Display panel manufacturing method, display panel and electronic equipment

Abstract

This application provides a method for manufacturing a display panel, a display panel, and an electronic device. By using a preset etching solution that has minimal impact on the isolation structure to pattern the conductive material layer, the impact of the earlier-formed sub-pixel manufacturing process on the isolation structure of the later-formed sub-pixels can be reduced, thereby ensuring the effectiveness of the subsequent electrode evaporation and bonding of each sub-pixel and guaranteeing the display yield.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a method for manufacturing a display panel, the display panel itself, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the current manufacturing process of OLED display products needs improvement. Summary of the Invention

[0004] To overcome the aforementioned shortcomings in the prior art, the purpose of this application is to provide a method for manufacturing a display panel, comprising:

[0005] providing a substrate;

[0006] An isolation structure is formed on one side of the substrate. The isolation structure includes a plurality of isolation openings spaced apart. The plurality of isolation openings include a first isolation opening and a second isolation opening.

[0007] A first light-emitting material layer, a first conductive material layer, and a first encapsulation material layer are sequentially formed on one side of the substrate where an isolation structure is provided. At least a portion of the first light-emitting material layer, the first conductive material layer, and the first encapsulation material layer are located within the first isolation opening and the second isolation opening.

[0008] Remove the first encapsulation material layer from the second isolation opening;

[0009] The first conductive material layer is etched using a preset etching solution to remove the first conductive material layer in the second isolation opening;

[0010] Remove the first luminescent material layer from the second isolation opening;

[0011] Among them, the isolation structure has a greater corrosion resistance to the preset etching solution than the first conductive material layer.

[0012] In some possible implementations, the pre-defined etching solution composition includes C6H8O7, HNO3, and CH3COOH.

[0013] In some possible implementations, the etching solution is pre-defined to contain C6H8O7 at a mass fraction greater than or equal to 15% and less than or equal to 30%, HNO3 at a mass fraction greater than or equal to 5% and less than or equal to 10%, and CH3COOH at a mass fraction greater than or equal to 5% and less than or equal to 10%.

[0014] In some possible implementations, the step of forming an isolation structure on one side of the substrate includes:

[0015] An isolation layer is formed on one side of the substrate;

[0016] An isolation structure is formed by patterning and etching an isolation layer. The isolation structure includes a support portion and a shielding portion stacked sequentially in a direction away from the substrate. The orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate. The first undercut lengths of the isolation structures corresponding to the first isolation opening and the second isolation opening are equal or the absolute value of their difference is less than or equal to 0.1 micrometers. The first undercut length is the distance between the orthographic projection of the end of the support portion near the isolation opening on the substrate and the orthographic projection of the end of the shielding portion near the isolation opening on the substrate.

[0017] The support portion has a higher corrosion resistance to the preset etching solution than the first conductive material layer.

[0018] In some possible implementations, the isolation structure also includes a receiving portion located on the side of the support portion closer to the substrate, wherein the orthographic projection of the support portion on the substrate lies within the orthographic projection of the receiving portion on the substrate; the area of ​​the orthographic projection of the support portion on the substrate is smaller than the area of ​​the orthographic projection of the receiving portion on the substrate.

[0019] The receiving part has a greater corrosion resistance to the preset etching solution than the first conductive material layer.

[0020] The second undercut lengths of the isolation structures corresponding to the first isolation opening and the second isolation opening are equal or the absolute value of the difference is less than or equal to 0.1 micrometers. The second undercut length is the distance between the orthographic projection of the end of the receiving part near the isolation opening on the substrate and the orthographic projection of the end of the shielding part near the isolation opening on the substrate.

[0021] Optionally, the first conductive material layer is in electrical contact with the receiving part.

[0022] In some possible implementations, after removing the first light-emitting material layer from the second isolation opening, the method further includes:

[0023] A second light-emitting material layer, a second conductive material layer, and a second encapsulation material layer are formed within the second isolation opening; the first light-emitting material layer and the second light-emitting material layer emit different colors.

