Multilayer ceramic electronic component

Abstract

The present disclosure provides a multilayer ceramic electronic component comprising: a ceramic body, the first surface and the second surface are opposite to each other in a first direction, the third surface and the fourth surface are opposite to each other in a second direction perpendicular to the first direction, and the fifth surface and the sixth surface are opposite to each other in a third direction perpendicular to the first direction and the second direction. A second electrode disposed in the third direction and including a plurality of dielectric layers and first and second internal electrodes alternately disposed in the third direction, and the dielectric layers being interposed between the first and second internal electrodes; a first external electrode connected to the first internal electrode and including a first conductive layer including a first groove in a surface and a first plating layer disposed on the first conductive layer; and the first coating part is arranged in the first groove and is in contact with the first plating layer.

Description

Technical Field

[0001] The present disclosure relates to a multilayer ceramic electronic component. Background Art

[0002] In recent years, the application fields of electronic products have expanded, and therefore the technical fields using multilayer ceramic electronic components have also expanded. In particular, with the electrification of vehicles, the electronic control unit (ECU) or transmission control unit (TCU) of the vehicle is set in the engine room, or directly attached to the transmission, etc.

[0003] Therefore, the multilayer ceramic electronic components are also required to have changed performance, and the multilayer ceramic electronic components applied to vehicles are required to have high reliability, high heat resistance, and the like.

[0004] In order to improve the moisture resistance reliability of multilayer ceramic electronic components, a method of blocking the moisture penetration path by coating the ceramic body can be used. However, in this case, since most of the coating material is an insulating material, non-plating may occur later. Therefore, it is necessary to develop a structure with improved moisture resistance reliability while preventing non-plating. Summary of the invention

[0005] The present disclosure is directed to providing a multilayer ceramic electronic component having improved moisture resistance reliability while preventing non-plating defects of a plating layer on a coating portion.

[0006] However, the problems to be solved by the embodiments of the present disclosure are not limited to the above-mentioned problems, and various extensions can be made within the scope of the spirit of the present disclosure.

[0007] According to an embodiment, a multilayer ceramic electronic component includes: a ceramic body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first direction and the second direction, and including a plurality of dielectric layers and a first internal electrode and a second internal electrode, the first internal electrode and the second internal electrode being alternately arranged in the third direction, and the dielectric layer being interposed between the first internal electrode and the second internal electrode; a first external electrode connected to the first internal electrode and including a first conductive layer and a first plating layer, the first conductive layer including a first groove in a surface, and the first plating layer being arranged on the first conductive layer; a first coating portion arranged in the first groove and in contact with the first plating layer; a second external electrode connected to the second internal electrode and including a second conductive layer and a second plating layer, the second conductive layer including a second groove in a surface, and the second plating layer being arranged on the second conductive layer; and a second coating portion arranged in the second groove and in contact with the second plating layer.

[0008] The multilayer ceramic electronic component may include a plurality of the first grooves, a plurality of the second grooves, a plurality of the first coating parts, and a plurality of the second coating parts.

[0009] The first conductive layer may include a first connecting portion and a first band portion, the first connecting portion being arranged on the first surface of the ceramic body and connected to a portion of the first internal electrode exposed from the first surface, the first band portion extending from the first connecting portion to the fifth surface and the sixth surface of the ceramic body, and the second conductive layer may include a second connecting portion and a second band portion, the second connecting portion being arranged on the second surface of the ceramic body and connected to a portion of the second internal electrode exposed from the second surface, the second band portion extending from the second connecting portion to the fifth surface and the sixth surface of the ceramic body.

[0010] The plurality of first coating portions may include a plurality of first connection coating portions provided on the first connection portion and a plurality of first belt coating portions provided on the first belt portion, and the plurality of second coating portions may include a plurality of second connection coating portions provided on the second connection portion and a plurality of second belt coating portions provided on the second belt portion.

[0011] A thickness of each of the plurality of first connection coating portions and the plurality of second connection coating portions in the first direction may be in a range of 100 nm to 300 nm.

[0012] A thickness of each of the plurality of first tape coating portions and the plurality of second tape coating portions in the third direction may be in a range of 100 nm to 300 nm.

[0013] A width of each of the plurality of first connection coating portions and the plurality of second connection coating portions in the third direction may be in a range of 1.8 µm to 2.2 µm.

[0014] A width of each of the plurality of first tape coating portions and the plurality of second tape coating portions in the first direction may be in a range of 1.8 μm to 2.2 μm.

[0015] Adjacent coating portions among the plurality of the first coating portions and / or the plurality of the second coating portions may be arranged with a spacing therebetween.

[0016] Adjacent coating portions among the plurality of first coating portions and / or the plurality of second coating portions may be arranged to have a spacing of 2 μm therebetween.

