Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction, with the dielectric layer interposed between the first and second internal electrodes; and first and second external electrodes disposed on opposite surfaces of the main body in a second direction perpendicular to the first direction, in which the main body includes a main portion in which the first and second internal electrodes are alternately disposed in the first direction, a first cover portion disposed on one surface of the main portion in the first direction, and a second cover portion disposed on the other surface of the main portion in the second direction, and a second cap portion disposed on the other surface of the main portion in the first direction, one of the first cap portion and the second cap portion including a cap electrode, a size of the cap electrode in the second direction being larger than an average size of the first internal electrode or the second internal electrode in the second direction.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0140707 filed on October 19, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) may be chip capacitors mounted on printed circuit boards of various electronic or automotive products (such as imaging devices including liquid crystal displays (LCDs) or plasma display panels (PDPs), computers, smart phones or mobile phones, on-board chargers (OBCs) for electric vehicles, circuits such as direct current-to-direct current (DC-DC) converters, or infotainment systems) for charging or discharging.

[0004] It is important for MLCC to have low equivalent series inductance (ESL) to operate smoothly in the high frequency region of the resonant frequency or higher. Attempts are being made to connect MLCCs in parallel with each other to reduce the ESL of the MLCC, which may result in a larger mounting area and increased production time.

[0005] Therefore, there is a need for structural improvements that reduce the ESL of multilayer electronic components such as MLCCs. Summary of the invention

[0006] One aspect of the present disclosure provides a multilayer electronic component having a minimum equivalent series inductance (ESL) based on its structure.

[0007] However, the present disclosure is not limited to the above description and may be more easily understood in the description of exemplary embodiments of the present disclosure.

[0008] According to one aspect of the present disclosure, a multilayer electronic component includes: a main body, including a dielectric layer and a first inner electrode and a second inner electrode alternately arranged in a first direction, and the dielectric layer is interposed between the first inner electrode and the second inner electrode; and a first outer electrode and a second outer electrode, which are arranged on opposite surfaces of the main body in a second direction perpendicular to the first direction, wherein the main body includes: a main part, in which the first inner electrode and the second inner electrode are alternately arranged in the first direction, a first cover part, which is arranged on a first surface of the main part in the first direction, and a second cover part, which is arranged on a second surface of the main part in the first direction, the first surface and the second surface are opposite to each other in the first direction, and one of the first cover part and the second cover part includes a cover electrode, the size of the cover electrode in the second direction is larger than the average size of the first inner electrode or the second inner electrode in the second direction, and the cover electrode is closer to the first surface or the second surface of the main part than to the surfaces of the main body opposite to each other in the first direction.

[0009] According to another aspect of the present disclosure, a multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes alternately arranged in a first direction, with the dielectric layer interposed between the first and second internal electrodes; a first external electrode arranged on one of two surfaces of the body opposite to each other in a second direction perpendicular to the first direction, the first external electrode being connected to the first internal electrode; and a second external electrode arranged on the other of the two surfaces of the body opposite to each other in the second direction, the second external electrode being connected to the second internal electrode, wherein the body includes: a main portion in which the first and second internal electrodes are alternately arranged in the first direction, a first cover portion arranged on a first surface of the main portion in the first direction, and a second cover portion arranged on a second surface of the main portion in the first direction, the first surface and the second surface being opposite to each other in the first direction, the first cover portion including a first cover electrode having a size in the second direction larger than an average size of the first or second internal electrode in the second direction, and the second cover portion including a second cover electrode having a size in the second direction larger than the average size of the first or second internal electrode in the second direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0011] Figure 1 is a perspective view schematically showing a multilayer electronic component according to an exemplary embodiment or another exemplary embodiment of the present disclosure;

[0012] Figure 2 According to an exemplary embodiment of the present disclosure Figure 1 A cross-sectional view of a multilayer electronic component taken along line II' in FIG.

[0013] Figure 3 It is along Figure 1 A cross-sectional view of a multilayer electronic component according to another exemplary embodiment of the present disclosure taken along line II';

[0014] Figure 4 yes Figure 3 Enlarged view of the middle P region;

[0015] Figure 5 is along Figure 1 A cross-sectional view taken along line II-II';

[0016] Figure 6 is an exploded perspective view showing the structure of a main body according to an exemplary embodiment;

[0017] Figure 7 is a perspective view showing a multilayer electronic component mounted on a substrate according to an exemplary embodiment or another exemplary embodiment of the present disclosure;

[0018] Fig. 8A A multilayer electronic component mounted on a substrate according to an exemplary embodiment of the present disclosure is Figure 7 A cross-sectional view taken along line III-III';

[0019] Figure 8B A multilayer electronic component mounted on a substrate according to another exemplary embodiment of the present disclosure is Figure 7 A cross-sectional view taken along line III-III';

[0020] Fig.9A is a schematic diagram showing a current conduction path of a multilayer electronic component according to a comparative example;

[0021] Fig. 9B is a schematic diagram showing a current conduction path of a multilayer electronic component according to an exemplary embodiment of the present disclosure;

[0022] Fig.10 is a perspective view schematically illustrating a multilayer electronic component according to an exemplary embodiment;

[0023] Fig.11 is a cross-sectional view of a multilayer electronic component in a first direction and a second direction according to an exemplary embodiment; and

[0024] Fig.12 is a cross-sectional view of a multilayer electronic component in a first direction and a second direction according to an exemplary embodiment. DETAILED DESCRIPTION

[0025] Exemplary embodiments of the present disclosure will now be described in detail below with reference to the accompanying drawings. Exemplary embodiments of the present disclosure may be modified in many different forms, and the scope of the present disclosure should not be limited to the exemplary embodiments set forth herein. In addition, exemplary embodiments of the present disclosure are provided to more fully explain the present disclosure to those skilled in the art. Therefore, in the accompanying drawings, shapes and sizes may be exaggerated for clarity, and the same reference numerals are used to represent the same or similar components.

