Wafer position correction device and method

Abstract

The invention provides a wafer position correcting device and method.The correcting device comprises a bearing table, an image collecting unit, a processing unit and a mechanical control unit, the bearing table is used for bearing a wafer box, and the wafer box is used for containing wafers; the image acquisition unit is spaced from the wafer by a preset distance and is used for acquiring a wafer state image; in the processing unit, an edge identification model identifies and collects edge point position information of a wafer and calculates a circle center position and an imaging area of the wafer, a tilting identification model determines whether the wafer tilts, a height identification model determines a height range of the wafer and calculates a height of the wafer, and a highlighting processing model determines a highlighting range of the wafer and calculates a highlighting value of the wafer. The processing unit generates a corresponding correction instruction based on the height or protrusion value of the wafer corresponding to the abnormal position state; and the mechanical control unit corrects the position of the wafer based on the correction instruction. According to the wafer position correction device and method, errors generated by manual correction and damage to the wafer are avoided, and the correction efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer position correction device and method. Background Art

[0002] The machine used to carry wafers may have problems with wafers falling off or being pulled out of the wafer box due to vibration when opening the box or different types of wafer boxes (FOUP) when placing wafers. That is, there will be a "protrusion" problem during the process of opening the box or transferring wafers. The wafer "protrusion" problem means that the position of the wafer in the wafer box has shifted compared to the wafer in the original position in the wafer box. Depending on the different offset positions, the top view of the wafer in the wafer box appears as follows Figure 1 and Figure 2 The two states shown are schematic diagrams of wafer 01 protruding without warping and wafer 01 protruding and warping. When the wafer sliding drift is small, it is manifested as the center position moving; when the wafer sliding is large, it is manifested as the center position moving and warping due to the influence of gravity. In addition, the current wafer flipping machine (Sorter machine) still uses fixed value compensation for robot (Arm) parameters instead of dynamic compensation, and the solution to the wafer "protrusion" problem is engineers visual inspection, manual use of manual tools (HT) to push, or the use of sensors for detection and adjustment, which consumes a lot of time and energy.

[0003] In view of this, there is an urgent need for a wafer position correction device that can accurately identify the position of a wafer that has shifted and correct the position in a short time. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a wafer position correction device and method for solving the problem in the prior art that it is time-consuming and inefficient to correct the wafer position deviation.

[0005] To achieve the above-mentioned and other related purposes, the present invention provides a wafer position correction device, comprising:

[0006] A carrier table, used for carrying a wafer box, wherein the wafer box is used for containing wafers;

[0007] An image acquisition unit is spaced apart from the wafer box by a preset distance, and is used to acquire a state image of the wafer in the wafer box;

[0008] A processing unit receives the state image information of the wafer, performs image information processing based on the state image information, and issues a correction instruction based on the processing result, wherein the processing unit includes an edge recognition model, a warping recognition model, a height recognition model, and a protrusion processing model, wherein the edge recognition model is used to recognize and collect edge point information of the wafer and calculate the center position and imaging area of ​​the wafer, the warping recognition model is used to judge whether the wafer is warped, the height recognition model is used to determine the height range of the wafer and calculate the height of the wafer, and the protrusion processing model is used to determine the protrusion range of the wafer and calculate the protrusion value of the wafer, and the processing unit generates a corresponding correction instruction based on the height or protrusion value of the wafer in the corresponding abnormal position state;

[0009] The mechanical control unit is used to receive the correction instruction output by the processing unit and correct the position of the wafer based on the correction instruction.

[0010] Optionally, the image acquisition unit includes a binocular camera.

[0011] Optionally, the image acquisition unit is further provided with a recognition algorithm model, and the image processing unit processes the state image of the wafer based on the recognition algorithm model.

[0012] Optionally, standard position information of the wafer is also preset in the processing unit, and the standard position information of the wafer includes position state information when the wafer is in the standard position.

[0013] Optionally, a plurality of slots for placing the wafers are provided in the wafer box, and each of the slots is at a different height in the wafer box.

[0014] Optionally, the edge recognition model is obtained by training multiple groups of state images of the wafer in each slot that are collected.

[0015] Optionally, the warping recognition model is obtained by training corresponding to a plurality of groups of different warping states for a plurality of warping conditions of the wafer in each slot.

[0016] Optionally, the height recognition model is obtained by performing corresponding height training of multiple groups of different states on the wafer located in each of the narrow slots.

[0017] Optionally, the protrusion processing model is obtained by training the position states of the wafer under a plurality of different protrusion situations in each slot.

[0018] Optionally, the image acquisition unit is further provided with a first transmission port for transmitting the status image of the wafer; and the mechanical control unit is further provided with a second transmission port for receiving correction instructions.

[0019] Optionally, the abnormal position state of the wafer includes protruding and warping, and protruding and not warping.

