Method for manufacturing surface mounted inductor

Abstract

The manufacturing method of the surface mounting inductor comprises the following steps: 1) preparing M * Ngt by using magnetic powder and a hollow coil; according to the inductor matrix of the inductor body primary blank, the pin outlet direction of each hollow coil is consistent with the axis direction of the coil, and the pin outlet end face exceeds the surface of the surface mounting inductor; 2) arranging an indication pin outgoing line mark on each inductor body initial blank during preparation or after preparation; 3) processing the inductor matrix until the corresponding hollow coil pins are exposed out of the surface of the inductor matrix; 4) cutting the inductor matrix to obtain a plurality of inductor body primary blanks; 5) performing plating resistance treatment on the surface of the inductor body primary blank to form an inductor blank; (6) finding out the pin outgoing line through the mark, and removing the plating resistance layer at the position of the metal conductive layer on the surface of the pin outgoing line on the pin outgoing line surface of the inductor blank according to the pin outgoing line position of the hollow coil during preparation to obtain an inductor finished product blank; and 7) depositing a metal conductive layer at the metal conductive layer position of the inductor finished product blank to obtain the product.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a surface mounted inductor. Background Art

[0002] With the rapid development of electronic technology, especially the rapid popularization of mobile consumer electronic terminals, inductive devices are developing in the direction of miniaturization, lightness, high frequency, large current, high efficiency and low electromagnetic interference.

[0003] The one-piece molded inductor has the advantages of strong anti-electromagnetic interference ability, solid structure, precise product size, small size, and large current. It is mainly used in equipment with high-density surface mounting circuits that have high requirements on product size and electromagnetic interference ability.

[0004] There are many manufacturing methods for one-piece molded inductors, such as the manufacturing method disclosed in Chinese patent document CN103050224A, which generally includes using magnetic metal powder to die-cast a hollow coil and an inner core into a power inductor and then coating it with a resin layer and electroplating electrodes. However, before electroplating the electrodes, the resin layer on the lead-out surface of the coil pin needs to be removed for smooth electroplating. At this time, there are resin layers on all six sides, and it is necessary to tentatively find the surface and remove the resin layer. Therefore, the processing time is long, resulting in low production efficiency of the product. Summary of the invention

[0005] The technical problem to be solved by the present invention is to overcome the above-mentioned shortcomings of the prior art and provide a method for manufacturing a surface mounted inductor with high production efficiency.

[0006] The technical solution adopted by the present invention to solve the above technical problems is: A method for manufacturing a surface mounted inductor, characterized in that it comprises the following steps: 1) Using magnetic powder and hollow coils, an inductor matrix containing M*N>1 (M and N are both natural numbers) inductor body blanks is prepared, the lead wire direction of each hollow coil is consistent with the coil axis direction, and the lead wire end face exceeds the surface of the surface mounted inductor; 2) A mark is set on each inductor body blank during or after preparation, and the mark surface is the hollow coil pin surface and indicates the pin outlet; 3) Mechanically process the inductor matrix until the corresponding hollow coil pins are exposed on the surface of the inductor matrix; 4) Cutting the inductor matrix to obtain a plurality of inductor body blanks; 5) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 6) Find the lead-out wires through the markings on the inductor blank, and remove the resist coating including the metal conductive layer position on the lead-out wire surface of the inductor blank according to the lead-out wire position of the hollow coil during preparation; 7) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

[0007] When the cross-section of the inductor body is square, the label must include a directional mark indicating the pin outlet.

