Printed board laminating and pre-stacking method

Abstract

The invention provides a printed board lamination pre-stacking method, and relates to the technical field of printed board production, and the method comprises the steps: S1, making a printed board engineering CAM file; s2, processing an inner layer unit; s3, rivet holes are machined, and single-time hot melting corresponding units are formed; s4, the alignment center of the corresponding hot melting unit is determined, and the multiple corresponding single-time hot melting units are placed in the to-be-hot-melted area of the magnetic line hot melting machine with the alignment center as the location; s5, carrying out hot melting; and S6, after hot melting is finished, riveting is conducted through rivets, and the riveting directions of the multiple riveting points are different. According to the method, a hot melting alignment unit and a machine alignment center point are independently aligned in each layer of hot melting alignment without being influenced by an alignment error of a hot melting unit on the upper layer, so that an accumulative error is reduced; by means of forward and reverse riveting in the riveting process, stress is reduced, so that the problem of layer deviation in the laminating process is solved, the interlayer alignment precision of the laminated multilayer printed board is high, and the method has good application prospects.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board production, and in particular provides a printed circuit board lamination pre-stacking method. Background Art

[0002] With the rapid development of the electronics industry, the number of layers of printed circuit boards is increasing, and the density is getting higher and higher. The minimum ring width reserved in the design is often only 3-4mil. At this time, in order to ensure the 2mil ring width required for the final inspection of the printed circuit board, a high requirement is placed on the guarantee of the alignment accuracy between the pressed layers of the printed circuit board.

[0003] Conventional pre-stacking methods for printed circuit board pressing include rivet riveting, pin hot melting, CCD hot melting, etc., which can still guarantee the requirements of positioning accuracy for printed circuit boards with less than 20 layers, but the effect is poor for printed circuit boards with high layers (more than 20 layers). Summary of the invention

[0004] The purpose of the present application is to provide a printed circuit board lamination pre-stacking method capable of ensuring accuracy.

[0005] In order to achieve the above-mentioned object, the present invention adopts the following technical scheme: a printed circuit board lamination pre-stacking method, which is used to laminate a plurality of single sheets and prepregs to form a printed circuit board, wherein the prepregs are arranged between adjacent single sheets, and the method comprises:

[0006] S1: Make CAM files for printed circuit board engineering;

[0007] S2: processing inner layer unit;

[0008] S3: processing rivet holes on the inner layer single sheet and prepreg obtained in S2, and each inner layer unit and prepreg constitute a single hot melt corresponding unit;

[0009] S4: determining the alignment center of the hot melt corresponding unit, and placing a plurality of single hot melt corresponding units in the hot melt area to be hot melted of the magnetic line hot melt machine based on the alignment center;

[0010] S5: hot melting;

[0011] S6: After the hot melt is completed, riveting is performed by rivets, wherein the riveting includes a plurality of riveting points, and the riveting directions of the plurality of riveting points are different.

[0012] The printed circuit board lamination pre-stacking method provided by the present invention also has the following technical features: the number of rivet holes in S3 is as shown in the table:

[0013] The number of inner units n Number of rivets n≤10 6-8 10＜n＜20 8-10 N≥20 ≥10 .

[0014] The printed circuit board lamination pre-stacking method provided by the present invention also has the technical feature that the rivet holes are symmetrically distributed on both sides of the printed circuit board.

[0015] The printed circuit board lamination pre-stacking method provided by the present invention also has the technical feature that each single hot melt corresponding unit in S4 is positioned with the alignment center as the positioning center when being placed.

[0016] The printed circuit board lamination pre-stacking method provided by the present invention also has the following technical feature: in S6, the riveting directions of two adjacent riveting points in the same direction are different.

[0017] The printed circuit board lamination pre-stacking method provided by the present invention also has the following technical feature: during the hot melting process in S5, explosion-proof holes and flow-blocking layers are sequentially provided outside the hot melting block.

[0018] The printed circuit board lamination pre-stacking method provided by the present invention also has the following technical features: the baffle layer includes two rows of outer baffle blocks and one row of inner baffle blocks arranged in the two rows of outer baffle blocks, and the diameter of the inner baffle blocks is smaller than that of the outer baffle blocks.

[0019] The printed circuit board lamination pre-stacking method provided by the present invention also has the following technical feature: the S4 also includes automatic detection of the number of placed layers.

[0020] Beneficial Effects

[0021] The hot melt alignment of each layer of the printed circuit board lamination pre-stacking method proposed by the present invention aligns the hot melt alignment unit with the machine alignment center point separately, which is not affected by the alignment error of the hot melt unit of the previous layer, reducing the cumulative error; the hot melt pattern structure in the hot melt area of ​​this method adopts a combination structure of hot melt blocks, flow blocking layers and explosion-proof holes, which can effectively reduce the distance between the pattern and the board edge, and ensure the flatness of the area after hot melting, reducing the layer deviation after lamination. Adding explosion-proof holes can effectively prevent the printed circuit board from being delaminated due to heat explosion in other processes after lamination, ensuring product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 A schematic diagram of the structure of a hot melt pattern provided by an embodiment of the present invention;

[0024] Figure 2 A schematic diagram of front and back riveting of the method provided in an embodiment of the present invention;

[0025] Among them, 1: outer baffle block; 2: inner baffle block; 3: explosion-proof hole. DETAILED DESCRIPTION

[0026] The present application is further described in detail below in conjunction with the accompanying drawings and examples, but it should be noted that these implementation methods are not limitations of the present application, and equivalent changes or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these implementation methods are all within the scope of protection of the present application.

