Electronic component

Abstract

An electronic component includes: an element body; a plurality of external electrodes each including a conductive resin layer; a plurality of internal electrodes electrically connected to corresponding external electrodes among the plurality of external electrodes; and an electrically insulating film disposed on the element body. The element body includes a pair of end surfaces, and a first side surface and a second side surface which are adjacent to the pair of end surfaces and are adjacent to each other. The element body includes: a first region located at a position separated from the first side surface; and a second region including the first side surface and having a dielectric constant smaller than that of the first region. The plurality of internal electrodes are disposed in the first region. The electrically insulating film includes a film portion on a region between the conductive resin layers in the second side surface.

Description

Technical Field

[0001] The present disclosure relates to electronic parts. Background Art

[0002] A known electronic component includes a rectangular body, a plurality of external electrodes, and a plurality of internal electrodes (for example, see Japanese Patent Publication No. 2018-006501). The plurality of external electrodes are respectively arranged on the body and include a conductive resin layer. The plurality of internal electrodes are respectively arranged in the body and are electrically connected to corresponding external electrodes among the plurality of external electrodes. Summary of the invention

[0003] The conductive resin layer generally contains a plurality of metal particles and a resin. In a structure in which the external electrode includes a conductive resin layer, the external electrode may migrate. The migration is considered to occur, for example, due to the following phenomenon.

[0004] The electric field or heat acts on the metal particles contained in the conductive resin layer, and the metal particles are ionized. The generated metal ions are attracted by the electric field generated between the external electrodes and move from the conductive resin layer. The electric field acting on the metal particles includes, for example, the electric field generated between the external electrode and the internal electrode. The metal ions moving from the conductive resin layer react with, for example, electrons caused by leakage current generated in the electronic parts, and precipitate as metal on the surface of the element body. The electrons caused by the leakage current are supplied, for example, from the element body, the internal electrode, or the external electrode.

[0005] An object of each aspect of the present disclosure is to provide an electronic component that suppresses the occurrence of migration even when the external electrode includes a conductive resin layer.

[0006] One method of the present disclosure provides an electronic component, which includes a rectangular parallelepiped body, a plurality of external electrodes, a plurality of internal electrodes, and an electrically insulating film disposed on the body. The body includes a pair of end faces facing each other and a first side face and a second side face adjacent to the pair of end faces and adjacent to each other. The plurality of external electrodes are respectively disposed on both ends of the body in the direction facing the pair of end faces, and respectively include a conductive resin layer located on the first side face and the second side face. The plurality of internal electrodes are disposed in the body and are electrically connected to corresponding external electrodes among the plurality of external electrodes. The body includes a first region and a second region. The first region is located at a position separated from the first side face and is provided with a plurality of internal electrodes. The second region includes the first side face and has a dielectric constant smaller than the dielectric constant of the first region. The electrically insulating film includes a film portion located on the region between the conductive resin layers in the second side face.

[0007] In one of the above-mentioned embodiments, the second region including the first side has a dielectric constant smaller than the dielectric constant of the first region. Therefore, the above-mentioned embodiment suppresses the generation of leakage current in the second region. Even when the metal particles contained in the conductive resin layer located on the first side are ionized, it is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the first side.

[0008] In the above-mentioned one mode, the film portion included in the electrical insulating film is located on the region between the conductive resin layers on the second side. Therefore, even if the metal particles included in the conductive resin layer located on the second side are ionized, the film portion hinders the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the second side.

[0009] As a result, the above-mentioned one aspect can suppress the occurrence of migration even if the external electrode includes a conductive resin layer located on the first side surface and the second side surface.

[0010] In the above embodiment, the element body may include a third side surface facing the first side surface and a third region including the third side surface and having a dielectric constant smaller than that of the first region. The conductive resin layer may be located on the third side surface.

[0011] The structure in which the element body includes the third region suppresses the generation of leakage current in the third region. Even when the metal particles contained in the conductive resin layer located on the third side surface are ionized, it is difficult for electrons to be supplied to the metal ions. It is difficult for the metal to precipitate on the third side surface. Therefore, the structure in which the element body includes the third region suppresses the generation of migration even if the external electrode includes the conductive resin layer located on the third side surface.

[0012] In the above aspect, the plurality of internal electrodes may face each other in a direction perpendicular to a direction in which the pair of end faces face each other and a direction in which the first side face and the third side face face each other.

[0013] In the structure in which a plurality of internal electrodes are mutually opposed in the above-mentioned direction, there is a tendency for electrons to be supplied from the internal electrodes to the conductive resin layer located on the second side surface as leakage current. However, as described above, the film partially blocks the reaction between the generated metal ions and the electrons. Therefore, even in this structure, the generation of migration is reliably suppressed.

[0014] In one embodiment, the plurality of internal electrodes may include an outermost internal electrode adjacent to the second side surface. When the outermost internal electrode and the conductive resin layer not electrically connected to the outermost internal electrode are viewed in a direction orthogonal to the first side surface, the outermost internal electrode may overlap with the conductive resin layer not electrically connected to the outermost internal electrode.

[0015] When viewed in a direction orthogonal to the first side surface, in a structure where the outermost inner electrode and the conductive resin layer that is not electrically connected to the outermost inner electrode overlap, there is a tendency for electrons to be supplied from the outermost inner electrode to the conductive resin layer located on the first side surface as leakage current. However, as described above, in the second region, it is difficult to supply electrons to the metal ions. Therefore, even in this structure, the generation of migration is reliably suppressed.

[0016] The conductive resin layer may continuously cover a portion of the first side surface, a portion of the second side surface, a portion of the third side surface, and a portion of a corresponding end surface of the pair of end surfaces.

[0017] Compared with a structure in which a conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the third side surface, and a part of the corresponding end surface, a structure in which a conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the third side surface, and a part of the corresponding end surface can reduce the amount of conductive resin paste used to form the conductive resin layer. The reduction in the amount of conductive resin paste used can reduce the length of the conductive resin layer in the direction in which a pair of end surfaces face each other, and can increase the distance between multiple external electrodes on the first, second, and third sides. The increase in the distance between multiple external electrodes reduces the electric field generated between the multiple external electrodes. Therefore, it is difficult for the generated metal ions to move from the conductive resin layer. As a result, the structure in which the conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the third side surface, and a part of the corresponding end surface can further suppress the generation of migration.

[0018] In the above embodiment, the element body may include a fourth side surface facing the second side surface. The conductive resin layer may be located on the fourth side surface. The electrical insulating film may include a film portion located on a region between the conductive resin layers on the fourth side surface.

[0019] In the structure where the film portion included in the electrical insulating film is also located on the region between the conductive resin layers on the fourth side, even if the metal particles included in the conductive resin layer located on the fourth side are ionized, the film portion hinders the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult to supply electrons to the metal ions. It is also difficult for the metal to precipitate on the fourth side.

[0020] As a result, even in this structure where the external electrode includes the conductive resin layer also located on the fourth side surface, the occurrence of migration is suppressed.

[0021] In one of the above aspects, the element body may also include a third side surface opposite to the first side surface and a fourth side surface opposite to the second side surface, and include a third region, the third region including the third side surface and having a dielectric constant smaller than that of the first region. The conductive resin layer may also be located on the fourth side surface. The electrical insulating film may also include a film portion located on a region between the conductive resin layers on the fourth side surface.

[0022] In the structure in which the electrically insulating film includes the film portion located in the region between the conductive resin layers located on the fourth side, even when the metal particles contained in the conductive resin layer located on the fourth side are ionized, the film portion hinders the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the fourth side. Therefore, the structure in which the electrically insulating film includes the film portion located in the region between the conductive resin layers located on the fourth side suppresses the occurrence of migration even in the structure in which the external electrode includes the conductive resin layer located on the fourth side.

[0023] In the above aspect, the plurality of internal electrodes may be opposed to each other in a direction in which the second side surface and the fourth side surface are opposed to each other.

[0024] In the structure in which a plurality of internal electrodes are mutually opposed in the above-mentioned direction, there is a tendency for electrons to be supplied from the internal electrodes to the conductive resin layer located on the second side surface and the fourth side surface as leakage current. However, as described above, the film portion blocks the reaction between the generated metal ions and the electrons. Therefore, even in this structure, the generation of migration is reliably suppressed.

[0025] In one embodiment, the plurality of internal electrodes may include a first outermost internal electrode adjacent to the second side surface and a second outermost internal electrode adjacent to the fourth side surface. When the first outermost internal electrode and the conductive resin layer not electrically connected to the first outermost internal electrode are observed in a direction perpendicular to the second side surface, the first outermost internal electrode may overlap with the conductive resin layer not electrically connected to the first outermost internal electrode. When the second outermost internal electrode and the conductive resin layer not electrically connected to the second outermost internal electrode are observed in a direction perpendicular to the fourth side surface, the second outermost internal electrode may overlap with the conductive resin layer not electrically connected to the second outermost internal electrode.

[0026] When viewed in a direction orthogonal to the second side surface, in a structure where the first outermost inner electrode and the conductive resin layer that is not electrically connected to the first outermost inner electrode overlap, there is a tendency for electrons to be supplied from the first outermost inner electrode to the conductive resin layer located on the second side surface as leakage current. However, as described above, the film portion blocks the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult for the metal to precipitate on the second side surface.

[0027] When viewed in a direction perpendicular to the fourth side surface, in a structure where the second outermost inner electrode and the conductive resin layer that is not electrically connected to the second outermost inner electrode overlap, there is a tendency for electrons to be supplied from the second outermost inner electrode to the conductive resin layer located on the fourth side surface as leakage current. However, as described above, the film portion blocks the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult for the metal to precipitate on the fourth side surface.

[0028] Therefore, even in these structures, the occurrence of migration is reliably suppressed.

[0029] In the above embodiment, the conductive resin layer may continuously cover a portion of the first side surface, a portion of the second side surface, a portion of the fourth side surface, and a portion of a corresponding end surface of the pair of end surfaces.

[0030] Compared with a structure in which a conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the fourth side surface, and a part of the corresponding end surface as a whole, a structure in which a conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the fourth side surface, and a part of the corresponding end surface can reduce the amount of conductive resin paste used to form the conductive resin layer. The reduction in the amount of conductive resin paste used can reduce the length of the conductive resin layer in the direction in which a pair of end surfaces face each other, and can increase the distance between multiple external electrodes on the first, second, and fourth sides. The increase in the distance between multiple external electrodes reduces the electric field generated between the multiple external electrodes. Therefore, it is difficult for the generated metal ions to move from the conductive resin layer. As a result, the structure in which the conductive resin layer continuously covers a part of the first side surface, a part of the second side surface, a part of the fourth side surface, and a part of the corresponding end surface can further suppress the generation of migration.

[0031] In the above aspect, the plurality of internal electrodes may be respectively located in the first region so as to be separated from one end of the first region that faces the first side surface.

[0032] In the structure in which the plurality of internal electrodes are located in the first region at a distance from the end of the first region facing the first side surface, the plurality of internal electrodes are reliably located in the first region. Therefore, this structure suppresses a decrease in electrostatic capacitance.

[0033] In the above aspect, the plurality of internal electrodes may be respectively located in the first region so as to be separated from one end of the first region facing the third side surface.

[0034] In the structure in which the plurality of internal electrodes are located in the first region away from the end of the first region facing the third side surface, the plurality of internal electrodes are reliably located in the first region. Therefore, this structure suppresses a decrease in electrostatic capacitance.

[0035] In the above-mentioned embodiment, the conductive resin layer may include a plurality of silver particles.

[0036] Another embodiment of the present disclosure provides an electronic component, which includes a rectangular body, a plurality of external electrodes, a plurality of internal electrodes, and an electrically insulating film disposed on the body. The body includes a pair of end faces facing each other and a first side face and a second side face adjacent to the pair of end faces and adjacent to each other. The plurality of external electrodes are respectively disposed on both ends of the body in the direction facing the pair of end faces, and respectively include a conductive resin layer located on the first side face and the second side face. The plurality of internal electrodes are disposed in the body and are electrically connected to corresponding external electrodes among the plurality of external electrodes. The first side face has a surface resistivity greater than that of the second side face. The electrically insulating film includes a film portion located on an area between the conductive resin layers in the second side face.

[0037] In the above another embodiment, the first side has a surface resistivity greater than that of the second side. Therefore, the above another embodiment suppresses the generation of leakage current on the first side. Even if the metal particles contained in the conductive resin layer located on the first side are ionized, it is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the first side.

