Negative pressure forming detection device for flexible circuit board of eddy current sensor

Abstract

The invention discloses a negative pressure forming detection device for a flexible circuit board of an eddy current sensor, which comprises a detection body which is made of a non-metal material and is provided with a vacuum adsorption surface, and a mounting molded surface of the flexible circuit board and an adsorption hole for forming vacuum adsorption are formed on the vacuum adsorption surface. According to the structure, the vacuum adsorption surface is formed, and then the mounting molded surface on the flexible circuit board is formed on the vacuum adsorption surface, so that when the flexible circuit board is adsorbed on the vacuum adsorption surface for testing, the mounting form of the flexible circuit board is simulated, and the flexible circuit board can be fixed at the same position; various tested parameters are tested under the same deformation and in a simulated installation state, and the stability of parameter testing is improved.

Description

Technical Field

[0001] The invention relates to the technical field of flexible circuit board testing, and in particular to a negative pressure forming detection device for a flexible circuit board using an eddy current sensor. Background Art

[0002] Eddy-current displacement sensor is a sensor based on the principle of electromagnetic induction and eddy current effect. It has many advantages of electromagnetic induction sensors, such as strong anti-interference ability, resistance to shock and vibration, high sensitivity, and no influence of medium. It is widely used in industries with harsh working environments such as industry, aviation, and aerospace.

[0003] The eddy current sensor uses the electromagnetic effect. When the transmitting coil is energized, an excitation electromagnetic field is generated. When a metal object approaches the magnetic field, part of the energy generated by the magnetic field is transferred to the metal field, generating a current on the surface of the metal object, which is generally called eddy current. These currents will generate a secondary magnetic field, which reacts to the original magnetic field and weakens the original magnetic field. The size of the eddy current is a function of distance, material, and size. Specifically, the cross-section and number of turns of the transmitting and receiving coils affect the sensitivity and phenomenon range of the eddy current sensor.

[0004] In the prior art, eddy current sensor probes use flexible circuit boards to achieve complex coils and smaller thicknesses to ensure the consistency of their performance. During the production process of such sensor probes, the state consistency of the flexible circuit board needs to be maintained, because the flexible characteristics of the flexible circuit board restrict the mass production of flexible coil board eddy current sensors. For flexible circuit boards, the existing detection method is to place the flexible circuit board on a desktop or foam platform to test it as closely as possible. However, based on the flexible characteristics of the flexible circuit board, this method cannot keep the position of the flexible circuit board consistent when testing different parameters, resulting in the inability to keep the deformation consistent when testing different parameters, resulting in unstable parameter testing. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides an eddy current sensor flexible circuit board negative pressure forming detection device, which includes a detection body formed of a non-metallic material and having a vacuum adsorption surface, on which a mounting profile of the flexible circuit board and adsorption holes for forming vacuum adsorption are formed. The above structure forms a vacuum adsorption surface, and then forms a mounting profile on the flexible circuit board on the vacuum adsorption surface. When the flexible circuit board is adsorbed on the vacuum adsorption surface for testing, the flexible circuit board is simulated in the form of being installed, and the flexible circuit board can be fixed in the same position, so that various parameters of the test are tested under the same deformation amount and simulated installation state, thereby improving the stability of parameter testing.

[0006] In one embodiment, a positioning pin for positioning the flexible circuit board is also included, and the positioning pin is matched with the positioning hole formed on the vacuum adsorption surface. By providing the positioning pin and the positioning hole matched therewith, the flexible circuit board can be accurately positioned, so that the position and deformation amount of the flexible circuit board with the same structure can be kept consistent during the detection, thereby ensuring the stability and consistency of the flexible circuit board with the same structure during the detection, and avoiding the occurrence of unstable detection.

[0007] In one embodiment, the detection body is provided with an adapter, and the adapter is adapted to the adapter provided on the flexible circuit board. By fixing the adapter, when the flexible circuit board is tested, it is sufficient to insert the adapter into the adapter, which reduces the movement of the connection between the adapter and the adapter, and further ensures the stability during the test.