[0026] Further, in the accompanying drawings, in order to clearly describe the present disclosure, parts that are not related to the description will be omitted, and for ease of explanation, the size and thickness of each component shown in the accompanying drawings are arbitrarily shown. Therefore, the present disclosure is not necessarily limited to the contents shown in the accompanying drawings. In addition, within the scope of the present disclosure, throughout the accompanying drawings, the same reference numerals will be used to designate the same components with similar functions. In addition, throughout the specification, when an element "includes" another component, it should be understood that, unless explicitly described to the contrary, the element may further include a third component without excluding the third component.

[0027] In the drawings, in the second direction and the third direction perpendicular to the first direction, the first direction may be defined as a thickness T direction or a direction in which the first internal electrode 121 and the second internal electrode 122 are alternately arranged with a dielectric layer interposed therebetween, the second direction may be defined as a length L direction, and the third direction may be defined as a width W direction.

[0028] Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an exemplary embodiment or another exemplary embodiment of the present disclosure.

[0029] Figure 2 According to an exemplary embodiment of the present disclosure Figure 1 A cross-sectional view of a multilayer electronic component taken along line II' in FIG.

[0030] Figure 3 is along Figure 1 0 is a cross-sectional view of a multilayer electronic component according to another exemplary embodiment of the present disclosure, taken along line II′ in FIG.

[0031] Figure 4 yes Figure 3 Magnified view of the P region.

[0032] Figure 5 It is along Figure 1 A cross-sectional view taken along line II-II'.

[0033] Figure 6 is an exploded perspective view illustrating a structure of a main body according to an exemplary embodiment.

[0034] Figure 7 is a perspective view illustrating a multilayer electronic component mounted on a substrate according to an exemplary embodiment or another exemplary embodiment of the present disclosure.

[0035] Fig. 8A A multilayer electronic component mounted on a substrate according to an exemplary embodiment of the present disclosure is provided along Figure 7 A cross-sectional view taken along line III-III'.

[0036] Figure 8B A multilayer electronic component mounted on a substrate according to another exemplary embodiment of the present disclosure is provided along Figure 7 A cross-sectional view taken along line III-III'.

[0037] Fig.9A is a schematic diagram illustrating a current conduction path of a multilayer electronic component according to a comparative example.

[0038] Fig. 9B is a schematic diagram illustrating a current conduction path of a multilayer electronic component according to an exemplary embodiment of the present disclosure.

[0039] Fig.10 is a perspective view schematically illustrating a multilayer electronic component according to an exemplary embodiment.

[0040] Fig.11 is a cross-sectional view of a multilayer electronic component in a first direction and a second direction according to an exemplary embodiment.

[0041] Fig.12 is a cross-sectional view of a multilayer electronic component in a first direction and a second direction according to an exemplary embodiment.

[0042] In the following, the instructions refer to Figures 1 to 12 A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure, a multilayer electronic component 100 ′ according to another exemplary embodiment, and various exemplary embodiments thereof are described in detail.

[0043] A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may include: a main body, including a dielectric layer and first and second internal electrodes alternately arranged in a first direction, with the dielectric layer interposed between the first and second internal electrodes; and first and second external electrodes arranged on opposite surfaces of the main body in a second direction perpendicular to the first direction, wherein the main body includes a main part, a first cover part, and a second cover part, in which the first and second internal electrodes are alternately arranged in the first direction, the first cover part is arranged on one surface of the main part in the first direction, and the second cover part is arranged on another surface of the main part in the first direction, one of the first cover part and the second cover part includes a cover electrode having a size in the second direction that is larger than an average size of the first or second internal electrode in the second direction, and the cover electrode is closer to one or the other surface of the main part in the first direction than to the opposite surfaces of the main body in the first direction.

[0044] A multilayer electronic component 100' according to another exemplary embodiment of the present disclosure may include: a body including a dielectric layer and first and second internal electrodes alternately arranged in a first direction, with the dielectric layer interposed between the first and second internal electrodes; a first external electrode arranged on one of two surfaces of the body opposite to each other in a second direction perpendicular to the first direction and connected to the first internal electrode; and a second external electrode arranged on the other of the two surfaces of the body opposite to each other in the second direction and connected to the second internal electrode, wherein the body includes a main part, a first cover part, and a second cover part, in which the first and second internal electrodes are alternately arranged in the first direction, the first cover part is arranged on one surface of the main part in the first direction, and the second cover part is arranged on the other surface of the main part in the first direction, the first cover part includes a first cover electrode having a size (or average size) in the second direction larger than an average size of the first or second internal electrode in the second direction, and the second cover part includes a second cover electrode having a size (or average size) in the second direction larger than an average size of the first or second internal electrode in the second direction.

[0045] In the following, reference is made to Figures 1 to 6 , the specification describes in detail exemplary embodiments of a multilayer electronic component 100 applied to an exemplary embodiment according to the present disclosure and a multilayer electronic component 100 ′ according to another exemplary embodiment.

[0046] The body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged in a first direction, with the dielectric layer 111 interposed between the internal electrodes 121 and 122. The body 110 is not particularly limited to a specific shape and may have a hexahedral shape or a shape similar to a hexahedral shape, as shown in the drawings. Since the ceramic powder included in the body 110 shrinks or its edges are polished during the process of sintering the body, the body 110 may not have a hexahedral shape with perfect straight lines. However, the body 110 may substantially have a hexahedral shape.

[0047] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 opposite to each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 opposite to each other in a third direction perpendicular to the first direction and the second direction.

[0048] The plurality of dielectric layers 111 included in the body 110 may have been sintered, and thus adjacent dielectric layers 111 may be integrated with each other, making it difficult to confirm the boundary between them without using a scanning electron microscope (SEM). The number of stacked dielectric layers does not need to be particularly limited and may be determined in consideration of the size of the ceramic electronic component. For example, the body may be formed by stacking 300 or more dielectric layers.