[0017] The multilayer ceramic electronic component may also include a third coating portion extending from one end of the first conductive layer to one end of the second conductive layer to cover at least a portion of at least one of the third surface, the fourth surface, the fifth surface, and the sixth surface of the ceramic body.

[0018] Each of the plurality of first coating parts, the plurality of second coating parts, and the third coating part may include at least one of silicon dioxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), zirconium oxide (ZrO), zinc oxide (ZnO), and barium oxide (BaO).

[0019] The first plating layer may be disposed on the first conductive layer and the plurality of first coating portions and contact a first end region of the third coating portion, and the second plating layer may be disposed on the second conductive layer and the plurality of second coating portions and contact a second end region of the third coating portion.

[0020] Each of the first plating layer and the second plating layer may include: an inner plating layer including nickel (Ni); and an outer plating layer disposed on the inner plating layer and including tin (Sn).

[0021] A cross-section of each of the plurality of first connection coating portions and the plurality of second connection coating portions in the second direction and the third direction may have a circular shape.

[0022] At least one connection coating portion among the plurality of first connection coating portions and the plurality of second connection coating portions may include silicon dioxide (SiO 2 ).

[0023] A width of each of the plurality of first connection coating portions and the plurality of second connection coating portions in the third direction may be in a range of 1.8 µm to 2.2 µm.

[0024] At least one of the plurality of first tape coating portions and the plurality of second tape coating portions may include silicon dioxide (SiO 2 ).

[0025] Adjacent connection coating portions among the plurality of first connection coating portions and / or the plurality of second connection coating portions may be arranged to have a spacing of 2 μm therebetween.

[0026] As set forth above, the multilayer ceramic electronic component according to the embodiment may have improved moisture resistance reliability while preventing non-plating defects of the plating layer on the coating portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a perspective view schematically showing a multilayer capacitor according to an embodiment of the present disclosure.

[0028] Figure 2 It is schematically shown Figure 1 A three-dimensional view of a ceramic body.

[0029] Figure 3 It is along Figure 1 A cross-sectional view taken along line III-III'.

[0030] Figure 4 yes Figure 3 An enlarged cross-sectional view of region A.

[0031] Figure 5 It is along Figure 1 A cross-sectional view taken along line V-V'.

[0032] Figure 6 is a scanning electron microscope (SEM) image of a cross section of a multilayer ceramic electronic component according to an embodiment. DETAILED DESCRIPTION

[0033] Hereinafter, embodiments of the present disclosure are described in detail with reference to the accompanying drawings so that those skilled in the art to which the present disclosure pertains can easily practice the present disclosure.

[0034] In order to clearly describe the present disclosure, parts irrelevant to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

[0035] Furthermore, some components shown in the drawings are exaggerated, omitted, or schematically shown, and the size of each component does not entirely reflect its actual size.

[0036] Furthermore, it should be understood that the drawings are provided only to make the embodiments of the present disclosure easily understood, and the spirit of the present disclosure is not limited to the drawings, but includes all modifications, equivalents, and substitutes included in the spirit and scope of the present disclosure.

[0037] Terms including ordinal numbers such as "first", "second", etc. may be used to describe various components. However, these components are not limited by these terms.

[0038] These terms are only used to distinguish one component from another.

[0039] In addition, when an element such as a layer, film, region, or substrate is referred to as being “on” or “over” another element, the element can be “directly on” the other element or other elements may be present between the element and the other element.

[0040] In contrast, when an element is referred to as being “directly on” another element, there are no other elements interposed between the element and the other element.

[0041] Furthermore, when an element is referred to as being “on” or “over” a reference element, the element may be located on or below the reference element, and is not necessarily “on” or “over” the reference element in a direction opposite to gravity.

[0042] It should be understood that the terms "including" and "having" used in this specification list the features, quantities, steps, operations, components, parts or their combinations mentioned in this specification, and do not exclude the existence or addition of one or more other features, quantities, steps, operations, components, parts or their combinations.

[0043] Unless explicitly described to the contrary, “comprising” any components should be understood to imply the inclusion of other components rather than the exclusion of other components.

[0044] In addition, throughout the specification, the expression “on a plane” may indicate a case where a target is observed from above, and the expression “on a cross section” may indicate a case where a cross section of a target along a vertical direction is observed from a side of the target.

[0045] Throughout the specification, when an element is referred to as being “coupled to” another element, it may mean not only that the element and the other element are “directly or physically coupled to” each other but also that the element and the other element are “indirectly or non-contact coupled to” each other with other elements interposed therebetween.

[0046] Furthermore, throughout the specification, when it is mentioned that any component is “connected” to another component, it may mean not only that two or more components are directly connected to each other but also that two or more components are indirectly connected to each other through another component, not only that two or more components are physically connected to each other but also that two or more components are electrically connected to each other, or that two or more components are a single entity although being referred to by different names based on their arrangement or function.

