Display module and display device

Abstract

The invention provides a display module and a display device, relates to the technical field of display, and is used for solving the problem of die marks of display products. The display module comprises a display panel, a flexible circuit board, a heat dissipation film and a buffer layer, wherein the flexible circuit board is located on the non-light-emitting side of the display panel, and the heat dissipation film is located between the flexible circuit board and the display panel; the flexible circuit board comprises a main body part and a bending part which are connected with each other; the main body part is connected with the heat dissipation film, the buffer layer is located between the bending part and the heat dissipation film, and the buffer layer is connected with the heat dissipation film.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the continuous development of display technology, the application fields of display products are becoming more and more extensive. At present, in order to match the overall design of the terminal, the flexible circuit board is designed into a "long neck" structure, and it is not bonded and fixed with other components. However, in logistics storage and daily touch screen use, the unfixed "long neck" will be vibrated and constantly hit other structures nearby, causing the module structure at the corresponding position to have a slight deformation. When the deformation accumulates to a certain extent, it will appear as an uneven screen on the front of the module. This poor display is called mold printing, which will greatly reduce the user experience. Summary of the invention

[0003] The object of the present invention is to provide a display module and a display device for solving the mold printing problem of display products.

[0004] In order to achieve the above object, the present invention provides the following technical solutions:

[0005] A first aspect of the present invention provides a display module, comprising: a display panel, a flexible circuit board, a heat dissipation film and a buffer layer; wherein the flexible circuit board is located on the non-light-emitting side of the display panel, and the heat dissipation film is located between the flexible circuit board and the display panel; the flexible circuit board comprises a main body part and a curved part connected to each other; the main body part is connected to the heat dissipation film, the buffer layer is located between the curved part and the heat dissipation film, and the buffer layer is connected to the heat dissipation film.

[0006] Optionally, the display module also includes an enhanced heat dissipation structure, which includes an enhanced heat dissipation layer, at least part of the enhanced heat dissipation layer is located between the heat dissipation film and the buffer layer, the enhanced heat dissipation layer is connected to the heat dissipation film, the main body is connected to the heat dissipation film through the enhanced heat dissipation layer, the buffer layer is connected to the heat dissipation film through the enhanced heat dissipation layer, and the thermal conductivity of the enhanced heat dissipation layer is higher than the thermal conductivity of the heat dissipation film.

[0007] Optionally, the enhanced heat dissipation layer includes a full-surface film layer, and an orthographic projection of the flexible circuit board on the display panel at least partially overlaps with an orthographic projection of the enhanced heat dissipation layer on the display panel.

[0008] Optionally, the enhanced heat dissipation layer includes a first enhanced heat dissipation pattern and a second enhanced heat dissipation pattern, the cohesive force of the first enhanced heat dissipation pattern is smaller than the cohesive force of the second enhanced heat dissipation pattern, and the thermal conductivity of the first enhanced heat dissipation pattern is higher than the thermal conductivity of the heat dissipation film;

[0009] The display panel includes a panel body and a panel bending portion, the panel bending portion is bent to the non-light-emitting side of the panel body, the panel bending portion is located on the side of the second enhanced heat dissipation pattern facing away from the panel body, and the orthographic projection of the panel bending portion on the panel body at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern on the panel body.

[0010] Optionally, the orthographic projection of the main body part on the panel body at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern on the panel body; and / or, the orthographic projection of the main body part on the panel body at least partially overlaps with the orthographic projection of the first enhanced heat dissipation pattern on the panel body.

[0011] Optionally, the enhanced heat dissipation structure also includes a first double-sided adhesive layer, an edge adhesive layer, and a second double-sided adhesive layer stacked in sequence in a direction away from the display panel, the edge adhesive layer being arranged on the same layer as the enhanced heat dissipation layer, and the edge adhesive layer surrounds the enhanced heat dissipation layer.

[0012] Optionally, the heat dissipation film includes a groove, and the enhanced heat dissipation layer is located in the groove.

