An outer layer etching process for a circuit board and an outer layer etching spray system

Abstract

The present invention relates to the field of outer layer etching of circuit boards, and particularly to an outer layer etching process and an outer layer etching spraying system for circuit boards, including a three-way solenoid valve, etc. An outer layer etching spraying system for circuit boards according to the present invention sprays and etches large-area continuous etching parts in the circuit board by a large spraying nozzle in a large-range spraying manner, and sprays and etches narrow-line etching parts in the circuit board by multiple small spraying nozzles in a partitioned and concentrated spraying manner. On the basis of saving the usage amount of the etching solution, the exchange rate of the etching solution at the narrow-line etching parts of the circuit board is improved; it overcomes the disadvantages that the working efficiency of spraying and etching the narrow-line etching parts of the circuit board by the etching solution is relatively low, and it is necessary to additionally increase the spraying pressure of the etching solution to improve the exchange rate of the etching solution, resulting in a large amount of waste of the etching solution.

Description

Technical Field

[0001] The present invention relates to the field of outer layer etching of circuit boards, and particularly to an outer layer etching process for circuit boards and an outer layer etching spray system. Background Art

[0002] In the step of outer layer etching of a circuit board by spraying an etching solution, when there are many narrow and long circuit etching structures with small areas in the circuit board, after the etching solution enters the etching parts of the narrow and long circuit structures in the circuit board, the etching solution cannot be discharged outward in time, resulting in that the subsequent etching solution is not easy to enter the narrow and long circuit etching parts to exchange the original etching solution, that is, the exchange rate of the etching solution in the narrow and long circuit etching parts is low, affecting the etching efficiency of the etching solution on the narrow and long circuit etching parts. Therefore, compared with the working efficiency of spraying and etching the large-area continuous etching parts on the circuit board by the etching solution, the working efficiency of spraying and etching the narrow and long circuit etching parts on the circuit board by the etching solution is low. At this time, it is necessary to increase the spraying flow rate of the etching solution in this area by an additional method, so that the sprayed etching solution rushes into the narrow and long circuit etching parts at a high flow rate state to improve the exchange rate of the etching solution in the narrow and long circuit etching parts of the circuit board, thereby improving the overall etching uniformity effect of the circuit board, and using the high exchange efficiency of the etching solution to carry away the impurities generated on the surface of the circuit board during the etching step. This treatment method will cause a large amount of etching solution waste. Summary of the Invention

[0003] In order to overcome the disadvantage that the working efficiency of spraying and etching the narrow and long circuit etching parts of the circuit board by the etching solution is low, and it is necessary to increase the spraying pressure of the etching solution by an additional method to improve the exchange rate of the etching solution, resulting in a large amount of etching solution waste, the present invention provides an outer layer etching process for circuit boards and an outer layer etching spray system.

[0004] An outer layer etching process for a circuit board according to the present invention includes the following steps:

[0005] Step 1, transfer the circuit board to the lower part of the spraying area corresponding to each three-way solenoid valve through a conveyor bed, and perform spraying and etching work on the circuit board;

[0006] Step 2, during the work of Step 1, the three-way solenoid valve uses a large spray nozzle to perform spraying and etching treatment on the large-area continuous etching parts on the circuit board in a large-range spraying manner, in cooperation with the rear spray pipe;

[0007] Step 3, during the work of Step 1, the three-way solenoid valve uses multiple small spray nozzles on the horizontal pipeline to perform spraying and etching treatment on the narrow and long circuit etching parts of the circuit board in a high-impact spraying state by zones;

[0008] Step 4, during the work of Step 1, use the waste liquid reflux system in the conveyor bed to recover the sprayed waste liquid.

[0009] Preferably, the spraying angle of the small spray nozzles on the horizontal pipeline is adjusted so that the small spray nozzles directly align with the position of the long and narrow circuit structure etching part in the spraying area for spraying and etching treatment work.