[0008] A method for manufacturing a surface mounted inductor, comprising the following steps: 1) Using magnetic powder and hollow coils to prepare an inductor matrix including M*N>1 inductor body blanks, the coil pin lead direction of the hollow coil is perpendicular to the coil axis direction, and the coil pin lead end exceeds the surface of the surface mounted inductor; 2) A mark is set on each inductor body blank during or after preparation, and the mark points to the hollow coil pin surface and indicates the pin outlet; 3) Cut the inductor matrix according to the coil pin outlet to obtain multiple inductor body blanks; 4) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 5) Find the pin outlet through the mark on the inductor body blank, and remove the resist layer including the metal conductive layer position on the pin outlet surface of the inductor blank; 6) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

[0009] A method for manufacturing a surface mounted inductor, comprising the following steps: 1) Prepare the hollow coil according to the design requirements. The lead wire direction of the hollow coil is consistent with the coil axis direction, and the lead wire end face exceeds the surface of the surface mounted inductor; 2) Assembling the hollow coil prepared in step 1 onto the parent substrate; 3) Then, the combination of the hollow coil and the matrix obtained in step 2 is molded by magnetic powder to prepare an inductor matrix including M*N>1 inductor body blanks; a mark is set on each inductor body blank during or after preparation, and the mark surface is the hollow coil pin surface and indicates the pin outlet; 4) Mechanically process the inductor matrix until the corresponding hollow coil pins are exposed on the surface of the inductor matrix; 5) Cutting the inductor matrix to obtain multiple inductor body blanks; 6) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 7) Find the pin-out line through the pin-out line surface marked on the inductor body blank, and remove the resist coating including the metal conductive layer position on the pin-out line surface of the inductor blank; 8) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

[0010] Preferably, the lead wires are connected to a conductive sheet parallel to the top surface of the hollow coil.

[0011] When the cross-section of the inductor body is square, the label must include a directional mark indicating the pin outlet.

[0012] A method for manufacturing a surface mounted inductor, comprising the following steps: 1) Prepare the hollow coil according to the design requirements. The direction of the hollow coil lead is perpendicular to the coil axis direction, and the coil lead end exceeds the surface of the surface mounted inductor; 2) Assembling the hollow coil prepared in step 1 onto the parent substrate; 3) Then, the combination of the hollow coil and the matrix obtained in step 2 is molded by magnetic powder to prepare an inductor matrix including M*N>1 inductor body blanks; a mark is set on each inductor body blank during or after preparation, and the mark points to the hollow coil pin surface and indicates the pin outlet; 4) Cut the inductor matrix according to the coil pin outlet to obtain multiple inductor body blanks; 5) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 6) Find the pin-out line through the pin-out line surface marked on the inductor body blank, and remove the resist coating including the metal conductive layer position on the pin-out line surface of the inductor blank; 7) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

[0013] A method for manufacturing a surface mounted inductor, comprising the following steps: 1) Using magnetic powder and coils to prepare an inductor matrix including M*N>1 inductor body blanks, wherein the coil is a gate-shaped coil, and the coil pin outlet terminal exceeds the surface of the surface-mounted inductor; 2) A mark is set on each inductor body blank during or after preparation, and the mark points to the hollow coil pin surface and indicates the pin outlet; 3) Cut the inductor matrix according to the coil pin outlet to obtain multiple inductor body blanks; 4) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 5) Find the pin outlet through the mark on the inductor body blank, and remove the resist layer including the metal conductive layer position on the pin outlet surface of the inductor blank; 6) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

[0014] A method for manufacturing a surface mounted inductor, comprising the following steps: 1) Prepare a coil according to the design requirements, wherein the coil is a gate-shaped coil, and the lead end of the coil pin exceeds the surface of the surface-mounted inductor; 2) Assembling the coil prepared in step 1 onto the parent substrate; 3) Then, the combination of the hollow coil and the matrix obtained in step 2 is molded by magnetic powder to prepare an inductor matrix including M*N>1 inductor body blanks; a mark is set on each inductor body blank during or after preparation, and the mark points to the coil pin surface and indicates the pin outlet; 4) Cut the inductor matrix according to the coil pin outlet to obtain multiple inductor body blanks; 5) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 6) Find the pin-out line through the pin-out line surface marked on the inductor body blank, and remove the resist coating including the metal conductive layer position on the pin-out line surface of the inductor blank; 7) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

[0015] Preferably, the inductor body blank is chamfered before the surface resist plating treatment to prevent the resist plating layer from being incompletely coated at the corners, thereby causing the surface mounted inductor product to short-circuit after electroplating.