[0013] Optionally, the display module further includes a planar layer, and along a direction away from the display panel, the enhanced heat dissipation structure, the planar layer and the buffer layer are stacked in sequence.

[0014] Optionally, the planar layer includes a heat dissipation metal material layer.

[0015] Based on the technical solution of the above display module, a second aspect of the present invention provides a display device including the above display module.

[0016] In the technical solution provided by the present invention, a buffer layer is provided between the curved part of the flexible circuit board and the heat dissipation film, so that the buffer layer can offset the pressure on the heat dissipation film caused by the vibration of the curved part with its excellent compression resilience, thereby fundamentally solving the cause of the slight deformation of the module structure and effectively improving the mold printing problem. Moreover, in the technical solution provided by the present invention, by adding the enhanced heat dissipation layer with a higher thermal conductivity coefficient, the heat generated by the heating component can be quickly transferred to the surrounding environment through the excellent thermal conductivity of the enhanced heat dissipation layer, thereby improving the heat dissipation efficiency of the display module. At the same time, through the excellent thermal conductivity of the enhanced heat dissipation layer, the heat generated by the heating component can be quickly transferred to the heat dissipation metal layer with a larger area but slightly lower thermal conductivity, thereby achieving faster heat dissipation to the environment and further improving the heat dissipation efficiency of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0018] Figure 1 A schematic plan view of the non-light-emitting side of a display module provided by an embodiment of the present invention;

[0019] Figure 2 A first cross-sectional schematic diagram of a display module provided by an embodiment of the present invention;

[0020] Figure 3 For the corresponding Figure 2 A schematic diagram of the layers of the structures located on the non-light-emitting side of the display panel in the first cross-sectional schematic diagram;

[0021] Figure 4 A first schematic plan view of an enhanced heat dissipation structure provided by an embodiment of the present invention;

[0022] Figure 5 A second schematic plan view of the enhanced heat dissipation structure provided by an embodiment of the present invention;

[0023] Figure 6 A second cross-sectional schematic diagram of a display module provided by an embodiment of the present invention.

[0024] Reference numerals:

[0025] 1-glass cover, 2-optical glue,

[0026] 3-Polarizer, 4-Panel body,

[0027] 41- panel bending part, 50- whole surface film layer,

[0028] 51-buffer adhesive layer, 52-heat dissipation metal layer,

[0029] 53-first double-sided adhesive layer, 54-edge adhesive layer,

[0030] 55-second enhanced heat dissipation pattern, 56-first enhanced heat dissipation pattern,

[0031] 57- second double-sided adhesive layer, 58 flat layer,

[0032] 59-buffer layer, 6-flexible circuit board,

[0033] 61-main body portion, 62-bent portion. DETAILED DESCRIPTION

[0034] In order to further illustrate the display module and the display device provided by the embodiments of the present invention, a detailed description is given below in conjunction with the accompanying drawings.

[0035] See also Figures 1 to 6 An embodiment of the present invention provides a display module, comprising: a display panel (including a panel body 4 and a panel bending portion 41), a flexible circuit board 6, a heat dissipation film (including a buffer adhesive layer 51 and a heat dissipation metal layer 52) and a buffer layer 59; wherein the flexible circuit board 6 is located on the non-light-emitting side of the display panel, and the heat dissipation film is located between the flexible circuit board 6 and the display panel; the flexible circuit board 6 includes a main body portion 61 and a bending portion 62 connected to each other; the main body portion 61 is connected to the heat dissipation film, the buffer layer 59 is located between the bending portion 62 and the heat dissipation film, and the buffer layer 59 is connected to the heat dissipation film.

[0036] Exemplarily, the display panel includes a panel body 4 and a panel bending portion 41, the panel bending portion 41 is bent to the non-light-emitting side of the panel body 4; the flexible circuit board 6 is connected to the panel bending portion 41 on the side of the panel bending portion 41 facing away from the panel body 4; at least part of the heat dissipation film is located between the panel body 4 and the panel bending portion 41; the buffer layer 59 is located between the bent portion 62 and the heat dissipation film, and the buffer layer 59 is arranged on the same layer as the panel bending portion 41.

