Electronic module and electronic timepiece

Abstract

An electronic module is provided with: a first circuit board having a first connection part on a first surface and a second connection part on a second surface opposite the first surface, the first connection part and the second connection part being electrically connected; a simulation block having a third connection portion connected to the first connection portion of the first circuit board; and a second circuit board having a fourth connection portion connected to the second connection portion of the first circuit board, the position of the first connection portion being different from the position of the second connection portion in plan view, the analog block having an opposing surface, and the analog block having a second connection portion connected to the second connection portion of the first circuit board. And an opposing surface that includes a range of at least a portion of the second connection portion and the fourth connection portion in plan view, is opposed to the first surface of the first circuit board, and has a protruding portion that protrudes toward the first circuit board side.

Description

Technical Field

[0001] The present disclosure relates to an electronic module and an electronic timepiece. Background Art

[0002] For example, as disclosed in Japanese Patent Publication No. 2018-9934, there is a technology used in the past to connect two circuit substrates in a watch. One circuit substrate is connected to the movement of the watch. A technology is disclosed in which the two circuit substrates arranged with a housing sandwiched therebetween are stably connected by an interconnector having elasticity and located inside the housing. Summary of the invention

[0003] The electronic module disclosed in the present invention has:

[0004] A first circuit substrate having a first connection portion on a first surface and a second connection portion on a second surface opposite to the first surface, wherein the first connection portion is electrically connected to the second connection portion;

[0005] an analog block having a third connection portion connected to the first connection portion of the first circuit substrate; and

[0006] a second circuit substrate having a fourth connection portion connected to the second connection portion of the first circuit substrate,

[0007] The position of the first connection portion is different from the position of the second connection portion in a top view.

[0008] The dummy block has a facing surface that includes at least a portion of the second connection portion and the fourth connection portion in a plan view and faces the first surface of the first circuit substrate, and has a protrusion that protrudes toward the first circuit substrate.

[0009] In addition, another electronic module disclosed herein has:

[0010] A first circuit substrate having a first connection portion on a first surface and a second connection portion on a second surface opposite to the first surface, wherein the first connection portion is electrically connected to the second connection portion;

[0011] an analog block having a third connection portion connected to the first connection portion of the first circuit substrate; and

[0012] a second circuit substrate having a fourth connection portion connected to the second connection portion of the first circuit substrate,

[0013] The position of the first connection portion is different from the position of the second connection portion in a top view.

[0014] The first circuit substrate has a light receiving element that detects light incident from the analog block side.

[0015] The second circuit board includes a control unit that executes processing based on a detection result of the light receiving element.

[0016] Further features of the present invention will become apparent from the following description of exemplary embodiments (with reference to the attached drawings). BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view of the electronic timepiece according to the first embodiment.

[0018] Figure 2 It is an exploded perspective view illustrating the structure of the electronic module according to the first embodiment.

[0019] Figure 3 It is a top view of the upper surface of the first circuit substrate and a bottom view of the lower surface.

[0020] Figure 4 This is a plan view of the upper surface of the second circuit substrate.

[0021] Figure 5 is a partial cross-sectional view of an electronic module including a protrusion.

[0022] Figure 6 This is a perspective view of the lower surface side of the second circuit substrate.

[0023] Figure 7 It is an exploded perspective view of each structure of the electronic module according to the second embodiment.

[0024] Figure 8 FIG. 1 is a partial cross-sectional view including a protrusion of the electronic module according to the second embodiment.

[0025] Fig. 9 It is a top view showing the upper surface of the first circuit substrate according to the modification. DETAILED DESCRIPTION

[0026] Hereinafter, embodiments of the present disclosure will be described based on the drawings.

[0027] [First embodiment]

[0028] Figure 1 It is a front view of the electronic timepiece 1 according to the first embodiment.

[0029] The electronic timepiece 1 includes a housing 2, a dial 52, a pointer 51, a bezel 11, pushbutton switches B1 to B3, a crown C1, and other operation receiving components for receiving external operations. On the dial 52, the pointer 51 is located at a position where it can rotate, and the content corresponding to the direction pointed by the pointer 51 is displayed. The display content of the pointer 51 includes the time (which may also be a date and time including the date, day of the week, etc.). The mark (time text 53) for indicating the displayed time is located on the dial 52.

[0030] Small windows 101 to 104 (dials) occupying a portion of the dial 52 are arranged. A portion of the pointer 51 rotates inside each of the small windows 101 to 104 to display the day of the week, the set time, the time of other cities in the world (including UTC), and 24 hours.

[0031] In addition, the dial 52 has an opening 54 at 6 o'clock. The date wheel 55 is located below the dial 52 (on the back side), and the number-shaped mark (date mark) corresponding to the date is selectively displayed from the opening 54 by the rotation of the date wheel 55. The date wheel 55 is located between two concentric circles with different radii, and the number-shaped part is supported by a support arm extending from the two concentric circles. Therefore, light is transmitted in the part other than the number-shaped part.