[0016] More specifically, the metal conductive layer is prepared by one or more processes including physical vapor deposition, chemical vapor deposition, electroplating and chemical plating.

[0017] Compared with the prior art, the present invention has the following advantages: the pin outlet can be found through the marking of the pin outlet surface marked on the inductor body blank, and the resist coating at the position of the metal conductive layer including the pin outlet surface on the pin outlet surface of the inductor blank can be removed, so the production efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of an air-core coil of a surface-mounted inductor according to Embodiment 1 of the present invention.

[0019] Figure 2 This is a structural diagram of the substrate of the surface mounted inductor according to Example 1 of the present invention.

[0020] Figure 3 This is a structural diagram of a combination of an air-core coil and a substrate of a surface-mounted inductor according to Example 1 of the present invention.

[0021] Figure 4 FIG. 1 is a schematic diagram of an inductor matrix including a plurality of inductor bodies according to Embodiment 1 of the present invention.

[0022] Figure 5 This is a schematic diagram of a finished inductor matrix after mechanical processing according to Example 1 of the present invention.

[0023] Figure 6 Schematic diagram of the inductor body blank after cutting the finished inductor matrix product according to Example 1 of the present invention.

[0024] Figure 7 Schematic diagram of an inductor blank after chamfering treatment according to Example 1 of the present invention.

[0025] Figure 8 Schematic diagram of the inductor body after surface resist plating according to Example 1 of the present invention.

[0026] Fig. 9 This is a schematic diagram of a finished inductor body after removing the resist plating layer at the metal conductive layer position according to Example 1 of the present invention.

[0027] Fig.10 This is a schematic diagram of a finished surface-mounted inductor according to Embodiment 1 of the present invention.

[0028] Fig.11 Schematic diagram of another air-core coil of the surface-mounted inductor according to Embodiment 1 of the present invention.

[0029] Fig.12 This is a schematic diagram of a preliminary inductor body obtained from another hollow coil of the surface mounted inductor according to Example 1 of the present invention.

[0030] Fig.13 Schematic diagram of another air-core coil of the surface-mounted inductor according to Embodiment 1 of the present invention.

[0031] Fig.14 Schematic diagram of an air-core coil of a surface-mounted inductor according to Embodiment 2 of the present invention.

[0032] Fig.15 This is a structural diagram of the combination of the hollow coil and substrate of the surface mounted inductor according to Example 2 of the present invention.

[0033] Fig.16 FIG. 2 is a schematic diagram of an inductor matrix including a plurality of inductor bodies according to Embodiment 2 of the present invention.

[0034] Fig.17 Schematic diagram of the inductor body blank after cutting the finished inductor matrix product according to embodiment 2 of the present invention.

[0035] Fig.18 Schematic diagram of an inductor blank after chamfering treatment according to Example 2 of the present invention.

[0036] Fig.19 Schematic diagram of the inductor body after surface resist plating according to Example 2 of the present invention.

[0037] Fig. 20 This is a schematic diagram of a finished inductor body after removing the resist plating layer at the metal conductive layer position according to embodiment 2 of the present invention.

[0038] Fig.21 This is a schematic diagram of a finished surface-mounted inductor according to Embodiment 2 of the present invention.

[0039] Fig. 22 Schematic diagram of another air-core coil of the surface-mounted inductor according to Embodiment 2 of the present invention.

[0040] Fig.23 This is a schematic diagram of a surface mounted inductor obtained by another type of air-core coil according to Example 2 of the present invention.

[0041] Fig.24 Schematic diagram of a coil of a surface mounted inductor according to Embodiment 3 of the present invention.

[0042] Fig.25 This is a structural diagram of the mother matrix of Example 3 of the present invention.

[0043] Fig.26 This is a structural diagram of the combination of the mother matrix of Example 3 of the present invention.

