Sectional drilling processing method and processing system for PCB (Printed Circuit Board)

Abstract

The invention provides a segmented drilling method for a PCB. The segmented drilling method comprises the steps that the feeding speed and the cutter feeding speed of a cutter are obtained; the cutter moves to the to-be-drilled point on the uppermost layer of the plate at the feeding speed, the feeding speed is switched into the cutter feeding speed, and a section of plate is machined at the cutter feeding speed; and the cutter is controlled to return to the cutter reference surface after each section of plate is machined, the cutter moves to the to-be-drilled starting point of the next section from the cutter reference surface again at the feeding speed when the next section is drilled, the feeding speed is switched to machine the next section of plate, and circulation is conducted till the cutter drills downwards to the final depth. A cutter is controlled to return to a cutter reference surface after each section of drilling is completed, the feeding speed of the cutter reference surface is reduced to a to-be-drilled starting point of a next section of plate, and drilling is switched to the feeding speed of the cutter, and a segmented variable-speed drilling mode is adopted, so that the machining efficiency of segmented drilling is effectively improved, the slow feeding time is shortened, and the machining efficiency is improved. And meanwhile, the segmentation instruction of segmented drilling is expanded, the segment length and the segment number of segmented drilling are freely set, and the machining requirements of different drilling technologies are met.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board drilling, and in particular to a PCB board segmented drilling processing method and a processing system. Background Art

[0002] In the PCB industry, communication boards, radar boards and special boards, such as military boards, have the characteristics of many pressed layers, thick copper foil, high hardness of board substrate, and thick total thickness of finished boards. When processing such boards, single-hole processing usually cannot be completed in one go, because the chip load is too large and the drilling stroke is too long. It is very easy to break the tool when drilling through in one go. Drilling needs to be performed in sections, which is called segmented drilling, to prevent problems such as tool breakage, crooked hole walls, overheating of the drill head, and poor chip removal caused by excessive load, so as to ensure processing quality and accuracy.

[0003] Before drilling a hole in a plate, the tool needs to be quickly positioned to the drilling position of the plate in a non-machining state. After the tool moves to the drilling position, the plate is drilled at a certain feed speed. The drilling speed of the tool will affect the temperature and roughness of the hole wall. The smaller the feed speed, the longer the tool stays in the hole, the higher the hole wall temperature, and the smaller the roughness, but more dust chips will be generated. Segmented drilling can prevent such problems from occurring. However, in the existing segmented drilling process, the drilled part and the undrilled part are kept at the same constant feed speed, which will be subject to a large load when the tool contacts the PCB plate, and it is easy to cause the deep hole drill to break or even break during the processing process, which may affect the life and straightness of the tool, resulting in low efficiency. At the same time, in the current segmented drilling of PCB boards, it can only be segmented according to distance and the number of drilling times. The segmentation method is limited and cannot adapt well to all PCB board drilling process requirements. Summary of the invention

[0004] The object of the present invention is to provide a PCB board segmented drilling processing method and processing system, so as to at least solve the problem that in the existing segmented drilling process, the drilled and un-drilled parts maintain the same feed speed, resulting in low efficiency and the segmented method is limited and cannot adapt to all PCB board drilling process requirements.

[0005] In order to solve the above technical problems, the present invention provides a PCB board segmented drilling processing method, comprising:

[0006] Get the feed rate and feed speed of the tool;

[0007] The tool moves to the topmost layer of the plate to be drilled using the feed speed, switches the feed speed to the feed speed, and processes a section of the plate using the feed speed;

[0008] After each section of plate is processed, the tool is controlled to return to the tool reference plane. When drilling the next section, the tool moves from the tool reference plane to the starting point of the next section to be drilled at the feed speed again, switches to the feed speed to process the next section of plate, and cycles until the tool drills to the final depth.

[0009] Optionally, in the segmented drilling method for a PCB board, the length of each segment of the board is set according to the distance, and the length of each segment can be the same or different.

[0010] Optionally, in the PCB board segmented drilling processing method, a segmentation instruction is formed according to the set length of each segment and the number of segments, and the tool drills the distance and number of drills for each segment according to the segmentation instruction.

[0011] Optionally, in the PCB board segmented drilling processing method, the segmentation instruction includes setting a certain number of segments with different lengths and / or setting a certain number of segments with the same lengths.

[0012] Optionally, in the PCB board segmented drilling processing method, the tool reference plane is located above the board.