[0008] Furthermore, the adapter is connected to a detection instrument for detecting parameters of the flexible circuit board through a signal beam. The detection instrument is not specifically limited and can be selected according to specific parameters, such as an E4990A impedance analyzer.

[0009] In one embodiment, the adsorption hole is connected to the vacuum device through a vacuum channel. The vacuum channel is connected to the vacuum device, so that the detection device can be easily moved, and different vacuum devices such as vacuum pumps and negative pressure pipes can be connected at different locations.

[0010] Furthermore, a pressure regulating valve for controlling the adsorption force is provided on the vacuum channel, and an adjusting knob is provided on the pressure regulating valve. By providing the pressure regulating valve, the speed of the adsorption force can be adjusted by rotating the adjusting knob to ensure the best adsorption force.

[0011] In one embodiment, a vent valve is further provided on the vacuum channel, and the flexible circuit board can be quickly removed by providing the vent valve.

[0012] In one embodiment, the detection body is a sealed structural box body. By providing the structural box body, the various structural components mentioned above can be conveniently operated and arranged.

[0013] Furthermore, the structural box body is a cuboid or a cube. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the specific implementation modes of the present invention, the following briefly introduces the drawings required for use in the specific implementation modes. Obviously, the drawings described below are some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 It is a structural schematic diagram of the negative pressure forming detection device of the eddy current sensor flexible circuit board of the present invention;

[0016] Figure 2 It is an optional structural schematic diagram of the negative pressure forming detection device for a flexible circuit board of an eddy current sensor of the present invention;

[0017] Figure 3 It is a schematic structural diagram of the eddy current sensor flexible circuit board negative pressure forming detection device and the flexible circuit board corresponding to the present invention;

[0018] The reference numerals in the figure are as follows: 1-vacuum adsorption surface; 2-detection body; 3-adsorption hole; 4-positioning pin; 5-positioning hole; 6-adapter seat; 7-adapter; 8-signal beam; 9-adjustment knob; 10-vacuum tube. DETAILED DESCRIPTION

[0019] The following is a clear and complete description of the content of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. The embodiments in the present invention and other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the present invention.

[0020] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0023] Example 1

[0024] like Figure 1As shown, the present embodiment discloses an eddy current sensor flexible circuit board negative pressure forming detection device, which includes a detection body 2 formed of a non-metallic material and having a vacuum adsorption surface 1. The non-metallic material is not specifically limited, and is preferably a polymer material, such as plastic. The shape of the detection body 2 is not specifically limited, and can be a regular shape or an irregular shape, and can be a solid structure with a channel or a hollow structure. In the present embodiment, the detection body 2 is a sealed structural box, specifically, a cuboid or a cube with an inner cavity, to be precise, a cuboid with an inner cavity. At this time, the vacuum adsorption surface 1 is a surface of the cuboid. Of course, in order to adapt to a variety of bottom surfaces of the flexible circuit board, the vacuum adsorption surface 1 is not a plane, for example, Figure 2 The structure shown is, of course, not limited to this structure, and can be processed according to the actual bottom surface or installation surface. In order to realize the adsorption function of the vacuum adsorption surface 1, a plurality of adsorption holes 3 for vacuum adsorption are formed on the vacuum adsorption surface 1. The adsorption holes 3 are connected to the vacuum equipment through a vacuum channel. The vacuum channel is related to the specific structure of the detection body 1 and is not specifically limited. In the present embodiment, it includes an inner cavity of a rectangular parallelepiped and a vacuum tube outside the rectangular parallelepiped. Specifically, in the present embodiment, the adsorption holes 3 are connected to the inner cavity of the rectangular parallelepiped, and the vacuum tubes are respectively connected to the inner cavity and the vacuum equipment. The vacuum equipment is preferably a vacuum pump or a pipe with vacuum performance in a certain space. Preferably, in the detection body 1, the adsorption holes 3 are connected to the inner cavity of the rectangular parallelepiped. The vacuum tubes are respectively connected to the inner cavity and the vacuum equipment. The vacuum equipment is preferably a vacuum pump or a pipe with vacuum performance in a certain space. Preferably, The vacuum channel is provided with an air pressure regulating valve for controlling the adsorption force, and the air pressure regulating valve is provided with an adjusting knob 9. In the present embodiment, the air pressure regulating valve (not shown in the figure) is located in the inner cavity, and its adjusting knob is fixed on the outside of a side wall of the cuboid, and the vacuum tube 10 passes through the side wall into the inner cavity and is connected with the interface of the air pressure regulating valve. At this time, the other interface of the air pressure regulating valve can be located in the inner cavity, and the connection between the vacuum tube 10 and the inner wall passed through is sealed. There are various ways to process it, which can be processed by structural parts or by gluing. In order to enable the flexible circuit board to be installed quickly and to ensure consistency after installation, positioning holes 5 are also formed on the vacuum adsorption surface 1. The positioning holes 5 are used in conjunction with the positioning pins 4. In the present embodiment, there are two positioning holes 5 and two positioning pins 4. Further, an adapter seat 6 is provided on the detection body 2, and the adapter seat 6 is sealed and connected to the side wall of the detection body 1, and it is compatible with the adapter 7 provided on the flexible circuit board, such as Figure 3As shown, when in use, the adapter 7 can be inserted into the adapter 6. As for the output of the signal, the adapter 6 is connected to the detection instrument for detecting the parameters of the flexible circuit board through the signal beam 8. In this embodiment, the signal beam 8 passes through the side wall of the detection body 2 to connect with the detection instrument. Of course, the signal beam 8 passing through the side wall of the detection body 2 also needs to be sealed to ensure the sealing of the detection body 2 and the vacuum adsorption of the flexible circuit board.

