Heating device for wafer processing

Abstract

The invention discloses a heating device for wafer processing, and relates to the technical field of wafer processing. The heating device for wafer processing comprises a shell arranged on gluing and developing equipment. According to the heating device for wafer processing, the electric heating module is arranged in a partitioned manner, so that the heating range can be conveniently adjusted according to the diameter size of a wafer, heating is more uniform, heat waste can be avoided, and the heating device is more energy-saving and environment-friendly; when a wafer is placed, the top of the heating disc can be cleaned, meanwhile, the buckling deformation condition of the top of the heating disc can be automatically detected, the attaching effect after the wafer is placed can be guaranteed, the wafer heating uniformity is guaranteed, and then the wafer heating quality is guaranteed. And during heating, air between the lower cover and the upper cover and organic matters generated by volatilization can be discharged, so that the heating is more uniform, the organic matters can be prevented from being condensed on the wafer, and the wafer heating quality is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, in particular to a heating device for wafer processing. Background Art

[0002] The heating device for wafer processing is part of the coating and developing machine. The coating and developing machine is a key equipment in semiconductor manufacturing and is used to complete all photolithography processes except exposure, including coating, baking, and developing of photolithography materials. When in use, a heating device is required to heat the wafer after spin coating. The heating device currently used is mainly a heating plate. When in use, the wafer is placed on the heating plate. In order to avoid the influence of airflow during heating, an upper cover and a lower cover are usually provided. When heating, the upper cover and the lower cover are closed and then a closed heating treatment is performed.

[0003] However, when the existing heating device for wafer processing is in use, the air in the cavity between the upper cover and the lower cover does not flow, which easily leads to inconsistent internal temperature and uneven heating. At the same time, organic solvent additives and the like form condensation on the top after volatilization at high temperature, and the condensed volatile substances can easily cause secondary pollution to the wafer, affecting the quality of wafer heating; it is inconvenient to adjust the heating range of the heating plate according to the diameter of the wafer, which not only makes the heating uneven, but also causes heat waste; because the heating plate is flat, there will be stress during heating, which is easy to cause warping, and the surface of the heating plate may be attached with impurities. After the wafer is placed, it cannot be completely fitted with the top of the heating plate, which will also cause uneven heating, thereby affecting the quality of wafer processing. Summary of the invention

[0004] The object of the present invention is to provide a heating device for wafer processing to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heating device for wafer processing, comprising a shell arranged on a glue coating and developing device, wherein a pick-up and delivery module, a spin coating module and a heating module are arranged in the shell, wherein the pick-up and delivery module comprises a loading robot, wherein a mounting rod is fixedly connected to the loading robot, and a suction cup is fixedly connected to the lower end of the mounting rod, wherein the heating module comprises two first fixing plates fixedly connected to the bottom of the shell, and a lower cover is fixedly connected to the top of the first fixing plate, wherein a first motor is fixedly connected to the bottom of the lower cover, and a rotating rod is fixedly connected to the output end of the first motor, and the upper end of the rotating rod is fixedly connected to A hollow heating plate is provided, and a plurality of through holes arranged in an array are provided on the top and the bottom of the heating plate. A cylinder is fixedly connected to the top of the shell, and an upper cover is fixedly connected to the lower end of the cylinder. An electric heating module is provided in the heating plate, and the electric heating module comprises an electric heating disc and a plurality of concentrically arranged electric heating rings, and the electric heating disc is fixed to the top of the heating plate, a lifting mechanism is provided between the electric heating ring and the bottom of the heating plate, an exhaust mechanism for discharging gas therein is provided on the lower cover and the upper cover, and a detection mechanism for detecting warping deformation of the top of the heating plate is provided on the top of the lower cover.

[0006] Preferably, the detection mechanism includes two first movable plates arranged on the top of the lower cover, a movable mechanism is arranged between the first movable plate and the lower cover, and a first telescopic mechanism is arranged on the top of each first movable plate, the first telescopic mechanism is connected to the second movable plate, a plurality of movable rods are inserted on the top of the second movable plate, and the plurality of movable rods are arranged at equal intervals, the lower end of each movable rod is fixedly connected to a conical disk, and a first spring is sleeved on the side wall of the movable rod, the two ends of the first spring are respectively fixed to the bottom of the second movable plate and the top of the conical disk, and a second telescopic mechanism is arranged on the top of the second movable plate, a second movable block is connected to the second telescopic mechanism, the side wall of the second movable block is fixedly connected to the third movable plate, and the top of the third movable plate is fixedly connected to the second fixed plate, and the side wall of the second fixed plate is provided with a sliding groove, The top of the second movable plate is fixedly connected to two symmetrically arranged first support blocks, and the opposite side walls of the two first support blocks are rotatably connected with a rotating pin, the side wall fixed sleeve of the rotating pin is provided with a pointer, and the side wall of the pointer is fixedly connected with a pushing pin, and the pushing pin is inserted in the slide groove, and the top of the second movable plate is fixedly connected to an arc plate, and the side wall of the arc plate is provided with a scale mark, the top of the second movable plate is fixedly connected to a first mounting block, and the side wall of the first mounting block is fixedly inserted with a distance sensor, and the side wall of the second movable plate is provided with a cleaning mechanism for cleaning the top of the heating plate, the top of the lower cover is provided with a first pushing mechanism, and the first pushing mechanism is used to push the second movable plate to move up and down, and a limiting mechanism is provided between the second movable plate and the first movable plate, and the limiting mechanism is used to limit the second movable plate.

[0007] Preferably, the lifting mechanism includes two connecting plates fixedly connected to the bottom of each electric heating ring, and the bottom of each connecting plate is fixedly connected to a connecting rod, the bottom of the heating plate is fixedly connected to a support plate, and the side wall of the support plate is fixedly connected to a first mounting plate, the lower end of the connecting rod passes through the bottom of the first mounting plate and is fixedly connected to a third moving block, the side wall of the support plate is provided with a pushing assembly, and the pushing assembly is used to push the third moving block to move, the side wall of each connecting rod is sleeved with a first return spring, and the two ends of the first return spring are respectively fixed to the top of the first mounting plate and the bottom of the connecting plate.

[0008] Preferably, the pushing assembly includes a first pushing rod fixedly connected to the side wall of each third moving block, and the side wall of the support plate is connected to the fourth moving block through a moving module, the bottom of the fourth moving block is fixedly connected to an inclined plate, and the bottom of the inclined plate is fixedly connected to a flat plate.

[0009] Preferably, the first pushing mechanism includes a first supporting frame and a second supporting frame fixedly connected to the top of the lower cover, and the top of the first supporting frame is fixedly connected with a first pushing block, and the first pushing block includes a first inclined surface, the top of the second supporting frame is fixedly connected with a second pushing block, and the second pushing block includes a second inclined surface, the side wall of the second movable plate close to the first pushing block is fixedly connected with the first fixed block, and the side wall of the second movable plate close to the second pushing block is fixedly connected with the second fixed block.