[0013] Optionally, in the PCB board segmented drilling processing method, the tool feed speed is obtained according to the set tool parameters.

[0014] Optionally, in the described PCB board segmented drilling processing method, the feed speed is used again to descend from the tool reference plane to the next segment to be drilled, including: the tool descends from the tool reference plane to the board surface and the segment length that has been drilled, that is, the tool descends to the intersection of the end position of the last drilled segment and the starting position of the undrilled segment.

[0015] The present invention also provides a processing system, comprising:

[0016] An acquisition unit, used for acquiring a feed speed of a tool and a feed speed of a tool;

[0017] A control unit, used to control the tool to descend to the point to be drilled at the feed speed, and to control the tool to return to the tool reference plane after each drilling;

[0018] The speed change unit is used to switch the feed speed of the tool to the feed speed after the tool descends to the drilling point;

[0019] The drilling unit is used to control the tool to process a section of the plate based on the feed speed.

[0020] Optionally, in the processing method, processing a section of the plate includes: further including a segmentation instruction unit, wherein the segmentation instruction unit is used to set the segmentation method, the length of each segment, and the number of segmentations.

[0021] Optionally, in the processing method, the drilling unit controls the drilling distance of the tool in the corresponding segment and the number of segment drilling times of the tool according to the segmentation instruction.

[0022] The present invention provides a PCB board segmented drilling processing method and processing system. By setting the feed speed and feed speed of the tool respectively, the tool returns to the tool reference plane after drilling each section, and the feed speed is reduced from the tool reference plane to the starting point of the next section to be drilled, and the tool feed speed is switched to drilling down, and the segment length and the number of segments are freely set by using the segmented variable speed drilling method, so as to solve the problems of low segmented drilling efficiency and the single segmentation method that cannot meet different drilling processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A flow chart of the PCB board segmented drilling method provided in this embodiment;

[0025] Figure 2 A schematic diagram of the structure when the tool is located in the R plane during the segmented drilling process provided in this embodiment;

[0026] Figure 3 A schematic diagram of the structure when the tool is located at the second section to be drilled during the segmented drilling process provided in this embodiment;

[0027] Figure 4 A schematic diagram of a segmented method for segmented drilling processing provided in this embodiment.

[0028] Figure numerals: 1- tool; 2- processed plate. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the present application clearer, a PCB board segmented drilling processing method and processing system proposed by the present invention are further described in detail below in combination with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis that each drawing needs to show is different, and sometimes different proportions are used.

[0030] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0031] Reference Figure 1 As shown, Figure 1 Flow chart of a PCB board segmented drilling processing method provided in an embodiment of the present application. An embodiment of the present application provides a plate processing method, comprising:

[0032] Get the feed rate and feed speed of the tool;

[0033] The tool moves to the topmost drilling starting point of the plate at a feed speed, switches the feed speed to a feed speed, and processes a section of the plate at the feed speed;

[0034] After each section of plate is processed, the tool is controlled to return to the tool reference plane. When drilling the next section, the tool moves from the tool reference plane to the drilling point of the next section of the plate at the feed speed again, switches to the feed speed to process the next section of the plate, and cycles until the tool drills to the final depth.

[0035] By obtaining the feed speed of the tool and the feed speed of the tool, the speed of the tool in the drilled part and the speed of the undrilled part are switched. After each drilling process is completed, the tool is controlled to return to the tool reference plane, and then moved from the tool reference plane to the starting point of the next section to be drilled at the feed speed. The tool passes through the previously drilled part at the feed speed until it reaches the starting point of the next section of the plate to be drilled. The feed speed is changed to the tool feed speed to drill the next section of the plate, and the cycle is repeated until the plate is drilled to the final depth. When the tool drills deeper, the tool heats up and removes chips slowly due to the depth of the hole. By drilling in sections and returning to the tool reference plane upward after each drilling, the tool briefly leaves the drilled part, which can ensure effective heat dissipation and effective chip removal of the tool, and avoid damage to the drill bit caused by continuous deep drilling.

[0036] Specifically, the feed speed is used to descend from the tool reference plane to the next section to be drilled, including: the tool descends from the tool reference plane to the board surface and all the sections that have been drilled, that is, the tool descends to the junction of the end position of the last drilled section and the starting position of the undrilled section using the feed speed. In other words, every time the tool returns to the tool reference plane after drilling a section, the distance to be descended at the feed speed next time will increase. When the tool reaches the starting position of the undrilled section and contacts the sheet to be drilled, the feed speed is switched to the feed speed for drilling. This method changes the tool's cutting speed in the drilled part during the segmented drilling process, improves the efficiency of segmented drilling, and reduces the slow feed time.