[0024] Alternatively, the isolation opening may also include a third isolation opening;

[0025] At the same time, remove the first encapsulation material layer in the second isolation opening and remove the first encapsulation material layer in the third isolation opening;

[0026] At the same time, remove the first conductive material layer in the second isolation opening and remove the first conductive material layer in the third isolation opening.

[0027] While removing the first luminescent material layer in the second isolation opening, remove the first luminescent material layer in the third isolation opening;

[0028] After removing the first luminescent material layer from the second isolation opening, the method further includes:

[0029] A second light-emitting material layer, a second conductive material layer, and a second encapsulation material layer are sequentially formed on one side of the substrate where an isolation structure is provided. At least a portion of the second light-emitting material layer, the second conductive material layer, and the second encapsulation material layer are located within the first isolation opening, the second isolation opening, and the third isolation opening.

[0030] Remove the second encapsulation material layer from the first and third isolation openings;

[0031] The second conductive material layer is etched using a preset etching solution to remove the second conductive material layer within the first and third isolation openings; the isolation structure has greater corrosion resistance to the preset etching solution than the second conductive material layer.

[0032] Remove the second light-emitting material layer from the first and third isolation openings;

[0033] A third light-emitting material layer, a third conductive material layer, and a third encapsulation material layer are sequentially formed on one side of the substrate where an isolation structure is provided. At least a portion of the third light-emitting material layer, the third conductive material layer, and the third encapsulation material layer are located within the first isolation opening, the second isolation opening, and the third isolation opening. The first light-emitting material layer, the second light-emitting material layer, and the third light-emitting material layer emit different colors.

[0034] Remove the third encapsulation material layer from the first and second isolation openings;

[0035] The third conductive material layer is etched using a preset etching solution or an etching solution different from the preset etching solution to remove the third conductive material layer inside the first isolation opening and the second isolation opening; the isolation structure has a greater corrosion resistance to the preset etching solution than the third conductive material layer has.

[0036] Remove the third luminescent material layer from the first and second isolation openings.

[0037] In some possible implementations, the isolation structure does not react with the pre-set etching solution.

[0038] Another object of this application is to provide a display panel, comprising:

[0039] Substrate;

[0040] An isolation structure located on one side of a substrate includes a plurality of isolation openings spaced apart; the isolation structure includes a support portion and a shielding portion stacked sequentially in a direction away from the substrate, wherein the orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate;

[0041] Multiple light-emitting devices with different emission colors, at least a portion of which is located within an isolation opening, wherein the first undercut lengths of the isolation structures corresponding to the isolation openings of at least two light-emitting devices with different emission colors are equal or the absolute value of their difference is less than or equal to 0.1 micrometers, and the first undercut length is the distance between the orthographic projection of the end of the support portion near the isolation opening on the substrate and the orthographic projection of the end of the shielding portion near the isolation opening on the substrate.

[0042] In some possible implementations, the display panel includes at least three light-emitting devices with different emitting colors, and the first undercut lengths of the isolation structures corresponding to the isolation openings of the light-emitting devices with different emitting colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers.

[0043] Optionally, the light-emitting devices with different emission colors include light-emitting devices for emitting red light, light-emitting devices for emitting green light, and light-emitting devices for emitting blue light.

[0044] In some possible implementations, the display panel also includes:

[0045] A pixel defining layer includes a pixel opening, which is connected to an isolation opening. The orthographic projection of the pixel opening onto the substrate is located within the orthographic projection of the isolation opening onto the substrate.

[0046] Optionally, the pixel defining layer is located between the isolation structure and the substrate, or the pixel defining layer is provided with a clearance opening, and the isolation structure is located at the clearance opening.

[0047] In some possible implementations, the light-emitting device includes a first electrode, a light-emitting unit, and a second electrode stacked sequentially in a direction away from the substrate.

[0048] In some possible implementations, the isolation structure is conductive, and the second electrode is electrically connected to the isolation structure;

[0049] Optionally, the second electrode extends from inside the isolation opening to contact the sidewall of the isolation structure facing the isolation opening.

[0050] In some possible implementations, the material of the support portion is more reactive than the material of the shielding portion;

[0051] Alternatively, the support may be made of aluminum, and the shield may be made of titanium.

