Wafer cutting method, system and wafer cutting equipment

Abstract

The present invention discloses a wafer cutting method, system and wafer cutting equipment. The wafer cutting method includes the following steps: S1, obtaining the distances measured by a circle of distance sensors arranged on the outer periphery of the wafer carrier. Each distance sensor measures the distance between it and the crystal ring frame, and the wafer where the crystal ring frame is located is concentrically arranged on the wafer carrier; S2, determining the difference between the maximum value and the minimum value of a set of distances measured by a circle of the distance sensors, and determining whether the difference is greater than a difference threshold; S3, when it is determined that the difference is greater than the difference threshold, stopping the processing and sending out an alarm; S4, when it is determined that the difference is less than or equal to the difference threshold, continuing the processing of the wafer. The present invention can timely detect abnormal situations and stop the processing, effectively avoiding the problems that may occur when continuing to fix the crystal ring frame and cut the wafer when the crystal ring frame is abnormal, which is beneficial to ensuring the cutting quality.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, in particular to a wafer cutting method, system and wafer cutting equipment. Background Art

[0002] In wafer processing, the wafer body is concentrically attached to the crystal ring frame through a thin film as a wafer, and then the wafer is placed on the chuck table of a dicing machine for cutting the wafer body.

[0003] The patent document with the authorization announcement number CN218614808U discloses a common workbench structure. In this structure, a set of fixing components is arranged on the outer periphery of the chuck table (base table) to fix the crystal ring frame.

[0004] However, during actual processing, there are abnormal situations such as large deformation of the crystal ring frame itself, loosening and inclination of the support blocks of the fixing components, and inconsistent top surface heights. These abnormal situations will cause uneven forces on different regions of the crystal ring frame when fixing the crystal ring frame through the fixing components, and the problem of the crystal ring frame deforming and pulling the thin film. When the thin film is pulled, there are the following risks:

[0005] (1) The overall position of the wafer moves slightly, resulting in the wafer not being concentric with the chuck table, affecting subsequent accurate cutting.

[0006] (2) The thin film becomes locally thinner due to pulling, causing uneven heights at different positions on the upper surface of the wafer body, resulting in different depths of cutting marks during cutting. Summary of the Invention

[0007] The purpose of the present invention is to solve the above problems existing in the prior art, and provide a wafer cutting method, system and wafer cutting equipment.

[0008] The purpose of the present invention is achieved through the following technical solutions:

[0009] A wafer cutting method includes the following steps:

[0010] S1, obtaining the distances measured by a circle of distance sensors arranged on the outer periphery of the chuck table, each distance sensor measuring the distance between it and the crystal ring frame, and the wafer where the crystal ring frame is located is concentrically arranged on the chuck table;

[0011] S2, determining the difference between the maximum value and the minimum value of a group of distances measured by the circle of distance sensors, and determining whether the difference is greater than a difference threshold;

[0012] S3, when it is determined that the difference is greater than the difference threshold, stopping the processing and sending an alarm;

[0013] S4. When it is determined that the difference is less than or equal to the difference threshold, continue the processing of the wafer.

[0014] Preferably, an installation ring is concentrically arranged on the outer periphery of the susceptor. A set of pressing mechanisms is evenly arranged in a circle on the installation ring. The distance measuring sensors are arranged at or beside each pressing mechanism. The pressing mechanisms are arranged on the installation ring so as to be adjustable in position along the radial direction of the susceptor.

[0015] Preferably, the pressing mechanism includes a movable seat arranged on the installation ring. A cushion block is arranged on the movable seat, and a downward pressing component for pressing the crystal ring frame on the cushion block. The downward pressing component includes a pressing block and a pressing driving device for driving the pressing block to move along the axial direction and the horizontal direction of the susceptor.

[0016] Preferably, the cushion block is connected to the movable seat through a bolt whose axis is parallel to the axis of the susceptor. A set of adjusting set screws is also penetrated through the cushion block, and the axis of the adjusting set screws is parallel to the axis of the susceptor.

[0017] Preferably, a set of pressing mechanisms is driven and synchronously adjusted by a synchronous driving mechanism;

[0018] When the size information of the wafer to be processed is obtained, control the synchronous driving mechanism to drive a set of the pressing mechanisms to adjust the position according to the size information of the wafer to be processed.