[0037] Furthermore, the feed speed of the tool is obtained according to the set tool parameters. The feed speed of the tool and the feed speed of the tool can be manually set or automatically set via the human-machine interface and stored in the storage unit. The specific parameter settings of the tool can be stored in the storage database unit, including the number of tools, tool types, tool sizes, tool speed settings, etc. The user can set different feed force thresholds and different feed speed thresholds according to the size, type, processing parameters and PCB board materials of the tool. The tool is set on the processing spindle, and the tool can be a cutting tool, a drilling tool, a milling cutter or a boring tool, etc. without specific restrictions. The processing spindle drives the tool to rotate and move downward at the feed speed, and the feed speed is maintained to move the tool to the point to be drilled on the board. Once the tool contacts the point to be drilled on the board, the feed speed is switched to the feed speed of the tool, and the feed speed of the tool is used to drill a section of the board. Among them, the feed speed of the tool is generally set with special process parameters.

[0038] In order to control the tool to switch speed in time when it moves to the drilling point of each section, the distance between the tool reference plane and the initial drilling point of the plate and the segment length value set for each section can be calculated, and then the total distance that the tool needs to move at the feed speed before each descent to the drilling point can be calculated. In combination with the given feed speed, the time required for the tool to move to the drilling point is calculated to control the speed switching, or the tool's moving position can be controlled by setting the tool's descent distance value, and the feed speed is switched to the tool's feed speed when the tool moves to the starting point to be drilled for drilling; or, force sensors and dampers can be set on the processing platform. The force sensor is used to sense the drilling resistance or reaction force when the tool contacts the plate, and the damper is used to buffer the drilling resistance or reaction force when the tool just contacts the plate and when the tool is about to drill through the plate, so as to reduce the feed impact. When the tool contacts the plate, the force sensor senses the change in the tool state to form a sensing signal, and the system receives the tool state change signal to control the speed switching of the tool. The force sensor may be, for example, a pressure sensor, a displacement sensor or a current sensor, and the displacement signal or the current sensing signal may be converted into a force sensing signal to know the current processing status. The damper may be, for example, a hydraulic cylinder, a spring or a combination thereof, but is not limited.

[0039] The tool reference plane is located above the plate. After the tool drills a certain length, the tool is controlled to move upward back to the tool reference plane. That is to say, after the tool drills a certain hole, it moves upward out of the drilled hole to the top of the PCB board to wait for the next drilling. When the tool is on the tool reference plane, it can speed up the heat dissipation of the tool and the removal of drill chips in the drilled hole, improve the drilling accuracy and avoid damage to the tool head. When waiting for the tool to drill again, the tool passes through all the drilled parts at the feed speed until the tool contacts the point to be drilled on the PCB board.

[0040] In this drilling process, the speed of the tool does not start from zero when it contacts the PCB board, but switches to the drilling feed speed of the PCB board at a certain feed speed through variable speed drilling, which saves the process of accelerating from zero when the tool contacts the PCB board and speeds up the feed time. Optionally, during the PCB drilling process, a pressure foot can be added to ensure the relative stability between the PCB board and the cover plate during each drilling. The segmented drilling method avoids problems such as tool breakage, crooked hole walls, heated drill heads, and poor chip removal caused by long drilling time. For batch drilling processes, this method of moving the tool back to the tool reference plane and switching speeds significantly increases the drilling speed of the PCB board, reduces the feed time, and improves work efficiency.

[0041] Furthermore, since the tool is affected by factors such as hole depth and plate thickness when drilling, the load it is subjected to is different at different depths. Generally, the deeper the tool drills, the greater the load it bears and the easier it is to break. Therefore, the drilling distance of each section of the tool can be different.

[0042] Specifically, in addition to changing the speed of the tool, the length of each drilling segment and the number of segments can be freely set, and the length of each plate segment can be freely set according to the distance, and the length of each segment can be the same or different. A segmentation instruction is formed according to the set length of each segment and the number of segments, and the tool corresponds to the distance of each drilling and the number of required drillings according to the segmentation instruction. The segment length parameter value in the segmentation instruction and its corresponding hole depth position, segment length arrangement method, and number of segments are all freely set. The segmentation method is expanded on the basis of the original segmentation. The segment length sequence and segment length parameters can be freely set by personnel according to actual needs, which can adapt to all drilling processing needs.