[0020] The present invention also provides a wafer position correction method, comprising the following steps:

[0021] Providing a wafer position correction device as described above and starting the device;

[0022] The image acquisition unit acquires a status image of the wafer in the wafer box and sends it to the processing unit;

[0023] The edge recognition model performs preliminary processing based on the state image received by the processing unit to obtain edge point information, center position and imaging area of ​​the wafer, and transmits the preliminary processing result to the warping recognition model;

[0024] The warping recognition model processes the state image received by the processing unit to determine whether the wafer is warped;

[0025] When the warping recognition model determines that the wafer is in a protruding but not warping state, the height recognition model processes based on the state image of the wafer to obtain a first height range of the wafer, the height recognition model processes based on the imaging area of ​​the wafer obtained by the edge recognition model, and compares the processing result with the first height range to obtain the first height of the wafer, the processing unit selects the protrusion processing model at the height based on the first height of the wafer, the protrusion processing model processes based on the state image of the wafer to obtain the protrusion range of the wafer, the protrusion processing model processes based on the center position of the wafer obtained by the edge recognition model, and compares the processing result with the protrusion range to obtain the protrusion value of the wafer, the processing unit generates a first correction instruction based on the protrusion value and the first height value and transmits it to the mechanical control unit, and the mechanical control unit performs a first correction on the position of the wafer based on the first correction instruction to make the wafer in a standard position;

[0026] When the warping recognition model determines that the wafer is in a protruding and warping state, the height recognition model processes based on the state image of the wafer to obtain a second height range of the wafer, the height recognition model processes based on the imaging area of ​​the wafer obtained by the edge recognition model, and compares the processing result with the second height range to obtain the second height of the wafer, the processing unit generates a second correction instruction based on the second height and transmits it to the mechanical control unit, the mechanical control unit performs a second correction on the position of the wafer based on the second correction instruction to make the wafer in a protruding and non-warped state, and returns to the above-mentioned image acquisition and the processing unit processing image steps until the wafer is in the standard position.

[0027] Optionally, the protrusion processing model processes the center position of the wafer obtained based on the edge recognition model and compares the processing result with the protrusion range to obtain the protrusion value of the wafer, including the following steps: the protrusion processing model uses a mathematical algorithm to calculate the difference between the center position of the wafer calculated by the edge recognition model and the corresponding center position in the wafer standard information to obtain a first moving distance in the horizontal direction of the wafer in a protruding and non-warped state, compares the first moving distance with the protrusion range, and obtains the protrusion value of the wafer based on the comparison result.

[0028] Optionally, the height recognition model processes the imaging area of ​​the wafer obtained based on the edge recognition model and compares the processing result with the second height range to obtain the second height of the wafer, including the following steps: the height recognition model uses a mathematical algorithm, and calculates the difference between the height of the wafer corresponding to the imaging area of ​​the wafer calculated by the edge recognition model and the height corresponding to the imaging area of ​​the wafer in the standard position information of the wafer to obtain the straightening height value of the wafer in a protruding and warped state, compares the straightening height value with the second height range, and obtains the second height of the wafer based on the comparison result.

[0029] Optionally, the process of height-adjusting the wafer according to the straightening height value of the wafer in the protruding and tilted state also includes a step of moving the wafer a preset distance in the horizontal direction according to a second moving distance set for the wafer to move in the horizontal direction, so that the wafer is in a protruding and non-tilted state.

[0030] As described above, the wafer correction position and method of the present invention have the following beneficial effects: the state image of the wafer is collected by the image acquisition unit, and the edge recognition model is used to collect the edge position of the wafer and calculate the center position and imaging area of ​​the wafer, and then the warping recognition model is used to judge whether the wafer is warped, the height recognition model is used to determine the height range of the wafer and calculate the height of the wafer, the protrusion processing model is used to determine the protrusion range of the wafer and calculate the protrusion value of the wafer, and the processing unit is based on the height or protrusion value of the wafer in the corresponding protruding warping state or protruding non-warping state. Generate corresponding correction instructions, then use the mechanical control unit to receive the correction instructions output by the processing unit and correct the position of the wafer based on the correction instructions, that is, the wafer position correction device changes the traditional way of using sensors to detect and correct abnormal wafer positions, and uses the image acquisition unit combined with multiple recognition models in the processing unit and the mechanical control unit to detect and dynamically adjust the position of the wafer, thereby improving the recognition accuracy of the position state of the wafer, avoiding damage to the wafer due to manual correction and large errors caused by manual correction, shortening the correction time, and thereby improving the efficiency and accuracy of the wafer position correction. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram showing the state in which the wafer is protruding and not warped in the prior art.

[0032] Figure 2 The figure shows a schematic diagram of a wafer protruding and warping state in the prior art.

[0033] Figure 3 It is a schematic diagram showing the state of the wafer of the present invention being in an initial critical position of protruding and tilting.

[0034] Figure 4 It is a schematic diagram showing the wafer of the present invention in a state where the wafer is at a critical position of protruding and warping and falling off.

[0035] Figure 5 The figure shows a flow chart of the wafer correction device of the present invention correcting a wafer in a protruding and non-warped state.

[0036] Figure 6 It is a schematic diagram showing the process of the wafer correction device of the present invention correcting a wafer in a protruding warped state to a protruding non-warped state.

[0037] Figure 7 It shows a schematic diagram of the image acquisition unit of the present invention acquiring a wafer image.

[0038] Figure 8Another schematic diagram showing the image acquisition unit of the present invention acquiring wafer images.

