Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer, in which the electrode layer includes: a connection electrode layer including copper (Cu) and glass; and a band electrode layer including silver (Ag) and glass, and the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0139677 filed on October 18, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCC, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various types of electronic products such as image display devices (including liquid crystal displays (LCDs), plasma display panels (PDPs), etc.), computers, smart phones, mobile phones, etc., for charging or discharging therefrom.

[0004] Since multilayer ceramic capacitors have a small size and high capacitance and are easy to mount, such multilayer ceramic capacitors can be used as components of various electronic devices. As various electronic devices such as computers, mobile devices, etc. have been miniaturized and implemented with high output, the demand for miniaturization and high capacitance of multilayer ceramic capacitors has increased.

[0005] Recently, multilayer electronic components have been used in various environments, and research is being conducted to improve life characteristics in harsh environments. In particular, the demand for a robust design that resists external impacts is increasing, and it is necessary to increase the bending strength in such a robust design. To this end, epoxy resin can be added to the external electrode to improve the bending strength characteristics. However, in the case of an external electrode including epoxy resin, since external moisture easily penetrates (which conflicts with the purpose of improving moisture-proof reliability), it is necessary to apply appropriate structures and materials to solve this problem. Summary of the invention

[0006] An aspect of the present disclosure is to provide a multilayer electronic component having improved bending strength characteristics.

[0007] An aspect of the present disclosure is to provide a multilayer electronic component having improved moisture resistance reliability.

[0008] However, various problems to be solved by the present disclosure are not limited to the above contents and can be more easily understood in the process of explaining specific embodiments of the present disclosure.

[0009] According to one aspect of the present disclosure, a multilayer electronic component includes: a main body including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, the main body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other and connected to the first surface and the second surface in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction and connected to the first surface, the second surface, the third surface and the fourth surface; and an external electrode including an electrode layer, a plating layer and a conductive resin layer, the electrode layer being arranged on the main body and connected to the internal electrode, the plating layer being arranged on the electrode layer, and the conductive resin layer including a conductive metal and a resin, wherein the electrode layer includes: a connecting electrode layer, which is respectively arranged on the third surface and the fourth surface and includes copper (Cu) and a first glass; and a strip electrode layer, which contacts the connecting electrode layer, is arranged on a portion of the first surface and a portion of the second surface and includes silver (Ag) and a second glass, and the conductive resin layer is arranged between the strip electrode layer and the plating layer.

[0010] According to another aspect of the present disclosure, a multilayer electronic component includes: a main body, including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, the main body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other and connected to the first surface and the second surface in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction and connected to the first surface, the second surface, the third surface and the fourth surface; and an external electrode, including an electrode layer, a plating layer and a conductive resin layer, the electrode layer is arranged on the main body and connected to the internal electrode, the plating layer is arranged on the electrode layer, wherein the electrode layer includes: a connecting electrode layer, which is respectively arranged on the third surface and the fourth surface and includes a first conductive metal and a first glass; and a strip electrode layer, contacting the connecting electrode layer, arranged on a portion of the first surface and a portion of the second surface and includes a second conductive metal and a second glass, and the conductive resin layer is arranged between the strip electrode layer and the plating layer, and the conductive resin layer includes a third conductive metal and a resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 A perspective view schematically illustrates a multilayer electronic component according to an embodiment of the present disclosure.

[0012] Figure 2 Schematically shows Figure 1A cross-sectional view taken along line II'.

[0013] Figure 3 Schematically shows Figure 1 A cross-sectional view taken along line II-II'.

[0014] Figure 4 Schematically shows Figure 2 Magnified view of area M.

[0015] Figure 5 Schematically illustrates a multilayer electronic component according to another embodiment of the present disclosure. Figure 1 The cross-sectional view corresponds to the cross-sectional view taken along line II'. DETAILED DESCRIPTION

[0016] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, embodiments of the present disclosure may be modified into various other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, embodiments of the present disclosure may be provided to more completely describe the present disclosure to those of ordinary skill in the art. Therefore, for the sake of clarity of description, the shapes, sizes, etc. of the elements in the accompanying drawings may be exaggerated, and the elements represented by the same reference numerals in the accompanying drawings may be the same elements.

[0017] In addition, in order to clearly explain the present disclosure, parts that are not related to the description will be omitted, and the thickness may be magnified to clearly show the layers and regions. The same reference numerals will be used to represent the same components. In addition, throughout the specification, unless otherwise specifically stated, when an element is referred to as "comprising" or "including" an element, this means that the element may also include other elements without excluding other elements.

[0018] In the drawings, a first direction may be defined as a stacking direction or a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0019] Multilayer electronic components Figure 1 A perspective view schematically illustrates a multilayer electronic component according to an embodiment of the present disclosure.

[0020] Figure 2 Schematically shows Figure 1 A cross-sectional view taken along line II'.

[0021] Figure 3 Schematically shows Figure 1 A cross-sectional view taken along line II-II'.

[0022] Figure 4 Schematically shows Figure 2 Magnified view of area M.

[0023] Figure 5 Schematically illustrates a multilayer electronic component according to another embodiment of the present disclosure. Figure 1 The cross-sectional view corresponds to the cross-sectional view taken along line II'.

[0024] In the following, reference is made to Figures 1 to 5 , a multilayer electronic component according to an embodiment of the present disclosure will be described in detail. A multilayer ceramic capacitor will be described as an example of a multilayer electronic component, but the multilayer electronic component may include an inductor, a piezoelectric element, a varistor, a thermistor, etc.