[0010] A circuit board outer layer etching spraying system of the present invention includes a conveying bed, a mounting frame, a main pipeline, an upper pipeline, a branch pipeline, a three-way solenoid valve, a mounting disc, a fixing frame, a horizontal pipeline, small spray nozzles, and large spray nozzles; there are no less than two mounting frames fixedly connected to the conveying bed; a main pipeline is fixedly connected inside the conveying bed; an upper pipeline is fixedly connected to the mounting frame; the upper pipeline is connected to the main pipeline; a number of branch pipelines are connected to the upper pipeline; a three-way solenoid valve is connected to the branch pipeline; a mounting disc is connected to the three-way solenoid valve; a fixing frame is fixedly connected to the mounting disc; a horizontal pipeline is fixedly connected to the fixing frame; the horizontal pipeline is connected to the first outlet end of the corresponding three-way solenoid valve; a number of small spray nozzles are connected to each of the horizontal pipelines; the second outlet end of the three-way solenoid valve is connected to a large spray nozzle.

[0011] Preferably, both the small spray nozzles and the large spray nozzles are set as conical flat nozzle structures.

[0012] Preferably, a number of parallel plates are provided at the outlet end of the large spray nozzle.

[0013] Preferably, the mounting disc is rotatably connected to the corresponding three-way solenoid valve; a first spur gear is fixedly connected to the mounting disc; a first motor is installed on the three-way solenoid valve; a second spur gear is fixedly connected to the output shaft of the first motor; the first spur gear meshes with the corresponding second spur gear.

[0014] Preferably, a number of rear spray pipes are connected to the upper pipeline, and the rear spray pipes and the branch pipelines are arranged alternately.

[0015] Preferably, the rear spray pipes are connected to rear spray nozzles, and the rear spray nozzles are set as conical flat nozzle structures.

[0016] Preferably, a fixing rod corresponding to the rear spray pipe is fixedly connected to the mounting frame; a second motor is installed at the lower end of the fixing rod; a ball valve is provided inside the rear spray nozzle; a first through-hole structure is opened in the ball valve.

[0017] Preferably, a second through-hole structure is opened in the ball valve, and the aperture of the second through-hole is larger than the aperture of the first through-hole.

[0018] An outer layer etching spray system for a circuit board of the present invention is provided with a number of small spray nozzles on a three-way solenoid valve through a mounting plate and a transverse pipe. The three-way solenoid valve is also directly connected with a large spray nozzle. The large spray nozzle is used to directly perform spray etching treatment on large-area continuous etching parts in the circuit board in a large-range spraying manner. The multiple small spray nozzles are used to perform spray etching treatment on narrow-line etching parts of the circuit board in a partitioned and concentrated spraying manner. The small spray nozzles can improve the spray impact pressure of the etching solution under the same spray flow rate of the etching solution, thereby improving the exchange rate of the etching solution at the narrow-line etching parts of the circuit board on the basis of saving the usage amount of the etching solution. In addition, the first motor is used to control the deflection direction and angle of the transverse pipe on the mounting plate, so that the etching solution sprayed from the small spray nozzles can perform efficient spray etching work on the concentrated narrow-line etching parts on one side of the spraying area, and at the same time, the etching solution sprayed from the rear spray nozzles can timely provide sufficient etching solution for the other side of the spraying area.

[0019] An outer layer etching spray system for a circuit board of the present invention effectively overcomes the disadvantages that the working efficiency of spray etching treatment on narrow-line etching parts of the circuit board by the etching solution is relatively low, and it is necessary to additionally increase the spray pressure of the etching solution to improve the exchange rate of the etching solution, resulting in a large amount of waste of the etching solution. Brief Description of the Drawings

[0020] Figure 1 Structural schematic diagram of the present invention described according to an embodiment;

[0021] Figure 2 Structural schematic diagram of the main pipe and the upper pipe of the present invention described according to an embodiment;

[0022] Figure 3 Structural schematic diagram of the three-way solenoid valve of the present invention described according to an embodiment;

[0023] Figure 4 Stereoscopic structural schematic diagram of the small spray nozzle of the present invention described according to an embodiment;

[0024] Figure 5 Structural sectional view of the rear spray nozzle of the present invention described according to an embodiment;

[0025] Figure 6 Structural sectional view of the ball valve of the present invention described according to an embodiment.