[0019] Preferably, the synchronous driving mechanism includes a driving ring concentrically arranged at the bottom of the installation ring. The driving ring is connected to and driven by a self-rotation driving component for its self-rotation, and the driving ring is connected to a set of the pressing mechanisms through a set of linkage rods.

[0020] Preferably, a pressure sensor is arranged on each cushion block. When it is determined that the difference is less than or equal to the difference threshold, start the pressing mechanism to fix the crystal ring frame, obtain the pressure values of a set of the pressure sensors, and determine whether the minimum value in the set of pressure values is greater than the pressure threshold. If so, continue the processing of the wafer. If not, stop the processing and issue an alarm.

[0021] Preferably, during the cutting process,

[0022] Obtain in real time the detection signal of a first detection component for detecting the working state of a first coupling in the lifting driving mechanism at the cutting mechanism, and determine whether the working state of the first coupling is normal; if it is determined that the working state of the first coupling is normal, continue the processing of the wafer; if it is determined that the working state of the first coupling is abnormal, stop the processing;

[0023] And / or obtain in real time the detection signal of a second detection component for detecting the working state of a second coupling in a first-direction translation mechanism at a cutting mechanism, and determine whether the working state of the second coupling is normal; if it is determined that the working state of the second coupling is normal, continue with the processing of the wafer; if it is determined that the working state of the second coupling is abnormal, stop the processing;

[0024] And / or obtain in real time the detection signal of a third detection component for detecting the working state of a third coupling in a second-direction translation mechanism connected to a wafer chuck, and determine whether the working state of the third coupling is normal; if it is determined that the working state of the third coupling is normal, continue with the processing of the wafer; if it is determined that the working state of the third coupling is abnormal, stop the processing.

[0025] A wafer cutting system, comprising:

[0026] A data acquisition unit for obtaining the distances measured by a set of distance sensors arranged in a circle on the outer periphery of a wafer chuck, each distance sensor measuring the distance between it and a crystal ring frame, and the crystal ring frame is concentrically arranged with the wafer on the wafer chuck;

[0027] A difference determination and comparison unit for determining the difference between the maximum value and the minimum value of a set of distances measured by the set of distance sensors in a circle, and determining whether the difference is greater than a difference threshold;

[0028] An alarm unit for stopping the processing and issuing an alarm when it is determined that the difference is greater than the difference threshold;

[0029] A processing unit for continuing with the processing of the wafer when it is determined that the difference is less than or equal to the difference threshold.

[0030] A wafer cutting device, comprising a processor and a memory, the memory stores a program executable by the processor, and when the program is executed, it implements the wafer cutting method described in any one of the above.

[0031] The advantages of the technical solution of the present invention are mainly reflected in:

[0032] Before fixing the crystal ring frame, the method of the present invention uses a set of distance sensors to detect their respective distances to different positions of the crystal ring frame to determine whether there is an abnormality in the crystal ring frame when the wafer is concentrically placed on the wafer chuck, can timely detect abnormal situations and stop the processing, effectively avoids possible problems that may occur when continuing with the fixing of the crystal ring frame and wafer cutting when the crystal ring frame is abnormal, and is beneficial to ensuring cutting quality and cutting safety.

[0033] The clamping mechanism of the present invention changes the conventional method of using a flip cylinder in the prior art. The up and down movement method can effectively avoid the problem that the flip cylinder is not flipped into place, which may cause insufficient contact between the pressure plate and the surface of the wafer ring frame and failure to clamp. This is beneficial to ensure that the bottom surface of the pressure block is in full contact with the wafer ring frame.

[0034] The multiple clamping mechanisms of the present invention are driven and adjusted synchronously by a synchronous driving mechanism, which can effectively meet the needs of fixing wafer ring frames on wafers of different sizes, can be automatically adjusted, and reduce manual intervention; and only one power source is set, so the equipment cost and the use cost are lower; at the same time, the consistency of the adjustment of several clamping mechanisms can be effectively guaranteed.

[0035] The present invention arranges a pressure sensor at each pad block, which can effectively detect whether each clamping mechanism has fully clamped the wafer ring frame, and can timely discover the situation of not clamping, which is conducive to ensuring the reliability of clamping.

