Wafer device, wafer, pedestal and dispensing method

Abstract

The invention discloses a wafer device, a wafer, a base and a dispensing method, and relates to the field of nixie tube processing.The wafer device comprises a step-shaped flow choking structure formed between the wafer and the base, and dispensing glue is adhered to the flow choking structure and used for fixing the wafer and the base; wherein the upper surface of the flow blocking structure adheres to the lower side face of the wafer in a dispensing mode, the side face, close to the wafer, of the flow blocking structure and the wafer form a closed retention layer, and the retention layer is used for containing dispensing glue liquefied from the lower side face of the wafer. A multi-layer flow choking structure is used for preventing glue from flowing into the base to influence the product performance, and five-point glue or six-point glue is used for reinforcing, so that the consistency of the crystal oscillator is good.

Description

Technical Field

[0001] The invention relates to the field of digital tube processing, and in particular to a chip device, a chip, a base and a glue dispensing method. Background Art

[0002] A quartz crystal resonator generally includes a quartz crystal with electrodes, a base and a metal cover. The bonding material is a conductive adhesive. The base physically supports and fixes the crystal through the bonding material, and at the same time realizes the electrical connection between the quartz crystal and the base, thereby realizing the oscillation of the quartz crystal through the peripheral circuit to generate an oscillation frequency.

[0003] The commonly used quartz wafer mounting and fixing base includes a mounting layer, one end of the quartz wafer is connected to the mounting layer by an adhesive material, and the other end is in an infinitely free state. Although this method can achieve good electrical performance, there are problems such as cracking of the conductive adhesive and falling off of the wafer after being subjected to high impact, which seriously restricts the use place and reliability of quartz crystal resonators or crystal oscillators containing surface-mounted quartz wafers. Summary of the invention

[0004] The invention provides a chip device, a chip, a base and a glue dispensing method to solve the problems of the prior art.

[0005] In a first aspect, the present invention provides a wafer device, comprising a metal layer disposed on a wafer cover, a wafer and a base; A stepped flow-blocking structure is formed between the wafer and the base, and glue is adhered to the flow-blocking structure to fix the wafer and the base; The upper surface of the blocking structure is glued to the lower side of the wafer, and the side of the blocking structure close to the wafer forms a closed retention layer with the wafer, and the retention layer is used to place the glue liquefied from the lower side of the wafer.

[0006] Furthermore, the flow-blocking structures are arranged at four surrounding wafer installation positions in the inner cavity of the base.

[0007] Furthermore, two corners at one end of the chip are provided with glue sticking to the blocking structure and contacting with two electrode areas of the base through glue, and at the same time, a ceramic corner at one end of the chip is contacted with at least one non-electrode area through glue.

[0008] Furthermore, the flow-blocking structure includes two edges in contact with the chip, an outer edge close to the chip and an outer edge away from the chip both in contact with the chip, and a lower edge of the side of the chip and the flow-blocking structure form a recessed area, which is used for accumulating liquefied glue.

[0009] Furthermore, the flow-blocking structure includes a first part, a second part and a third part in sequence from the side away from the chip to the side close to the chip, the chamfer of the first part contacts the chip, the height of the second part is lower than the first part and the third part, and the chamfer of the third part contacts the chip.

[0010] Furthermore, the metal layer includes Fe, Ni and Co elements.

[0011] In a second aspect, the present invention provides a wafer dispensing method for obtaining a wafer device as described in any one of the first aspects, comprising the following steps: Dispensing glue on two electrode areas and at least one non-electrode area of ​​the base; Press the wafer onto the conductive adhesive; Dispense glue again on the wafer at the corresponding dispensing position; The base and the wafer are placed in an oven for baking; After curing a metal layer is placed over the base.

[0012] In a third aspect, the present invention provides a susceptor, wherein the susceptor is used to contact a wafer, and the susceptor and the metal layer covering the wafer form a wafer device as described in any one of the first aspects.

[0013] In a fourth aspect, the present invention provides a chip, wherein the chip is a chip in a chip device as described in any one of the first aspects, and the lower side of the edge of the chip is inclined.

[0014] The wafer device, wafer, base and glue dispensing method provided by the present invention use a multi-layer flow-blocking structure to prevent colloid from flowing into the base and affecting product performance, and use five-point glue or six-point glue reinforcement to ensure good consistency of the crystal oscillator. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of the present invention, and do not constitute a limitation of the embodiments of the present invention. In the drawings: Figure 1 A schematic diagram of a wafer device provided by an exemplary embodiment of the present invention.

[0016] Figure 2 A partial schematic diagram of a wafer device provided by an exemplary embodiment of the present invention.

[0017] Figure 3 A partial schematic diagram of another wafer device provided by an exemplary embodiment of the present invention.

[0018] Figure 4 A schematic diagram of a flow-blocking structure in a wafer device provided by an exemplary embodiment of the present invention.