[0049] The raw materials included in the dielectric layer 111 may be changed based on the purpose of the multilayer electronic component. Specifically, the multilayer electronic component may use ferroelectric barium titanate (BaTiO3) as a material for the main purpose of achieving a higher capacitance per unit volume thereof, and use paraelectric calcium zirconate (CaZrO 3 ) as a material for the main purpose of ensuring improved reliability in a high-temperature environment. Examples of BaTiO 3 -based materials may be BaTiO 3 or (Ba 3 Ca 1-x )TiO x in which calcium (Ca), zirconium (Zr), etc. are partially solid-solved in BaTiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1). CaZrO3 An example of a base material may be (Ca 1-x Sr x )(Zr 1-y Ti y ) 3 (0 <x<1,0<y<1)。

[0050] The average thickness td of the dielectric layer 111 is not particularly limited.

[0051] For miniaturization and higher capacity of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be less than or equal to 0.35 μm, and the average thickness td of the dielectric layer 111 may be greater than or equal to 2 μm to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure. The average thickness td of the dielectric layer 111 according to the present disclosure will be described below.

[0052] The average thickness td of the dielectric layer 111 may mean an average thickness of the dielectric layer 111 disposed between the first and second internal electrodes 121 and 122 .

[0053] The average thickness td of the dielectric layer 111 can be measured by scanning an image of a cross section (or L direction-T direction cross section) of the body 110 in the second direction and the first direction using a scanning electron microscope (SEM). Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art may be used.

[0054] For example, the average thickness td of the dielectric layer 111 may be an average value obtained by, in a dielectric layer extracted from an image of a cross section of the body 110 in the length direction-thickness direction (or L direction-T direction cross section) cut from the center of the body 110 in the width direction, centering on a dielectric layer of one layer disposed at a point where a center line of the body in the length direction and a center line of the body in the thickness direction intersect each other, in a dielectric layer having a total of five layers including the dielectric layer and two upper layers and two lower layers, after taking as a reference point the point where a center line of the body in the length direction and a center line of the body in the thickness direction intersect each other and then determining five equally spaced points including the reference point and two points on the left and two points on the right with the reference point as the center, measuring their thicknesses at five equally spaced points. An image of the cross section of the body 110 may be obtained by a scanning electron microscope (SEM).

[0055] like Figure 2 As shown, the internal electrodes 121 and 122 may be alternately disposed while the dielectric layer 111 is interposed between the internal electrodes 121 and 122 in the first direction.

[0056] The internal electrodes 121 and 122 may be divided into a first internal electrode 121 and a second internal electrode 122. The first internal electrodes 121 and the second internal electrodes 122 may be alternately disposed opposite to each other with the dielectric layer 111 interposed therebetween, and the first internal electrodes 121 and the second internal electrodes 122 may be in contact with the third surface 3 and the fourth surface 4 of the body 110, respectively, to be connected to external electrodes 130 and 140 described below.

[0057] Reference Figure 2 , the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3 , and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4 .

[0058] Here, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 interposed therebetween.

[0059] Reference Figure 5 The body 110 may be formed by alternately stacking ceramic green sheets having the first internal electrodes 121 formed thereon and ceramic green sheets having the second internal electrodes 122 formed thereon and then sintering them.

[0060] The material included in the internal electrode 121 or 122 is not particularly limited, and a material having excellent conductivity may be used. For example, the internal electrode 121 or 122 may be formed by printing a conductive paste for an internal electrode including at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet.

[0061] A method of printing the conductive paste for the internal electrode may be a screen printing method, a gravure printing method, or the like, and is not limited thereto.

[0062] The average thickness te of the internal electrode 121 or 122 is not particularly limited and may be changed based on the purpose. The average thickness te of the internal electrode 121 or 122 may be less than or equal to 0.35 μm to achieve miniaturization of the multilayer electronic component 100, and the average thickness te of the internal electrode 121 or 122 may be greater than or equal to 3 μm to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure.

[0063] The average thickness te of the internal electrode 121 or 122 may be an average value obtained by: in an internal electrode extracted from an image of a cross section of the main body 110 in the length direction-thickness direction (or L direction-T direction cross section) cut from the center of the main body 110 in the width direction, with an internal electrode of one layer disposed at a point where the center line of the main body in the length direction and the center line of the main body in the thickness direction intersect each other as the center, in an internal electrode having a total of five layers including the internal electrode and the upper two layers and the lower two layers, after making the point where the center line of the main body in the length direction and the center line of the main body in the thickness direction intersect each other as a reference point and then determining five equally spaced points including the point and two points on the left and two points on the right with the reference point as the center, measuring their thicknesses at the five equally spaced points. An image of the cross section of the main body 110 may be obtained by a scanning electron microscope (SEM).

[0064] The body 110 may include a main portion M, which is a region where the dielectric layer 111 and the internal electrode 121 or 122 are alternately disposed in the first direction. In addition, the main portion M may be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0065] In addition, the main portion M can be divided into a capacitor forming portion and a longitudinal edge portion, wherein the capacitor forming portion is a region where the first internal electrode 121 and the second internal electrode 122 overlap with each other in the first direction, and the longitudinal edge portion is a region where the first internal electrode 121 and the second internal electrode 122 do not overlap with each other in the first direction.

[0066] Reference Figure 5 , the cover parts C1 and C2 may be respectively disposed on one surface and the other surface of the main part M in the first direction. The cover part may include a first cover part C1 disposed on one surface of the main part M in the first direction and a second cover part C2 disposed on the other surface of the main part M in the first direction.

[0067] The cover portion C1 or C2 may serve to prevent damage to the inner electrode caused by physical stress or chemical stress and to improve the strength of the multilayer electronic component 100 .

[0068] The cap portion C1 or C2 may include the same material as the dielectric layer 111 without including the first internal electrode 121 or the second internal electrode 122, and may be formed by stacking one dielectric layer or two or more dielectric layers on the upper surface (one surface) and the lower surface (the other surface) of the main portion M in the thickness direction, respectively. However, the component of the cap portion is not limited to the same component as the dielectric layer 111 of the main portion M, and may include a component different from the dielectric layer 111 of the main portion M.