[0036] During the processing, the present invention detects the working status of the couplings of each moving mechanism in real time, can promptly discover the abnormal status of the coupling and stop processing, can avoid processing when the moving positions of the wafer table and the main shaft are inaccurate, and is beneficial to ensuring the processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a three-dimensional diagram of the wafer holding platform and its surrounding structures of the present invention;

[0038] Figure 2 is a flow chart of a wafer cutting method according to Embodiment 1 of the present invention;

[0039] Figure 3 It is a partial schematic diagram of the distance measuring sensor and the clamping mechanism arranged on the mounting ring of the present invention, in which the clamping block is hidden;

[0040] Figure 4 is a stereogram of a mounting ring of the present invention;

[0041] Figure 5 It is a schematic diagram of the clamping mechanism of the present invention being connected to the driving ring via a linkage rod;

[0042] Figure 6 is a perspective view of a drive ring of the present invention;

[0043] Figure 7 is a flow chart of the wafer cutting method in Embodiment 2 of the present invention;

[0044] Figure 8 It is a three-dimensional diagram of the wafer holding platform and its surrounding structures of the present invention, in which the pressing blocks of each pressing mechanism are hidden;

[0045] Figure 9It is a flowchart of the wafer cutting method in Embodiment 3 of the present invention;

[0046] Figure 10 It is an exploded view of the wafer cutting mechanism of the present invention, and the wafer chuck and its surrounding structures are hidden in the figure;

[0047] Figure 11 It is a first perspective three-dimensional view of the third detection component and the third coupling area in the present invention;

[0048] Figure 12 It is a second perspective three-dimensional view of the third detection component and the third coupling area in the present invention. Detailed implementation manners

[0049] The objectives, advantages and features of the present invention will be illustrated and explained by the following non-restrictive description of preferred embodiments. These embodiments are only typical examples of applying the technical solutions of the present invention, and all technical solutions formed by equivalent replacement or equivalent transformation fall within the scope of protection required by the present invention.

[0050] In the description of the solution, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of description and simplification of the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Embodiment 1

[0051] The wafer cutting method disclosed by the present invention will be described below with reference to the accompanying drawings. The wafer cutting method is based on a wafer cutting device. Like the prior art, the wafer cutting device generally includes a wafer chuck 100 for carrying and fixing a wafer.

[0052] Different from the prior art:

[0053] As shown in the Figure 1 drawing, a mounting ring 200 concentric with the wafer chuck 100 is provided on the outer periphery of the wafer chuck 100. The top surface of the mounting ring 200 is lower than the top surface of the wafer chuck 100. A set of pressing mechanisms 300 are evenly arranged on the mounting ring 200 in a circumferential manner. The pressing mechanisms 300 are used to fix the crystal ring frame A on the wafer placed on the wafer chuck 100. The number of the pressing mechanisms 300 can be designed according to needs, preferably 3-6. In this embodiment, 4 pressing mechanisms 300 are taken as an example for illustration.

[0054] Each of the pressing mechanisms 300 includes a spacer block 310 and a downward pressing assembly 320 that presses the crystal ring frame A of the wafer on the wafer stage 100 onto the spacer block 310. The spacer block 310 is located above the mounting ring, and the top surface of the spacer block 310 is slightly lower than the top surface of the wafer stage 100. Thus, when the crystal ring frame A is pressed onto the spacer block 310, the thin film on the wafer can be fully sealed with the edge of the wafer stage 100 to ensure that the wafer stage 100 reliably adsorbs the thin film.

[0055] The downward pressing assembly 320 includes a pressing block 321 and a pressing driving device 322 that drives the pressing block 321 to move along the axis of the wafer stage 100 and horizontally. The pressing driving device 322 passes through the mounting ring 200, and it is preferably a rotary clamping cylinder. The cylinder shaft of the rotary clamping cylinder can rotate 90° and extend and retract up and down. When the fixation of the crystal ring frame A is not required, the cylinder shaft of the rotary clamping cylinder extends upward and the pressing block 321 is located outside the crystal ring frame A. At this time, interference with the loading and unloading of the wafer can be avoided; when the fixation of the crystal ring frame A is required, the cylinder shaft of the rotary clamping cylinder retracts downward and rotates 90° so that the pressing block 321 presses on the top surface of the crystal ring frame A to press the crystal ring frame A against the spacer block 310. Of course, the pressing driving device 322 can also adopt other feasible structures, such as a structure combining a rotary cylinder and a cylinder.