[0038] In the above-mentioned another mode, the film portion contained in the electrical insulating film is located on the region between the conductive resin layers on the second side. Therefore, even if the metal particles contained in the conductive resin layer located on the second side are ionized, the film portion hinders the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the second side.

[0039] As a result, the above-mentioned other aspect suppresses the occurrence of migration even in a structure in which the external electrode includes a conductive resin layer located on the first side surface and the second side surface.

[0040] The present disclosure will be more fully understood from the detailed description set forth below and the accompanying drawings, which are presented by way of illustration only and, therefore, should not be construed as limiting the present disclosure.

[0041] According to the detailed description shown below, the further applicable scope of the present disclosure will become apparent. However, it should be understood that while indicating the embodiments of the present disclosure, the detailed description and specific examples are shown only by way of illustration, and from this detailed description, those skilled in the art will be aware of various changes and modifications of the claims of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a perspective view showing the electronic component according to the first embodiment.

[0043] Figure 2 It is a diagram showing a cross-sectional structure of the electronic component according to the first embodiment.

[0044] Figure 3 It is a diagram showing a cross-sectional structure of the electronic component according to the first embodiment.

[0045] Figure 4 It is a diagram showing a cross-sectional structure of the electronic component according to the first embodiment.

[0046] Figure 5 It is a diagram showing a cross-sectional structure of the electronic component according to the first embodiment.

[0047] Figure 6 It is a diagram showing a cross-sectional structure of the electronic component according to the first embodiment.

[0048] Figure 7 It is a diagram showing a cross-sectional structure of an electronic component according to a modified example of the first embodiment.

[0049] Figure 8 It is a diagram showing a cross-sectional structure of an electronic component according to a modified example of the first embodiment.

[0050] Fig. 9 It is a diagram showing a cross-sectional structure of an electronic component according to a modified example of the first embodiment.

[0051] Fig.10 It is a perspective view showing an electronic component according to a second embodiment.

[0052] Fig.11 It is a diagram showing a cross-sectional structure of an electronic component according to a second embodiment.

[0053] Fig.12 It is a diagram showing a cross-sectional structure of an electronic component according to a second embodiment.

[0054] Fig.13 It is a diagram showing a cross-sectional structure of an electronic component according to a second embodiment.

[0055] Fig.14 It is a diagram showing a cross-sectional structure of an electronic component according to a second embodiment.

[0056] Fig.15 It is a perspective view showing an electronic component according to a third embodiment.

[0057] Fig.16 It is a diagram showing a cross-sectional structure of an electronic component according to a third embodiment.

[0058] Fig.17 It is a diagram showing a cross-sectional structure of an electronic component according to a third embodiment.

[0059] Fig.18It is a diagram showing a cross-sectional structure of an electronic component according to a third embodiment.

[0060] Fig.19 It is a diagram showing a cross-sectional structure of an electronic component according to a third embodiment.

[0061] Fig. 20 It is a perspective view showing an electronic component according to a fourth embodiment.

[0062] Fig.21 It is a diagram showing a cross-sectional structure of an electronic component according to a fourth embodiment.

[0063] Fig. 22 It is a diagram showing a cross-sectional structure of an electronic component according to a fourth embodiment.

[0064] Fig.23 It is a diagram showing a cross-sectional structure of an electronic component according to a fourth embodiment.

[0065] Fig.24 It is a diagram showing an electronic component device according to a fifth embodiment. DETAILED DESCRIPTION

[0066] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following description, the same elements or elements having the same functions are denoted by the same reference numerals, and repeated descriptions are omitted.

[0067] First embodiment

[0068] Reference Figure 1 to Figure 6 The structure of the multilayer capacitor C1 according to the first embodiment will be described. Figure 1 It is a perspective view showing the electronic component according to the first embodiment. Figure 2 to Figure 6 It is a figure which shows the cross-sectional structure of the electronic component of Embodiment 1. In Embodiment 1, the electronic component is, for example, a multilayer capacitor C1.

[0069] like Figure 1 As shown, the multilayer capacitor C1 includes an element body 3, a plurality of external electrodes 5, a plurality of internal electrodes 7 and 9, and an electrical insulating film EI. The element body 3 is in a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, or a rectangular parallelepiped shape with rounded corners and edges.

[0070] The element body 3 includes a pair of mutually opposing side surfaces 3a and 3b, a pair of mutually opposing side surfaces 3c and 3d, and a pair of mutually opposing end surfaces 3e. The side surfaces 3a and 3b, the side surfaces 3c and 3d, and the end surface 3e are respectively rectangular. The rectangular shape includes, for example, a shape in which each corner is chamfered or a shape in which each corner is rounded. The direction in which the pair of side surfaces 3a and 3b are opposite includes a first direction D1. The direction in which the pair of side surfaces 3c and 3d are opposite includes a third direction D3. The direction in which the pair of end surfaces 3e are opposite includes a second direction D2. In the first embodiment, for example, when the side surface 3c includes the first side surface, the side surface 3a includes the second side surface, and the side surface 3d includes the third side surface. For example, when the side surface 3a includes the second side surface, the side surface 3b includes the fourth side surface.

[0071] The side surfaces 3a and 3b are opposed to each other in the first direction D1. The first direction D1 includes a direction orthogonal to the side surfaces 3a and 3b, and is orthogonal to the third direction D3. A pair of side surfaces 3c and 3d are opposed to each other in the third direction D3. The third direction D3 includes a direction orthogonal to the side surfaces 3c and 3d. A pair of end surfaces 3e are opposed to each other in the second direction D2. The second direction D2 includes a direction parallel to the side surfaces 3a and 3b and the side surfaces 3c and 3d, and is orthogonal to the first direction D1 and the third direction D3. The second direction D2 includes a direction orthogonal to the end surfaces 3e.

[0072] The pair of side surfaces 3c and 3d extend in the first direction D1 so as to connect the pair of side surfaces 3a and 3b. The pair of side surfaces 3c and 3d also extend in the second direction D2. The pair of end surfaces 3e extend in the first direction D1 so as to connect the pair of side surfaces 3a and 3b. The pair of end surfaces 3e also extend in the third direction D3.

[0073] The side surface 3a and the side surface 3c are adjacent to a pair of end surfaces 3e and are adjacent to each other. The side surface 3a and the side surface 3c may be directly adjacent to each other or may be indirectly adjacent to each other via an edge portion. The side surface 3a and the side surface 3d are adjacent to a pair of end surfaces 3e and are adjacent to each other. The side surface 3a and the side surface 3d may be directly adjacent to each other or may be indirectly adjacent to each other via an edge portion.

[0074] The multilayer capacitor C1 is soldered and mounted on an electronic device. The electronic device includes, for example, a circuit board or an electronic component. In the multilayer capacitor C1, for example, the side surface 3a faces the electronic device. In this case, the side surface 3a is configured to constitute a mounting surface. The side surface 3a is a mounting surface.

[0075] For example, the length of the element body 3 in the second direction D2 is greater than the length of the element body 3 in the first direction D1, and less than the length of the element body 3 in the third direction D3. For example, the second direction D2 includes the long side direction of the element body 3. The length of the element body 3 in the first direction D1 and the length of the element body 3 in the third direction D3 may also be equal to each other. The length of the element body 3 in the first direction D1 and the length of the element body 3 in the third direction D3 may also be different from each other.

[0076] The length of the element body 3 in the first direction D1 is, for example, 0.1 to 3.2 mm. The length of the element body 3 in the second direction D2 is, for example, 0.2 to 7.5 mm. The length of the element body 3 in the third direction D3 is, for example, 0.1 to 6.3 mm. In the element body 3, for example, the second direction D2 is the long side direction. The length of the element body 3 in the first direction D1 is the height of the element body 3. The length of the element body 3 in the second direction D2 is the length of the element body 3. The length of the element body 3 in the third direction D3 is the width of the element body 3. For example, the height of the element body 3 is 2.5 mm, the width of the element body 3 is 2.5 mm, and the length of the element body 3 is 3.2 mm.

[0077] The element body 3 includes four ridges 3g, four ridges 3i, and four ridges 3j. The ridges 3g are located between each end face 3e and each side face 3a, 3b. The ridges 3i are located between the end face 3e and each side face 3c, 3d. The ridges 3j are located between each side face 3a, 3b and each side face 3c, 3d. For example, each ridge 3g, 3i, 3j is rounded in a curved manner. The element body 3 is subjected to so-called R chamfering processing. Each end face 3e is indirectly adjacent to each side face 3a, 3b via the ridges 3g. Each end face 3e is indirectly adjacent to each side face 3c, 3d via the ridges 3i. Each side face 3a, 3b is indirectly adjacent to each side face 3c, 3d via the ridges 3j.

[0078] like Figure 2 to Figure 6 As shown, the element body 3 includes region R1, region R2 and region R3. Region R1 does not include side 3c and side 3d. Region R2 includes side 3c. Region R2 includes, for example, the entire side 3c. Region R3 includes side 3d. Region R3 includes, for example, the entire side 3d. Region R1 is located between region R2 and region R3 in the third direction D3. Region R1 is located at a position separated from side 3c and side 3d.

[0079] The height of region R2 is equal to the height of region R3. The height of region R2 is the length of region R2 in the first direction D1. The height of region R3 is the length of region R3 in the first direction D1. The width of region R2 is equal to the width of region R3. The width of region R2 is the length of region R2 in the second direction D2. The width of region R3 is the length of region R3 in the second direction D2. The thickness of region R2 is equal to the thickness of region R3. The thickness of region R2 is the length of region R2 in the third direction D3. The thickness of region R3 is the length of region R3 in the third direction D3. The thickness of region R2 may not be equal to the thickness of region R3. The thickness of region R2 may also be different from the thickness of region R3. For example, in the case where region R1 includes the first region, region R2 may also include the second region, and region R3 may also include the third region.

[0080] The element body 3 includes a dielectric material. The region R1 includes a first dielectric material. The first dielectric material includes, for example, BaTiO 3 System, Ba(Ti, Zr)O 3 System or (Ba, Ca)TiO 3 The regions R2 and R3 contain a second dielectric material different from the first dielectric material. The second dielectric material contains, for example, CaZrO 3 system, SrTiO 3 System or (Ca, Sr)(Zr, Ti)O 3 The second dielectric material has, for example, a dielectric constant smaller than that of the first dielectric material.

[0081] The element body 3 is formed by stacking a plurality of dielectric layers in a first direction D1. The element body 3 includes a plurality of stacked dielectric layers. In the element body 3, the stacking direction of the plurality of dielectric layers is consistent with the first direction D1. Each dielectric layer is formed, for example, by a sintered body of a ceramic green sheet containing a dielectric material. In an actual element body 3, each dielectric layer is integrated to such an extent that the boundaries between the dielectric layers cannot be identified.

[0082] The process of obtaining the element body 3 includes, for example, the steps of preparing a ceramic green sheet containing a first dielectric material and a ceramic green sheet containing a second dielectric material, and the step of combining these ceramic green sheets to obtain a sheet laminate. Therefore, one dielectric layer includes, for example, a portion containing the first dielectric material and a portion containing the second dielectric material.

[0083] like Figure 1 to Figure 6As shown, the electrical insulating film EI is arranged on the element body 3. The electrical insulating film EI is directly arranged on the element body 3. The electrical insulating film EI includes a film portion EIa. In the first embodiment, the electrical insulating film EI includes only the film portion EIa. The film portion EIa is arranged on the side surface 3a. The film portion EIa covers the side surface 3a and is directly connected to the side surface 3a. The film portion EIa is only located on the side surface 3a.

[0084] The electrical insulating film EI has, for example, a resistivity higher than that of the element body 3. The resistivity of the element body 3 includes the volume resistivity of the element body 3 or the surface resistivity of the element body 3. The electrical insulating film EI may have a resistivity higher than the volume resistivity of the element body 3 and higher than the surface resistivity of the element body 3.

[0085] The electrical insulating film EI includes, for example, an electrical insulating film. The electrical insulating film includes, for example, a sputtered film or a silicon oxide film. The silicon oxide film includes, for example, a silicon dioxide film. The electrical insulating film EI may also include an aluminum oxide film. The average thickness of the film portion EIa is, for example, not less than 0.02 μm. The average thickness may also be not less than 0.05 μm.

