Wafer collaging equipment
By providing a wafer plating device including a bearing platform, a dispensing device and a pressing device, the problem of insufficient splicing efficiency and reliability of CMOS chips in the prior art is solved, and efficient and reliable wafer styling and mounting is achieved, meeting the imaging performance requirements of large-size CMOS chips.
Patent Information
- Application Number
- CN202411759648.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-04-18
AI Technical Summary
The prior art is difficult to achieve efficient and reliable CMOS chip splicing, and there are problems with high probability of defects and high cost in the manufacturing process of large-size chips, which makes it difficult to meet the imaging performance requirements of large-size CMOS chips.
A wafer placing device is provided, including a carrier platform, a dispensing device and a pressing device. By setting a replaceable adsorption base, wafer misalignment is avoided and efficient and reliable wafer splicing and mounting are ensured.
It realizes efficient and reliable CMOS chip splicing, reduces the probability of wafer damage, improves production efficiency, and meets the imaging performance requirements of large-sized CMOS chips.
Smart Images
Figure CN119855267A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor processing, and in particular, to a wafer pasting device. Background Art
[0002] CMOS (complementary metal oxide semiconductor) image sensors have high sensitivity, low noise, wide spectral response range and fast output capability, so they are widely used in the field of industrial imaging, including but not limited to machine vision, security monitoring, intelligent transportation, life sciences, biomedicine, scientific imaging, high-definition video, television broadcasting, etc. CMOS X-ray detectors, as an X-ray imaging device, use CMOS (complementary metal oxide semiconductor) chips as photosensitive elements to convert light signals into electrical signals.
[0003] With the continuous development of all walks of life, the demand for X-ray imaging is getting higher and higher, and the application scenarios are becoming increasingly complex, which puts higher requirements on the imaging performance parameters of CMOS X-ray detectors, such as pixel resolution, dynamic range, magnification, and detection range. Generally, the size of CMOS chips has a direct impact on the imaging capability of CMOS X-ray detectors, but in the existing technology, directly manufacturing large-size CMOS chips faces many challenges. For example, under the existing level of photolithography technology, the maximum exposure area of a single chip is limited and cannot be increased indefinitely; the probability of defects in large-size chips during the manufacturing process increases, resulting in a decrease in yield and a significant increase in costs. Since there are great challenges in the direct manufacture of large-size CMOS chips in terms of technology and cost, a feasible solution is to obtain large-size CMOS chips by splicing small-size CMOS chips. However, there is currently a lack of a reliable CMOS chip splicing device, which makes it difficult to achieve efficient and reliable CMOS chip splicing, and wafer dislocation is prone to occur during the splicing process, which in turn affects the final imaging effect. In severe cases, it may even cause the product to be scrapped, so it is difficult to meet the current demand for large-size CMOS chips. Summary of the invention
[0004] The purpose of the embodiments of the present application is to provide a wafer splicing device, which can complete a variety of tasks including wafer splicing, wafer dispensing, transportation and mounting of components to be bonded, and by providing a replaceable adsorption base, it can effectively avoid wafer misalignment, thereby improving the stability of wafer splicing and mounting of flat components, ensuring efficient and reliable completion of wafer splicing and mounting.
[0005] The present application provides a wafer pasting device, including a carrying platform, a glue dispensing device and a pressing device. Among them, the carrying platform includes an adsorption base and a horizontal adjustment platform, the adsorption base is fixedly arranged above the horizontal adjustment platform, and a base adsorption plane for adsorbing wafers is arranged on the upper part of the adsorption base, and a vent is arranged on the base adsorption plane. The glue dispensing device is used to perform glue dispensing operations on the surface of the wafer. The pressing device includes a pressing drive device and a pressing adsorption head arranged below the pressing drive device. When in use, the pressing device adsorbs the flat-plate-shaped component to be pasted and moves to the top of the carrying platform to press the component to be pasted and the wafer together.
[0006] In an implementable solution, the adsorption base is installed on the horizontal adjustment platform in a detachable manner.
[0007] In an implementable solution, the carrying platform includes a plurality of adsorption bases, each of which has a base adsorption plane of a different size.