[0056] As shown in the attached Figure 1 figure, a circle of distance measuring sensors 400 is further provided on the mounting ring 200. The distance measuring sensors 400 detect the distance upward. At least one distance measuring sensor 400 can be provided beside each pressing mechanism 300. Of course, one distance measuring sensor 400 can also be provided on each spacer block 310. The distance measuring sensors 400 are, for example, laser distance measuring sensors, which are not limited here. When the wafer is concentrically placed on the wafer stage 100, the crystal ring frame A of the wafer is located above the circle of distance measuring sensors 400. Thus, each distance measuring sensor 400 can measure the distance between it and the crystal ring frame A.

[0057] Correspondingly, as shown in the attached Figure 2 figure, the wafer cutting method includes the following steps:

[0058] S0, manually place the wafer to be processed on the wafer stage 100 or place the wafer to be processed on the wafer stage 100 through known automated equipment. After that, the wafer can be adjusted to a position concentric with the wafer stage 100 through a centering mechanism. The centering mechanism and its specific adjustment process are known technologies and will not be elaborated here.

[0059] S1. Obtain the distance between the ring-shaped distance sensors 400 provided on the outer periphery of the wafer stage and the crystal ring frame A measured by the ring-shaped distance sensors 400;

[0060] S2. Determine the difference between the maximum value and the minimum value in a set of distances measured by the ring-shaped distance sensors 400, and determine whether the difference is greater than a difference threshold. Preferably, the difference threshold is 3 microns;

[0061] S3. When it is determined that the difference is greater than the difference threshold, this indicates that there is a height difference at different positions of the crystal ring frame A, and the height difference exceeds the acceptable range. If the crystal ring frame A is continued to be fixed by the pressing mechanism 300, there will be a problem of excessive stretching of the film. Therefore, the processing should be stopped and an alarm should be issued to remind the staff to handle it.

[0062] S4. When it is determined that the difference is less than or equal to the difference threshold, this indicates that the heights at different positions of the crystal ring frame A are the same or approximately the same. When the pressing mechanism 300 fixes the crystal ring frame A, the influence of the deformation of the film can be ignored. Therefore, the processing of the wafer can be continued, that is, the crystal ring frame A can be fixed by the pressing mechanism 300 and subsequent cutting can be carried out.

[0063] In S3, the common reasons for the difference exceeding the difference threshold are as follows. One reason is that the top surface heights of several pads 310 are not uniform; another reason is that the crystal ring frame A itself already has obvious deformation.

[0064] When it is determined that the top surface heights of the pads 310 are not uniform, the pads 310 need to be adjusted. Specifically, as shown in the attached Figure 3 figure, the pads 310 are connected to the mounting ring 200 through bolts (not shown in the figure) passing through the connection holes 311 of the pads. The axis of the bolt is parallel to the axis of the wafer stage 100. At the same time, a set of adjusting screws 340 are also provided on the pads 310. The axis of the adjusting screws 340 is parallel to the axis of the wafer stage 100. When the top surface height of a pad 310 needs to be adjusted, it can be achieved by adjusting the connection depth of the bolt and the mounting ring 200 and the distance that the adjusting screw 340 extends below the pad 310.

[0065] When it is determined that the crystal ring frame A itself already has obvious deformation, the wafer body can be removed from the film, re - laminated and then cut. At the same time, for the abnormal crystal ring frame A, it is corrected by a correction device, for example, the deformed wafer border is stamped by a stamping device. Embodiment 2

[0066] In the above-mentioned Embodiment 1, the position of each pressing mechanism 300 is fixed. In actual processing, the sizes of wafers are diverse. Therefore, in order to better adapt to the processing of wafers of different sizes, each of the pressing mechanisms 300 is arranged on the mounting ring 200 so as to be adjustable in position along the radial direction of the wafer stage 100. At the same time, at least two of the distance measuring sensors 400 are arranged beside each of the pressing mechanisms 300, and the distance measuring sensors 400 are arranged along the moving direction of the pressing mechanism 300 beside them. Of course, if the distance measuring sensors 400 are arranged on the cushion blocks, only one distance measuring sensor 400 needs to be arranged at each pressing mechanism.