[0039] Fig. 9 It is a schematic diagram showing a state where the wafer protrusion of the present invention is not lifted.

[0040] Fig.10 It is a schematic diagram showing the wafer protrusion and warping state of the present invention.

[0041] Component number description

[0042] 01 Wafer

[0043] 1 Wafer

[0044] 2 Image acquisition unit DETAILED DESCRIPTION

[0045] The following is a description of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0046] See also Figures 3 to 10 . It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0047] Embodiment 1

[0048] The present embodiment provides a wafer position correction device, comprising: a carrier, an image acquisition unit 2, a processing unit, and a mechanical control unit, wherein the carrier is used to carry a wafer box, and the wafer box is used to hold wafer 1; the image acquisition unit 2 is spaced a preset distance from the wafer box, and the image acquisition unit 2 is used to collect the state image of the wafer 1 in the wafer box; the processing unit receives the state image information of the wafer 1 and performs image information processing based on the state image information and issues a correction instruction based on the processing result; the processing unit includes an edge recognition model, a warping recognition model, a height recognition model, and a protrusion processing model; the edge recognition The identification model is used to identify and collect edge point information of the wafer 1 and calculate the center position and imaging area of ​​the wafer 1, the warping identification model is used to determine whether the wafer 1 is warped, the height identification model is used to determine the height range of the wafer 1 and calculate the height of the wafer, the protrusion processing model is used to determine the protrusion range of the wafer 1 and calculate the protrusion value of the wafer, the processing unit generates a corresponding correction instruction based on the height or protrusion value of the wafer 1 in the corresponding abnormal position state; the mechanical control unit is used to receive the correction instruction output by the processing unit and correct the position of the wafer 1 based on the correction instruction.

[0049] As an example, the wafer box is provided with a plurality of slots for placing the wafer 1, and each slot is at a different height in the wafer box. In this embodiment, the wafer box is provided with 25 slots.

[0050] Specifically, the narrow groove is used to protect the wafer 1 and prevent the wafer 1 from sticking.

[0051] As an example, the abnormal position state of the wafer 1 includes protruding and warping, and protruding and not warping.

[0052] As an example, the image acquisition unit 2 includes a binocular camera or other suitable image acquisition devices.

[0053] Specifically, the image acquisition units 2 are disposed on two opposite sides of the wafer 1 .

[0054] Specifically, the image acquisition unit 2 is located outside the edge of the wafer 1 to ensure that the state image of the wafer 1 can be acquired.

[0055] Specifically, the shape of the state image of the wafer 1 acquired by the image acquisition unit 2 is approximately an arc.

[0056] As an example, the image acquisition unit 2 is further provided with a recognition algorithm model, and the image processing unit processes the state image of the wafer 1 based on the recognition algorithm.

[0057] Specifically, the recognition algorithm model processes the state image of the wafer based on Gaussian filtering or Kalman filtering.

[0058] As an example, the image acquisition unit 2 is also provided with a first transmission port for transmitting the status image of the wafer.

[0059] As an example, the processing unit also presets wafer standard position information, and the wafer standard position information includes position state information of the wafer 1 when it is in the standard position, for example, the center position and imaging area of ​​the wafer when it is in the standard position.

[0060] Specifically, the standard position information of the wafer is obtained by collecting multiple groups of status images of the wafer 1 in the standard position (i.e., without protrusion or warping) by the image acquisition unit 2, and after image processing, the processing unit calculates multiple groups of center positions and imaging area values ​​of the wafer 1, and fits the corresponding standard position information of the wafer based on the status images of each wafer 1.

[0061] Specifically, the edge position information of the wafer 1 is collected through the edge recognition model, and through combination with a mathematical algorithm, the center position and imaging area of ​​the wafer 1 are calculated according to the approximate arc image of the wafer 1.

[0062] As an example, the edge recognition model is obtained by training multiple groups of state images of the wafer 1 in each narrow slot obtained by collection. For example, taking the thirteenth narrow slot (slot13) position in the middle as an example, the wafer 1 in various states is placed in slot13 for multiple times, and the state image of the wafer 1 placed each time is collected by the image acquisition unit 2, and the edge of the wafer 1 in each state image is framed and identified, thereby generating a position model of the wafer 1. After obtaining the approximate circular model, the approximate arc is converted into an arc through the corresponding algorithm, and then different points are collected on the arc (the number of collected points should be greater than or equal to three points to determine the center position and radius of the circle), and then the position information of the wafer 1 (such as the center position of the circle, imaging area and other data range values) is calculated. The range value can obtain the edge recognition model.

[0063] As an example, the warping recognition model is obtained by training corresponding to a plurality of different warping states for a plurality of warping situations of the wafer 1 in each slot.

[0064] Specifically, Figure 3 and Figure 4As shown, there are respectively a schematic diagram of the state of the wafer being in an initial critical position of protruding tilting and a schematic diagram of the state of the wafer being in a critical position of protruding tilting and falling off. By performing multiple sets of position training on the wafer 1 in the range from the initial position of tilting to the critical position of tilting and falling off of the wafer 1, and distinguishing it from the wafer 1 that is not tilted, and then obtaining multiple sets of state image models of the wafer 1 in a tilted state, the tilting recognition model can be obtained.