[0008] In an practicable solution, the horizontal adjustment platform includes an adjustment base and a plurality of retractable adjustment rods. When in use, the adsorption base is fixedly arranged above the adjustment base, and the horizontality of the adjustment base is changed by adjusting the length of the adjustment rods so that the base adsorption plane is located in the horizontal plane.
[0009] In an implementable solution, the ventilation holes of the base adsorption plane include a first ventilation hole and a second ventilation hole, and the diameter of the first ventilation hole is greater than the diameter of the second ventilation hole.
[0010] In one feasible solution, a blue film is laid on the adsorption plane of the base.
[0011] In an practicable solution, the wafer collage device further includes a flat plate buffer device for storing flat plate-shaped components to be bonded. The flat plate buffer device includes a flat plate bearing portion and a flat plate driving device. The upper portion of the flat plate bearing portion is provided with a flat plate adsorption surface, and the flat plate driving device is used to drive the flat plate bearing portion to flip up and down.
[0012] In an practicable solution, the wafer collage equipment further includes a wafer handling device, which includes a displacement module and a wafer adsorption module. The displacement module includes a horizontal displacement mechanism and a lifting mechanism installed on the horizontal displacement mechanism. The wafer adsorption module is installed at the bottom of the lifting mechanism and is used to adsorb one wafer or multiple wafers.
[0013] In an operative solution, the wafer adsorption module includes a first adsorption module and a second adsorption module separated from each other, a first adsorption plane is disposed at the lower portion of the first adsorption module, and a second adsorption plane is disposed at the lower portion of the second adsorption module. The adsorption area of the first adsorption plane is greater than the adsorption area of the second adsorption plane.
[0014] In an practicable solution, the wafer collage device further includes a material unloading device. The material unloading device includes a wafer gripping portion and a material unloading driving device. The surface of the wafer gripping portion is provided with a wafer adsorption portion, and the material unloading driving device is used to drive the wafer gripping portion to translate and flip up and down.
[0015] In an practicable solution, the wafer collage device further includes a detection device. The detection device includes an upper alignment camera and a lower alignment camera, wherein the upper alignment camera is arranged on the lifting mechanism and its lens direction faces downward, and the lens direction of the lower alignment camera faces upward. When in use, the wafer handling device drives the upper alignment camera to move to the top of the lower alignment camera to detect the wafer.
[0016] In an implementable solution, the wafer collage equipment further includes a wafer cleaning device, which includes a tornado cleaning device and / or a plasma cleaning device.
[0017] Compared with the prior art, the beneficial effects of this application include at least:
[0018] The present application provides a wafer bonding device that can meet various work requirements including wafer splicing, wafer dispensing, transportation and mounting of parts to be bonded, etc., reduces the need for manual participation and reduces the difficulty of operation, helps to improve production efficiency, improve the effects of wafer splicing and bonding, and reduce the probability of wafer damage.
[0019] Furthermore, due to the provision of a special replaceable adsorption base, the wafer pasting equipment of the present application can prevent the wafers that have been placed in place from shifting during the multi-wafer splicing process, and can effectively avoid product defects or even product scrap caused by wafer misalignment, thereby excellently meeting the multi-wafer splicing process's needs for reliability, stability, etc., and can adapt to the splicing of wafers of different sizes and quantities, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0021] Figure 1 It is a schematic diagram of a carrying platform of a wafer collage device according to an embodiment of the present application;
[0022] Figure 2 is a schematic diagram of a dispensing device;
[0023] Figure 3is a schematic diagram of a pressing device;
[0024] Figure 4 is a schematic diagram of a flat-panel cache device;
[0025] Figure 5 It is a schematic diagram of a wafer handling device and a detection device;
[0026] Figure 6 Schematic diagram of the feeding device.