[0067] Specifically, as shown in the attached Figure 4 , the attached Figure 5 shows, the mounting ring 200 is a circular ring, and four notches 210 are evenly arranged on the outer edge of the circular ring in the circumferential direction. Each of the pressing mechanisms 300 is movably arranged at each notch 210. At this time, the pressing mechanism 300 includes a moving seat 330 slidably arranged at the notch 210, and a pressing-down assembly 320 and a cushion block 310 are arranged on the moving seat 330. Moreover, the moving seat 330 of each pressing mechanism 300 can be connected to a driver for driving it to move along the notch 210. The driver is, for example, a known linear module, a rodless cylinder, etc., which is not limited herein.

[0068] Furthermore, in order to reduce the drive source, in a more preferred embodiment, as shown in the attached Figure 5 shows, a group of pressing mechanisms 300 are driven and synchronously adjusted by a synchronous drive mechanism 500; the synchronous drive mechanism 500 includes a drive ring 510 concentrically arranged at the bottom of the mounting ring 200. The drive ring 510 is connected to a self-rotation drive assembly 520 for driving its self-rotation, and the drive ring 510 is connected to a group of pressing mechanisms 300 through a group of linkage rods 530. The self-rotation drive assembly 520 is, for example, arranged on a hollow turntable; or the self-rotation drive assembly 520 includes a roller, the roller is connected to a rotary drive motor for driving its self-rotation and the wheel surface of the roller is attached to the outer peripheral surface of the drive ring 510, so that when the roller rotates, the roller drives the drive ring 510 to rotate for adjustment; of course, the roller can also be a gear, and teeth meshing with the gear are formed on the outer periphery of the drive ring.

[0069] As shown in the attached Figure 5 shows, a group of connecting pieces 511 are arranged on the outer edge of the drive ring 510. One end of each connecting piece 511 is pivotally connected to one end of an L-shaped linkage rod 530, and the other end of the linkage rod 530 is pivotally connected to the moving seat 330 of the pressing mechanism 300. Thus, when the drive ring 510 rotates, several pressing mechanisms 300 can be driven to be synchronously adjusted through a group of linkage rods 530.

[0070] To ensure the position accuracy when the driving ring 510 rotates, a set of positioning pins 220 are provided on one of the driving ring 510 and the mounting ring 200, and arc-shaped grooves or arc-shaped holes 512 corresponding to each of the positioning pins 220 are provided on the other.

[0071] As shown in the attached Figure 4 - attached Figure 6 As shown, three equally spaced positioning pins 220 are provided at the bottom of the mounting ring 200, and the circle where the three positioning pins 220 are located is concentric with the mounting ring 200. At the same time, three arc-shaped holes 512 are concentrically provided on the driving ring 510, and each positioning pin 220 is fitted into an arc-shaped hole 512. Thus, when the driving ring 510 rotates, the three positioning pins 220 can move along their respective arc-shaped holes 512, and the driving ring 510 is limited to ensure the synchronization of the plurality of linkage rods 530.

[0072] When processing wafers of one size, the size information of the wafers can be manually input first. Of course, the size information of the wafers to be processed can also be automatically obtained by other means. For example, the size information of the wafers can be determined by detecting the size of the cassette for loading the wafers, or the size of the wafers can be determined by image recognition after loading. There is no limitation here.

[0073] As shown in the attached Figure 7 As shown, when the size information of the wafers to be processed is obtained, the synchronous drive mechanism 500 is controlled according to the size information of the wafers to be processed to drive a set of the pressing mechanisms 300 to adjust their positions. For example, the current position of the pressing mechanism can fix the crystal ring frame of 8-inch wafers. When 12-inch wafers need to be processed, several pressing mechanisms 300 can be adjusted towards the outer edge direction of the mounting ring 200. Embodiment 3

[0074] When the pressing mechanism 300 presses, there is a problem that the crystal ring frame A cannot be stably fixed due to reasons such as unstable air source, slight deformation of the crystal ring frame A, and deformation of the pressing block 321. Therefore, as shown in the attached Figure 8 As shown, a pressure sensor 350 is provided on each of the pads 310. The pressure sensor 350 is located at the middle position of the pad 310, and the detection point of the pressure sensor 350 slightly protrudes above the top surface of the pad 310.