[0026] Reference signs in the drawings: 1 - conveying bed, 2 - mounting bracket, 31 - main pipeline, 32 - upper pipeline, 33 - branch pipeline, 4 - three-way solenoid valve, 41 - mounting plate, 42 - fixing bracket, 43 - horizontal pipeline, 44 - small spray nozzle, 45 - large spray nozzle, 451 - parallel plate, 46 - first spur gear, 47 - first motor, 48 - second spur gear, 51 - rear spray pipe, 52 - rear spray nozzle, 53 - fixing rod, 54 - second motor, 55 - ball valve, 5501 - first through hole, 5502 - second through hole. Detailed implementation mode

[0027] The following describes the implementation mode of the present invention with reference to the drawings.

[0028] Embodiment 1

[0029] An outer layer etching spray system for a circuit board, as Figures 1 - 5 shown, includes a conveying bed 1, a mounting bracket 2, a main pipeline 31, an upper pipeline 32, a branch pipeline 33, a three-way solenoid valve 4, a mounting plate 41, a fixing bracket 42, a horizontal pipeline 43, a small spray nozzle 44, and a large spray nozzle 45; two mounting brackets 2 are fixedly connected to the conveying bed 1; two main pipelines 31 are fixedly connected inside the conveying bed 1; one upper pipeline 32 is fixedly connected to each mounting bracket 2; the left end and the right end of the upper pipeline 32 are respectively connected to the two main pipelines 31; a number of branch pipelines 33 are connected to each upper pipeline 32; a three-way solenoid valve 4 is connected to each branch pipeline 33; a mounting plate 41 is rotatably connected to each three-way solenoid valve 4; a fixing bracket 42 is fixedly connected to each mounting plate 41; a horizontal pipeline 43 is fixedly connected to each fixing bracket 42; each horizontal pipeline 43 is respectively connected to the first outlet end of the corresponding three-way solenoid valve 4; a number of small spray nozzles 44 are connected to each horizontal pipeline 43; a large spray nozzle 45 is connected to the second outlet end of each three-way solenoid valve 4; the liquid inlet end of the three-way solenoid valve 4 is initially connected and communicated with the second outlet end; each small spray nozzle 44 and large spray nozzle 45 are both set as a conical flat nozzle structure that widens downward in the left and right directions; a number of parallel plates 451 arranged in the left and right directions are provided at the outlet end of each large spray nozzle 45, and the etching solution sprayed out from the outlet end of the large spray nozzle 45 will uniformly fall vertically under the limiting and guiding action of each parallel plate 451, concentrating the spraying range of the etching solution; a first spur gear 46 is fixedly connected to each mounting plate 41; a first motor 47 is installed on each three-way solenoid valve 4; a second spur gear 48 is fixedly connected to the output shaft of each first motor 47; each first spur gear 46 meshes with the corresponding second spur gear 48.

[0030] As Figure 2 、 Figure 3 and Figure 5As shown, several rear spray pipes 51 are connected to the rear sides of the two upper pipes 32 respectively, and the rear spray pipes 51 and the branch pipes 33 are arranged alternately in the left-right direction of the same upper pipe 32; the lower end of the rear spray pipe 51 is connected to a rear spray nozzle 52, and the rear spray nozzle 52 is set as a conical flat nozzle structure that is downward and widened in the left-right direction. The etching solution flowing out from the first through hole 5501 of the ball valve 55 performs spray etching work along the diffusion range defined by the shape of the rear spray nozzle 52, restricting the diffusion range of the etching solution sprayed downward from the rear spray nozzle 52 to the front and rear sides, so that the etching solution can only diffuse in the left and right directions.