[0043] The segmentation instruction includes setting a certain number of segments with different lengths and / or setting a certain number of segments with the same length. For example, the parameters of the segmentation instruction are set such that the first n segments are segmented according to different distances, and the remaining part is divided into m segments, which are divided according to the same equidistant distances. That is to say, the segmentation length is divided into two parts, and the first to the nth segments are set to have different distances for each segment, and the n+1th to the mth segments are set to have the same distance for each segment, wherein the values ​​of n and m are freely set by the staff.

[0044] Specifically, the distance of each segment in the first n segments can be set to be completely different, or can be set to be different, according to the actual drilling requirements. Either parameter n or m can be set to zero. When n is set to zero, all segments are divided according to the same segment length. When m is set to zero, all segments are not divided according to the distance. Similarly, the distance division method of the two parts can be swapped, and the first n segments are set to have the same distance for each segment, and the last m segments are set to have different distances for each segment.

[0045] The segmentation method can also be divided into multiple parts. Taking three parts as an example, the first n segments are a segmentation method, for example, the length of each segment is the same, the middle m segments are a segmentation method, for example, the length of each segment is different, and the last p segments are a segmentation method, for example, the length of each segment is the same. The specific parameter values ​​of n, m, and p can be freely set. In other words, by manually selecting parameters to set the length of each segment, the arrangement of all drilling segment lengths can be formed. Based on the original unified length of the same distance, the segmented drilling instructions can be expanded according to different scene requirements. The length of each segment and the number of segments can be freely set, which increases the freedom of segmented drilling settings and meets the needs of different drilling processes.

[0046] The tool drills the distance and number of times for each segment according to the segmentation instruction. The drilling distance of each segment of the tool is consistent with the segment length set for that segment. The system controls the drilling distance of the tool each time and the total number of drilling times of the tool according to the segment length and segment number calculated by the set segmentation instruction. The drilling distance of the tool each time is the distance the tool starts drilling after moving to the drilling point of the segment. Similarly, the drilling distance of each segment of the tool can be the same or different.

[0047] Reference Figure 2 and Figure 3 As shown, Figure 2 and Figure 3 The schematic diagram of the segmented drilling process provided in the embodiment of the present application, the tool 1 is set on the processing spindle on the crossbeam above the workbench, the circuit board is placed on the workbench, the processing spindle is controlled to move along the X direction on the crossbeam, and the circuit board is controlled to move along the Y direction on the workbench, the processing spindle and the circuit board are moved to a suitable position, and the processing spindle is controlled to move along the Z direction to perform drilling processing on the circuit board below. The structure of the specific circuit board processing equipment is not repeated, but is not limited to the structure of the above-mentioned circuit board processing equipment. Specifically, the parameters of the tool 1 (the rotation speed of the tool 1, the feed speed of the tool 1, the diameter of the tool 1, the feed speed of the tool 1), the delay time (the time that the tool 1 moves upward and stays on the tool reference plane above the processing plate 2 for idling after processing a section of holes, and the next section of holes will be processed after the time is over) and the tool life (the total number of holes that a new tool or a tool with a re-sharpened blade needs to drill from the beginning of use until it reaches the blunt standard) are input into the system, and the system controls the processing spindle to start and process the plate 2.

[0048] Specifically, H1, H2, ..., H n The depth of the PCB to be drilled is divided into n sections, and the tool drills in sequence according to the distance of each section. After drilling a certain depth, the tool returns to the tool reference plane above the board to wait for the next section of drilling. Figure 2 and Figure 3 For example, H1, H2, ..., H n The distance between them is the same, which is only one of the segmentation methods and is not limited to this. The R plane is located above the PCB board and is the segmented drilling return plane, that is, the tool reference plane. Tool 1 will return to the R plane after each drilling of a segment. When tool 1 starts to drill segment H1, tool 1 descends from the starting position of segment H1 at the set feed speed. When it descends to the bottom depth of segment H1, Figure 3The tool position shown in the figure controls the tool to return to the upper R plane to wait for drilling of H2 segment, and complete the drilling of H1 segment. When drilling H2 segment, tool 1 descends from R plane to PCB board surface and descends to H1 segment that has been drilled at the feed rate given by special parameters, and passes through the drilled H1 segment at the feed rate to improve efficiency, until the tool descends to the starting position of H2 segment, that is, the junction of H1 segment and H2 segment, as shown in the figure. Figure 3 As shown in the figure (the stop position of the tool when drilling H1 is the same as the starting position of the tool when drilling H2), the feed speed is switched to the feed speed set by tool 1 to drill down until it reaches the bottom of H2, and then returns to the R surface to complete the drilling of H2. The H3 segment is also drilled by tool 1 from the R surface to the PCB board surface and the drilled H1 and H2 segments using the feed speed given by special parameters. When it reaches the junction of H2 and H3 segments, it is switched to the tool feed speed to drill down, and so on, until the H3 segment is completed. n Drilling work of the segment.