[0075] As shown in the attached Figure 9As shown, when it is determined that the difference does not exceed the difference threshold and the pressing mechanism can be started, start the pressing mechanism 300 to fix the crystal ring frame A of the wafer. At this time, obtain a set of pressure values of the pressure sensors 350, and determine whether the minimum value in the set of pressure values is greater than the pressure threshold. If so, continue the processing of the wafer, that is, start cutting the wafer on the susceptor. If not, stop the processing and issue an alarm. At this time, manual inspection and processing are performed. For example, the position of the magnetic control switch of the rotary pressing cylinder can be adjusted so that the pressing block 321 of the pressing component 320 can press tighter. Specific processing measures can be selected according to needs and are not limited here. Embodiment 4

[0076] In the wafer cutting device, as shown in the appendix Figure 10 As shown, the susceptor 100 is arranged on a second-direction translation mechanism 600 that drives it to translate in the second direction. At the same time, the main shaft 710 of the cutting mechanism 700 is arranged on a lifting drive mechanism 720 that drives it to move up and down and a first-direction translation mechanism 730 that drives the lifting drive mechanism 720 to translate in the first direction, and the first direction and the second direction are perpendicular. During processing, it is necessary to drive the susceptor 100 to move through the second-direction translation mechanism 600 and drive the main shaft 710 to move through the lifting drive mechanism 720 and the first-direction translation mechanism 730 to achieve cutting.

[0077] The first-direction translation mechanism 730, the lifting drive mechanism 720, and the second-direction translation mechanism 600 all adopt a structure of a motor cooperating with a lead screw to generate linear motion, and the power output shaft of the motor is connected to the screw of the lead screw through a coupling. That is, the lifting drive mechanism 720 includes a first coupling, the first-direction translation mechanism 730 includes a second coupling, and the second-direction translation mechanism 600 includes a third coupling.

[0078] The connection stability between the coupling and the power output shaft and the screw of the lead screw will have a significant impact on the position accuracy of the susceptor 100 and the position accuracy of the main shaft 710, and these will greatly affect the cutting accuracy. Therefore, it is necessary to detect the working state of each coupling. Correspondingly, a first detection component is set to detect the working state of the first coupling, a second detection component is set to detect the working state of the second coupling, and a third detection component is set to detect the working state of the third coupling.

[0079] The principles of the first detection component, the second detection component, and the third detection component for detecting the working states of the first coupling, the second coupling, and the third coupling are the same. The following takes the detection of the working state of the third coupling 610 by the third detection component as an example for explanation.

[0080] As shown in the appendix Figure 11 、AppendixFigure 12 As shown, the third detection component at least includes a first detector disposed on the motor base 620 where the motor is located. There are two first detectors, and they respectively correspond to the positions of one hub 611 of the third coupling. The first detector can be a known opposed sensor, which includes a transmitter 630 and a receiver 640 disposed on two support plates of the motor base 620. The detection light emitted by the transmitter 630 is close to or tangent to the edge of the outer peripheral surface of the hub 611 in the locked state. At this time, the detection light emitted by the transmitter 630 can be received by the receiver 640. When the fastening screw of the locked hub 611 becomes loose, the outer peripheral surface of the hub 611 expands outwards due to the looseness, thereby blocking the detection light emitted by the transmitter 630. At this time, the receiver 640 cannot receive the detection light, so it can be determined that the fastening screw is loose, and thus it can be determined that the working state of the third coupling is abnormal. Of course, in other embodiments, the first detector can also be a proximity sensor or a structure in which a self-reflective sensor cooperates with a reflector, which is not limited herein.

[0081] As shown in the appendix Figure 11 As shown, the third detection component may further include a second detector disposed on the motor base 620. The second detection sensor is used to detect the hub 611 of the third coupling that is away from the motor. The second detector is, for example, a visual recognition device. The visual recognition device, for example, uses a CCD (charge-coupled device) to collect images. A light source 660 is also disposed on the motor base 620 on the same side as the CCD 650, and through holes corresponding to the light source and the CCD are disposed on the support plate. And, feature points are disposed on the outer peripheral surface of the hub 611. The feature points are, for example, a groove or a bump or a specific pattern, etc., which is not limited herein.

[0082] When the motor is in the initial position, the feature points on the hub 611 are aligned with the CCD, and the image of the hub 611 at this time is collected as a standard image. Subsequently, after the motor is started, when it is determined that the power output shaft rotates one circle, the CCD is controlled to collect an image, and the collected image is compared with the standard image to determine whether the positions of the feature points on the collected image and the feature points on the standard image are the same or whether the position difference meets the requirements. If they are not the same or the position difference does not meet the requirements, that is, the synchronism between the third coupling and the power output shaft does not meet the requirements, it can be determined that the working state of the third coupling is abnormal; on the contrary, it can be determined that the working state of the third coupling is normal.