[0031] The following are the spray etching treatment work steps of a spray etching system for the outer layer of a circuit board according to the present invention:

[0032] Before performing the etching treatment work on the circuit board, the circuit structure information of the circuit board is input into the control system, so that the control system can cooperate with an external image recognition camera to actively recognize the distribution of large-area continuous etching parts and narrow-line structure etching parts in the circuit board, and then perform corresponding treatments on these two types of etching parts respectively.

[0033] The two main pipes 31 are jointly externally connected to the etching solution conveying equipment, and a waste liquid reflux system is installed in the transfer bed 1. The etching solution conveying equipment conveys the etching solution to the branch pipes 33 of each upper pipe 32 through the main pipes 31. After most of the etching solution enters the inlet end of the three-way solenoid valve 4 from the branch pipe 33, the etching solution directly sprays downward from the large spray nozzle 45 through the second outlet end of the three-way solenoid valve 4. The sprayed etching solution continuously exchanges in the large-area continuous etching parts of the circuit board to perform the etching work. Each three-way solenoid valve 4 corresponds to a spray area of a circuit board, and each large spray nozzle 45 focuses on spraying and etching the etching parts in the middle of the corresponding spray area. At the same time, another part of the etching solution is sprayed downward through the rear spray pipe 51 into the adjacent parts between two spray areas, and corresponding spray etching treatment is performed on the adjacent parts between two spray areas, realizing that the large spray nozzle 45 sprays in a large range and cooperates with the rear spray pipe 51 to directly perform spray etching treatment on the large-area continuous etching parts of the circuit board. At this time, the etching solution sprayed in a large range can efficiently flow through each area of the large-area continuous etching parts of the circuit board, improving the utilization rate of the etching solution and greatly reducing the total usage amount of the etching solution. The exchanged etching solution is discharged into the waste liquid reflux system in the transfer bed 1 in the form of waste liquid.

[0034] When there is a narrow circuit structure etching part in a certain spraying area of the circuit board, the three-way solenoid valve 4 corresponding to this spraying area switches to connect the inlet end with the first outlet end. At this time, most of the etching solution enters the inlet end of the three-way solenoid valve 4 from the branch pipe 33. Then the etching solution passes through the second outlet end of the three-way solenoid valve 4 and the transverse pipe 43 successively, and sprays downward from each small spray nozzle 44. The spraying range of the etching solution sprayed out from the small spray nozzle 44 is reduced, but the impact pressure of the etching solution sprayed out from the small spray nozzle 44 is greatly increased. At the same time, the first motor 47 drives the second spur gear 48 to rotate, the second spur gear 48 meshes with the first spur gear 46 to drive the mounting disk 41 to rotate, and the mounting disk 41 drives the transverse pipe 43 and the small spray nozzle 44 on the fixing bracket 42 to deflect at a small angle, so that the etching solution sprayed out from the small spray nozzle 44 is aligned with the position of the narrow circuit structure etching part in the spraying area. All the small spray nozzles 44 on the transverse pipe 43 gather in the deflection direction, and the spraying density of all the small spray nozzles 44 on the transverse pipe 43 for the side part in the spraying area is increased by reducing the horizontal distribution space of the small spray nozzles 44. At this time, the etching solution sprayed out from the small spray nozzle 44 sprays into the narrow circuit structure etching part in a high-impact spraying state in zones, realizing the improvement of the exchange rate of the etching solution in the narrow circuit etching part of the circuit board on the basis of saving the usage amount of the etching solution, and ensuring the efficient completion of the spraying and etching treatment work for the narrow circuit etching part of the circuit board.

[0035] When multiple narrow circuit structure etching parts in a certain spraying area of the circuit board are concentrated on the same side, the first motor 47 drives the second spur gear 48 to rotate, so that the mounting disk 41 drives the transverse pipe 43 and the small spray nozzle 44 on the fixing bracket 42 to deflect at a large angle towards the concentrated side of the multiple narrow circuit structure etching parts in the spraying area, so that the multiple small spray nozzles 44 are concentrated above the side of the spraying area, and the concentrated spraying and etching treatment of each narrow circuit structure etching part is carried out efficiently.