[0037] Exemplarily, the orthographic projection of the bent portion 62 on the display panel is located inside the orthographic projection of the buffer layer 59 on the display panel.

[0038] Exemplarily, the heat dissipation film includes a buffer adhesive layer 51 and a heat dissipation metal layer 52. The buffer adhesive layer 51 is located between the panel body 4 and the heat dissipation metal layer 52, and is used to bond the panel body 4 and the heat dissipation metal layer 52. The buffer adhesive layer 51 also has a certain impact buffering ability; the functions of the heat dissipation metal layer 52 include dissipating heat to the environment and resisting external impact.

[0039] The display module also includes a glass cover plate 1, an optical glue 2 and a polarizer 3. The glass cover plate 1, the optical glue 2 and the polarizer 3 are all arranged on the light-emitting side of the panel body 4, and are stacked in sequence in a direction close to the panel body 4. The glass cover plate 1 is bonded to the panel body 4 through the optical glue 2 and the polarizer 3.

[0040] Exemplarily, the buffer layer 59 includes silicone, rubber, foam, etc. Such materials have excellent compression resilience and can effectively absorb the vibration and impact generated by the curved portion 62 of the flexible circuit board 6. When the buffer layer 59 is deformed by vibration and impact, it can generate a rebound force to offset the external force. At the same time, the buffer layer 59 also has strong toughness and can withstand long-term vibration impact without breaking.

[0041] It should be noted that, in the display module provided by the embodiment of the present invention, the connection between the film layers includes direct bonding or indirect bonding through an adhesive layer, but is not limited thereto.

[0042] It should be noted that the material type and shape of the buffer layer 59 are not limited. The material is only required to have sufficient elasticity and toughness, no deformation during display module testing and use environment, and the shape of the material can cover the curved portion 62.

[0043] It should be noted that the flexible circuit board 6 includes a main body part 61 and a bent part 62 that are connected to each other; the main body part 61 is fixed to the non-light-emitting side of the panel body 4 by means of glue, and the bent part 62 cannot be fixed like the main body part 61 because it needs to be fastened to a fixture for relevant testing. Therefore, during logistics transportation and use of the touch screen after installation, the bent part 62 will be vibrated and will continue to collide with the heat dissipation metal layer, causing a slight deformation at the corresponding position of the module. When the deformation accumulates to a certain extent, it will appear as an uneven screen on the front of the module, thereby greatly reducing the user experience.

[0044] According to the specific structure of the above-mentioned display module, in the display module provided by the embodiment of the present invention, a buffer layer 59 is arranged between the bent portion 62 of the flexible circuit board 6 and the heat dissipation film, so that the buffer layer 59 can offset the pressure on the heat dissipation film caused by the vibration of the bent portion 62 with its excellent compression rebound characteristics, thereby fundamentally solving the cause of the module structure deformation and effectively improving the mold printing problem.

[0045] As the market demands for more functions of display devices, electronic products may run multiple large applications and games at the same time, and the processor workload increases, which will generate more heat. However, with the trend of thinner and lighter display devices, the thickness of display devices cannot be increased at will to obtain more heat dissipation space, so higher requirements are placed on the heat dissipation design of display modules. In addition, as the functions of display devices continue to enrich and the layout of energy-consuming components is compact, the heat generation of the whole machine increases, the heat dissipation efficiency decreases, and the user experience is affected.