[0032] The housing 2 has a cylindrical shape with the upper and lower surfaces open, and has the above-mentioned pointer 51, date wheel 55, dial 52 and time characters 53 inside. In addition to the above, the housing 2 also accommodates a circuit unit 21 (see Figure 2 ) and simulation block 22 (refer to Figure 2 ) and other electronic modules 20 (refer to Figure 2 The circuit unit 21 includes a microcomputer 217 that controls the timing operation, the display operation of the pointer 51, etc. (see Figure 2 ). The analog block 22 includes a stepping motor that rotates the pointer 51 and the date wheel 55. The button switches B1 to B3 and the crown C1 protrude outward from the side of the housing 2. The electrical signals involved in these operations are transmitted to the internal circuit board through the housing 2. At the 12 o'clock and 6 o'clock directions of the housing 2, the mounting portion 2a of the strap extends to the outside of the housing 2 when viewed from above the display surface of the pointer 51. The housing 2 can be an insulating component such as resin, ceramic, or a metal component such as titanium. The lower end (back side) of the housing 2 is sealed by a back cover (not shown).

[0033] The upper part of the dial 52 and the pointer 51 (the upper end and the front side of the housing 2) is covered by a transparent windproof component, and the housing 2 is sealed. The periphery of the dial 52 is surrounded by the parting plate 6. Part or all of the time characters 53, etc. can also be fixed relative to the parting plate 6. The solar panel is located in a ring shape along the inner circumference of the parting plate 6 below the dial 52 and the date wheel 55. The outer frames of the small windows 101 to 104, the time characters 53, the date markings of the date wheel 55, etc., which have low light transmittance or are completely non-transparent, are located on a part of the light-receiving surface of the solar panel.

[0034] The bezel 11 is located at the periphery of the electronic timepiece 1. The bezel 11 may also have a mark indicated by the pointer 51. In addition, the bezel 11 is also used for decorative purposes. In addition, when the electronic timepiece 1 performs radio wave reception, communication, etc., it can also function as an antenna element.

[0035] Figure 2 It is an exploded perspective view for explaining the structure of the electronic module 20 according to the present embodiment.

[0036] The electronic module 20 includes a circuit unit 21 and an analog block 22. The circuit unit 21 receives power supply and performs operation control of the electronic timepiece 1. The analog block 22 is a collection of structures that generate analog signals according to operation input and output, or perform operations corresponding to input signals. The analog block 22 is located on the display surface side (upper side) of the electronic timepiece 1, and the circuit unit 21 is located below it (back side). The circuit unit 21 and the analog block 22 are fixed to each other by screws S, mainly small-sized nails, in an overlapping state. The type of screw S can be arbitrarily determined according to the required strength, space, etc.

[0037] Various structures of the analog block 22 are fixed to the support member 220. The analog block 22 may include, for example, a stepping motor for rotating the pointer 51, an operation detection mechanism 22e for the pushbutton switches B1 to B3, an operation detection mechanism 22d for the crown C1, a lighting operation unit for an LED lamp, a vibration motor for notifying an operation, a buzzer sound generating unit, or some or all of the above structures. The operation detection mechanisms 22d, 22e, etc. may also use a conventionally known structure for detecting a pressing operation or a rotating operation.

[0038] The motor connection terminal 22a, the detection unit connection terminal 22b, and the solar cell connection terminal (not shown) are located on the first circuit substrate 211 side of the circuit unit 21 in the simulation block 22, i.e., on the lower surface. These connection terminals 22a, 22b, the solar cell connection terminals, and the operation detection mechanisms 22d, 22e, etc. correspond to the third connection portion of this embodiment. In addition, the support member 220 of the simulation block 22 has an opposing surface 221f that is opposite to the upper surface 211T of the first circuit substrate 211, and has a protrusion 221 that protrudes toward the first circuit substrate 211 side. The hole portion 221h (see Figure 5 ) As described later, the plurality of positions, here six positions, are located on the opposite surface 221f. The support 222 further protruding from the opposite surface 221f is located inside the hole 221h. The screw S mentioned above is screwed into the support 222 to fix the circuit part 21 and the simulation block 22. The protrusion 221 can also be connected to the plurality of support 222 in common. Figure 2 The four struts 222 shown are located on opposite sides 221 f of the common protrusion 221 .

[0039] The circuit unit 21 has a first circuit substrate 211 and a second circuit substrate 213. The second circuit substrate 213 is a common substrate that performs the same operation as a conventional control substrate. On the second circuit substrate 213, electronic components such as a microcomputer 217 (control unit) having a CPU (Central Processing Unit) and a RAM (Random Access Memory), a memory such as a flash memory, and a module for controlling wireless communication are located on the lower surface 213B side. In addition, a battery storage section 213c for storing batteries inserted from the insertion port E side is located approximately in the center of the lower surface 213B of the second circuit substrate 213. The upper surface 213T of the second circuit substrate 213 is opposite to the lower surface 211B of the first circuit substrate 211.

[0040] The second circuit substrate 213 may be a laminated substrate or a double-sided substrate, depending on the required wiring patterning, etc. The first circuit substrate 211 may also be a double-sided substrate thinner than the second circuit substrate 213. In particular, the first circuit substrate 211 may be as thin as possible. Thus, the increase in thickness of the electronic timepiece 1 caused by the thickness of the additional first circuit substrate 211 is reduced compared to the second circuit substrate 213, which is likely to have the same thickness as before. Accordingly, the materials of the base materials of the first circuit substrate 211 and the second circuit substrate 213 do not have to be the same.