[0010] Preferably, the limiting mechanism includes two T-shaped guide rods fixedly connected to the side wall of the first movable plate, and the side wall of the T-shaped guide rod is sleeved with a fourth movable plate, the side wall of the fourth movable plate is fixedly connected with a first limiting rod and a second limiting rod, and the second limiting rod is directly above the first limiting rod, and the side wall of the second movable plate close to the fourth movable plate is provided with a hemispherical limiting groove, the side wall of each T-shaped guide rod is sleeved with a second spring, and the two ends of the second spring are respectively fixed to the side wall of the fourth movable plate and the end of the T-shaped guide rod.

[0011] Preferably, the exhaust mechanism includes two exhaust pipes fixedly connected to the bottom of the lower cover and the side wall of the upper cover, and a hose is fixedly connected between the two exhaust pipes, a collecting pipe is fixedly inserted into the side wall of the shell, the air inlet end of the collecting pipe is fixedly connected to an exhaust fan, and the air inlet end of the exhaust fan is fixed to the side wall of the hose.

[0012] Preferably, the moving mechanism includes two groups of second support blocks fixedly connected to the top of the lower cover, and the number of second support blocks in each group is two, and the side walls of each group of second support blocks are fixedly connected to two guide rods, the side wall of each first movable plate is fixedly connected with a slider, and the slider is sleeved on the side wall of the guide rod, the side wall of each guide rod is sleeved with a second return spring, and the two ends of the second return spring are respectively fixed to the slider and the side wall of the second support block, the side wall of the mounting rod is fixedly connected with a connecting frame, and the side wall of the connecting frame is fixedly connected with a push plate, the bottom of the push plate is provided with a third inclined surface, and the side wall of the push plate is fixedly connected with a stopper.

[0013] Preferably, the cleaning mechanism includes a third fixed block fixedly connected to the side wall of the second movable plate, and the side wall of the third fixed block is fixedly connected to two first sleeves, each of the first sleeves is inserted with a first rod, and the end of the first rod away from the first sleeve is fixedly connected to the fifth movable plate, the bottom of the fifth movable plate is fixedly connected to a plurality of brushes, and the plurality of brushes are arranged at equal intervals, a second pushing mechanism is provided on the top of the lower cover, and the second pushing mechanism is used to push the fifth movable plate to move, the side wall of each of the first sleeves is sleeved with a third return spring, and the two ends of the third return spring are respectively fixed to the fifth movable plate and the side wall of the third fixed block.

[0014] Preferably, the second pushing mechanism includes a third support frame fixedly connected to the top of the lower cover, and the top of the third support frame is fixedly connected to a second mounting plate, the side wall of the fifth movable plate is fixedly connected to a second mounting block, and the side wall of the second mounting block is fixedly connected to a second pushing rod, one end of the second pushing rod away from the second mounting block slides on the side wall of the second mounting plate and forms a sliding surface, a plurality of array-arranged protrusions are fixedly connected to the sliding surface, and one end of the second pushing rod away from the second mounting block slides on the edge of the protrusion.

[0015] Preferably, the first telescopic mechanism includes a second rod fixedly connected to the top of each first movable plate, and the side wall of the second rod is sleeved with a second sleeve, the upper end of the second sleeve is fixed to the bottom of the second movable plate, the side wall of the second sleeve is sleeved with a third spring, and the two ends of the third spring are respectively fixed to the top of the first movable plate and the bottom of the second movable plate.

[0016] Preferably, the second telescopic mechanism includes two third rods fixedly connected to the top of the second movable plate, and the side wall of each third rod is sleeved with a third sleeve, the upper end of the third sleeve is fixed to the bottom of the second movable block, the side wall of the third sleeve is sleeved with a fourth spring, and the two ends of the fourth spring are respectively fixed to the top of the second movable plate and the bottom of the second movable block.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] (1) This type of heating device for wafer processing is provided with an exhaust mechanism and a lifting mechanism. When the wafer needs to be heated, the wafer is first adsorbed by the suction cup on the loading robot and placed on the top of the heating plate. Then, the wafer is spin-coated by the spin coating module. After the spin coating is completed, the upper cover is driven downward by the cylinder and contacts with the top of the lower cover to form a sealing effect. Then, the upper cover is adjusted according to the diameter of the wafer. During the adjustment, the moving module is started to move the fourth moving block toward the support plate, and at the same time, the inclined plate and the flat plate are driven to move synchronously. When the first push rod slides along the inclined plate to the bottom of the flat plate, the third moving block can be pushed downward, and the electric heating ring is driven downward by the connecting rod and the connecting plate. At the same time, the first return spring is compressed to move the electric heating ring on the periphery of the wafer downward, and then the electric heating disc and the electric heating ring under the wafer can be energized. At this time, the wafer can be heated by the heating disc. By zoning the electric heating module, it is convenient to adjust the heating range according to the diameter of the wafer, which not only makes the heating more uniform, but also avoids heat waste, and is more energy-saving and environmentally friendly. At the same time, the exhaust fan is started to perform exhaust operation, so that the air between the lower cover and the upper cover and the organic matter generated by volatilization enter the hose through the exhaust pipe, and are discharged through the exhaust fan and the collecting pipe for purification. Not only can the heating be more uniform, but also can avoid the condensation of organic matter on the wafer, thereby ensuring the quality of wafer heating.

[0019] (2) This type of heating device for wafer processing is provided with a detection mechanism, etc., when the wafer moves to the top of the heating plate, when the loading robot and the suction cup continue to move downward, when the third inclined surface of the pushing plate abuts against the side of the second moving plate, the second moving plate can be pushed to move, and at the same time, the first moving plate is driven to move by the first telescopic mechanism, and the slider is driven to move along the guide rod toward the direction close to the second support frame. At the same time, the second return spring is compressed, so that the multiple conical disks can be driven to move synchronously through the moving rod and the first spring. When the conical disk abuts against the side wall of the heating plate, the conical disk and the moving rod can be pushed to move upward. At the same time, the first spring is compressed. When the conical disk moves to the top of the heating plate, under the action of the first spring, the conical disk abuts against the top of the heating plate and slides on its surface. Moreover, when the conical disk and the moving rod move upward, the upper end of the moving rod abuts against the bottom of the third moving plate, thereby When the third movable plate moves upward, the second movable block and the second fixed plate are driven to move upward synchronously. At the same time, the fourth spring is compressed, and when the second fixed plate moves upward, the pushing pin slides downward along the slide groove and pushes the pointer to rotate clockwise along the rotating pin. At this time, the initial scale mark indicated by the pointer is detected by the distance sensor, and when the conical disk heating plate slides on the top, when the top of the heating plate is warped, it will push the conical disk and the moving rod to continue to move upward. At this time, the pointer can be pushed to continue to rotate upward along the rotating pin. When the distance sensor detects that the initial scale mark indicated by the pointer becomes larger, it can be determined that the top of the heating plate is warped. Therefore, before placing the wafer, the warping deformation of the top of the heating plate can be automatically detected, which can ensure the bonding effect of the wafer after placement, ensure the uniformity of wafer heating, and thus ensure the quality of wafer heating.