[0086] A plurality of external electrodes 5 are arranged on the element body 3. In the first embodiment, the multilayer capacitor C1 includes a pair of external electrodes 5. Each external electrode 5 is arranged at both ends of the element body 3 in the second direction D2. Each external electrode 5 is arranged on a corresponding end face of a pair of end faces 3e. In the first embodiment, each external electrode 5 is arranged on five faces, namely, the side faces 3a, 3b, the side faces 3c, 3d and one end face 3e, the ridges 3g, 3i, 3j, and the electrical insulating film EI. Each external electrode 5 is indirectly arranged on the side face 3a via the electrical insulating film EI.

[0087] Each external electrode 5 includes a plurality of electrode portions 5a, 5b, 5c, 5d, and 5e. Electrode portion 5a is disposed on side surface 3a and edge portion 3g. Electrode portion 5b is disposed on side surface 3b and edge portion 3g. Electrode portion 5c is disposed on side surface 3c and edge portion 3i. Electrode portion 5d is disposed on side surface 3d and edge portion 3i. Electrode portion 5e is disposed on end surface 3e. External electrode 5 further includes an electrode portion disposed on edge portion 3j. Electrode portions 5a, 5b, 5c, 5d, and 5e adjacent to each other are connected and electrically connected.

[0088] Each external electrode 5 includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The third electrode layer E3 constitutes the outermost layer of the external electrode 5. Each electrode portion 5a, 5c, 5d, 5e includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The electrode portion 5b includes a first electrode layer E1 and a third electrode layer E3. In the first embodiment, the second electrode layer E2 includes a conductive resin layer. The conductive resin layer included in the second electrode layer E2 is located on the side 3a and the side 3c. The conductive resin layer included in the second electrode layer E2 is located on the side 3a and the side 3d.

[0089] The first electrode layer E1 of the electrode portion 5a is arranged on the electrical insulating film EI and on the ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is formed on the electrical insulating film EI in a manner covering a portion of the electrical insulating film EI, and is formed on the element body 3 in a manner covering the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is in contact with the above-mentioned portion of the electrical insulating film EI and the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is formed on the element body 3 in a manner covering a portion of the ridge portion 3j. The first electrode layer E1 of the electrode portion 5a is in contact with the above-mentioned portion of the ridge portion 3j. In the electrode portion 5a, the first electrode layer E1 is directly in contact with the electrical insulating film EI (film portion EIa), and is directly in contact with the element body 3. The electrical insulating film EI is covered by the first electrode layer E1 in the above-mentioned portion, and is exposed from the first electrode layer E1 in the remaining portion except the above-mentioned portion. The above-mentioned portion of the electrical insulating film EI includes a partial area of ​​the electrical insulating film EI close to the end surface 3e. The first electrode layer E1 of the electrode portion 5a is located on the electrical insulating film EI. The side surface 3a includes a portion indirectly covered by the first electrode layer E1 and a portion exposed from the first electrode layer E1. The first electrode layer E1 may not be formed on the electrical insulating film EI. The first electrode layer E1 may not be arranged on the electrical insulating film EI.

[0090] The second electrode layer E2 of the electrode portion 5a is arranged on the first electrode layer E1 and on the electrically insulating film EI. The second electrode layer E2 of the electrode portion 5a is formed on the first electrode layer E1 in a manner covering the first electrode layer E1 of the electrode portion 5a, and is formed on the electrically insulating film EI in a manner covering a portion of the electrically insulating film EI. The second electrode layer E2 of the electrode portion 5a is in contact with the above-mentioned portion of the electrically insulating film EI and the entirety of the first electrode layer E1. The electrically insulating film EI includes a membrane portion EIa on an area between the second electrode layer E2 in the side 3a. In the electrode portion 5a, the second electrode layer E2 is directly in contact with the first electrode layer E1 and the electrically insulating film EI (membrane portion EIa). In the electrode portion 5a, the second electrode layer E2 indirectly covers the side 3a in a manner that the first electrode layer E1 and the electrically insulating film EI are located between the second electrode layer E2 and the side 3a. The second electrode layer E2 of the electrode portion 5a is located on the side 3a. The portion included in the second electrode layer E2 and located on the side surface 3a constitutes a layer portion located on the side surface 3a. The second electrode layer E2 includes a layer portion located on the side surface 3a. The second electrode layer E2 of the electrode portion 5a includes an edge E2a located on the electrical insulating film EI. e .

[0091] The third electrode layer E3 of the electrode portion 5a is arranged on the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is in contact with the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion 5a, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5a is located on the electrical insulating film EI.

[0092] The first electrode layer E1 of the electrode portion 5b is arranged on the side surface 3b and the edge portion 3g. The first electrode layer E1 of the electrode portion 5b is formed in a manner covering a portion of the side surface 3b and the entire edge portion 3g. The first electrode layer E1 of the electrode portion 5b is in contact with the above-mentioned portion of the side surface 3b and the entire edge portion 3g. In the electrode portion 5b, the first electrode layer E1 is directly in contact with the element body 3. The side surface 3b is covered by the first electrode layer E1 in the above-mentioned portion, and is exposed from the first electrode layer E1 in the remaining portion except the above-mentioned portion. The above-mentioned portion of the side surface 3b includes a portion of the area of ​​the side surface 3b close to the end surface 3e. The first electrode layer E1 of the electrode portion 5b is located on the side surface 3b. The first electrode layer E1 may not be formed on the side surface 3b. The first electrode layer E1 may not be arranged on the side surface 3b.

[0093] The third electrode layer E3 of the electrode portion 5b is arranged on the first electrode layer E1. In the electrode portion 5b, the third electrode layer E3 covers the first electrode layer E1. In the electrode portion 5b, the third electrode layer E3 is in contact with the first electrode layer E1. In the electrode portion 5b, the third electrode layer E3 is directly in contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5b is located on the side surface 3b. The electrode portion 5b does not include the second electrode layer E2. The side surface 3b is not covered by the second electrode layer E2.

[0094] The first electrode layer E1 of the electrode portion 5c is arranged on the side surface 3c and the edge portion 3i. The first electrode layer E1 of the electrode portion 5c is formed in a manner covering a portion of the side surface 3c and the entire edge portion 3i. The first electrode layer E1 of the electrode portion 5c is in contact with the above-mentioned portion of the side surface 3c and the entire edge portion 3i. In the electrode portion 5c, the first electrode layer E1 is directly in contact with the element body 3. The side surface 3c is covered by the first electrode layer E1 in the above-mentioned portion, and is exposed from the first electrode layer E1 in the remaining portion except the above-mentioned portion. The above-mentioned portion of the side surface 3c includes a portion of the side surface 3c close to the end surface 3e. The first electrode layer E1 of the electrode portion 5c is located on the side surface 3c. The first electrode layer E1 may not be formed on the side surface 3c. The first electrode layer E1 may not be arranged on the side surface 3c.

[0095] The second electrode layer E2 of the electrode portion 5c is arranged on the first electrode layer E1 and on the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is formed in a manner covering a portion of the first electrode layer E1 and a portion of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is directly in contact with the above-mentioned portion of the first electrode layer E1 and the above-mentioned portion of the side surface 3c. The second electrode layer E2 of the electrode portion 5c is formed in a manner covering the above-mentioned portion of the first electrode layer E1 of the electrode portion 5c. The above-mentioned portion of the side surface 3c includes, for example, a corner region of the side surface 3a and the end surface 3e in the side surface 3c. In the electrode portion 5c, the second electrode layer E2 indirectly covers the above-mentioned portion of the side surface 3c in a manner in which the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The first electrode layer E1 of the electrode portion 5c is covered by the second electrode layer E2 in the above-mentioned portion, and is exposed from the second electrode layer E2 in the remaining portion except the above-mentioned portion. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c. The portion included in the second electrode layer E2 and located on the side surface 3c constitutes a layer portion located on the side surface 3c. The second electrode layer E2 includes a layer portion located on the side surface 3c. The second electrode layer E2 of the electrode portion 5c includes an edge E2c located on the side surface 3c. e .

[0096] The third electrode layer E3 of the electrode portion 5c is arranged on the first electrode layer E1 and the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 covers the entirety of the second electrode layer E2 and the entirety of the portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in contact with the entirety of the second electrode layer E2 and is in contact with the entirety of the portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is directly in contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode portion 5c is located on the side surface 3c.

[0097] The electrode portion 5c includes a plurality of regions 5c 1 , 5c 2 In the first embodiment, the electrode portion 5c includes only two regions 5c 1 , 5c 2 . Area 5c 2 Located in area 5c 1 Area 5c 1 It includes the first electrode layer E1 and the third electrode layer E3. Region 5c 1 The second electrode layer E2 is not included. Region 5c 2 It includes a first electrode layer E1, a second electrode layer E2 and a third electrode layer E3. Region 5c 1 This includes the region where the first electrode layer E1 is exposed from the second electrode layer E2. Region 5c 2 It includes the area where the first electrode layer E1 is covered by the second electrode layer E2.

[0098] The first electrode layer E1 of the electrode portion 5d is arranged on the side surface 3d and the edge portion 3i. The first electrode layer E1 of the electrode portion 5d is formed in a manner covering a portion of the side surface 3d and the entire edge portion 3i. The first electrode layer E1 of the electrode portion 5d is in contact with the above-mentioned portion of the side surface 3d and the entire edge portion 3i. In the electrode portion 5d, the first electrode layer E1 is directly in contact with the element body 3. The side surface 3d is covered by the first electrode layer E1 in the above-mentioned portion, and is exposed from the first electrode layer E1 in the remaining portion except the above-mentioned portion. The above-mentioned portion of the side surface 3d includes a portion of the area of ​​the side surface 3d close to the end surface 3e. The first electrode layer E1 of the electrode portion 5d is located on the side surface 3d. The first electrode layer E1 may not be formed on the side surface 3d. The first electrode layer E1 may not be arranged on the side surface 3d.

[0099] The second electrode layer E2 of the electrode portion 5d is arranged on the first electrode layer E1 and on the side surface 3d. In the electrode portion 5d, the second electrode layer E2 is formed in a manner covering a portion of the first electrode layer E1 and a portion of the side surface 3d. In the electrode portion 5d, the second electrode layer E2 is directly in contact with the above-mentioned portion of the first electrode layer E1 and the above-mentioned portion of the side surface 3d. The second electrode layer E2 of the electrode portion 5d is formed in a manner covering the above-mentioned portion of the first electrode layer E1 of the electrode portion 5d. The above-mentioned portion of the side surface 3d includes, for example, a corner region of the side surface 3d close to the side surface 3a and the end surface 3e. In the electrode portion 5d, the second electrode layer E2 indirectly covers the above-mentioned portion of the side surface 3d in a manner in which the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3d. The first electrode layer E1 of the electrode portion 5d is covered by the second electrode layer E2 in the above-mentioned portion, and is exposed from the second electrode layer E2 in the remaining portion except the above-mentioned portion. The second electrode layer E2 of the electrode portion 5d is located on the side surface 3d. The portion included in the second electrode layer E2 and located on the side surface 3d constitutes a layer portion located on the side surface 3d. The second electrode layer E2 includes a layer portion located on the side surface 3d. The second electrode layer E2 of the electrode portion 5d includes an edge E2d located on the side surface 3d. e .

[0100] The third electrode layer E3 of the electrode portion 5d is arranged on the first electrode layer E1 and the second electrode layer E2. In the electrode portion 5d, the third electrode layer E3 covers the entire second electrode layer E2 and covers the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5d, the third electrode layer E3 is in contact with the entire second electrode layer E2 and is in contact with the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5d, the third electrode layer E3 is directly in contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode portion 5d is located on the side surface 3d.

[0101] The electrode portion 5d includes a plurality of regions 5d 1 , 5d 2 In the first embodiment, the electrode portion 5d includes only two regions 5d 1 , 5d 2 . Area 5d 2 Located in area 5d 1 Area 5d 1 The region 5d includes the first electrode layer E1 and the third electrode layer E3. 1 The second electrode layer E2 is not included. Region 5d 2 The region 5d includes a first electrode layer E1, a second electrode layer E2 and a third electrode layer E3. 1 This includes the region where the first electrode layer E1 is exposed from the second electrode layer E2. Region 5d 2It includes the area where the first electrode layer E1 is covered by the second electrode layer E2.

[0102] The first electrode layer E1 of the electrode portion 5e is disposed on the end surface 3e. The first electrode layer E1 of the electrode portion 5e is formed to cover the entire end surface 3e. The first electrode layer E1 of the electrode portion 5e is in contact with the entire end surface 3e. In the electrode portion 5e, the first electrode layer E1 is in direct contact with the end surface 3e.