[0041] The second circuit substrate 213, the first circuit substrate 211, and the simulation block 22 are aligned by using the support 222, the first through hole 211h, and the second through hole 213h. In the aligned state, the screw S is screwed into the hole of the support 222 to fix the second circuit substrate 213, the first circuit substrate 211, and the simulation block 22. In the fixed state, the head of the screw S is located inside the second through hole 213h and does not protrude from the lower surface 213B (fourth surface) of the second circuit substrate 213.

[0042] Figure 3 (a) is a plan view of the upper surface 211T of each of the first circuit substrates 211. Figure 3 (b) is a bottom view of the lower surface 211B.

[0043] Figure 3 The upper surface 211T (first surface) shown in (a) is the surface facing the analog block 22. The connection pad 211a of the stepping motor, the phototransistor 216 (light receiving element; the outer frame is indicated by a dotted line) for detecting the pointer and its connection pad 211b, the connection pad 211c of the solar panel, the operation detection unit 211d of the push button switches B1 to B3, and the operation detection unit 211e of the crown C1 are located on the upper surface 211T. The signal wiring extends from the above-mentioned connection pads 211a, 211b, 211c and the operation detection units 211d, 211e to the through holes connecting the upper surface side and the lower surface side of the first circuit substrate 211, respectively.

[0044] The top view positions of these connection pads 211a, 211c and operation detection parts 211d, 211e are connected to each other corresponding to the positions of the connection terminal 22a of the motor in the analog block 22, the connection terminal of the solar cell, the operation detection mechanism 22d of the crown C1, and the operation detection mechanism 22e of the push-button switches B1 to B3. The connection mentioned here does not mean a fixed connection based on a joining component, etc. It is sufficient as long as there is at least contact in a state of reliable electrical connection. On the other hand, the connection between the connection terminal and the connection pad may also have a fitting portion corresponding to a concave and convex portion, etc. These connection pads 211a to 211c, the operation detection parts 211d, 211e, and the connection pads of the connection terminal of the solar cell correspond to the first connection part of the present embodiment. The top view positions of these third connection parts and the first connection part can be designed and changed according to each model of the electronic watch.

[0045] In the simulation block 22, a through hole is located at a position overlapping with the phototransistor 216 when viewed from above. The through hole allows external light from the display surface side to pass through. The gear that further transmits the rotation of the stepping motor to the pointer 51 is located at a top-view position of the through hole. When the gear having a through hole rotates and the through hole of the gear overlaps with the top-view position of the through hole of the simulation block 22, external light reaches the phototransistor 216 and the detected light amount increases. Thus, the position of the pointer 51 corresponding to the rotation angle of the gear is determined. In addition, the multiple gears that transmit rotation to a certain pointer 51 may also have through holes respectively. In the case where all of these multiple through holes overlap with the through holes of the simulation block when viewed from above, external light can also reach the phototransistor 216.

[0046] In addition, the through hole of the analog block 22 corresponding to one of the phototransistors 216 may also be located at a position that does not overlap with the gear when viewed from above. The phototransistor 216 detects the amount of external light that is not blocked by the gear and enters from the display surface side. As a threshold for the other phototransistors 216 to detect external light, the light amount or a value lower than the light amount may also be set. That is, when the other phototransistor 216 detects external light with an amount greater than the threshold, it is determined that the corresponding pointer is located at the detection position of the phototransistor 216.

[0047] The phototransistor 216 that detects external light without being blocked by gears, etc. can also be used to detect nighttime, dark indoors, etc. In the case where the amount of light detected by the phototransistor 216 is smaller than the reference value for a certain period of time, it can also be determined that it is at nighttime or in a drawer, etc. In this case, the electronic clock 1 can also automatically shift to a sleep mode that limits movement and power consumption. In the sleep mode, for example, the operation of the second hand can be stopped, or the communication action can be stopped. Regarding the automatic transition to the sleep mode (automatic sleep function), in addition to the external light detection based on the phototransistor 216, motion detection based on an acceleration sensor, etc. can also be used as a reference.

[0048] Figure 3 The lower surface 211B (second surface) shown in (b) is the surface of the first circuit substrate 211 on the opposite side of the upper surface 211T, and is the surface opposite to the second circuit substrate 213. The positions of the through holes are the same on the upper surface 211T and the lower surface 211B. The second connection pad 32 (second connection portion) for transmitting and receiving signals between the first connection portion of the upper surface 211T and the second circuit substrate 213 and the third connection portion is located on the lower surface 211B. The through hole and the second connection pad 32 are electrically connected by signal wiring. The pattern of the signal wiring can also be appropriately designed regardless of a specific pattern, etc.

[0049] The second connection pads 32 are arranged in groups according to the plurality of groups. For example, in the four second connection pad groups 32a, the second connection pads 32 are arranged in a ring shape at approximately equal angle intervals in eight directions relative to the center position of the first through hole 211h. In the other two second connection pad groups 32b, the second connection pads 32 are arranged in an arc shape at approximately equal angle intervals in six directions except two directions out of the eight directions relative to the center position of the first through hole 211h. That is, the position of the second connection pad 32 is different from the position of the first connection portion in a top perspective view.