[0020] (3) This type of heating device for wafer processing, by setting a first pushing mechanism and a limiting mechanism, when detecting the top of the heating plate, when the third inclined surface of the pushing plate abuts against the side of the second movable plate, it can push the second movable plate to move in the direction close to the second support frame. After the detection is completed, when the second fixed block abuts against the second inclined surface, it can push the second movable plate to move upward and drive the conical plate to move upward. At the same time, the third spring is stretched. When the stop block slides to the side wall of the second movable plate, when the loading robot drives the suction cup to continue to move downward, the wafer can be placed on the top of the heating plate. At the same time, when the second movable plate moves upward, the first limiting rod can slide out of the limiting groove and on the side wall of the second movable plate. When the second limit rod is aligned with the limit groove, the second limit rod can be inserted into the limit groove for limiting under the action of the second spring. After the placement is completed, when the loading robot drives the suction cup to move upward, the second movable plate can gradually separate from the stop block and the third inclined surface. At this time, it can be moved and reset in the direction close to the first support frame under the action of the second reset spring. At this time, there is a distance between the conical disk and the top of the wafer to avoid interference with the wafer. When the first fixed block is against the first inclined surface, the second movable plate can be pushed to move downward. At this time, the first limit rod is inserted into the limit groove for limiting, and drives the conical disk to move downward and reset, thereby facilitating subsequent detection operations and making it more convenient and quick to use.

[0021] (4) This type of heating device for wafer processing, by providing a cleaning mechanism, etc., can, during inspection, when the second movable plate moves, drive the fifth movable plate and the brush to move synchronously, and when the end of the second push rod abuts against the protrusion, it can push the fifth movable plate to move in the direction close to the third fixed block. At the same time, the third reset spring is compressed. When the end of the second push rod passes over the protrusion, the fifth movable plate can move and reset under the action of the third reset spring, and so on and so forth, so that the fifth movable plate can drive the brush to move back and forth, thereby cleaning the top of the heating plate, which not only ensures that the inspection result is more accurate, but also ensures the bonding effect after the wafer is placed and the quality of heating. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the use state of the present invention;

[0023] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 3 It is a structural schematic diagram of the moving mechanism in the present invention;

[0025] Figure 4 It is a structural schematic diagram of the detection mechanism in the present invention;

[0026] Figure 5 It is a schematic diagram of the position of the limiting mechanism in the present invention;

[0027] Figure 6 It is a schematic diagram of the overall structure of the heating plate in the present invention;

[0028] Figure 7 Schematic diagram of the internal structure of the heating plate in the present invention

[0029] Figure 8 for Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0030] Fig. 9 for Figure 3 A schematic diagram of the enlarged structure at B in the middle;

[0031] Fig.10 for Figure 5 Schematic diagram of the enlarged structure at C in the middle;

[0032] Fig.11 for Figure 3 Schematic diagram of the enlarged structure at D in the middle;

[0033] Fig.12 for Figure 4 Schematic diagram of the enlarged structure at E in the middle;

[0034] Fig.13 for Figure 7 The enlarged structural diagram at F in the middle;

[0035] Fig.14 for Fig.12 Schematic diagram of the enlarged structure at G in the middle.

[0036] In the figure: 101, housing; 102, spin coating module; 103, feeding manipulator; 104, mounting rod; 105, suction cup; 201, support plate; 202, first mounting plate; 203, connecting rod; 204, connecting plate; 205, third moving block; 206, first return spring; 301, first push rod; 302, moving module; 303, fourth moving block; 304, inclined plate; 305, flat plate; 401, third set rod; 402, third sleeve; 403, fourth spring; 501, first fixed block; 502, first support frame; 503, first push block; 5 ...4, first return spring; 505, first push rod; 506, first return spring; 506, first push rod; 502, first support frame; 503, first push block; 504, first return spring; 504, first push rod; 504, first push block; 505, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 504, first push rod; 4, first inclined plane; 505, second fixed block; 506, second support frame; 507, second push block; 508, second inclined plane; 601, fifth movable plate; 602, brush; 603, third fixed block; 604, first sleeve; 605, first set of rods; 606, third return spring; 701, second sleeve; 702, second set of rods; 703, third spring; 801, third support frame; 802, second mounting plate; 803, protrusion; 804, second mounting block; 805, second push rod; 901, T-shaped guide rod; 902, fourth movable plate; 903, second Spring; 904, limit groove; 905, first limit rod; 906, second limit rod; 1001, second support block; 1002, guide rod; 1003, slider; 1004, second return spring; 1005, push plate; 1006, third inclined plane; 1007, stopper; 1008, connecting frame; 1101, first fixing plate; 1102, first motor; 1103, rotating rod; 1104, heating plate; 1105, through hole; 1106, cylinder; 1107, upper cover; 1108, lower cover; 1109, electric heating disc; 1110, electric heating ring; 12 01, first movable plate; 1202, second movable plate; 1203, movable rod; 1204, conical disk; 1205, first spring; 1206, third movable plate; 1207, second movable block; 1208, first supporting block; 1209, rotating pin; 1210, pointer; 1211, second fixed plate; 1212, slide groove; 1213, push pin; 1214, arc plate; 1215, scale mark; 1216, first mounting block; 1217, distance sensor; 1301, exhaust duct; 1302, hose; 1303, exhaust fan; 1304, collecting pipe. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] See also Figure 1-Figure 14 The present invention provides a technical solution: a heating device for wafer processing, comprising a shell 101 arranged on a glue coating and developing device, wherein a pick-up module, a spin coating module 102 and a heating module are arranged in the shell 101, wherein the pick-up module comprises a loading robot 103, wherein a mounting rod 104 is fixedly connected to the loading robot 103, and a suction cup 105 is fixedly connected to the lower end of the mounting rod 104, wherein the heating module comprises two first fixing plates 1101 fixedly connected to the bottom of the shell 101, and a lower cover 1108 is fixedly connected to the top of the first fixing plates 1101, wherein the lower cover 110 The bottom of the housing 101 is fixedly connected to a first motor 1102, and the output end of the first motor 1102 is fixedly connected to a rotating rod 1103, the upper end of the rotating rod 1103 is fixedly connected to a hollow heating plate 1104, and the top and bottom of the heating plate 1104 are provided with a plurality of through holes 1105 arranged in an array, which can reduce the warping caused by stress, the top of the housing 101 is fixedly connected to a cylinder 1106, and the lower end of the cylinder 1106 is fixedly connected to an upper cover 1107, and an electric heating module is arranged in the heating plate 1104, and the electric heating module includes an electric heating disc 110 9 and a plurality of concentrically arranged electric heating rings 1110, and the electric heating disc 1109 is fixed to the top of the heating disc 1104, a lifting mechanism is arranged between the electric heating ring 1110 and the bottom of the heating disc 1104, an exhaust mechanism for exhausting the gas inside is arranged on the lower cover 1108 and the upper cover 1107, and a detection mechanism for detecting the warping deformation of the top of the heating disc 1104 is arranged on the top of the lower cover 1108. By arranging the electric heating modules in different areas, it is convenient to adjust the heating range according to the diameter size of the wafer, which not only makes the heating more uniform, but also It can ensure uniformity and avoid waste of heat, which is more energy-saving and environmentally friendly. When placing the wafer, the top of the heating plate 1104 can be cleaned, and at the same time, the warping deformation of the top of the heating plate 1104 can be automatically detected, so as to ensure the bonding effect of the wafer after placement and the uniformity of wafer heating, thereby ensuring the quality of wafer heating. When heating, the air between the lower cover 1108 and the upper cover 1107 and the organic matter generated by volatilization can be discharged, which not only makes the heating more uniform, but also avoids the condensation of organic matter on the wafer, thereby ensuring the quality of wafer heating.