[0027] In the figure: 1, carrying platform; 2, dispensing device; 3, pressing device; 4, flat plate buffer device; 5, wafer handling device; 6, unloading device; 7, detection device; 101, adsorption base; 102, horizontal adjustment platform; 111, base adsorption plane; 121, adjustment base; 122, adjustment rod; 201, dispensing module; 202, motion module; 221, horizontal motion mechanism; 222, vertical motion mechanism; 301, pressing adsorption head; 302, pressing drive device; 401, flat plate bearing part; 402, flat plate drive device; 411, flat plate adsorption surface; 501, displacement module; 502, wafer adsorption module; 511, horizontal displacement mechanism; 512, lifting mechanism; 521, first adsorption module; 522, second adsorption module; 601, wafer grasping part; 602, unloading drive device; 611, wafer adsorption part; 701, upper alignment camera; 702, lower alignment camera. DETAILED DESCRIPTION
[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0029] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0030] like Figure 1-Figure 3As shown, the present application provides a wafer collage device, including a carrying platform 1, a glue dispensing device 2 and a pressing device 3. Among them, the carrying platform 1 includes an adsorption base 101 and a horizontal adjustment platform 102, the adsorption base 101 is fixedly arranged above the horizontal adjustment platform 102, and a base adsorption plane 111 for adsorbing wafers is arranged on the upper part of the adsorption base 101, and a vent hole is arranged on the base adsorption plane 111. The glue dispensing device 2 is used to perform glue dispensing operations on the surface of the wafer. The pressing device 3 includes a pressing drive device 302 and a pressing adsorption head 301 arranged below the pressing drive device 302.
[0031] An airflow channel can be arranged inside the adsorption base 101, and a vent can be arranged on the surface of the adsorption base 101 and connected to an external exhaust device. The vent holes, airflow channels and vents on the base adsorption plane 111 form a complete airflow channel. The base adsorption plane 111 can be made of ceramic material, which has excellent wear resistance, hardness and chemical stability, and helps to prevent damage to the wafer surface. The dispensing device 2 may include a dispensing module 201 and a motion module 202, and the motion module 202 includes a horizontal motion mechanism 221 and a vertical motion mechanism 222 mounted on the horizontal motion mechanism 221. When in use, the motion module 202 can drive the dispensing module 201 to move to a designated position for dispensing. An airflow channel can be arranged inside the pressing adsorption head 301, and a vent can be arranged on the surface and connected to an external exhaust device. The vent, airflow channel and the vent holes on the surface of the pressing adsorption head 301 form a complete airflow channel.
[0032] When in use, first adjust the horizontal adjustment platform 102 so that the base adsorption plane 111 is in a horizontal state, and then exhaust air through the exhaust device to form a negative pressure area on the base adsorption plane 111. At this time, one or more wafers are placed on the carrier platform 1, and the base adsorption plane 111 can firmly adsorb the wafer to prevent the wafer from being displaced due to external interference, especially helping to keep each wafer relatively still when multiple wafers are spliced to prevent misalignment during the splicing process. Then, the glue dispensing device 2 moves to the top of the carrier platform 1 and dispenses glue on the surface of the wafer. When splicing multiple wafers, glue can be dispensed on the back of each wafer and at the splicing seams between the wafers. The specific glue dispensing amount and glue dispensing position can be determined according to actual work requirements. Afterwards, the pressing device 3 absorbs the flat-plate-shaped component to be bonded and drives the component to be bonded to move to the top of the carrier platform 1, and then moves downward to press the component to be bonded with the wafer with glue dispensed on the surface.
[0033] The present application provides a device specifically used for wafer splicing and mounting, which can meet various work requirements including wafer splicing, wafer dispensing, transportation and mounting of parts to be bonded, etc., reducing the need for manual participation and reducing the difficulty of operation, which helps to improve production efficiency, improve the effect of wafer splicing and bonding, and reduce the probability of wafer damage. Furthermore, due to the provision of a special replaceable adsorption base 101, the wafer bonding equipment of the present application can prevent the displacement of wafers that have been placed in place during the multi-wafer splicing process, thereby excellently meeting the multi-wafer splicing process for reliability, stability and other aspects of the needs, and can adapt to the splicing of wafers of different sizes and quantities, and has a wide range of applications.
[0034] In addition, the wafer collage equipment of the present application may also include a glue curing device. It should be noted that when the component to be bonded is a wafer backplane made of glass material, the glue dispensing device 2 can use UV glue to dispense glue on the surface of the wafer. Accordingly, the glue curing device can include an ultraviolet point light source and an ultraviolet surface light source, and the glue curing process can be divided into two stages: pre-curing and main curing. In the pre-curing stage, the shadowless glue is initially cured using an ultraviolet point light source so that the wafer backplane and the wafer are initially combined to avoid relative displacement between the two; in the main curing stage, the shadowless glue is completely cured using an ultraviolet surface light source so that the wafer backplane and the wafer are completely bonded. During the glue curing process, the pressing device 3 can maintain the pressing state of the component to be bonded and the wafer, and the specific pressure value can be set according to work needs.