[0036] Embodiment 2

[0037] On the basis of Embodiment 1, as Figures 1 - 6 shown, a number of fixing rods 53 corresponding to the rear spray pipe 51 are fixedly connected to the rear sides of the two mounting brackets 2; a second motor 54 is installed at the lower end of each fixing rod 53; a ball valve 55 is provided in each rear spray nozzle 52; a first through hole 5501 structure is opened in each ball valve 55, and the rear spray pipe 51 and the rear spray nozzle 52 are initially connected through the first through hole 5501.

[0038] In this embodiment, as Figure 3As shown in the figure, within the spraying area jointly responsible for by the small spray nozzle 44, the large spray nozzle 45 and the rear spray nozzle 52, when the horizontal pipe 43 on the three-way solenoid valve 4 deflects to the right, the concentrated spraying and etching work is carried out on the concentrated part of the narrow line etching on the right side of the spraying area. And under the condition that there are also a small number of etched parts on the left side of the spraying area, the second motor 54 corresponding to the rear spray pipe 51 on the left side of the three-way solenoid valve 4 drives the ball valve 55 connected thereto to rotate, so that the outlet end of the first through hole 5501 of the ball valve 55 deflects to the right. At this time, more etching solution flowing out from the first through hole 5501 of the ball valve 55 is sprayed towards the right side of the rear spray nozzle 52, so that more etching solution is sprayed from the rear spray nozzle 52 to the left side part of the spraying area, realizing that the etched parts on the left side of the spraying area can also be subjected to sufficient etching solution spraying treatment, and on the basis of saving the usage amount of the etching solution, efficiently completing the corresponding spraying and etching work.

[0039] Embodiment 3

[0040] On the basis of Embodiment 2, as Figures 1 - 5 shown in the figure, a second through hole 5502 structure is provided in the ball valve 55, and the second through hole 5502 intersects with the first through hole 5501 in the same ball valve 55, and the aperture of the second through hole 5502 is larger than the aperture of the first through hole 5501.

[0041] In this embodiment, when the horizontal pipe 43 on a certain three-way solenoid valve 4 deflects to the right, the concentrated spraying and etching work is carried out on the concentrated part of the narrow line etching on the right side of the spraying area, and there are a small number of etched parts on the left side of the spraying area. At the same time, when the horizontal pipe 43 on the three-way solenoid valve 4 on the left side of the three-way solenoid valve 4 deflects to the left, the concentrated spraying and etching work is carried out on the concentrated part of the narrow line etching on the left side of another spraying area, and there are also a small number of etched parts on the right side of the spraying area. Under such a condition, only the spraying and etching treatment of the etching solution sprayed out from the rear spray nozzle 52 can be obtained for the adjacent part between the two adjacent spraying areas. Therefore, the ball valve 55 in the rear spray nozzle 52 cannot provide more etching solution to it by deflecting to any side. It is necessary to drive the ball valve 55 connected thereto by the second motor 54 to rotate, so that the second through hole 5502 takes over the first through hole 5501 to connect the rear spray pipe 51 and the rear spray nozzle 52. At this time, the amount of etching solution sprayed out from the second through hole 5502 of the ball valve 55 in the same time is much larger than the amount of etching solution sprayed out from the first through hole 5501 of the ball valve 55, and the etching solution sprayed out from the second through hole 5502 of the ball valve 55 will diffuse to the adjacent part between the above two adjacent spraying areas along the rear spray nozzle 52 with a larger flow rate, realizing the sufficient spraying treatment of the etching solution for the adjacent part between the two adjacent spraying areas and efficiently completing the corresponding spraying and etching work.