[0083] Of course, in other embodiments, the second detector may also adopt a proximity sensor or a ranging sensor 400. For example, when a proximity sensor is adopted, a feature point is provided on the hub 611. The feature point is, for example, a bump protruding from the outer peripheral surface of the hub 611. When the bump is facing the proximity sensor, the proximity sensor can detect the bump. When other positions on the outer peripheral surface of the hub 611 are facing the proximity sensor, the proximity sensor cannot detect the outer peripheral surface of the hub 611.

[0084] When the motor is in the initial position, the proximity sensor can detect the bump. Subsequently, every time the power output shaft rotates one circle, it can be determined whether the proximity sensor detects the bump again or whether the difference between the duration of one rotation of the power output shaft and the duration of one rotation of the coupling determined by the proximity sensor is within the threshold range. The time interval between two consecutive detections of the bump by the proximity sensor is the duration of one rotation of the third coupling. If the proximity sensor detects the bump again when the power output shaft rotates one circle or the difference between the duration of one rotation of the power output shaft and the duration of one rotation of the third coupling is within the difference threshold, it is determined that the synchronization of the third coupling and the power output shaft meets the requirements and the working state of the third coupling is normal; otherwise, it is determined that the working state of the third coupling is abnormal.

[0085] Therefore, during the wafer cutting process, the detection signal of the first detection component is obtained in real time, and it is determined whether the working state of the first coupling is normal; if it is determined that the working state of the first coupling is normal, the wafer processing continues; if it is determined that the working state of the first coupling is abnormal, the processing is stopped.

[0086] And / or obtain the detection signal of the second detection component in real time, and determine whether the working state of the second coupling is normal; if it is determined that the working state of the second coupling is normal, the wafer processing continues; if it is determined that the working state of the second coupling is abnormal, the processing is stopped.

[0087] And / or obtain the detection signal of the third detection component in real time, and determine whether the working state of the third coupling is normal; if it is determined that the working state of the third coupling is normal, the wafer processing continues; if it is determined that the working state of the third coupling is abnormal, the processing is stopped. Embodiment 5

[0088] This embodiment discloses a wafer cutting system, including:

[0089] A data acquisition unit is configured to obtain the distances measured by a circle of distance sensors 400 disposed on the outer periphery of the susceptor 100. Each distance sensor measures the distance between itself and the crystal ring frame, and the crystal ring frame is concentrically disposed on the susceptor with the wafer.

[0090] A difference determination and comparison unit is configured to determine the difference between the maximum value and the minimum value in a set of distances measured by the circle of distance sensors 400, and determine whether the difference is greater than a difference threshold.

[0091] An alarm unit is configured to stop the processing and issue an alarm when it is determined that the difference is greater than the difference threshold.

[0092] A processing unit is configured to continue the processing of the wafer when it is determined that the difference is less than or equal to the difference threshold. Embodiment 6

[0093] This embodiment discloses a wafer cutting device, including a processor and a memory. The memory stores a program executable by the processor. When the program is executed, the above-described wafer cutting method is implemented.

[0094] There are still various implementation manners of the present invention. All technical solutions formed by equivalent transformation or equivalent substitution fall within the protection scope of the present invention.

Claims

1. A wafer cutting method, characterized in that, Including the following steps: S1. Obtain the distances measured by a circle of distance sensors arranged on the outer periphery of the susceptor. Each distance sensor measures the distance between it and the crystal ring frame. The distance sensors detect the distance upward, and the wafer where the crystal ring frame is located is concentrically arranged on the susceptor. An installation ring is concentrically arranged on the outer periphery of the susceptor. A circle of pressing mechanisms is evenly arranged on the installation ring in a circumferential manner. The distance sensors are arranged at or beside each pressing mechanism. The pressing mechanisms are arranged on the installation ring so as to be adjustable in position along the radial direction of the susceptor. A group of pressing mechanisms are driven and synchronously adjusted by a synchronous driving mechanism. When the size information of the wafer to be processed is obtained, the synchronous driving mechanism is controlled according to the size information of the wafer to be processed to drive a group of the pressing mechanisms to adjust their positions. The synchronous driving mechanism includes a driving ring concentrically arranged at the bottom of the installation ring. The driving ring is connected to a self-rotation driving component that drives its self-rotation, and the driving ring is connected to a group of the pressing mechanisms through a group of linkage rods. S2. Determine the difference between the maximum value and the minimum value among a group of distances measured by a circle of the distance sensors, and determine whether the difference is greater than a difference threshold. S3. When it is determined that the difference is greater than the difference threshold, stop the processing and issue an alarm. S4. When it is determined that the difference is less than or equal to the difference threshold, continue the processing of the wafer.