[0103] The second electrode layer E2 of the electrode portion 5e is arranged on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is formed in a manner covering a portion of the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is directly in contact with the above-mentioned portion of the first electrode layer E1. The second electrode layer E2 of the electrode portion 5e is formed in a manner covering the above-mentioned portion of the first electrode layer E1 of the electrode portion 5e. In the electrode portion 5e, the second electrode layer E2 indirectly covers a portion of the end face 3e in a manner such that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. A portion of the end face 3e includes, for example, a portion of the end face 3e close to the side surface 3a. The first electrode layer E1 of the electrode portion 5e is covered by the second electrode layer E2 in the above-mentioned portion, and is exposed from the second electrode layer E2 in the remaining portion except for the above-mentioned portion. The portion included in the second electrode layer E2 and located on the end face 3e constitutes a layer portion located on the end face 3e. The second electrode layer E2 includes a layer portion located on the end face 3e.

[0104] The third electrode layer E3 of the electrode portion 5e is arranged on the first electrode layer E1 and the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 covers the entire second electrode layer E2 and covers the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2 and is in contact with the entire portion of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode portion 5e, the third electrode layer E3 is directly in contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode portion 5e is located on the end surface 3e.

[0105] The electrode portion 5e may not include the second electrode layer E2. In a structure in which the electrode portion 5e does not include the second electrode layer E2, the third electrode layer E3 included in the electrode portion 5e covers the entire first electrode layer E1 and is directly in contact with the first electrode layer E1.

[0106] The electrode portion 5e includes a plurality of regions 5e 1 、5e 2 In the first embodiment, the electrode portion 5e includes only two regions 5e 1 、5e 2 . Area 5e 2 Located in area 5e1 Area 5e 1 The region 5e includes a first electrode layer E1 and a third electrode layer E3. 1 The second electrode layer E2 is not included. Region 5e 2 The electrode portion 5e includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. In the electrode portion 5e, the third electrode layer E3 is formed to cover the entire end surface 3e when viewed from the first direction D1. In the first embodiment, the third electrode layer E3 indirectly covers the entire end surface 3e. Region 5e 1 The region 5e includes the region where the first electrode layer E1 is exposed from the second electrode layer E2. 2 It includes the area where the first electrode layer E1 is covered by the second electrode layer E2.

[0107] The electrically insulating film EI includes a portion covered by the external electrode 5 and a portion exposed from the external electrode 5. The film portion EIa includes a portion covered by the electrode portion 5a and a portion exposed from the electrode portion 5a. The portion included in the electrically insulating film EI (film portion EIa) and exposed from the external electrode 5 (electrode portion 5a) is located on the area between the pair of external electrodes 5 (a pair of electrode portions 5a) in the side 3a. The electrically insulating film EI includes a film portion located at least on the area between the pair of external electrodes 5 in the side 3a. The electrically insulating film EI includes a film portion located at least on the area exposed from the pair of external electrodes 5 in the side 3a.

[0108] The first electrode layer E1 is formed by sintering the conductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed in a manner that covers the above-mentioned part of each side surface 3a, 3b, the above-mentioned part of each side surface 3c, 3d, one end surface 3e and the edges 3g, 3i, 3j. The first electrode layer E1 is formed by sintering the metal component (metal particles) contained in the conductive paste. The first electrode layer E1 includes a sintered metal layer. The first electrode layer E1 includes a sintered metal layer formed on the element body 3. In the first embodiment, the first electrode layer E1 includes a sintered metal layer containing Cu. The first electrode layer E1 may also include a sintered metal layer containing Ni. The first electrode layer E1 includes a base metal. The conductive paste, for example, includes particles containing Cu or Ni, a glass component, an organic binder and an organic solvent. The first electrode layer E1 included in each electrode portion 5a, 5b, 5c, 5d, 5e is formed integrally.

[0109] The second electrode layer E2 is formed by curing the conductive resin paste applied to the first electrode layer E1. The second electrode layer E2 is formed over the first electrode layer E1 and the element body 3. The first electrode layer E1 includes a base metal layer for forming the second electrode layer E2. The second electrode layer E2 includes a conductive resin layer covering the first electrode layer E1. The conductive resin paste includes, for example, a resin, a conductive material, and an organic solvent. The resin includes, for example, a thermosetting resin. The conductive material includes, for example, metal particles. The metal particles include, for example, silver particles or copper particles. In the first embodiment, the second electrode layer E2 includes a plurality of Ag particles. The thermosetting resin includes, for example, a phenolic resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a portion of the edge portion 3j. The second electrode layer E2 included in each electrode portion 5a, 5c, 5d, 5e is formed integrally.

[0110] The third electrode layer E3 is formed on the second electrode layer E2 and the first electrode layer E1 (the portion exposed from the second electrode layer E2) by a plating method. The third electrode layer E3 may also have a multilayer structure. In this case, the third electrode layer E3 includes, for example, a Ni-plated layer and a solder-plated layer. The Ni-plated layer is formed on the second electrode layer E2 and the first electrode layer E1. The solder-plated layer is formed on the Ni-plated layer. The solder-plated layer covers the Ni-plated layer. The solder-plated layer has better resistance to solder corrosion than the metal contained in the second electrode layer E2. The third electrode layer E3 may also include a Sn-plated layer, a Cu-plated layer, or an Au-plated layer instead of the Ni-plated layer. The solder-plated layer includes, for example, a Sn-plated layer, a Sn-Ag alloy-plated layer, a Sn-Bi alloy-plated layer, or a Sn-Cu alloy-plated layer. The third electrode layer E3 included in each electrode portion 5a, 5b, 5c, 5d, 5e is formed integrally.

[0111] The second electrode layer E2 continuously covers a portion of the side surface 3c, a portion of the side surface 3a, a portion of the side surface 3d, and a portion of the corresponding end surface in a pair of end surfaces 3e. For example, the second electrode layer E2 continuously covers only a portion of each of the side surfaces 3c and 3d, only a portion of the side surface 3a, and only a portion of the end surface 3e. The second electrode layer E2 includes a portion that is configured to continuously cover only a portion of each of the side surfaces 3c and 3d, only a portion of the side surface 3a, and only a portion of the end surface 3e. The above-mentioned portion of the end surface 3e includes a portion of the end surface 3e close to the side surface 3a. The above-mentioned portions of the side surfaces 3c and 3d include a portion of the side surfaces 3c and 3d close to the side surface 3a. The second electrode layer E2 covers the entirety of an edge portion 3g, only a portion of the edge portion 3i, and only a portion of the edge portion 3j. A portion of the portion of the first electrode layer E1 that covers the edge portion 3i is exposed from the second electrode layer E2. For example, each region 5c 1 , 5d 1 、5e 1 The included first electrode layer E1 is exposed from the second electrode layer E2.

[0112] In the structure where the electrode portion 5e does not include the second electrode layer E2, the second electrode layer E2 continuously covers only a portion of each of the side surfaces 3c and 3d and only a portion of the side surface 3a. The second electrode layer E2 includes a portion that continuously covers only a portion of each of the side surfaces 3a and only a portion of each of the side surfaces 3c and 3d.

[0113] The film portion EIa is disposed at least in the area between the pair of external electrodes 5 on the side surface 3a. The side surfaces 3c, 3d, the pair of end surfaces 3e and the ridges 3g, 3i, 3j are exposed from the electrical insulating film EI. The electrical insulating film EI includes the film portion EIa located in the area between the second electrode layers E2 on the side surface 3a.

[0114] The multilayer capacitor C1 includes a plurality of internal electrodes 7 and a plurality of internal electrodes 9. Each internal electrode 7, 9 is an internal conductor disposed in the element body 3. Each internal electrode 7, 9 is electrically connected to a corresponding external electrode in a pair of external electrodes 5. Each internal electrode 7, 9 includes a conductive material generally used as an internal conductor of a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal electrodes 7, 9 are formed as a sintered body of a conductive paste including the above-mentioned conductive material. In the first embodiment, each internal electrode 7, 9 includes Ni.

[0115] The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are alternately arranged in the first direction D1. The internal electrodes 7 and the internal electrodes 9 are arranged in the element body 3 in a manner of being arranged in the first direction D1. The internal electrodes 7 and the internal electrodes 9 are arranged in different positions (layers) in the first direction D1. The internal electrodes 7 and the internal electrodes 9 are alternately arranged in the element body 3 in a manner of being opposed to each other with a gap in the first direction D1. The polarities of the internal electrodes 7 and the internal electrodes 9 are different from each other.

[0116] Each of the internal electrodes 7 and 9 is located in a plane substantially parallel to each of the side surfaces 3a and 3b. The internal electrode 7 and the internal electrode 9 are opposed to each other in the first direction D1. The direction in which the internal electrode 7 and the internal electrode 9 are opposed (the first direction D1) is orthogonal to the direction parallel to each of the side surfaces 3a and 3b (the second direction D2 and the third direction D3). The internal electrode 7 and the internal electrode 9 are opposed to each other in the direction (the first direction D1) orthogonal to the direction in which the pair of end surfaces 3e are opposed (the second direction D2) and the direction in which the side surfaces 3c and the side surfaces 3d are opposed (the third direction D3).

[0117] The plurality of internal electrodes 7 and 9 each include an end exposed at a corresponding end face 3e in a pair of end faces 3e. The above-mentioned one end included in the plurality of internal electrodes 7 and 9 is covered by the corresponding electrode portion 5e. In the first embodiment, the above-mentioned one end is entirely covered by the corresponding electrode portion 5e. The internal electrode 7 and the internal electrode 9 are directly connected to the corresponding electrode portion 5e. The internal electrode 7 and the internal electrode 9 are electrically connected to the corresponding external electrode 5. The plurality of internal electrodes 7 each include an end 7c near the side surface 3c and an end 7d near the side surface 3d. The plurality of internal electrodes 9 each include an end 9c near the side surface 3c and an end 9d near the side surface 3d. The ends 7c and 7d and the ends 9c and 9d are not exposed on the outer surface of the element body 3.

[0118] Each end face 3e is exposed from the electrical insulating film EI (film portion EIa), and the one end included in each of the plurality of internal electrodes 7 and 9 includes a region exposed from the electrical insulating film EI. In the first embodiment, the one end included in each of the plurality of internal electrodes 7 and 9 includes only a region exposed from the electrical insulating film EI. The entire one end included in each of the plurality of internal electrodes 7 and 9 is exposed from the electrical insulating film EI. The electrical insulating film EI (film portion EIa) is opposed to the plurality of internal electrodes 7 and 9 in the first direction D1.

[0119] like Figure 3 to Figure 6 As shown, the plurality of internal electrodes 7 and 9 are arranged in the region R1. The end 7c included in each of the plurality of internal electrodes 7 extends in the second direction D2 along the end B1 in the region R1 that is opposite to the side surface 3c. The end 9c included in each of the plurality of internal electrodes 9 extends in the second direction D2 along the end B1. The end 7d included in each of the plurality of internal electrodes 7 extends in the second direction D2 along the end B2 in the region R1 that is opposite to the side surface 3d. The end 9d included in each of the plurality of internal electrodes 9 extends in the second direction D2 along the end B2. In the first embodiment, when viewed from the first direction D1, the end 7c and the end 9c coincide with the end B1, and the end 7d and the end 9d coincide with the end B2. The plurality of internal electrodes 7 and 9 are not arranged in the region R2 and the region R3.

[0120] In the first embodiment, the region R2 is in contact with the ends 7c and 9c of the internal electrodes 7 and 9. Therefore, the region R2 includes a region between the imaginary plane including the ends 7c and 9c and the side surface 3c. The region R3 is in contact with the ends 7d and 9d of the internal electrodes 7 and 9. Therefore, the region R3 includes a region between the imaginary plane including the ends 7d and 9d and the side surface 3d. The length of the region R1 in the third direction D3 is, for example, equal to the length of the internal electrodes 7 and 9 in the third direction D3.

[0121] like Figure 2 and Figure 6As shown, the plurality of internal electrodes 9 include an outermost internal electrode 9p adjacent to the side surface 3a. When the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p are observed in a direction (third direction D3) orthogonal to the side surface 3c, the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p overlap. In the first embodiment, the plurality of internal electrodes 7 may include an outermost internal electrode 7p adjacent to the side surface 3b. When the outermost internal electrode 7p and the second electrode layer E2 not electrically connected to the outermost internal electrode 7p are observed in a direction (third direction D3) orthogonal to the side surface 3d, the outermost internal electrode 7p may overlap with the second electrode layer E2 not electrically connected to the outermost internal electrode 7p.

