Chip testing method and device, management service platform and electronic equipment

Abstract

The embodiment of the invention discloses a chip testing method and device, a management service platform and electronic equipment, and the method comprises the steps that the management service platform enables a first target binding result to be matched with first preset binding information, and sends second preset binding information to a testing machine when the matching succeeds, and setting each test board card on the test machine based on second preset binding information to obtain a second target binding result, and when the second target binding result is successfully matched with the second preset binding information, testing each target tested device by the test machine to obtain a test result. Therefore, the first target binding result corresponding to each test board card on the loading and unloading machine table is matched with the first preset binding information, and the second target binding result on the test machine table is matched with the second preset binding information, so that the target tested device is prevented from being arranged on an unusable slot position; and it is ensured that the test board card can be accurately arranged in a corresponding test machine.

Description

Technical Field

[0001] The present application relates to chip testing technology, and in particular to a chip testing method, device, management service platform and electronic equipment. Background Art

[0002] Test board management is an important part of the chip testing process, and effective test board management can improve chip testing efficiency. In the mass production test phase, users need to use a large number of test boards for testing at the same time. At the same time, there may be multiple different types of test boards, multiple test machines, and multiple batches for testing at the same time. Due to the different types of devices under test, different batches and different types of test boards require different types of test machines and test programs. If mixed batches occur, production accidents may occur, resulting in damage to the chips under test and causing large economic losses to customers. Therefore, there is an urgent need for a method that can ensure accurate settings between the devices under test and the test boards and test machines during the test process. Summary of the invention

[0003] In order to solve the above technical problems, the embodiments of the present application provide a chip testing method, device, management service platform and electronic device.

[0004] In one aspect of an embodiment of the present application, a chip testing method is provided, which is applied to a test management system, the test management system comprising a management service platform, a loading and unloading machine and a test machine, the method comprising: the management service platform obtains a first target binding result corresponding to at least one test board from the loading and unloading machine, and matches the first target binding result with a first preset binding information, wherein the first preset binding information comprises a slot status of a slot on each test board in the at least one test board, the first target binding result comprises slot information corresponding to each target device under test, and each target device under test is arranged on the at least one test board; in response to the first target binding result successfully matching the first preset binding information, the management service platform sends a second preset binding information to the test machine; based on the second preset binding information, each test board is arranged on the test machine to obtain a second target binding result, wherein the second target binding result and the second preset binding information both comprise a corresponding relationship between each test board and a test station on the test machine; in response to the second target binding result successfully matching the second preset binding information, the test machine tests each target device under test to obtain a test result.

[0005] Another aspect of the embodiments of the present application provides a chip testing device, which is applied to a test management system, wherein the test management system includes a management service platform, a loading and unloading machine, and a test machine, and the device includes: a first verification module, which is used for the management service platform to obtain a first target binding result corresponding to at least one test board from the loading and unloading machine, and match the first target binding result with first preset binding information, wherein the first preset binding information includes a slot status of a slot on each test board in the at least one test board, and the first target binding result includes slot information corresponding to each target device under test, and each target device under test is arranged on the at least one test board; A first sending module is used for, in response to the first target binding result successfully matching the first preset binding information, the management service platform sending second preset binding information to the test machine; a second verification module is used for, based on the second preset binding information, setting the at least one test board on the test machine to obtain a second target binding result, wherein the second target binding result and the second preset binding information both include the corresponding relationship between each test board and the test station on the test machine; a testing module is used for, in response to the second target binding result successfully matching the second preset binding information, the test machine testing each target device under test to obtain a test result.

[0006] Another aspect of an embodiment of the present application provides an electronic device, comprising: a memory for storing a computer program; a processor for executing the computer program stored in the memory, and when the computer program is executed, the above-mentioned chip testing method is implemented.

[0007] In another aspect of the embodiments of the present application, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the above-mentioned chip testing method is implemented.

[0008] In another aspect of the embodiments of the present application, a computer program product is provided, including computer program instructions, which implement the above-mentioned chip testing method when executed by a processor.

[0009] The chip testing method, device, management service platform, electronics, storage and product in the embodiments of the present application, the chip testing method includes: the management service platform matches the first target binding result with the first preset binding information, the first preset binding information includes the slot status of the slot on each test board, the first target binding result includes the slot information corresponding to each target device under test, each target device under test is set on at least one test board, when the first target binding result matches the first preset binding information successfully, the management service platform sends the second preset binding information to the test machine, and each test board is set on the test machine based on the second preset binding information to obtain the second target binding result, the second target binding result and the second preset binding information both include the correspondence between each test board and the test station on the test machine, when the second target binding result matches the second preset binding information successfully, the test machine tests each target device under test to obtain a test result. Therefore, by matching the first target binding result corresponding to each test board on the loading and unloading machine with the first preset binding information, and matching the second target binding result on the test machine with the second preset binding information, it is possible to avoid the target device under test being set in an unusable slot, and ensure that the test board can be accurately set in the corresponding test machine, thereby avoiding the situation where the target device under test is set in an unusable slot or the target device under test is damaged due to being tested on the wrong test machine, and also ensuring the accuracy of the test of the target device under test.