[0047] In the drawings, the X-axis direction refers to a first direction or a length direction, the Y-axis direction refers to a second direction or a width direction, and the Z-axis direction refers to a third direction or a thickness direction.

[0048] Figure 1 is a perspective view schematically showing a multilayer capacitor according to an embodiment of the present disclosure, Figure 2 It is schematically shown Figure 1 A perspective view of a ceramic body, and Figure 3 It is along Figure 1 A cross-sectional view taken along line III-III'.

[0049] Reference Figures 1 to 3According to an embodiment, a multilayer ceramic electronic component 100 may include: a ceramic body 110 having a first surface S1 and a second surface S2 opposite to each other in a first direction (or an X-axis direction), a third surface S3 and a fourth surface S4 opposite to each other in a second direction (or a Y-axis direction) perpendicular to the first direction (or the X-axis direction), and a fifth surface S5 and a sixth surface S6 opposite to each other in a third direction (or a Z-axis direction) perpendicular to the first direction (or the X-axis direction) and the second direction (or the Y-axis direction), and including a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122, the first and second internal electrodes 121 and 122 being alternately arranged in the third direction (or the Z-axis direction), and the dielectric layers 111 and 112 are disposed alternately in the third direction (or the Z-axis direction). The conductive layer 111 is between the first inner electrode 121 and the second inner electrode 122; the first outer electrode 131 is connected to the first inner electrode 121 and includes a first conductive layer 131a and a first plating layer 131b disposed on the first conductive layer 131a; the first coating portion 141 is disposed in a first groove 133 disposed in the first conductive layer 131a and in contact with the first plating layer 131b; the second outer electrode 132 is connected to the second inner electrode 122 and includes a second conductive layer 132a and a second plating layer 132b disposed on the second conductive layer 132a; and the second coating portion 142 is disposed in a second groove 134 disposed in the second conductive layer 132a and in contact with the second plating layer 132b. In addition, a plurality of first grooves 133 and a plurality of second grooves 134 may be provided, and a plurality of first coating portions 141 and a plurality of second coating portions 142 may be provided.

[0050] According to an embodiment, a multilayer ceramic electronic component 100 may include a ceramic body 110, which includes a dielectric layer 111 and first and second internal electrodes 121 and 122, wherein the first and second internal electrodes 121 and 122 are alternately stacked in a third direction (or Z-axis direction), and the dielectric layer 111 is interposed between the first and second internal electrodes 121 and 122.

[0051] The ceramic body 110 may have first and second surfaces S1 and S2 opposite to each other in a first direction (or X-axis direction), third and fourth surfaces S3 and S4 opposite to each other in a second direction (or Y-axis direction), and fifth and sixth surfaces S5 and S6 opposite to each other in a third direction (or Z-axis direction).

[0052] The ceramic body 110 is not limited to a specific shape, and Figure 1 and Figure 2As shown, the ceramic body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Because the ceramic powder included in the ceramic body 110 shrinks in the process of sintering the ceramic body, the ceramic body 110 may not have a hexahedral shape with perfect straight lines. However, the ceramic body 110 may generally have a hexahedral shape. If necessary, the ceramic body 110 may have a corner that is rounded so as not to be sharp. The rounding process can be performed, for example, using drum polishing, etc., but is not limited thereto.

[0053] The ceramic body 110 may be formed by alternately stacking a first internal electrode 121, a dielectric layer 111, and a second internal electrode 122. The first internal electrode 121, the dielectric layer 111, and the second internal electrode 122 may be stacked in a third direction (or a Z-axis direction). A plurality of dielectric layers 111 may have been sintered, so adjacent dielectric layers 111 may be integrated with each other, making it difficult to identify the boundaries therebetween without using a scanning electron microscope (SEM).

[0054] The dielectric layer 111 may include a ceramic material having a high dielectric constant, such as barium titanate (BaTiO3)-based ceramic powder, strontium titanate (SrTiO3)-based ceramic powder, etc. However, the material of the dielectric layer 111 of the present disclosure is not limited thereto as long as sufficient capacitance can be obtained.

[0055] The dielectric layer 111 may be formed by adding necessary additives to a slurry including the above materials, coating it on a carrier film, and drying it to prepare a plurality of ceramic green sheets. The ceramic green sheets may be formed by forming the slurry into a sheet having a thickness of several μm using a doctor blade method, but are not limited thereto.

[0056] The ceramic body 110 may be formed by alternately stacking ceramic green sheets having the first internal electrode pattern printed on the dielectric layer 111 and ceramic green sheets having the second internal electrode pattern printed on the dielectric layer 111 in the third direction (Z-axis direction). The printing method of the first internal electrode pattern and the second internal electrode pattern may be a screen printing method or a gravure printing method, but is not limited thereto.

