A plastic sealing mold

Abstract

The present invention relates to a plastic encapsulation mold, belonging to the field of semiconductor packaging technology. The plastic encapsulation mold comprises: a plastic encapsulation outer frame, both sides of the plastic encapsulation outer frame are fixedly connected to guide frames, the guide frames penetrate into the interior of the plastic encapsulation outer frame, the upper end of the plastic encapsulation outer frame is fixedly connected to a connecting frame, the lower end of the connecting frame is fixedly connected to two electro-hydraulic push rods; a plastic encapsulation mechanism, the plastic encapsulation mechanism is installed at the lower end of the connecting frame, and the surface of the plastic encapsulation mechanism extends to the outside of the plastic encapsulation outer frame; a first hot air duct is used to auxiliary heat the sliding lower mold heating area, and a second hot air duct is used to inject hot air into the wall at the same time, reducing heat loss caused by contact between external normal temperature gas and the mold cavity, so that the device reduces contact with external normal temperature air during opening and closing, and assists in maintaining the high temperature effect of the mold cavity, shortening the heating time of the mold cavity, and improving the processing efficiency of the device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, in particular to a plastic packaging mold. Background Art

[0002] The semiconductor plastic encapsulation process is a common process in the semiconductor industry. Molten resin is injected into a nearly sealed mold cavity. The resin flows and fills the entire mold cavity, encapsulating the entire chip and part of the lead frame to form a semiconductor product. The purpose of the semiconductor plastic encapsulation process is to use resin to encapsulate the entire chip to protect the sensitive structures inside the semiconductor product, such as the chip, bonding wires, and components, from the influence of the external environment, thereby ensuring the overall insulation and reliability of the semiconductor product.

[0003] After searching the prior art for "a semiconductor plastic packaging device", the announcement number is "CN116682745B". This device heats and melts the plastic block through the plastic packaging body, and then performs plastic packaging processing on the semiconductor. However, during the heating operation, the two modules will be separated and merged back and forth to perform plastic packaging processing on the semiconductor product. When separated, the inner cavity of the mold is exposed to the outside and heat loss occurs. The inner cavity of the mold needs time to be gradually heated again to maintain the melting temperature of the subsequent material, which will affect the work efficiency of the semiconductor plastic packaging processing. Summary of the Invention

[0004] Based on this, it is necessary to provide a plastic encapsulation mold to address the problem that during the heating operation, the temperature of the mold cavity needs to be gradually heated to the melting temperature of the plastic block due to the separation of the two modules and contact with the outside room temperature air, which will affect the work efficiency of the semiconductor plastic encapsulation processing.

[0005] A plastic packaging mold comprises: a plastic packaging frame, both sides of the plastic packaging frame are fixedly connected to guide frames, the guide frames extend into the interior of the plastic packaging frame, the upper end of the plastic packaging frame is fixedly connected to a connecting frame, and the lower end of the connecting frame is fixedly connected to two electro-hydraulic push rods; a plastic packaging mechanism, the plastic packaging mechanism is installed at the lower end of the connecting frame, and the surface of the plastic packaging mechanism extends to the outside of the plastic packaging frame; wherein, the plastic packaging mechanism includes a lower mold adjustment assembly installed on the inner bottom wall of the plastic packaging frame, the upper end of the lower mold adjustment assembly is installed with an upper mold drive assembly, and the upper mold drive assembly is arranged at the telescopic end of the connecting frame, a plastic packaging material extrusion head is arranged inside the lower mold adjustment assembly, and the lower end of the plastic packaging material extrusion head extends to the bottom of the plastic packaging frame, and a temperature auxiliary assembly is provided below the lower mold adjustment assembly, and the temperature auxiliary assembly is installed on the surface of the plastic packaging frame.

[0006] In one embodiment, the lower mold adjustment assembly includes a central guide bar fixedly connected to the inner bottom wall of the plastic packaging outer frame, the inner wall of the central guide bar is fixedly connected to the surface of the plastic packaging material extrusion head, and side guide bars fixedly connected to the inner wall of the plastic packaging outer frame are provided on both sides of the central guide bar. A sliding lower mold is slidably connected between the central guide bar and the side guide bars, and two bottom sliding frames are fixedly connected between the central guide bar and the side guide bars. The sliding lower mold is slidably connected to the surface of the bottom sliding frame. The upper end of the sliding lower mold is provided with four lower mold grooves, and thermal insulation material needs to be provided in the middle of the sliding lower mold. The thermal insulation material is appropriately adjusted according to actual usage, and two lower mold grooves are distributed on each side of the thermal insulation material.