[0044] Fig. 27 Schematic diagram of the inductor body blank after cutting the finished inductor matrix product according to embodiment 3 of the present invention. DETAILED DESCRIPTION

[0045] The present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0046] 1. Preparation of materials 1.1 Magnetic Powder Any one or a mixture of multiple magnetic powders such as iron-silicon-chromium alloy powder, carbonyl iron powder, reduced iron powder, iron-silicon-aluminum alloy powder, iron-nickel alloy powder and iron-silicon alloy powder is selected and mixed with auxiliary materials.

[0047] The auxiliary materials include a passivator, an insulating agent, a binder and a lubricant.

[0048] The passivation agent solution is mixed with the main alloy powder, heated to ≥40°C, then maintained at the temperature and stirred for ≥30 minutes, and then the temperature is raised to 50°C-90°C to completely volatilize the solvent in the passivation agent solution to obtain dry passivation alloy powder; the insulating agent is weighed in proportion, the insulating agent is mixed with the passivation alloy powder and stirred for ≥40 minutes to obtain insulating alloy powder; the binder is weighed in proportion, the binder is dissolved in the solvent to obtain a binder solution, the binder solution is mixed with the insulating alloy powder and stirred for ≥40 minutes, and then heated to 50-80°C to volatilize the solvent in the binder solution to obtain bonding alloy powder; the lubricant is weighed in proportion, the lubricant is mixed with the bonding alloy powder and stirred for ≥30 minutes. Then the mixture is sieved and granulated, baked at 150°C for about 40 minutes, and the powders with different particle size distributions are proportioned to obtain magnetic powder.

[0049] The magnetic powder may also be prepared using other conventional compositions and methods, which are not listed here one by one.

[0050] 1.2 Air-core coil The hollow coil is composed of a wire with an insulating layer, the wire may have a self-adhesive layer, the adhesion temperature of the self-adhesive layer is 80°C to 220°C, and the insulation layer of the wire with the insulating layer has a temperature resistance of 180°C to 450°C.

[0051] The cross section of the coil is usually circular or rectangular, the shape is detailed in the following section.

[0052] 2. Manufacturing of surface mount inductors Example 1

[0053] like Figure 1-13 , a method for manufacturing a surface mounted inductor, comprising the following steps: 1) Prepare a hollow coil according to the design requirements, the pin outlet direction 101 of the hollow coil is consistent with the coil axis direction 102, and the end surface 231 of the pin outlet 211 exceeds the surface of the surface mounted inductor; 2) Assemble the hollow coil 1 prepared in step 1 onto the parent substrate 301, 3) Then, the combined body 301 including the hollow coil and the matrix obtained in step 2 is molded by magnetic powder to prepare the inductor matrix 501; a mark 801 is set on each inductor body blank during or after preparation, and the mark surface is the hollow coil pin surface and indicates the pin outlet; 4) Grinding the inductor matrix until the corresponding hollow coil pin 921 is exposed on the surface 521 of the inductor matrix; 5) cutting the inductor matrix to obtain a plurality of inductor body blanks 521; 6) Performing surface resist plating on the inductor body blank to obtain the inductor blank 601; 7) Find the pin outlets through the markings of the pin outlet surface marked on the inductor body blank, and remove the resist layer 701 including the metal conductive layer position of the pin outlet surface on the pin outlet surface of the inductor blank to obtain the finished inductor blank; 8) Depositing one or more metal conductive layers 901 at the metal conductive layer position of the finished inductor blank to obtain a surface mounted inductor 160 .

[0054] In this embodiment, there are three types of hollow coils in step 1). One type of hollow coil has a lead wire direction that is consistent with the coil axis direction, and a lead wire end face that exceeds the surface of the surface-mounted inductor. Figure 1 As shown, The second hollow coil 112 is the first hollow coil, and the lead wire 231 is connected to the conductive sheet 232, 212 parallel to the top surface of the hollow coil. Fig.11 As shown, the only difference between it and the first hollow coil is that this can increase the contact area of ​​the electroplating layer and can conduct electricity better.