[0057] The first and second internal electrodes 121 and 122 may be stacked such that corresponding cross sections are exposed to opposite ends of the ceramic body 110. In detail, the first and second internal electrodes 121 and 122 may be respectively exposed to both surfaces of the ceramic body 110 in a first direction (or an X-axis direction), the first internal electrode 121 may be exposed to the first surface S1 of the ceramic body 110, and the second internal electrode 122 may be exposed to the second surface S2.

[0058] The first and second internal electrodes 121 and 122 may include a conductive metal. For example, the conductive metal may include at least one of nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The first and second internal electrodes 121 and 122 may be formed using a conductive paste including the conductive metal.

[0059] In the multilayer ceramic electronic component 100 according to the embodiment, the first and second external electrodes 131 and 132 may be disposed on the outer surface of the ceramic body 110. The first external electrode 131 may be disposed on the first surface S1 of the ceramic body 110, and the second external electrode 132 may be disposed on the second surface S2 of the ceramic body 110.

[0060] The first and second external electrodes 131 and 132 may be respectively supplied with voltages having different polarities and may be respectively electrically connected to exposed portions of the first and second internal electrodes 121 and 122 .

[0061] The first external electrode 131 may include a first conductive layer 131a disposed on the surface of the ceramic body 110 and connected to the first internal electrode 121, and a first plating layer 131b disposed on the first conductive layer 131a. The first plating layer 131b may include a first inner plating layer 131b1 covering the first conductive layer 131a and a first outer plating layer 131b2 disposed on the first inner plating layer 131b1. In addition, the second external electrode 132 may include a second conductive layer 132a and a second plating layer 132b disposed on the surface of the ceramic body 110 and connected to the second internal electrode 122, and a second plating layer 132b disposed on the second conductive layer 132a. The second plating layer 132b may include a second inner plating layer 132b1 covering the second conductive layer 132a and a second outer plating layer 132b2 disposed on the second inner plating layer 132b1.

[0062] The first conductive layer 131a and the second conductive layer 132a may be fired electrodes each including a conductive metal. For example, the conductive metal may include at least one of nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof, and may also include glass and epoxy resin.

[0063] As an example of a method of forming the first conductive layer 131a and / or the second conductive layer 132a, the conductive layer may be formed by immersing the ceramic body in a conductive paste including a conductive metal and then firing it, or may be formed by printing the conductive paste on the surface of the ceramic body using a screen printing method or a gravure printing method and then firing it. In addition, the conductive layer may be formed using a method such as coating the conductive paste on the surface of the ceramic body, or transferring a dry film formed by drying the conductive paste to the ceramic body and then firing it. However, the present disclosure is not limited thereto, and the conductive layer may be formed by forming a conductive paste on the ceramic body using various methods other than the above methods and then firing it.

[0064] The first conductive layer 131 a may include a first connection portion 131 a 1 and a first band portion 131 a 2 .

[0065] The first connection portion 131a1 may be disposed on the first surface S1 of the ceramic body 110 and connected to the exposed portion of the first internal electrode 121. Specifically, the first connection portion 131a1 may be connected to the portion of the first internal electrode 121 exposed from the first surface S1 of the ceramic body 110.

[0066] The first band portion 131a2 may partially extend from the first connection portion 131a1 to other surfaces of the ceramic body 110. For example, the first band portion 131a2 may partially extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110 to improve the adhesion strength of the first conductive layer 131a to the ceramic body 110, etc.

[0067] The second conductive layer 132a may include a second connection portion 132a1 and a second band portion 132a2.

[0068] The second connection portion 132a1 may be disposed on the second surface S2 of the ceramic body 110 and connected to the exposed portion of the second internal electrode 122. Specifically, the second connection portion 132a1 may be connected to the portion of the second internal electrode 122 exposed from the second surface S2 of the ceramic body 110.

[0069] The second band portion 132a2 may partially extend from the second connection portion 132a1 to other surfaces of the ceramic body 110. For example, the second band portion 132a2 may partially extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110 to improve the adhesion strength of the second conductive layer 132a to the ceramic body 110, etc.

[0070] A plurality of first coating parts 141 may be disposed on the first conductive layer 131a, and a plurality of second coating parts 142 may be disposed on the second conductive layer 132a. In addition, the third coating part 143 may partially cover the ceramic body 110. Specifically, the third coating part 143 of the present disclosure may completely cover the exposed surface of the ceramic body 110. In this way, moisture may be prevented from penetrating between the first conductive layer 131a and / or the second conductive layer 132a and the ceramic body 110, thereby obtaining excellent moisture resistance reliability.