[0007] In one embodiment, the upper mold drive assembly includes an upper mold fixedly connected to the telescopic end of the connecting frame, a cooling air duct is provided inside the upper mold, two heating blocks are embedded in the middle of the upper end of the upper mold, fixed sleeves are fixedly connected to both sides of the upper mold, a fixed ring is fixedly connected to the middle of the side of the upper mold, a hinged rod is hinged to the inner wall of the fixed ring, and the other end of the hinged rod is hinged to the upper end of the adjacent sliding lower mold. The hinged rod drives the sliding lower mold to slide between the middle guide bar and the side guide bar through the fixed ring.

[0008] In one embodiment, the end of the hinged rod near the upper mold is fixedly connected to a toggle block, and both sides of the guide frame are provided with a sealed telescopic cylinder fixedly connected to the surface of the plastic-encapsulated outer frame. The telescopic end of the sealed telescopic cylinder contacts the lower end of the toggle block, and a spring is mounted on the telescopic end of the sealed telescopic cylinder. The lower end of the sealed telescopic cylinder is connected to a liquid guide tube, and the end of the liquid guide tube away from the sealed telescopic cylinder is connected to a sealed embedded cylinder. When the hinged rod deflects, the toggle block moves with it, and then contacts the telescopic end of the sealed telescopic cylinder, causing the liquid medium in the sealed telescopic cylinder to be injected into the liquid guide tube, which in turn causes the piston in the sealed embedded cylinder to move toward the fixed sleeve.

[0009] In one embodiment, the temperature assist component includes a thermal insulation plate fixedly connected to the inner bottom wall of the plastic-encapsulated outer frame, the thermal insulation plate and the bottom sliding frame are combined to form a cooling chamber, and the opposite side of the adjacent thermal insulation plate forms a preheating chamber. The lower end of the thermal insulation plate is provided with a vortex tube fixedly connected to the lower end of the plastic-encapsulated outer frame, the cold air end of the vortex tube is connected to a first cold air duct, the end of the first cold air duct away from the vortex tube extends into the cooling chamber, the bottom wall of the cooling chamber is fixedly connected to a second cold air duct, and the other end of the second cold air duct is connected to the surface of the sealed embedded cylinder. The vortex tube injects high-speed gas so that the first cold air duct guides the cold air flow out, thereby cooling the cooling chamber, wherein the interior of the cooling chamber cools the lower part of the sliding lower mold through the guide heat guide plate, the corrugated heat guide plate and the bottom sliding frame, and the low-temperature gas is introduced into the cooling air duct through the second cold air duct, the sealed embedded cylinder and the fixed sleeve.

[0010] In one embodiment, a central guide groove is defined at the upper end of the central guide strip, a lower mold guide groove is defined at the upper end of the sliding lower mold, the central guide groove communicates with the adjacent lower mold guide groove, and a guide and heat conduction plate is fixedly connected to the lower end of the sliding lower mold. The lower mold guide groove and the central guide groove guide the material into the mold cavity. During this introduction process, the air vents defined at the upper end of the upper mold continuously heat the molding compound, thereby improving its fluidity and enabling rapid molding of the finished molded product.

[0011] In one embodiment, the upper end of the bottom sliding frame is provided with a guide slot, the guide heat conducting plate being slidably connected to the inner wall of the guide slot, and a corrugated heat conducting plate being provided between adjacent guide slots and slidably connected to the inner top wall of the bottom sliding frame. A hinged rod drives the sliding lower mold to move horizontally. After the upper mold moves downward again, inertia causes the other two lower mold slots of the sliding lower mold to move below the heating block. The surface of the corrugated heat conducting plate, away from the bottom sliding frame, is wavy, which can assist in guiding the airflow.