[0035] In one embodiment, if Figure 1 As shown, the adsorption base 101 is installed on the horizontal adjustment platform 102 in a detachable manner. Specifically, the adsorption base 101 can be detachably connected to the horizontal adjustment platform 102 by means of screw connection, snap connection or magnetic connection, and no excessive restrictions are made here. In addition, a base connection portion can be fixedly provided below the adsorption base 101, and the adsorption base 101 can be detachably connected to the upper surface of the horizontal adjustment platform through the base connection portion.
[0036] In one embodiment, the carrier platform 1 may include a plurality of adsorption bases 101, each of which has a base adsorption plane 111 of a different size. In actual work, different adsorption bases 101 may be appropriately replaced according to the size and quantity of wafers to be spliced. For example, a model of adsorption base 101 specifically for splicing four, six or nine wafers may be provided, so that the wafer splicing device of the present application has a better scope of application and flexibility, and can adapt to more complex production task requirements.
[0037] In one embodiment, if Figure 1As shown, the horizontal adjustment platform 102 includes an adjustment base 121 and a plurality of retractable adjustment rods 122. When in use, the adsorption base 101 is fixedly disposed above the adjustment base 121, and the horizontality of the adjustment base 121 is changed by adjusting the length of the adjustment rod 122, so that the horizontality of the upper surface of the adjustment base 121 meets the requirements, and ensures that the base adsorption plane 111 is located in the horizontal plane. A laser displacement sensor can be installed on the upper surface of the adjustment base 121, and a servo motor can be arranged at the lower part of the adjustment rod 122, and the laser displacement sensor is connected to the servo motor signal. When in use, the laser displacement sensor will test the horizontality of the upper surface of the adjustment base 121 and transmit the signal to the servo motor, and then the servo motor will adjust the height accordingly until the horizontality of the upper surface of the adjustment base 121 meets the requirements.
[0038] In one embodiment, the vent holes of the base adsorption plane 111 include a first vent hole and a second vent hole, and the diameter of the first vent hole is greater than the diameter of the second vent hole. Specifically, the diameter of the first vent hole can be set to 0.5mm-1mm, preferably 1mm. The first vent holes are evenly distributed on the base adsorption plane 111, and the distance between adjacent first vent holes can be set to 0.5cm-1.5cm, preferably 1cm. The second vent hole is a micron-level microporous structure, and the second vent holes are evenly distributed on the base adsorption plane 111, and the distance between adjacent second vent holes can be set to 0.1mm-1mm. By combining the larger first vent holes and the smaller second vent holes, the base adsorption plane 111 can achieve a more uniform and stable wafer adsorption effect, which helps to avoid deformation of the wafer and damage. In addition, the base adsorption plane 111 may also only include the first vent hole.
[0039] In one embodiment, a blue film is laid on the base adsorption plane 111. In actual work, ventilation holes should be set on the blue film according to the ventilation holes on the base adsorption plane 111, so as to ensure that the base adsorption plane 111 can normally adsorb the wafer. By laying a blue film on the base adsorption plane 111, the stability and reliability of the wafer during the manufacturing and packaging process can be improved, while protecting the wafer from contamination and physical damage.
[0040] In one embodiment, if Figure 4As shown, the wafer pasting equipment also includes a flat plate buffer device 4 for storing flat plate-shaped components to be pasted. The flat plate buffer device 4 includes a flat plate bearing portion 401 and a flat plate driving device 402, and a flat plate adsorption surface 411 is provided on the upper portion of the flat plate bearing portion 401. Ventilation holes can be provided on the flat plate adsorption surface 411, an air flow channel can be provided inside the flat plate bearing portion 401, and a vent can be provided on the surface of the flat plate bearing portion 401 and connected to an external exhaust device, and the vent, the air flow channel and the vent on the flat plate adsorption surface 411 form a complete air flow passage. When in use, the flat plate driving device 402 can drive the flat plate bearing portion 401 to drive the components to be pasted to flip up and down, so as to facilitate the implementation of some process flows, for example, it is convenient to clean the surfaces on both sides of the components to be pasted.