[0049] Specifically, Figure 2 This is the position structure diagram when the tool is located in the R plane. Figure 3 This is the position structure diagram when tool 1 descends from the R plane to the drilling point of segment H2 at the feed speed. At this time, the tool tip position of tool 1 is at the junction of segment H1 and segment H2. The position of tool 1 when drilling the starting point of segment H2 to be drilled is the same as the deepest position of segment H1. Here, the tool feed speed is switched to drill segment H2 until it drills to the bottom depth position of segment H2, and then the tool is controlled to return to the upper tool reference plane P plane to wait for processing segment H3, and so on.

[0050] Figure 4 The schematic diagram of the segmentation structure provided in one embodiment is only one segmentation method of the segmentation drill, which is divided into two groups, H1 to H m The length of each segment can be freely defined. m+1 To H n The segment length is divided into equal parts according to the distance and the number of times to form a new segment length instruction. After receiving the set segment length instruction, the system controls the distance the tool descends and the number of times the drill is descended. Among them, the values ​​of m and n can be freely set according to the process requirements, and H1 to H m The freely defined segment length includes the same distance segment length and different distance segment length. When the n value is zero, it means that the segmentation method is to freely define the segment length. When the m value is zero, it means that the segmentation method is to divide the segment length equally according to the distance and the number of times. Of course, the segmentation method can also be set to H1 to H m The length of the segment is first divided into equal parts according to distance and number of times, H m+1 To H nThe length of each segment can be freely defined, and the values ​​of m and n can also be freely set according to the process requirements. Similarly, the segmentation method can be divided into multiple groups, and the segment length parameters of each group can be freely set, which improves the freedom of the segmentation method and can realize all possible segmentation methods, which is suitable for any drilling process with processing requirements.

[0051] The present application also discloses a plate processing system, which uses the plate processing method described in any of the above embodiments to drill holes in the plate. The plate processing system includes:

[0052] The acquisition unit is used to acquire the feed speed and feed speed of the tool. According to the type and size of the tool used, the size and type of the tool and the processing parameters of the plate are acquired from the storage database unit. After determining the tool information and the plate information, the feed speed and feed speed of the tool used are acquired. The required information can also be stored in the storage unit manually or automatically through the human-machine interface, and the feed speed and feed speed of the tool can be acquired by setting the information in the storage unit.

[0053] A control unit is used to control the tool to descend to the point to be drilled at the feed speed, and to control the tool to return to the tool reference plane after each drilling.

[0054] When the tool obtains the processing instruction and the feed speed of the tool, the control unit controls the tool to use the feed speed to descend to the drilling point. When drilling for the first time, the tool is controlled to descend to the topmost board surface of the PCB board. After obtaining the position of the tool by calculation or sensing, the tool speed is controlled to switch to the feed speed, and the feed speed is used to drill a section of the plate.

[0055] After the tool has completed processing a section of the plate, the control unit controls the tool to return to the tool reference plane above the plate. The tool reference plane is used as a unified reference plane. The tool returns to the reference plane after each section of processing is completed. The position of each return is relatively uniform, which is convenient for calculating the tool's next drilling distance. At the same time, the return of the tool after each drilling can quickly dissipate heat from the tool and complete rapid chip removal from the hole wall.

[0056] The speed changing unit is used to switch the feed speed of the tool to the feed speed after the tool descends to the point to be drilled.

[0057] The drilling unit is used to control the tool to process a section of the plate based on the feed speed.

