of the surface of the power chip.

[0010] Furthermore, at least one first through hole is provided on the first circuit board layer, and at least one first protrusion structure is provided on a side of the temperature homogenizer close to the first circuit board layer, and the first protrusion structure passes through the first through hole to make the temperature homogenizer and the heat sink fit in contact.

[0011] Furthermore, at least one second through hole is provided on the first circuit board layer, and at least one second protrusion structure is provided on a side of the temperature spreader close to the first circuit board layer, and the second protrusion structure passes through the second through hole to make the temperature spreader and the power chip in close contact.

[0012] Furthermore, the third circuit board layer is a double-layer structure; the temperature homogenizing plate is embedded in the third circuit board layer and is in contact with the first circuit board layer and the second circuit board layer respectively.

[0013] Furthermore, the embedded temperature vapor chamber assembly also includes a fixing screw, a threaded hole is provided on the side of the heat sink that is bonded to the first circuit board layer, and fixing holes are respectively provided at positions of the circuit board and the temperature vapor chamber corresponding to the threaded holes, and the fixing screw passes through the fixing hole along the direction of the third circuit board layer toward the first circuit board layer and forms a threaded fixed connection with the threaded hole.

[0014] Furthermore, the heat sink is a fin-type heat sink.

[0015] Furthermore, the temperature homogenizing plate is made of copper, stainless steel or titanium alloy and is manufactured based on the ECP process.

[0016] Furthermore, the temperature homogenizing plate is connected to a ground terminal on the first circuit board layer or the second circuit board layer.

[0017] Furthermore, a support structure fixedly supported on a plate body of the temperature equalizing plate is also provided in the temperature equalizing plate.

[0018] The present invention further provides an electronic device, comprising the embedded temperature vapor chamber assembly as described above.

[0019] Compared with the related art, the embedded temperature-averaging board assembly of the present invention includes a circuit board, a power chip, a temperature-averaging board and a heat sink: the circuit board is a multi-layer circuit board, the circuit board includes a first circuit board layer for attaching the power chip, a second circuit board layer for serving as a bottom plate, and a third circuit board layer sandwiched between the first circuit board layer and the second circuit board layer; the temperature-averaging board is sandwiched between the first circuit board layer and the second circuit board layer, and is arranged in the same layer as the third circuit board layer, and the orthographic projection of the temperature-averaging board toward the first circuit board layer covers the power chip; the temperature-averaging board includes a closed cavity, a capillary structure arranged in the cavity and a phase-change liquid filled in the cavity; the heat sink is attached to the side of the first circuit board layer away from the third circuit board layer, and is at least attached to the surface of part of the power chip. In the above structure, the temperature-averaging board is embedded in the multi-layer circuit board, and the embedded design improves the overall thermal conductivity of the circuit board. On the basis of the integrated temperature-averaging board, the present invention also uses a heat sink to attach the power chip for auxiliary heat dissipation, which is more conducive to directly controlling the heat generation of the power chip on the circuit board. Compared with the related art, the heat dissipation performance of the embedded temperature-averaging board assembly of the present invention is better.

Brief Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0021] Figure 1 A schematic diagram of the three-dimensional structure of an embedded temperature vapor chamber assembly provided in an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of the overall exploded structure of an embedded temperature vapor chamber assembly provided in an embodiment of the present invention;

[0023] Figure 3 The embodiment of the present invention provides Figure 1 A cross-sectional view of line AA in the three-dimensional structural schematic diagram of the embedded temperature vapor chamber assembly. [Specific implementation method]

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] See also Figure 1-3 As shown, an embodiment of the present invention provides an embedded temperature vapor chamber assembly 100, wherein: Figure 1 A schematic diagram of the three-dimensional structure of an embedded temperature vapor chamber assembly provided in an embodiment of the present invention, Figure 2 The overall decomposition structure diagram of the embedded vapor chamber assembly provided in an embodiment of the present invention, the embedded vapor chamber assembly 100 includes a circuit board, a power chip 2, a vapor chamber 3 and a heat sink 4:

[0026] The circuit board 1 is a multi-layer circuit board, comprising a first circuit board layer 11 for mounting the power chip 2, a second circuit board layer 12 for serving as a base plate, and a third circuit board layer 13 sandwiched between the first circuit board layer 11 and the second circuit board layer 12;

[0027] The temperature plate 3 is sandwiched between the first circuit board layer 11 and the second circuit board layer 12, and is arranged on the same layer as the third circuit board layer 13. The orthographic projection of the temperature plate 3 toward the first circuit board layer 11 covers the power chip 2.