[0050] The first circuit substrate 211 has a threaded hole 211j for fixing the stepper motor and a hole portion 211k, the hole portion 211k being used to prevent the protruding portion of the fixed stepper motor, here the coil portion, from contacting the first circuit substrate 211. If the stepper motor is directly fixed to the first circuit substrate 211, the coil portion of the stepper motor protrudes to a position intersecting with a plane including the upper surface 211T of the first circuit substrate 211. In contrast, the hole portion 211k of the first circuit substrate 211 is located at a position where the coil portion of the stepper motor intersects with a plane including the upper surface 211T of the first circuit substrate 211 when the stepper motor is directly stopped. Therefore, the electronic module 20 can fix the stepper motor directly to the first circuit substrate 211 and prevent the coil portion of the stepper motor from contacting the first circuit substrate 211. At the stage where the stepper motor is fixed to the first circuit substrate 211, an inspection is performed to see whether the stepper motor rotates the gear normally. In this inspection, a hole for visually confirming the rotation of the gear between the first circuit substrate 211 and the supporting member of the dummy block 22 serves as a detection hole 211q.

[0051] When the first circuit substrate 211 is assembled and fixed to the electronic module 20, the positioning pin is inserted into the positioning hole 211p and aligned with other components. Thus, easy and accurate alignment can be performed. In addition, when the analog block 22 is flexed when the pointer 51 is assembled and fixed to the analog block 22, the through hole 211m is located at a position where the analog block 22 can contact the first circuit substrate 211. Therefore, when assembling and manufacturing the electronic module 20, it is difficult to cause a fault such as the analog block 22 being damaged by contact with the first circuit substrate 211.

[0052] These holes, namely the threaded hole 211j, the hole portion 211k, the detection hole 211q, the positioning hole 211p, and the through hole 211m, are all located at positions corresponding to the structure of the analog block 22. That is, when the analog block 22 is changed, the formation positions of these holes also need to be changed corresponding to the analog block 22. These holes are all located in the first circuit substrate 211, so that, for example, even when the position of the stepping motor of the analog block 22 is changed, it is sufficient to change the positions of the holes of the first circuit substrate 211 accordingly.

[0053] On the contrary, when at least a part of these holes are located in the second circuit substrate 213, it is necessary to change the position of the holes of the second circuit substrate 213 along with the change of the analog block 22. Therefore, the second circuit substrate 213 is not a common substrate. Alternatively, if the position of the stepper motor of the analog block 22 is limited in a manner consistent with the position of the holes located in the common substrate, that is, the second circuit substrate 213, the design freedom of the second circuit substrate 213 and the analog block 22 is reduced.

[0054] Figure 4 It is a plan view of the upper surface 213T of the second circuit substrate 213 .

[0055] The fourth connection pad 34 (fourth connection portion) is located on the upper surface 213T (third surface) of the second circuit substrate 213. The fourth connection pad 34 includes a fourth connection pad group 34a that overlaps with the position of the second connection pad group 32a in the lower surface 211B of the first circuit substrate 211 when viewed from above, and a fourth connection pad group 34b that overlaps with the second connection pad group 32b. Therefore, by aligning the first circuit substrate 211 and the second circuit substrate 213 and fastening them with screws, the fourth connection pad 34 is electrically connected to the corresponding second connection pad 32, respectively. That is, the first circuit substrate 211 and the second circuit substrate 213 are fastened by screws S, so that the second connection pad 32 and the fourth connection pad 34 are easily and reliably connected.

[0056] Furthermore, at least a portion of the second connection pads 32 and the fourth connection pads 34 overlap with the range of the protrusion 221 of the simulation block 22 in a plan view. That is, when the screws are tightened, the first circuit substrate 211 and the second circuit substrate 213 are supported from below by the protrusion 221 having high local rigidity and strength relative to the insertion direction of the screw S, that is, the up-down direction. Thus, the fourth connection pads 34 and the second connection pads 32 can be reliably pressed.

[0057] Furthermore, the first circuit board 211 and the second circuit board 213 do not necessarily have to have the same plan view shape. As required, any plan view shape may be partially protruding or recessed relative to the other plan view shape.

[0058] Figure 5 2 is a partial cross-sectional view of the electronic module 20 including one protrusion 221. In this figure, the screw S is omitted.

[0059] As described above, the analog block 22 and the circuit part 21 of the electronic module 20 are located in overlapping positions. The protrusion 221 that protrudes relatively toward the first circuit substrate 211 side in the support member 220 of the analog block 22 is opposite to and in contact with the first circuit substrate 211 at the opposite surface 221f. The protrusion 221 has a hole 221h. The support 222 is located inside the hole 221h. The support 222 has a threaded hole 222h extending from its lower end inside along the extension direction. The inner wall surface of the threaded hole 222h has a threaded groove to engage with the screw S.

[0060] The support 222 passes through the first through hole 211h of the first circuit substrate 211. In addition, the support 222 is partially inserted into the second through hole 213h of the second circuit substrate 213. As a result, it is easy to align the support 222 with the first circuit substrate 211 and the second circuit substrate 213. In addition, a space where the support 222 is not inserted remains at the lower part of the second through hole 213h, so that the portion of the head of the screw S protruding from the lower part of the second circuit substrate 213 is reduced.

[0061] In addition, if Figure 3 as well as Figure 4 As shown, the multiple positions where the first circuit substrate 211, the second circuit substrate 213, and the simulation block 22 are fixed by screws S can also be roughly evenly distributed. Here, the positions of the second through holes 213h in the six locations are arranged in a regular polygon or ring shape slightly closer to the edge than the middle between the center and the edge of the second circuit substrate 213 when viewed from above. As described above, the top view position of the second through hole 213h also corresponds to the position of the first through hole 211h and the position of the protrusion 221. Therefore, the pressure applied to the first circuit substrate 211 and the second circuit substrate 213 when tightening the screws is roughly evenly distributed, and the deformation and damage of the first circuit substrate 211 and the second circuit substrate 213 are reduced.