[0055] The third type of hollow coil body is a racetrack-shaped hollow coil 113, such as Fig.13 As shown, surface mount inductor products can be manufactured according to the above method to meet the requirements of products with different shapes and specifications.

[0056] In the step 2), magnetic powder is used to prepare Figure 2 The mother matrix 301 is shown, which includes a base and 4×5 bosses 311 arranged in rows and columns on the base. The hollow coil is then assembled onto the bosses 311 of the mother matrix 301 to form a combined body 401.

[0057] The above-mentioned boss can also be replaced by a groove, or by a groove with a limiting hollow coil, and at the same time, a boss with a limiting hollow coil is also provided, so that the hollow coil can be better limited to adapt to various situations.

[0058] When the boss is non-circular, when the hollow coil is sleeved on the boss, the boss will limit the freedom of the hollow coil in the direction of the substrate plane, and the direction of the coil is fixed.

[0059] When the groove is used, the hollow coil is placed in the groove, and the groove will limit the freedom of the hollow coil in the direction of the substrate plane, and the direction of the coil is fixed.

[0060] In step 3, the combination of the base and the hollow coil 401 is placed in the mold cavity of the mold, and the magnetic powder material is filled and cold-pressed or hot-pressed or cold-pressed and hot-pressed and pressure-maintained to form an inductor matrix blank containing 4×5 inductor bodies, such as Figure 4 shown.

[0061] The temperature of the cold pressing treatment is not higher than 50° C., the temperature of the hot pressing treatment is 60° C. to 250° C., and the holding pressure treatment time is 3 seconds to 300 seconds.

[0062] The inductor matrix blank is heat-treated to obtain the inductor matrix finished blank, the heat treatment temperature is 120° C. to 250° C., and the heat treatment time is 30 minutes to 600 minutes. Since the heat treatment is a necessary process for preparing the inductor matrix, it will not be described in detail here.

[0063] In this embodiment 1, in step 3), during the preparation of the inductor matrix, a mark 801 is stamped on each inductor body by using a convex punch, such as Figure 4 shown.

[0064] In this embodiment 1, the grinding process of the inductor matrix in step 4) can also be milling or other processing methods to remove the designed thickness from the upper and lower surfaces of the inductor matrix to meet the design requirements. The preferred processing is grinding using a surface grinder.

[0065] The inductor matrix is ​​then cut by wire cutting to obtain a plurality of inductor body blanks. A mark 801 may also be stamped on the inductor body blanks at this time.

[0066] The logo 801 may be circular or in other shapes.

[0067] When the cross section of the inductor matrix is ​​a square, since the sides of the inductor matrix are the same, the pin outlet position cannot be identified. Therefore, the mark should be a directional mark with a marked pin outlet, such as an arrow. Please refer to the following description Fig.18 Logo 804 is shown.

[0068] When the cross-section of the inductor matrix is ​​a shape with different lengths and widths, such as a rectangle, since the side lengths of the inductor matrix are different at this time, the initial hollow coil can be placed, such as on the long side, so that the pin outlet position is easy to identify. Therefore, the mark can be a common mark, such as the aforementioned circular mark 801, and there can be no directional mark indicating the pin outlet, such as an arrow.

[0069] The inductor body blank can also be chamfered to prevent the following defects of short circuit after electroplating caused by incomplete coating of the resist coating at the corners.

[0070] After chamfering, the inductor body blank becomes an inductor chamfered blank; then the surface of the inductor chamfered blank is ultrasonically cleaned, the product surface is dried, and then the surface of the inductor chamfered blank is coated with a resist plating layer, and the resist plating layer is evenly coated on the surface of the inductor finished product resist plating layer portion corresponding to the inductor chamfered blank to obtain the inductor finished product blank.