[0052] In some possible implementations, the isolation structure also includes a receiving portion located on the side of the support portion closer to the substrate, wherein the orthographic projection of the support portion on the substrate is within the orthographic projection of the receiving portion on the substrate;

[0053] The area of ​​the support portion projected onto the substrate is smaller than the area of ​​the receiving portion projected onto the substrate.

[0054] Optionally, the second electrode makes electrical contact with the receiving part.

[0055] In some possible implementations, the second undercut lengths of the isolation structures corresponding to the isolation openings of at least two light-emitting devices with different emission colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers. The second undercut length is the distance between the orthographic projection of the end of the receiving part near the isolation opening on the substrate and the orthographic projection of the end of the shielding part near the isolation opening on the substrate.

[0056] Optionally, the display panel includes at least three light-emitting devices with different emitting colors, and the second undercut lengths of the isolation structures corresponding to the isolation openings of the light-emitting devices with different emitting colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers;

[0057] Optionally, the material of the receiving part may include molybdenum.

[0058] In some possible implementations, the display panel also includes a packaging unit located on the side of the light-emitting device away from the substrate, the packaging unit extending from the isolation opening to the side of the isolation structure away from the substrate;

[0059] Optionally, there is a gap between the packaging units corresponding to adjacent isolation openings, and the gap is located on the side of the isolation structure away from the substrate.

[0060] In some possible implementations, the display panel further includes a second encapsulation layer and a third encapsulation layer that are located on the side of the encapsulation unit away from the substrate and are stacked sequentially in a direction away from the substrate;

[0061] Optionally, the materials of the packaging unit and the third packaging layer include inorganic materials, and the materials of the second packaging layer include organic materials.

[0062] In some possible implementations, the isolation structure includes at least two isolation openings with different opening sizes, the opening size being the size of the orthographic projection of the isolation opening onto the substrate.

[0063] In some possible implementations, the opening sizes of the isolation openings corresponding to at least two light-emitting devices with different emission colors are different.

[0064] This application also provides an electronic device, which includes a display panel manufactured using the manufacturing method of the display panel provided prior to this application, or includes the display panel provided in this application.

[0065] Compared with the prior art, this application has the following beneficial effects:

[0066] The manufacturing method, display panel, and electronic device provided in this application can reduce the impact of the earlier-formed sub-pixel fabrication process on the isolation structure of the later-formed sub-pixels by using a preset etching solution that has less impact on the isolation structure. This ensures the effectiveness of the subsequent electrode evaporation and bonding of each sub-pixel and guarantees the display yield. Attached Figure Description

[0067] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0068] Figure 1 A schematic diagram of a display panel with an isolation structure;

[0069] Figure 2 This is one of the schematic diagrams illustrating the manufacturing process of a display panel with an isolation structure.

[0070] Figure 3 This is the second schematic diagram illustrating the manufacturing process of a display panel with an isolation structure.

[0071] Figure 4 This is a flowchart illustrating the steps of the manufacturing method for the display panel provided in this embodiment;

[0072] Figure 5 This is one of the schematic diagrams illustrating the manufacturing process of the display panel provided in this embodiment;

[0073] Figure 6 This is the second schematic diagram of the manufacturing process of the display panel provided in this embodiment;

[0074] Figure 7 This is the third schematic diagram illustrating the manufacturing process of the display panel provided in this embodiment;

[0075] Figure 8 One of the schematic diagrams of the display panel provided in this embodiment;

[0076] Figure 9 This is a second schematic diagram of the display panel provided in this embodiment;

[0077] Figure 10 This is a schematic diagram of the isolation structure provided in this embodiment;

[0078] Figure 11 This is the fourth schematic diagram of the display panel provided in this embodiment;

[0079] Figure 12 This is the fifth schematic diagram of the display panel provided in this embodiment;

[0080] Figure 13 This is the sixth schematic diagram of the display panel provided in this embodiment;

[0081] Figure 14 This is the seventh schematic diagram of the display panel provided in this embodiment.