[0062] In this way, the first circuit substrate 211 is a relay substrate through which signals pass when signals are exchanged between the second circuit substrate 213 and the analog block 22. At this time, the first connection portion in the upper surface 211T of the first circuit substrate 211 corresponds to the position of the third connection portion in the analog block 22. At the same time, the position of the second connection pad 32 on the lower surface 211B of the first circuit substrate 211 corresponds to the position of the fourth connection pad 34 on the upper surface 213T of the second circuit substrate 213. That is, even if the position and number of each part in the analog block 22 are changed, as long as the position of the first connection portion on the upper surface 211T of the first circuit substrate 211 and the pattern of the signal wiring are changed, the second circuit substrate 213 can continue to be used as it is.

[0063] Figure 6 It is a perspective view of the lower surface 213B of the second circuit substrate 213 .

[0064] The stereogram is from Figure 2 213c, i.e., the side of the insertion port E. In the battery storage section 213c, the battery is installed and removed in the direction along the second circuit substrate 213 via the insertion port E. That is, the direction of the battery installation and removal is the direction indicated by the thick arrow. The battery inserted into the battery storage section 213c is fixed by a leaf spring 213cs. The battery has, for example, a button-shaped shape, and can be a dry cell or a secondary cell. In the electronic module 20, electronic components protruding in the height direction from the lower surface 213B are not located in a range that hinders the insertion and removal of the battery via the insertion port E. For example, an inspection pad P used for inspection during manufacturing inspection can also be arranged in this part. By locating the upper surface (exposed surface) of the inspection pad P at approximately the same position as the lower surface 213B of the second circuit substrate 213, it is possible to avoid hindering the insertion and removal of the battery via the insertion port E.

[0065] [Second embodiment]

[0066] Next, an electronic module 20a according to a second embodiment will be described.

[0067] Figure 7 It is an exploded perspective view of each structure of the electronic module 20a.

[0068] The electronic module 20 a of the second embodiment includes a spacer 212 and an interconnector 214 between a first circuit substrate 211 and a second circuit substrate 213 .

[0069] The spacer 212 is an insulating film that separates the first circuit substrate 211 and the second circuit substrate 213 in a manner that makes it difficult for a short circuit to occur. In addition, the spacer 212 also serves as a buffer component for the protruding portion of the opposing surfaces of the first circuit substrate 211 and the second circuit substrate 213. When the first circuit substrate 211 and the second circuit substrate 213 are fastened by screws, if there is a concave-convex between the opposing lower surface 211B and the upper surface 213T, a more localized stress is applied to the protruding portion. Due to this stress, the first circuit substrate 211 and the second circuit substrate 213 are easily damaged. The spacer 212 relieves such stress and reduces the occurrence of damage.

[0070] The spacer 212 has a first through hole 211h, a second through hole 213h, and a through hole 212h including a pillar 222 in a top view. The through hole 212h is wider than the second through hole 213h of the second circuit substrate 213 when viewed from above. The ring-shaped interconnector 214 is located in the through hole 212h. That is, the interconnector 214 is located between the second connection pad 32 and the fourth connection pad 34. As described above, the interconnector 214 does not make the second connection pads 32 arranged in a ring shape with the pillar 222 as the center and the fourth connection pads 34 conductive to each other. On the other hand, the interconnector 214 has anisotropic conductivity in a manner that is conductive between the relative second connection pads 32 and the fourth connection pads 34. The thickness of the interconnector 214 is the same as the thickness of the spacer 212, so that the second connection pad 32 and the fourth connection pad 34 are easily and reliably contacted and conductive.

[0071] Figure 8 1 is a partial cross-sectional view of the electronic module 20 a according to the second embodiment, including one protrusion 221 .

[0072] As described above, the thickness of the spacer 212 is substantially the same as the thickness of the interconnector 214 , and a layer having substantially uniform thickness is obtained between the first circuit substrate 211 and the second circuit substrate 213 .

[0073] The support 222 passes through the first through hole 211h of the first circuit substrate 211 and the approximately central hole portion of the interconnector 214, and extends into the second through hole 213h of the second circuit substrate 213. Thus, the interconnector 214 is properly aligned with respect to the first circuit substrate 211 and the second circuit substrate 213. Alignment marks (marks) and the like may also be used for alignment of the interconnector 214 in the rotational direction within the surface of the spacer 212. The alignment marks may also be located, for example, on the support 222, the first circuit substrate 211 or the spacer 212, and the interconnector 214, respectively.

[0074] Fig. 9 1 is a plan view showing an upper surface 213Ta of the second circuit substrate 213 according to a modification.

[0075] The fourth connection pads 34 may also be arranged, for example, between two protrusions 221. For example, the fourth connection pads 34 are in a two-dimensional matrix when viewed from above, and are arranged in a strip shape here. According to the arrangement of the fourth connection pads 34, the positions of the second connection pads on the lower surface (fourth surface) of the second circuit substrate 213 are also in a two-dimensional matrix, i.e., strip shape, when viewed from above.

