An automotive-grade multi-lead SMD package and its manufacturing method

Abstract

The present invention discloses an automotive-grade multi-lead SMD package and a preparation method thereof, which relates to the technical field of electronic component structures. An installation groove for accommodating an electronic device is formed in a first end surface of the package along a first direction; a guiding channel is formed in the package, and the guiding channel extends from a bottom wall of the installation groove to the first end surface; at least a part of a lead of the electronic device passes through the guiding channel and extends to the first end surface. By providing the guiding channel, the leads of the THT components are controllably extended to the first end surface inside the package, and most of the leads need to pass through the guiding channel, thereby reducing the short-circuit risk, further reducing the minimum safety distance between components, and improving the integration density of the circuit board; at the same time, through the design of the package body, the transformation of THT components to SMD packages is realized, and the installation method of SMD components can be simulated by THT components during the development stage, so as to improve the integration density of automotive-grade circuit boards on the premise of reducing the development cost.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component structures, and particularly to an automotive-grade multi-lead SMD package and a preparation method thereof. Background Art

[0002] With the rapid development of new energy vehicles, electronic components are increasingly widely used therein. Electronic components include power semiconductors, sensors, capacitors, resistors, etc. Most of the above-mentioned electronic components adopt the form of THT components (Through-hole technology, through-hole insertion technology) or SMD components (Surface Mount Technology, surface mount technology).

[0003] Specifically, THT components need to be inserted into the circuit board through the holes on the circuit board, and then connected by manual or automatic soldering. Limited by the requirement of opening holes on the circuit board for THT components, it is difficult to further improve the integration density of the circuit board. At the same time, new energy vehicles usually need to meet the requirements of high integration and miniaturization in the design of electronic systems, which poses higher challenges to THT components; in order to achieve a high-density and compact circuit board layout, engineers usually prefer to use SMD components. However, in the actual R & D process, limited by the supply types and costs of suppliers, it is difficult for electronic components to fully adopt SMD components, resulting in the need to open holes for THT components on the circuit board, reducing the integration density of the circuit board; if directly customize SMD components with parameters equivalent to those of THT components, it will often bring higher development costs during the development stage.

[0004] It can be seen that the types of existing electronic components are difficult to meet the development requirements of automotive-grade circuit boards regarding integration density under the premise of low development costs. Summary of the Invention

[0005] The purpose of the present invention is to provide an automotive-grade multi-lead SMD package and a preparation method thereof, so as to solve the problem that the types of existing electronic components are difficult to improve the integration density of automotive-grade circuit boards during the development stage under the premise of low development costs.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] An automotive-grade multi-lead SMD package, including a package, wherein an installation groove for accommodating an electronic device is formed on a first end surface of the package along a first direction;

[0008] A guiding channel is formed in the package, and the guiding channel extends from a bottom wall of the installation groove to the first end surface; at least a part of a lead of the electronic device passes through the guiding channel and extends to the first end surface for surface mounting;

[0009] Wherein, an avoidance groove is formed on a side surface of the encapsulation member, and at least a part of the guiding channel is covered by the avoidance groove along the extending direction of the avoidance groove.

[0010] Optionally, the guiding channel includes a first channel, a second channel, and a third channel that are connected in sequence; the first channel is formed on the bottom wall of the installation groove and extends to the second end surface of the encapsulation member; the second channel is arranged parallel to the second end surface; the third channel extends to the first end surface.

[0011] Optionally, the number of the pins is two, the first channels are the same as the pins, and the two first channels are arranged at intervals along a second direction; the two second channels extend away from each other along the second direction; the two third channels are arranged at intervals along the second direction;

[0012] Bending grooves are respectively formed on the first end surface corresponding to the outlets of the third channels, and the bending grooves are used for placing the pins that pass through the third channels and are bent.

[0013] Optionally, the two bending grooves respectively extend away from each other along a third direction, and the third direction is respectively perpendicular to the first direction and the second direction.