[0082] Icons: 110-Substrate; 120-First electrode; 130-Pixel defining layer; 140-Isolation structure; 141-Support portion; 142-Shielding portion; 143-Receiving portion; 150-Light-emitting unit; 160-Second electrode; 170-Encapsulation unit; 180-Second encapsulation layer; 190-Third encapsulation layer; 910-Etching barrier portion; 1510-First light-emitting material layer; 1610-First electrode material layer; 1710-First encapsulation material layer; P1-First sub-pixel; P2-Second sub-pixel; P3-Third sub-pixel. Detailed Implementation

[0083] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0084] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0085] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0086] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0087] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0088] Please refer to Figure 1 In some display panels employing the isolation structure 140, the display panel typically includes a substrate 110, a pixel defining layer 130, the isolation structure 140, and a light-emitting device. The pixel openings of the pixel defining layer 130 communicate with the isolation openings of the isolation structure 140. The light-emitting device is at least partially located within the pixel openings and / or the isolation openings. The light-emitting device includes a first electrode 120, a light-emitting unit 150, and a second electrode 160. The display panel may also include an encapsulation unit 170 located on the side of the light-emitting device away from the substrate.

[0089] The isolation structure can enclose multiple isolation openings. This structure allows for the formation of multiple spaced-apart light-emitting units of different colors and corresponding second electrodes in the light-emitting material layer and second electrode layer without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. The isolation structure separates the light-emitting material layer and the second electrode in the light-emitting device, making different light-emitting devices independent, reducing crosstalk between adjacent devices, and improving display performance. Furthermore, the independence of adjacent light-emitting devices allows for independent packaging, improving packaging yield. Simultaneously, due to the isolation structure, the light-emitting material layer and second electrode layer in each color light-emitting device of the display panel can be fabricated as a whole before patterning, eliminating the need for a fine metal mask and saving on display panel manufacturing costs.

[0090] Among them, patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, and 202311499823.9 describe the relevant technical solutions of the isolation structure 140 (or partition structure), the contents of which are incorporated herein by reference.

[0091] The inventors discovered that during the manufacturing process of the aforementioned display panel, in the etching operation of the second electrode 160 (e.g., cathode) of the earlier formed sub-pixels (which may include light-emitting devices), the etching action may affect the isolation structure 140 of the later formed sub-pixels (which may be side-etched with increased side-etching depth). This can lead to problems such as poor electrode-isolation of the later formed sub-pixels, and / or inconsistent bonding resistance among the sub-pixels. If the side-etching depth (equivalent to the undercut length) of the isolation structure exceeds a certain value, the subsequent pixels may have difficulty bonding. Abnormal cathode bonding can lead to poor dark spots, affecting the display effect.

[0092] Specifically, please refer to Figure 2 When the first sub-pixel P1 is fabricated before the second sub-pixel P2 and the third sub-pixel P3, the first electrode 120, the pixel defining layer 130 and the isolation structure 140 are usually fabricated on the substrate 110. Then, the first light-emitting material layer 1510, the first conductive material layer 1610 and the first encapsulation material layer 1710 are deposited by vapor deposition. Finally, an etched protective portion 910 is set at the isolation opening corresponding to the first sub-pixel P1.

[0093] Next, please refer to Figure 3 The first light-emitting material layer 1510, the first conductive material layer 1610 and the first encapsulation material layer 1710 not covered by the etch protection part 910 are removed by etching gas, etching solution and stripping solution respectively, to form the light-emitting unit 150, the second electrode 160 and the encapsulation unit 170 corresponding to the first sub-pixel P1.

[0094] During this process, the etching solution used to remove the first conductive material layer 1610 may also cause some damage to the isolation structure 140 that is not covered by the etching protection portion 910. This causes the support portion 141 in the isolation structure 140, which is more susceptible to etching, to shrink further inward compared to the shielding portion 142. Consequently, the first undercut length SA2 corresponding to the second sub-pixel P2 increases compared to the first undercut length SA1 corresponding to the first sub-pixel P1. When the second electrode 160 corresponding to the second sub-pixel P2 is subsequently formed, the second electrode 160 corresponding to the second sub-pixel P2 cannot effectively connect with the isolation structure 140, affecting the lighting yield of the second sub-pixel P2.