[0076] like Figure 2As shown, in the portion where the fourth connection pads 34 are arranged, the support member 220 of the simulation block 22 is thickened in a strip shape to connect the pillars 222 on both sides. Therefore, even in such a position of the fourth connection pads 34, the deformation and damage of the first circuit substrate 211 and the second circuit substrate 213 can be reduced by screwing. By screwing the two ends of the arrangement of the fourth connection pads 34, the second connection pads 32 and the fourth connection pads 34 can be reliably connected.

[0077] As described above, the electronic module 20, 20a of the present embodiment includes a first circuit substrate 211, a simulation block 22, and a second circuit substrate 213. The first circuit substrate 211 has a first connection portion on the upper surface 211T (first surface), and has a second connection pad 32 on the lower surface 211B on the opposite side of the upper surface 211T, and the first connection portion is electrically connected to the second connection pad 32. The simulation block 22 has a third connection portion, which is connected to the first connection portion of the first circuit substrate 211. The second circuit substrate 213 has a fourth connection pad 34, which is connected to the second connection pad 32 of the first circuit substrate 211. The position of the first connection portion is different from the position of the second connection pad 32 in a top perspective view. The simulation block 22 has a relative surface 221f, and the relative surface 221f has a protrusion 221 protruding toward the first circuit substrate 211 side. The facing surface 221f includes at least a portion of the second connection pad 32 and the fourth connection pad 34 in a plan view, and faces the upper surface 211T of the first circuit substrate 211. The facing surface 221f has a protrusion protruding toward the first circuit substrate.

[0078] According to the content disclosed in the aforementioned Japanese Patent Laid-Open No. 2018-9934, it is sometimes necessary to redesign the substrate according to the change of the analog block possessed by the electronic device. At this time, if all substrates are redesigned, the man-hours and costs of each model of the product will increase.

[0079] Such electronic modules 20 and 20a can change the design of the first circuit substrate 211 according to the position and number of peripheral devices such as motors and light receiving elements in the analog block 22. On the other hand, by making the positional relationship between the lower surface 211B of the first circuit substrate 211 and the second circuit substrate 213 consistent, it is not necessary to change the second circuit substrate 213 every time when the design is changed. Therefore, the effort and cost corresponding to the change of the analog block of each model such as the design change and model change of the degree controlled by the same microcomputer 217 are reduced. Therefore, the electronic modules 20 and 20a can suppress the increase of cost and man-hours, and can cope with the change of the analog block.

[0080] In addition, the electronic module 20 has a plurality of second connection pads 32. The second connection pads 32 may also be divided into a plurality of groups and arranged in plurality.

[0081] That is, when the circuit unit 21 and the analog block 22 are fixed, a plurality of second connection pads 32 may be concentratedly arranged on the surface stably supported by the protrusion 221. Thus, in the electronic module 20, the second connection pads 32 and the fourth connection pads 34 are reliably in contact and easily conductive.

[0082] In addition, the first circuit substrate 211 may have a first through hole 211h, and the second circuit substrate 213 may have a second through hole 213h. The simulation block 22 may have a pillar 222 extending from the opposite surface 221f. The pillar 222 is inserted into the first through hole 211h and the second through hole 213h. Thus, the simulation block 22 having the pillar 222 is easily and accurately aligned with the first circuit substrate 211 and the second circuit substrate 213 having the first through hole 211h and the second through hole 213h, respectively. Therefore, the work spent on fixing these simulation blocks 22, the first circuit substrate 211, and the second circuit substrate 213 becomes simple, and positional deviation can also be reduced.

[0083] In addition, the support 222 may also have a threaded hole 222h along the extension direction. The first circuit substrate 211, the second circuit substrate 213, and the simulation block 22 can be fixed to each other by screws S screwed into the threaded holes 222h. In this way, the simulation block 22, the first circuit substrate 211, and the second circuit substrate 213 are fixed by screws S at the aligned position, so that the positional deviation can be reduced more reliably and the electronic module 20 can be fixed.

[0084] In addition, the first circuit substrate 211 has a plurality of second connection pads 32. The plurality of second connection pads 32 may also be arranged in a ring or arc shape around the first through hole 211h. The second connection pads 32 are evenly arranged in radial positions relative to the central axis, so that the force applied when fixing them is easy to become equal. Therefore, the electronic module 20, 20a can reduce the occurrence of poor conduction between the second connection pad 32 and the fourth connection pad 34, or deformation and damage caused by excessive force.

[0085] Alternatively, the protrusion 221 may also connect and extend the two pillars 222 in a plan view. The first circuit substrate 211 has a plurality of second connection pads 32 , which may also be arranged in a line or strip along the protrusion 221 .

[0086] Even with such an arrangement of the protrusion 221 and the second connection pad 32 , the conduction between the second connection pad 32 and the fourth connection pad 34 can be appropriately ensured by fastening with screws using the support columns 222 at both ends.

[0087] In addition, the electronic module 20a may also have an interconnector 214 between the second connection pad 32 of the first circuit substrate 211 and the fourth connection pad 34 of the second circuit substrate 213. In particular, when there are bumps and depressions between the first circuit substrate 211 and the second circuit substrate 213 due to the head of the screw, etc., a space is provided around them. Therefore, the increase in local stress on the first circuit substrate 211 and the second circuit substrate 213 is reduced. As a result, the first circuit substrate 211 and the second circuit substrate 213 are fixed more stably. In addition, the second connection pad 32 and the fourth connection pad 34 are more stably bonded and conductive.