[0010] The technical solution of the present application is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0012] The present application can be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0013] Figure 1 It is a flowchart of a chip testing method provided by an exemplary embodiment of the present application.

[0014] Figure 2 It is a flowchart of a chip testing method provided by another exemplary embodiment of the present application.

[0015] Figure 3 It is a schematic diagram of a chip testing method provided by an application example of the present disclosure.

[0016] Figure 4 It is a schematic diagram of a management service platform provided by an exemplary embodiment of the present application.

[0017] Figure 5It is a schematic diagram of a management service platform provided by another exemplary embodiment of the present application.

[0018] Figure 6 It is a structural block diagram of a chip testing device provided by an exemplary embodiment of the present disclosure.

[0019] Figure 7 This is a schematic diagram of the structure of an application embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0020] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0021] Those skilled in the art can understand that the terms "first" and "second" in the embodiments of the present application are only used to distinguish different steps, devices or modules, etc., and neither represent any specific technical meaning nor indicate the necessary logical order between them.

[0022] It should also be understood that in the embodiments of the present application, "plurality" may refer to two or more than two, and "at least one" may refer to one, two or more than two.

[0023] It should also be understood that any component, data or structure mentioned in the embodiments of the present application can generally be understood as one or more, unless explicitly limited or otherwise indicated in the context.

[0024] In addition, the term "and / or" in this application is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this application generally indicates that the associated objects before and after are in an "or" relationship.

[0025] It should also be understood that the description of the various embodiments in this application focuses on the differences between the various embodiments, and the same or similar aspects thereof can be referenced to each other, and for the sake of brevity, they will not be described one by one.

[0026] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0027] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0028] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0029] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0030] The embodiments of the present application can be applied to electronic devices such as terminal devices, computer systems, servers, etc., which can operate with many other general or special computing system environments or configurations. Examples of well-known terminal devices, computing systems, environments and / or configurations suitable for use with electronic devices such as terminal devices, computer systems, servers, etc. include, but are not limited to: personal computer systems, server computer systems, thin clients, thick clients, handheld or laptop devices, microprocessor-based systems, set-top boxes, programmable consumer electronics, network personal computers, small computer systems, large computer systems, and distributed cloud computing technology environments including any of the above systems, etc.

[0031] Electronic devices such as terminal devices, computer systems, servers, etc. can be described in the general context of computer system executable instructions (such as program modules) executed by computer systems. Generally, program modules can include routines, programs, object programs, components, logic, data structures, etc., which perform specific tasks or implement specific abstract data types. Computer systems / servers can be implemented in a distributed cloud computing environment, where tasks are performed by remote processing devices linked through a communication network. In a distributed cloud computing environment, program modules can be located on local or remote computing system storage media including storage devices.

[0032] In the process of realizing the present application, it is found through research that in the chip testing process, the corresponding test board and test machine can be selected for the device under test according to the type of the device under test or the tested function, and then the device under test is fixedly set on the test board, and then the test board is sent to the test machine for testing. For example, when the device under test is subjected to an aging test, the device under test can be fixed to an aging test board (Burn-In Board, BIB), and then the test machine used to perform an aging test on the device under test is tested. Thus, it is crucial to avoid the test of the device under test and the test board and the test machine setting errors (for example, mixed batches, etc.) to the device under test.

[0033] Figure 1 FIG. 1 is a flow chart of a chip testing method provided by an exemplary embodiment of the present application. This embodiment can be applied to a test management system, such as Figure 1As shown, the chip testing method may include the following steps:

[0034] Step S110: The management service platform obtains a first target binding result corresponding to at least one test board from a loading and unloading machine, and matches the first target binding result with the first preset binding information.

[0035] Among them, the test management system includes: a management service platform, a loading and unloading machine and a test machine. The management service platform is respectively connected to the loading and unloading machine and the test machine in communication. The management service platform may include, for example, at least one of the following: a server, a computer, a notebook, and a tablet computer. The loading and unloading machine (Load / Unload machine, L / UL machine) is used to set the device under test on the test board. The test machine is used to test the function or performance of the device under test. The test machine may include, for example, at least one of the following: a chip aging tester, a chip vibration tester, and an integrated circuit automatic tester (Automatic Test Equipment, ATE), etc. In one embodiment, the test management system may include multiple loading and unloading machines and multiple test machines, and the multiple loading and unloading machines and multiple test machines are all connected to the management service platform in communication.