[0058] During the first drilling, the top of the plate is usually covered with an aluminum plate to ensure that the plate surface is flattened. The aluminum material is relatively soft, which can help the blade to have a certain buffer when in contact, and help chip removal and heat dissipation. After the first drilling is completed, the tool returns to the tool reference plane and descends to the second section of the surface to be processed at the feed speed again. At this time, the tool has a certain rotation speed and descending speed. After switching to the feed speed, the tool can reduce the speed of the next feed acceleration in the plate, reduce the axial force impact when the tool cuts into the plate, and avoid tool breakage. The feed speed and feed speed of the tool are often different. If the plate is cut directly from zero at the set feed speed, the hardness of the plate is usually high. In order to maintain a constant cutting speed, the instantaneous impact of the tool contacting the material in the plate will cause a sudden change in the axial force of the tool. In minor cases, it will cause micro-deformation of the tool and produce errors in drilling accuracy. In severe cases, the tool cannot withstand the impact and breaks in the plate. Therefore, after the tool contacts the surface to be drilled, the speed change unit controls the tool to switch the feed speed to the feed speed for drilling, reducing the axial force impact when the tool cuts into the plate and avoiding tool breakage. The segmented drilling method can realize variable speed segmented processing, which is not only less likely to cause tool breakage, but also can achieve the effect of greatly improving processing efficiency.

[0059] The processing system also includes a segmentation instruction unit, which is used to set the segmentation method, the length of each segment, and the number of segmentations. The segmentation method of the segmented drill, the length of each segment, and other parameters can be freely set according to actual needs. The drilling unit controls the drilling distance of the tool in the corresponding segment and the number of segmented drillings of the tool according to the segmentation instruction.

[0060] By adopting variable speed cutting in segmented drilling, the cutting speed of the drilled part in the segmented drilling is changed, and the undrilled part is switched to the feed speed of the tool parameters to improve the efficiency of segmented drilling; different segmentation modes are adopted to improve the freedom of segmented drilling, and the segmented drilling instructions are expanded. Different distances can be defined for segmented drilling to meet different drilling process requirements.

[0061] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other. In addition, the different parts between the various embodiments can also be used in combination with each other, and the present invention is not limited to this.

[0062] The above is a detailed introduction to a PCB board segmented drilling processing method and processing system provided in the embodiments of the present application, and the principles and implementation methods of the present application are explained by using specific examples. The description of the above embodiments is only used to help understand the technical solution and its core idea of ​​the present application; ordinary technicians in this field should understand that: they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present application.

Claims

1. A PCB board segmented drilling method, characterized in that: include: Get the feed rate and feed speed of the tool; The tool moves to the topmost drilling point of the plate at the feed speed, switches the feed speed to the feed speed, and processes a section of the plate at the feed speed; After each section of plate is processed, the tool is controlled to return to the tool reference plane. When drilling the next section, the tool moves from the tool reference plane to the starting point of the next section to be drilled at the feed speed again, switches to the feed speed to process the next section of plate, and cycles until the tool drills to the final depth.

2. The PCB board segmented drilling method according to claim 1, characterized in that: The length of each section of the plate can be freely set according to the distance, and the length of each section can be the same or different.

3. The PCB board segmented drilling method according to claim 2, characterized in that: A segmentation instruction is formed according to the set length of each segment and the number of segments, and the tool corresponds to the drilling distance and the number of drilling times of each segment according to the segmentation instruction.

4. The PCB board segmented drilling method according to claim 3, characterized in that: The segmentation instruction includes setting a certain number of segments with different segment lengths and / or setting a certain number of segments with the same segment lengths.

5. The PCB board segmented drilling method according to claim 1, characterized in that: The tool reference surface is located above the plate.

6. The PCB board segmented drilling method according to claim 1, characterized in that: Get the tool feed speed according to the set tool parameters.

7. The PCB board segmented drilling method according to claim 1, characterized in that: The feed speed is used again to descend from the tool reference plane to the next point to be drilled, including: the tool descends from the tool reference plane to the board surface and the length of the segment that has been drilled, that is, the tool descends to the intersection of the end position of the last drilled segment and the starting position of the undrilled segment.

8. A processing system, characterized in that: include: An acquisition unit, used for acquiring a feed speed of a tool and a feed speed of a tool; A control unit, used to control the tool to descend to the point to be drilled at the feed speed, and to control the tool to return to the tool reference plane after each drilling; The speed change unit is used to switch the feed speed of the tool to the feed speed after the tool descends to the drilling point; The drilling unit is used to control the tool to process a section of the plate based on the feed speed.

9. The processing system according to claim 8, characterized in that: It also includes a segmentation instruction unit, which is used to set the segmentation method, the length of each segment and the number of segmentations.

10. The processing system according to claim 9, characterized in that: The drilling unit controls the drilling distance of the tool in the corresponding segment and the number of segment drilling times of the tool according to the segment instructions.

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