[0025] The multilayer electronic component 100 according to an embodiment of the present disclosure may include: a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 alternately disposed with the dielectric layer 111 in a first direction, and including a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and opposite to each other in the third direction; and external electrodes 131 and 132 including electrode layers 131a and 131b disposed on the body 110 and connected to the internal electrodes 121 and 122. 2a and a plating layer arranged on the electrode layers 131a and 132a, wherein the electrode layers 131a and 132a include: connecting electrode layers 131a-1 and 132a-1, which are respectively arranged on the third surface 3 and the fourth surface 4 and include copper (Cu) and glass; and strip electrode layers 131a-2 and 132a-2, which contact the connecting electrode layers 131a-1 and 132a-1, are arranged on a part of the first surface 1 and a part of the second surface 2 and include silver (Ag) and glass, and the external electrodes 131 and 132 also include conductive resin layers 131b and 132b arranged between the strip electrode layers 131a-2 and 132a-2 and the plating layer and include conductive metal and resin.

[0026] The body 110 may have dielectric layers 111 and internal electrodes 121 and 122 that are alternately stacked.

[0027] More specifically, the body 110 may include a capacitance forming part Ac including first and second internal electrodes 121 and 122 disposed in the body 110 and alternately arranged to face each other with a dielectric layer therebetween to form capacitance.

[0028] Although the specific shape of the body 110 is not particularly limited, the body 110 may have a Figure 1The hexahedral shape shown in the figure, etc. Due to the shrinkage of the ceramic powder particles included in the main body 110 during the sintering process, the main body 110 may not have a perfectly straight hexahedral shape, but may have a substantially hexahedral shape.

[0029] The main body 110 may include a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction.

[0030] The plurality of dielectric layers 111 forming the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated to an extent that it may be difficult to identify the boundary between adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0031] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained therefrom. Generally, perovskite (ABO3)-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. can be used. The barium titanate-based material may include BaTiO3-based ceramic powder, and examples of the BaTiO3-based ceramic powder may include BaTiO3 or (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0032] In addition, for the purpose of the present disclosure, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the powder of barium titanate (BaTiO3), etc. as the raw material for forming the dielectric layer 111.

[0033] The thickness td of the dielectric layer 111 does not need to be particularly limited.

[0034] To achieve a high capacitance of the multilayer electronic component 100, the thickness td of the dielectric layer 111 can be less than or equal to 3.0 μm. To more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness td of the dielectric layer 111 can be less than or equal to 0.6 μm, and more preferably, less than or equal to 0.4 μm.

[0035] In this case, the thickness td of the dielectric layer 111 may mean a thickness td of the dielectric layer 111 disposed between the adjacent first and second internal electrodes 121 and 122 .

[0036] The thickness td of the dielectric layer 111 may represent a size of the dielectric layer 111 in the first direction. In addition, the thickness td of the dielectric layer 111 may represent an average thickness td of the dielectric layer 111, and may represent an average size of the dielectric layer 111 in the first direction. For example, the average thickness td of the dielectric layer 111 may refer to an average thickness of at least one dielectric layer in the dielectric layer 111.

[0037] The average size of the dielectric layer 111 in the first direction can be measured by scanning the cross section of the body 110 in the first direction and the second direction with a scanning electron microscope (SEM) at a magnification of 10000 to obtain an image. More specifically, the average size of one dielectric layer 111 in the first direction represents an average value calculated by measuring the size of one dielectric layer 111 in the first direction at 30 equally spaced points in the second direction in the scanned image. The 30 equally spaced points can be specified in the capacitance forming portion Ac. In addition, when such an average value is determined by measuring the average value widely used for 10 dielectric layers 111, the average size of the dielectric layer 111 in the first direction can be more generalized.

[0038] The internal electrodes 121 and 122 may be alternately stacked with the dielectric layers 111 .

[0039] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122, and the first internal electrode 121 and the second internal electrode 122 may be alternately arranged opposite to each other and the dielectric layer 111 constituting the body 110 is interposed between the first internal electrode 121 and the second internal electrode 122, and the first internal electrode 121 and the second internal electrode 122 may be exposed from the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0040] More specifically, the first inner electrode 121 may be spaced apart from the fourth surface 4 and may be exposed from the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and may be exposed from the fourth surface 4. The first outer electrode 131 may be disposed on the third surface 3 of the body 110 to be connected to the first inner electrode 121, and the second outer electrode 132 may be disposed on the fourth surface 4 of the body 110 to be connected to the second inner electrode 122.

[0041] For example, the first internal electrode 121 may not be connected to the second external electrode 132 but may be connected to the first external electrode 131, and the second internal electrode 122 may not be connected to the first external electrode 131 but may be connected to the second external electrode 132. In this case, the first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 interposed therebetween.

[0042] The body 110 may be formed by alternately stacking ceramic green sheets on which the conductive paste for the first internal electrode 121 is printed and ceramic green sheets on which the conductive paste for the second internal electrode 122 is printed, and then sintering the stacked ceramic green sheets.

[0043] The material for forming the internal electrodes 121 and 122 is not particularly limited, and a material having excellent conductivity may be used. For example, the internal electrodes 121 and 122 may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0044] In addition, the internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes containing at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As a printing method of the conductive paste for the internal electrodes, a screen printing method, a gravure printing method, etc. may be used, but the present disclosure is not limited thereto.

[0045] The thickness te of the internal electrodes 121 and 122 does not need to be particularly limited.

[0046] In order to achieve high capacitance of the multilayer electronic component 100, the thickness te of the internal electrodes 121 and 122 may be less than or equal to 1.0 μm, and in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness te of the internal electrodes 121 and 122 may be less than or equal to 0.6 μm, more preferably, less than or equal to 0.4 μm.