[0036] The target device under test (DUT) can be, for example, a chip, an integrated circuit or a wafer. The test board can also be called a load board, which is used to fix the device under test and to achieve the connection between the device under test and the test machine. For example, the test board can be a BIB. The test board can include multiple slots (DUT positions). Exemplarily, a test socket can be provided in the slot, and the target device under test can be fixed by the test socket.

[0037] The first preset binding information includes the slot status of the slots on each test board in at least one test board, and the first target binding result includes the slot information corresponding to each target device under test, and each target device under test is set on at least one test board.

[0038] The slot status may include: open and closed. When the slot status of a slot is open, it means that the slot can be used normally, that is, the device under test can be set in the slot; when the slot status of a slot is closed, it means that the slot cannot be used normally, that is, the device under test cannot be set in the slot. The corresponding relationship between each target device under test and the slot on the test board includes: the slot corresponding to each target device under test, that is, the slot where each test board is located. The slot information corresponding to each target device under test includes the slot of the test board where the target device under test is located.

[0039] In one embodiment, the management service platform determines whether a target device under test is set in a slot with a slot status of closed based on the slot status of the slots on each test board and the slot information corresponding to each target device under test. When it is determined that no target device under test is set in a slot with a slot status of closed, it is determined that the first target binding result matches the first preset binding information successfully. When it is determined that a target device under test is set in a slot with a slot status of closed, it is determined that the first target binding result fails to match the first preset binding information.

[0040] Step S120 , in response to the first target binding result successfully matching the first preset binding information, the management service platform sends second preset binding information to the test machine.

[0041] The second preset binding information includes the correspondence between each test board and the test station on the test machine. The correspondence between each test board and the test station on the test machine includes: the test station corresponding to each test board, that is, the test station fixed to each test board.

[0042] Exemplarily, when it is determined that the first target binding result fails to match the first preset binding information, the test can be stopped and the device under test on the test board can be adjusted to adjust the target device under test set in a slot with a closed slot status to a slot with an open slot status.

[0043] Step S130, based on the second preset binding information, each test board is set on the test machine to obtain a second target binding result.

[0044] The second target binding result includes: the correspondence between each test board and the test station on the test machine. The test machine sets each test board on the test machine based on the second preset binding information to obtain the second target binding result.

[0045] In one embodiment, a plurality of test stations may be disposed on the test machine, and each test station is used to fix a test board.

[0046] Exemplarily, each test board can be set to a corresponding test station on a corresponding test machine according to the second preset binding information, and the second target binding result can be obtained by scanning the QR code or barcode on the test board and the QR code or barcode of the test machine.

[0047] Step S140 , in response to the second target binding result successfully matching the second preset binding information, the test machine tests each target device under test to obtain a test result.

[0048] Among them, the test machine compares the second target binding result with the second preset binding information. When the second target binding result is the same as the second preset binding information, it is determined that the second target binding result and the second preset binding information match successfully, and the test machine executes the test on the target device under test; when the second target binding result and the second preset binding information are different, it is determined that the second target binding result and the second preset binding information match unsuccessfully, and the test machine does not test the target device under test.

[0049] In an embodiment of the present application, by matching the first target binding result corresponding to each test board on the loading and unloading machine with the first preset binding information, and matching the second target binding result on the test machine with the second preset binding information, it is avoided that the target device under test is set in an unusable slot, and it is ensured that the test board can be accurately set in the corresponding test machine, thereby avoiding the situation where the target device under test is set in an unusable slot or the target device under test is damaged due to being tested on an incorrect test machine, and at the same time, the accuracy of the test of the target device under test is ensured.

[0050] In some optional implementations, before step S110 in the embodiment of the present application, the step also includes: the loading and unloading machine obtains first preset binding information from the management service platform, and sets the target device under test on the test board based on the first preset binding information to obtain a first target binding result.

[0051] In one implementation, each target test device may be respectively set in a slot whose slot status is open according to the slot status of each slot on the test board in the first preset binding information.

[0052] Exemplarily, the first target binding result can be obtained by scanning a QR code or a barcode on the test board and a QR code or a barcode on the device under test, and the first target binding result can be transmitted to the management service platform.

[0053] Exemplarily, the first preset binding information includes a socket map file (File Socket Map, FSM), and the socket map file is shown in Table 1. The first target binding result may include a mounting information map (DUT Mounted Device, DMD), and the mounting information map may refer to Table 2.

