Reinforcing method of flexible circuit board

Abstract

The invention discloses a method for reinforcing a flexible circuit board, which comprises the following steps of: respectively crushing hydroxyethyl cellulose and polyethylene into particles, mixing to obtain a mixture, adding a solvent into the mixture, stirring to obtain a mixed solution, filtering the mixed solution to obtain a polymer solution, and carrying out ultrasonic treatment on the polymer solution to obtain the flexible circuit board. The method comprises the following steps of: firstly, coating a polymer solution on the surface of the flexible circuit board, curing the polymer solution to form a reinforcing layer so as to improve the structural strength and wear resistance of the flexible circuit board, and finally, forming an anti-corrosion layer on the reinforcing layer so as to protect the surface of the flexible circuit board from being damaged by chemical substances and external environment. Therefore, the problems of weak structure, easy damage and the like of the flexible circuit board in the prior art are avoided.

Description

Technical Field

[0001] The invention relates to the technical field of circuit boards, and in particular to a reinforcement method for a flexible circuit board. Background Art

[0002] At present, flexible circuit boards are widely used in electronic products. Their unique flexibility and bendability enable them to adapt to the space limitations and shape requirements of various complex electronic devices. However, flexible circuit boards often have problems such as weak structure and easy damage. Summary of the invention

[0003] In order to solve the above technical problems, an embodiment of the present invention provides a method for reinforcing a flexible circuit board, comprising:

[0004] The hydroxyethyl cellulose and the polyethylene are crushed into particles respectively;

[0005] Mixing the hydroxyethyl cellulose and the polyethylene crushed into particles to obtain a mixture;

[0006] adding a solvent to the mixture and stirring to obtain a mixed solution;

[0007] filtering the mixed solution to obtain a polymer solution;

[0008] Applying the polymer solution on the surface of the flexible circuit board and curing the polymer solution to form a reinforcement layer;

[0009] An anti-corrosion coating is coated on the reinforcement layer, and the anti-corrosion coating is cured to form an anti-corrosion layer.

[0010] As a preferred embodiment, the mass ratio of the hydroxyethyl cellulose to the polyethylene is 1:1-1:5.

[0011] As a preferred solution, the mass of the solvent is 10%-50% of the total mass of the mixture.

[0012] As a preferred embodiment, the solvent is ethanol or acetone.

[0013] As a preferred embodiment, the anti-corrosion coating includes sodium dihydrogen phosphate, dipotassium hydrogen phosphate, zinc salt, ammonium chloride and water.

[0014] As a preferred embodiment, the components of the anti-corrosion coating include: 2 g of sodium dihydrogen phosphate, 3.5 g of dipotassium hydrogen phosphate, 2 g of zinc salt, 0.5 g of ammonium chloride and 400 ml of water.

[0015] As a preferred embodiment, the step of coating the polymer solution on the surface of the flexible circuit board and curing the polymer solution to form a reinforcement layer specifically includes:

[0016] coating the polymer solution on the surface of the flexible circuit board;

[0017] At room temperature, the flexible circuit board coated with the polymer solution is air-dried for 48 hours, or the flexible circuit board coated with the polymer solution is dried in an oven at a drying temperature of 120° C. for 2 hours to form a reinforcement layer.

[0018] As a preferred embodiment, after coating the anti-corrosion coating on the reinforcement layer and curing the anti-corrosion coating into the anti-corrosion layer, the method further comprises:

[0019] A plurality of through holes penetrating upper and lower surfaces of the reinforcement layer and the anti-corrosion layer are formed in the reinforcement layer and the anti-corrosion layer.

[0020] As a preferred solution, the diameter of at least a portion of the through holes gradually decreases from the opening position toward the direction away from the opening position.

[0021] As a preferred solution, the ratio of the hole diameter to the hole depth of at least a portion of the through holes is 1:2 to 5:1.

[0022] Compared with the prior art, the beneficial effect of the embodiments of the present invention is that: the embodiments of the present invention provide a method for reinforcing a flexible circuit board, firstly, hydroxyethyl cellulose and polyethylene are crushed into particles respectively, and then they are mixed to obtain a mixture, and then a solvent is added to the mixture and stirred to obtain a mixed solution, and then the mixed solution is filtered to obtain a polymer solution, and then the polymer solution is coated on the surface of the flexible circuit board, and the polymer solution is solidified to form a reinforcement layer to improve the structural strength and wear resistance of the flexible circuit board, and finally an anti-corrosion layer is formed on the reinforcement layer to protect the surface of the flexible circuit board from damage by chemical substances and the external environment, thereby avoiding the problems of weak structure and easy damage of the flexible circuit board in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic flow chart of a method for reinforcing a flexible circuit board in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] See also Figure 1 , which is a flow chart of a method for reinforcing a flexible circuit board in an embodiment of the present invention.