[0012] In one embodiment, the sealed embedded cylinder is embedded and mounted on the surface of the plastic-encapsulated outer frame. A piston is slidably connected to the inner wall of the sealed embedded cylinder. A valve core joint is fixedly connected to the inner wall of the piston. The valve core joint is connected to a telescopic bellows at the end away from the fixed sleeve. When the sealed telescopic cylinder is squeezed, the valve core joint contacts the cylinder joint, forming a tight fit. At this time, the cylinder joint and the valve core joint match, forming a connected effect. A cold air flow is injected into the interior of the cooling air duct through the fixed sleeve, rapidly cooling the adjacent plastic-encapsulated semiconductor, thereby improving the molding effect of the semiconductor plastic seal.

[0013] In one embodiment, a sliding tube is slidably connected to the inner wall of the fixed sleeve, the other end of which is fixedly connected to the cylinder connector, and a spring is fixedly connected between the fixed sleeve and the cylinder connector. When the sealed telescopic cylinder is not compressed, the fixed sleeve, via the sliding tube, drives the cylinder connector toward the end of the sealed embedded cylinder away from the second cooling air duct. At this time, the piston and the valve core connector are located within the sealed embedded cylinder, and the valve core connector and the cylinder connector do not contact each other.

[0014] In one embodiment, the hot gas end of the vortex tube is connected to a first hot gas conduit, which extends into the interior of the preheating chamber. A second hot gas conduit is fixedly connected to the inner bottom wall of the preheating chamber. The other end of the second hot gas conduit extends through the side of the plastic package frame and into the interior of the plastic package frame. The first hot gas conduit introduces hot air into the preheating chamber to assist in preheating the sliding lower mold above the preheating chamber, thereby improving the molding efficiency of the semiconductor plastic package. The hot gas in the preheating chamber is preheated through the second hot gas conduit to the adjacent lower mold groove above the sliding lower mold.

[0015] The above-mentioned plastic sealing mold maintains the melting heat in the middle of the upper mold by providing a heating block in the plastic sealing mechanism, thereby reducing heat loss during the reciprocating motion of the upper mold. The first hot air duct is used to auxiliary heat the heating area of ​​the sliding lower mold, and the second hot air duct is used to inject hot air into the wall to reduce heat loss caused by contact between external normal temperature air and the mold cavity. This reduces contact with external normal temperature air during the opening and closing process of the device, and assists in maintaining the high temperature effect of the mold cavity, thereby shortening the heating time of the mold cavity and improving the processing efficiency of the device.

[0016] The device can guide the low-temperature airflow to the inside of the cooling chamber through the first cold air duct during the plastic sealing process through the upper mold drive component and the temperature auxiliary component, thereby assisting in cooling the lower part of the sliding lower mold in the low-temperature area, and assisting in rapid cooling of the lower part of the semiconductor after plastic sealing molding. The low-temperature gas inside the cooling chamber is introduced into the upper mold through the closed embedded cylinder and the fixed sleeve, and cools the upper part of the semiconductor after plastic sealing molding, shortening the cooling and shaping time of the semiconductor after plastic sealing, and improving the processing efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 It is a structural schematic diagram of the present invention;

[0019] Figure 2 It is a structural schematic diagram of the plastic sealing mechanism of the present invention;

[0020] Figure 3 This is a schematic diagram of the explosion structure of the plastic sealing mechanism of the present invention;

[0021] Figure 4 This is a schematic diagram of the partial explosion structure of the lower mold adjustment assembly of the present invention;

[0022] Figure 5 A schematic diagram of the lower die guide groove of the present invention is provided;

[0023] Figure 6 A schematic diagram of the cooling airway of the present invention;

[0024] Figure 7 A schematic diagram of the guide notch of the present invention;

[0025] Figure 8 This is a schematic structural diagram of the corrugated heat conducting plate of the present invention;

[0026] Figure 9 It is a schematic diagram of the partial structure of the temperature auxiliary component of the present invention;

[0027] Figure 10 This is a schematic diagram of the connection between the enclosed telescopic cylinder and the liquid guide tube of the present invention;

[0028] Figure 11 This is a schematic diagram of the distribution of shrapnel according to the present invention;

[0029] Figure 12 It is a schematic diagram of the explosion structure inside the sealed embedded cylinder of the present invention.