[0069] The cover portion C1 or C2 may include a cover electrode 121' or 122', which has a size in the second direction larger than an average size of the first or second internal electrodes in the second direction, instead of the first or second internal electrodes 121 or 122. The cover electrode 121' or 122' will be described in detail below.

[0070] The average thickness of the cover portion C1 or C2 is not particularly limited. In order to achieve miniaturization and high capacity of the multilayer electronic component, the average thickness of the cover portion C1 or C2 may be equal to or less than 15 μm.

[0071] The average thickness of the cover portion C1 or C2 may refer to the size of the cover portion C1 or C2 in the first direction, and may be the average value of the size of the cover portion C1 or C2 in the first direction measured at five equally spaced points on the top or bottom of the main portion M.

[0072] Reference Figure 5 , the edge portions 114 and 115 may be respectively disposed on one surface and the other surface of the main portion M in the third direction.

[0073] The edge portions 114 and 115 may include an edge portion 114 disposed on one surface of the main portion M in the third direction and an edge portion 115 disposed on the other surface of the main portion M in the third direction. That is, the edge portions 114 and 115 may be disposed on both surfaces of the main portion in the width direction.

[0074] like Figure 5 As shown, the edge portion 114 or 115 may represent the area between the two ends of the internal electrode 121 or 122 and the boundary surface of the main body 110 in a cross section of the main body 110 in the width direction-thickness direction (or W direction-T direction cross section) cut at the center of the main body 110 along the length (L) direction.

[0075] The edge portion 114 or 115 may mainly serve to prevent damage to the inner electrode caused by physical stress or chemical stress.

[0076] The edge portion 114 or 115 may be formed by not coating the conductive paste on a portion of the ceramic green sheet except for a portion where the internal electrode is to be formed.

[0077] Optionally, in order to suppress steps caused by the internal electrode 121 or 122, the edge portion 114 or 115 can be formed by cutting the stacked dielectric layer 111 and the internal electrodes 121 and 122 to expose one surface and the other surface of the main portion M in the width direction, and then stacking a dielectric layer or two or more dielectric layers on one surface and the other surface of the main portion M in the width direction.

[0078] In addition, the width of the edge portion 114 or 115 may not be particularly limited. However, the average width of the edge portion 114 or 115 may be less than or equal to 15 μm to more easily achieve miniaturization and higher capacitance of the multilayer electronic component.

[0079] The average width of the edge portion 114 or 115 may refer to the average size of the edge portion 114 or 115 in the third direction, and may be the average value of the size of the edge portion 114 or 115 in the third direction measured at five equally spaced points on one surface or the other surface of the main portion M.

[0080] Reference Figures 1 to 3 , the external electrodes 130 and 140 may be disposed on the body 110 .

[0081] In detail, when the second direction refers to a direction perpendicular to the first direction, the external electrodes 130 and 140 may be respectively disposed on one surface 3 and the other surface 4 of the body 110 that are opposite to each other in the second direction.

[0082] Here, the external electrodes 130 and 140 may include a first external electrode 130 and a second external electrode 140, the first external electrode 130 is arranged on a third surface 3 of the two surfaces of the main body 110 opposite to each other in the second direction and connected to the first internal electrode 121, and the second external electrode 140 is arranged on a fourth surface 4 of the two surfaces of the main body 110 opposite to each other in the second direction and connected to the second internal electrode 122.

[0083] like Figures 1 to 3 As shown, the external electrodes 130 and 140 may be respectively disposed on a third surface 3 and a fourth surface 4 which are one surface and another surface opposite to each other in the second direction of the body 110, and may include a first external electrode 130 connected to the first internal electrode 121 and a second external electrode 140 connected to the second internal electrode 122.

[0084] This exemplary embodiment describes that the multilayer electronic component 100 includes two external electrodes 130 and 140. However, the number, shape, etc. of the external electrodes may be changed based on the shape of the internal electrode 121 or 122 or other purposes.

[0085] In addition, the external electrode 130 or 140 may be made of any material having conductivity such as metal, use of a specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may have a multi-layered structure.

[0086] For example, the external electrode 130 or 140 may include an electrode layer disposed on the body 110 and a plating layer formed on the electrode layer.

[0087] For a more specific example of the electrode layer, the electrode layer may be a sintered electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and resin.

[0088] In addition, the electrode layer may include a sintered electrode and a resin-based electrode sequentially formed on the body. In addition, the electrode layer may be formed by transferring a sheet containing a conductive metal to the body or by transferring a sheet containing a conductive metal to the sintered electrode.

[0089] The conductive metal included in the electrode layer may use a material having excellent conductivity, and is not particularly limited. For example, the conductive metal may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0090] The plating layer may include at least one of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, or may include a plurality of layers.

[0091] For a more specific example of the plating layer, the plating layer may be a nickel (Ni) plating layer or a tin (Sn) plating layer, and may have a nickel (Ni) plating layer and a tin (Sn) plating layer sequentially formed on the electrode layer, or a tin (Sn) plating layer, a nickel (Ni) plating layer, and a tin (Sn) plating layer sequentially formed on the electrode layer. In addition, the plating layer may include a plurality of Ni plating layers or a plurality of Sn plating layers.

[0092] The size of the multilayer electronic component 100 or 100 ′ may not be particularly limited.

[0093] The multilayer electronic component 100 or 100' may have a size of 0201 (i.e., 0.2 mm x 0.1 mm in length x width) or smaller to achieve both miniaturization and higher capacity. For products where reliability is important under high temperature and high pressure environments, the multilayer electronic component 100 may have a size of 3225 (i.e., 3.2 mm x 2.5 mm in length x width) or larger, and the size of the multilayer electronic component is not limited thereto.