[0046] See also Figures 1 to 6 In some embodiments, the display module also includes an enhanced heat dissipation structure, which includes an enhanced heat dissipation layer (including a first enhanced heat dissipation pattern 56 and a second enhanced heat dissipation pattern 55; or, including a whole-surface film layer 50), at least a portion of the enhanced heat dissipation layer is located between the heat dissipation film and the buffer layer 59, the enhanced heat dissipation layer is connected to the heat dissipation film, the main body 61 is connected to the heat dissipation film through the enhanced heat dissipation layer, the buffer layer 59 is connected to the heat dissipation film through the enhanced heat dissipation layer, and the thermal conductivity of the enhanced heat dissipation layer is higher than the thermal conductivity of the heat dissipation film.

[0047] Exemplarily, the enhanced heat dissipation layer includes graphene, but is not limited thereto. It is worth noting that the enhanced heat dissipation layer is not limited to graphene, and the thermal conductivity is significantly higher than that of the heat dissipation metal layer 52.

[0048] Exemplarily, the heat dissipation film, the enhanced heat dissipation layer, the buffer layer 59 and the flexible circuit board 6 are stacked in sequence along a direction away from the panel body 4 .

[0049] In the display module provided by the above embodiment, by adding the enhanced heat dissipation layer with a higher thermal conductivity, the heat generated by the heat generating component can be quickly transferred to the surrounding environment through the excellent thermal conductivity of the enhanced heat dissipation layer, thereby improving the heat dissipation efficiency of the display module. At the same time, through the excellent thermal conductivity of the enhanced heat dissipation layer, the heat generated by the heat generating component can be quickly transferred to the heat dissipation metal layer 52 with a larger area but slightly lower thermal conductivity, thereby achieving faster heat dissipation to the environment, further improving the heat dissipation efficiency of the module.

[0050] like Figure 5 and Figure 6 As shown, in some embodiments, the enhanced heat dissipation layer includes a full-surface film layer 50, and the orthographic projection of the flexible circuit board 6 on the display panel at least partially overlaps with the orthographic projection of the enhanced heat dissipation layer on the display panel.

[0051] Exemplarily, the orthographic projection of the flexible circuit board 6 on the display panel is located inside the orthographic projection of the enhanced heat dissipation layer on the display panel.

[0052] Exemplarily, the entire surface of the enhanced heat dissipation layer includes graphene, but is not limited thereto.

[0053] If the conductive adhesive bonding width around the enhanced heat dissipation layer is large and the bonding strength of the edge glue is not insufficient, the heat dissipation effect can be better enhanced by laying the entire surface of the enhanced heat dissipation layer.

[0054] like Figures 2 to 4 As shown, in some embodiments, the enhanced heat dissipation layer includes a first enhanced heat dissipation pattern 56 and a second enhanced heat dissipation pattern 55, the cohesive force of the first enhanced heat dissipation pattern 56 is smaller than the cohesive force of the second enhanced heat dissipation pattern 55, and the thermal conductivity of the first enhanced heat dissipation pattern 56 is higher than the thermal conductivity of the heat dissipation film;

[0055] The display panel includes a panel body 4 and a panel bending portion 41, the panel bending portion 41 is bent to the non-light-emitting side of the panel body 4, the panel bending portion 41 is located on the side of the second enhanced heat dissipation pattern 55 facing away from the panel body 4, and the orthographic projection of the panel bending portion 41 on the panel body 4 at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern 55 on the panel body 4.

[0056] Exemplarily, the display panel includes a panel body 4 and a panel bending portion 41, the panel body 4 includes array-distributed pixel units, and the panel body 4 is used to realize the display function of the display panel; the panel bending portion 41 serves as the Pad area of ​​the display panel and is used to bind to the flexible circuit board 6.

[0057] Exemplarily, the first enhanced heat dissipation pattern 56 and the second enhanced heat dissipation pattern 55 are made of different materials, for example, the first enhanced heat dissipation pattern 56 is made of graphite (ene), and the second enhanced heat dissipation pattern 55 is made of heat dissipation metal layer material, but not limited thereto.

[0058] Exemplarily, the first enhanced heat dissipation pattern 56 and the second enhanced heat dissipation pattern 55 are independent of each other, and the area of ​​the first enhanced heat dissipation pattern 56 is greater than the area of ​​the second enhanced heat dissipation pattern 55 .