[0039] The detection mechanism includes two first movable plates 1201 arranged on the top of the lower cover 1108, a movable mechanism is arranged between the first movable plate 1201 and the lower cover 1108, and a first telescopic mechanism is arranged on the top of each first movable plate 1201, and the second movable plate 1202 is connected to the first telescopic mechanism, and a plurality of movable rods 1203 are inserted on the top of the second movable plate 1202, and the plurality of movable rods 1203 are arranged at equal intervals, and the lower end of each movable rod 1203 is fixedly connected to a conical disk 1204, and the side wall of the movable rod 1203 is sleeved with a first spring 1205, and the two ends of the first spring 1205 are respectively fixed to the bottom of the second movable plate 1202 and the top of the conical disk 1204, and the second movable plate 1202 A second telescopic mechanism is arranged on the top, and a second moving block 1207 is connected to the second telescopic mechanism. A third moving plate 1206 is fixedly connected to the side wall of the second moving block 1207, and a second fixed plate 1211 is fixedly connected to the top of the third moving plate 1206. A sliding groove 1212 is provided on the side wall of the second fixed plate 1211, and two symmetrically arranged first supporting blocks 1208 are fixedly connected to the top of the second moving plate 1202. The opposite side walls of the two first supporting blocks 1208 are rotatably connected with a rotating pin 1209, and a pointer 1210 is fixedly sleeved on the side wall of the rotating pin 1209, and a pushing pin 1213 is fixedly connected to the side wall of the pointer 1210, and the pushing pin 1213 is inserted in the sliding groove 1212, and the second moving plate 120 2 is fixedly connected with an arc plate 1214 on the top, and a scale mark 1215 is set on the side wall of the arc plate 1214; the top of the second movable plate 1202 is fixedly connected with a first mounting block 1216, and a distance sensor 1217 is fixedly inserted into the side wall of the first mounting block 1216; the side wall of the second movable plate 1202 is provided with a cleaning mechanism for cleaning the top of the heating disk 1104; the top of the lower cover 1108 is provided with a first pushing mechanism, and the first pushing mechanism is used to push the second movable plate 1202 to move up and down; a limiting mechanism is set between the second movable plate 1202 and the first movable plate 1201, and the limiting mechanism is used to limit the second movable plate 1202, and the wafer moves to the top of the heating disk 1104. When the feeding robot 103 and the suction cup 105 continue to move downward, the second moving plate 1202 is moved by the moving mechanism, and at the same time, the first moving plate 1201 is moved by the first telescopic mechanism, so that the multiple conical disks 1204 can be driven to move synchronously through the moving rod 1203 and the first spring 1205. When the conical disk 1204 abuts against the side wall of the heating disk 1104, the conical disk 1204 and the moving rod 1203 can be pushed to move upward. At the same time, the first spring 1205 is compressed. When the conical disk 1204 moves to the top of the heating disk 1104, under the action of the first spring 1205, the conical disk 1204 abuts against the top of the heating disk 1104 and slides on its surface, and,When the conical disk 1204 and the moving rod 1203 move upward, the upper end of the moving rod 1203 abuts against the bottom of the third moving plate 1206, thereby pushing the third moving plate 1206 to move upward. When the third moving plate 1206 moves upward, the second moving block 1207 and the second fixed plate 1211 move upward synchronously. At the same time, the fourth spring 403 is compressed. When the second fixed plate 1211 moves upward, the pushing pin 1213 slides downward along the sliding groove 1212 and pushes the pointer 1210 to rotate clockwise along the rotating pin 1209. At this time, the initial scale mark 1215 indicated by the pointer 1210 is detected by the distance sensor 1217. Furthermore, when the conical disk 1204 heating disk slides on the top of 1104, when the top of the heating disk 1104 is warped, the conical disk 1204 and the moving rod 1203 are pushed to continue to move upward. At this time, the pointer 1210 can be pushed to continue to rotate upward along the rotating pin 1209. When the distance sensor 1217 detects that the initial scale mark 1215 indicated by the pointer 1210 becomes larger, it can be determined that the top of the heating disk 1104 is warped. Therefore, before placing the wafer, the warping deformation of the top of the heating disk 1104 can be automatically detected, which can ensure the bonding effect of the wafer after placement, ensure the uniformity of the wafer heating, and thus ensure the quality of the wafer heating.

[0040] The lifting mechanism includes two connecting plates 204 fixedly connected to the bottom of each electric heating ring 1110, and the bottom of each connecting plate 204 is fixedly connected to a connecting rod 203, the bottom of the heating plate 1104 is fixedly connected to a support plate 201, and the side wall of the support plate 201 is fixedly connected to a first mounting plate 202, the lower end of the connecting rod 203 passes through the bottom of the first mounting plate 202 and is fixedly connected to a third moving block 205, the side wall of the support plate 201 is provided with a pushing component, and the pushing component is used to push the third moving block 205 to move, the side wall of each connecting rod 203 is sleeved with a first return spring 206, and the two ends of the first return spring 206 are respectively connected to the top of the first mounting plate 202 and the connecting plate 20 4 is fixed at the bottom and is adjusted according to the diameter of the wafer. When adjusting, the third moving block 205 is pushed downward by the pushing assembly, and the electric heating ring 1110 is driven to move downward by the connecting rod 203 and the connecting plate 204. At the same time, the first reset spring 206 is compressed to move the electric heating ring 1110 around the wafer downward, and then the electric heating disc 1109 and the electric heating ring 1110 under the wafer can be energized. At this time, the wafer can be heated by the heating disc 1104. By zoning the electric heating module, it is convenient to adjust the heating range according to the diameter of the wafer, which not only makes the heating more uniform, but also avoids heat waste, and is more energy-saving and environmentally friendly.