[0088] In addition, the simulation block 22 has a plurality of pillars 222. The pillars 222 can also be arranged in a dispersed manner. The parts that stably support the connection between the second connection pad 32 and the fourth connection pad 34 are dispersed, so that the stress distribution between the first circuit substrate 211 and the second circuit substrate 213 will not be offset. Therefore, the electronic module 20, 20a reduces deformation or damage during fixed assembly.

[0089] In addition, the plurality of pillars 222 may be located in a ring shape between the center and the edge of the second circuit substrate 213 in a top perspective view. The first circuit substrate 211 and the second circuit substrate 213 are supported at a position not too close to the center or the edge (screw fastening). As a result, floating is unlikely to occur between the first circuit substrate 211 and the second circuit substrate 213, and the second connection pad 32 and the fourth connection pad 34 are more reliably connected.

[0090] The electronic module 20 may also include a battery storage portion 213c located on the lower surface 213B of the second circuit board 213 opposite to the upper surface 213T where the third connection pads 33 are located. The structure of storing batteries on the bottom side of the electronic module 20 makes it easy to install batteries in the electronic timepiece 1.

[0091] In addition, the battery storage portion 213c has an insertion port E through which the battery can be inserted and removed in a certain direction along the lower surface 213B. The electronic components protruding from the lower surface 213B are not located in a range that hinders the insertion and removal of the battery through the insertion port E. Thus, the battery can be easily removed and installed. In addition, the electronic timepiece 1 can reduce the possibility of damaging the components on the second circuit substrate 213 when removing and installing the battery.

[0092] Alternatively, the electronic module 20 of the present embodiment includes a first circuit substrate 211, a simulation block 22, and a second circuit substrate 213. The first circuit substrate 211 has a first connection portion on an upper surface 211T (first surface), and has a second connection pad 32 on a lower surface 211B on the opposite side of the upper surface 211T, and the first connection portion is electrically connected to the second connection pad 32. The simulation block 22 has a third connection portion, which is connected to the first connection portion of the first circuit substrate 211. The second circuit substrate 213 has a fourth connection pad 34, which is connected to the second connection pad 32 of the first circuit substrate 211. The position of the first connection portion is different from the position of the second connection pad 32 in a top perspective. The first circuit substrate 211 may also have a phototransistor 216 that detects light incident from the simulation block 22 side. At this time, the second circuit substrate 213 has a microcomputer 217 that performs processing based on the detection result of the phototransistor 216.

[0093] That is, the electronic component, i.e., the phototransistor 216, is directly fixed to the circuit substrate. Since the directly fixed circuit substrate is the first circuit substrate 211, there is no need to adjust its quantity and position on the common substrate, i.e., the second circuit substrate 213 side. In other words, the phototransistor 216 is located on the first circuit substrate 211 designed separately, so that the degree of freedom of configuration of the phototransistor 216 is improved. In addition, the phototransistor 216 is located on the first circuit substrate 211 closer to the analog block 22 or even the display surface than the second circuit substrate 213. As a result, the electronic timepiece 1 can reduce the loss of incident light and improve the detection sensitivity. Furthermore, in addition to the first circuit substrate 211 and the second circuit substrate 213, there is no need to prepare a substrate for directly fixing the phototransistor 216. Therefore, the electronic module 20 can suppress the increase in man-hours and costs for each model of the product, and can cope with changes in the analog block.

[0094] In addition, the electronic timepiece 1 of this embodiment includes the above-mentioned electronic module 20. The performance of such an electronic timepiece 1 does not change significantly, but the effort and cost of developing models with slightly different functions and designs are reduced. Therefore, it is possible to carry out product development of multiple models more quickly and at a lower cost than before.

[0095] In addition, the present invention is not limited to the above-mentioned embodiment, and various modifications can be made.

[0096] For example, the second connection pads 32 and the fourth connection pads 34 may not be located around the plurality of groups of protrusions 221. Alternatively, the groups of second connection pads 32 and fourth connection pads 34 may be arranged in one-to-one correspondence with the plurality of protrusions 221, respectively.

[0097] On the other hand, the plurality of groups of second connection pads 32 and fourth connection pads 34 corresponding to a certain protrusion 221 may be grouped together to connect to the same type of structure in the analog block 22. Alternatively, the combination of the second connection pads 32 and the fourth connection pads 34 may be randomly arranged.

[0098] In addition, the shape of the second through hole 213h may have a structure suitable for screw fastening, such as a stepped structure.

[0099] In the above description, the support 222 has a length sufficient to be inserted into the first through hole 211h and the second through hole 213h, but the present invention is not limited thereto. As long as the alignment can be easily performed by other methods, the support 222 may be shorter than the length of the first through hole 211h, that is, the thickness of the first circuit substrate 211. In addition, the height of only a portion of the plurality of support pillars 222 may be longer than the thickness of the first circuit substrate 211.

[0100] In addition, in the above description, the protrusion 221 in which the pillar 222 is completely extended to the position corresponding to the second connection pad 32 is described, but the present invention is not limited thereto. The protrusion 221 having the pillar 222 and being screwed and the protrusion 221 not having the pillar 222 and not being screwed may also exist in a mixed state. In this case, the position of the screw S may be determined to a degree that the conduction between the second connection pad 32 and the fourth connection pad 34 does not cause any problem.