[0041] In one embodiment, if Figure 5 As shown, the wafer collage equipment also includes a wafer handling device 5. The wafer handling device 5 includes a displacement module 501 and a wafer adsorption module 502. Among them, the displacement module 501 includes a horizontal displacement mechanism 511 and a lifting mechanism 512 installed on the horizontal displacement mechanism 511. The wafer adsorption module 502 is installed at the bottom of the lifting mechanism 512, and is used to adsorb one wafer or multiple wafers. The wafer adsorption module 502 can be installed at the bottom of the lifting mechanism 512 in a detachable manner, so that in actual work, wafer adsorption modules 502 of different sizes or functions can be replaced to meet different task requirements, or the wafer adsorption module 502 can be conveniently replaced when it is damaged.
[0042] In one embodiment, if Figure 5As shown, the wafer adsorption module 502 includes a first adsorption module 521 and a second adsorption module 522 separated from each other. A first adsorption plane is provided at the lower part of the first adsorption module 521, and a second adsorption plane is provided at the lower part of the second adsorption module 522. The adsorption area of the first adsorption plane is greater than the adsorption area of the second adsorption plane. An air flow channel can be provided inside the first adsorption module 521, and an air vent can be provided on the surface and connected to an external exhaust device. The air vent, the air flow channel and the air vent of the first adsorption plane form a complete air flow channel. Similarly, an air flow channel can be provided inside the second adsorption module 522, and an air vent can be provided on the surface and connected to an external exhaust device. The air vent, the air flow channel and the air vent of the second adsorption plane form a complete air flow channel. When splicing multiple wafers, the second adsorption module 522 can be used to adsorb a single wafer from the loading position and place the single wafer on the carrying platform 1 for splicing. After all wafers are placed in place and spliced, the first adsorption module 521 can be used to adsorb all wafers at the same time, and move while maintaining the relative positions of all wafers, so as to carry out various subsequent tasks, such as splicing seam width detection. In addition, the wafer adsorption module 502 can also include more than two sub-adsorption modules, each of which can have a different adsorption area, so as to meet the adsorption requirements of more wafer sizes.
[0043] In one embodiment, if Figure 6 As shown, the wafer collage equipment also includes a material unloading device 6. The material unloading device 6 includes a wafer gripping part 601 and a material unloading driving device 602. Among them, a wafer adsorption part 611 is provided on the surface of the wafer gripping part 601, and the material unloading driving device 602 is used to drive the wafer gripping part 601 to translate and flip up and down. An air flow channel can be provided inside the wafer adsorption part 611, and an air vent can be provided on the surface and an external exhaust device can be connected. The air vent, the air flow channel and the wafer adsorption part 611 form a complete air flow passage. After completing the mounting work, the material unloading driving device 602 can drive the wafer gripping part 601 to move above the carrying platform 1, adsorb the surface of the wafer backplane through the wafer adsorption part 611, and then drive the wafer gripping part 601 to leave the carrying platform 1 and reach the designated position, thereby completing the unloading.
[0044] In one embodiment, if Figure 5As shown, the wafer collage equipment also includes a detection device 7, which includes an upper alignment camera 701 and a lower alignment camera 702. The upper alignment camera 701 is arranged on the lifting mechanism 512 and its lens direction is facing the lower side, and the lens direction of the lower alignment camera 702 is facing the upper side. When in use, when the wafer is placed in place on the carrier platform 1, or multiple single wafers are placed in place on the carrier platform 1 to complete the splicing, the wafer handling device 5 absorbs all wafers and moves them to the top of the lower alignment camera 702, so that the lens directions of the upper alignment camera 701 and the lower alignment camera 702 are aligned, and then the detection process is started, such as detecting the width of the splicing seam between each wafer. In the detection of the splicing seam width, the detection standard can be set to a splicing seam width between adjacent wafers not exceeding 10μm. After the detection is completed, the wafer handling device 5 transfers all wafers back to the carrier platform 1.