[0094] Here, the length of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component in the third direction. The maximum dimension of the multilayer electronic component 100 in each of the second direction and the third direction may be measured by a scanning electron microscope (SEM) or an optical microscope. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used.

[0095] Reference Figure 7 as well as Fig. 8A and Figure 8B , Figure 7A mounting board 1100 is shown on which a multi-layer electronic component 100 or 100' is mounted. Fig. 8A and Figure 8B According to an exemplary embodiment, a Figure 7 In a cross section taken along line III-III′ in FIG. 1 , the multilayer electronic component 100 or 100 ′ may be bonded to the substrate 180 through electrode pads 181 and 182 and solders 191 and 192 provided on the substrate 180 .

[0096] Reference Fig. 8A , the cover electrode 122' may be closest to the substrate 180, and refer to Figure 8B , the second cover electrode 122 ′ may be closest to the substrate 180 . Figure 8B A multilayer electronic component 100 ′ according to another exemplary embodiment shown in FIG. 1 can achieve the effects of the present disclosure regardless of its mounting direction, which will be described below.

[0097] Hereinafter, the specification classifies and describes in detail a multilayer electronic component 100 according to an exemplary embodiment of the present disclosure and a multilayer electronic component 100 ′ according to another exemplary embodiment.

[0098] Reference Figure 2 , a body 110 of a multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may include: a main portion M in which first internal electrodes 121 and second internal electrodes 122 are alternately arranged in a first direction; a first cover portion C1 arranged on one surface of the main portion in the first direction; and a second cover portion C2 arranged on the other surface of the main portion in the first direction, and one of the first cover portion and the second cover portion may include a cover electrode 122' having an average size in the second direction that is larger than that of the first internal electrode or the second internal electrode.

[0099] Here, the cover electrode may be closer to one surface or the other surface of the main portion in the first direction than to first surface 1 and second surface 2 which are surfaces of the main body that are opposite to each other in the first direction.

[0100] Reference Figure 4 , Figure 4 yes Figure 2 As shown in the enlarged view of the P region in FIG. 1 , the cover electrode 122 ′ may extend a certain distance S from a straight line connecting the ends of the inner electrodes 122 to each other.

[0101] The inductance L of a rectangular parallelepiped conductor with length l (mm), width w (mm) and thickness t (mm) can be expressed as follows:

[0102] [Formula 1]

[0103]

[0104] That is, it can be seen that the inductance L of the conductor having a rectangular parallelepiped shape may have a faster change based on a change in its length than based on a change in its width or thickness.

[0105] Therefore, a high-frequency voltage having a resonant frequency or higher can be applied to the multilayer electronic component, and current can flow along the lowest layer in the stacking direction, where the length of the current conduction path is the shortest, and the inductance on the path can be used as the impedance of the multilayer electronic component.

[0106] Therefore, in the main body 110 in the exemplary embodiment of the present disclosure, one of the first cover part and the second cover part may include a cover electrode 122', the size of the cover electrode 122' in the second direction may be larger than the average size of the first internal electrode or the second internal electrode in the second direction, and the cover electrode may be closer to one surface or the other surface of the main part opposite to each other in the first direction than the surfaces of the main body opposite to each other in the first direction to form a shortened current conduction path, thereby reducing the equivalent series inductance (ESL) of the multilayer electronic component.

[0107] In detail, in a comparative example in which the size of the cover electrode 122' in the second direction is not greater than the average size of the inner electrode 121 or 122 in the second direction, the current may flow along Fig.9A On the other hand, in an exemplary embodiment where the size of the cover electrode 122' in the second direction is adjusted to be larger than the average size of the inner electrode 121 or 122 in the second direction, the current may flow along Fig. 9B The current conduction path C shown in FIG.

[0108] When a high-frequency voltage having a resonance frequency or higher is applied to the multilayer electronic component according to the comparative example, the current conduction path C' may include the inner electrode of the lowermost layer. However, the current conduction path C' may not pass through the entire lowermost layer, and may have some sections where the path passes through the inner electrode of the lowermost layer, and some sections where the path passes through the inner electrode of the upper layer adjacent thereto.

[0109] On the other hand, the current conduction path C may be a path that passes through the entire cover electrode when a high-frequency voltage having a resonant frequency or higher is applied to the multilayer electronic component according to the exemplary embodiment. Therefore, the multilayer electronic component according to the exemplary embodiment may have a shorter current conduction path than the multilayer electronic component according to the comparative example, thereby reducing the ESL of the multilayer electronic component.

[0110] In addition, a material included in the cover electrode 122 ′ is not particularly limited and may include the same conductive metal as the internal electrode 121 or 122 , and the cover electrode 122 ′ may be formed using the same method as the method of forming the internal electrode 121 or 122 .

[0111] In addition, in an exemplary embodiment, the cover electrode 122' may be connected to only one of the first external electrode 130 and the second external electrode 140. Therefore, the current conduction path of the multilayer electronic component 100 can be effectively shortened.

[0112] In addition, a plurality of internal electrodes 121 or 122 may be provided, and the sizes of the internal electrodes 121 and 122 in the second direction may be substantially the same as each other. Specifically, the size difference between the plurality of internal electrodes 121 and 122 in the second direction may be less than or equal to 10%, and the size difference between the plurality of internal electrodes 121 and 122 in the second direction may be less than or equal to 5%.

[0113] In addition, the size of the cover electrode 122' in the second direction may be appropriately adjusted to effectively form the above-mentioned shortened current conduction path. Referring to Figure 4 , D represents the spacing distance between the cover electrode 122' and the external electrode 130 in the second direction, and td represents the average thickness of the dielectric layer. When D < td, dielectric breakdown may occur at a voltage lower than the withstand voltage of the dielectric layer 111 between the internal electrodes 121 and 122. When D ≥ 2×td, the current conduction path may not be shortened significantly compared to the multilayer electronic component according to the comparative example. Therefore, in an exemplary embodiment, the size of the cover electrode 122' in the second direction may be adjusted to satisfy td ≤ D < 2×td, thereby preventing a lower withstand voltage while reducing the ESL of the multilayer electronic component 100.