[0071] Each of the plurality of first coating parts 141, the plurality of second coating parts 142, and the third coating part 143 may include an insulating material or a material for preventing moisture penetration. For example, each of the plurality of first coating parts 141, the plurality of second coating parts 142, and the third coating part 143 may include silicon dioxide (SiO2), aluminum oxide (Al2O3), zirconium oxide (ZrO), zinc oxide (ZnO), or barium oxide (BaO). Each of the plurality of first coating parts 141, the plurality of second coating parts 142, and the third coating part 143 may be an inorganic thin film layer. The inorganic thin film layer may be made of a metal compound (e.g., oxide, nitride), and / or may be made of a non-metallic compound. In this embodiment, when each of the plurality of first coating parts 141, the plurality of second coating parts 142, and the third coating part 143 is an inorganic thin film layer, its chemical reaction with external contaminants may be minimized, thereby improving the reliability of the multilayer ceramic electronic component 100. The composition of the inorganic thin film layer is not particularly limited. However, the composition of the inorganic thin film layer may include, for example, at least one selected from the group consisting of aluminum oxide (Al2O3), hafnium oxide (HfO2), zirconium dioxide (ZrO2), lanthanum oxide (La2O3), silicon dioxide (SiO2), tantalum pentoxide (Ta2O5), niobium pentoxide (Nb2O5), yttrium (II) oxide (Y2O3), strontium titanate (SrTiO3), barium titanate (BaTiO3), or aluminum nitride (AlN) and silicon nitride (SiN x ) is selected from the group consisting of at least one nitride.

[0072] The method of forming the plurality of first coating parts 141, the plurality of second coating parts 142, and the third coating part 143 of the multilayer ceramic electronic component is not particularly limited. For example, the coating parts may be formed by atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, etc., but are not limited thereto.

[0073] The first inner plating layer 131b1 and / or the second inner plating layer 132b1 and / or the first outer plating layer 131b2 and / or the second outer plating layer 132b2 may include at least one selected from the group consisting of copper (Cu), tin (Sn), nickel (Ni), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof, but is not limited thereto. For example, the first inner plating layer 131b1 and / or the second inner plating layer 132b1 may include nickel (Ni), and the first outer plating layer 131b2 and / or the second outer plating layer 132b2 may include tin (Sn).

[0074] As described above, the first external electrode 131 and / or the second external electrode 132 may have a structure in which two or more plating layers of different components are stacked, but is not limited thereto. When the first external electrode 131 and / or the second external electrode 132 has a structure in which two or more plating layers are stacked as described above, the multilayer ceramic electronic component 100 of this embodiment can simultaneously satisfy desired mechanical properties and excellent moisture resistance reliability. The plating layer may be formed by a sputtering method or an electroplating (or electrodeposition) method, and is not limited thereto.

[0075] In the following, reference will be made to Figure 4 and Figure 5 as well as Figure 3 The first and second conductive layers 131 a and 132 a , the plurality of first coating portions 141 , the plurality of second coating portions 142 , and the third coating portion 143 are described.

[0076] Figure 4 yes Figure 3 is an enlarged cross-sectional view of region A, and Figure 5 It is along Figure 1 A cross-sectional view taken along line V-V'. Figure 4 and Figure 5 The first external electrode 131 is shown, and the same configuration may be applied to the second external electrode 132 .

[0077] A plurality of first grooves 133 may be provided in the surface of the first conductive layer 131a. Each of the plurality of first coating portions 141 may be provided in each of the plurality of first grooves 133. In other words, the plurality of first coating portions 141 may be provided in the plurality of first grooves 133, respectively. In addition, a plurality of second grooves 134 may be provided in the surface of the second conductive layer 132a. Each of the plurality of second coating portions 142 may be provided in each of the plurality of second grooves 134. In other words, the plurality of second coating portions 142 may be provided in the plurality of second grooves 134, respectively.

[0078] In the manufacturing process of the multilayer ceramic electronic component 100, the plurality of first coating parts 141 may be formed in the plurality of first grooves 133 formed on the surface of the first conductive layer 131a, and the plurality of second coating parts 142 may be formed in the plurality of second grooves 134 formed on the surface of the second conductive layer 132a. In other words, the plurality of first coating parts 141 and the plurality of second coating parts 142 may fill the irregularities formed in the surface of the first conductive layer 131a and the surface of the second conductive layer 132a, respectively.

[0079] A plurality of first coating portions 141 may be spaced apart from each other. A plurality of second coating portions 142 may be spaced apart from each other. That is, adjacent coating portions in the plurality of first coating portions 141 and / or the plurality of second coating portions 142 may be spaced apart from each other, respectively. A plurality of first coating portions 141 and / or a plurality of second coating portions 142 may be arranged to have a specific spacing between them. For example, a plurality of first coating portions 141 and / or a plurality of second coating portions 142 may be arranged to have a spacing of 2µm between them, respectively. The spacing may be the shortest distance from the surface of the coating portion to the nearest surface on the adjacent coating portion, for example, for a connecting coating portion (to be described later), the spacing may be expressed as the shortest distance from the surface of the connecting coating portion to the nearest surface on the adjacent connecting coating portion in the second direction or the third direction, and for a belt coating portion (to be described later), the spacing may be expressed as the shortest distance from the surface of the belt coating portion to the nearest surface on the adjacent belt coating portion in the first direction or the second direction. The spacing may be measured, for example, by SEM. Even if not described in the present disclosure, other methods and / or other tools understood by a person of ordinary skill in the art may be used.