[0045] In one embodiment, the wafer bonding device further includes a wafer cleaning device, which includes a tornado cleaning device and / or a plasma cleaning device. During operation, the wafer surface can be cleaned using the wafer cleaning device first, and then the wafer is placed on the carrier platform 1. In addition, before the pressing device 3 absorbs the component to be bonded, the wafer cleaning device can be used to clean the surface of the component to be bonded.
[0046] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A wafer collage device, characterized in that: include: The carrying platform (1) comprises an adsorption base (101) and a horizontal adjustment platform (102), wherein the adsorption base (101) is fixedly arranged above the horizontal adjustment platform (102), a base adsorption plane (111) for adsorbing wafers is arranged on the upper part of the adsorption base (101), and a vent hole is arranged on the base adsorption plane (111); A glue dispensing device (2), used for performing glue dispensing operation on the surface of the wafer; The pressing device (3) comprises a pressing drive device (302) and a pressing adsorption head (301) arranged below the pressing drive device (302); when in use, the pressing device (3) adsorbs a flat plate-shaped component to be bonded and moves to the top of the supporting platform (1), thereby pressing the component to be bonded and the wafer together.
2. The wafer collage equipment according to claim 1, characterized in that: The adsorption base (101) is installed on the horizontal adjustment platform (102) in a detachable manner.
3. The wafer collage equipment according to claim 1, characterized in that: The carrying platform (1) comprises a plurality of adsorption bases (101), each of the adsorption bases (101) having a base adsorption plane (111) of a different size.
4. The wafer collage equipment according to claim 1, characterized in that: The horizontal adjustment platform (102) comprises an adjustment base (121) and a plurality of retractable adjustment rods (122); When in use, the adsorption base (101) is fixedly arranged above the adjustment base (121), and the horizontality of the adjustment base (121) is changed by adjusting the length of the adjustment rod (122), so that the base adsorption plane (111) is located in a horizontal plane.
5. The wafer collage equipment according to claim 1, characterized in that: The ventilation holes of the base adsorption plane (111) include a first ventilation hole and a second ventilation hole, and the diameter of the first ventilation hole is greater than the diameter of the second ventilation hole.
6. The wafer collage equipment according to claim 1, characterized in that: A blue film is laid on the base adsorption plane (111).
7. The wafer collage equipment according to claim 1, characterized in that: It also includes a flat plate buffer device (4) for storing flat plate-shaped components to be bonded, and the flat plate buffer device (4) includes: A flat plate bearing portion (401), the upper portion of which is provided with a flat plate adsorption surface (411); The flat plate driving device (402) is used to drive the flat plate bearing part (401) to flip up and down.
8. The wafer collage equipment according to claim 1, characterized in that: It also includes a wafer handling device (5), wherein the wafer handling device (5) includes: A displacement module (501) comprises a horizontal displacement mechanism (511) and a lifting mechanism (512) installed on the horizontal displacement mechanism (511); The wafer adsorption module (502) is installed at the bottom end of the lifting mechanism (512) and is used to adsorb one wafer or multiple wafers.
9. The wafer collage equipment according to claim 8, characterized in that: The wafer adsorption module (502) comprises a first adsorption module (521) and a second adsorption module (522) which are separated from each other, wherein a first adsorption plane is arranged at the bottom of the first adsorption module (521), and a second adsorption plane is arranged at the bottom of the second adsorption module (522); The adsorption area of the first adsorption plane is greater than the adsorption area of the second adsorption plane.
10. The wafer collage equipment according to claim 1, characterized in that: The invention also comprises a material discharging device (6), wherein the material discharging device (6) comprises: A wafer grabbing portion (601) having a wafer adsorption portion (611) disposed on its surface; The material unloading driving device (602) is used to drive the wafer grabbing part (601) to move horizontally and flip up and down.
11. The wafer collage equipment according to claim 8, characterized in that: It also includes a detection device (7), the detection device (7) including an upper alignment camera (701) and a lower alignment camera (702), the upper alignment camera (701) being arranged on the lifting mechanism (512) and having its lens oriented downward, and the lower alignment camera (702) having its lens oriented upward; When in use, the wafer transport device (5) drives the upper alignment camera (701) to move to the position directly above the lower alignment camera (702) to inspect the wafer.
12. The wafer collage equipment according to claim 1, characterized in that: Also included is a wafer cleaning device, which includes a tornado cleaning device and / or a plasma cleaning device.