[0030] Reference numerals:

[0031] 100, plastic packaging frame; 110, guide frame; 200, connecting frame; 210, electro-hydraulic push rod; 300, plastic packaging mechanism; 310, lower mold adjustment assembly; 311, middle guide strip; 3111, middle guide groove; 312, sliding lower mold; 3121, lower mold guide groove; 3122, guide and heat conduction plate; 313, side guide strip; 314, bottom sliding frame; 3141, guide slot; 3142, corrugated heat conduction plate; 320, upper mold drive assembly; 321, upper mold; 3211, cooling air duct; 322, heating block; 323, fixed sleeve; 3231, sliding tube; 3232, Cylinder joint; 3233, spring; 324, fixing ring; 3241, hinged rod; 3242, toggle block; 325, closed telescopic cylinder; 3251, spring; 326, liquid guide tube; 327, closed embedded cylinder; 3271, telescopic bellows; 3272, valve core joint; 3273, piston; 330, temperature auxiliary component; 331, vortex tube; 332, first hot air duct; 3321, second hot air duct; 333, first cold air duct; 3331, second cold air duct; 334, insulation board; 335, cooling chamber; 3351, preheating chamber; 340, plastic encapsulation compound extruder. DETAILED DESCRIPTION

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0033] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are for illustrative purposes only and do not represent the only implementation method.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0035] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are in contact indirectly through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] Unless otherwise defined, all technical and scientific terms used in the present description have the same meanings as those commonly understood by those skilled in the art to which this invention pertains. The terms used in this description are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used in this description includes any and all combinations of one or more of the associated listed items.

[0037] The following combination Figures 1-12 The plastic encapsulation mold of the present invention includes: a plastic encapsulation frame 100, with guide frames 110 fixedly connected to both sides of the plastic encapsulation frame 100, the guide frames 110 extending into the interior of the plastic encapsulation frame 100, a connecting frame 200 fixedly connected to the upper end of the plastic encapsulation frame 100, and two electro-hydraulic push rods 210 fixedly connected to the lower end of the connecting frame 200; a plastic encapsulation mechanism 300, which is mounted on the lower end of the connecting frame 200, and the surface of the plastic encapsulation mechanism 300 extends to the outside of the plastic encapsulation frame 100; wherein the plastic encapsulation mechanism 300 The lower mold adjustment assembly 310 is mounted on the inner bottom wall of the molding outer frame 100. The upper mold drive assembly 320 is mounted on the upper end of the lower mold adjustment assembly 310. The upper mold drive assembly 320 is arranged at the telescopic end of the connecting frame 200. The lower mold adjustment assembly 310 is provided with a molding compound extrusion head 340. The lower end of the molding compound extrusion head 340 extends to the bottom of the molding outer frame 100. A temperature auxiliary assembly 330 is provided below the lower mold adjustment assembly 310. The temperature auxiliary assembly 330 is mounted on the surface of the molding outer frame 100.

[0038] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 10 、 Figure 11 、 Figure 12As shown, the lower mold adjustment assembly 310 includes a central guide bar 311 fixedly connected to the inner bottom wall of the molding outer frame 100. The inner wall of the central guide bar 311 is fixedly connected to the surface of the molding compound extrusion head 340. Side guide bars 313 fixedly connected to the inner wall of the molding outer frame 100 are provided on both sides of the central guide bar 311. A sliding lower mold 312 is slidably connected between the central guide bar 311 and the side guide bars 313. Two bottom sliding frames 314 are fixedly connected between the central guide bar 311 and the side guide bars 313. The sliding lower mold 312 is slidably connected to the surfaces of the bottom sliding frames 314. A central guide groove 3111 is defined at the upper end of the central guide bar 311. A bottom mold guide groove 3121 is defined at the upper end of the sliding lower mold 312. The central guide groove 3111 communicates with the adjacent bottom mold guide groove 3121. A guide and heat conducting plate 3122 is fixedly connected to the lower end of the sliding lower mold 312. A guide slot 3141 is formed at the upper end of the bottom sliding frame 314. A guide heat conducting plate 3122 is slidably connected to the inner wall of the guide slot 3141. A corrugated heat conducting plate 3142 is provided between adjacent guide slots 3141. The corrugated heat conducting plate 3142 is slidably connected to the inner top wall of the bottom sliding frame 314.