[0114] In addition, when the average thickness of the cover electrode 122' is less than the average thickness te of the internal electrode, the ESL may not be reduced sufficiently. Therefore, in an exemplary embodiment, the average thickness of the cover electrode 122' may be equal to or greater than the average thickness of the internal electrode 121 or 122. In addition, the upper limit value of the average thickness of the cover electrode 122' is not particularly limited and may vary based on the required characteristics of the multilayer electronic component 100.

[0115] In addition, as in the exemplary embodiment of the present disclosure, the lower ESL that can be obtained when the main body 110 includes the cover electrode 122' can be improved as the dielectric layer 111 becomes thicker. Specifically, the average thickness td of the dielectric layer 111 may be greater than or equal to 2 μm, thereby further reducing the ESL of the multilayer electronic component according to the present disclosure. The upper limit value of the average thickness td of the dielectric layer 111 is not particularly limited and may vary based on the size of the multilayer electronic component 100.

[0116] In addition, as in the exemplary embodiment of the present disclosure, in the case where the multilayer electronic component 100 has a reverse geometric capacitor structure, the lower ESL that can be obtained when the main body includes the cover electrode 122' can be more significantly improved. Specifically, as Fig.10As shown, when the maximum dimension of the multilayer electronic component 100 ″ in the third direction (W direction) is greater than its maximum dimension in the second direction (L direction), the current conduction path can be significantly shortened.

[0117] In addition, as in the exemplary embodiment of the present disclosure, in the case where the multilayer electronic component 100 has a smaller size, the lower ESL that can be obtained when the body includes the cover electrode 122' can be more significantly improved. In detail, when the multilayer electronic component 100 has a size of 1005 or less, the effect of shortening the current conduction path can be further improved. Here, the size 1005 may refer to the case where the length×width=1.0mm×0.5mm, and the maximum size in the second direction (L direction)×the maximum size in the third direction (W direction)=1.0mm×0.5mm.

[0118] Reference Figure 3 , a body 110 of a multilayer electronic component 100' according to another exemplary embodiment of the present disclosure may include a first internal electrode 121 and a second internal electrode 122, and external electrodes 130 and 140 disposed on the body may include a first external electrode 130 connected to the first internal electrode 121 and a second external electrode 140 connected to the second internal electrode 122.

[0119] Here, the body 110 may include a main portion M in which the first and second internal electrodes are alternately arranged in the first direction, a first cover portion C1 arranged on one surface of the main portion in the first direction, and a second cover portion C2 arranged on the other surface of the main portion in the first direction, and the first cover portion may include a first cover electrode 121' having a size in the second direction larger than an average size of the first or second internal electrode in the second direction, and the second cover portion may include a second cover electrode 122' having a size in the second direction larger than an average size of the first or second internal electrode in the second direction. Accordingly, a shortened current conduction path may be formed, thereby not only reducing the ESL of the multilayer electronic component, but also reducing the ESL regardless of the mounting direction of the multilayer electronic component.

[0120] In addition, in an exemplary embodiment, the first cover electrode 121' may be connected to the first external electrode 130 and spaced apart from the second external electrode 140, and the second cover electrode 122' may be connected to the second external electrode 140 and spaced apart from the first external electrode 130. Therefore, the current conduction path of the multilayer electronic component 100' can be effectively shortened.

[0121] Reference Figure 4 , Figure 4 yes Figure 3 As shown in the enlarged view of the P region in FIG. 1 , the second cover electrode 122 ′ may extend a certain distance S from a straight line connecting ends of the second internal electrode 122 to each other. Figure 3The second cover electrode 122' is shown. However, the first cover electrode 121' may also extend a specific distance from a straight line connecting the ends of the first inner electrodes 121 to each other.

[0122] In addition, a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 may be provided separately, and the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122 may have substantially the same dimensions in the second direction. Specifically, each dimensional difference between the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122 in the second direction may be less than or equal to 10%, and each dimensional difference between the plurality of first inner electrodes 121 and the plurality of second inner electrodes 122 in the second direction may be less than or equal to 5%.

[0123] In addition, the dimension of the second cover electrode 122' in the second direction may be appropriately adjusted to effectively form the above-mentioned shortened current conduction path. Refer to Figure 4 , where D represents the spacing distance between the second cover electrode 122' and the first outer electrode 130 in the second direction, and td represents the average thickness of the dielectric layer. When D < td, dielectric breakdown may occur at a voltage lower than the withstand voltage of the dielectric layer 111 between the inner electrodes 121 and 122. When D ≥ 2 × td, the current conduction path may not be shortened significantly compared to the multilayer electronic component according to the comparative example. Therefore, in the exemplary embodiment, the dimension of the cover electrode 122' in the second direction may be adjusted to satisfy td ≤ D < 2 × td, thereby preventing a lower withstand voltage while reducing the ESL of the multilayer electronic component 100'.

[0124] The spacing distance D can be measured by scanning an image of the cross-section of the main body 110 in the length direction - thickness direction (or L direction - T direction cross-section) using a scanning electron microscope (SEM). Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art can be used.

[0125] In addition, when the average thickness of the second cover electrode 122' is less than the average thickness te of the inner electrode, the ESL may not be reduced sufficiently. Therefore, in the exemplary embodiment, the average thickness of the first cover electrode 121' or the second cover electrode 122' may be equal to or greater than the average thickness of the first inner electrode 121 or the second inner electrode 122. In addition, the upper limit value of the average thickness of the first cover electrode 121' or the second cover electrode 122' is not particularly limited and may vary based on the required characteristics of the multilayer electronic component 100'.