[0041] The pushing assembly includes a first pushing rod 301 fixedly connected to the side wall of each third moving block 205, and the side wall of the support plate 201 is connected to the fourth moving block 303 through the moving module 302, the bottom of the fourth moving block 303 is fixedly connected to the inclined plate 304, and the bottom of the inclined plate 304 is fixedly connected to the flat plate 305. When adjusting, start the moving module 302 to make the fourth moving block 303 move toward the direction close to the support plate 201, and at the same time, drive the inclined plate 304 and the flat plate 305 to move synchronously. When the first pushing rod 301 slides along the inclined plate 304 to the bottom of the flat plate 305, it can push the third moving block 205 to move downward, and drive the electric heating ring 1110 to move downward through the connecting rod 203 and the connecting plate 204.

[0042] The first pushing mechanism includes a first supporting frame 502 and a second supporting frame 506 fixedly connected to the top of the lower cover 1108, and the top of the first supporting frame 502 is fixedly connected with a first pushing block 503, and the first pushing block 503 includes a first inclined surface 504, the top of the second supporting frame 506 is fixedly connected with a second pushing block 507, and the second pushing block 507 includes a second inclined surface 508, the side wall of the second movable plate 1202 close to the first pushing block 503 is fixedly connected with the first fixed block 501, and the side wall of the second movable plate 1202 close to the second pushing block 507 is fixedly connected with the second fixed block 505, when the top of the heating plate 1104 is detected, when the third inclined surface 1006 of the pushing plate 1005 abuts against the side edge of the second movable plate 1202, it can push the second movable plate 1202 to be close to the second supporting frame 502. The support frame 506 moves in the direction of the support frame 506. After the inspection is completed, when the second fixed block 505 abuts against the second inclined surface 508, the second movable plate 1202 can be pushed to move upward and drive the conical disk 1204 to move upward. After the placement is completed, when the loading robot 103 drives the suction cup 105 to move upward, the second movable plate 1202 can gradually separate from the stop block 1007 and the third inclined surface 1006. At this time, it can be moved and reset in the direction close to the first support frame 502 under the action of the moving mechanism. At this time, there is a distance between the conical disk 1204 and the top of the wafer to avoid interference with the wafer. When the first fixed block 501 abuts against the first inclined surface 504, the second movable plate 1202 can be pushed to move downward and drive the conical disk 1204 to move downward and reset, thereby facilitating subsequent detection operations and making it more convenient and quick to use.

[0043] The limiting mechanism includes two T-shaped guide rods 901 fixedly connected to the side wall of the first movable plate 1201, and the side wall of the T-shaped guide rod 901 is sleeved with a fourth movable plate 902, the side wall of the fourth movable plate 902 is fixedly connected with a first limiting rod 905 and a second limiting rod 906, and the second limiting rod 906 is located directly above the first limiting rod 905, and the side wall of the second movable plate 1202 close to the fourth movable plate 902 is provided with a hemispherical limiting groove 904, and the side wall of each T-shaped guide rod 901 is sleeved with a second spring 903, and the two ends of the second spring 903 are respectively connected to the fourth movable plate 902. The side wall of the movable plate 902 and the end of the T-shaped guide rod 901 are fixed. When the second movable plate 1202 moves upward, the first limiting rod 905 can slide out of the limiting groove 904 and slide on the side wall of the second movable plate 1202. At the same time, the second spring 903 is compressed. When the second limiting rod 906 is aligned with the limiting groove 904, under the action of the second spring 903, the second limiting rod 906 can be inserted into the limiting groove 904 for limiting. When the second movable plate 1202 moves downward, the first limiting rod 905 is inserted into the limiting groove 904 for limiting.

[0044] The exhaust mechanism includes two exhaust pipes 1301 fixedly connected to the bottom of the lower cover 1108 and the side wall of the upper cover 1107, and a hose 1302 is fixedly connected between the two exhaust pipes 1301. A collecting pipe 1304 is fixedly inserted into the side wall of the shell 101, and an exhaust fan 1303 is fixedly connected to the air inlet end of the collecting pipe 1304, and the air inlet end of the exhaust fan 1303 is fixed to the side wall of the hose 1302. The exhaust fan 1303 is started to perform exhaust operation, so that the air between the lower cover 1108 and the upper cover 1107 and the organic matter generated by volatilization enter the hose 1302 through the exhaust pipe 1301, and are discharged through the exhaust fan 1303 and the collecting pipe 1304 for purification treatment, which can not only make the heating more uniform, but also prevent the organic matter from condensing on the wafer, thereby ensuring the quality of wafer heating.

[0045] The moving mechanism includes two groups of second support blocks 1001 fixedly connected to the top of the lower cover 1108, and the number of each group of second support blocks 1001 is two, and the side walls of each group of second support blocks 1001 are fixedly connected to two guide rods 1002, and the side walls of each first movable plate 1201 are fixedly connected to a slider 1003, and the slider 1003 is sleeved on the side walls of the guide rods 1002, and the side walls of each guide rod 1002 are sleeved with a second return spring 1004, and the two ends of the second return spring 1004 are respectively fixed to the slider 1003 and the side walls of the second support blocks 1001, and the side walls of the mounting rods 104 are fixedly connected to a connecting frame 1008, and the side walls of the connecting frame 1008 are fixed. A pushing plate 1005 is connected, a third inclined surface 1006 is provided at the bottom of the pushing plate 1005, and a stopper 1007 is fixedly connected to the side wall of the pushing plate 1005. When the wafer moves to the top of the heating plate 1104, when the loading robot 103 and the suction cup 105 continue to move downward, when the third inclined surface 1006 of the pushing plate 1005 abuts against the side of the second movable plate 1202, the second movable plate 1202 can be pushed to move. At the same time, the first movable plate 1201 is driven to move through the first telescopic mechanism, and the slider 1003 is driven to move along the guide rod 1002 toward the direction close to the second support frame 506. At the same time, the second return spring 1004 is compressed.