[0065] Specifically, the warping recognition model determines whether the wafer 1 is in a warped state by determining whether the state image captured of the wafer 1 is circular.

[0066] As an example, the height recognition model is obtained by performing corresponding height training of multiple groups of different states on the wafer 1 located in each of the slots.

[0067] Specifically, by placing the wafer 1 at different heights of the narrow slot, a height recognition model training is performed on the imaging of different positions of the wafer 1 in each of the narrow slots in a protruding and raised state and a protruding and non-raised state, and a plurality of imaging area calculation values ​​of the wafer 1 are obtained, that is, each different state of the narrow slot (multiple states of protruding and non-raised and multiple states of protruding and raised) corresponds to an imaging area calculation value, and each imaging area value corresponds to a height value of the wafer 1. All imaging area calculation values ​​of the protruding and non-raised state or the protruding and raised state of each narrow slot constitute a group of imaging area ranges, and the imaging area range corresponds to the height range of the wafer 1.

[0068] As an example, the protrusion processing model is obtained by training the position status of the wafer 1 in various protrusion situations in each narrow slot. For example, taking the position of slot 13 as an example, the image acquisition unit 2 is used to collect the state image of the wafer 1 placed each time, and the model is trained using the method of the open source platform. The edge of the wafer 1 in the protruding state in each state image is framed and identified, and then the center position of the wafer 1 is calculated. The position status information of the wafer 1 containing a variety of different protrusion situations and different center positions can be obtained, and the protrusion processing model can be obtained.

[0069] Specifically, when the wafer 1 is in a protruding but not warped state, the first height range of the wafer 1 can be determined by the height recognition model based on the state image of the wafer 1. The height recognition model then performs difference calculation between the imaging area of ​​the wafer 1 obtained based on the edge recognition model and the height value corresponding to the imaging area in the wafer standard information, and compares the calculation result with the first height range to obtain the first height of the wafer 1. The processing unit selects the protrusion processing model at the height based on the first height of the wafer 1, and then performs processing based on the state image of the wafer through the protrusion processing model to obtain the protrusion range of the wafer 1. The protrusion processing model then performs difference calculation between the center position of the wafer 1 obtained based on the edge recognition model and the center position in the wafer standard information, and compares the calculation result with the protrusion range, and obtains the protrusion value of the wafer 1 based on the matching of the comparison result.

[0070] Specifically, the first height value is obtained by comparing and matching the calculated height difference value with the first height range, and the protrusion value is obtained by comparing and matching the calculated protrusion value difference value with the protrusion range, thereby preventing misjudgment during the correction process of the wafer 1.

[0071] Specifically, when the wafer 1 is in a protruding and warped state, the second height range of the wafer 1 is determined based on the state image of the wafer 1 through the height recognition model, and the height model is used to calculate the difference between the imaging area of ​​the wafer 1 and the height corresponding to the imaging area in the wafer standard information, and then the obtained difference is compared with the second height range, and the second height value is obtained based on the comparison result. The second height value is used to correct the wafer 1 to be in a protruding and non-warped state, and then the protrusion value of the wafer 1 in the protruding and non-warped state is calculated.

[0072] Specifically, the correction instruction includes a first correction instruction generated by the processing unit based on the protrusion value and the first height value and transmitted to the mechanical control unit, and a second compensation instruction generated by the processing unit based on the second height value.

[0073] Specifically, the mechanical control unit includes a mechanical arm or other suitable mechanical devices.

[0074] Specifically, the mechanical control unit is used to receive the correction instruction of the information processing unit and then correct the position of the wafer 1 in the abnormal position to return it to the normal position.

[0075] As an example, the mechanical control unit is also provided with a second transmission port for receiving correction instructions.

[0076] Specifically, the wafer position correction device can correct the positions of the wafers 1 at abnormal positions in the wafer box one by one.

[0077] Specifically, the state image of the wafer 1 is collected by the image acquisition unit 2, and the edge position of the wafer 1 is captured by the edge recognition model and the center position and area of ​​the wafer 1 are calculated, and the warping recognition model is further used to judge whether the wafer 1 is warped, and the height recognition model is used to determine the height range of the wafer 1 and calculate the height of the wafer 1, and the protrusion processing model is used to determine the protrusion range of the wafer 1 and calculate the protrusion value of the wafer 1, and the processing unit is based on the height or protrusion value of the wafer in the corresponding protruding warping state or protruding non-warping state. Generate corresponding correction instructions, then use the mechanical control unit to receive the correction instructions output by the processing unit and correct the position of the wafer based on the correction instructions, that is, the wafer position correction device changes the traditional way of using sensors to detect and correct abnormal wafers, and uses the image acquisition unit 2 in combination with multiple recognition models in the processing unit and the mechanical control unit to detect and dynamically adjust the position of the wafer, thereby avoiding damage to the wafer 1 and large errors caused by manual correction, shortening the correction time, and improving the efficiency and correction accuracy of the position correction of the wafer 1.