[0027] In the description of the embodiments of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the creation of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the creation of the present application.

[0028] In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0029] The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention of this application can be understood by specific circumstances.

[0030] like Figure 1-2 As shown, the embodiment of the present application provides a printed circuit board lamination pre-stacking method for laminating a plurality of single sheets and prepregs to form a printed circuit board, wherein the prepregs are arranged between adjacent single sheets, and the method comprises:

[0031] S1: Make CAM files for printed circuit board engineering;

[0032] S2: processing inner layer unit;

[0033] S3: processing rivet holes on the inner layer single sheet and prepreg obtained in S2, and each inner layer unit and prepreg constitute a single hot melt corresponding unit;

[0034] S4: determining the alignment center of the hot melt corresponding unit, and placing a plurality of single hot melt corresponding units in the hot melt area to be hot melted of the magnetic line hot melt machine based on the alignment center;

[0035] S5: hot melting;

[0036] S6: After the hot melt is completed, riveting is performed by rivets, wherein the riveting includes multiple riveting points, and the riveting directions of the multiple riveting points are different. The different riveting directions reduce stress and thus reduce the problem of layer deviation during the lamination process.

[0037] In some embodiments, the number of rivet holes in S3 is as shown in the table:

[0038] The number of inner units n Number of rivets n≤10 6-8 10＜n＜20 8-10 N≥20 ≥10 .

[0039] In some embodiments, the rivet holes are symmetrically distributed on both sides of the printed circuit board.

[0040] In some embodiments, each single hot melt corresponding unit in S4 is positioned with the alignment center as the positioning center.

[0041] In some embodiments, Figure 2 As shown, in S6, the riveting directions of two adjacent riveting points in the same direction are different.

[0042] In some embodiments, Figure 1 As shown, during the hot melting process in S5, explosion-proof holes 3 and a flow-blocking layer are sequentially provided outside the hot melting block.

[0043] In some embodiments, the baffle layer includes two rows of outer baffle blocks 1 and a row of inner baffle blocks 2 disposed in the two rows of outer baffle blocks 1 , and the inner baffle blocks 2 have a smaller diameter than the outer baffle blocks 1 .

[0044] In some embodiments, the size of the outer spoiler 1 is 1 mm, and the size of the inner spoiler 2 is 0.5 mm.

[0045] In some embodiments, S4 also includes automatic detection of the number of placed layers.

[0046] In some embodiments, the hot melt formula is 100-150°C for 90-140s. Place the printed board after hot melting on the hot melt machine or on the stacking table, grab the first single sheet at the four corners and lift the printed board 5-8cm for 5 times. If there is no delamination, it is considered that the hot melting effect of the board is good.

[0047] In some embodiments, the hot melt alignment target uses a foolproof target, and the target is placed on an odd-numbered layer. This allows the equipment to automatically check whether the number of layers is correct during the stacking process. This not only simplifies the work of personnel, but also eliminates the problem of disordered stacking layers. The details are as follows:

[0048]

[0049]

[0050] The above is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application. The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present application, and these improvements and variations should also be regarded as the protection scope of the present application.

Claims

1. A printed circuit board lamination pre-stacking method for laminating a plurality of single sheets and prepregs to form a printed circuit board, wherein the prepregs are arranged between adjacent single sheets, characterized in that: The method comprises: S1: Make CAM files for printed circuit board engineering; S2: processing inner layer unit; S3: processing rivet holes on the inner layer single sheet and prepreg obtained in S2, and each inner layer unit and prepreg constitute a single hot melt corresponding unit; S4: determining the alignment center of the hot melt corresponding unit, and placing a plurality of single hot melt corresponding units in the hot melt area to be hot melted of the magnetic line hot melt machine based on the alignment center; S5: hot melting; S6: After the hot melt is completed, riveting is performed by rivets, wherein the riveting includes a plurality of riveting points, and the riveting directions of the plurality of riveting points are different.

2. The printed circuit board lamination pre-stacking method according to claim 1, characterized in that: The number of rivet holes in S3 is shown in the table: 。 3. The printed circuit board lamination pre-stacking method according to claim 2, characterized in that: The rivet holes are symmetrically distributed on both sides of the printed circuit board.

4. The printed circuit board lamination pre-stacking method according to claim 1, characterized in that: Each single hot melt corresponding unit in S4 is positioned with the alignment center as the positioning center.

5. The printed circuit board lamination pre-stacking method according to claim 1, characterized in that: In S6, the riveting directions of two adjacent riveting points in the same direction are different.

6. The printed circuit board lamination pre-stacking method according to claim 1, characterized in that: During the hot melting process in S5, explosion-proof holes and flow-blocking layers are sequentially arranged outside the hot melting block.

7. The printed circuit board lamination pre-stacking method according to claim 6, characterized in that: The flow-blocking layer comprises two rows of outer flow-blocking blocks and one row of inner flow-blocking blocks arranged in the two rows of outer flow-blocking blocks, and the diameter of the inner flow-blocking blocks is smaller than that of the outer flow-blocking blocks.

8. The printed circuit board lamination pre-stacking method according to claim 1, characterized in that: The S4 also includes automatic detection of the number of layers placed.

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