[0054] Table 1

[0055]

[0056] Among them, Data Item represents data item, Data Type represents data type, Data Size represents data size, Characters represents characters, and Bytes represents bytes. The test program file represents the test program file used to test the target device under test, the bracket ID represents the identification of the loading and unloading machine used, the board slot number includes the number of each slot on the test board, the test product name is the name of the target device under test, the device ID represents the identification of the type of the target device under test, the board ID represents the identification of the test board, the column DUT number represents the number of slots included in each column on the test board, the row DUT number represents the number of slots included in each row on the test board, and the device mounting information of each DUT represents the number of target devices under test that can be set on each target test board. Table 1 shows the slot status of each slot on a test board, b0~b15 are the slots in the bth row and the 1st to 15th columns, and the slot status of slots b1~b15 are all open.

[0057] Table 2

[0058]

[0059]

[0060] In Table 2, no target device under test is set in slots b1 to b15.

[0061] In an embodiment of the present application, the loading and unloading machine sets each target device under test in a corresponding slot based on the first preset binding information, thereby ensuring that each target device under test can be accurately set in a corresponding slot on the corresponding target test board, and avoiding the target device under test from being set in a slot whose slot status is closed.

[0062] In some optional implementations, the chip testing method in the embodiment of the present application may further include: the management service platform generates first preset binding information based on preset board status information.

[0063] The preset board status information includes: the slot status of each slot on each test board, and the board status of each test board. The board status may include: normal and disabled. When the board status of the test board is normal, it means that the test board can be used to test the device under test; when the board status of the test board is disabled, it means that the test board cannot be used to test the device under test.

[0064] In one embodiment, according to the function or performance that needs to be tested of the target device under test, based on the preset board status information, a corresponding test board with a normal board status can be selected, and the first preset binding information can be constructed according to the slot status of the slots on each selected test board.

[0065] In the embodiment of the present application, the usable test boards can be efficiently determined according to the preset board status information, thereby avoiding the use of test boards whose board status is disabled during the test process.

[0066] Figure 2 FIG. 1 is a flow chart of a chip testing method provided by another exemplary embodiment of the present application. In some optional implementations, such as Figure 2 As shown, before the test machine tests at least one target device under test, the following steps may also be included:

[0067] In step S210 , the test machine performs a pre-test on each target device under test to obtain a pre-test result.

[0068] The pre-test result includes connection states corresponding to the slots on each test board, and the connection state corresponding to the slot represents the connection state between the slot and the target device under test arranged on the slot.

[0069] The pre-test is used to test the connection status between the slot on the test board and the target device under test set in the slot. The connection status can be connection success or connection failure.

[0070] Step S220, based on the connection statuses corresponding to the slots on each test board, determine slot status update information corresponding to each slot, and when the slot status update information corresponding to any slot is closed, the management service platform updates the slot status of any slot to closed.

[0071] In one embodiment, the management service platform also stores historical pre-test results, the historical pre-test results include historical connection states corresponding to each slot on each test board, and according to the historical connection states corresponding to each slot and the connection states corresponding to each slot in the pre-test results, the number of times the connection state corresponding to each slot is continuously failed to connect is determined, when it is determined that the number of times the connection state corresponding to any slot is continuously failed to connect is greater than a preset failure number threshold, the slot state update information corresponding to the any slot is determined to be closed, otherwise, the slot state update information is determined to be unchanged, when the slot state update information corresponding to any slot is closed, the slot state of any slot is updated to closed in the preset board state information, when the slot state update information corresponding to any slot is unchanged, no processing is performed, and the number of failures is cleared, wherein the preset failure number threshold can be set according to the actual test requirements. For example, the preset failure number threshold can be set according to the type of the test board (Board Type), or can also be set according to the type of the target device under test (Device ID).

[0072] In an embodiment of the present application, a pre-test is performed on the target device under test before the test to determine the connection status between each target device under test and the corresponding slot, thereby ensuring the accuracy of subsequent tests and realizing real-time monitoring of the slot status to ensure that slots with risks are not used in the next test.

[0073] In some optional embodiments, the chip testing method in the embodiment of the present application also includes: determining the slot status update information corresponding to each slot based on the classification level and / or test pass information corresponding to each slot in the test results, and when the slot status update information corresponding to any slot is closed, the management service platform updates the slot status of any slot to closed.

[0074] The test results include the classification level corresponding to each slot and the test pass information corresponding to each slot. The classification level corresponding to the slot is used to indicate the classification level of the target test device on the slot, and the classification level is used to indicate the quality of the target test device. The test pass information corresponding to the slot is used to indicate the test pass information of the target test device on the slot, and the test pass information of the target test device is used to indicate whether the target device under test has passed the test, and the test pass information includes test pass and test failure.