[0014] Optionally, at positions corresponding to the second channels and the third channels of the encapsulation member, a first avoidance groove is formed from a first side surface of the encapsulation member, and a second avoidance groove is formed from a second side surface of the encapsulation member; the first avoidance groove extends to the second channel, and the second avoidance groove extends to the third channel;

[0015] Wherein, the first avoidance groove covers the second channel along a direction perpendicular to the first side surface, and the second avoidance groove covers the third channel along a direction perpendicular to the second side surface.

[0016] Optionally, the first avoidance groove extends to the farthest second channel to form a limiting groove between two adjacent second channels;

[0017] The limiting groove communicates between the two second channels, and two bending members are slidably and detachably connected in the limiting groove, one bending member extends from the limiting groove to the outside of one first avoidance groove, and the other bending member extends from the limiting groove to the outside of the other first avoidance groove.

[0018] Optionally, the bending member includes a bending body part that penetrates through the first avoidance groove and the second channel, the bending body part is connected with a bending transition part in the limiting groove, and the bending transition part is arranged parallel to the second channel; the bending transition part is connected with a bending connection part; wherein, the two bending connection parts are connected by a tension spring.

[0019] Optionally, a positioning block is convexly provided on the second end surface of the encapsulation, and a positioning hole is provided on the positioning block.

[0020] Optionally, along the first direction, the second avoidance groove penetrates through the first end surface and the second end surface.

[0021] A preparation method of a vehicle-grade multi-lead SMD encapsulation, which is applied to the vehicle-grade multi-lead SMD encapsulation as described above, includes:

[0022] Place the electronic device into the installation groove, and bend the pins along the guiding channel to the first end surface.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] A vehicle-grade multi-lead SMD encapsulation and a preparation method thereof provided by the present invention enable the pins of THT components to be controllably extended to the first end surface inside the encapsulation through the setting of the guiding channel. Most of the pins need to pass through the guiding channel, thereby reducing the short-circuit risk, further reducing the minimum safety distance between components, and improving the integration density of the circuit board. At the same time, through the design of the encapsulation body, the transformation of THT components to SMD encapsulation is realized to meet the requirements of high integration and miniaturization of the electronic system of new energy vehicles. The installation method of SMD components can be simulated with THT components during the development stage, so as to meet the development requirements of the electronic system of new energy vehicles. Furthermore, on the premise of reducing the development cost, the integration density of the vehicle-grade circuit board is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have technical substance. Any modification of the structure, change of the proportional relationship, or adjustment of the size should still fall within the scope that can be covered by the technical content disclosed in the present invention without affecting the effects that the present invention can produce and the purposes that can be achieved.

[0027] Figure 1 It is a schematic diagram of the overall structure of the vehicle-grade multi-lead SMD encapsulation provided by the embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of a partial cross-sectional structure of an automotive-grade multi-lead SMD package provided by an embodiment of the present invention;

[0029] Figure 3 This is a schematic side view structure of an automotive-grade multi-lead SMD package provided by an embodiment of the present invention;

[0030] Figure 4 is Figure 3 A schematic diagram of a cross-sectional structure along A-A;

[0031] Figure 5 This is a schematic top view structure of an automotive-grade multi-lead SMD package provided by an embodiment of the present invention;

[0032] Figure 6 is Figure 5 A schematic diagram of a cross-sectional structure along B-B;

[0033] Illustration: 100, package; 101, first end face; 102, second end face; 103, mounting groove; 104, first side face; 105, second side face; 106, first relief groove; 107, second relief groove; 108, limiting groove; 120, guiding channel; 121, first channel; 122, second channel; 123, third channel; 124, bending groove; 130, positioning block; 131, positioning hole;

[0034] 200, electronic device; 210, pin; 300, bending part; 310, bending body part; 320, bending transition part; 330, bending connection part. Detailed implementation manners

[0035] To make the invention objectives, features, and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component present.

[0037] The technical solution of the present invention will be further described below with reference to the drawings and through specific embodiments.