[0042] Those skilled in the art should understand that the above embodiments do not limit the present invention in any form. Any technical solutions obtained by means of equivalent replacement or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A circuit board outer layer etching process, characterized in that: The following steps are involved: Step 1: conveying the circuit board through the conveyor bed (1) to the bottom of the spraying area corresponding to each three-way solenoid valve (4), and performing spray etching on the circuit board; Step 2: During the operation of step 1, the three-way solenoid valve (4) uses a large spray nozzle (45) to spray over a large area in cooperation with the rear spray pipe (51) to directly perform spray etching on a large area of ​​continuous etching parts in the circuit board; Step 3: During the operation of step 1, the three-way solenoid valve (4) uses a plurality of small spray nozzles (44) on the transverse pipe (43) to spray and etch the narrow and long circuit etching parts of the circuit board in a high-impact spray state in a zoned manner; Step 4: During the operation of step 1, the waste liquid reflow system in the conveyor bed (1) is used to recycle the spray waste liquid.

2. A circuit board outer layer etching process according to claim 1, characterized in that: The spraying angle of the small spray nozzle (44) on the transverse pipe (43) is adjusted so that the small spray nozzle (44) is directly aligned with the position of the narrow and long line structure etching part in the spraying area to perform spray etching processing.

3. A circuit board outer layer etching spray system, the system using a circuit board outer layer etching process according to claim 1 or 2, comprising: a conveyor bed (1); at least two mounting frames (2) are fixedly connected to the conveyor bed (1); a main pipeline (31) is fixedly connected inside the conveyor bed (1); an upper pipeline (32) is fixedly connected to the mounting frame (2); the upper pipeline (32) is connected to the main pipeline (31); a plurality of branch pipelines (33) are connected to the upper pipeline (32); Features: It also includes a three-way solenoid valve (4); the branch pipe (33) is connected to the three-way solenoid valve (4); the three-way solenoid valve (4) is connected to a mounting plate (41); the mounting plate (41) is fixedly connected to a fixing frame (42); the fixing frame (42) is fixedly connected to a transverse pipe (43); the transverse pipe (43) is connected to a first outlet end of a corresponding three-way solenoid valve (4); each of the transverse pipes (43) is connected to a plurality of small spray nozzles (44); and the second outlet end of the three-way solenoid valve (4) is connected to a large spray nozzle (45).

4. A circuit board outer layer etching spray system according to claim 3, characterized in that: The small spray nozzle (44) and the large spray nozzle (45) are both configured as conical flat nozzle structures.

5. A circuit board outer layer etching spray system according to claim 4, characterized in that: A plurality of parallel plates (451) are provided at the outlet end of the large spray nozzle (45).

6. A circuit board outer layer etching spray system according to claim 5, characterized in that: The mounting plate (41) is rotatably connected to the corresponding three-way solenoid valve (4); a first spur gear (46) is fixedly connected to the mounting plate (41); a first motor (47) is mounted on the three-way solenoid valve (4); an output shaft of the first motor (47) is fixedly connected to a second spur gear (48); and the first spur gear (46) is meshed with the corresponding second spur gear (48).

7. A circuit board outer layer etching spray system according to claim 5, characterized in that: The upper pipeline (32) is connected to a plurality of rear spray pipes (51), and the rear spray pipes (51) and the branch pipelines (33) are arranged alternately.

8. A circuit board outer layer etching spray system according to claim 7, characterized in that: The rear spray pipe (51) is connected to a rear spray nozzle (52), and the rear spray nozzle (52) is configured as a conical flat nozzle structure.

9. A circuit board outer layer etching spray system according to claim 8, characterized in that: The mounting frame (2) is fixedly connected with a fixing rod (53) corresponding to the rear spray pipe (51); a second motor (54) is installed at the lower end of the fixing rod (53); a ball valve (55) is provided in the rear spray nozzle (52); and a first through hole (5501) structure is provided in the ball valve (55).

10. A circuit board outer layer etching spray system according to claim 9, characterized in that: A second through hole (5502) structure is provided in the ball valve (55), and the diameter of the second through hole (5502) is larger than the diameter of the first through hole (5501).

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