[0126] In addition, as in the exemplary embodiment of the present disclosure, the lower ESL that can be obtained when the body 110 includes the first cover electrode 121' and the second cover electrode 122' can be improved as the dielectric layer 111 is thicker. In detail, the average thickness td of the dielectric layer 111 can be greater than or equal to 2μm, thereby further reducing the ESL of the multilayer electronic component according to the present disclosure. The upper limit value of the average thickness td of the dielectric layer 111 is not particularly limited and can be changed based on the size of the multilayer electronic component 100'.

[0127] In addition, as in the exemplary embodiment of the present disclosure, in the case where the multilayer electronic component 100' has a reverse geometry capacitor structure, the lower ESL that can be obtained when the body includes the first cover electrode 121' and the second cover electrode 122' can be more significantly improved. Fig.10 As shown, when the maximum dimension of the multilayer electronic component 100 ″ in the third direction (W direction) is greater than its maximum dimension in the second direction (L direction), the current conduction path can be significantly shortened.

[0128] In addition, as in the exemplary embodiment of the present disclosure, in the case where the multilayer electronic component 100' has a smaller size, the lower ESL that can be obtained when the body includes the first cover electrode 121' and the second cover electrode 122' can be more significantly improved. In detail, when the multilayer electronic component 100' has a size of 1005 or less, the effect of shortening the current conduction path can be further improved. Here, the size 1005 may refer to the case where the length × width = 1.0 mm × 0.5 mm, and the maximum size in the second direction (L direction) × the maximum size in the third direction (W direction) = 1.0 mm × 0.5 mm.

[0129] In addition, an example of a method of measuring the size of the first cover electrode 121' or the second cover electrode 122' in the second direction, the average size of the inner electrode 121 or 122 in the second direction, and the thickness of the first cover electrode 121' or the second cover electrode 122' may be a method of measuring an image of a cross section (L direction-T direction cross section) of the body 110 in the length direction-thickness direction cut from the center of the body 110 in the width direction, the image being obtained by a scanning electron microscope (SEM). Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art may be used.

[0130] In detail, in the case of the first cover electrode 121' or the second cover electrode 122', the size of the area where the cover electrode 121' or 122' is formed in the second direction can be measured in the above image, and in the case of the inner electrode 121 or 122, its average size in the second direction can be an average value obtained by measuring their sizes at five equally spaced points after making the point where the center line of the body in the length direction and the center line of the body in the thickness direction intersect each other as a reference point and then determining five equally spaced points including the reference point and two upper points and two lower points with the reference point as the center.

[0131] In addition, the average thickness of the first cover electrode 121 ′ or the second cover electrode 122 ′ may be measured in the same manner as the average thickness of the internal electrode 121 or 122 .

[0132] Fig.11 1 is a cross-sectional view of a multilayer electronic component 100 - 1 in a first direction and a second direction according to an exemplary embodiment.

[0133] Reference Fig.11 According to the exemplary embodiment, one of the first cover portion C1 and the second cover portion C2 including the cover electrode 122' of the multilayer electronic component 100-1 may further include one or more additional cover electrodes 122' arranged outside the cover electrode 122' in the first direction. The additional cover electrode 122' may be arranged outside the cover portion C2 including the cover electrode 122' in the first direction, thereby improving the strength and moisture resistance reliability of the multilayer electronic component 100-1.

[0134] Here, in exemplary embodiments, the cover electrode may be connected to only one of the first and second external electrodes, and the additional cover electrode may be connected to only the same external electrode as the external electrode to which the cover electrode is connected.

[0135] Fig.11 It is shown that when the second cover portion C2 includes the second cover electrode 122', the second additional cover electrode 122' is arranged on the outside compared to the second cover electrode 122' in the first direction. However, when the first cover portion C1 includes the first cover electrode 121', the first cover portion C1 may also include the first additional cover electrode 121' arranged on the outside compared to the first cover electrode 121' in the first direction.

[0136] One or more additional cover electrodes 122'' may be provided. As the number of additional cover electrodes 122'' increases, the strength and moisture resistance reliability of the multilayer electronic component 100-1 may be further improved.

[0137] The upper limit of the number of additional cover electrodes 122 ″ may not need to be particularly limited, and the upper limit of the number of additional cover electrodes 122 ″ may be determined based on the thickness or design specifications of cover portion C2 .

[0138] Fig.12 1 is a cross-sectional view of a multilayer electronic component 100 ′- 1 in a first direction and a second direction according to an exemplary embodiment.

[0139] Reference Fig.12 According to the exemplary embodiment, the first cover portion C1 of the multilayer electronic component 100'-1 may include a first additional cover electrode 121' arranged on the outside compared to the first cover electrode 121' in the first direction, and the second cover portion C2 may also include a second additional cover electrode 122' arranged on the outside compared to the second cover electrode 122' in the first direction. The first additional cover electrode 121' and the second additional cover electrode 122' may be arranged on the outside compared to the first cover electrode 121' and the second cover electrode 122' in the first direction, respectively, so as to improve the strength and moisture resistance reliability of the multilayer electronic component 100'-1.

[0140] Here, in exemplary embodiments, the cover electrode may be connected to only one of the first and second external electrodes, and the additional cover electrode may be connected to only the same external electrode as the external electrode to which the cover electrode is connected.

[0141] One or more first additional cover electrodes 121 ″ and second additional cover electrodes 122 ″ may be provided. As the number of first additional cover electrodes 121 ″ or second additional cover electrodes 122 ″ increases, the strength and moisture resistance reliability of the multilayer electronic component 100 ′- 1 may be further improved.

[0142] The upper limit of the number of first additional cover electrodes 121 ″ or second additional cover electrodes 122 ″ may not need to be particularly limited and may be determined based on the thickness or design specifications of the first cover portion C1 or the second cover portion C2.

[0143] (Example)

[0144] Table 1 shows the results of calculating the effect of shortening the current conduction path based on the size of the multilayer electronic component 100 by assuming that the average thickness of the dielectric layer is 5 μm.