[0038] Embodiment 1:

[0039] The vehicle-grade multi-lead SMD package provided in this embodiment is designed to meet the high requirements for integration and miniaturization in current vehicle-grade electronic systems; through the improvement of the vehicle-grade multi-lead SMD package, it not only solves the problem of low circuit board integration, but also reduces the cost expenditure in the development process to a certain extent; specifically, in the development stage, engineers can use THT components that simulate the installation method of SMD components, greatly reducing the risk and cost of prototype development. In addition, the design of this vehicle-grade multi-lead SMD package has the advantage of high reliability and can meet the requirements of new energy vehicle on-board electronic systems for complex working conditions such as anti-vibration and temperature changes.

[0040] As Figure 1 , Figure 2 , Figure 5 and Figure 6 shown, the vehicle-grade multi-lead SMD package in this embodiment includes a package 100. An installation groove 103 for accommodating an electronic device 200 is formed in the first end face 101 of the package 100 along a first direction; a guiding channel 120 is formed in the package 100, and the guiding channel 120 extends from the bottom wall of the installation groove 103 to the first end face 101; at least a part of the lead 210 of the electronic device 200 passes through the guiding channel 120 and extends to the first end face 101 for surface mounting.

[0041] Among them, the first direction is also the mounting direction of the vehicle-grade multi-lead SMD package, and the first end face 101 is the mounting surface of the vehicle-grade multi-lead SMD package on the circuit board. In this embodiment, after the electronic device 200 is placed in the installation groove 103, its lead 210 is correspondingly inserted into the guiding channel 120, and then by cooperating with a bending machine or manual bending, the lead 210 can be bent along the guiding channel 120 and extended to the first end face 101, thereby being used for surface mounting; the electronic device 200 includes but is not limited to power semiconductors, sensors, capacitors, resistors, etc.

[0042] Specifically, in the automotive-grade multi-lead SMD package of this embodiment, the pins 210 of the THT components are controllably extended to the first end face 101 inside the package 100 through the arrangement of the guiding channels 120. Most of the pins 210 need to pass through the guiding channels 120, thereby reducing the short-circuit risk, further reducing the minimum safety distance between components, and improving the integration density of the circuit board. At the same time, through the design of the package 100 body, the conversion of THT components to SMD packaging is realized to meet the requirements of high integration and miniaturization of the new energy vehicle electronic system. The installation method of SMD components can be simulated with THT components during the development stage, so as to meet the development requirements of the new energy vehicle electronic system. Furthermore, on the premise of reducing the development cost, the integration density of the automotive-grade circuit board is improved.

[0043] Further, as Figure 5 and Figure 6 shown, the guiding channel 120 includes a first channel 121, a second channel 122, and a third channel 123 that are connected in sequence. The first channel 121 is opened on the bottom wall of the installation groove 103 and extends to the second end face 102 of the package 100. The second channel 122 is arranged parallel to the second end face 102. The third channel 123 extends to the first end face 101. Exemplarily, the connected first channel 121, second channel 122, and third channel 123 are integrally in a "J" shape and coincide with the electronic device 200 in the projection in the first direction, thereby controlling the pins 210 in a more compact space and further improving the integration density of the circuit board.

[0044] Further, guiding channels 120 are respectively provided at the positions of the package 100 corresponding to the respective pins 210. Each guiding channel 120 correspondingly includes a connected first channel 121, a second channel 122, and a third channel 123. The guiding channels 120 are independently arranged from each other, and the package 100 is provided with twice the number of side wall surfaces corresponding to the respective pins 210. For example, when the electronic device 200 has two pins 210, the package 100 includes four side wall surfaces and is generally rectangular. When the electronic device 200 has four pins 210, the package 100 includes eight side wall surfaces and is generally octagonal. Additionally, an avoidance groove is provided on the side surface of the package 100, and at least part of the guiding channel 120 is covered by the avoidance groove along the extension direction of the avoidance groove. Thus, the pins 210 in part of the guiding channels 120 can be pressured through the space left by the avoidance groove, that is, pressure can be applied to the pins 210 through the aperture left by the avoidance groove to bend the pins 210, thereby realizing the quick bending of the pins 210 and improving the process efficiency.