[0019] In the figure: 1. Metal layer; 2. Wafer; 3. Flow blocking structure; 4. Base; 101. Glue dispensing; 102. Recessed area; 31. First part; 32. Second part; 33. Third part. DETAILED DESCRIPTION

[0020] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0021] The present invention arranges a flow blocking structure for a special lower edge chip to prevent the dispensing glue from liquefying and flowing into the base to affect the consistency of the crystal oscillator.

[0022] The wafer device, wafer, base and dispensing method provided by the present invention are intended to solve the above technical problems in the prior art.

[0023] The technical solution of the present invention and how the technical solution of the present invention solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0024] Example 1: Figure 1 As shown, a wafer device comprises a metal layer disposed on a wafer cover, a wafer and a base; A stepped flow-blocking structure is formed between the wafer and the base, and glue is adhered to the flow-blocking structure for fixing the wafer and the base; the flow-blocking structure is arranged at four surrounding wafer mounting positions in the inner cavity of the base, and glue is arranged at two corners at one end of the wafer to adhere to the flow-blocking structure and contact with two electrode areas of the base through glue, and at the same time, a ceramic corner at one end of the wafer contacts with at least one non-electrode area through glue; the flow-blocking structure includes two edges in contact with the wafer, and the outer edge close to the wafer and the outer edge away from the wafer are both in contact with the wafer, such as Figure 2 , Figure 3 As shown, the lower edge of the side of the chip and the flow-blocking structure form a recessed area, and the recessed area is used for accumulating liquefied glue.

[0025] The upper surface of the blocking structure is glued to the lower side of the wafer, and the side of the blocking structure close to the wafer forms a closed retention layer with the wafer, and the retention layer is used to place the glue liquefied from the lower side of the wafer.

[0026] Also includes, such as Figure 4As shown, the flow blocking structure includes a first part, a second part and a third part from the side away from the wafer to the side close to the wafer, the chamfer of the first part contacts the wafer, the height of the second part is lower than the first part and the third part, and the chamfer of the third part contacts the wafer. The chamfer of the first part is fixed relative to the wafer after the adhesive dispensing, isolating the upper edge of the first part from the third part, and the third part is located on the base, sandwiching the second part between the first part, and the height of the second part is lower than the third part. When the dispensing glue is liquefied, it flows from the upper edge of the first part into the second part. The setting size of the second part is larger than the size of the dispensing area, which can effectively prevent the dispensing glue from leaking.

[0027] In the several embodiments provided by the present invention, it should be understood that the disclosed systems and methods can be implemented in other ways. For example, the system embodiments described above are only illustrative, for example, the division of the modules is only a logical function division, and there may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0028] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0029] In addition, each functional module in each embodiment of the present invention may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0030] Those skilled in the art will appreciate that the embodiments of the present invention may be provided as methods or systems. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects.

[0031] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0032] The above are only embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

[0033] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed by the present invention. The description and examples are to be considered exemplary only, and the true scope and spirit of the present invention is indicated by the claims above.

[0034] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A wafer device, characterized in that: It includes a metal layer, a chip and a base arranged on a chip cover; A stepped flow-blocking structure is formed between the wafer and the base, and glue is adhered to the flow-blocking structure to fix the wafer and the base; The upper surface of the blocking structure is glued to the lower side of the wafer, and the side of the blocking structure close to the wafer forms a closed retention layer with the wafer, and the retention layer is used to place the glue liquefied from the lower side of the wafer.

2. A wafer device according to claim 1, characterized in that: The flow-blocking structures are arranged at four surrounding wafer installation positions in the inner cavity of the base.

3. A wafer device according to claim 2, characterized in that: Glue is set at two corners at one end of the chip to adhere to the blocking structure and contact with two electrode areas of the base through glue, and at the same time, a ceramic corner at one end of the chip contacts with at least one non-electrode area through glue.

4. A wafer device according to claim 3, characterized in that: The flow-blocking structure includes two edges in contact with the wafer, an outer edge close to the wafer and an outer edge away from the wafer both in contact with the wafer, and a recessed area is formed between the lower edge of the side of the wafer and the flow-blocking structure, and the recessed area is used for accumulating liquefied glue.

5. A wafer device according to claim 3, characterized in that: The flow-blocking structure includes a first part, a second part and a third part in sequence from the side away from the wafer to the side close to the wafer, the chamfer of the first part contacts the wafer, the height of the second part is lower than the first part and the third part, and the chamfer of the third part contacts the wafer.

6. A wafer device according to claim 3, characterized in that: The metal layer includes Fe, Ni and Co elements.

7. A wafer dispensing method, characterized in that: A method for obtaining a wafer device as claimed in any one of claims 1 to 6 comprises the following steps: Dispensing glue on two electrode areas and at least one non-electrode area of ​​the base; Press the wafer onto the conductive adhesive; Dispense glue again on the wafer at the corresponding dispensing position; The base and the wafer are placed in an oven for baking; After curing a metal layer is placed over the base.

8. A base, characterized in that: The base is used to contact the wafer, and the base and the metal layer covering the wafer form a wafer device as described in any one of claims 1-6.

9. A wafer, characterized in that: The wafer is a wafer in a wafer device as described in any one of claims 1 to 6, and the lower side of the edge of the wafer is inclined.

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