[0046] The cleaning mechanism includes a third fixed block 603 fixedly connected to the side wall of the second movable plate 1202, and the side wall of the third fixed block 603 is fixedly connected to two first sleeves 604, each first sleeve 604 is inserted with a first rod 605, and the end of the first rod 605 away from the first sleeve 604 is fixedly connected to the fifth movable plate 601, and the bottom of the fifth movable plate 601 is fixedly connected to a plurality of brushes 602, and the plurality of brushes 602 are arranged at equal intervals, and a second pushing mechanism is arranged on the top of the lower cover 1108, and the second pushing mechanism is used to push the fifth movable plate 601 to move, and the side wall of each first sleeve 604 A third return spring 606 is provided, and both ends of the third return spring 606 are respectively fixed to the side walls of the fifth movable plate 601 and the third fixed block 603. During detection, when the second movable plate 1202 moves, it can drive the fifth movable plate 601 and the brush 602 to move synchronously. At the same time, the fifth movable plate 601 drives the brush 602 to move back and forth through the second pushing mechanism and the third return spring 606, so that the top of the heating plate 1104 can be cleaned, which not only ensures that the detection result is more accurate, but also ensures the bonding effect after the wafer is placed and the quality of heating.

[0047] The second pushing mechanism includes a third support frame 801 fixedly connected to the top of the lower cover 1108, and the top of the third support frame 801 is fixedly connected to the second mounting plate 802, the side wall of the fifth movable plate 601 is fixedly connected to the second mounting block 804, and the side wall of the second mounting block 804 is fixedly connected to the second pushing rod 805, the end of the second pushing rod 805 away from the second mounting block 804 slides on the side wall of the second mounting plate 802 and forms a sliding surface, a plurality of array-arranged protrusions 803 are fixedly connected to the sliding surface, and the end of the second pushing rod 805 away from the second mounting block 804 slides on the edge of the protrusion 803, during detection, when the second movable plate 1202 moves, it can drive the fifth movable plate 601 and the brush 602 to move synchronously, and when the end of the second pushing rod 805 abuts against the protrusion 803, it can push the fifth movable plate 601 to move in the direction close to the third fixed block 603.

[0048] The first telescopic mechanism includes a second rod 702 fixedly connected to the top of each first movable plate 1201, and the side wall of the second rod 702 is sleeved with a second sleeve 701, the upper end of the second sleeve 701 is fixed to the bottom of the second movable plate 1202, the side wall of the second sleeve 701 is sleeved with a third spring 703, and the two ends of the third spring 703 are respectively fixed to the top of the first movable plate 1201 and the bottom of the second movable plate 1202, which guides and resets the movement of the second movable plate 1202.

[0049] The second telescopic mechanism includes two third rods 401 fixedly connected to the top of the second movable plate 1202, and the side wall of each third rod 401 is sleeved with a third sleeve 402, the upper end of the third sleeve 402 is fixed to the bottom of the second movable block 1207, the side wall of the third sleeve 402 is sleeved with a fourth spring 403, and the two ends of the fourth spring 403 are respectively fixed to the top of the second movable plate 1202 and the bottom of the second movable block 1207, which guides and resets the movement of the second movable block 1207.

[0050] Working principle: During use, when the wafer needs to be heated, the suction cup 105 on the loading robot 103 is first used to adsorb the wafer and place it on the top of the heating plate 1104. When the wafer moves to the top of the heating plate 1104, when the loading robot 103 and the suction cup 105 continue to move downward, when the third inclined surface 1006 of the push plate 1005 abuts against the side of the second moving plate 1202, the second moving plate 1202 can be pushed to move. At the same time, the first moving plate 1201 is driven to move by the first telescopic mechanism, and the slider 1003 is driven to move along the guide rod 1002 toward the direction close to the second support frame 506. At the same time, the second return spring 1004 is compressed, so that the multiple conical disks 1204 can be driven to move synchronously through the moving rod 1203 and the first spring 1205.

[0051] When the conical disk 1204 abuts against the side wall of the heating disk 1104, the conical disk 1204 and the moving rod 1203 can be pushed to move upward. At the same time, the first spring 1205 is compressed. When the conical disk 1204 moves to the top of the heating disk 1104, the conical disk 1204 abuts against the top of the heating disk 1104 and slides on its surface under the action of the first spring 1205. Moreover, when the conical disk 1204 and the moving rod 1203 move upward, the upper end of the moving rod 1203 abuts against the bottom of the third moving plate 1206. The third movable plate 1206 is pushed upward, and when the third movable plate 1206 moves upward, the second movable block 1207 and the second fixed plate 1211 are driven to move upward synchronously. Meanwhile, the fourth spring 403 is compressed, and when the second fixed plate 1211 moves upward, the push pin 1213 slides downward along the slide slot 1212, and pushes the pointer 1210 to rotate clockwise along the rotating pin 1209. At this time, the initial scale mark 1215 indicated by the pointer 1210 is detected by the distance sensor 1217;

[0052] Furthermore, when the conical disk 1204 heating disk slides on the top of 1104, when the top of the heating disk 1104 is warped, the conical disk 1204 and the moving rod 1203 are pushed to continue to move upward. At this time, the pointer 1210 can be pushed to continue to rotate upward along the rotating pin 1209. When the distance sensor 1217 detects that the initial scale mark 1215 indicated by the pointer 1210 becomes larger, it can be determined that the top of the heating disk 1104 is warped. Therefore, before placing the wafer, the warping deformation of the top of the heating disk 1104 can be automatically detected, which can ensure the bonding effect of the wafer after placement, ensure the uniformity of the wafer heating, and thus ensure the quality of the wafer heating.

[0053] When the top of the heating plate 1104 is tested, when the third inclined surface 1006 of the push plate 1005 abuts against the side of the second movable plate 1202, the second movable plate 1202 can be pushed to move in the direction close to the second support frame 506. After the test is completed, when the second fixed block 505 abuts against the second inclined surface 508, the second movable plate 1202 can be pushed to move upward, and the conical plate 1204 can be driven to move upward. At the same time, the third spring 703 is stretched, and the stopper 1007 slides to the side of the second movable plate 1202. When the loading robot 103 drives the suction cup 105 to continue to move downward, the wafer can be placed on the top of the heating plate 1104. At the same time, when the second movable plate 1202 moves upward, the first limiting rod 905 can slide out of the limiting groove 904 and slide on the side wall of the second movable plate 1202. At the same time, the second spring 903 is compressed. When the second limiting rod 906 is aligned with the limiting groove 904, under the action of the second spring 903, the second limiting rod 906 can be inserted into the limiting groove 904 for limiting.