[0078] The wafer position correction device of the present embodiment collects the state image of the wafer 1 through the image acquisition unit 2, and processes the state image of the wafer 1 through the processing unit, and then captures the edge position of the wafer 1 through the edge recognition model and calculates the center position and area of ​​the wafer 1 through the mathematical algorithm, and further uses the warping recognition model to judge whether the wafer 1 is warped, uses the height recognition model to determine the height range of the wafer 1 and calculate the height of the wafer 1, and uses the protrusion processing model to determine the protrusion range of the wafer 1 and calculate the protrusion value of the wafer 1. The processing unit determines the warping state or the non-protrusion state based on the corresponding protrusion. The height or protrusion value of the wafer in the warped state generates a corresponding correction instruction, and then the mechanical control unit is used to receive the correction instruction output by the processing unit and correct the position of the wafer based on the correction instruction. That is, the wafer position correction device changes the traditional method of using sensors for detection and adjustment, and adopts the image acquisition unit 2 combined with multiple recognition models in the processing unit and the mechanical control unit to detect and dynamically adjust the position of the wafer 1, thereby improving the recognition accuracy of the position state of the wafer 1, avoiding damage to the wafer 1 and large errors caused by manual correction, shortening the correction time, and increasing the correction efficiency and accuracy of the wafer 1 position.

[0079] Embodiment 2

[0080] This embodiment provides a wafer position correction method, such as Figure 5 As well as Figure 6 As shown, there are respectively a schematic diagram of a process of the wafer correction device correcting a wafer 1 in a protruding non-warping state and a schematic diagram of a process of the wafer correction device correcting a wafer 1 in a protruding warping state to a protruding non-warping state, including the following steps:

[0081] S1: providing a wafer position correction device as described in Embodiment 1, and starting the device;

[0082] S2: The image acquisition unit acquires a status image of the wafer in the wafer box and transmits it to the processing unit;

[0083] S3: the edge recognition model performs preliminary processing based on the state image received by the processing unit to obtain edge point information, center position and imaging area of ​​the wafer, and transmits the preliminary processing result to the warping recognition model;

[0084] S4: the warping recognition model processes the state image received by the processing unit to determine whether the wafer is warped;

[0085] S5: When the warping recognition model determines that the wafer is in a protruding but not warping state, the height recognition model processes based on the state image of the wafer to obtain a first height range of the wafer, and the height recognition model processes based on the imaging area of ​​the wafer obtained by the edge recognition model, and compares the processing result with the first height range to obtain the first height of the wafer. The processing unit selects the protrusion processing model at the height based on the first height of the wafer, and the protrusion processing model processes based on the state image of the wafer to obtain the protrusion range of the wafer. The protrusion processing model processes based on the center position of the wafer obtained by the edge recognition model, and compares the processing result with the protrusion range to obtain the protrusion value of the wafer. The processing unit generates a first correction instruction based on the protrusion value and the first height value and transmits it to the mechanical control unit. The mechanical control unit performs a first correction on the position of the wafer based on the first correction instruction to make the wafer in a standard position.

[0086] S6: When the warping recognition model determines that the wafer is in a protruding and warping state, the height recognition model processes based on the state image of the wafer to obtain a second height range of the wafer, the height recognition model processes based on the imaging area of ​​the wafer obtained by the edge recognition model, and compares the processing result with the second height range to obtain the second height of the wafer, the processing unit generates a second correction instruction based on the second height and transmits it to the mechanical control unit, the mechanical control unit performs a second correction on the position of the wafer based on the second correction instruction to make the wafer in a protruding and non-warped state, and returns to the above-mentioned image acquisition and processing steps of the processing unit until the wafer is in the standard position.

[0087] For details, please refer to Figure 7-Figure 8 , execute the steps S1-S2, provide a wafer position correction device as described in Example 1, and start the device; the image acquisition unit 2 acquires the state image of the wafer 1 in the wafer box and transmits it to the processing unit.

[0088] Specifically, the wafer box is provided with a plurality of narrow slots for containing the wafers 1 .

[0089] Specifically, under the condition that the performance of the wafer 1 position correction device is met, the spacing distance between the image acquisition unit 2 and the wafer 1 can be selected according to actual conditions, and is not limited here.

[0090] Specifically, the image acquisition unit is further provided with a recognition algorithm model. After the image acquisition unit 2 acquires the state image of the wafer 1 , the step of processing the state image of the wafer 1 based on the recognition algorithm model is also included.

[0091] Specifically, the image acquisition unit 2 performs image processing on the status image of the wafer 1, including the following steps: acquiring the image data of the wafer 1 by the background difference method, imaging through morphological processing, filtering and image corrosion of the wafer 1 image to remove the block noise, and then expanding to form a better image effect and performing convex hull screening to remove the wrong blocks, so as to obtain the status image of the wafer 1.

[0092] Specifically, the image acquisition unit 2 filters and reduces noise on the image of the wafer 1 by using Gaussian filtering or Kalman filtering, wherein the noise reduction effect of the Kalman filtering is better than the noise reduction effect of the Gaussian filtering.

[0093] Specifically, Figure 7-Figure 8As shown, there are respectively a schematic diagram of the image acquisition unit 2 acquiring the state image of the wafer 1 and another schematic diagram of the image acquisition unit 2 acquiring the state image of the wafer 1. The image acquisition unit 2 is located outside the edge of the wafer 1, and then acquires the state image of the wafer 1 in the narrow slot.