[0059] Exemplarily, the heat dissipation film, the enhanced heat dissipation layer and the panel bending portion 41 are stacked in sequence along a direction away from the panel body 4 .

[0060] Exemplarily, the orthographic projection of the panel bending portion 41 on the panel body 4 does not overlap with the orthographic projection of the first enhanced heat dissipation pattern 56 on the panel body 4 .

[0061] It should be noted that although graphite (ene) has a high thermal conductivity, it has a low tensile strength and a small cohesive force, and is easy to delaminate when pulled. Since the panel bending portion 41 will bend 180° and bonded to the enhanced heat dissipation structure on the non-light-emitting side of the panel body 4, the panel bending portion 41 will generate deformation resilience after bending at a large angle. If the width of the edge glue near the attachment area is narrow, the peeling force of the graphite (ene) layer glue is insufficient, and the edge glue will be separated from the upper and lower layers due to insufficient adhesion, resulting in the delamination of graphite (ene) and the display module, which indirectly leads to the delamination and fracture of graphite (ene).

[0062] In the display module provided in the above embodiment, the enhanced heat dissipation layer is provided to include a first enhanced heat dissipation pattern 56 and a second enhanced heat dissipation pattern 55, the cohesive force of the first enhanced heat dissipation pattern 56 is less than the cohesive force of the second enhanced heat dissipation pattern 55, and at the same time, the orthographic projection of the panel bending portion 41 on the panel body 4 is provided to at least partially overlap with the orthographic projection of the second enhanced heat dissipation pattern 55 on the panel body 4; so that in the direction perpendicular to the panel body 4, the panel bending portion 41 can overlap with the second enhanced heat dissipation pattern 55 with better tensile strength, and the bonding area between the second enhanced heat dissipation pattern 55 and the double-sided adhesive located on the upper and lower layers thereof is large enough, and the situation of delamination due to insufficient bonding force of the double-sided adhesive will not occur. Therefore, the enhanced heat dissipation layer is provided to include the second enhanced heat dissipation pattern 55, which effectively improves the problem of delamination of graphene and display module caused by the bending resilience of the panel bending portion 41.

[0063] Moreover, in the display module provided by the above embodiment, the thermal conductivity of the first enhanced heat dissipation pattern 56 is set to be higher than the thermal conductivity of the heat dissipation film, which improves the above problem and ensures the overall heat dissipation performance of the display module.

[0064] like Figures 2 to 4 As shown, in some embodiments, the orthographic projection of the main body part 61 on the panel body 4 is set to at least partially overlap with the orthographic projection of the second enhanced heat dissipation pattern 55 on the panel body 4; and / or, the orthographic projection of the main body part 61 on the panel body 4 is set to at least partially overlap with the orthographic projection of the first enhanced heat dissipation pattern 56 on the panel body 4.

[0065] Exemplarily, the orthographic projection of the bent portion 62 on the panel body 4 at least partially overlaps with the orthographic projection of the first enhanced heat dissipation pattern 56 on the panel body 4; and / or, the orthographic projection of the bent portion 62 on the panel body 4 at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern 55 on the panel body 4.

[0066] Exemplarily, the orthographic projection of the bent portion 62 on the panel body 4 is located inside the orthographic projection of the first enhanced heat dissipation pattern 56 on the panel body 4 .

[0067] The above-mentioned setting makes the orthographic projection of the main part 61 on the panel body 4 at least partially overlap with the orthographic projection of the second enhanced heat dissipation pattern 55 on the panel body 4, which can ensure the bonding performance between the main part 61 and the enhanced heat dissipation layer and avoid the delamination problem between the main part 61 in the flexible circuit board 6 and the enhanced heat dissipation layer.