[0122] In the multilayer capacitor C1, the region R2 including the side surface 3c has a dielectric constant smaller than that of the region R1. Therefore, the multilayer capacitor C1 suppresses the generation of leakage current in the region R2. Even if the metal particles contained in the second electrode layer E2 located on the side surface 3c are ionized, it is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side surface 3c.

[0123] In the stacked capacitor C1, the film portion EIa included in the electrical insulating film EI is located on the area between the second electrode layers E2 on the side 3a. Therefore, even if the metal particles included in the second electrode layer E2 located on the side 3a are ionized, the film portion EIa blocks the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side 3a.

[0124] As a result, the multilayer capacitor C1 can suppress the occurrence of migration even when the external electrode 5 includes the second electrode layer E2 located on the side surface 3 c and the side surface 3 a .

[0125] In the multilayer capacitor C1, the electrical insulating film EI is disposed only on the side surface 3a. For example, the electrical insulating film EI can be easily formed on the element body 3 compared with a structure in which the electrical insulating film EI is disposed on the side surfaces 3a, 3c, and 3d.

[0126] In the multilayer capacitor C1, the element body 3 includes a side surface 3d facing the side surface 3c and includes a region R3 including the side surface 3d and having a dielectric constant smaller than that of the region R1. The second electrode layer E2 is located on the side surface 3d.

[0127] The multilayer capacitor C1 suppresses the generation of leakage current in the region R3. Even when the metal particles contained in the second electrode layer E2 located on the side 3d are ionized, it is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side 3d. Therefore, the multilayer capacitor C1 suppresses the generation of migration even if the external electrode 5 includes the second electrode layer E2 located on the side 3d.

[0128] In the multilayer capacitor C1, the plurality of internal electrodes 7 and 9 face each other in a first direction D1 orthogonal to the direction in which the pair of end faces 3e face each other and the direction in which the side faces 3c and 3d face each other.

[0129] In the multilayer capacitor C1, there is a tendency for electrons to be supplied as leakage current from the internal electrodes 7 and 9 that are opposed to each other in the first direction D1 to the second electrode layer E2 located on the side surface 3a. However, as described above, the film portion E1a blocks the reaction between the generated metal ions and the electrons. Therefore, in the multilayer capacitor C1, the generation of migration is reliably suppressed.

[0130] In the multilayer capacitor C1, the plurality of internal electrodes 9 include an outermost internal electrode 9p adjacent to the side surface 3a. When the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p are viewed in a direction orthogonal to the side surface 3c, the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p overlap.

[0131] In the multilayer capacitor C1, there is a tendency for electrons to be supplied from the outermost internal electrode 9p to the second electrode layer E2 located on the side surfaces 3c and 3d as leakage current. However, as described above, it is difficult to supply electrons to the metal ions in the region R2. Therefore, in the multilayer capacitor C1, the occurrence of migration is reliably suppressed.

[0132] Even in a structure where the distance between the outermost internal electrode 9p and the side surface 3a is small, the occurrence of migration can be reliably suppressed as described above. That is, even in a structure where the number of stacked internal electrodes 7 and 9 is increased, the occurrence of migration can be reliably suppressed.

[0133] In the multilayer capacitor C1, the second electrode layer E2 continuously covers a portion of the side surface 3c, a portion of the side surface 3a, a portion of the side surface 3d, and a portion of a corresponding end surface of the pair of end surfaces 3e.

[0134] Compared with the structure in which the second electrode layer E2 continuously covers a part of the side surface 3c, a part of the side surface 3a, a part of the side surface 3d, and the entire corresponding end surface 3e, the structure in which the second electrode layer E2 continuously covers a part of the side surface 3c, a part of the side surface 3a, a part of the side surface 3d, and a part of the corresponding end surface 3e can reduce the amount of conductive resin paste used to form the second electrode layer E2. The reduction in the amount of conductive resin paste can reduce the length of the second electrode layer E2 in the direction in which the pair of end surfaces 3e are opposite, and the distance between the pair of external electrodes 5 can be increased on the side surfaces 3c, 3a, and 3d. The increase in the distance between the pair of external electrodes 5 reduces the electric field generated between the pair of external electrodes 5. Therefore, it is difficult for the generated metal ions to move from the second electrode layer E2. As a result, the structure in which the second electrode layer E2 continuously covers a part of the side surface 3c, a part of the side surface 3a, a part of the side surface 3d, and a part of the corresponding end surface 3e can further suppress the generation of migration.

[0135] Compared with a structure in which the second electrode layer E2 continuously covers a part of the side surface 3c, a part of the side surface 3a, a part of the side surface 3d, and the entire corresponding end surface 3e, the multilayer capacitor C1 has a lower ESR (equivalent series resistance).

[0136] The multilayer capacitor C1 comprises: an element body 3 having a rectangular parallelepiped shape and including a pair of end faces 3e facing each other and side faces 3c and side faces 3a adjacent to the pair of end faces 3e and adjacent to each other; a pair of external electrodes 5 respectively arranged at both ends of the element body 3 in the direction in which the pair of end faces 3e face each other and including second electrode layers E2 located on the side faces 3c and the side faces 3a; a plurality of internal electrodes 7 and 9 arranged in the element body 3 and electrically connected to corresponding external electrodes in the pair of external electrodes; and an electrical insulating film EI arranged on the element body 3. The side faces 3c have a surface resistivity greater than that of the side faces 3a. The electrical insulating film EI includes a film portion EIa located in a region between the second electrode layers E2 in the side faces 3a.

[0137] In the multilayer capacitor C1, the side surface 3c has a surface resistivity greater than that of the side surface 3a. Therefore, the multilayer capacitor C1 suppresses the generation of leakage current in the side surface 3c. Even if the metal particles contained in the second electrode layer E2 located on the side surface 3c are ionized, it is difficult for electrons to be supplied to the metal ions. It is difficult for the metal to precipitate on the side surface 3c.

[0138] In the stacked capacitor C1, the film portion EIa included in the electrical insulating film EI is located on the area between the second electrode layers E2 on the side 3a. Therefore, even if the metal particles included in the second electrode layer E2 located on the side 3a are ionized, the film portion EIa blocks the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side 3a.

[0139] As a result, the multilayer capacitor C1 can suppress the occurrence of migration even when the external electrode 5 includes the second electrode layer E2 located on the side surface 3 c and the side surface 3 a .

[0140] Reference Figure 7 to Figure 9 A multilayer capacitor C1 according to a modified example of the first embodiment will be described. Figure 7 to Figure 9 : is a diagram showing a cross-sectional structure of an electronic component of a modified example of the first embodiment. The multilayer capacitor C1 of the modified example is generally similar to or the same as the multilayer capacitor C1 of the first embodiment described above, but the multilayer capacitor C1 of the modified example is different from the multilayer capacitor C1 of the first embodiment in terms of the structure of the region R1, region R2, and region R3 included in the element body 3. The following mainly describes the differences from the multilayer capacitor C1 of the first embodiment.

[0141] The multilayer capacitor C1 of the modified example is the same as the multilayer capacitor C1 of the first embodiment, and includes a rectangular parallelepiped element body 3, a pair of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. The element body 3 includes a region R1, a region R2, and a region R3. The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are arranged in the region R1. The plurality of internal electrodes 7 and 9 are electrically connected to the corresponding external electrodes in the pair of external electrodes 5, respectively.

[0142] The lengths of the regions R1, R2, and R3 of the modification example in the third direction D3 are different from the lengths of the regions R1, R2, and R3 of the first embodiment in the third direction D3. The length of the region R2 of the modification example in the third direction D3 is smaller than the length of the region R2 of the first embodiment in the third direction D3. The length of the region R3 of the modification example in the third direction D3 is smaller than the length of the region R2 of the first embodiment in the third direction D3. The length of the region R1 of the modification example in the third direction D3 is larger than the length of the region R1 of the first embodiment in the third direction D3 by the amount by which the lengths of the regions R2 and R3 are reduced.

[0143] The plurality of internal electrodes 7 and 9 are each located in the region R1 apart from the end B1. The end 7c included in each of the plurality of internal electrodes 7 is separated from the end B1 and extends in the second direction D2 in the region R1. The end 9c included in each of the plurality of internal electrodes 9 is separated from the end B1 and extends in the second direction D2 in the region R1. The plurality of internal electrodes 7 and 9 are each located in the region R1 apart from the end B2. The end 7d included in each of the plurality of internal electrodes 7 is separated from the end B2 and extends in the second direction D2 in the region R1. The end 9d included in each of the plurality of internal electrodes 9 is separated from the end B2 and extends in the second direction D2 in the region R1. The plurality of internal electrodes 7 and 9 are not arranged in the region R2 and the region R3.

[0144] In the multilayer capacitor C1, the plurality of internal electrodes 7, 9 are located in the region R1 so as to be separated from the end B1 of the region R1 that faces the side surface 3c.

[0145] In the multilayer capacitor C1, the plurality of internal electrodes 7 and 9 are reliably located within the region R1. Therefore, the multilayer capacitor C1 suppresses a decrease in electrostatic capacitance.

[0146] In the multilayer capacitor C1, the plurality of internal electrodes 7, 9 are located in the region R1 so as to be separated from the end B2 of the region R1 that faces the side surface 3d.

[0147] In the multilayer capacitor C1, the plurality of internal electrodes 7 and 9 are reliably located within the region R1. Therefore, the multilayer capacitor C1 suppresses a decrease in electrostatic capacitance.

[0148] Second embodiment

[0149] Reference Figure 10 to Figure 14 The multilayer capacitor C1 according to the second embodiment will be described. Fig.10 It is a perspective view showing an electronic component according to a second embodiment. Figure 11 to Figure 14 : is a diagram showing a cross-sectional structure of an electronic component according to a second embodiment. The multilayer capacitor C1 according to the second embodiment is generally similar to or the same as the multilayer capacitor C1 according to the first embodiment described above, but the multilayer capacitor C1 according to the second embodiment is different from the multilayer capacitor C1 according to the first embodiment in terms of the structure of the region R1, region R2, and region R3 included in the element body 3, the structure of the plurality of internal electrodes 7, 9, and the arrangement of the electrical insulating film EI. The following mainly describes the differences from the multilayer capacitor C1 according to the first embodiment.

[0150] like Figure 10 to Figure 14As shown, the multilayer capacitor C1 of the second embodiment is the same as the multilayer capacitor C1 of the first embodiment, and includes a rectangular parallelepiped element body 3, a pair of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. The side surface 3a is a mounting surface. In the second embodiment, for example, when the side surface 3a includes the first side surface, the side surface 3b includes the third side surface. For example, when the side surface 3c includes the second side surface, the side surface 3d includes the fourth side surface.

[0151] The element body 3 includes a region R1, a region R2, and a region R3. The region R1 does not include the side surface 3a and the side surface 3b. The region R2 includes the side surface 3a. The region R2 includes the entire side surface 3a, for example. The region R3 includes the side surface 3b. The region R3 includes the entire side surface 3b, for example. The region R1 is located between the region R2 and the region R3 in the first direction D1. The region R1 is located at a position separated from the side surface 3a and the side surface 3b.

[0152] The height of region R2 is equal to the height of region R3. The height of region R2 is the length of region R2 in the third direction D3. The height of region R3 is the length of region R3 in the third direction D3. The width of region R2 is equal to the width of region R3. The width of region R2 is the length of region R2 in the second direction D2. The width of region R3 is the length of region R3 in the second direction D2. The thickness of region R2 is equal to the thickness of region R3. The thickness of region R2 is the length of region R2 in the first direction D1. The thickness of region R3 is the length of region R3 in the first direction D1. The thickness of region R2 may not be equal to the thickness of region R3. The thickness of region R2 may also be different from the thickness of region R3. Region R2 and region R3 have a dielectric constant smaller than that of region R1. Region R2 and region R3 have a surface resistivity greater than that of region R1. Side 3a and side 3b have a surface resistivity greater than that of side 3c and 3d.