[0039] The upper mold driving assembly 320 includes an upper mold 321 fixedly connected to the telescopic end of the connecting frame 200, a cooling air duct 3211 is opened inside the upper mold 321, two heating blocks 322 are embedded in the middle of the upper end of the upper mold 321, both sides of the upper mold 321 are fixedly connected to fixed sleeves 323, and the middle part of the side of the upper mold 321 is fixedly connected to a fixed ring 324, the inner wall of the fixed ring 324 is hinged with a hinge rod 3241, and the other end of the hinge rod 3241 is hinged to the upper end of the adjacent sliding lower mold 312; when the device is in use, the upper mold 321 is driven by the connecting frame 200 to move up and down, and when the upper mold 321 moves downward, the upper mold 321 is driven by the connecting frame 200 to move up and down. The fixing ring 324 enables the hinged rod 3241 to drive the sliding lower mold 312 to slide between the middle guide bar 311 and the side guide bar 313. When the upper mold 321 moves downward, the sliding lower mold 312 moves toward the end of the plastic packaging outer frame 100. At this time, the two lower mold grooves above the sliding lower mold 312 near one end are located directly below the heating block 322, thereby driving the plastic packaging compound extruder 340 to introduce the molten plastic packaging compound into the mold cavity through the lower mold guide groove 3121 and the middle guide groove 3111. During the introduction process, the air outlet is opened at the upper end of the upper mold 321 and the plastic packaging compound is continuously heated, which improves the fluidity of the plastic packaging compound and enables the plastic packaging product to be quickly formed.

[0040] The upper end of the sliding lower mold 312 is provided with four lower mold grooves, and a heat-insulating material needs to be set in the middle of the sliding lower mold 312. The heat-insulating material is appropriately adjusted according to the actual use situation. Two lower mold grooves are distributed on each side of the heat-insulating material, and a guide slot 3141 and a guide heat-conducting plate 3122 are provided on the upper end of the bottom sliding frame 314 to play an auxiliary guiding role for the sliding lower mold 312. Eight suction holes are provided on the upper end of the upper mold 321, and four suction holes are provided on each side of the two heating blocks 322. The suction holes can be connected to an external suction device. When the plastic sealing material under the heating block 322 is formed, the heating of the heating block 322 is stopped. At this time, the driving connecting frame 200 drives the upper mold 321 to move upward, and then the fixing ring 324 follows the upward movement, and the hinge rod 3 241 drives the sliding lower mold 312 to move horizontally. After the upper mold 321 moves downward again, the other two lower mold grooves of the sliding lower mold 312 move to the bottom of the heating block 322 under the action of inertia. The semiconductor previously molded and sealed under the heating block 322 can be sucked by the suction holes. When the upper mold 321 is lifted again, it moves along with the upper mold groove of the upper mold 321 under the action of suction. When the upper mold 321 performs another longitudinal reciprocating movement, the suction holes above the semiconductor can stop suctioning. At this time, the molded semiconductor located in the upper mold groove falls onto the top of the bottom sliding frame 314. When the upper mold 321 reciprocates again, the end of the sliding lower mold 312 will push the plastic-sealed semiconductor that has fallen on the bottom sliding frame 314 out of the plastic-sealed outer frame 100.

[0041] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 10 、 Figure 11 、 Figure 12 As shown, the end of the hinged rod 3241 near the upper mold 321 is fixedly connected to a toggle block 3242. A sealed telescopic cylinder 325 fixedly connected to the surface of the plastic-encapsulated outer frame 100 is provided on both sides of the guide frame 110. The telescopic end of the sealed telescopic cylinder 325 contacts the lower end of the toggle block 3242. A spring 3251 is sleeved on the telescopic end of the sealed telescopic cylinder 325. The lower end of the sealed telescopic cylinder 325 is connected to a liquid guide tube 326, and the end of the liquid guide tube 326 away from the sealed telescopic cylinder 325 is connected to a sealed embedded cylinder 327. The sealed embedded cylinder 327 is embedded and mounted on the surface of the plastic-encapsulated outer frame 100. A piston 3273 is slidably connected to the inner wall of the sealed embedded cylinder 327. A valve core joint 3272 is fixedly connected to the inner wall of the piston 3273. The end of the valve core joint 3272 away from the fixed sleeve 323 is connected to a telescopic bellows 3271. The inner wall of the fixed sleeve 323 is slidably connected to a sliding tube 3231 , the other end of the sliding tube 3231 is fixedly connected to a cylinder joint 3232 , and a spring piece 3233 is fixedly connected between the fixed sleeve 323 and the cylinder joint 3232 ;