[0045] Taking the example that the electronic device 200 has two pins 210, when the package 100 includes four side wall surfaces, namely two first side surfaces 104 and two second side surfaces 105, at the positions of the package 100 corresponding to the second channels 122 and the third channels 123, a first relief groove 106 is opened from the first side surface 104 of the package 100, and a second relief groove 107 is opened from the second side surface 105 of the package 100; the first relief groove 106 extends to the second channel 122, and the second relief groove 107 extends to the third channel 123; wherein, the first relief groove 106 covers the second channel 122 along a direction perpendicular to the first side surface 104, and the second relief groove 107 covers the third channel 123 along a direction perpendicular to the second side surface 105.

[0046] It should be added that when the first relief groove 106 is opened from the first side surface 104 and extends inward until it coincides with the first channel 121, the second channel 122 can be formed, and the first relief groove 106 connected to the second channel 122 is formed. At this time, pressure can be applied to the pin 210 through the space left by the first relief groove 106 to bend the pin 210; similarly, the second relief groove 107 is opened from the second side surface 105 and extends inward until it coincides with the second channel 122, the third channel 123 can be formed, and the second relief groove 107 connected to the third channel 123 is formed. At this time, pressure can be applied to the pin 210 through the space left by the second relief groove 107 to bend the pin 210;

[0047] Meanwhile, to ensure that the part of the pin 210 extending beyond the first channel 121 can be bent to the second channel 122, the first relief groove 106 is also provided to extend upward from the second end face 102 to avoid the path of the pin 210 being bent to the second channel 122.

[0048] For the convenience of those skilled in the art to understand, this embodiment also provides a preparation method of an automotive-grade multi-lead SMD package, and the specific steps include:

[0049] Step S201: Place the electronic device 200 into the installation groove 103, and make the pins 210 pass through the first channels 121 correspondingly;

[0050] Step S202: Apply pressure to the part of the pin 210 located in the first relief groove 106 and the part of the pin 210 extending beyond the first relief groove 106 along the second direction, so that the pin 210 is bent towards the second channel 122;

[0051] Step S203: Apply pressure to the part of the pin 210 located in the second relief groove 107 and the part of the pin 210 extending beyond the second relief groove 107 along the first direction, so that the pin 210 is bent towards the third channel 123;

[0052] Among them, it should be noted that the length of the pin 210 extending from the third channel 123 can be made shorter, that is, the protruding distance of the pin 210 relative to the first end face 101 is shorter. At this time, the excess part of the pin 210 can be used as a solder pad, that is, the length of the pin 210 extending from the third channel 123 matches the thickness of the solder pad.

[0053] As another optional implementation, the length of the pin 210 extending from the third channel 123 can be made longer at the same time; the number of pins 210 is two, the first channels 121 are the same as the pins 210, and the two first channels 121 are arranged at intervals in the second direction; the two second channels 122 extend in opposite directions along the second direction respectively; the two third channels 123 are arranged at intervals in the second direction; bending grooves 124 are respectively formed on the first end face 101 corresponding to the outlets of the third channels 123, and the bending grooves 124 are used for placing the pins 210 that pass through the third channels 123 and are bent.

[0054] It can be understood that the two second channels 122 extend in opposite directions respectively, making the arrangement of the pins 210 more flexible, enabling more efficient space utilization on the first end face 101 of the package 100, and reducing the interference between the pins 210 and the risk of electrical short circuit at the same time; at the same time, the setting of the bending grooves 124 ensures that the pins 210 can be reliably bent to the corresponding positions after passing through the third channels 123, which not only improves the stability of the package 100, but also leaves enough long pins 210, making the subsequent connection between the pins 210 and the circuit board more firm, and avoiding the problem of poor soldering caused by improper positions of the pins 210.

[0055] Specifically, as Figure 5 shown, the two bending grooves 124 extend in opposite directions along the third direction respectively, and the third direction is perpendicular to the first direction and the second direction respectively. At this time, it means that the two pins 210 finally extend in opposite directions, which can increase the distance between the pins 210 to improve the overall safety. As another optional implementation, the two bending grooves 124 can both extend in the same direction.