[0153] The second electrode layer E2 continuously covers a portion of the side surface 3c, a portion of the side surface 3a, a portion of the side surface 3d, and a portion of the corresponding end surface in a pair of end surfaces 3e. For example, the second electrode layer E2 only connects and covers a portion of each of the side surfaces 3c and 3d, only a portion of the side surface 3a, and only a portion of the corresponding end surface 3e. The second electrode layer E2 includes a portion that is set to continuously cover only a portion of each of the side surfaces 3c and 3d, only a portion of the side surface 3a, and only a portion of the corresponding end surface 3e. The above-mentioned portion of the corresponding end surface 3e includes a portion of the corresponding end surface 3e close to the side surface 3a. The above-mentioned portions of the sides 3c and 3d include a portion of the sides 3c and 3d close to the side surface 3a. The second electrode layer E2 covers the entire edge portion 3g, only a portion of the edge portion 3i, and only a portion of the edge portion 3j. A portion of the portion of the first electrode layer E1 that covers the edge portion 3i is exposed from the second electrode layer E2. For example, each region 5c 1 , 5d 1 、5e 1 The first electrode layer E1 included is exposed from the second electrode layer E2. The second electrode layer E2 includes a conductive resin layer.

[0154] The internal electrodes 7 and the internal electrodes 9 are arranged at different positions in the third direction D3. The internal electrodes 7 and the internal electrodes 9 are opposed to each other in a direction (third direction D3) perpendicular to the direction (second direction D2) in which the pair of end faces 3e are opposed and the direction (first direction D1) in which the side faces 3a and 3b are opposed. The internal electrodes 7 and the internal electrodes 9 are alternately arranged in the element body 3 so as to be opposed with a gap in the third direction D3. The internal electrodes 7 and 9 are located in a plane substantially parallel to the side faces 3c and 3d.

[0155] The plurality of internal electrodes 7 and 9 each include an end exposed at a corresponding end face 3e in a pair of end faces 3e. The above-mentioned one end included in each of the plurality of internal electrodes 7 and 9 is covered by a corresponding electrode portion 5e in a plurality of electrode portions 5e. In the second embodiment, the above-mentioned one end is entirely covered by the corresponding electrode portion 5e. The internal electrode 7 and the internal electrode 9 are directly connected to the corresponding electrode portion 5e. The internal electrode 7 and the internal electrode 9 are electrically connected to the corresponding external electrode 5 in a plurality of external electrodes 5. The plurality of internal electrodes 7 each include an end 7a near the side surface 3a and an end 7b near the side surface 3b. The plurality of internal electrodes 9 each include an end 9a near the side surface 3a and an end 9b near the side surface 3b. The ends 7a, 7b and the ends 9a, 9b are not exposed on the outer surface of the element body 3.

[0156] The plurality of internal electrodes 7 and 9 are arranged in the region R1. The end 7a included in each of the plurality of internal electrodes 7 extends in the second direction D2 along the end B1 opposite to the side surface 3a in the region R1. The end 9a included in each of the plurality of internal electrodes 9 is arranged in the second direction D2 along the end B1. The end 7b included in each of the plurality of internal electrodes 7 is arranged in the second direction D2 along the end B2 opposite to the side surface 3b in the region R1. The end 9b included in each of the plurality of internal electrodes 9 is arranged in the second direction D2 along the end B2. In the second embodiment, when viewed from the second direction D2, the end 7a and the end 9a coincide with the end B1, and the end 7b and the end 9b coincide with the end B2. The plurality of internal electrodes 7 and 9 are not arranged in the region R2 and the region R3.

[0157] The plurality of internal electrodes 7 and 9 may be located in the region R1 separately from the end B1. The end 7a included in each of the plurality of internal electrodes 7 may be separated from the end B1 and arranged along the second direction D2 in the region R1. The end 9a included in each of the plurality of internal electrodes 9 may be separated from the end B1 and arranged along the second direction D2 in the region R1. The plurality of internal electrodes 7 and 9 may be located in the region R1 separately from the end B2. The end 7b included in each of the plurality of internal electrodes 7 may be separated from the end B2 and arranged along the second direction D2 in the region R1. The end 9b included in each of the plurality of internal electrodes 9 may be separated from the end B2 and arranged along the second direction D2 in the region R1. In these cases, the lengths of the regions R2 and R3 in the first direction D1 are reduced, and the length of the region R1 in the first direction D1 is increased by the amount by which the lengths of the regions R2 and R3 in the first direction D1 are reduced. The plurality of internal electrodes 7 and 9 are not arranged in the regions R2 and R3.

[0158] The plurality of internal electrodes 7 include an outermost internal electrode 7p adjacent to the side surface 3d. When the outermost internal electrode 7p and the second electrode layer E2 not electrically connected to the outermost internal electrode 7p are observed in a direction (third direction D3) orthogonal to the side surface 3d, the outermost internal electrode 7p overlaps with the second electrode layer E2 not electrically connected to the outermost internal electrode 7p.

[0159] The plurality of internal electrodes 9 include an outermost internal electrode 9p adjacent to the side surface 3c. When the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p are observed in a direction (third direction D3) orthogonal to the side surface 3c, the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p overlap. For example, in the case where the outermost internal electrode 7p includes the second outermost internal electrode, the outermost internal electrode 9p includes the first outermost internal electrode.

[0160] The electrical insulating film EI is disposed on the side surface 3c and the side surface 3d. The film portion EIa is disposed at least on the area between the pair of external electrodes 5 on the side surfaces 3c and 3d. The film portion EIa covers the side surface 3c and is directly in contact with the side surface 3c. The film portion EIa covers the side surface 3d and is directly in contact with the side surface 3d. The film portion EIa is located only on the side surface 3c and the side surface 3d.

[0161] Each end face 3e is exposed from the electrical insulating film EI (film portion EIa). Therefore, the above-mentioned one end included in each of the plurality of internal electrodes 7 and 9 includes a region exposed from the electrical insulating film EI. In the second embodiment, the above-mentioned one end included in each of the plurality of internal electrodes 7 and 9 includes only a region exposed from the electrical insulating film EI. The above-mentioned one end included in each of the plurality of internal electrodes 7 and 9 is entirely exposed from the electrical insulating film EI. The side faces 3a and 3b and the ridges 3g, 3i, and 3j are exposed from the electrical insulating film EI. The electrical insulating film EI (film portion EIa) is opposed to the plurality of internal electrodes 7 and 9 in the third direction D3.

[0162] In the multilayer capacitor C1 of the second embodiment, the element body 3 includes a side surface 3d opposite to the side surface 3c and a side surface 3b opposite to the side surface 3a, and includes a region R3 including the side surface 3d and having a dielectric constant smaller than that of the region R1. The second electrode layer E2 is located on the side surface 3d. The electrical insulating film EI includes a film portion EIa located on a region between the second electrode layers E2 on the side surface 3b.

[0163] In the multilayer capacitor C1 of the second embodiment, even when the metal particles contained in the second electrode layer E2 located on the side 3d are ionized, the film portion EIa blocks the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side 3d. Therefore, even in a structure in which the external electrode 5 includes the second electrode layer E2 located on the side 3d, and the electrical insulating film EI includes the film portion EIa located in the area between the second electrode layers E2 in the side 3d, the generation of migration is suppressed.

[0164] In the multilayer capacitor C1 of the second embodiment, the electrical insulating film EI is disposed only on the side surfaces 3c and 3d. For example, the electrical insulating film EI can be formed more easily than when it is disposed on the side surfaces 3a and 3b and the side surfaces 3c and 3d.

[0165] In the multilayer capacitor C1 of the second embodiment, the plurality of internal electrodes 7 and 9 are opposed to each other in the direction in which the side surface 3 c and the side surface 3 d are opposed to each other.

[0166] In the multilayer capacitor C1 of the second embodiment, there is a tendency for electrons to be supplied from the internal electrodes 7 and 9 to the second electrode layer E2 located on the side surface 3c and the side surface 3d as leakage current. However, as described above, the film portion E1a blocks the reaction between the generated metal ions and the electrons. Therefore, in the multilayer capacitor C1 of the second embodiment, the generation of migration is also reliably suppressed.

[0167] In the multilayer capacitor C1 of the second embodiment, the plurality of internal electrodes 7, 9 include an outermost internal electrode 9p adjacent to the side surface 3c and an outermost internal electrode 7p adjacent to the side surface 3d. When the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p are observed in a direction perpendicular to the side surface 3c, the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p overlap. When the outermost internal electrode 7p and the second electrode layer E2 not electrically connected to the outermost internal electrode 7p are observed in a direction perpendicular to the side surface 3d, the outermost internal electrode 7p and the second electrode layer E2 not electrically connected to the outermost internal electrode 7p overlap.

[0168] In the multilayer capacitor C1 of the second embodiment, there is a tendency for electrons to be supplied from the outermost internal electrode 9p to the second electrode layer E2 located on the side surface 3c as leakage current. However, as described above, the film portion E1a blocks the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult for the metal to precipitate on the side surface 3c.

[0169] In the multilayer capacitor C1 of the second embodiment, there is a tendency for electrons to be supplied from the outermost internal electrode 7p to the second electrode layer E2 located on the side surface 3d as leakage current. However, as described above, the film portion E1a blocks the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult for the metal to precipitate on the side surface 3d.

[0170] Therefore, also in the multilayer capacitor C1 of the second embodiment, the occurrence of migration can be reliably suppressed.

[0171] The multilayer capacitor C1 of the second embodiment can increase the lengths of the plurality of internal electrodes 7 and 9 in the direction in which the pair of end faces 3e face each other. Therefore, the multilayer capacitor C1 of the second embodiment can increase the capacitance.

[0172] In the multilayer capacitor C1 of the second embodiment, the second electrode layer E2 continuously covers a portion of the side surface 3a, a portion of the side surface 3c, a portion of the side surface 3d, and a portion of a corresponding one of the pair of end surfaces 3e.

[0173] Compared to a structure in which the second electrode layer E2 continuously covers a portion of the side surface 3a, a portion of the side surface 3c, a portion of the side surface 3d, and the entire corresponding end surface 3e, the multilayer capacitor C1 of the second embodiment can reduce the amount of conductive resin paste used to form the second electrode layer E2. The reduction in the amount of conductive resin paste can reduce the length of the second electrode layer E2 in the direction in which the pair of end surfaces 3e are opposed, and can increase the distance between the pair of external electrodes 5 on the side surfaces 3a, 3c, and 3d. The increase in the distance between the pair of external electrodes 5 reduces the electric field generated between the pair of external electrodes 5. Therefore, it is difficult for the generated metal ions to move from the second electrode layer E2. As a result, the multilayer capacitor C1 of the second embodiment can further suppress the generation of migration.

[0174] Compared to a structure in which the second electrode layer E2 continuously covers a portion of the side surface 3a, a portion of the side surface 3c, a portion of the side surface 3d, and the entire corresponding end surface 3e, the multilayer capacitor C1 of the second embodiment has lower ESR.

[0175] Third embodiment

[0176] Reference Figure 15 to Figure 19 A multilayer capacitor C1 according to a third embodiment will be described. Fig.15 It is a perspective view showing an electronic component according to a third embodiment. Figure 16 to Figure 19 : is a diagram showing a cross-sectional structure of an electronic component of the third embodiment. The multilayer capacitor C1 of the third embodiment is generally similar to or the same as the multilayer capacitor C1 of the first embodiment described above, but the multilayer capacitor C1 of the third embodiment is different from the multilayer capacitor C1 of the first embodiment in terms of the structure of the external electrode 5 and the arrangement of the electrical insulating film EI. The following mainly describes the differences from the multilayer capacitor C1 of the first embodiment.

[0177] The multilayer capacitor C1 of the third embodiment is the same as the multilayer capacitor C1 of the first embodiment, and includes a rectangular parallelepiped element body 3, a pair of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. The side 3a is a mounting surface. The pair of external electrodes 5 include a second electrode layer E2 located on the side 3c and the side 3a, respectively. The electrical insulating film EI includes a film portion EIa located on the area between the second electrode layer E2 in the side 3a. The pair of external electrodes 5 include a second electrode layer E2 located on the side 3c and the side 3b, respectively. The electrical insulating film EI includes a film portion EIa located on the area between the second electrode layer E2 in the side 3b. In the third embodiment, for example, when the side 3a includes the second side, the side 3b includes the fourth side. For example, when the side 3c includes the first side, the side 3d includes the third side.

[0178] Each external electrode 5 includes a plurality of electrode portions 5a, 5b, 5c, 5d, and 5e. Each electrode portion 5a, 5b, 5c, 5d, and 5e includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The second electrode layer E2 includes a conductive resin layer.