[0047] In this case, the thickness te of the internal electrodes 121 and 122 may represent a size in the first direction of the internal electrodes 121 and 122. In addition, the thickness te of the internal electrodes 121 and 122 may represent an average thickness te of the internal electrodes 121 and 122, and may represent an average size in the first direction of the internal electrodes 121 and 122. For example, the average thickness te of the internal electrodes 121 and 122 may refer to an average thickness of at least one of the internal electrodes 121 and 122.

[0048] The average size of the internal electrodes 121 and 122 in the first direction may be measured by scanning a cross section of the body 110 in the first direction and the second direction with a scanning electron microscope (SEM) at a magnification of 10000 to obtain an image. More specifically, the average size of one internal electrode in the first direction may be an average value calculated by measuring the size of one internal electrode in the first direction at 30 equally spaced points in the second direction in the scanned image. The 30 equally spaced points may be specified in the capacitance forming portion Ac. In addition, when such an average value is determined by widely using the average value for 10 internal electrodes, the average size of the internal electrode in the first direction may be more generalized.

[0049] In the embodiment of the present disclosure, an average thickness td of at least one of the plurality of dielectric layers 111 and an average thickness te of at least one of the plurality of internal electrodes 121 and 122 may satisfy 2×te <td。

[0050] For example, the average thickness td of one dielectric layer 111 may be twice greater than the average thickness te of one internal electrode 121 and 122. Preferably, the average thickness td of the plurality of dielectric layers 111 may be twice greater than the average thickness te of the plurality of internal electrodes 121 and 122.

[0051] Generally, for high voltage electronic components, a major issue may be reliability due to a decrease in breakdown voltage (BDV) under a high voltage environment.

[0052] To prevent a decrease in breakdown voltage under a high voltage environment, the average thickness td of the dielectric layer 111 may be made twice greater than the average thickness te of the internal electrodes 121 and 122. Therefore, the thickness of the dielectric layer (which may be the distance between the internal electrodes) may be increased, and breakdown voltage characteristics may be improved.

[0053] When the average thickness td of the dielectric layer 111 is less than or equal to twice the average thickness te of the internal electrodes 121 and 122 , the average thickness of the dielectric layer (which may be an average distance between the internal electrodes) may be thin, so that a breakdown voltage may be reduced and a short circuit may occur between the internal electrodes.

[0054] In the high voltage electronic component, an average thickness te of the internal electrodes may be less than or equal to 1.0 μm, and an average thickness td of the dielectric layer may be less than or equal to 3.0 μm, but the present disclosure is not necessarily limited thereto.

[0055] The body 110 may include cover portions 112 and 113 disposed on both surfaces of the capacitance forming portion Ac in the first direction.

[0056] Specifically, the covering portions 112 and 113 may include a first covering portion 112 disposed on one surface of the capacitance forming portion Ac in the first direction and a second covering portion 113 disposed on the other surface of the capacitance forming portion Ac in the first direction. More specifically, the covering portions 112 and 113 may include an upper covering portion 112 (i.e., the first covering portion 112) disposed above the capacitance forming portion Ac in the first direction and a lower covering portion 113 (i.e., the second covering portion 113) disposed below the capacitance forming portion Ac in the first direction.

[0057] The upper covering portion 112 and the lower covering portion 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitor forming portion Ac in the first direction, respectively, and may mainly play a role in preventing the internal electrodes 121 and 122 from being damaged due to physical stress and / or chemical stress.

[0058] The upper and lower covers 112 and 113 do not include the internal electrodes 121 and 122 and may include the same material as the dielectric layer 111. For example, the upper and lower covers 112 and 113 may include a ceramic material and may include, for example, a barium titanate (BaTiO3)-based ceramic material.

[0059] The thickness tc of each of the covering portions 112 and 113 does not need to be particularly limited.

[0060] To more easily achieve miniaturization and high capacitance of multilayer electronic component 100 , thickness tc of each of covers 112 and 113 may be 100 μm or less, preferably 30 μm or less, and in the case of an ultra-small product, more preferably 20 μm or less.

[0061] In this case, the thickness tc of each of the covering portions 112 and 113 may represent the size of each of the covering portions 112 and 113 in the first direction. In addition, the thickness tc of each of the covering portions 112 and 113 may represent the average thickness tc of each of the covering portions 112 and 113, and may represent the average size of each of the covering portions 112 and 113 in the first direction.

[0062] The average size of each of the covering portions 112 and 113 in the first direction may be measured by scanning an image obtained by scanning a cross section of the body 110 in the first direction and the second direction with a scanning electron microscope (SEM) at a magnification of 10000. More specifically, the average size of each of the covering portions 112 and 113 in the first direction may be an average value calculated by measuring the size of one covering portion in the first direction at 30 equally spaced points in the second direction in the scanned image.

[0063] In addition, the average size of the covering portion in the first direction measured by the above method may be substantially the same as the average size of the covering portion in the first direction measured in the cross section of the body 110 in the first and third directions.

[0064] The multilayer electronic component 100 may include side edge portions 114 and 115 disposed on both side surfaces of the capacitance forming portion Ac in the third direction.

[0065] Specifically, the side edge portions 114 and 115 may include a first side edge portion 114 arranged on one surface of the capacitor forming portion Ac in the third direction and a second side edge portion 115 arranged on another surface of the capacitor forming portion Ac in the third direction, and more specifically, may include a first side edge portion 114 arranged on one side surface of the capacitor forming portion Ac in the third direction and a second side edge portion 115 arranged on another side surface of the capacitor forming portion Ac in the third direction.

[0066] like Figure 3 As shown in , the side edge portions 114 and 115 may refer to regions between both ends of the first and second internal electrodes 121 and 122 in the third direction and an outer surface of the body 110 in the third direction in a cross section of the body 110 cut along the first and third directions.