[0026] The method for reinforcing a flexible circuit board according to an embodiment of the present invention comprises:

[0027] Step S101, crushing hydroxyethyl cellulose and polyethylene into particles respectively;

[0028] Step S102, mixing the hydroxyethyl cellulose crushed into particles and the polyethylene to obtain a mixture;

[0029] Step S103, adding a solvent to the mixture and stirring to obtain a mixed solution;

[0030] Step S104, filtering the mixed solution to obtain a polymer solution;

[0031] Step S105, coating the polymer solution on the surface of the flexible circuit board, and curing the polymer solution to form a reinforcement layer;

[0032] Step S106, coating an anti-corrosion coating on the reinforcement layer, and curing the anti-corrosion coating into an anti-corrosion layer.

[0033] In an embodiment of the present invention, hydroxyethyl cellulose and polyethylene are first crushed into particles respectively, and then mixed to obtain a mixture, and then a solvent is added to the mixture and stirred to obtain a mixed solution, and then the mixed solution is filtered to obtain a polymer solution, and then the polymer solution is coated on the surface of the flexible circuit board, and the polymer solution is cured to form a reinforcement layer to improve the structural strength and wear resistance of the flexible circuit board, and finally an anti-corrosion layer is formed on the reinforcement layer to protect the surface of the flexible circuit board from damage by chemical substances and the external environment, thereby avoiding the problems of weak structure and easy damage of the flexible circuit board in the prior art.

[0034] In an optional embodiment, in step S101, hydroxyethyl cellulose and polyethylene are respectively crushed into particles of appropriate sizes, so as to facilitate subsequent mixing and dissolving of hydroxyethyl cellulose and polyethylene in a certain proportion.

[0035] In an optional embodiment, in step S102, the mass ratio of the hydroxyethyl cellulose and the polyethylene is 1:1-1:5, for example, it can be 1:1, 1:2, 1:3, 1:4, 1:5, etc. Of course, the mass ratio of the hydroxyethyl cellulose and the polyethylene can also be set to other ratios according to actual use requirements, which will not be further elaborated here.

[0036] In an optional embodiment, in step S103, the mixture is stirred evenly until the hydroxyethyl cellulose and the polyethylene are fully dissolved in the solvent, and the mass of the solvent is 10%-50% of the total mass of the mixture, for example, it can be 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, etc. Of course, the mass ratio of the solvent to the total mass of the mixture can also be set to other values ​​according to actual use requirements, and no further details are given here. Exemplarily, the solvent is ethanol or acetone. Of course, the solvent can also be selected from other materials according to actual use requirements, and no further details are given here.

[0037] In an optional embodiment, in step S104, the prepared solution is filtered to remove impurities to make it purer.

[0038] In an optional embodiment, the step S105 of "coating the polymer solution on the surface of the flexible circuit board and curing the polymer solution to form a reinforcement layer" specifically includes:

[0039] coating the polymer solution on the surface of the flexible circuit board;

[0040] At room temperature, the flexible circuit board coated with the polymer solution is air-dried for 48 hours, or the flexible circuit board coated with the polymer solution is dried in an oven at a drying temperature of 120° C. for 2 hours to form a reinforcement layer.

[0041] In this embodiment, the polymer solution is coated on the surface of the flexible circuit board and solidified by air-drying or baking to form a hard reinforcement layer on the flexible circuit board to improve the structural strength and wear resistance of the flexible circuit board.

[0042] In an optional embodiment, in step S106, an anti-corrosion coating is applied on the surface of the reinforcement layer to form an anti-corrosion layer, thereby protecting the surface of the flexible circuit board from damage by chemical substances and the external environment. The anti-corrosion coating includes sodium dihydrogen phosphate, dipotassium hydrogen phosphate, zinc salt, ammonium chloride and water. In a specific implementation, the anti-corrosion coating is obtained by uniformly mixing sodium dihydrogen phosphate, dipotassium hydrogen phosphate, zinc salt, ammonium chloride and water. Exemplarily, the components of the anti-corrosion coating include: 2g of sodium dihydrogen phosphate, 3.5g of dipotassium hydrogen phosphate, 2g of zinc salt, 0.5g of ammonium chloride and 400ml of water. Of course, the content of each component in the anti-corrosion coating can also be set to other values ​​according to actual use requirements, and no further details are given here.

[0043] In an optional embodiment, after coating the anti-corrosion coating on the reinforcement layer and curing the anti-corrosion coating into the anti-corrosion layer, the method further comprises:

[0044] A plurality of through holes penetrating upper and lower surfaces of the reinforcement layer and the anti-corrosion layer are formed in the reinforcement layer and the anti-corrosion layer.