[0028] The temperature homogenizing plate 3 comprises a closed cavity, a capillary structure arranged in the cavity and a phase change liquid filled in the cavity;

[0029] The heat sink 4 is attached to a side of the first circuit board layer 11 away from the third circuit board layer 13 , and is in contact with at least a portion of the surface of the power chip 2 .

[0030] The temperature plate 3 covers the power chip 2 in terms of area so that the heat generated by the power chip 2 can be transferred through the temperature plate 3 .

[0031] Specifically, in the embodiment of the present invention, in order to further improve the thermal conductivity of the temperature averaging plate 3, at least one first through hole 111 is provided on the first circuit board layer 11, and at least one first protruding structure 31 is provided on the side of the temperature averaging plate 3 close to the first circuit board layer 11, and the first protruding structure 31 passes through the first through hole 111 to make the temperature averaging plate 3 and the heat sink 4 fit in contact. Through such a design, the heat absorbed by the temperature averaging plate 3 from the circuit board can be transferred to the heat sink 4, and the heat sink 4 assists the temperature averaging plate 3 in auxiliary heat dissipation.

[0032] In the embodiment of the present invention, in order to further improve the heat dissipation performance of the temperature averaging plate 3 for the power chip 2, at least one second through hole 112 is provided on the first circuit board layer 11, and at least one second protrusion structure 32 is provided on the side of the temperature averaging plate 3 close to the first circuit board layer 11, and the second protrusion structure 32 passes through the second through hole 112 to make the temperature averaging plate 3 and the power chip 2 fit in contact. With such a design, the temperature averaging plate 3 can not only transfer the heat generated by the power chip 2 through the heat conduction of the circuit board, but also directly transfer the heat by fitting the power chip 2, so that the heat conduction process will not be hindered by the circuit board 1.

[0033] Combined with the design of the fitting contact between the temperature equalizer 3 and the heat sink 4 in the above embodiment, the fitting contact between the temperature equalizer 3 and the power chip 2 actually forms a high-performance heat transfer channel based on the temperature equalizer 3 between the bottom surface of the power chip 2 and the heat sink 4, thereby improving the overall heat dissipation performance of the component.

[0034] In a possible implementation, the circuit board 1 is formed by laminating two double-layer circuit boards of the same structure. In this case, the third circuit board layer 13 is a double-layer structure, and the temperature averaging plate 3 is embedded in the third circuit board layer 13 and is respectively in contact with the first circuit board layer 11 and the second circuit board layer 12. Through such a design, the power chip 2 laminating surface and the bottom plate of the entire circuit board can achieve a balanced distribution of heat through the large-area temperature averaging plate 3, thereby optimizing the heat dissipation performance of the circuit board.

[0035] In the embodiment of the present invention, the heat sink 4 is a fin-type heat sink. At the same time, in order to fix the heat sink 4, as shown in FIG. Figure 3 As shown, Figure 3 The embodiment of the present invention provides Figure 1 In the cross-sectional view of line AA in the three-dimensional structural schematic diagram of the embedded temperature equalizing plate assembly, the embedded temperature equalizing plate assembly 100 also includes a fixing screw 5, a threaded hole 41 is provided on the side where the heat sink 4 is in contact with the first circuit board layer 11, and fixing holes 6 are respectively provided at positions of the circuit board 1 and the temperature equalizing plate 3 corresponding to the threaded hole 41, and the fixing screw 5 passes through the fixing hole 6 along the direction of the third circuit board layer 13 toward the first circuit board layer 11 to form a threaded fixed connection with the threaded hole 41.

[0036] In the embodiment of the present invention, the temperature plate 3 is made based on the ECP (Electrochemical Plating) process, which is a process for depositing metallic copper on a semiconductor substrate by an electrochemical method. The temperature plate 3 in the embodiment of the present invention can be made of a high thermal conductivity material as a substrate and manufactured by the ECP process. The substrate material can be copper, stainless steel, titanium alloy, etc., all of which have good thermal conductivity.

[0037] Preferably, based on the structure of the embedded temperature vapor chamber assembly 100 provided in the embodiment of the present invention, the strength of the temperature vapor chamber 3 can be improved by designing a support structure in the body of the temperature vapor chamber 3. The thermal conductivity of the temperature vapor chamber 3 can be further improved by connecting the temperature vapor chamber 3 assembly to the ground terminal on the circuit board layer.

[0038] An embodiment of the present invention also provides an electronic device, which includes the embedded temperature vapor chamber assembly 100 as described in the above embodiment. It can be understood that the electronic device designed based on the embedded temperature vapor chamber assembly 100 provided in the embodiment of the present invention, based on the embedded design of the temperature vapor chamber 3 of the embedded temperature vapor chamber assembly 100, and the structure of the heat sink 4 to assist in heat dissipation, can achieve better heat dissipation performance, as described in the above embodiment, which will not be repeated here.