[0179] The second electrode layer E2 of the electrode portion 5b is arranged on the first electrode layer E1 and the electrically insulating film EI. In the electrode portion 5b, the second electrode layer E2 is formed on the first electrode layer E1 in a manner covering the first electrode layer E1 of the electrode portion 5b, and is formed on the electrically insulating film EI in a manner covering a portion of the electrically insulating film EI. The second electrode layer E2 of the electrode portion 5b is in contact with the above-mentioned portion of the electrically insulating film EI and the entirety of the first electrode layer E1. In the electrode portion 5b, the second electrode layer E2 is directly in contact with the first electrode layer E1 and the electrically insulating film EI. In the electrode portion 5b, the second electrode layer E2 indirectly covers the side surface 3b in a manner that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3b. The second electrode layer E2 of the electrode portion 5b is located on the side surface 3b. The second electrode layer E2 of the electrode portion 5b includes an edge E2b located on the side surface 3b. e .

[0180] The third electrode layer E3 of the electrode portion 5b is arranged on the second electrode layer E2. In the electrode portion 5b, the third electrode layer E3 covers the second electrode layer E2. In the electrode portion 5b, the third electrode layer E3 is in contact with the second electrode layer E2. In the electrode portion 5b, the third electrode layer E3 is directly in contact with the second electrode layer E2. In the electrode portion 5b, the third electrode layer E3 is not directly in contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5b is located on the side surface 3b.

[0181] In the electrode portion 5c, the second electrode layer E2 is formed to cover the above-mentioned part of the first electrode layer E1 and the above-mentioned part of the side 3c, and to cover the other part of the first electrode layer E1 and the other part of the side 3c. In the electrode portion 5c, the second electrode layer E2 is directly connected to the above-mentioned other part of the first electrode layer E1 and the above-mentioned other part of the side 3c. The second electrode layer E2 of the electrode portion 5c covers the above-mentioned other part of the first electrode layer E1 of the electrode portion 5c. The area included in the side 3c and covered by the second electrode layer E2 is, for example, located at a position close to the side surface 3a and the end surface 3e, and at a position close to the side surface 3b and the end surface 3e. In the electrode portion 5c, the second electrode layer E2 indirectly covers the above-mentioned other part of the side surface 3c in a manner that the first electrode layer E1 is located between the second electrode layer E2 and the side 3c. The first electrode layer E1 of the electrode portion 5c is covered by the second electrode layer E2 in the above-mentioned part and the above-mentioned other part, and is exposed from the second electrode layer E2 in the remaining part except for the above-mentioned part and the above-mentioned other part.

[0182] The electrode portion 5c includes a plurality of regions 5c1 , 5c 2 , 5c 3 For example, the electrode portion 5c includes only three regions 5c 1 , 5c 2 , 5c 3 . Area 5c 3 Located in area 5c 1 Area 5c 3 It includes a first electrode layer E1, a second electrode layer E2 and a third electrode layer E3. Region 5c 3 The region 5c includes the region where the first electrode layer E1 is covered by the second electrode layer E2. In the first direction D1, the region 5c 1 Located in zone 5c 2 With area 5c 3 between.

[0183] In the electrode portion 5d, the second electrode layer E2 is formed to cover the above-mentioned part of the first electrode layer E1 and the above-mentioned part of the side 3d, and to cover the other part of the first electrode layer E1 and the other part of the side 3d. In the electrode portion 5d, the second electrode layer E2 is directly connected to the above-mentioned other part of the first electrode layer E1 and the above-mentioned other part of the side 3d. The second electrode layer E2 of the electrode portion 5d covers the above-mentioned other part of the first electrode layer E1 of the electrode portion 5d. The area included in the side 3d and covered by the second electrode layer E2 is, for example, located at a position close to the side surface 3a and the end surface 3e and at a position close to the side surface 3b and the end surface 3e. In the electrode portion 5d, the second electrode layer E2 indirectly covers the above-mentioned other part of the side surface 3d in a manner that the first electrode layer E1 is located between the second electrode layer E2 and the side 3d. The first electrode layer E1 of the electrode portion 5d is covered by the second electrode layer E2 in the above-mentioned part and the above-mentioned other part, and is exposed from the second electrode layer E2 in the remaining part except for the above-mentioned part and the above-mentioned other part.

[0184] The electrode portion 5d includes a plurality of regions 5d 1 , 5d 2 , 5d 3 For example, the electrode portion 5d only includes three regions 5d 1 , 5d 2 , 5d 3 . Area 5d 3 Located in area 5d 1 Area 5d 3 The region 5d includes a first electrode layer E1, a second electrode layer E2 and a third electrode layer E3. 3 The area 5d includes the area where the first electrode layer E1 is covered by the second electrode layer E2. In the first direction D1, the area 5d 1 Located in area 5d 2 With area 5d 3between.

[0185] In the electrode portion 5e, the second electrode layer E2 is formed to cover the above-mentioned part of the first electrode layer E1, and to cover another part of the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is directly connected to the above-mentioned other part of the first electrode layer E1. The second electrode layer E2 of the electrode portion 5e covers the above-mentioned other part of the first electrode layer E1 of the electrode portion 5e. In the electrode portion 5e, the second electrode layer E2 indirectly covers the other part of the end face 3e in a manner that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. The other part of the end face 3e is located, for example, near the side surface 3b in the end face 3e. The first electrode layer E1 of the electrode portion 5e is covered by the second electrode layer E2 in the above-mentioned part and the above-mentioned other part, and is exposed from the second electrode layer E2 in the remaining part except the above-mentioned part and the above-mentioned other part.

[0186] The electrode portion 5e includes a plurality of regions 5e 1 、5e 2 、5e 3 For example, the electrode portion 5e includes only three regions 5e 1 、5e 2 、5e 3 . Area 5e 3 Located in area 5e 1 Area 5e 3 The region 5e includes a first electrode layer E1, a second electrode layer E2 and a third electrode layer E3. 3 The first electrode layer E1 is covered by the second electrode layer E2. In the first direction D1, the area 5e 1 Located in area 5e 2 With Region 5e 3 between.

[0187] In the multilayer capacitor C1 of the third embodiment, the second electrode layer E2 continuously covers only a portion of the side surface 3a, only a portion of the end surface 3e, and only a portion of each of the side surfaces 3c and 3d, and continuously covers only a portion of the side surface 3b, only another portion of the end surface 3e, and only another portion of each of the side surfaces 3c and 3d. The second electrode layer E2 includes a plurality of portions separated from each other. That is, the second electrode layer E2 includes a first portion and a second portion, the first portion is configured to continuously cover only a portion of the side surface 3a, only a portion of the end surface 3e, and only a portion of each of the side surfaces 3c and 3d, and the second portion is configured to continuously cover only a portion of the side surface 3b, only another portion of the end surface 3e, and only another portion of each of the side surfaces 3c and 3d.

[0188] The above-mentioned part of the end face 3e is located near the side face 3a. The above-mentioned part of each side face 3c, 3d is located near the side face 3a. The above-mentioned other part of the end face 3e is located near the side face 3b. The above-mentioned other part of each side face 3c, 3d is located near the side face 3b. The second electrode layer E2 covers the entirety of one edge portion 3g, only a part of the edge portion 3i, and only a part of the edge portion 3j, and covers the entirety of another edge portion 3g, only another part of the edge portion 3i, and only another part of the edge portion 3j.

[0189] A portion of the first electrode layer E1 that covers the edge portion 3i is exposed from the second electrode layer E2. 1 , 5d 1 、5e 1 The included first electrode layer E1 is exposed from the second electrode layer E2.

[0190] In the structure where the electrode portion 5e does not include the second electrode layer E2, the second electrode layer E2 continuously covers only a portion of each of the side surfaces 3c and 3d and only a portion of the end surface 3e. The second electrode layer E2 includes a portion that continuously covers only a portion of each of the side surfaces 3a and 3b and only a portion of the end surface 3e.

[0191] The film portion EIa is disposed at least in the region between the pair of external electrodes 5 on the side surfaces 3a and 3b. The side surfaces 3c and 3d, the pair of end surfaces 3e, and the ridges 3g, 3i, and 3j are exposed from the electrical insulating film EI. The electrical insulating film EI includes the film portion EIa located in the region between the second electrode layers E2 on each of the side surfaces 3a and 3b.

[0192] The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are alternately arranged in the first direction D1. The plurality of internal electrodes 7 include an outermost internal electrode 7p adjacent to the side surface 3b. When the outermost internal electrode 7p and the second electrode layer E2 not electrically connected to the outermost internal electrode 7p are observed in a direction (third direction D3) orthogonal to the side surface 3c, the outermost internal electrode 7p and the second electrode layer E2 not electrically connected to the outermost internal electrode 7p overlap.

[0193] The plurality of internal electrodes 9 include an outermost internal electrode 9p adjacent to the side surface 3a. When the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p are observed in a direction (third direction D3) orthogonal to the side surface 3c, the outermost internal electrode 9p and the second electrode layer E2 not electrically connected to the outermost internal electrode 9p overlap.

[0194] In the third embodiment, the plurality of internal electrodes 7 and the plurality of internal electrodes 9 may be arranged alternately in the third direction D3.

[0195] In the multilayer capacitor C1 of the third embodiment, the element body 3 includes a side surface 3b facing the side surface 3a. The second electrode layer E2 is located on the side surface 3b. The electrical insulating film EI includes a film portion EIa located on the region between the second electrode layers E2 on the side surface 3b.

[0196] In the multilayer capacitor C1 of the third embodiment, the region R2 including the side surface 3c has a dielectric constant smaller than that of the region R1. Therefore, the multilayer capacitor C1 of the third embodiment suppresses the generation of leakage current in the region R2. Even if the metal particles contained in the second electrode layer E2 located on the side surface 3c are ionized, it is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side surface 3c.

[0197] In the multilayer capacitor C1 of the third embodiment, the region R3 including the side surface 3d has a dielectric constant smaller than that of the region R1. Therefore, the multilayer capacitor C1 of the third embodiment suppresses the generation of leakage current in the region R3. Even when the metal particles contained in the second electrode layer E2 located on the side surface 3d are ionized, it is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side surface 3d.

[0198] In the multilayer capacitor C1 of the third embodiment, the film portion EIa included in the electrical insulating film EI is located in the region between the second electrode layer E2 on the side surfaces 3a and 3b. Therefore, even when the metal particles included in the second electrode layer E2 located on the side surfaces 3a and 3b are ionized, the film portion EIa blocks the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side surfaces 3a and 3b.

[0199] As a result, the multilayer capacitor C1 of the third embodiment can suppress the occurrence of migration even if the external electrode 5 includes the second electrode layer E2 located on the side surface 3 a and the side surface 3 b .

[0200] Fourth embodiment

[0201] Reference Figure 20 to Figure 23 A multilayer capacitor C1 according to a fourth embodiment will be described. Fig. 20 It is a perspective view showing an electronic component according to a fourth embodiment. Figure 21 to Figure 23 : is a diagram showing a cross-sectional structure of an electronic component of a fourth embodiment. The multilayer capacitor C1 of the fourth embodiment is generally similar to or the same as the multilayer capacitor C1 of the first embodiment described above, but the multilayer capacitor C1 of the fourth embodiment is different from the multilayer capacitor C1 of the first embodiment in terms of the structure of the external electrode 5 and the arrangement of the electrical insulating film EI. The following mainly describes the differences from the multilayer capacitor C1 of the first embodiment.

[0202] The multilayer capacitor C1 of the fourth embodiment is the same as the multilayer capacitor C1 of the first embodiment, and includes a rectangular parallelepiped element body 3, a pair of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. The side surface 3a is a mounting surface. In the fourth embodiment, for example, when the side surface 3a includes the second side surface, the side surface 3b includes the fourth side surface. For example, when the side surface 3c includes the first side surface, the side surface 3d includes the third side surface.

[0203] Each external electrode 5 includes a plurality of electrode portions 5a, 5b, 5c, 5d, and 5e. Each electrode portion 5a, 5b, 5c, 5d, and 5e includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The second electrode layer E2 includes a conductive resin layer.

[0204] The second electrode layer E2 of the electrode portion 5c is arranged on the first electrode layer E1 and on the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is formed on the first electrode layer E1 in a manner covering the first electrode layer E1 of the electrode portion 5c, and is formed on the side surface 3c in a manner covering a portion of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in contact with the above-mentioned portion of the side surface 3c and the entirety of the first electrode layer E1. The first electrode layer E1 of the electrode portion 5c is entirely covered on the second electrode layer E2. The first electrode layer E1 of the electrode portion 5c does not include an area exposed from the second electrode layer E2.