[0056] For the convenience of those skilled in the art to understand, this embodiment also provides a preparation method for a vehicle-grade multi-lead SMD package, and the specific steps include:

[0057] Step S201: Place the electronic device 200 into the installation groove 103, and make the pins 210 correspondingly pass through the first channels 121;

[0058] Step S202: Apply pressure to the part of the pins 210 located in the first avoidance groove 106 and the part of the pins 210 exceeding the first avoidance groove 106 in the second direction, and make the pins 210 bend towards the second channels 122;

[0059] Step S203: Apply pressure to the part of the pin 210 located in the second relief groove 107 and the part of the pin 210 extending beyond the second relief groove 107 in the first direction, so that the pin 210 bends towards the third channel 123;

[0060] Step S204: Apply pressure to the part of the pin 210 extending beyond the third channel 123 in the third direction, so that the pin 210 bends towards the bending groove 124.

[0061] Further, as Figures 1 to 6 shown, the first relief groove 106 extends to the farthest second channel 122 to form a limiting groove 108 between two adjacent second channels 122; the limiting groove 108 communicates between the two second channels 122, and two bending members 300 are detachably and slidably connected in the limiting groove 108. One bending member 300 extends from the limiting groove 108 to the outside of one first relief groove 106, and the other bending member 300 extends from the limiting groove 108 to the outside of the other first relief groove 106.

[0062] For the convenience of those skilled in the art to understand, step S202 is specifically described. Step S202 specifically includes:

[0063] Step S2021: Push the bending member 300 to slide along the limiting groove 108 in the second direction, so that the bending member 300 moves in the direction close to its corresponding third channel 123. It can be understood that the bending member 300 corresponds to the first relief groove 106 one by one, and the first relief groove 106 corresponds to the second channel 122 and the third channel 123 one by one. Thus, when the bending member 300 moves in the direction close to the third channel 123, it will apply pressure to the pin 210, causing the part of the pin 210 extending beyond the first channel 121 to bend towards the second channel 122.

[0064] Specifically, in the above steps, in steps S202 to S204, the bending steps can be realized by a bending machine or manually; after introducing the bending member 300, it means that all bending steps are implemented above the second end face 102. For example, through a fixture (the fixture needs to be provided with a relief groove corresponding to the position of the pin 210) and the second end face 102 to cooperate to initially clamp and position the package 100. After inserting the electronic device 200 into the installation groove 103, pressure can be applied to the bending member 300 from the first side face 104 to apply pressure to the pin 210 through the bending member 300, so that the pin 210 bends towards the second channel 122. At this time, the end of the pin 210 has moved from below the package 100 to the side face, which is convenient for subsequent manual or bending machine to bend it.

[0065] It should be noted that along the first direction, the second avoidance groove 107 penetrates through the first end face 101 and the second end face 102, facilitating the part of the pin 210 that extends beyond the second channel 122 to be bent towards the third channel 123.

[0066] For the convenience of those skilled in the art to understand, the formation method of the channels of the package 100 is described as follows:

[0067] Step S101: Provide a package 100 with an installation groove 103; the electronic device 200 includes two pins 210.

[0068] Step S102: Open a first channel 121 at a position corresponding to the pin 210 on the bottom wall of the installation groove 103, and the first channel 121 penetrates through the bottom wall of the installation groove 103.

[0069] Step S103: Open a first avoidance groove 106 at a position corresponding to a first channel 121 on a first side surface 104 of the package 100, and the first avoidance groove 106 extends to the first channel 121 and overlaps with the first channel 121; open a first avoidance groove 106 at a position corresponding to the other first channel 121 on the other first side surface 104 of the package 100, and the first avoidance groove 106 extends to the first channel 121 and overlaps with the first channel 121; a limiting groove 108 is formed by connecting the two first avoidance grooves 106.

[0070] Step S104: Open a second avoidance groove 107 at a position corresponding to a second channel 122 on a second side surface 105 of the package 100, and the second avoidance groove 107 extends to the second channel 122 and overlaps with the second channel 122; open a second avoidance groove 107 at a position corresponding to the other second channel 122 on the other second side surface 105 of the package 100, and the second avoidance groove 107 extends to the second channel 122 and overlaps with the second channel 122.