[0075] Exemplarily, the test results include: a bin (classification) map (Category DUT Map, CMD) and a failed device map (Fail Device Map, FDM), wherein the bin map includes the classification level corresponding to each slot, and the bin map can be found in Table 3; the failed device map includes the test pass information corresponding to each slot, and the failed device map can be found in Table 4.

[0076] Table 3

[0077]

[0078]

[0079] In Table 3, the classification level corresponding to the slots b5 to b15 is Bin0.

[0080] Table 4

[0081]

[0082] In Table 4, the test pass information corresponding to the slots b1 to b15 is test failure.

[0083] In one embodiment, the historical test results also include historical classification levels and historical test pass information corresponding to each slot on each test board. The management service platform determines the number of times the classification level corresponding to each slot is continuously the preset classification level based on the historical classification level corresponding to each slot and the classification level corresponding to each slot in the test results. When it is determined that the number of times the classification level corresponding to any slot is continuously the preset classification level is greater than or equal to a first preset number threshold, the slot status update information corresponding to any slot is determined to be closed, otherwise the slot status update information is determined to be unchanged. When the slot status update information corresponding to any slot is closed, the slot status of any slot is updated to closed in the preset board status information. When the slot status update information corresponding to any slot is unchanged, no processing is performed and the number of failures is cleared.

[0084] The management service platform determines the number of times the test pass information corresponding to each slot is continuously tested as failed based on the historical test pass information corresponding to each slot and the test pass information corresponding to each slot in the test results. When it is determined that the number of times the test pass information corresponding to any slot is continuously tested as failed is greater than or equal to the second preset number threshold, the slot status update information corresponding to any slot is determined to be closed, otherwise the slot status update information is determined to be unchanged. When the slot status update information corresponding to any slot is closed, the slot status of any slot is updated to closed in the preset board status information. When the slot status update information corresponding to any slot is unchanged, no processing is performed and the number of failures is cleared. Among them, the first preset number threshold and the second preset number threshold can be set according to actual test requirements. For example, the first preset number threshold and the second preset number threshold can be set according to the type of test board, or can also be set according to the type of target device under test.

[0085] Correspondingly, in an embodiment of the present application, it also includes: based on the test yield corresponding to each test board in the test results, determining the board status update information of each test board, and when the board status update information corresponding to any test board is disabled, the management service platform updates the board status of any test board to disabled.

[0086] The test results also include the test yields corresponding to each test board. The test yield corresponding to the test board represents the test pass rate of the target devices under test set on the test board. For each test board, the value of the number of target devices under test with test pass information on the test board divided by the number of all target devices under test on the test board is determined as the test yield corresponding to the test board.

[0087] In one embodiment, the historical test results also include the historical test yields corresponding to each test board.

[0088] According to the test yield rate of each test board and the test result, the test yield rate of each test board is determined to be less than or equal to the number of times of the preset yield threshold value, when it is determined that the test yield rate corresponding to any test board is less than or equal to the number of times of the preset yield threshold value is greater than or equal to the third preset number of times threshold value, the board state update information corresponding to any test board is determined to be disabled, otherwise the board state update information is determined to be unchanged, when the board state update information corresponding to any test board is closed, the board state of any test board is updated to be disabled in the preset board state information, when the board state update information corresponding to any test board is unchanged, no processing is done, and the number of failures is cleared. Wherein, the third preset number of times threshold value can be set according to the actual test demand. For example, the third preset number of times threshold value can be set according to the type of the test board, or can also be set according to the type of the target device under test.

[0089] In an embodiment of the present application, slot status update information corresponding to each slot is determined by the classification level and / or test pass information corresponding to each slot, and board status update information corresponding to each test board is determined by the test yield corresponding to each test board, and whether to update the slot status and board status is determined based on the slot status update information and the board status update information, thereby achieving timely updating of the board status of the test board and the slot status of the slot, ensuring that slots and test boards with risks are not used for the next test.

[0090] In some optional embodiments, the chip testing method in the embodiments of the present application further includes: in response to monitoring that the number of slots on any test board whose slot status is closed is greater than or equal to a preset closed number threshold, updating the board status of any test board to disabled.

[0091] Among them, the management service platform monitors the slot status of each slot on each test board in real time. When it is determined that the number of closed slots on any test board is greater than or equal to the preset closed number threshold, the board status of any test board is updated to disabled, otherwise no processing is performed, wherein the closed slot is used to indicate a slot whose slot status is closed. The preset closed number threshold can be set according to actual test requirements. For example, the preset closed number threshold can be set according to the type of the test board, or it can also be set according to the type of the target device under test.

[0092] In an embodiment of the present application, by monitoring the slot status of the slots on the test board, and when the number of slots on the test board that are closed is greater than or equal to a preset closed number threshold, the board status of the test board is updated to disabled, thereby achieving timely update of the board status of the test board, ensuring that the test board with risks is not used for the next test.