[0205] The second electrode layer E2 of the electrode portion 5d is arranged on the first electrode layer E1 and on the side surface 3d. In the electrode portion 5d, the second electrode layer E2 is formed on the first electrode layer E1 in a manner covering the first electrode layer E1 of the electrode portion 5d, and is formed on the side surface 3d in a manner covering a portion of the side surface 3d. In the electrode portion 5d, the second electrode layer E2 is in contact with the above-mentioned portion of the side surface 3d and the entire first electrode layer E1. The first electrode layer E1 of the electrode portion 5d is entirely covered on the second electrode layer E2. The first electrode layer E1 of the electrode portion 5d does not include a region exposed from the second electrode layer E2.

[0206] The second electrode layer E2 of the electrode portion 5e is arranged on the first electrode layer E1. In the electrode portion 5e, the second electrode layer E2 is formed on the first electrode layer E1 in a manner covering the first electrode layer E1 of the electrode portion 5e. In the electrode portion 5e, the second electrode layer E2 is in contact with the entirety of the first electrode layer E1. The first electrode layer E1 of the electrode portion 5e entirely covers the second electrode layer E2. The first electrode layer E1 of the electrode portion 5e does not include an area exposed from the second electrode layer E2.

[0207] The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are arranged alternately in the first direction D1. In the fourth embodiment, the plurality of internal electrodes 7 and the plurality of internal electrodes 9 are arranged alternately in the third direction D3.

[0208] In the multilayer capacitor C1 of the fourth embodiment, the element body 3 includes a side surface 3b facing the side surface 3a. The second electrode layer E2 is located on the side surface 3b. The electrical insulating film EI includes a film portion EIa located on the region between the second electrode layers E2 on the side surface 3b.

[0209] In the multilayer capacitor C1 of the fourth embodiment, the region R2 including the side surface 3c has a dielectric constant smaller than that of the region R1. Therefore, the multilayer capacitor C1 of the fourth embodiment suppresses the generation of leakage current in the region R2. Even if the metal particles contained in the second electrode layer E2 located on the side surface 3c are ionized, it is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side surface 3c.

[0210] In the multilayer capacitor C1 of the fourth embodiment, the region R3 including the side surface 3d has a dielectric constant smaller than that of the region R1. Therefore, the multilayer capacitor C1 of the fourth embodiment suppresses the generation of leakage current in the region R3. Even when the metal particles contained in the second electrode layer E2 located on the side surface 3d are ionized, it is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side surface 3d.

[0211] In the multilayer capacitor C1 of the fourth embodiment, the film portion EIa included in the electrical insulating film EI is located on the area between the second electrode layer E2 on the side surfaces 3a and 3b. Therefore, even if the metal particles included in the second electrode layer E2 located on the side surfaces 3a and 3b are ionized, the film portion EIa blocks the reaction between the generated metal ions and the electrons caused by the leakage current. It is difficult to supply electrons to the metal ions. It is difficult for the metal to precipitate on the side surfaces 3a and 3b.

[0212] As a result, the multilayer capacitor C1 of the fourth embodiment can suppress the occurrence of migration even if the external electrode 5 includes the second electrode layer E2 located on the side surface 3 a and the side surface 3 b .

[0213] Fifth embodiment

[0214] Reference Fig.24 An electronic component device according to a fifth embodiment will be described. Fig.24 It is a diagram showing an electronic component device according to a fifth embodiment.

[0215] In the fifth embodiment, the electronic component device ECD includes the multilayer capacitor C1 of the first embodiment and an electronic device ED. The multilayer capacitor C1 of the first embodiment is mounted in the electronic device ED. The multilayer capacitor C1 of the first embodiment is soldered and mounted in the electronic device ED. The electronic device ED includes, for example, a circuit board or electronic components. The electronic component device ECD may also include a modified example of the first embodiment and the multilayer capacitor C1 of the second to fourth embodiments and the electronic device ED.

[0216] The electronic device ED includes a side surface EDa. The electronic device ED includes a pair of pad electrodes PE arranged on the side surface EDa. The pair of pad electrodes PE are electrically connected to the multilayer capacitor C1 of the first embodiment. The pair of pad electrodes PE are each electrically connected to a corresponding external electrode 5 in a pair of external electrodes 5. The pair of pad electrodes PE are separated from each other in the second direction D2. The multilayer capacitor C1 of the first embodiment is arranged in the electronic device ED in such a manner that the side surface EDa and the side surface 3a are opposite to each other. Each internal electrode 7, 9 is located in a plane substantially parallel to the side surface EDa. The side surface 3a is a mounting surface.

[0217] When the multilayer capacitor C1 of the first embodiment is mounted by soldering, the molten solder wets the external electrode 5 (third electrode layer E3). The wet solder solidifies to form a solder fillet SF on the external electrode 5. The corresponding external electrode 5 and pad electrode PE are connected via the solder fillet SF.

[0218] It should be understood that not all aspects, advantages and features described herein must be achieved or included in any one particular example. In fact, after various examples have been described and illustrated herein, it is apparent that other examples may be modified in design and detail.

[0219] In the above-mentioned embodiments and variations, a laminated capacitor is used as an example of an electronic component, but applicable electronic components are not limited to laminated capacitors. Applicable electronic components include laminated inductors, laminated varistors, laminated piezoelectric actuators, laminated thermistors, laminated solid battery components, laminated composite components, or other laminated electronic components.

[0220] When the outermost inner electrode 7p, 9p and the second electrode layer E2 not electrically connected to the outermost inner electrode 7p, 9p are observed in a direction orthogonal to the side 3c, the outermost inner electrode 7p, 9p may not overlap with the second electrode layer E2, and the second electrode layer E2 is not electrically connected to the outermost inner electrode 7p, 9p. When the outermost inner electrode 7p, 9p and the second electrode layer E2 not electrically connected to the outermost inner electrode 7p, 9p are observed in a direction orthogonal to the side 3c, the outermost inner electrode 7p, 9p and the second electrode layer E2 not electrically connected to the outermost inner electrode 7p, 9p overlap as described above, and there is a tendency to supply electrons from the outermost inner electrode 7p, 9p to the second electrode layer E2 located on the side 3c, 3d as leakage current. However, as described above, in the region R2, it is difficult to supply electrons to the metal ions. Therefore, in the stacked capacitor C1, the generation of migration is reliably suppressed.

[0221] When the outermost inner electrode 9p and the second electrode layer E2 not electrically connected to the outermost inner electrode 9p are observed in a direction orthogonal to the side surface 3c, the outermost inner electrode 9p may not overlap with the second electrode layer E2, which is not electrically connected to the outermost inner electrode 9p. When the outermost inner electrode 9p and the second electrode layer E2 not electrically connected to the outermost inner electrode 9p are observed in a direction orthogonal to the side surface 3c, in a structure in which the outermost inner electrode 9p and the second electrode layer E2 not electrically connected to the outermost inner electrode 9p overlap, as described above, there is a tendency for electrons to be supplied from the outermost inner electrode 9p to the second electrode layer E2 located on the side surface 3c as a leakage current. However, the membrane portion E1a hinders the reaction of the generated metal ions with the electrons caused by the leakage current. It is difficult for the metal to precipitate on the side surface 3c.

[0222] When the outermost inner electrode 7p and the second electrode layer E2 not electrically connected to the outermost inner electrode 7p are observed in a direction orthogonal to the side surface 3d, the outermost inner electrode 7p may not overlap with the second electrode layer E2, which is not electrically connected to the outermost inner electrode 7p. When the outermost inner electrode 7p and the second electrode layer E2 not electrically connected to the outermost inner electrode 7p are observed in a direction orthogonal to the side surface 3d, in a structure in which the outermost inner electrode 7p and the second electrode layer E2 not electrically connected to the outermost inner electrode 7p overlap, there is a tendency for electrons to be supplied from the outermost inner electrode 7p to the second electrode layer E2 located on the side surface 3d as a leakage current. However, the membrane portion E1a hinders the reaction of the generated metal ions with the electrons caused by the leakage current. It is difficult for the metal to precipitate on the side surface 3d.

[0223] Therefore, in the multilayer capacitor C1, occurrence of migration is reliably suppressed.

Claims

1. An electronic component comprising: A body having a rectangular parallelepiped shape and comprising a pair of end faces facing each other and a first side face and a second side face adjacent to the pair of end faces and adjacent to each other; a plurality of external electrodes, each of which is disposed on both ends of the element body in a direction in which the pair of end faces face each other, and each of which includes a conductive resin layer located on the first side surface and the second side surface; a plurality of internal electrodes disposed in the element body and electrically connected to corresponding external electrodes among the plurality of external electrodes; and an electrical insulating film disposed on the element body, The element body comprises: a first region, which is located at a position separated from the first side surface and is provided with the plurality of internal electrodes; a second region including the first side and having a dielectric constant smaller than that of the first region, The electrical insulating film includes a film portion located on a region between the conductive resin layers in the second side.

2. The electronic component according to claim 1, wherein The element body further includes a third side surface opposite to the first side surface, and further includes a third region, the third region includes the third side surface and has a dielectric constant smaller than the dielectric constant of the first region, The conductive resin layer is also located on the third side.

3. The electronic component according to claim 2, wherein: The plurality of internal electrodes face each other in a direction orthogonal to a direction in which the pair of end faces face each other and a direction in which the first side face and the third side face face each other.

4. The electronic component according to claim 3, wherein: The plurality of internal electrodes include an outermost internal electrode adjacent to the second side, When the outermost inner electrode and the conductive resin layer not electrically connected to the outermost inner electrode are viewed in a direction orthogonal to the first side surface, the outermost inner electrode and the conductive resin layer not electrically connected to the outermost inner electrode overlap.

5. The electronic component according to any one of claims 2 to 4, wherein The conductive resin layer continuously covers a portion of the first side surface, a portion of the second side surface, a portion of the third side surface, and a portion of a corresponding end surface of the pair of end surfaces.

6. The electronic component according to claim 1, wherein The element body further includes a fourth side surface opposite to the second side surface, The conductive resin layer is also located on the fourth side surface, The electrical insulating film further includes a film portion located on a region between the conductive resin layers in the fourth side.

7. The electronic component according to claim 1, wherein The element body further includes a third side surface opposite to the first side surface and a fourth side surface opposite to the second side surface, and further includes a third region, the third region includes the third side surface and has a dielectric constant smaller than the dielectric constant of the first region, The conductive resin layer is also located on the fourth side surface, The electrical insulating film further includes a film portion located on a region between the conductive resin layers in the fourth side.

8. The electronic component according to claim 7, wherein: The plurality of internal electrodes are opposed to each other in a direction in which the second side surface and the fourth side surface are opposed to each other.

9. The electronic component according to claim 8, wherein: The plurality of internal electrodes include a first outermost internal electrode adjacent to the second side surface and a second outermost internal electrode adjacent to the fourth side surface, When the first outermost inner electrode and the conductive resin layer not electrically connected to the first outermost inner electrode are viewed in a direction orthogonal to the second side surface, the first outermost inner electrode and the conductive resin layer not electrically connected to the first outermost inner electrode overlap, When the second outermost inner electrode and the conductive resin layer not electrically connected to the second outermost inner electrode are viewed in a direction orthogonal to the fourth side surface, the second outermost inner electrode and the conductive resin layer not electrically connected to the second outermost inner electrode overlap.

10. The electronic component according to any one of claims 7 to 9, wherein The conductive resin layer continuously covers a portion of the first side surface, a portion of the second side surface, a portion of the fourth side surface, and a portion of a corresponding end surface of the pair of end surfaces.

11. The electronic component according to any one of claims 1 to 6, wherein The plurality of internal electrodes are respectively located in the first region and separated from one end of the first region that is opposite to the first side surface.

12. The electronic component according to claim 2 or 7, wherein: The plurality of internal electrodes are respectively located in the first region and separated from one end of the first region that is opposite to the third side surface.

13. The electronic component according to any one of claims 1 to 12, wherein The conductive resin layer includes a plurality of silver particles.

14. An electronic component comprising: A body having a rectangular parallelepiped shape and comprising a pair of end faces facing each other and a first side face and a second side face adjacent to the pair of end faces and adjacent to each other; a plurality of external electrodes, each of which is disposed on both ends of the element body in a direction in which the pair of end faces face each other, and each of which includes a conductive resin layer located on the first side surface and the second side surface; a plurality of internal electrodes disposed in the element body and electrically connected to corresponding external electrodes among the plurality of external electrodes; and an electrical insulating film disposed on the element body, The first side has a surface resistivity greater than a surface resistivity of the second side, The electrical insulating film includes a film portion located on a region between the conductive resin layers in the second side.

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