[0080] Each of the plurality of first coating portions 141 and / or each of the plurality of second coating portions 142 may have a circular cross-sectional shape, but is not limited thereto, and may have any shape formed by being accommodated in the first groove 133 and / or the second groove 134, such as a polygonal shape.

[0081] The plurality of first coating portions 141 may include a plurality of first connection coating portions 141a disposed on the first connection portion 131a1 and a plurality of first belt coating portions 141b disposed on the first belt portion 131a2. In addition, the plurality of second coating portions 142 may include a plurality of second connection coating portions 142a disposed on the second connection portion 132a1 and a plurality of second belt coating portions 142b disposed on the second belt portion 132a2. The plurality of first belt coating portions 141b may be disposed in the first groove on the first belt portion 131a2, and the plurality of second belt coating portions 142b may be disposed in the second groove on the second belt portion 132a2.

[0082] The thickness of each of the plurality of first connection coating portions 141a and the plurality of second connection coating portions 142a in the first direction (or X-axis direction) may be in the range of 100nm to 300nm. In addition, the thickness of each of the plurality of first belt coating portions 141b and the plurality of second belt coating portions 142b in the third direction (or Z-axis direction) may be in the range of 100nm to 300nm.

[0083] In the present specification, the thickness of each of the first coating portion 141 and / or the second coating portion 142 may refer to the thickness measured in a direction perpendicular to the surface of the conductive layer 131a and / or 132a. Specifically, based on the XZ cross section passing through the center of the multilayer ceramic electronic component 100 in the second direction (or Y-axis direction), the thickness of each of the plurality of first connection coating portions 141a and / or the plurality of second connection coating portions 142a may be: the maximum value or minimum value of the lengths of a plurality of line segments connecting one end to the other end of each of the plurality of first connection coating portions 141a and / or the plurality of second connection coating portions 142a in the first direction (or X-axis direction), or the arithmetic mean of the lengths of the plurality of line segments. The arithmetic mean may refer to: the arithmetic mean of the thickness measured at 10 equidistant points dividing the region where the corresponding component is provided on the above-mentioned XZ cross section.

[0084] In addition, based on the XZ cross section passing through the center of the multilayer ceramic electronic component 100 in the second direction (or Y-axis direction), the thickness of each of the plurality of first tape coating portions 141b and / or the plurality of second tape coating portions 142b may be: the maximum value or the minimum value of the lengths of a plurality of line segments connecting one end to the other end of each of the plurality of first tape coating portions 141b and / or the plurality of second tape coating portions 142b in the third direction (or Z-axis direction), or the arithmetic mean of the lengths of the plurality of line segments. The arithmetic mean may refer to: the arithmetic mean of the thicknesses measured at 10 equally spaced points dividing the region where the corresponding member is provided on the above XZ cross section.

[0085] The thickness of the connection coating portion and the thickness of the belt coating portion can be measured, for example, by SEM. Even if not described in the present disclosure, other methods and / or other tools understood by those of ordinary skill in the art may be used.

[0086] In the following Table 1, whether non-plating defects occurred was confirmed by observing the cross section of the multilayer ceramic electronic component using SEM. The moisture resistance reliability test measured the number of samples that had defects when the rated voltage was applied at a temperature of 85° C. and a relative humidity of 85% for 24 hours.

[0087] [Table 1]

[0088] Referring to Table 1 above, it can be confirmed that when the thickness of each of the plurality of first connection coating portions 141a and the plurality of second connection coating portions 142a is less than 100nm, the multilayer ceramic electronic component has reduced moisture resistance reliability, and when the thickness is greater than 300nm, non-plating occurs. In contrast, it can be confirmed that when the thickness of each of the plurality of first connection coating portions 141a and the plurality of second connection coating portions 142a is in the range of 100nm to 300nm, the multilayer ceramic electronic component has improved moisture resistance reliability while preventing non-plating of the plating layer. The width of each of the plurality of first connection coating portions 141a and the plurality of second connection coating portions 142a in the third direction (or Z-axis direction) may be in the range of 1.8µm to 2.2µm. In addition, the width of each of the plurality of first tape coating portions 141b and the plurality of second tape coating portions 142b in the first direction (or X-axis direction) may be in the range of 1.8µm to 2.2µm. For example, each of the plurality of first connection coating portions 141a and the plurality of second connection coating portions 142a may have a width of 2µm in the third direction (Z-axis direction). In addition, each of the plurality of first tape coating portions 141b and the plurality of second tape coating portions 142b may have a width of 2µm in the first direction (or X-axis direction). When the width of each of the plurality of first connection coating portions 141a and the plurality of second connection coating portions 142a in the third direction (or Z-axis direction) is less than 1.8µm, the multilayer ceramic electronic component may have poor moisture resistance reliability, and when the width is greater than 2.2µm, the multilayer ceramic electronic component may have unplated plating. In addition, when the width of each of the plurality of first tape coating portions 141b and the plurality of second tape coating portions 142b in the first direction (or X-axis direction) is less than 1.8µm, the multilayer ceramic electronic component may have poor moisture resistance reliability, and when the width is greater than 2.2µm, the multilayer ceramic electronic component may have unplated plating.