[0067] The side margin portions 114 and 115 may be prepared by not coating the conductive paste on the areas of the ceramic green sheets where the side margin portions 114 and 115 are to be formed when the internal electrodes 121 and 122 are formed by coating the conductive paste on the ceramic green sheets. In order to suppress the step difference due to the internal electrodes 121 and 122, the side margin portions 114 and 115 may be formed by stacking the ceramic green sheets on which the conductive paste is formed to form a stacked body, cutting the stacked body so that the internal electrodes 121 and 122 are exposed to both side surfaces of the capacitance forming portion Ac in the third direction, and then stacking a single dielectric layer or two or more dielectric layers along the third direction on both side surfaces of the capacitance forming portion Ac in the third direction.

[0068] The side margin parts 114 and 115 may mainly play a role in preventing the internal electrodes 121 and 122 from being damaged due to physical stress and / or chemical stress.

[0069] The first and second side margin portions 114 and 115 do not include the internal electrodes 121 and 122 and may include the same material as the dielectric layer 111. For example, the first and second side margin portions 114 and 115 may include a ceramic material and may include, for example, a barium titanate (BaTiO3)-based ceramic material.

[0070] The width wm of each of the first side margin portion 114 and the second side margin portion 115 does not need to be particularly limited.

[0071] To more easily achieve miniaturization and high capacitance of the multilayer electronic component 100 , the width wm of the side edge portions 114 and 115 may be 100 μm or less, preferably 30 μm or less, and in the case of ultra-small products, more preferably 20 μm or less.

[0072] In this case, the width wm of the side edge portions 114 and 115 may represent a dimension in the third direction of each of the side edge portions 114 and 115. In addition, the width wm of each of the side edge portions 114 and 115 may represent an average width wm of each of the side edge portions 114 and 115, and may represent an average dimension in the third direction of each of the side edge portions 114 and 115.

[0073] The average size of each of the side edge portions 114 and 115 in the third direction may be measured by scanning an image obtained by scanning a cross section of the body 110 in the first direction and the third direction with a scanning electron microscope (SEM) at a magnification of 10000. More specifically, the average size of each of the side edge portions 114 and 115 in the third direction may refer to an average value calculated by measuring the size of one side edge portion in the third direction at 10 equally spaced points in the first direction in the scanned image.

[0074] In the embodiment of the present disclosure, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is shown, but the number, shape, etc. of the external electrodes 131 and 132 may be changed according to the shape of the internal electrodes 121 and 122 or other purposes.

[0075] The external electrodes 131 and 132 may be disposed on the body 110 , and may be connected to the internal electrodes 121 and 122 .

[0076] More specifically, the external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132, which are respectively disposed on the third surface 3 and the fourth surface 4 of the body 110 and are respectively connected to the first internal electrode 121 and the second internal electrode 122. For example, the first external electrode 131 may be disposed on the third surface 3 of the body 110 and may be connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the body 110 and may be connected to the second internal electrode 122.

[0077] In addition, the external electrodes 131 and 132 may be disposed to extend on a portion of the first surface 1 and a portion of the second surface 2 of the body 110, and / or may be disposed to extend on a portion of the fifth surface 5 and a portion of the sixth surface 6 of the body 110. For example, the first external electrode 131 may be disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the body 110 and disposed on the third surface 3 of the body 110, and the second external electrode 132 may be disposed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6 of the body 110 and disposed on the fourth surface 4 of the body 110. In this case, the first external electrode 131 and the second external electrode 132 may be spaced apart from each other.

[0078] The external electrodes 131 and 132 may be formed using any material such as metal as long as they have conductivity, and a specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may also have a multi-layered structure.

[0079] In an embodiment of the present disclosure, the external electrodes 131 and 132 may include: electrode layers 131a and 132a, connected to the internal electrodes 121 and 122 and disposed on the body 110; and plating layers 131c, 132c, 131d, and 132d, disposed on the electrode layers 131a and 132a. The electrode layers 131a and 132a may include: connecting electrode layers 131a-1 and 132a-1, disposed on the third surface 3 and the fourth surface 4, respectively, and including a first conductive metal and a first glass; and strip electrode layers 131a-2 and 132a-2, contacting the connecting electrode layers 131a-1 and 132a-1, disposed on a portion of the first surface 1 and a portion of the second surface 2, and including a second conductive metal and a second glass.

[0080] In this case, the external electrodes 131 and 132 may further include conductive resin layers 131 b and 132 b disposed between the strip electrode layers 131 a - 2 and 132 a - 2 and the plated layers 131 c and 132 c and including a third conductive metal and a resin.

[0081] The multilayer electronic component 100 may include the above-described structure of the external electrodes 131 and 132 to simultaneously improve bending strength characteristics and moisture-proof reliability.

[0082] The external electrodes 131 and 132 may include electrode layers 131a and 132a connected to the internal electrodes 121 and 122 and disposed on the body 110. In this case, the electrode layers 131a and 132a include: connecting electrode layers 131a-1 and 132a-1, which are respectively disposed in the connecting portions on the third surface 3 and the fourth surface 4; and strip electrode layers 131a-2 and 132a-2, which contact the connecting electrode layers 131a-1 and 132a-1 and are disposed in the strip portions on a portion of the first surface 1 and a portion of the second surface 2.

[0083] More specifically, the first external electrode 131 may be connected to the first internal electrode 121, and may include an electrode layer 131a disposed on the body 110. In this case, the electrode layer 131a may include: a connection electrode layer 131a-1 disposed on the third surface 3; and a strip electrode layer 131a-2 contacting the connection electrode layer 131a-1 and disposed on a portion of the first surface 1 and a portion of the second surface 2. In this case, the strip electrode layer 131a-2 may include: a first strip electrode layer 131a-2a disposed on a portion of the first surface 1 of the body 110; and a second strip electrode layer 131a-2b disposed on a portion of the second surface 2 of the body 110.