[0094] Specifically, the image acquisition unit 2 obtains the state image of the wafer 1 through a binocular recognition method.

[0095] Specifically, step S3 is executed, the edge recognition model performs preliminary processing based on the state image received by the processing unit to obtain edge point information, center position and imaging area of ​​the wafer 1, and transmits the preliminary processing result to the warping recognition model.

[0096] Specifically, the edge recognition model recognizes the edge of the wafer 1 and collects the points, and uses a mathematical algorithm to calculate the center position and imaging area of ​​the wafer 1.

[0097] Specifically, the wafer standard position information is the position state information of the wafer 1 when it is in the standard position, which is obtained by performing edge recognition on the wafer 1 in the normal position and collecting edge points multiple times.

[0098] Specifically, the step S4 is executed, the warping recognition model processes the state image received by the processing unit to determine whether the wafer 1 is warped;

[0099] Specifically, the warping recognition model determines whether the preliminary processing result of the state image of the wafer 1 is circular. If the preliminary processing result of the state image of the wafer 1 is non-circular, it can be determined that the wafer 1 is in a warped state.

[0100] For details, please refer to Fig. 9, executing step S5, when the warping recognition model determines that the wafer 1 is in a protruding but not warping state, the height recognition model processes based on the state image of the wafer 1 to obtain a first height range of the wafer 1, and the height recognition model processes based on the imaging area of ​​the wafer 1 obtained by the edge recognition model, and compares the processing result with the first height range to obtain the first height of the wafer 1, the processing unit selects the protrusion processing model at the height based on the first height of the wafer 1, the protrusion processing model processes based on the state image of the wafer 1 to obtain the protrusion range of the wafer 1, the protrusion processing model processes based on the center position of the wafer 1 obtained by the edge recognition model, and compares the processing result with the protrusion range to obtain the protrusion value of the wafer 1, the processing unit generates a first correction instruction based on the protrusion value and the first height value and transmits it to the mechanical control unit, and the mechanical control unit performs a first correction on the position of the wafer 1 based on the first correction instruction to make the wafer in a standard position.

[0101] Specifically, Fig. 9 As shown, it is a schematic diagram of the state where the wafer 1 is protruding but not warped. The position state of the wafer 1 is protruding but not warped, that is, the center of the wafer 1 is only shifted in the linear position during the smoothing process, and the wafer 1 can be restored to the standard position by using the translational reset method.

[0102] Specifically, the height recognition model processes the imaging area of ​​the wafer 1 obtained based on the edge recognition model, and compares the processing result with the first height range to obtain the first height of the wafer 1, including the following steps: the height recognition model calculates the difference between the imaging area of ​​the wafer 1 obtained based on the edge recognition model and the height value corresponding to the imaging area in the wafer standard information, and compares the calculation result with the first height range to match and obtain the first height of the wafer 1.

[0103] As an example, the protrusion processing model processes the center position of the wafer 1 obtained based on the edge recognition model and compares the processing result with the protrusion range to obtain the protrusion value of the wafer, including the following steps: the protrusion processing model uses a mathematical algorithm to calculate the difference between the center position of the wafer 1 calculated by the edge recognition model and the corresponding center position in the wafer standard information to obtain the first moving distance in the horizontal direction of the wafer 1 in a protruding and non-warped state, compares the first moving distance with the protrusion range, and obtains the protrusion value of the wafer based on the comparison result.

[0104] Specifically, when the wafer 1 is in a protruding and non-warped state, the method further includes calculating the lifting height of the mechanical control unit according to the imaging area of ​​the wafer 1 to avoid scratches on the wafer 1 .

[0105] Specifically, by comparing the area and center position of the protruding wafer 1 with the area and center position of the wafer 1 in the standard position in the narrow slot on the same layer, the data for dynamically adjusting the height position of the wafer 1 by the mechanical control unit is obtained. When it is calculated that the difference between the collected area of ​​the wafer 1 and the area of ​​the wafer 1 in the standard position on the layer is large, it is returned to the mechanical control unit to implement closed-loop control of the height position compensation of the wafer 1 for placing and picking.

[0106] For details, please refer to Fig.10 , execute step S6, when the warping recognition model determines that the wafer 1 is in a protruding and warping state, the height recognition model processes based on the state image of the wafer 1 to obtain a second height range of the wafer, the height recognition model processes based on the imaging area of ​​the wafer 1 obtained by the edge recognition model, and compares the processing result with the second height range to obtain the second height of the wafer, the processing unit generates a second correction instruction based on the second height and transmits it to the mechanical control unit, the mechanical control unit performs a second correction on the position of the wafer 1 based on the second correction instruction, so that the wafer 1 is in a protruding and non-warping state, and returns to the above-mentioned image acquisition and the processing unit processing the image step.

[0107] Specifically, when the position state of the wafer 1 is protruding and warping, that is, when the position deviation of the wafer 1 in the smoothing process is large, the wafer 1 will warp under the action of gravity. The position of the wafer 1 can be corrected by first performing a correction calculation on the warping state of the wafer 1 to restore the wafer 1 to the protruding and non-warping state, and then performing a position compensation calculation on the protruding and non-warping wafer 1 to correct the position of the wafer 1.