[0071] The resist coating has the characteristics of insulation and rust prevention. The resist coating is carried out using common components and methods, which will not be described in detail here.

[0072] In this embodiment 1, the pin-out surface is found by the pin-out surface mark 801 marked on the inductor body blank, and the resist plating layer including the metal conductive layer position of the pin-out surface is removed on the pin-out surface of the inductor blank; The processing method for removing the resist coating at the metal conductive layer position corresponding to the inductor blank is laser ablation. The obtained finished inductor blank has only the metal conductive layer position not covered by the resist coating. The leads at both ends of the hollow coil in each finished inductor blank are exposed at the corresponding metal conductive layer position of the inductor body after this processing. Therefore, the metal conductive layer position can be surface deposited to form an electrode.

[0073] The surface-deposited metal conductive layer can be formed by one or more processes such as physical vapor deposition, chemical vapor deposition, electroplating and chemical plating. One or more metal conductive layers are deposited on the surface of the finished inductor blank without a resist coating. The metal conductive layer is the electrode, and a surface-mounted inductor is obtained. Fig.10 shown.

[0074] A better metal conductive layer is four layers, wherein the first layer is a nickel layer, the second layer is a copper layer, the third layer is a nickel layer, and the fourth layer is a tin layer.

[0075] In this embodiment 1, a 4×5 arrangement of hollow coils is used as an embodiment. Of course, the arrangement of the hollow coils and the number of inductor blanks can be changed. Example 2

[0076] like Figure 14-21 , a method for manufacturing a surface mount inductor, comprising the steps of: 1) Prepare the hollow coil 114 according to the design requirements, the direction of the hollow coil lead wire 214 is perpendicular to the coil axis direction 102, and the coil lead wire end exceeds the corresponding outer side surface of the coil end; 2) Assembling the hollow coil 114 prepared in step 1 onto the parent substrate 304; 3) Then, the combination of the hollow coil and the matrix obtained in step 2 is molded by magnetic powder to prepare an inductor matrix 504 containing M*N>1 inductor body blanks; a mark is set on each inductor body blank during or after preparation, and the mark points to the hollow coil pin surface and indicates the pin outlet; 4) Cut the inductor matrix according to the coil pin outlet to obtain multiple inductor body blanks; 5) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 6) Find the pin outlet through the mark of the pin outlet surface marked on the inductor body blank, and remove the resist layer including the metal conductive layer position of the pin outlet surface on the pin outlet surface of the inductor blank to obtain the finished inductor blank; 7) Depositing one or more metal conductive layers 914 at the metal conductive layer position of the finished inductor blank to obtain a surface mounted inductor.

[0077] The difference between Example 2 and Example 1 is only that: 1. The lead-out direction 103 of the hollow coil used in step 1) is perpendicular to the coil axis direction 102, and the lead-out end of the coil exceeds the surface of the surface-mounted inductor.

[0078] There are two specific forms of hollow coils: one is that the pins of the hollow coils are along the tangent of the coil, and the other is that the two pins are in an eight-shaped shape 214, such as Fig.14 shown.

[0079] Another is that two pins 215 are parallel, such as Fig. 22 As shown, the metal conductive layer 905 has only one side, which can reduce the board area. Fig.23 The mark 805 is located in the direction of the coil pin outlet, and can directly indicate the coil pin outlet without a directional mark.

[0080] 2. The inductor matrix is ​​directly cut according to the coil pin outlet to obtain multiple inductor body blanks, without grinding the inductor matrix as in Example 1, until the corresponding hollow coil pins are exposed on the surface of the inductor matrix, and then cutting is performed.

[0081] 3. The location and nature of the logo are different.

[0082] The mark of this embodiment is a directional mark 804 which is not on the pin outlet surface, but points to the pin outlet surface.

[0083] The mark 804 is a directional mark, and in this embodiment, it is an arrow-shaped directional mark.

[0084] The mark 804 can also be circular or in other shapes, and its directionality can be reflected by its position or shape. For example, it is located near the pin outlet surface, and the pin outlet position can be determined in combination with the placement position of the initial hollow coil during the setting, as shown below: Fig.23 Logo 805.