[0042] When the hinge rod 3241 deflects, it drives the toggle block 3242 to follow the deflection, thereby contacting the telescopic end of the sealed telescopic cylinder 325, so that the liquid medium inside the sealed telescopic cylinder 325 is injected into the liquid guide tube 326. At this time, the piston 3273 inside the sealed embedded cylinder 327 moves toward the fixed sleeve 323, so that the valve core joint 3272 moves out of the sealed embedded cylinder 327. When the sealed telescopic cylinder 325 is not squeezed, the fixed sleeve 323 drives the cylinder joint 3232 through the sliding tube 3231 to move the sealed embedded cylinder 327 away from the second cooling duct 33 When the ends of the airtight expansion cylinder 325 are close to each other, the piston 3273 and the valve core joint 3272 are located inside the sealed embedded cylinder 327, and the valve core joint 3272 does not contact the cylinder joint 3232. When the sealed telescopic cylinder 325 is squeezed, the valve core joint 3272 contacts the cylinder joint 3232 to form a tight fit. At this time, the cylinder joint 3232 matches the valve core joint 3272 to form a communication effect. The cold air flow is injected into the cooling air channel 3211 through the fixed sleeve 323, and the adjacent plastic-encapsulated semiconductor is quickly cooled, thereby improving the molding effect of the semiconductor plastic encapsulation.

[0043] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 7 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12As shown, the temperature auxiliary component 330 includes an insulation plate 334 fixedly connected to the inner bottom wall of the plastic-sealed outer frame 100. The insulation plate 334 and the bottom sliding frame 314 are combined to form a cooling chamber 335. The opposite sides of the adjacent insulation plates 334 form a preheating chamber 3351. The lower end of the insulation plate 334 is provided with a vortex tube 331 fixedly connected to the lower end of the plastic-sealed outer frame 100. The cold air end of the vortex tube 331 is connected to a first cold air duct 333. The end of the first cold air duct 333 away from the vortex tube 331 passes through the cooling chamber 335. The bottom wall of the cooling chamber 335 is fixedly connected to a second cold air duct 3331. The other end of the second cold air duct 3331 is connected to the surface of the sealed embedded cylinder 327. The hot gas end of the vortex tube 331 is connected to the first hot gas conduit 332, which passes through the interior of the preheating chamber 3351. The inner bottom wall of the preheating chamber 3351 is fixedly connected to the second hot gas conduit 3321. The other end of the second hot gas conduit 3321 passes through the side of the plastic-encapsulated outer frame 100 and extends to the interior of the plastic-encapsulated outer frame 100. High-speed gas is injected through the vortex tube 331 so that the first cold air duct 333 guides the cold air flow out to cool the cooling chamber 335, wherein the interior of the cooling chamber 335 cools the bottom of the sliding lower mold 312 through the guide heat conducting plate 3122, the corrugated heat conducting plate 3142 and the bottom sliding frame 314, and the low-temperature gas is introduced into the cooling air channel 3211 through the second cold air duct 3331, the sealed embedded cylinder 327 and the fixed sleeve 323, and assists in cooling the two lower mold grooves near the end of the plastic packaging outer frame 100, and introduces hot air into the preheating chamber 3351 through the first hot air duct 332 to assist in preheating the sliding lower mold 312 above the preheating chamber 3351, thereby improving the molding efficiency of semiconductor plastic packaging. The hot gas inside the preheating chamber 3351 is preheated to the adjacent lower mold groove above the sliding lower mold 312 through the second hot air duct 3321, thereby improving the molding efficiency of semiconductor plastic packaging.

[0044] When using this device:

[0045] The driving connecting frame 200 drives the upper mold 321 to move longitudinally, and the hinge rod 3241 drives the sliding lower mold 312 to slide between the middle guide strip 311 and the side guide strip 313 through the fixing ring 324. When the upper mold 321 moves downward, the sliding lower mold 312 moves toward the end of the plastic packaging outer frame 100, drives the plastic packaging material extrusion head 340 to introduce the molten plastic packaging material, and the lower mold guide groove 3121 and the middle guide groove 3111 guide the mold cavity. The upper end of the sliding lower mold 312 is provided with four lower mold grooves, and the bottom sliding frame 3 The guide slots 3141 and the guide heat conducting plate 3122 are provided at the upper end of the 14 to assist in guiding the sliding lower mold 312. When the molding compound below the heating block 322 is formed, the heating of the heating block 322 is stopped, and the connecting frame 200 is driven to move the upper mold 321 upward. The fixing ring 324 moves upward along with it, and the hinged rod 3241 drives the sliding lower mold 312 to move horizontally. After the upper mold 321 moves downward again, the other two lower mold slots of the sliding lower mold 312 move to the bottom of the heating block 322 under the action of inertia.