[0108] As an example, the height recognition model processes the imaging area of ​​the wafer 1 obtained based on the edge recognition model and compares the processing result with the second height range to obtain the second height of the wafer 1, including the following steps: the height recognition model uses a mathematical algorithm, and calculates the difference between the height of the wafer 1 corresponding to the imaging area of ​​the wafer 1 calculated by the edge recognition model and the height corresponding to the imaging area of ​​the wafer 1 corresponding to the standard position information of the wafer to obtain the straightening height value of the wafer in a protruding and warped state, compares the straightening height value with the second height range, and obtains the second height of the wafer 1 based on the comparison result.

[0109] As an example, the process of height-adjusting the wafer 1 according to the straightening height value of the wafer in the protruding and tilted state also includes a step of moving the wafer 1 in the horizontal direction by a preset distance according to a second moving distance set for the wafer 1 to move in the horizontal direction, so that the wafer 1 is in a protruding and non-tilted state.

[0110] Specifically, the processing unit calculates the second height value of the abnormal wafer based on the processing result of the edge recognition model, which also includes the following steps: capturing the outermost point of the wafer 1 through the edge recognition model in combination with the height recognition model and the protrusion processing model, and calculating the distance between the edges of the farthest wafer 1, and then calculating the second height value in combination with the height recognition model and the protrusion processing model.

[0111] Specifically, after the wafer 1 in the protruding and non-warping state is corrected according to the second correction instruction, the wafer is in the protruding and non-warping state, but has not reached the standard position of the wafer 1.

[0112] Specifically, Fig.10 As shown, it is a structural diagram of the wafer 1 that is protruding and warping. When the wafer 1 undergoing the second correction is in a protruding and non-warping state, the above-mentioned image acquisition and image processing steps are performed again, and the processing unit is used to judge the corresponding position state information and calculate the position correction value, so that the protruding offset position of the wafer 1 can be determined and the position corrected, which will not be repeated here.

[0113] Specifically, the edge position is captured by collecting the state image of the wafer 1, and the height and protrusion value of the wafer 1 in a protruding and warping state or a protruding and non-warping state can be determined through the edge recognition model, the warping recognition model, the height recognition model, and the protrusion processing model, and then the mechanical control unit is controlled to correct the position of the wafer 1, thereby shortening the correction time of the position of the wafer 1 and improving the correction accuracy.

[0114] The wafer position correction method of the present embodiment captures the edge position of the wafer 1 by collecting the state image of the wafer 1, and determines the height and protrusion value of the wafer 1 in a protruding and warping state or a protruding and non-warping state through the edge recognition model, the warping recognition model, the height recognition model, and the protrusion processing model, and then controls the mechanical control unit to correct the position of the wafer 1, thereby shortening the correction time of the wafer 1 position and improving the correction accuracy.

[0115] In summary, the wafer correction device and method of the present invention collects the state image of the wafer through an image acquisition unit, captures the edge position of the wafer through an edge recognition model, and calculates the center position and area of ​​the wafer through the mathematical algorithm, further uses a warping recognition model to judge whether the wafer is warped, uses a height recognition model to determine the height range of the wafer and calculates the height of the wafer, uses a protrusion processing model to determine the protrusion range of the wafer and calculates the protrusion value of the wafer, and the processing unit generates a corresponding correction instruction based on the height or protrusion value of the wafer in the corresponding protruding warping state or protruding non-warping state, and then uses a mechanical control unit to receive the correction instruction output by the processing unit and correct the position of the wafer based on the correction instruction. That is, the wafer position correction device changes the traditional method of using sensors to detect and adjust the correction of abnormal wafers, and uses an image acquisition unit combined with multiple recognition models in the processing unit and a mechanical control unit to detect and dynamically adjust the position of the wafer, thereby improving the recognition accuracy, shortening the correction time, avoiding damage to the wafer caused by manual correction and large errors caused by manual correction, and improving the efficiency and accuracy of wafer position correction. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0116] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer position correction device, characterized in that: include: A carrier table, used for carrying a wafer box, wherein the wafer box is used for containing wafers; An image acquisition unit is spaced apart from the wafer box by a preset distance, and is used to acquire a state image of the wafer in the wafer box; A processing unit receives the state image information of the wafer, performs image information processing based on the state image information, and issues a correction instruction based on the processing result, wherein the processing unit includes an edge recognition model, a warping recognition model, a height recognition model, and a protrusion processing model, wherein the edge recognition model is used to recognize and collect edge point information of the wafer and calculate the center position and imaging area of ​​the wafer, the warping recognition model is used to judge whether the wafer is warped, the height recognition model is used to determine the height range of the wafer and calculate the height of the wafer, and the protrusion processing model is used to determine the protrusion range of the wafer and calculate the protrusion value of the wafer, and the processing unit generates a corresponding correction instruction based on the height or protrusion value of the wafer in the corresponding abnormal position state; The mechanical control unit is used to receive the correction instruction output by the processing unit and correct the position of the wafer based on the correction instruction.