[0093] Figure 3 FIG. 1 is a schematic diagram of a chip testing method provided by an application example of the present disclosure. Figure 3 As shown, the loading and unloading trolley loads the test board onto or unloads the test board from the loading and unloading trolley through the upper and lower plate operations. The loading and unloading trolley can load the target device under test and the test board onto the loading and unloading machine. The loading and unloading machine can set the target device under test on the test board (loading), and send the loaded test board into the test machine. After the test is completed, the target device under test can be unloaded from the test board (unloading).

[0094] The loading and unloading machine obtains the first preset binding information from the management service platform, and sets the target device under test on the test board (binds) based on the first preset binding information, obtains the first target binding result, and sends the first target binding result to the management service platform. The management service platform matches the first target binding result with the first preset binding information. When the first target binding result matches the first preset binding information successfully, the management service platform sends the second preset binding information to the test machine. When the match fails, it can be sent to the test board to delete the wrong slot where the target device under test is placed. Then the test board is manually unlocked and confirmed. After the confirmation is passed, the management service platform sends the second preset binding information to the test machine. The test machine sets each test board on the test machine (binds) based on the second preset binding information and obtains the second target binding result. When the second target binding result matches the second preset binding information successfully, a test is performed to obtain a test result. When the match is successful, troubleshooting can be performed. When the test is completed, after the test is completed, the management service platform controls the test board and the target device under test, as well as the test board and the test machine to unbind.

[0095] Figure 4 FIG. 1 is a schematic diagram of a management service platform provided by an exemplary embodiment of the present application. Figure 4 As shown, the management service platform may include: a main server and a backup server; the main server and the backup server are respectively communicated with the loading and unloading machines and the testing machine; the main server executes the above-mentioned chip testing method; in response to detecting an abnormality in the main server, the backup server executes the above-mentioned chip testing method.

[0096] Among them, the main server and the slave server are connected in communication, and a heartbeat mechanism is set between the main server and the backup server. The main server and the backup server sense each other's existence through the heartbeat mechanism. The backup server determines the status of the main server through heartbeat detection. When the heartbeat of the main server times out, that is, the backup server does not receive the heartbeat packet sent by the main server within the preset time, it is determined that the main server is abnormal. The main server can also synchronize data with the backup server in real time. When the main server is abnormal, the main server can also perform full data synchronization processing on the backup server.

[0097] In the embodiment of the present application, by setting the management service platform to a dual-server design, when the main server fails (abnormal), the backup server automatically changes its role to the main server, and actively communicates with the loading and unloading machines and the testing machines, ensuring that the test process is not affected when the main server is abnormal, and also avoiding the risk of data loss caused by abnormalities in the main device.

[0098] Figure 5 is a schematic diagram of a management service platform provided by another exemplary embodiment of the present application. In some optional implementations, such as Figure 5 As shown, the management service platform also includes multiple clients, which are respectively connected to the main server and the backup server for communication; for the multiple clients, the client processes the test board management information in the main server and the backup server based on the corresponding permissions of the client.

[0099] The test board management information may include test board outbound information, test board inbound information, test board repair information, test board status information, and slot status information.

[0100] Each client has a corresponding permission, and different permissions can be set for the user's client according to the user's role in the test process. Each client can update, view, delete, modify, and perform other operations on the test board management information according to the permissions corresponding to the client. For example, roles may include test board warehouse administrator, equipment engineer, and operator (OP).

[0101] In the embodiment of the present application, by setting different permissions for different clients, different operations and management of the test board are achieved according to different permissions.

[0102] Figure 6 : is a block diagram of a chip testing device provided by an exemplary embodiment of the present disclosure. The chip testing device is applied to a test management system, the test management system includes a management service platform, a loading and unloading machine and a test machine, the device includes:

[0103] A first verification module 310 is used for the management service platform to obtain a first target binding result corresponding to at least one test board from the loading and unloading machine, and match the first target binding result with first preset binding information, wherein the first preset binding information includes the slot status of the slots on each test board in the at least one test board, and the first target binding result includes the slot information corresponding to each target device under test, and each target device under test is set on the at least one test board;

[0104] A first sending module 320, configured to, in response to the first target binding result successfully matching the first preset binding information, send second preset binding information by the management service platform to the test machine;

[0105] A second verification module 330 is used to set the at least one test board on the test machine based on the second preset binding information to obtain a second target binding result, wherein the second target binding result and the second preset binding information both include a correspondence between each test board and a test station on the test machine;

[0106] The testing module 340 is configured to, in response to the second target binding result successfully matching the second preset binding information, test the target devices under test by the testing machine to obtain a test result.