[0045] In this embodiment, by setting a plurality of through holes penetrating the upper and lower surfaces of the reinforcing layer and the anti-corrosion layer, firstly, a bending space can be provided for the flexible circuit board to improve the bending performance of the flexible circuit board, so that the flexible circuit board can be suitable for scenes with larger bending angles; secondly, the flexible circuit board is easy to generate heat during operation, and the through holes can be used to dissipate heat for the flexible circuit board, so as to improve the heat dissipation performance of the flexible circuit board, thereby ensuring the normal operation of the flexible circuit board; thirdly, when the flexible circuit board generates heat, by setting the through holes, a deformation space can be provided for the reinforcing layer and the anti-corrosion layer, so as to avoid the problem of damage to the reinforcing layer and the anti-corrosion layer due to extrusion deformation at various places caused by thermal expansion of the reinforcing layer and the anti-corrosion layer. In addition, the through holes are formed by, for example, laser drilling or other methods.

[0046] In an optional embodiment, the aperture of at least a portion of the through holes gradually decreases from the opening position toward the direction away from the opening position.

[0047] It should be noted that the opening position refers to the opening position of the through hole on the side of the anti-corrosion layer away from the reinforcement layer. In this embodiment, by setting the aperture of at least a portion of the through holes to gradually decrease from the opening position to the direction away from the opening position, a larger bending space is further provided for the flexible circuit board, and the heat dissipation performance can be further improved.

[0048] In an optional embodiment, a ratio of the hole diameter to the hole depth of at least a portion of the through holes is 1:2 to 5:1.

[0049] In this embodiment, the ratio of the hole diameter to the hole depth of at least a portion of the through holes is 1:2 to 5:1, which can obtain good bending performance and heat dissipation performance of the flexible circuit board.

[0050] The embodiment of the present invention effectively improves the structural strength, durability and wear resistance of the circuit board by covering the surface of the flexible circuit board with a reinforcement layer, and can be widely used in the manufacture of flexible circuit boards for various electronic products. At the same time, the embodiment of the present invention can also effectively reduce the cost of the flexible circuit board and improve production efficiency and quality.

[0051] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A method for reinforcing a flexible circuit board, characterized in that: include: The hydroxyethyl cellulose and the polyethylene are crushed into particles respectively; Mixing the hydroxyethyl cellulose and the polyethylene crushed into particles to obtain a mixture; adding a solvent to the mixture and stirring to obtain a mixed solution; filtering the mixed solution to obtain a polymer solution; Applying the polymer solution on the surface of the flexible circuit board and curing the polymer solution to form a reinforcement layer; An anti-corrosion coating is coated on the reinforcement layer, and the anti-corrosion coating is cured to form an anti-corrosion layer.

2. The method for reinforcing a flexible circuit board according to claim 1, characterized in that: The mass ratio of the hydroxyethyl cellulose to the polyethylene is 1:1-1:

5.

3. The method for reinforcing a flexible circuit board according to claim 1, characterized in that: The mass of the solvent is 10%-50% of the total mass of the mixture.

4. The method for reinforcing a flexible circuit board according to claim 3, characterized in that: The solvent is ethanol or acetone.

5. The method for reinforcing a flexible circuit board according to claim 1, wherein: The anti-corrosion coating comprises sodium dihydrogen phosphate, dipotassium hydrogen phosphate, zinc salt, ammonium chloride and water.

6. The method for reinforcing a flexible circuit board according to claim 5, characterized in that: The components of the anti-corrosion coating include: 2g of sodium dihydrogen phosphate, 3.5g of dipotassium hydrogen phosphate, 2g of zinc salt, 0.5g of ammonium chloride and 400ml of water.

7. The method for reinforcing a flexible circuit board according to claim 1, wherein: The step of coating the polymer solution on the surface of the flexible circuit board and curing the polymer solution to form a reinforcement layer specifically includes: coating the polymer solution on the surface of the flexible circuit board; At room temperature, the flexible circuit board coated with the polymer solution is air-dried for 48 hours, or the flexible circuit board coated with the polymer solution is dried in an oven at a drying temperature of 120° C. for 2 hours to form a reinforcement layer.

8. The method for reinforcing a flexible circuit board according to any one of claims 1 to 7, characterized in that: After coating the anti-corrosion coating on the reinforcement layer and curing the anti-corrosion coating into an anti-corrosion layer, the method further comprises: A plurality of through holes penetrating upper and lower surfaces of the reinforcement layer and the anti-corrosion layer are formed in the reinforcement layer and the anti-corrosion layer.

9. The method for reinforcing a flexible circuit board according to claim 8, characterized in that: The aperture of at least a portion of the through holes gradually decreases from the opening position toward the direction away from the opening position.

10. The method for reinforcing a flexible circuit board according to claim 8, wherein: The ratio of the hole diameter to the hole depth of at least a portion of the through holes is 1:2 to 5:1.

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