2. The wafer position correction device according to claim 1, characterized in that: The image acquisition unit includes a binocular camera.

3. The wafer position correction device according to claim 1, characterized in that: The image acquisition unit is also provided with a recognition algorithm model, and the image processing unit processes the state image of the wafer based on the recognition algorithm model.

4. The wafer position correction device according to claim 1, characterized in that: The processing unit is also preset with wafer standard position information, and the wafer standard position information includes position state information when the wafer is in the standard position.

5. The wafer position correction device according to claim 1, characterized in that: The wafer box is provided with a plurality of narrow slots for placing the wafers, and each of the narrow slots is at a different height in the wafer box.

6. The wafer position correction device according to claim 5, characterized in that: The edge recognition model is obtained by training multiple groups of state images of the wafer in each slot.

7. The wafer position correction device according to claim 5, characterized in that: The warping recognition model is obtained by training corresponding to multiple groups of different warping states for various warping conditions of the wafer in each slot.

8. The wafer position correction device according to claim 5, characterized in that: The height recognition model is obtained by performing corresponding height training of multiple groups of different states on the wafer located in each of the narrow slots.

9. The wafer position correction device according to claim 5, characterized in that: The protrusion processing model is obtained by training the position states of the wafer under a plurality of different protrusion situations in each slot.

10. The wafer position correction device according to claim 1, characterized in that: The image acquisition unit is also provided with a first transmission port for transmitting the state image of the wafer; the mechanical control unit is also provided with a second transmission port for receiving compensation instructions.

11. The wafer position correction device according to claim 1, characterized in that: The abnormal position state of the wafer includes protruding and warping, and protruding and not warping.

12. A wafer position correction method, characterized in that: The following steps are involved: Providing a wafer position correction device as claimed in any one of claims 1 to 11 and starting the device; The image acquisition unit acquires a status image of the wafer in the wafer box and transmits it to the processing unit; The edge recognition model performs preliminary processing based on the state image received by the processing unit to obtain edge point information, center position and imaging area of ​​the wafer, and transmits the preliminary processing result to the warping recognition model; The warping recognition model processes the state image received by the processing unit to determine whether the wafer is warped; When the warping recognition model determines that the wafer is in a protruding but not warping state, the height recognition model processes based on the state image of the wafer to obtain a first height range of the wafer, the height recognition model processes based on the imaging area of ​​the wafer obtained by the edge recognition model, and compares the processing result with the first height range to obtain the first height of the wafer, the processing unit selects the protrusion processing model at the height based on the first height of the wafer, the protrusion processing model processes based on the state image of the wafer to obtain the protrusion range of the wafer, the protrusion processing model processes based on the center position of the wafer obtained by the edge recognition model, and compares the processing result with the protrusion range to obtain the protrusion value of the wafer, the processing unit generates a first correction instruction based on the protrusion value and the first height value and transmits it to the mechanical control unit, and the mechanical control unit performs a first correction on the position of the wafer based on the first correction instruction to make the wafer in a standard position; When the warping recognition model determines that the wafer is in a protruding and warping state, the height recognition model processes based on the state image of the wafer to obtain a second height range of the wafer, the height recognition model processes based on the imaging area of ​​the wafer obtained by the edge recognition model, and compares the processing result with the second height range to obtain the second height of the wafer, the processing unit generates a second correction instruction based on the second height and transmits it to the mechanical control unit, the mechanical control unit performs a second correction on the position of the wafer based on the second correction instruction to make the wafer in a protruding and non-warped state, and returns to the above-mentioned image acquisition and the processing unit processing image steps until the wafer is in the standard position.

13. The wafer position correction method according to claim 12, characterized in that: The protrusion processing model processes the center position of the wafer obtained based on the edge recognition model and compares the processing result with the protrusion range to obtain the protrusion value of the wafer, including the following steps: the protrusion processing model uses a mathematical algorithm to calculate the difference between the center position of the wafer calculated by the edge recognition model and the corresponding center position in the wafer standard information to obtain the first moving distance of the wafer in the horizontal direction in a protruding and non-warped state, compares the first moving distance with the protrusion range, and obtains the protrusion value of the wafer based on the comparison result.

14. The wafer position correction method according to claim 12, characterized in that: The height recognition model processes the imaging area of ​​the wafer obtained based on the edge recognition model and compares the processing result with the second height range to obtain the second height of the wafer, including the following steps: the height recognition model uses a mathematical algorithm, and calculates the difference between the height of the wafer corresponding to the imaging area of ​​the wafer calculated by the edge recognition model and the height corresponding to the imaging area of ​​the wafer corresponding to the standard position information of the wafer to obtain the straightening height value of the wafer in a protruding and warped state, compares the straightening height value with the second height range, and obtains the second height of the wafer based on the comparison result.

15. The wafer position correction method according to claim 14, characterized in that: The process of height-adjusting the wafer according to the straightening height value of the wafer in the protruding and tilted state also includes a step of moving the wafer in the horizontal direction by a preset distance according to a second moving distance set for the wafer to move in the horizontal direction, so that the wafer is in a protruding and non-tilted state.

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