[0068] The above-mentioned setting of the main body 61 on the panel body 4 at least partially overlaps the orthographic projection of the first enhanced heat dissipation pattern 56 on the panel body 4, which can ensure that the enhanced heat dissipation layer can better dissipate the heat generated by the flexible circuit board 6, thereby ensuring the overall heat dissipation performance of the display module.

[0069] The above-mentioned setting of the orthographic projection of the bent portion 62 on the panel body 4 at least partially overlaps with the orthographic projection of the first enhanced heat dissipation pattern 56 on the panel body 4, further ensuring that the enhanced heat dissipation layer can better dissipate the heat generated by the flexible circuit board 6, thereby ensuring the overall heat dissipation performance of the display module.

[0070] The above-mentioned setting makes the orthographic projection of the bent portion 62 on the panel body 4 at least partially overlap with the orthographic projection of the second enhanced heat dissipation pattern 55 on the panel body 4, further increasing the area of ​​the second enhanced heat dissipation pattern 55, better improving the bonding performance of the enhanced heat dissipation layer, and further avoiding the delamination problem of the enhanced heat dissipation layer.

[0071] like Figures 3 to 5 As shown, in some embodiments, the enhanced heat dissipation structure also includes a first double-sided adhesive layer 53, an edge adhesive layer 54, and a second double-sided adhesive layer 57 stacked in sequence in a direction away from the display panel, and the edge adhesive layer 54 is arranged on the same layer as the enhanced heat dissipation layer, and the edge adhesive layer 54 surrounds the enhanced heat dissipation layer.

[0072] Although graphene has excellent thermal conductivity, its density is relatively low, the layers are bonded by weak van der Waals forces, the interaction force between molecules is relatively small, the tensile strength and elongation are low, and it is easy to break along the layers when subjected to external forces.

[0073] The enhanced heat dissipation structure set up as described above also includes a first double-sided adhesive layer 53, an edge adhesive layer 54 and a second double-sided adhesive layer 57 which are stacked in sequence along a direction away from the display panel, so that the first double-sided adhesive layer 53 can respectively bond the edge adhesive and the enhanced heat dissipation layer to the heat dissipation metal layer 52 in the heat dissipation film, and the first double-sided adhesive layer 53, the edge adhesive layer 54 and the second double-sided adhesive layer 57 can confine the enhanced heat dissipation layer in a sealed space formed by the three, thereby effectively preventing the material in the enhanced heat dissipation layer from breaking, breaking and dropping foreign objects.

[0074] like Figure 6 As shown, in some embodiments, the heat dissipation film includes a groove, and the enhanced heat dissipation layer is located in the groove.

[0075] Exemplarily, the heat dissipation film includes a buffer adhesive layer 51 and a heat dissipation metal layer 52, wherein the buffer adhesive layer 51 is located between the panel body 4 and the heat dissipation metal layer 52, the heat dissipation metal layer 52 includes a hollow area, and the hollow area and the buffer adhesive layer 51 together form the groove, the heat dissipation metal layer 52 serves as the groove wall of the groove, and the buffer adhesive layer 51 serves as the groove bottom of the groove. The enhanced heat dissipation layer is located in the groove, and is arranged in the same layer as the heat dissipation metal layer 52, and is bonded to the buffer adhesive layer 51.

[0076] Exemplarily, the heat dissipation metal layer 52 surrounds the enhanced heat dissipation layer, but is not limited thereto.

[0077] When the enhanced heat dissipation layer is provided in the above manner, it is only necessary to make grooves on the heat dissipation film and directly attach the enhanced heat dissipation layer to the buffer adhesive layer, which not only improves the heat dissipation efficiency but also achieves the thinning of the display module.

[0078] In more detail, the heat dissipation film arranged above includes a groove, and the enhanced heat dissipation layer is located in the groove, so that the four sides of the enhanced heat dissipation layer can be edged by the heat dissipation metal layer 52, and at the same time, the surface of the enhanced heat dissipation layer facing the display panel can be directly bonded with the buffer adhesive layer 51, so that the first double-sided adhesive layer 53 and the edge adhesive layer 54 that are originally required to be set can be removed. This solution not only simplifies the production process of the display module, but also realizes the thinning requirement of the display module.