[0089] In the present specification, the "width" of the first coating portion 141 and / or the second coating portion 142 may refer to the width of the first coating portion 141 and / or the second coating portion 142 measured in a direction perpendicular to two opposite surfaces of the first coating portion 141 and / or the second coating portion 142. Specifically, based on an XZ cross section passing through the center of the multilayer ceramic electronic component 100 in the second direction (or Y-axis direction), the width of each of the plurality of first connection coating portions 141a and / or the plurality of second connection coating portions 142a may be: the maximum value or the minimum value of the lengths of a plurality of line segments connecting one end to the other end of each of the plurality of first connection coating portions 141a and / or the plurality of second connection coating portions 142a in the third direction (or Z-axis direction), or the arithmetic mean of the lengths of the plurality of line segments. The arithmetic mean may refer to: the arithmetic mean of the widths measured at 10 equally spaced points dividing the region where the corresponding component is provided on the above XZ cross section.

[0090] In addition, based on the XZ cross section passing through the center of the multilayer ceramic electronic component 100 in the second direction (or Y-axis direction), the width of each of the plurality of first tape coating portions 141b and / or the plurality of second tape coating portions 142b may be: the maximum value or the minimum value of the lengths of a plurality of line segments connecting one end to the other end of each of the plurality of first tape coating portions 141b and / or the plurality of second tape coating portions 142b in the first direction (or X-axis direction), or the arithmetic mean of the lengths of the plurality of line segments. The arithmetic mean may refer to: the arithmetic mean of the widths measured at 10 equally spaced points dividing the region where the corresponding member is provided on the above XZ cross section.

[0091] The width of the connection coating portion and the width of the belt coating portion can be measured, for example, by SEM. Even if not described in the present disclosure, other methods and / or other tools understood by a person of ordinary skill in the art may be used.

[0092] In the manufacturing process of the multilayer ceramic electronic component 100, the first conductive layer 131a and the second conductive layer 132a may be formed on the ceramic body 110, and then a plurality of first coating portions 141, a plurality of second coating portions 142, and a third coating portion 143 may be formed. Therefore, the third coating portion 143 may contact one corner region of the first conductive layer 131a and / or one corner region of the second conductive layer 132a. Specifically, the third coating portion 143 may extend from one end of the first conductive layer 131a to one end of the second conductive layer 132a to cover at least a portion of at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110.

[0093] In addition, in the manufacturing process of the multilayer ceramic electronic component 100, the third coating portion 143 may be formed, and then the plating layers 131b and 132b may be formed. Therefore, the first inner plating layer 131b1 may contact one end region of the third coating portion 143, and the second inner plating layer 132b1 may contact the other end region of the third coating portion 143. The first inner plating layer 131b1 may be disposed on the first conductive layer 131a and / or the plurality of first coating portions 141, and the second inner plating layer 132b1 may be disposed on the second conductive layer 132a and the plurality of second coating portions 142.

[0094] Figure 6 is a scanning electron microscope (SEM) image of a cross section of a multilayer ceramic electronic component according to an embodiment.

[0095] Reference Figure 6 , a structure can be confirmed in which a plurality of coating portions are arranged in a plurality of grooves arranged in a surface of a conductive layer including copper (Cu), an inner plating layer including nickel (Ni) is arranged on the conductive layer and / or the plurality of coating portions, and an outer plating layer including tin (Sn) is arranged on the inner plating layer.

[0096] As described above, according to the embodiment, the multilayer ceramic electronic component may include a plurality of first coating portions and a plurality of second coating portions respectively disposed in a plurality of first grooves and a plurality of second grooves, thereby improving the moisture resistance reliability of the multilayer ceramic electronic component while preventing unplating defects of the plating layer on the coating portions.

[0097] Although the embodiments of the present disclosure have been described, it should be understood that the present disclosure is not limited to the disclosed embodiments. Various modifications can be made within the scope of the claims, and these modifications also fall within the scope of the present disclosure.