[0084] The second external electrode 132 may be connected to the second internal electrode 122, and may include an electrode layer 132a disposed on the body 110. In this case, the electrode layer 132a may include: a connection electrode layer 132a-1 disposed on the fourth surface 4; and a strip electrode layer 132a-2 contacting the connection electrode layer 132a-1 and disposed on a portion of the first surface 1 and a portion of the second surface 2. In this case, the strip electrode layer 132a-2 may include: a first strip electrode layer 132a-2a disposed on a portion of the first surface 1 of the body 110; and a second strip electrode layer 132a-2b disposed on a portion of the second surface 2 of the body 110.

[0085] The connection electrode layers 131 a - 1 and 132 a - 1 may include a first conductive metal and a first glass.

[0086] The first conductive metal may include, for example, copper (Cu), but the present disclosure is not particularly limited thereto, and may not be particularly limited as long as it is a material that can be electrically connected to the internal electrodes 121 and 122. The material that may be the first conductive metal may include at least one selected from the group consisting of copper (Cu), nickel (Ni), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, and any material having excellent conductivity may be used.

[0087] In addition, the first glass may play a role of improving adhesion with the body 110, and the connection electrode layers 131a-1 and 132a-1 may include the first glass to have excellent adhesion with the body 110. In this case, the first glass may be a concept including glass frit.

[0088] The connection electrode layers 131 a - 1 and 132 a - 1 may be formed by coating a conductive paste including a first glass and a first conductive metal and then sintering the conductive paste.

[0089] The electrode layers 131a-2 and 132a-2 may include a second conductive metal and a second glass.

[0090] The second conductive metal may include, for example, silver (Ag), but the present disclosure is not particularly limited thereto, and may not be particularly limited as long as it is a material that can be electrically connected to the connection electrode layers 131a-1 and 132a-1 and the internal electrodes 121 and 122. The material that may be the second conductive metal may include at least one of copper (Cu), nickel (Ni), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, and any material having excellent conductivity may be used.

[0091] The strip electrode layers 131a-2 and 132a-2 may include a conductive metal softer than the conductive metal included in the connection electrode layers 131a-1 and 132a-1, for example, silver (Ag). Therefore, the multilayer electronic component 100 can absorb the bending stress applied thereto to suppress the generation of cracks. The softness of the metal can be determined by a hardness tester. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used.

[0092] In addition, the second glass may be used to improve adhesion with the body 110, and the electrode-bearing layers 131a-2 and 132a-2 may include the second glass to have excellent adhesion with the body 110. In this case, the second glass may be a concept including glass frit.

[0093] The electrode-bearing layers 131 a - 2 and 132 a - 2 may be formed by coating a conductive paste including a second glass and a second conductive metal and then sintering the conductive paste.

[0094] The first glass and the second glass may be the same as or different from each other, and when they include a plurality of glass types, at least one of the plurality of glass types may be the same material, but the present disclosure is not particularly limited thereto.

[0095] The method of forming the connecting electrode layers 131a-1 and 132a-1 and the strip electrode layers 131a-2 and 132a-2 is not particularly limited. For example, the electrode layers 131a and 132a may be formed by first applying a conductive paste for connecting the electrode layers 131a-1 and 132a-1, and later applying a conductive paste for the strip electrode layers 131a-2 and 132a-2, and then sintering the conductive paste. Alternatively, the electrode layers 131a and 132a may be formed by first applying a conductive paste for the strip electrode layers 131a-2 and 132a-2, and later applying a conductive paste for connecting the electrode layers 131a-1 and 132a-1, and then sintering the conductive paste. As an example, a conductive paste for connecting the electrode layers may be first applied to the positions of the entire electrode layers, the conductive paste for connecting the electrode layers may be removed by a polishing process such as a sandblasting process in the area where the strip electrode layers are to be formed, and then a conductive paste for the strip electrode layers may be applied to the area where the strip electrode layers are to be formed. As another example, a conductive paste for an electrode layer may first be coated on the entire electrode layer, the conductive paste for an electrode layer may be removed from the area where a connecting electrode layer is to be formed by a polishing process such as a sandblasting process, and then the conductive paste for a connecting electrode layer may be coated on the area where a connecting electrode layer is to be formed.

[0096] In the embodiment of the present disclosure, the electrode-bearing layers 131 a - 2 and 132 a - 2 may not be disposed between the extension line EL1 of the first surface 1 and the extension line EL2 of the second surface 2 .

[0097] For reference Figure 2 In a more specific example, the first electrode layer 131a-2a of the first external electrode 131 may be disposed only below the extension line EL1 of the first surface 1 and may not be disposed above the extension line EL1 of the first surface 1, and the second electrode layer 131a-2b of the first external electrode 131 may be disposed only above the extension line EL2 of the second surface 2 and may not be disposed below the extension line EL2 of the second surface 2. For example, the electrode layers 131a-2a and 131a-2b of the first external electrode 131 may not be disposed between the extension line EL1 of the first surface 1 and the extension line EL2 of the second surface 2 in the first direction, or may not be disposed on the third surface 3.

[0098] The first electrode-bearing layer 132a-2a of the second external electrode 132 may be disposed only below the extension line EL1 of the first surface 1 and may not be disposed above the extension line EL1 of the first surface 1, and the second electrode-bearing layer 132a-2b of the second external electrode 132 may be disposed only above the extension line EL2 of the second surface 2 and may not be disposed below the extension line EL2 of the second surface 2. For example, the electrode-bearing layers 132a-2a and 132a-2b of the second external electrode 132 may not be disposed between the extension line EL1 of the first surface 1 and the extension line EL2 of the second surface 2 in the first direction, or may not be disposed on the fourth surface 4.