[0079] Moreover, the above-mentioned setting method enables the orthographic projection of the panel bending portion 41 on the display panel to overlap with the orthographic projection of the heat dissipation metal layer 52 on the display panel, thereby ensuring that the bonding between the panel bending portion 41 and the heat dissipation metal layer 52 is light. Therefore, the enhanced heat dissipation layer can be set as a full-surface film layer structure, thereby further improving the heat dissipation performance of the display module.

[0080] like Figures 2 to 6 As shown, in some embodiments, the display module further includes a planar layer 58 , and along a direction away from the display panel, the enhanced heat dissipation structure, the planar layer 58 and the buffer layer 59 are stacked in sequence.

[0081] Exemplarily, the surface of the flat layer 58 facing the panel body 4 is bonded to the second double-sided adhesive layer 57, and the surface of the flat layer 58 facing away from the panel body 4 is bonded to the buffer layer 59, the main part 61 of the flexible circuit board 6 and the panel bending part 41 of the display panel.

[0082] Since the main body 61 of the flexible circuit board 6 and the panel bending portion 41 of the display panel both need to be attached to the enhanced heat dissipation structure, the attachment surface needs to maintain a certain degree of flatness. The above-mentioned display module also includes a flat layer 58, so that the flat layer 58 can flatten the step difference of the enhanced heat dissipation structure facing away from the surface of the panel body 4, thereby ensuring the flatness of the attachment surface of the enhanced heat dissipation structure facing away from the panel body 4, thereby ensuring the attachment effect of the main body 61 of the flexible circuit board 6 and the panel bending portion 41 of the display panel.

[0083] like Figures 2 to 6 As shown, in some embodiments, the planar layer 58 includes a heat dissipation metal material layer.

[0084] The above-mentioned flat layer 58 includes a heat dissipation metal material layer, which further improves the overall heat dissipation performance of the display module.

[0085] A second aspect of the present invention provides a display device, comprising the display module provided by the above embodiment.

[0086] It should be noted that the display device can be any product or component with display function, such as a television, a monitor, a digital photo frame, a mobile phone, a tablet computer, etc., wherein the display device also includes a flexible circuit board 6, a printed circuit board and a backplane.

[0087] In the display module provided by the above embodiment, a buffer layer 59 is arranged between the bent portion 62 of the flexible circuit board 6 and the heat dissipation film, so that the buffer layer 59 can offset the pressure on the heat dissipation film caused by the vibration of the bent portion 62 with its excellent compression resilience, thereby fundamentally solving the cause of the module structure deformation and effectively improving the mold printing problem.

[0088] In the display module provided by the above embodiment, by adding the enhanced heat dissipation layer with a higher thermal conductivity, the heat generated by the heat-generating component can be quickly transferred to the surrounding environment through the excellent thermal conductivity of the enhanced heat dissipation layer, thereby improving the heat dissipation efficiency of the display module. At the same time, through the excellent thermal conductivity of the enhanced heat dissipation layer, the heat generated by the heat-generating component can be quickly transferred to the heat dissipation metal layer with a larger area but slightly lower thermal conductivity, thereby achieving faster heat dissipation to the environment, further improving the heat dissipation efficiency of the module.

[0089] Therefore, the display device provided by the embodiment of the present invention also has the above-mentioned beneficial effects when including the above-mentioned display module, which will not be described in detail here.

[0090] It should be noted that the signal line extends along a certain direction means that: the signal line includes a main part and a secondary part connected to the main part, the main part is a line, a line segment or a strip-shaped body, the main part extends along a certain direction, and the length of the main part extending along the certain direction is greater than the length of the secondary part extending along other directions.