[0046] When the hinge rod 3241 deviates, the toggle block 3242 is driven to follow the deviation and hit the telescopic end of the closed telescopic cylinder 325. The liquid medium inside the closed telescopic cylinder 325 is injected into the liquid guide tube 326. The piston 3273 inside the closed embedded cylinder 327 moves toward the fixed sleeve 323. The valve core joint 3272 moves out of the closed embedded cylinder 327. The valve core joint 3272 hits the cylinder joint 3232 to form a tight fit. The cylinder joint 3232 matches the valve core joint 3272 to form a connection effect. The cold air flow is injected into the interior of the cooling airway 3211 through the fixed sleeve 323. The vortex tube 331 transfers the high-speed air The body is injected into the first cold air duct 333 to guide the cold air flow out to cool the cooling chamber 335. The inside of the cooling chamber 335 is cooled by the guide heat conducting plate 3122, the corrugated heat conducting plate 3142 and the bottom sliding frame 314 to cool the lower sliding lower mold 312. The second cold air duct 3331, the sealed embedded cylinder 327 and the fixed sleeve 323 guide the low-temperature gas into the cooling air channel 3211 to assist the two lower mold grooves near the end of the plastic packaging outer frame 100 to assist in cooling. The first hot air duct 332 guides the hot air flow into the preheating chamber 3351 to assist the preheating operation of the sliding lower mold 312 above the preheating chamber 3351, thereby improving the molding efficiency of semiconductor plastic packaging.

[0047] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0048] The above-described embodiments merely illustrate several embodiments of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, and these modifications and improvements fall within the scope of the present invention. Therefore, the scope of the present invention shall be determined by the appended claims.

Claims

1. A plastic encapsulation mold, characterized in that: include: A plastic-encapsulated outer frame (100), wherein both sides of the plastic-encapsulated outer frame (100) are fixedly connected to guide frames (110), the guide frames (110) penetrate into the interior of the plastic-encapsulated outer frame (100), the upper end of the plastic-encapsulated outer frame (100) is fixedly connected to a connecting frame (200), and the lower end of the connecting frame (200) is fixedly connected to two electro-hydraulic push rods (210); A plastic sealing mechanism (300), the plastic sealing mechanism (300) being mounted on the lower end of the connecting frame (200), the surface of the plastic sealing mechanism (300) extending to the outside of the plastic sealing outer frame (100); The plastic packaging mechanism (300) includes a lower mold adjustment component (310) installed on the inner bottom wall of the plastic packaging outer frame (100), an upper mold driving component (320) is installed on the upper end of the lower mold adjustment component (310), and the upper mold driving component (320) is arranged at the telescopic end of the connecting frame (200). A plastic packaging material extrusion head (340) is arranged inside the lower mold adjustment component (310), and the lower end of the plastic packaging material extrusion head (340) passes through the bottom of the plastic packaging outer frame (100). A temperature auxiliary component (330) is arranged below the lower mold adjustment component (310), and the temperature auxiliary component (330) is installed on the surface of the plastic packaging outer frame (100); The lower mold adjustment assembly (310) includes a middle guide bar (311) fixedly connected to the inner bottom wall of the plastic packaging outer frame (100), the inner wall of the middle guide bar (311) is fixedly connected to the surface of the plastic packaging material extrusion head (340), and side guide bars (313) fixedly connected to the inner wall of the plastic packaging outer frame (100) are provided on both sides of the middle guide bar (311). A sliding lower mold (312) is slidably connected between the middle guide bar (311) and the side guide bars (313), and two bottom sliding frames (314) are fixedly connected between the middle guide bar (311) and the side guide bars (313), and the sliding lower mold (312) is slidably connected to the surface of the bottom sliding frame (314); The upper mold driving assembly (320) includes an upper mold (321) fixedly connected to the telescopic end of the connecting frame (200), a cooling air duct (3211) is provided inside the upper mold (321), two heating blocks (322) are embedded and installed in the middle of the upper end of the upper mold (321), both sides of the upper mold (321) are fixedly connected to fixed sleeves (323), the middle part of the side of the upper mold (321) is fixedly connected to a fixed ring (324), the inner wall of the fixed ring (324) is hinged to a hinge rod (3241), and the other end of the hinge rod (3241) is hinged to the upper end of the adjacent sliding lower mold (312).