[0101] In addition, in the above, in the above-mentioned first embodiment, the second connection pads 32 are arranged in a ring or arc shape in a top view, but are not limited to this. They can be arranged in a frame shape, or they can be arranged at dispersed angle intervals according to the number of second connection pads 32. In addition, correspondingly, the protrusion 221 may not be a circle in a top view, but a rectangular shape, etc. On the other hand, in a modified example, the fourth connection pad 34, that is, the second connection pad 32 is arranged in a strip shape, but are not limited to this. The fourth connection pad 34 may also be arranged in a row on a straight line. Alternatively, it may be an arrangement that is missing from the two-dimensional matrix. When the fourth connection pad 34 and the second connection pad 32 are completely arranged in two dimensions, it is sometimes difficult to properly set the pattern of the signal wiring. Therefore, the points required to obtain the appropriate pattern of the signal wiring may also be an arrangement without the fourth connection pad 34 and the second connection pad 32.

[0102] In addition, the support column 222 may not penetrate the protrusion 221 and extend further downward. The support column 222 may be overlapped on the protrusion 221. In this case, the screw hole 222h may extend across the protrusion 221 and the support column 222.

[0103] In the above description, the pillars 222 are arranged in a ring shape (hexagonal shape) in a plan view, but the present invention is not limited thereto. For example, when the plan view shape of the circuit portion 21 is not isotropic, the pillars 222 may be arranged dispersedly according to the concavity and convexity thereof.

[0104] In the above description, the phototransistor 216 is used for detecting the position of the pointer 51 and determining the transition to the sleep mode, but it may be used for either of the two purposes. Alternatively, the phototransistor 216 may be used for other purposes.

[0105] Furthermore, the above disclosure is also useful in the case where a plurality of designs are developed in particular in small portable electronic devices other than the electronic timepiece 1 .

[0106] In addition, the specific structures, configurations, signal wiring connections, functions, and operation contents shown in the above embodiments can be appropriately changed without departing from the gist of the present invention. The scope of the present invention includes the scope of the invention described in the claims and their equivalents.

[0107] This application claims priority from Japanese Patent Application No. 2023-178124 filed on October 16, 2023, the entire contents of which are incorporated herein by reference.

Claims

1. An electronic module, characterized in that: have: A first circuit substrate having a first connection portion on a first surface and a second connection portion on a second surface opposite to the first surface, wherein the first connection portion is electrically connected to the second connection portion; an analog block having a third connection portion connected to the first connection portion of the first circuit substrate; and a second circuit substrate having a fourth connection portion connected to the second connection portion of the first circuit substrate, The position of the first connection portion is different from the position of the second connection portion in a top view. The dummy block has a facing surface that includes at least a portion of the second connection portion and the fourth connection portion in a plan view and faces the first surface of the first circuit substrate, and has a protrusion that protrudes toward the first circuit substrate.

2. The electronic module according to claim 1, characterized in that: having a plurality of the second connecting parts, The second connection parts are divided into a plurality of groups and a plurality of groups are arranged in each group.

3. The electronic module according to claim 2, characterized in that: An interconnector is provided between the second connection portion of the first circuit substrate and the fourth connection portion of the second circuit substrate.

4. The electronic module according to any one of claims 1 to 3, characterized in that: The first circuit substrate has a first through hole, The second circuit substrate has a second through hole, The simulation block has pillars extending from the opposite faces, The support column is inserted into the first through hole and the second through hole.

5. The electronic module according to claim 4, characterized in that: The pillar has a threaded hole along the extension direction. The first circuit substrate, the second circuit substrate, and the dummy block are fixed to each other by screws screwed into the threaded holes.

6. The electronic module according to claim 4 or 5, characterized in that: The first circuit substrate has a plurality of the second connecting portions. The plurality of second connection portions are arranged in a ring shape or an arc shape around the first through hole.

7. The electronic module according to any one of claims 4 to 6, characterized in that: The simulation block has a plurality of the pillars, The plurality of pillars are dispersedly located in a ring shape between the center and the edge of the second circuit substrate in a plan view.

8. The electronic module according to any one of claims 1 to 7, characterized in that: A storage portion for a storage battery is provided, the storage portion for the storage battery is located on a fourth surface of the second circuit substrate which is opposite to the third surface where the third connection portion is located, The storage portion has an insertion port for inserting and removing the battery in a direction along the fourth surface. The electronic component protruding from the fourth surface is not located in a range that hinders insertion and removal of the battery through the insertion port.

9. The electronic module according to claim 1, characterized in that: The position of the first connection portion is different from the position of the second connection portion in a top view. The first circuit substrate has a light receiving element that detects light incident from the analog block side. The second circuit board includes a control unit that executes processing based on a detection result of the light receiving element.

10. An electronic module, characterized in that: have: A first circuit substrate having a first connection portion on a first surface and a second connection portion on a second surface opposite to the first surface, wherein the first connection portion is electrically connected to the second connection portion; an analog block having a third connection portion connected to the first connection portion of the first circuit substrate; and a second circuit substrate having a fourth connection portion connected to the second connection portion of the first circuit substrate, The position of the first connection portion is different from the position of the second connection portion in a top view. The first circuit substrate has a light receiving element that detects light incident from the analog block side. The second circuit board includes a control unit that executes processing based on a detection result of the light receiving element.

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