[0099] Therefore, the electrode-bearing layers 131 a - 2 and 132 a - 2 may not be disposed between the extension line EL1 of the first surface 1 and the extension line EL2 of the second surface 2 , or may not be disposed on the third surface 3 and the fourth surface 4 .

[0100] In another embodiment of the present disclosure, the electrode layers 231a-2 and 232a-2 (see Figure 5 ) can be arranged between the extension line EL3 of the third surface 3 and the extension line EL4 of the fourth surface 4.

[0101] For reference Figure 5 In a more specific example, the first electrode layer 231a-2a of the first external electrode 231 may be disposed only on the right side of the extension line EL3 of the third surface 3 and may not be disposed on the left side of the extension line EL3 of the third surface 3, and the second electrode layer 231a-2b of the first external electrode 231 may be disposed only on the right side of the extension line EL3 of the third surface 3 and may not be disposed on the left side of the extension line EL3 of the third surface 3. For example, the electrode layers 231a-2a and 231a-2b of the first external electrode 231 may be disposed on the right side of the extension line EL3 of the third surface 3 or may not be disposed on the third surface 3.

[0102] The first electrode layer 232a-2a of the second external electrode 232 may be disposed only on the left side of the extension line EL4 of the fourth surface 4 and may not be disposed on the right side of the extension line EL4 of the fourth surface 4, and the second electrode layer 232a-2b of the second external electrode 232 may be disposed only on the left side of the extension line EL4 of the fourth surface 4 and may not be disposed on the right side of the extension line EL4 of the fourth surface 4. For example, the electrode layers 232a-2a and 232a-2b of the second external electrode 232 may be disposed on the left side of the extension line EL4 of the fourth surface 4 or may not be disposed on the fourth surface 4.

[0103] Therefore, the electrode-bearing layers 231 a - 2 and 232 a - 2 may be disposed between the extension line EL3 of the third surface 3 and the extension line EL4 of the fourth surface 4 .

[0104] Return to reference Figure 2, the plating layers 131c, 132c, 131d and 132d may be used to improve mounting characteristics.

[0105] The plating layers 131 c , 132 c , 131 d , and 132 d are not particularly limited in terms of the type thereof, and may be formed as a single plating layer 131 c and 132 c or a plurality of plating layers 131 c , 132 c , 131 d , and 132 d .

[0106] For example, the plating layers 131c, 132c, 131d, and 132d may include first plating layers 131c and 132c disposed on the electrode layers 131a and 132a and second plating layers 131d and 132d disposed on the first plating layers 131c and 132c.

[0107] For a more specific example of the plating layers 131 c , 132 c , 131 d , and 132 d , the drawings show two plating layers, but the present disclosure is not limited thereto and may include one plating layer or two or more plating layers as needed.

[0108] The plating layers 131c, 132c, 131d, and 132d may be at least one of a nickel (Ni) plating layer and a tin (Sn) plating layer. On the electrode layers 131a and 132a, a Ni plating layer and a Sn plating layer may be sequentially formed, or a Sn plating layer, a Ni plating layer, and a Sn plating layer may be sequentially formed. In addition, the plating layers 131c, 132c, 131d, and 132d may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0109] In the embodiment of the present disclosure, the external electrodes 131 and 132 may further include conductive resin layers 131 b and 132 b disposed between the strip electrode layers 131 a - 2 and 132 a - 2 and the first plating layers 131 c and 132 c and including a third conductive metal and a resin.

[0110] The third conductive metal may include, for example, copper (Cu), but the present disclosure is not particularly limited thereto, and may not be particularly limited as long as it is a material that can be electrically connected to the internal electrodes 121 and 122 or the electrode layers 131a and 132a. The material that may be the third conductive metal may include at least one of copper (Cu), nickel (Ni), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, and any material having excellent conductivity may be used.

[0111] In this case, the third conductive metal may include at least one of spherical particles and flaky particles. For example, the third conductive metal may include only flaky particles, may include only spherical particles, or may include a mixture of flaky particles and spherical particles. In this case, the spherical particles may also include a shape that may not be completely spherical, for example, a shape in which the length ratio of the major axis to the minor axis (major axis / minor axis) is less than or equal to 1.45. Flaky particles refer to particles having a flat and elongated shape, and are not particularly limited, but for example, the length ratio of the major axis to the minor axis (major axis / minor axis) may be greater than or equal to 1.95. The length of the major axis and the length of the minor axis of the spherical particles and the flaky particles can be measured from an image obtained by scanning a cross section in the first direction and the second direction cut from the central portion of the multilayer electronic component in the third direction with a scanning electron microscope (SEM).

[0112] In addition, the third conductive metal may include an intermetallic compound. The intermetallic compound may be included to further improve electrical connectivity with the electrode layers 131a and 132a. The intermetallic compound may be used to improve electrical connectivity by connecting a plurality of metal particles, and may be used to surround a plurality of metal particles and connect the plurality of metal particles to each other.

[0113] In this case, the intermetallic compound may include a metal having a melting point lower than the curing temperature of the resin. For example, since the intermetallic compound includes a metal having a melting point lower than the curing temperature of the resin, the metal having a melting point lower than the curing temperature of the resin may be melted during the drying process and the curing process, and may form the intermetallic compound with a portion of the metal particles to surround the metal particles.

[0114] The intermetallic compound may include a low melting point metal having a melting point of 300° C. or less. For example, the intermetallic compound may include tin (Sn) having a melting point of 213° C. to 220° C. During the drying process and the curing process, Sn may melt, and the melted Sn may wet the third conductive metal particles (such as Ag, Ni, or Cu) having a high melting point higher than the curing temperature of the resin by capillary action, and may react with a portion of the Ag, Ni, or Cu metal particles to form an intermetallic compound such as Ag3Sn, Ni3Sn4, Cu6Sn5, Cu3Sn, etc. Ag, Ni, or Cu that does not participate in the reaction may remain as metal particles.