[0054] After the wafer is placed, when the loading robot 103 drives the suction cup 105 to move upward, the second movable plate 1202 can gradually separate from the stop block 1007 and the third inclined surface 1006. At this time, it can be moved and reset in the direction close to the first support frame 502 under the action of the second reset spring 1004. At this time, there is a distance between the conical disk 1204 and the top of the wafer to avoid interference with the wafer. When the first fixed block 501 is against the first inclined surface 504, the second movable plate 1202 can be pushed to move downward. At this time, the first limiting rod 905 is inserted into the limiting groove 904 for limiting, and drives the conical disk 1204 to move downward and reset, thereby facilitating subsequent detection operations and being more convenient and quick to use.

[0055] At the same time, when the second movable plate 1202 moves, it can drive the fifth movable plate 601 and the brush 602 to move synchronously. When the end of the second push rod 805 abuts against the protrusion 803, it can push the fifth movable plate 601 to move in the direction close to the third fixed block 603. At the same time, the third reset spring 606 is compressed. When the end of the second push rod 805 passes over the protrusion 803, the fifth movable plate 601 can move and reset under the action of the third reset spring 606. In this way, the fifth movable plate 601 can drive the brush 602 to move back and forth, so that the top of the heating plate 1104 can be cleaned, which not only ensures that the detection result is more accurate, but also ensures the bonding effect after the wafer is placed and the heating quality.

[0056] Next, the wafer is spin-coated by the spin-coating module 102. After the spin-coating is completed, the upper cover 1107 is driven by the cylinder 1106 to move downward and contact the top of the lower cover 1108 to form a sealing effect. Next, the adjustment is made according to the diameter of the wafer. During the adjustment, the moving module 302 is started to move the fourth moving block 303 toward the direction close to the support plate 201. At the same time, the inclined plate 304 and the flat plate 305 are driven to move synchronously. When the first push rod 301 slides along the inclined plate 304 to the bottom of the flat plate 305, it can push the third moving block 205. The first return spring 206 is compressed to move the electric heating ring 1110 around the wafer downward, and then the electric heating disc 1109 and the electric heating ring 1110 below the wafer are powered on. At this time, the heating disc 1104 can be used to heat the wafer. By arranging the electric heating modules in different areas, the heating range can be adjusted according to the diameter of the wafer, which not only makes the heating more uniform, but also avoids heat waste, and is more energy-saving and environmentally friendly.

[0057] At the same time, the exhaust fan 1303 is started to perform exhaust operation, so that the air between the lower cover 1108 and the upper cover 1107 and the volatilized organic matter enter the hose 1302 through the exhaust pipe 1301, and are discharged through the exhaust fan 1303 and the collection pipe 1304 for purification treatment, which can not only make the heating more uniform, but also prevent the organic matter from condensing on the wafer, thereby ensuring the quality of wafer heating;

[0058] After the heating is completed, the upper cover 1107 is driven by the cylinder 1106 to move upward and separate from the top of the lower cover 1108, and then the heated wafer can be removed by the material removal robot.

Claims

1. A heating device for wafer processing, comprising a housing (101) arranged on a coating and developing device, wherein a pick-up and delivery module, a spin coating module (102) and a heating module are arranged in the housing (101), wherein the pick-up and delivery module comprises a loading robot (103), wherein a mounting rod (104) is fixedly connected to the loading robot (103), and a suction cup (105) is fixedly connected to the lower end of the mounting rod (104), wherein: The heating module comprises two first fixing plates (1101) fixedly connected to the bottom of the shell (101), and the top of the first fixing plates (1101) is fixedly connected to a lower cover (1108), the bottom of the lower cover (1108) is fixedly connected to a first motor (1102), and the output end of the first motor (1102) is fixedly connected to a rotating rod (1103), the upper end of the rotating rod (1103) is fixedly connected to a hollow heating plate (1104), and the top and bottom of the heating plate (1104) are both provided with a plurality of through holes (1105) arranged in an array, the top of the shell (101) is fixedly connected to a cylinder (1106), and the cylinder (110 6) is fixedly connected to an upper cover (1107) at its lower end, an electric heating module is arranged inside the heating plate (1104), the electric heating module comprises an electric heating disc (1109) and a plurality of concentrically arranged electric heating rings (1110), and the electric heating disc (1109) is fixed to the top of the heating plate (1104), a lifting mechanism is arranged between the electric heating ring (1110) and the bottom of the heating plate (1104), an exhaust mechanism for discharging the gas inside the lower cover (1108) and the upper cover (1107), and a detection mechanism for detecting the warping deformation of the top of the heating plate (1104) is arranged on the top of the lower cover (1108).

2. A wafer processing heating device according to claim 1, characterized in that: The detection mechanism comprises two first movable plates (1201) arranged on the top of the lower cover (1108), a movable mechanism is arranged between the first movable plates (1201) and the lower cover (1108), and a first telescopic mechanism is arranged on the top of each first movable plate (1201), a second movable plate (1202) is connected to the first telescopic mechanism, a plurality of movable rods (1203) are inserted on the top of the second movable plate (1202), and the plurality of movable rods (1203) are arranged at equal intervals, a conical disk (1204) is fixedly connected to the lower end of each movable rod (1203), and the movable rod (1203) The side wall of the second movable plate (1202) is sleeved with a first spring (1205), the two ends of the first spring (1205) are respectively fixed to the bottom of the second movable plate (1202) and the top of the conical disk (1204), and the top of the second movable plate (1202) is provided with a second telescopic mechanism, the second telescopic mechanism is connected to a second movable block (1207), the side wall of the second movable block (1207) is fixedly connected to a third movable plate (1206), and the top of the third movable plate (1206) is fixedly connected to a second fixed plate (1211), the side wall of the second fixed plate (1211) is provided with a sliding groove (1212), and the second movable plate (1202) is provided with a second telescopic mechanism. The top of the plate (1202) is fixedly connected with two symmetrically arranged first support blocks (1208), and the opposite side walls of the two first support blocks (1208) are rotatably connected with a rotating pin (1209), and the side wall of the rotating pin (1209) is fixedly sleeved with a pointer (1210), and the side wall of the pointer (1210) is fixedly connected with a push pin (1213), and the push pin (1213) is inserted into the slide groove (1212), and the top of the second movable plate (1202) is fixedly connected with an arc plate (1214), and the side wall of the arc plate (1214) is provided with a scale mark (1215), and the second movable plate The top of (1202) is fixedly connected to a first mounting block (1216), and a distance sensor (1217) is fixedly inserted into the side wall of the first mounting block (1216); the side wall of the second movable plate (1202) is provided with a cleaning mechanism for cleaning the top of the heating plate (1104); the top of the lower cover (1108) is provided with a first pushing mechanism, and the first pushing mechanism is used to push the second movable plate (1202) to move up and down; a limiting mechanism is provided between the second movable plate (1202) and the first movable plate (1201), and the limiting mechanism is used to limit the second movable plate (1202).