[0039] Compared with the related art, the embedded temperature-averaging board assembly of the present invention includes a circuit board, a power chip, a temperature-averaging board and a heat sink: the circuit board is a multi-layer circuit board, the circuit board includes a first circuit board layer for attaching the power chip, a second circuit board layer for serving as a bottom plate, and a third circuit board layer sandwiched between the first circuit board layer and the second circuit board layer; the temperature-averaging board is sandwiched between the first circuit board layer and the second circuit board layer, and is arranged in the same layer as the third circuit board layer, and the orthographic projection of the temperature-averaging board toward the first circuit board layer covers the power chip; the temperature-averaging board includes a closed cavity, a capillary structure arranged in the cavity and a phase-change liquid filled in the cavity; the heat sink is attached to the side of the first circuit board layer away from the third circuit board layer, and is at least attached to the surface of part of the power chip. In the above structure, the temperature-averaging board is embedded in the multi-layer circuit board, and the embedded design improves the overall thermal conductivity of the circuit board. On the basis of the integrated temperature-averaging board, the present invention also uses a heat sink to attach the power chip for auxiliary heat dissipation, which is more conducive to directly controlling the heat generation of the power chip on the circuit board. Compared with the related art, the heat dissipation performance of the embedded temperature-averaging board assembly of the present invention is better.

[0040] The above description is only an implementation mode of the present invention. It should be pointed out that, for ordinary technicians in this field, improvements can be made without departing from the creative concept of the present invention, but these all belong to the protection scope of the present invention.

Claims

1. An embedded temperature vapor chamber assembly, comprising a circuit board, a power chip, a temperature vapor chamber and a heat sink, characterized in that: The circuit board is a multi-layer circuit board, comprising a first circuit board layer for mounting the power chip, a second circuit board layer for serving as a base plate, and a third circuit board layer sandwiched between the first circuit board layer and the second circuit board layer; The temperature averaging plate is sandwiched between the first circuit board layer and the second circuit board layer and is arranged on the same layer as the third circuit board layer, and the orthographic projection of the temperature averaging plate toward the first circuit board layer covers the power chip; the temperature averaging plate includes a closed cavity, a capillary structure arranged in the cavity, and a phase change liquid filled in the cavity; The heat sink is attached to a side of the first circuit board layer away from the third circuit board layer and is in contact with at least a portion of the surface of the power chip.

2. The embedded temperature vapor chamber assembly according to claim 1, characterized in that: At least one first through hole is provided on the first circuit board layer, and at least one first protrusion structure is provided on a side of the temperature averaging plate close to the first circuit board layer. The first protrusion structure passes through the first through hole so that the temperature averaging plate is in contact with the heat sink.

3. The embedded temperature vapor chamber assembly according to claim 1, characterized in that: At least one second through hole is provided on the first circuit board layer, and at least one second protruding structure is provided on a side of the temperature spreader close to the first circuit board layer. The second protruding structure passes through the second through hole so that the temperature spreader is in contact with the power chip.

4. The embedded temperature vapor chamber assembly according to claim 1, characterized in that: The third circuit board layer is a double-layer structure; the temperature homogenizing plate is embedded in the third circuit board layer and is in contact with the first circuit board layer and the second circuit board layer respectively.

5. The embedded temperature vapor chamber assembly according to claim 1, characterized in that: The embedded temperature vapor chamber assembly also includes a fixing screw, a threaded hole is provided on the side of the heat sink that is in contact with the first circuit board layer, fixing holes are respectively provided at positions of the circuit board and the temperature vapor chamber corresponding to the threaded holes, and the fixing screw passes through the fixing hole along the direction from the third circuit board layer to the first circuit board layer and forms a threaded fixed connection with the threaded hole.

6. The embedded temperature vapor chamber assembly according to claim 1, characterized in that: The heat sink is a fin-type heat sink.

7. The embedded temperature vapor chamber assembly according to claim 1, characterized in that: The temperature homogenizing plate is made of copper, stainless steel or titanium alloy and is manufactured based on the ECP process.

8. The embedded temperature vapor chamber assembly according to claim 1, characterized in that: The temperature homogenizing plate is connected to a ground terminal on the first circuit board layer or the second circuit board layer.

9. The embedded temperature vapor chamber assembly according to claim 1, characterized in that: The temperature averaging plate is also provided with a support structure fixedly supported on the plate body of the temperature averaging plate.

10. An electronic device, characterized in that: The electronic device comprises the embedded temperature vapor chamber assembly according to any one of claims 1 to 9.

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