[0085] 4. Cut the inductor matrix according to the coil pin leads to obtain multiple inductor body blanks.

[0086] The rest of the processing procedures are the same or similar to those in Example 1. Example 3

[0087] like Figure 24-27 As shown, a method for manufacturing a surface mounted inductor comprises the following steps: 1) Prepare an air-core coil according to the design requirements, wherein the coil is a gate-shaped coil 116, and the end of the coil pin lead 216 exceeds the surface of the surface-mounted inductor; 2) Assembling the gate-shaped coil 116 prepared in step 1 onto the groove 326 of the parent substrate 306; 3) Then, the combination 406 of the gate-shaped coil 116 and the matrix 306 obtained in step 2 is molded by magnetic powder to prepare an inductor matrix including 5*1 inductor body blanks; a mark 806 is set on each inductor body blank during or after preparation, and the mark points to the coil pin surface and indicates the pin outlet; 4) Cutting the inductor matrix according to the coil pin outlet line 216 to obtain a plurality of inductor body blanks 526; 5) Performing surface resist plating treatment on the inductor body blank 526 to obtain an inductor blank; 6) Find the pin outlet through the mark 806 of the pin outlet surface marked on the inductor body, and remove the resist coating at the position of the metal conductive layer including the pin outlet surface on the pin outlet surface of the inductor body to obtain the finished inductor body; 7) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

[0088] The only difference between Example 3 and Example 2 is the coil. The rest of the processing is the same or similar to that of Example 2. Please refer to the figures and description of Example 2.

[0089] The above-mentioned embodiments 1, 2, and 3 all use a matrix substrate to position the coil, but the matrix substrate may not be used to position the coil, and the inductor matrix may be directly prepared using magnetic powder and the coil. Since this preparation is also a common method, it will not be described here.

Claims

1. A method for manufacturing a surface mounted inductor, characterized in that: It includes the following steps: 1) Using magnetic powder and hollow coils, an inductor matrix containing M*N>1 inductor body blanks is prepared. The lead-out direction of each hollow coil is consistent with the coil axis direction, and the lead-out end face exceeds the surface of the surface-mounted inductor. 2) A mark is set on each inductor body blank during or after preparation, and the mark surface is the hollow coil pin surface and indicates the pin outlet; 3) Mechanically process the inductor matrix until the corresponding hollow coil pins are exposed on the surface of the inductor matrix; 4) Cutting the inductor matrix to obtain a plurality of inductor body blanks; 5) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 6) Find the lead-out wires through the markings on the inductor blank, and remove the resist coating including the metal conductive layer position on the lead-out wire surface of the inductor blank according to the lead-out wire position of the hollow coil during preparation; 7) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

2. The method for manufacturing a surface mounted inductor according to claim 1, wherein: When the cross-section of the inductor body is square, the label must include a directional mark indicating the pin outlet.

3. A method for manufacturing a surface mounted inductor, characterized in that: It includes the following steps: 1) Using magnetic powder and hollow coils to prepare an inductor matrix including M*N>1 inductor body blanks, the coil pin lead direction of the hollow coil is perpendicular to the coil axis direction, and the coil pin lead end exceeds the surface of the surface mounted inductor; 2) A mark is set on each inductor body blank during or after preparation, and the mark points to the hollow coil pin surface and indicates the pin outlet; 3) Cut the inductor matrix according to the coil pin outlet to obtain multiple inductor body blanks; 4) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 5) Find the pin outlet through the mark on the inductor body blank, and remove the resist layer including the metal conductive layer position on the pin outlet surface of the inductor blank; 6) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