[0107] In some optional implementations, the chip testing device in the embodiment of the present application further includes:

[0108] A binding module is used for the loading and unloading machine to obtain the first preset binding information from the management service platform, and to set the target device under test on the test board based on the first preset binding information to obtain the first target binding result.

[0109] In some optional implementations, the chip testing device in the embodiment of the present application further includes:

[0110] An information generation module is used for the management service platform to generate the first preset binding information based on preset board status information, wherein the preset board status information includes the slot status of each slot on each test board and the board status of each test board.

[0111] In some optional implementations, the chip testing device in the embodiment of the present application further includes:

[0112] A pre-test module, used for the test machine to perform pre-test on each target device under test to obtain a pre-test result, wherein the pre-test result includes the connection status corresponding to the slots on each test board;

[0113] The first card control module is used to determine the slot status update information corresponding to each slot based on the connection status corresponding to the slots on the test boards, and when the slot status update information corresponding to any slot is closed, the management service platform updates the slot status of any slot to closed.

[0114] In some optional implementations, the chip testing device in the embodiment of the present application further includes:

[0115] a second card control module, configured to determine slot status update information corresponding to each slot based on the classification level and / or test pass information corresponding to each slot in the test result, and when the slot status update information corresponding to any slot is closed, the management service platform updates the slot status of any slot to closed;

[0116] The third card control module is used to determine the board status update information of each test board based on the test yield corresponding to each test board in the test results, and when the board status update information corresponding to any test board is disabled, the management service platform updates the board status of any test board to disabled.

[0117] In some optional implementations, the chip testing device in the embodiment of the present application further includes:

[0118] The fourth card control module is used to update the card state of any test board to disabled in response to monitoring that the number of slots in the closed state on any test board is greater than or equal to a preset closed number threshold.

[0119] The chip testing device of the embodiment of the present disclosure corresponds to the embodiment of the chip testing method of the present disclosure, and the relevant contents can be referenced to each other and will not be repeated here.

[0120] The beneficial technical effects corresponding to the exemplary embodiments of the chip testing device of the disclosed embodiments can be found in the corresponding beneficial technical effects of the above-mentioned corresponding exemplary method part, which will not be repeated here.

[0121] In addition, an embodiment of the present application further provides an electronic device, including:

[0122] Memory for storing computer programs;

[0123] The processor is used to execute the computer program stored in the memory, and when the computer program is executed, the chip testing method described in any of the above embodiments of the present application is implemented.

[0124] Figure 7 This is a schematic diagram of the structure of an application embodiment of the electronic device of the present application. Figure 7 The electronic device according to the embodiment of the present application is described. The electronic device may be any one or both of the first device and the second device, or a stand-alone device independent of them, and the stand-alone device may communicate with the first device and the second device to receive the collected input signal from them.

[0125] like Figure 7 As shown, the electronic device includes one or more processors and memory.

[0126] The processor may be a central processing unit (CPU) or other forms of processing units having data processing capabilities and / or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.

[0127] The memory may include one or more computer program products, and the computer program product may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory (cache), etc. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored on the computer-readable storage medium, and the processor may execute the program instructions to implement the chip testing method of each embodiment of the present application described above and / or other desired functions.

[0128] In one example, the electronic device may further include: an input device and an output device, and these components are interconnected via a bus system and / or other forms of connection mechanisms (not shown).

[0129] In addition, the input device may also include, for example, a keyboard, a mouse, and the like.

[0130] The output device can output various information to the outside, including the determined distance information, direction information, etc. The output device can include, for example, a display, a speaker, a printer, a communication network and a remote output device connected thereto, and the like.

[0131] Of course, to simplify, Figure 7 Only some of the components in the electronic device related to the present application are shown, and components such as a bus, an input / output interface, etc. are omitted. In addition, the electronic device may further include any other appropriate components according to specific application conditions.

[0132] In addition to the above-mentioned methods and devices, an embodiment of the present application may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the chip testing method according to various embodiments of the present application described in the above part of this specification.

[0133] The computer program product may be written in any combination of one or more programming languages ​​to write program codes for performing the operations of the embodiments of the present application, including object-oriented programming languages, such as Java, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as an independent software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0134] In addition, an embodiment of the present application may also be a computer-readable storage medium on which computer program instructions are stored. When the computer program instructions are executed by a processor, the processor executes the steps of the chip testing method according to various embodiments of the present application described in the above part of this specification.

[0135] The computer readable storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can include, for example, but is not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0136] A person of ordinary skill in the art can understand that all or part of the steps of implementing the above method embodiment can be completed by hardware related to program instructions, and the aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps of the above method embodiment; and the aforementioned storage medium includes: ROM, RAM, magnetic disk or optical disk, etc., various media that can store program codes.