[0071] Step S105: Pass a bending part 300 through a first avoidance groove 106 and assemble it in the limiting groove 108, and pass the other bending part 300 through the other first avoidance groove 106 and assemble it in the limiting groove 108.

[0072] As a preferred embodiment, the bending member 300 includes a bending body portion 310 passing through the first avoidance groove 106 and the second channel 122. The bending body portion 310 is connected with a bending transition portion 320 in the limiting groove 108, and the bending transition portion 320 is arranged in parallel with the second channel 122; the bending transition portion 320 is connected with a bending connection portion 330; wherein, the two bending connection portions 330 are connected by a tension spring. Wherein, to ensure the directional movement of the bending member 300 along the second direction, structures such as a slide rail and a slider can be arranged in the first avoidance groove 106, so that the bending member 300 can slide in the first avoidance groove 106 along the second direction; the bending member can also be clamped by a manipulator to ensure that the bending member 300 can slide in the first avoidance groove 106 along the second direction, which is not limited in this embodiment.

[0073] It should be noted that in the bending member 300, the bending body portion 310 and the bending transition portion 320 are arranged in an "L" shape. For the pin 210, it can increase the contact area, ensure that the pin 210 always extends accurately along the predetermined trajectory during the bending process, and ensure the accuracy and stability of the pin 210 during the assembly process; then, the extended bending connection portion 330 is slidably connected in the limiting groove 108 to initially ensure the smooth movement of the bending member 300. Then, in cooperation with the tension spring pulling the two bending connection portions 330, the tension spring can evenly distribute the pressure applied to the bending member 300, avoiding the problem of uneven bending or damage of the pin 210 caused by excessive unilateral force, and further ensuring that the two bending members 300 can push outward smoothly and evenly. More specifically, when the bending member 300 needs to move and apply pressure, the tension spring can effectively provide a reverse force to ensure that the two bending members 300 are always in a stable state during the process of bending the pin 210, ensuring that the pin 210 will not undergo uneven deformation during the entire assembly process, ensuring the bending accuracy of the pin, and further improving the assembly quality.

[0074] On the basis of the above embodiment, the package 100 is convexly provided with a positioning block 130 on the second end face 102, and a positioning hole 131 is opened on the positioning block 130. The positioning hole 131 is used for clamping and positioning by a fixture. In cooperation with the use of the bending member 300, the bending step can be integrated above the second end face 102, thereby simplifying the bending step, reducing the bending difficulty, and being able to complete the subsequent bending action with a single fixture positioning.

[0075] Embodiment Two:

[0076] This embodiment also provides a preparation method for a vehicle-grade multi-lead SMD package, which is applied to the vehicle-grade multi-lead SMD package as in Embodiment One, and includes:

[0077] Step S101, providing a package 100 provided with an installation groove 103; the electronic device 200 includes two pins 210;

[0078] Step S102: At the position of the bottom wall of the installation groove 103 corresponding to the pin 210, a first channel 121 is opened, and the first channel 121 penetrates through the bottom wall of the installation groove 103;

[0079] Step S103: At the position of a first side surface 104 of the package 100 corresponding to a first channel 121, a first avoidance groove 106 is opened, and the first avoidance groove 106 extends to the first channel 121 and overlaps with the first channel 121; at the position of the other first side surface 104 of the package 100 corresponding to the other first channel 121, a first avoidance groove 106 is opened, and the first avoidance groove 106 extends to the first channel 121 and overlaps with the first channel 121; a limiting groove 108 is formed by connecting the two first avoidance grooves 106;

[0080] Step S104: At the position of a second side surface 105 of the package 100 corresponding to a second channel 122, a second avoidance groove 107 is opened, and the second avoidance groove 107 extends to the second channel 122 and overlaps with the second channel 122; at the position of the other second side surface 105 of the package 100 corresponding to the other second channel 122, a second avoidance groove 107 is opened, and the second avoidance groove 107 extends to the second channel 122 and overlaps with the second channel 122;

[0081] Step S105: Pass a bending part 300 through a first avoidance groove 106 and assemble it in the limiting groove 108, and pass the other bending part 300 through the other first avoidance groove 106 and assemble it in the limiting groove 108;