[0091] It should be noted that the "same layer" in the embodiment of the present invention may refer to a film layer on the same structural layer. Or, for example, a film layer on the same layer may be a film layer for forming a specific pattern formed by the same film forming process, and then the film layer is patterned by the same mask through a single composition process to form a layer structure. Depending on the specific pattern, a single composition process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses.

[0092] In the various method embodiments of the present invention, the serial numbers of the steps cannot be used to limit the sequence of the steps. For ordinary technicians in this field, without paying creative work, changes to the sequence of the steps are also within the protection scope of the present invention.

[0093] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the method embodiment, since it is basically similar to the product embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiment.

[0094] Unless otherwise defined, the technical terms or scientific terms used in this disclosure should be understood by people with ordinary skills in the field to which the present invention belongs. "First", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect", "couple" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0095] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0096] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0097] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A display module, characterized in that: include: A display panel, a flexible circuit board, a heat dissipation film and a buffer layer; wherein the flexible circuit board is located on the non-light-emitting side of the display panel, and the heat dissipation film is located between the flexible circuit board and the display panel; the flexible circuit board includes a main body part and a curved part connected to each other; the main body part is connected to the heat dissipation film, the buffer layer is located between the curved part and the heat dissipation film, and the buffer layer is connected to the heat dissipation film.

2. The display module according to claim 1, characterized in that: The display module also includes an enhanced heat dissipation structure, which includes an enhanced heat dissipation layer, at least part of which is located between the heat dissipation film and the buffer layer, the enhanced heat dissipation layer is connected to the heat dissipation film, the main body is connected to the heat dissipation film through the enhanced heat dissipation layer, the buffer layer is connected to the heat dissipation film through the enhanced heat dissipation layer, and the thermal conductivity of the enhanced heat dissipation layer is higher than the thermal conductivity of the heat dissipation film.

3. The display module according to claim 2, characterized in that: The enhanced heat dissipation layer includes a full-surface film layer, and the orthographic projection of the flexible circuit board on the display panel at least partially overlaps with the orthographic projection of the enhanced heat dissipation layer on the display panel.

4. The display module according to claim 2, characterized in that: The enhanced heat dissipation layer includes a first enhanced heat dissipation pattern and a second enhanced heat dissipation pattern, the cohesive force of the first enhanced heat dissipation pattern is smaller than the cohesive force of the second enhanced heat dissipation pattern, and the thermal conductivity of the first enhanced heat dissipation pattern is higher than the thermal conductivity of the heat dissipation film; The display panel includes a panel body and a panel bending portion, the panel bending portion is bent to the non-light-emitting side of the panel body, the panel bending portion is located on the side of the second enhanced heat dissipation pattern facing away from the panel body, and the orthographic projection of the panel bending portion on the panel body at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern on the panel body.

5. The display module according to claim 4, characterized in that: The orthographic projection of the main body portion on the panel body at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern on the panel body; And / or, an orthographic projection of the main body portion on the panel body at least partially overlaps with an orthographic projection of the first enhanced heat dissipation pattern on the panel body.

6. The display module according to any one of claims 2 to 5, characterized in that: The enhanced heat dissipation structure also includes a first double-sided adhesive layer, an edge adhesive layer, and a second double-sided adhesive layer stacked in sequence in a direction away from the display panel. The edge adhesive layer is arranged on the same layer as the enhanced heat dissipation layer, and the edge adhesive layer surrounds the enhanced heat dissipation layer.

7. The display module according to any one of claims 2 to 5, characterized in that: The heat dissipation film comprises a groove, and the enhanced heat dissipation layer is located in the groove.

8. The display module according to claim 2, characterized in that: The display module further includes a flat layer, and along a direction away from the display panel, the enhanced heat dissipation structure, the flat layer and the buffer layer are stacked in sequence.

9. The display module according to claim 8, characterized in that: The planar layer includes a heat dissipation metal material layer.

10. A display device, characterized in that: It comprises the display module as claimed in any one of claims 1 to 9.

Images