[0137] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0138] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the system embodiment, since it basically corresponds to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0139] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0140] The method and apparatus of the present application may be implemented in many ways. For example, the method and apparatus of the present application may be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above order of steps for the method is for illustration only, and the steps of the method of the present application are not limited to the order specifically described above, unless otherwise specifically stated. In addition, in some embodiments, the present application may also be implemented as a program recorded in a recording medium, which includes machine-readable instructions for implementing the method according to the present application. Therefore, the present application also covers a recording medium storing a program for executing the method according to the present application.

[0141] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0142] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0143] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A chip testing method, characterized in that: Applied to a test management system, the test management system includes a management service platform, a loading and unloading machine and a test machine, and the method includes: The management service platform obtains a first target binding result corresponding to at least one test board from the loading and unloading machine, and matches the first target binding result with first preset binding information, wherein the first preset binding information includes the slot status of the slots on each test board in the at least one test board, and the first target binding result includes the slot information corresponding to each target device under test, and each target device under test is set on the at least one test board; In response to the first target binding result successfully matching the first preset binding information, the management service platform sends second preset binding information to the test machine; Based on the second preset binding information, each test board is set on the test machine to obtain a second target binding result, wherein the second target binding result and the second preset binding information both include a correspondence between each test board and a test station on the test machine; In response to the second target binding result successfully matching the second preset binding information, the test machine tests each of the target devices under test to obtain a test result.

2. The method according to claim 1, characterized in that: Before the management service platform obtains the first target binding result corresponding to at least one test board from the loading and unloading machine, it includes: The loading and unloading machine obtains the first preset binding information from the management service platform, and sets the target device under test on the test board based on the first preset binding information to obtain the first target binding result.

3. The method according to claim 1 or 2, characterized in that: Also includes: The management service platform generates the first preset binding information based on preset board status information, wherein the preset board status information includes a slot status of each slot on each test board and a board status of each test board.

4. The method according to claim 3, characterized in that Before the test machine tests the at least one target device under test, the test machine further includes: The test machine performs a pre-test on each target device under test to obtain a pre-test result, wherein the pre-test result includes connection states corresponding to the slots on each test board; Based on the connection statuses corresponding to the slots on the test boards, slot status update information corresponding to each slot is determined, and when the slot status update information corresponding to any slot is closed, the management service platform updates the slot status of any slot to closed.

5. The method according to claim 3 or 4, characterized in that: Also includes: Based on the classification level and / or test pass information respectively corresponding to each slot in the test result, determine the slot status update information respectively corresponding to each slot, and when the slot status update information corresponding to any slot is closed, the management service platform updates the slot status of any slot to closed; Based on the test yields corresponding to the test boards in the test results, the board status update information of each test board is determined, and when the board status update information corresponding to any test board is disabled, the management service platform updates the board status of any test board to disabled.

6. The method according to claim 5, characterized in that Also includes: In response to monitoring that the number of slots in the closed state on any test board is greater than or equal to a preset closed number threshold, the board state of the any test board is updated to disabled.

7. A management service platform, characterized in that: The management service platform includes a main server and a backup server, and the main server and the backup server are respectively connected to the loading and unloading machine and the testing machine for communication; The main server executes the chip testing method described in any one of claims 1 to 6; In response to detecting an abnormality in the main server, the backup server executes the chip testing method described in any one of claims 1-6.

8. The platform according to claim 7, characterized in that The management service platform further includes a plurality of clients, wherein the plurality of clients are respectively connected to the primary server and the backup server for communication; For the multiple clients, the clients process the test board management information in the primary server and the backup server based on the permissions corresponding to the clients.

9. A chip testing device, characterized in that: Applied to a test management system, the test management system includes a management service platform, a loading and unloading machine and a test machine, and the device includes: A first verification module is used for the management service platform to obtain a first target binding result corresponding to at least one test board from the loading and unloading machine, and match the first target binding result with first preset binding information, wherein the first preset binding information includes a slot status of a slot on each test board in the at least one test board, and the first target binding result includes slot information corresponding to each target device under test, and each target device under test is set on the at least one test board; A first sending module, configured to, in response to the first target binding result successfully matching the first preset binding information, send second preset binding information by the management service platform to the test machine; A second verification module is used to set the at least one test board on the test machine based on the second preset binding information to obtain a second target binding result, wherein the second target binding result and the second preset binding information both include a correspondence between each test board and a test station on the test machine; The testing module is used for, in response to the second target binding result successfully matching the second preset binding information, the testing machine tests each target device under test to obtain a test result.

10. An electronic device, characterized in that: include: Memory for storing computer programs; A processor is used to execute the computer program stored in the memory, and when the computer program is executed, the chip testing method described in any one of claims 1 to 6 is implemented.

Images