[0082] Step S200: Place the electronic device in the installation groove 103, and bend the pins along the guiding channel to the first end face;

[0083] Step S200 specifically includes:

[0084] Step S201: Place the electronic device 200 in the installation groove 103, and make the pins 210 correspondingly pass through the first channels 121;

[0085] Step S202: Apply pressure to the part of the pin 210 located in the first avoidance groove 106 and the part of the pin 210 exceeding the first avoidance groove 106 in the second direction, so that the pin 210 is bent towards the second channel 122;

[0086] Step S203: Apply pressure to the part of the pin 210 located in the second avoidance groove 107 and the part of the pin 210 exceeding the second avoidance groove 107 in the first direction, so that the pin 210 is bent towards the third channel 123;

[0087] Step S204: Apply pressure to the part of the pin 210 that extends beyond the third channel 123 in the third direction, causing the pin 210 to bend towards the bending groove 124;

[0088] Step S205: Take out the bent part 300 to obtain an automotive-grade multi-lead SMD package.

[0089] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automotive-grade multi-lead SMD package, characterized in that, It includes a package, and an installation groove for accommodating an electronic device is formed in a first end surface of the package along a first direction; the first end surface is a mounting surface of the package on a circuit board. A guiding channel is formed in the package, and the guiding channel extends from a bottom wall of the installation groove to the first end surface; at least a part of a lead of the electronic device passes through the guiding channel and extends to the first end surface for surface mounting. Wherein, an avoidance groove is formed in a side surface of the package, and at least a part of the guiding channel is covered by the avoidance groove along an extending direction of the avoidance groove. The guiding channel includes a first channel, a second channel and a third channel which are connected in sequence; the first channel is formed in the bottom wall of the installation groove and extends to a second end surface of the package; the second channel is arranged parallel to the second end surface; the third channel extends to the first end surface. At positions of the package corresponding to each of the second channel and the third channel, a first avoidance groove is formed from a first side surface of the package, and a second avoidance groove is formed from a second side surface of the package; the first avoidance groove extends to the second channel, and the second avoidance groove extends to the third channel. Wherein, the first avoidance groove covers the second channel along a direction perpendicular to the first side surface, and the second avoidance groove covers the third channel along a direction perpendicular to the second side surface. The first avoidance groove extends to the farthest second channel to form a limiting groove between two adjacent second channels. The limiting groove communicates between the two second channels, and two bending members are detachably and slidably connected in the limiting groove. One bending member extends from the limiting groove to the outside of one first avoidance groove, and the other bending member extends from the limiting groove to the outside of the other first avoidance groove. The bending member includes a bending body portion passing through the first avoidance groove and the second channel. The bending body portion is connected with a bending transition portion in the limiting groove, and the bending transition portion is arranged parallel to the second channel; the bending transition portion is connected with a bending connection portion; wherein, the two bending connection portions are connected by a tension spring.

2. The automotive-grade multi-lead SMD package according to claim 1, wherein The number of the leads is two. The first channels are the same as the leads, and the two first channels are arranged at intervals along a second direction; the two second channels extend away from each other along the second direction; the two third channels are arranged at intervals along the second direction. Bending grooves are respectively formed on the first end surface corresponding to outlets of the third channels, and the bending grooves are used for placing the leads passing through the third channels and being bent.

3. The automotive-grade multi-lead SMD package according to claim 2, characterized in that, The two bending grooves extend away from each other along a third direction, and the third direction is respectively perpendicular to the first direction and the second direction.

4. The automotive-grade multi-lead SMD package according to claim 3, characterized in that, A positioning block protrudes from the second end surface of the package, and a positioning hole is formed in the positioning block.

5. The automotive-grade multi-lead SMD package according to claim 3, wherein Along the first direction, the second avoidance groove penetrates through the first end surface and the second end surface.

6. A preparation method of an automotive-grade multi-lead SMD package, characterized in that, Applied to the automotive-grade multi-lead SMD package according to any one of claims 1-5, it includes: Placing the electronic device into the installation groove, and bending the leads along the guiding channel to the first end surface.

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