Claims

1. A multilayer ceramic electronic component comprising: a ceramic body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first direction and the second direction, and comprising a plurality of dielectric layers and first and second internal electrodes, the first and second internal electrodes being alternately arranged in the third direction, and the dielectric layers being interposed between the first and second internal electrodes; a first outer electrode connected to the first inner electrode and comprising a first conductive layer and a first plating layer, the first conductive layer comprising a first groove in a surface, the first plating layer being disposed on the first conductive layer; a first coating portion, disposed in the first groove and in contact with the first plating layer; a second outer electrode connected to the second inner electrode and including a second conductive layer and a second plating layer, the second conductive layer including a second groove in a surface, the second plating layer being disposed on the second conductive layer; as well as The second coating portion is disposed in the second groove and contacts the second plating layer.

2. The multilayer ceramic electronic component according to claim 1, comprising: A plurality of the first grooves, a plurality of the second grooves, a plurality of the first coating portions, and a plurality of the second coating portions.

3. The multilayer ceramic electronic component according to claim 2, wherein: The first conductive layer comprises: a first connection portion disposed on the first surface of the ceramic body and connected to a portion of the first internal electrode exposed from the first surface; and a first band portion extending from the first connection portion to the fifth surface and the sixth surface of the ceramic body, and The second conductive layer comprises: a second connection portion disposed on the second surface of the ceramic body and connected to a portion of the second internal electrode exposed from the second surface; and A second band portion extends from the second connection portion to the fifth surface and the sixth surface of the ceramic body.

4. The multilayer ceramic electronic component according to claim 3, wherein: The plurality of first coating portions include a plurality of first connection coating portions provided on the first connection portion and a plurality of first belt coating portions provided on the first belt portion, and The plurality of second coating portions include a plurality of second connection coating portions provided on the second connection portion and a plurality of second belt coating portions provided on the second belt portion.

5. The multilayer ceramic electronic component according to claim 4, wherein: A thickness of each of the plurality of first connection coating portions and the plurality of second connection coating portions in the first direction is in a range of 100 nm to 300 nm.

6. The multilayer ceramic electronic component according to claim 4, wherein: A thickness of each of the plurality of first tape-coated portions and the plurality of second tape-coated portions in the third direction is in a range of 100 nm to 300 nm.

7. The multilayer ceramic electronic component according to claim 4, wherein: A width of each of the plurality of first connection coating portions and the plurality of second connection coating portions in the third direction is in a range of 1.8 μm to 2.2 μm.

8. The multilayer ceramic electronic component according to claim 4, wherein: A width of each of the plurality of first tape coating portions and the plurality of second tape coating portions in the first direction is in a range of 1.8 μm to 2.2 μm.

9. The multilayer ceramic electronic component according to claim 2, wherein: Adjacent coating portions among the plurality of first coating portions and / or the plurality of second coating portions are arranged with a spacing therebetween.

10. The multilayer ceramic electronic component according to claim 9, wherein: Adjacent coating portions among the plurality of first coating portions and / or the plurality of second coating portions are arranged to have a spacing of 2 μm therebetween.

11. The multilayer ceramic electronic component according to claim 2, further comprising: The third coating portion extends from one end of the first conductive layer to one end of the second conductive layer to cover at least a portion of at least one of the third surface, the fourth surface, the fifth surface, and the sixth surface of the ceramic body.

12. The multilayer ceramic electronic component according to claim 11, wherein: Each of the plurality of first coating parts, the plurality of second coating parts, and the third coating part includes at least one of SiO 2 , Al 2 O 3 , ZrO, ZnO, and BaO.

13. The multilayer ceramic electronic component according to claim 11, wherein: The first plating layer is disposed on the first conductive layer and the plurality of first coating portions and is in contact with a first end region of the third coating portion, and The second plating layer is disposed on the second conductive layer and the plurality of second coating portions, and is in contact with a second end region of the third coating portion.

14. The multilayer ceramic electronic component according to claim 13, wherein: Each of the first plating layer and the second plating layer includes: An inner plating layer including Ni; and The outer plating layer is disposed on the inner plating layer and includes Sn.

15. The multilayer ceramic electronic component according to claim 4, wherein: Each of the plurality of first connection coating portions and the plurality of second connection coating portions has a circular shape in cross-section in the second direction and the third direction.

16. The multilayer ceramic electronic component according to claim 5, wherein: At least one connection coating portion among the plurality of first connection coating portions and the plurality of second connection coating portions includes SiO 2 .

17. The multilayer ceramic electronic component according to claim 16, wherein: Each of the plurality of first connection coating portions and the plurality of second connection coating portions has a width in the third direction ranging from 1.8 μm to 2.2 μm.

18. The multilayer ceramic electronic component according to claim 17, wherein: At least one of the plurality of first tape coating portions and the plurality of second tape coating portions includes SiO 2 .

19. The multilayer ceramic electronic component according to claim 18, wherein: Adjacent connection coating portions among the plurality of first connection coating portions and / or the plurality of second connection coating portions are arranged to have a spacing of 2 μm therebetween.

Images