[0145] To determine whether the current conduction path will be shortened, by comparing Fig.9A The case of following the path along the second direction in the comparative example shown and Fig. 9B The case of following the path along the second direction is shown to calculate each path shortening rate in both cases.

[0146] [Table 1]

[0147]

[0148] Referring to Table 1, it can be seen that the smaller the size of the multilayer electronic component and the smaller the maximum size in the second direction (L direction), the higher the path shortening efficiency.

[0149] Therefore, when the maximum dimension of the multilayer electronic component 100 or 100' in the third direction (W direction) is adjusted to be larger than its maximum dimension in the second direction (L direction), the effect of shortening the current conduction path that can be achieved by introducing the cover electrode 121' or 122' can be further improved.

[0150] As described above, according to exemplary embodiments of the present disclosure, a multilayer electronic component can ensure lower ESL and impedance by shortening a current conduction path by extending the length of an internal electrode adjacent to a mounting surface to be longer than the length of other internal electrodes.

[0151] While exemplary embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and first and second internal electrodes alternately arranged in a first direction, with the dielectric layer interposed between the first and second internal electrodes; as well as A first external electrode and a second external electrode are disposed on opposite surfaces of the body in a second direction perpendicular to the first direction, Wherein, the subject includes: a main portion in which the first internal electrodes and the second internal electrodes are alternately arranged in the first direction, a first cover portion provided on a first surface of the main portion in the first direction, and a second cover portion, disposed on a second surface of the main portion in the first direction, The first surface and the second surface are opposite to each other in the first direction, One of the first cover portion and the second cover portion includes a cover electrode, a size of the cover electrode in the second direction being larger than an average size of the first internal electrode or the second internal electrode in the second direction, and The cover electrode is closer to the first surface or the second surface of the main portion than to surfaces of the main body that are opposed to each other in the first direction.

2. The multilayer electronic component according to claim 1, wherein The one of the first cover portion and the second cover portion including the cover electrode further includes one or more additional cover electrodes disposed farther from a center of the body in the first direction than the cover electrode in the first direction.

3. The multilayer electronic component according to claim 2, wherein: The cover electrode is connected to only one of the first external electrode and the second external electrode, and The additional cover electrode is connected only to the same external electrode as the cover electrode is connected to.

4. The multilayer electronic component according to claim 1, comprising a plurality of first internal electrodes and a plurality of second internal electrodes, and A size difference between the first internal electrode and the second internal electrode in the second direction is less than or equal to 10%.

5. The multilayer electronic component according to claim 1, wherein td≤D≤2×td, wherein D represents a spacing distance between the cover electrode and one of the first and second external electrodes farther from the cover electrode in the second direction, and td represents an average thickness of the dielectric layer.

6. The multilayer electronic component according to claim 1, wherein: An average thickness of the cover electrode is equal to or greater than an average thickness of the first internal electrode and the second internal electrode.

7. The multilayer electronic component according to claim 1, wherein: A maximum dimension of the multilayer electronic component in a third direction is greater than a maximum dimension of the multilayer electronic component in the second direction, and the third direction refers to a direction perpendicular to the first direction and the second direction.

8. The multilayer electronic component according to claim 1, wherein The multilayer electronic component has a size of 1005 or less.

9. The multilayer electronic component according to claim 1, wherein: Only one of the first cover portion and the second cover portion includes the cover electrode.

10. A multilayer electronic component comprising: A body including a dielectric layer and first and second internal electrodes alternately arranged in a first direction, wherein the dielectric layer is interposed between the first and second internal electrodes; a first external electrode disposed on one of two surfaces of the body that are opposite to each other in a second direction perpendicular to the first direction, the first external electrode being connected to the first internal electrode; as well as a second external electrode disposed on the other of the two surfaces of the body opposite to each other in the second direction, the second external electrode being connected to the second internal electrode, Wherein, the subject includes: a main portion in which the first internal electrodes and the second internal electrodes are alternately arranged in the first direction, a first cover portion provided on a first surface of the main portion in the first direction, and a second cover portion, disposed on a second surface of the main portion in the first direction, The first surface and the second surface are opposite to each other in the first direction, The first cover portion includes a first cover electrode, a size of the first cover electrode in the second direction is larger than an average size of the first inner electrode or the second inner electrode in the second direction, and The second cover portion includes a second cover electrode having a size in the second direction larger than the average size of the first internal electrode or the second internal electrode in the second direction.

11. The multilayer electronic component according to claim 10, wherein: The first cover portion further includes one or more first additional cover electrodes disposed farther from a center of the main body in the first direction than the first cover electrode in the first direction, and The second cover portion further includes one or more second additional cover electrodes disposed farther from a center of the main body in the first direction than the second cover electrode in the first direction.

12. The multilayer electronic component according to claim 11, wherein The first cover electrode and the first additional cover electrode are connected to the first outer electrode and are spaced apart from the second outer electrode, and The second cover electrode and the second additional cover electrode are connected to the second external electrode and are spaced apart from the first external electrode.

13. The multilayer electronic component according to claim 10, comprising a plurality of first internal electrodes and a plurality of second internal electrodes, and A size of each of the plurality of first internal electrodes differs from a size of each of the plurality of second internal electrodes by 10% or less in the second direction.

14. The multilayer electronic component according to claim 10, wherein: td≤D≤2×td, wherein D represents a spacing distance between the second cover electrode and one of the first external electrode and the second external electrode farther from the cover electrode in the second direction, and td represents an average thickness of the dielectric layer.

15. The multilayer electronic component according to claim 10, wherein An average thickness of the first cover electrode or the second cover electrode is equal to or greater than an average thickness of the first internal electrode and the second internal electrode.

16. The multilayer electronic component according to claim 10, wherein: A maximum dimension of the multilayer electronic component in a third direction is greater than a maximum dimension of the multilayer electronic component in the second direction, and the third direction refers to a direction perpendicular to the first direction and the second direction.

17. The multilayer electronic component according to claim 10, wherein: The multilayer electronic component has a size of 1005 or less.

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