4. A method for manufacturing a surface mounted inductor, characterized in that: It includes the following steps: 1) Prepare the hollow coil according to the design requirements. The lead wire direction of the hollow coil is consistent with the coil axis direction, and the lead wire end face exceeds the surface of the surface mounted inductor; 2) Assemble the hollow coil prepared in step 1 onto the parent substrate, 3) Then, the combination of the hollow coil and the matrix obtained in step 2 is molded by magnetic powder to prepare an inductor matrix including M*N>1 inductor body blanks; a mark is set on each inductor body blank during or after preparation, and the mark surface is the hollow coil pin surface and indicates the pin outlet; 4) Mechanically process the inductor matrix until the corresponding hollow coil pins are exposed on the surface of the inductor matrix; 5) Cutting the inductor matrix to obtain multiple inductor body blanks; 6) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 7) Find the pin-out line through the pin-out line surface marked on the inductor body blank, and remove the resist coating including the metal conductive layer position on the pin-out line surface of the inductor blank; 8) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

5. The method for manufacturing a surface mounted inductor according to claim 1 or 4, characterized in that: The lead wires are then connected to a conductive sheet parallel to the top surface of the hollow coil.

6. The method for manufacturing a surface mount inductor according to claim 5, characterized in that: When the cross-section of the inductor body is square, the label must include a directional mark indicating the pin outlet.

7. A method for manufacturing a surface mounted inductor, characterized in that: It includes the following steps: 1) Prepare the hollow coil according to the design requirements. The direction of the hollow coil lead is perpendicular to the coil axis direction, and the coil lead end exceeds the surface of the surface mounted inductor; 2) Assembling the hollow coil prepared in step 1 onto the parent substrate; 3) Then, the combination of the hollow coil and the matrix obtained in step 2 is molded by magnetic powder to prepare an inductor matrix including M*N>1 inductor body blanks; a mark is set on each inductor body blank during or after preparation, and the mark points to the hollow coil pin surface and indicates the pin outlet; 4) Cut the inductor matrix according to the coil pin outlet to obtain multiple inductor body blanks; 5) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 6) Find the pin-out line through the pin-out line surface marked on the inductor body blank, and remove the resist coating including the metal conductive layer position on the pin-out line surface of the inductor blank; 7) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

8. A method for manufacturing a surface mounted inductor, characterized in that: It includes the following steps: 1) Using magnetic powder and coils to prepare an inductor matrix including M*N>1 inductor body blanks, wherein the coil is a gate-shaped coil, and the lead end of the coil pin exceeds the surface of the surface-mounted inductor; 2) A mark is set on each inductor body blank during or after preparation, and the mark points to the hollow coil pin surface and indicates the pin outlet; 3) Cut the inductor matrix according to the coil pin outlet to obtain multiple inductor body blanks; 4) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 5) Find the pin outlet through the mark on the inductor body blank, and remove the resist layer including the metal conductive layer position on the pin outlet surface of the inductor blank; 6) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

9. A method for manufacturing a surface mounted inductor, characterized in that: It includes the following steps: 1) Prepare a coil according to the design requirements, wherein the coil is a gate-shaped coil, and the lead end of the coil pin exceeds the surface of the surface-mounted inductor; 2) Assembling the coil prepared in step 1 onto the parent substrate; 3) Then, the combination of the hollow coil and the matrix obtained in step 2 is molded by magnetic powder to prepare an inductor matrix including M*N>1 inductor body blanks; a mark is set on each inductor body blank during or after preparation, and the mark points to the coil pin surface and indicates the pin outlet; 4) Cut the inductor matrix according to the coil pin outlet to obtain multiple inductor body blanks; 5) The surface of the inductor body blank is subjected to resist plating to form an inductor blank; 6) Find the pin-out line through the pin-out line surface marked on the inductor body blank, and remove the resist coating including the metal conductive layer position on the pin-out line surface of the inductor blank; 7) Depositing one or more metal conductive layers at the metal conductive layer position of the finished inductor body to obtain a surface mounted inductor.

10. The method for manufacturing a surface mounted inductor according to any one of claims 1 to 9, characterized in that: The inductor body blank is chamfered before the surface resist plating treatment.

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