3. The wafer processing heating device according to claim 1, characterized in that: The lifting mechanism comprises two connecting plates (204) fixedly connected to the bottom of each electric heating ring (1110), and the bottom of each connecting plate (204) is fixedly connected to a connecting rod (203), the bottom of the heating plate (1104) is fixedly connected to a support plate (201), and the side wall of the support plate (201) is fixedly connected to a first mounting plate (202), the lower end of the connecting rod (203) passes through the bottom of the first mounting plate (202) and is fixedly connected to a third moving block (205), the side wall of the support plate (201) is provided with a pushing assembly, and the pushing assembly is used to push the third moving block (205) to move, the side wall of each connecting rod (203) is sleeved with a first return spring (206), and the two ends of the first return spring (206) are respectively fixed to the top of the first mounting plate (202) and the bottom of the connecting plate (204).

4. A wafer processing heating device according to claim 3, characterized in that: The pushing assembly comprises a first pushing rod (301) fixedly connected to the side wall of each third moving block (205), and the side wall of the support plate (201) is connected to the fourth moving block (303) through a moving module (302), the bottom of the fourth moving block (303) is fixedly connected to an inclined plate (304), and the bottom of the inclined plate (304) is fixedly connected to a flat plate (305).

5. The wafer processing heating device according to claim 2, characterized in that: The first pushing mechanism comprises a first supporting frame (502) and a second supporting frame (506) fixedly connected to the top of the lower cover (1108), and the top of the first supporting frame (502) is fixedly connected with a first pushing block (503), and the first pushing block (503) comprises a first inclined surface (504), the top of the second supporting frame (506) is fixedly connected with a second pushing block (507), and the second pushing block (507) comprises a second inclined surface (508), the side wall of the second movable plate (1202) close to the first pushing block (503) is fixedly connected with the first fixed block (501), and the side wall of the second movable plate (1202) close to the second pushing block (507) is fixedly connected with the second fixed block (505).

6. The wafer processing heating device according to claim 2, characterized in that: The limiting mechanism comprises two T-shaped guide rods (901) fixedly connected to the side wall of the first movable plate (1201), and the side wall of the T-shaped guide rod (901) is sleeved with a fourth movable plate (902), the side wall of the fourth movable plate (902) is fixedly connected with a first limiting rod (905) and a second limiting rod (906), and the second limiting rod (906) is located directly above the first limiting rod (905), and the side wall of the second movable plate (1202) close to the fourth movable plate (902) is provided with a hemispherical limiting groove (904), and the side wall of each T-shaped guide rod (901) is sleeved with a second spring (903), and the two ends of the second spring (903) are respectively fixed to the side wall of the fourth movable plate (902) and the end of the T-shaped guide rod (901).

7. The wafer processing heating device according to claim 1, characterized in that: The exhaust mechanism comprises two exhaust pipes (1301) fixedly connected to the bottom of the lower cover (1108) and the side wall of the upper cover (1107), and a hose (1302) is fixedly connected between the two exhaust pipes (1301); a collecting pipe (1304) is fixedly inserted into the side wall of the shell (101); an air inlet end of the collecting pipe (1304) is fixedly connected to an exhaust fan (1303), and an air inlet end of the exhaust fan (1303) is fixed to the side wall of the hose (1302).

8. The wafer processing heating device according to claim 2, characterized in that: The moving mechanism comprises two groups of second support blocks (1001) fixedly connected to the top of the lower cover (1108), and each group of second support blocks (1001) has two second support blocks (1001), and the side walls of each group of second support blocks (1001) are fixedly connected to two guide rods (1002), and the side walls of each first moving plate (1201) are fixedly connected to a slider (1003), and the slider (1003) is sleeved on the side walls of the guide rods (1002), and the side walls of each guide rod (1002) are sleeved A second return spring (1004) is provided, and the two ends of the second return spring (1004) are respectively fixed to the slider (1003) and the side wall of the second support block (1001); the side wall of the mounting rod (104) is fixedly connected to a connecting frame (1008), and the side wall of the connecting frame (1008) is fixedly connected to a push plate (1005); a third inclined surface (1006) is provided at the bottom of the push plate (1005), and a stopper (1007) is fixedly connected to the side wall of the push plate (1005).

9. The wafer processing heating device according to claim 2, characterized in that: The cleaning mechanism comprises a third fixed block (603) fixedly connected to the side wall of the second movable plate (1202), and the side wall of the third fixed block (603) is fixedly connected to two first sleeves (604), each of the first sleeves (604) is inserted with a first sleeve rod (605), and the end of the first sleeve rod (605) away from the first sleeve tube (604) is fixedly connected to the fifth movable plate (601), the bottom of the fifth movable plate (601) is fixedly connected to a plurality of brushes (602), and the plurality of brushes (602) are arranged at equal intervals, the top of the lower cover (1108) is provided with a second pushing mechanism, and the second pushing mechanism is used to push the fifth movable plate (601) to move, the side wall of each first sleeve tube (604) is sleeved with a third return spring (606), and the two ends of the third return spring (606) are respectively fixed to the fifth movable plate (601) and the side wall of the third fixed block (603).

10. The wafer processing heating device according to claim 9, characterized in that: The second pushing mechanism includes a third support frame (801) fixedly connected to the top of the lower cover (1108), and the top of the third support frame (801) is fixedly connected to a second mounting plate (802), the side wall of the fifth movable plate (601) is fixedly connected to a second mounting block (804), and the side wall of the second mounting block (804) is fixedly connected to a second pushing rod (805), one end of the second pushing rod (805) away from the second mounting block (804) slides on the side wall of the second mounting plate (802) and forms a sliding surface, a plurality of array-arranged protrusions (803) are fixedly connected to the sliding surface, and one end of the second pushing rod (805) away from the second mounting block (804) slides on the edge of the protrusion (803).

11. The wafer processing heating device according to claim 2, characterized in that: The first telescopic mechanism comprises a second rod (702) fixedly connected to the top of each first movable plate (1201), and the side wall of the second rod (702) is sleeved with a second sleeve (701), the upper end of the second sleeve (701) is fixed to the bottom of the second movable plate (1202), the side wall of the second sleeve (701) is sleeved with a third spring (703), and the two ends of the third spring (703) are respectively fixed to the top of the first movable plate (1201) and the bottom of the second movable plate (1202).

12. The wafer processing heating device according to claim 2, characterized in that: The second telescopic mechanism includes two third rods (401) fixedly connected to the top of the second movable plate (1202), and the side wall of each third rod (401) is sleeved with a third sleeve (402), the upper end of the third sleeve (402) is fixed to the bottom of the second movable block (1207), the side wall of the third sleeve (402) is sleeved with a fourth spring (403), and the two ends of the fourth spring (403) are respectively fixed to the top of the second movable plate (1202) and the bottom of the second movable block (1207).

Images