[0025] In order to remove the flexible circuit board after the test is completed, a vent valve (not shown in the figure) is also provided on the side wall of the inner cavity of the detection body 2.

[0026] The use process of the present invention is as follows:

[0027] The flexible circuit board is positioned on the vacuum adsorption surface 1 by means of the positioning pin 4, the vent valve is closed, the vacuum pump is started, the adjustment knob is turned to form a negative pressure in the adsorption hole 3, the flexible circuit board is adsorbed on the vacuum adsorption surface 1, and the detection is performed through the detection equipment (such as E4990A impedance analyzer) according to the parameters to be detected; after the detection is completed, the vacuum pump is closed, the vent valve is opened, and the flexible circuit board can be replaced.

[0028] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. An eddy current sensor flexible circuit board negative pressure forming detection device, characterized in that: The device comprises a detection body formed of non-metallic material and having a vacuum adsorption surface, wherein a mounting profile of a flexible circuit board and adsorption holes for forming vacuum adsorption are formed on the vacuum adsorption surface.

2. The eddy current sensor flexible circuit board negative pressure forming detection device according to claim 1 is characterized in that: It also includes positioning pins for positioning the flexible circuit board, and the positioning pins are matched with positioning holes formed on the vacuum adsorption surface.

3. The eddy current sensor flexible circuit board negative pressure forming detection device according to claim 1 is characterized in that: The detection body is provided with an adapter seat, and the adapter seat is adapted to the adapter provided on the flexible circuit board.

4. The eddy current sensor flexible circuit board negative pressure forming detection device according to claim 3 is characterized in that: The adapter is connected to a detection instrument for detecting parameters of the flexible circuit board through a signal beam.

5. The eddy current sensor flexible circuit board negative pressure forming detection device according to claim 1, characterized in that: The adsorption hole is communicated with the vacuum equipment through a vacuum channel.

6. The eddy current sensor flexible circuit board negative pressure forming detection device according to claim 5, characterized in that: An air pressure regulating valve for controlling the adsorption force is arranged on the vacuum channel, and an adjusting knob is arranged on the air pressure regulating valve.

7. The eddy current sensor flexible circuit board negative pressure forming detection device according to claim 6, characterized in that: The vacuum channel is also provided with a vent valve.

8. The eddy current sensor flexible circuit board negative pressure forming detection device according to claim 1, characterized in that: The detection body is a closed structural box body.

9. The eddy current sensor flexible circuit board negative pressure forming detection device according to claim 8, characterized in that: The structural box body is a cuboid or a cube.

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