2. The wafer cutting method according to claim 1, wherein: The pressing mechanism includes a moving seat movably arranged on the installation ring. A cushion block is arranged on the moving seat, and a pressing-down component that presses the crystal ring frame on the cushion block. The pressing-down component includes a pressing block and a pressing driving device that drives the pressing block to move axially and horizontally along the susceptor.

3. The wafer cutting method according to claim 2, wherein: The cushion block is connected to the moving seat through bolts whose axes are parallel to the axis of the susceptor. A group of adjusting jackscrews are also arranged on the cushion block, and the axes of the adjusting jackscrews are parallel to the axis of the susceptor.

4. The wafer cutting method according to claim 2, wherein: A pressure sensor is arranged on each cushion block. When it is determined that the difference is less than or equal to the difference threshold, start the pressing mechanism to fix the crystal ring frame, obtain the pressure values of a group of the pressure sensors, and determine whether the minimum value among a group of pressure values is greater than a pressure threshold. If so, continue the processing of the wafer. If not, stop the processing and issue an alarm.

5. The wafer cutting method according to any one of claims 1-4, characterized in that: During the cutting process, Obtain in real time the detection signal of a first detection component for detecting the working state of a first coupling in the lifting driving mechanism at the cutting mechanism, and determine whether the working state of the first coupling is normal. If it is determined that the working state of the first coupling is normal, continue the processing of the wafer. If it is determined that the working state of the first coupling is abnormal, stop the processing. And / or obtain in real time the detection signal of a second detection component for detecting the working state of a second coupling in the first-direction translation mechanism at the cutting mechanism, and determine whether the working state of the second coupling is normal. If it is determined that the working state of the second coupling is normal, continue the processing of the wafer. If it is determined that the working state of the second coupling is abnormal, stop the processing. And / or obtain in real time the detection signal of a third detection component for detecting the working state of a third coupling in a second-direction translation mechanism for connecting a susceptor, and determine whether the working state of the third coupling is normal; if it is determined that the working state of the third coupling is normal, continue with the processing of the wafer; if it is determined that the working state of the third coupling is abnormal, stop the processing.

6. A wafer cutting system, characterized in that, Comprising: A data acquisition unit for obtaining the distances measured by a circle of distance sensors arranged on the outer periphery of the susceptor. Each distance sensor measures the distance between it and the crystal ring frame. The distance sensors are arranged concentrically with the wafer where the crystal ring frame is located on the susceptor; an installation ring is concentrically arranged on the outer periphery of the susceptor, and a circle of pressing mechanisms is evenly arranged on the installation ring in a circumferential manner. The distance sensors are arranged at or beside each pressing mechanism. The pressing mechanisms are arranged on the installation ring in a position-adjustable manner along the radial direction of the susceptor; a group of pressing mechanisms are driven by a synchronous driving mechanism to adjust synchronously; when the size information of the wafer to be processed is obtained, the synchronous driving mechanism is controlled according to the size information of the wafer to be processed to drive a group of the pressing mechanisms to adjust their positions; the synchronous driving mechanism includes a driving ring concentrically arranged at the bottom of the installation ring. The driving ring is connected to a self-rotation driving component that drives its self-rotation, and the driving ring is connected to a group of the pressing mechanisms through a group of linkage rods; A difference determination and comparison unit for determining the difference between the maximum value and the minimum value of a group of distances measured by a circle of the distance sensors, and determining whether the difference is greater than a difference threshold; An alarm unit for stopping the processing and issuing an alarm when it is determined that the difference is greater than the difference threshold; A processing unit for continuing with the processing of the wafer when it is determined that the difference is less than or equal to the difference threshold.

7. A wafer cutting device, comprising a processor and a memory, the memory storing a program executable by the processor, characterized in that: When the program is executed, it implements the wafer cutting method according to any one of claims 1-5.

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