[0115] Thus, the plurality of metal particles may include one or more of Ag, Ni, and Cu, and the intermetallic compound may include one or more of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0116] The resin may include a thermosetting resin having electrical insulation. For example, the resin may include an epoxy resin, but the present disclosure is not particularly limited thereto, and may include a resin having a small molecular weight and being liquid at room temperature among bisphenol A resin, ethylene glycol epoxy resin, novolac epoxy resin, or derivatives thereof. However, the present disclosure is not particularly limited thereto.

[0117] The conductive resin layers 131 b and 132 b may improve the bending strength characteristics and moisture-proof reliability of the multilayer electronic component 100 .

[0118] More specifically, when the multilayer electronic component 100 is mounted on a substrate, the conductive resin layers 131b and 132b absorb tensile stress generated in a mechanical environment or a thermal environment to prevent cracks from occurring. In addition, the various materials included in the conductive resin layers 131b and 132b can effectively inhibit external moisture penetration, thereby improving moisture-proof reliability.

[0119] In the present disclosure, the first conductive metal, the second conductive metal, and the third conductive metal may be the same or different from each other, or two of the three conductive metals may be the same material. In addition, each of the conductive metals may include multiple materials, and at least one of the multiple materials may be the same material, but the present disclosure is not particularly limited thereto.

[0120] The conductive resin layers 131 b and 132 b may be disposed between the electrode-bearing layers 131 a - 2 and 132 a - 2 and the first plating layers 131 c and 132 c .

[0121] For example, in the embodiment of the present disclosure, the conductive resin layers 131 b and 132 b may not be provided between the extension line EL1 of the first surface 1 and the extension line EL2 of the second surface 2 .

[0122] For reference Figure 2 In a more specific example, the first conductive resin layer 131b-1 of the first external electrode 131 may be disposed only below the extension line EL1 of the first surface 1 and may not be disposed above the extension line EL1 of the first surface 1, and the second conductive resin layer 131b-2 of the first external electrode 131 may be disposed only above the extension line EL2 of the second surface 2 and may not be disposed below the extension line EL2 of the second surface 2. For example, the conductive resin layers 131b-1 and 131b-2 of the first external electrode 131 may not be disposed between the extension line EL1 of the first surface 1 and the extension line EL2 of the second surface 2 in the first direction, or may not be disposed on the third surface 3.

[0123] The first conductive resin layer 132b-1 of the second external electrode 132 may be disposed only below the extension line EL1 of the first surface 1 and may not be disposed above the extension line EL1 of the first surface 1, and the second conductive resin layer 132b-2 of the second external electrode 132 may be disposed only above the extension line EL2 of the second surface 2 and may not be disposed below the extension line EL2 of the second surface 2. For example, the conductive resin layers 132b-1 and 132b-2 of the second external electrode 132 may not be disposed between the extension line EL1 of the first surface 1 and the extension line EL2 of the second surface 2 in the first direction, or may not be disposed on the fourth surface 4.

[0124] Therefore, the conductive resin layers 131 b and 132 b may not be provided between the extension line EL1 of the first surface 1 and the extension line EL2 of the second surface 2 and may not be provided on the third surface 3 and the fourth surface 4 .

[0125] In another embodiment of the present disclosure, the conductive resin layers 231b and 232b (see Figure 5 ) can be arranged between the extension line EL3 of the third surface 3 and the extension line EL4 of the fourth surface 4.

[0126] For reference Figure 5 In a more specific example, the first conductive resin layer 231b-1 of the first external electrode 231 may be disposed only on the right side of the extension line EL3 of the third surface 3 and may not be disposed on the left side of the extension line EL3 of the third surface 3, and the second conductive resin layer 231b-2 of the first external electrode 231 may be disposed only on the right side of the extension line EL3 of the third surface 3 and may not be disposed on the left side of the extension line EL3 of the third surface 3. For example, the conductive resin layers 231b-1 and 231b-2 of the first external electrode 231 may be disposed on the right side of the extension line EL3 of the third surface 3 or may not be disposed on the third surface 3.

[0127] The first conductive resin layer 232b-1 of the second external electrode 232 may be disposed only on the left side of the extension line EL4 of the fourth surface 4 and may not be disposed on the right side of the extension line EL4 of the fourth surface 4, and the second conductive resin layer 232b-2 of the second external electrode 232 may be disposed only on the left side of the extension line EL4 of the fourth surface 4 and may not be disposed on the right side of the extension line EL4 of the fourth surface 4. For example, the conductive resin layers 232b-1 and 232b-2 of the second external electrode 232 may be disposed on the left side of the extension line EL4 of the fourth surface 4 or may not be disposed on the fourth surface 4.

[0128] Therefore, the conductive resin layers 231 b and 232 b may be disposed between the extension line EL3 of the third surface 3 and the extension line EL4 of the fourth surface 4 .

[0129] In an embodiment of the present disclosure, the conductive resin layers 131b and 132b may not be in contact with the connection electrode layers 131a-1 and 132a-1. In an embodiment of the present disclosure, the conductive resin layers 131b and 132b may not be in direct contact with the connection electrode layers 131a-1 and 132a-1.

[0130] Since the conductive resin layers 131 b and 132 b may not contact the connection electrode layers 131 a - 1 and 132 a - 1 , the bending strength characteristics of the multilayered electronic component 100 may be improved, and a structure according to a manufacturing process may be easily designed.