2. The plastic encapsulation mold according to claim 1, characterized in that: The end of the hinged rod (3241) close to the upper mold (321) is fixedly connected to a toggle block (3242). Both sides of the guide frame (110) are provided with a sealed telescopic cylinder (325) fixedly connected to the surface of the plastic-encapsulated outer frame (100). The telescopic end of the sealed telescopic cylinder (325) contacts the lower end of the toggle block (3242). The telescopic end of the sealed telescopic cylinder (325) is sleeved with a spring (3251). The lower end of the sealed telescopic cylinder (325) is connected to a liquid guide tube (326). The end of the liquid guide tube (326) away from the sealed telescopic cylinder (325) is connected to a sealed embedded cylinder (327).

3. The plastic encapsulation mold according to claim 1, characterized in that: The temperature auxiliary component (330) includes a thermal insulation plate (334) fixedly connected to the inner bottom wall of the plastic-encapsulated outer frame (100), the thermal insulation plate (334) and the bottom sliding frame (314) are combined to form a cooling chamber (335), and the opposite side of the adjacent thermal insulation plate (334) forms a preheating chamber (3351), the lower end of the thermal insulation plate (334) is provided with a vortex tube (331) fixedly connected to the lower end of the plastic-encapsulated outer frame (100), the cold air end of the vortex tube (331) is connected to a first cold air duct (333), the end of the first cold air duct (333) away from the vortex tube (331) passes through the cooling chamber (335), the bottom wall of the cooling chamber (335) is fixedly connected to a second cold air duct (3331), and the other end of the second cold air duct (3331) is connected to the surface of the sealed embedded cylinder (327).

4. The plastic encapsulation mold according to claim 1, characterized in that: A middle guide groove (3111) is provided at the upper end of the middle guide strip (311), a lower die guide groove (3121) is provided at the upper end of the sliding lower die (312), the middle guide groove (3111) is communicated with the adjacent lower die guide groove (3121), and a guide and heat conduction plate (3122) is fixedly connected to the lower end of the sliding lower die (312).

5. The plastic encapsulation mold according to claim 4, characterized in that: A guide slot (3141) is provided at the upper end of the bottom sliding frame (314), the guide heat conduction plate (3122) is slidably connected to the inner wall of the guide slot (3141), a corrugated heat conduction plate (3142) is provided between adjacent guide slots (3141), and the corrugated heat conduction plate (3142) is slidably connected to the inner top wall of the bottom sliding frame (314).

6. The plastic encapsulation mold according to claim 2, characterized in that: The sealed embedded cylinder (327) is embedded and installed on the surface of the plastic-encapsulated outer frame (100); the inner wall of the sealed embedded cylinder (327) is slidably connected to a piston (3273); the inner wall of the piston (3273) is fixedly connected to a valve core joint (3272); and the end of the valve core joint (3272) away from the fixed sleeve (323) is connected to a telescopic bellows (3271).

7. The plastic encapsulation mold according to claim 6, characterized in that: The inner wall of the fixed sleeve (323) is slidably connected to a sliding tube (3231), the other end of the sliding tube (3231) is fixedly connected to a gas cylinder joint (3232), and a spring (3233) is fixedly connected between the fixed sleeve (323) and the gas cylinder joint (3232).

8. The plastic encapsulation mold according to claim 3, characterized in that: The hot air end of the vortex tube (331) is connected to a first hot air conduit (332), the first hot air conduit (332) passes through the interior of the preheating chamber (3351), and the inner bottom wall of the preheating chamber (3351) is fixedly connected to a second hot air conduit (3321), the other end of the second hot air conduit (3321) passes through the side of the plastic-encapsulated outer frame (100) and extends to the interior of the plastic-encapsulated outer frame (100).

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