[0131] Furthermore, in an embodiment of the present disclosure, the first plating layers 131c and 132c may not be in contact with the electrode-bearing layers 131a-2 and 132a-2. In an embodiment of the present disclosure, the first plating layers 131c and 132c may not be in direct contact with the electrode-bearing layers 131a-2 and 132a-2.

[0132] The first plating layers 131c and 132c may not contact the electrode-bearing layers 131a-2 and 132a-2 to prevent the plating solution from penetrating into the body during the plating process, thereby improving moisture-proof reliability and suppressing degradation of the internal electrodes.

[0133] in addition, Figure 5 Elements not mentioned in the examples can be Figure 2 The elements in the example are similarly understood, for example, the body 210, the internal electrodes 221 and 222, the dielectric layer 211, the cover parts 212 and 213, the electrode layers 231a and 232a, the connecting electrode layers 231a-1 and 232a-1, and the plating layers 231c, 232c, 231d and 232d.

[0134] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0135] In order to simultaneously achieve miniaturization and high capacitance, since the thickness of the dielectric layer and the internal electrode should be thinned to increase the number of stacking, the multilayer electronic component 100 according to the present disclosure having a size of 1005 (length×width: 1.0 mm×0.5 mm) or less may have a more significant effect.

[0136] In addition, the expression "embodiment" used in this specification does not mean the same embodiment, and may be provided to emphasize and describe different unique features. However, the embodiment presented above may not exclude being implemented in combination with the features of another embodiment. For example, although the description in a specific embodiment is not described in another embodiment, it may be understood as an explanation related to another embodiment unless otherwise described or contradictory to another embodiment.

[0137] The terms used in the present disclosure are only used to illustrate various examples and are not intended to limit the inventive concept. Unless the context clearly dictates otherwise, a singular expression includes a plural expression.

[0138] One of the many effects of the present disclosure is to improve the bending strength characteristics of a multilayer electronic component.

[0139] One of the many effects of the present disclosure is to improve the moisture resistance reliability of multi-layer electronic components.

[0140] However, various advantages and effects of the present disclosure are not limited to the above contents and can be more easily understood in the process of explaining specific embodiments of the present disclosure.

[0141] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other and connected to the first surface and the second surface in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction and connected to the first surface, the second surface, the third surface and the fourth surface; as well as an external electrode, comprising an electrode layer, a plating layer and a conductive resin layer, wherein the electrode layer is disposed on the body and connected to the internal electrode, the plating layer is disposed on the electrode layer, and the conductive resin layer comprises a conductive metal and a resin, The electrode layer includes: a connecting electrode layer, which is respectively arranged on the third surface and the fourth surface and includes Cu and a first glass; and a strip electrode layer, which contacts the connecting electrode layer, is arranged on a part of the first surface and a part of the second surface and includes Ag and a second glass, and The conductive resin layer is provided between the electrode-carrying layer and the plating layer.

2. The multilayer electronic component according to claim 1, wherein The conductive metal includes Cu.

3. The multilayer electronic component according to claim 1, wherein: The conductive metal includes an intermetallic compound.

4. The multilayer electronic component according to claim 1, wherein: The electrode-carrying layer is not disposed between an extension line of the first surface and an extension line of the second surface.

5. The multilayer electronic component according to claim 1, wherein The conductive resin layer is not provided between an extension line of the first surface and an extension line of the second surface.

6. The multilayer electronic component according to claim 1, wherein The electrode layer is disposed between an extension line of the third surface and an extension line of the fourth surface.

7. The multilayer electronic component according to claim 1, wherein: The conductive resin layer is provided between an extension line of the third surface and an extension line of the fourth surface.

8. The multilayer electronic component according to claim 1, wherein The conductive resin layer is not in contact with the connection electrode layer.

9. The multilayer electronic component according to claim 1, wherein: The plated layer is not in contact with the electrode-bearing layer.

10. The multilayer electronic component according to claim 1, wherein The plating layer includes: a first plating layer provided on the connection electrode layer and the conductive resin layer; and a second plating layer provided on the first plating layer.

11. A multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other and connected to the first surface and the second surface in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction and connected to the first surface, the second surface, the third surface and the fourth surface; as well as an external electrode, comprising an electrode layer, a plating layer and a conductive resin layer, wherein the electrode layer is disposed on the body and connected to the internal electrode, and the plating layer is disposed on the electrode layer, The electrode layer includes: a connecting electrode layer, which is respectively arranged on the third surface and the fourth surface and includes a first conductive metal and a first glass; and a strip electrode layer, which contacts the connecting electrode layer, is arranged on a part of the first surface and a part of the second surface and includes a second conductive metal and a second glass, and The conductive resin layer is provided between the electrode-carrying layer and the plated layer, and the conductive resin layer includes a third conductive metal and a resin.

12. The multilayer electronic component according to claim 11, wherein The electrode-carrying layer is not disposed between an extension line of the first surface and an extension line of the second surface.

13. The multilayer electronic component according to claim 11, wherein The conductive resin layer is not provided between an extension line of the first surface and an extension line of the second surface.

14. The multilayer electronic component according to claim 11, wherein The electrode layer is disposed between an extension line of the third surface and an extension line of the fourth surface.

15. The multilayer electronic component according to claim 11, wherein The conductive resin layer is provided between an extension line of the third surface and an extension line of the fourth surface.

16. The multilayer electronic component according to claim 11, wherein The second conductive metal is softer than the first conductive metal.

17. The multilayer electronic component according to claim 11, wherein: The second conductive metal is a different metal from the first conductive metal.

18. The multilayer electronic component according to claim 11, wherein The resin includes epoxy resin.

19. The multilayer electronic component according to claim 11, wherein: The first glass and / or the second glass includes glass frit.

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