[0095] In view of this, this embodiment provides a solution that can improve the consistency of the first undercut length corresponding to each isolation opening. The solution provided in this embodiment will be described in detail below.

[0096] Please refer to Figure 4 , Figure 4 This is a flowchart illustrating a method for manufacturing a display panel according to this embodiment. The method may include the following steps.

[0097] Step S110: Provide substrate 110.

[0098] In this embodiment, multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers (e.g., metal layers), multiple insulating layers, and a planarization layer, can also be formed on one side of the substrate 110. These multiple film layer structures can form multiple thin film transistors (TFTs) at different locations, and the thin film transistors can cooperate with each other to form multiple pixel driving units or driving circuits.

[0099] In step S120, an isolation structure 140 is formed on one side of the substrate 110. The isolation structure 140 includes a plurality of isolation openings spaced apart. The plurality of isolation openings includes a first isolation opening and a second isolation opening.

[0100] Optionally, in this embodiment, the isolation structure 140 may include a support portion 141 and a shielding portion 142 sequentially stacked along a direction away from the substrate 110. The orthographic projection of the support portion 141 on the substrate 110 lies within the orthographic projection of the shielding portion 142 on the substrate 110. The orthographic projection area of ​​the support portion 141 on the substrate 110 is smaller than the orthographic projection area of ​​the shielding portion 142 on the substrate 110. That is, at the isolation opening, the support portion 141 of the isolation structure 140 is recessed relative to the shielding portion 142, forming an undercut structure, which is equivalent to the cross-section of the isolation structure 140 being T-shaped.

[0101] In this embodiment, the first undercut length corresponding to the isolation opening is the distance between the orthographic projection of the end of the support portion 141 near the isolation opening on the substrate 110 and the orthographic projection of the end of the shielding portion 142 near the isolation opening on the substrate 110.

[0102] In step S130, a first light-emitting material layer 1510, a first conductive material layer 1610, and a first encapsulation material layer 1710 are sequentially formed on the side of the substrate 110 where the isolation structure 140 is provided. At least a portion of the first light-emitting material layer 1510, the first conductive material layer 1610, and the first encapsulation material layer 1710 are located within the first isolation opening and the second isolation opening.

[0103] In this embodiment, the first light-emitting material layer 1510 and the first conductive material layer 1610, which cover the entire layer, can be formed by vapor deposition, and the first encapsulation material layer 1710, which covers the entire layer, can be formed by chemical vapor deposition. In this case, at least a portion of the first light-emitting material layer 1510, the first conductive material layer 1610, and the first encapsulation material layer 1710 are located within the first isolation opening and the second isolation opening.

[0104] Step S140: Remove the first encapsulation material layer 1710 from the second isolation opening.

[0105] In this embodiment, the first encapsulation material layer 1710 in the second isolation opening can be removed by dry etching.

[0106] In step S150, the first conductive material layer 1610 is etched using a preset etching solution to remove the first conductive material layer 1610 from the second isolation opening.

[0107] In this embodiment, the isolation structure 140 has a greater corrosion resistance to the preset etching solution than the first conductive material layer 1610 has.

[0108] For example, please refer to Figure 2 and Figure 3 During the fabrication of the first sub-pixel P1, when patterning and etching the first conductive material layer 1610, a preset etching solution provided in this embodiment is used for etching. Since the isolation structure 140 has greater corrosion resistance to the preset etching solution than the first conductive material layer 1610, the preset etching solution will not have a significant impact on the isolation structure 140. That is, as... Figure 3 As shown, the etching process in step S150 of the fabrication process for the first sub-pixel P1 will not affect the first undercut length SA2 corresponding to the isolation opening of the second sub-pixel P2.

[0109] Step S160: Remove the first luminescent material layer 1510 from the second isolation opening.

[0110] Based on the above design, in this embodiment, by using a preset etching solution that has a smaller impact on the isolation structure 140 to pattern the conductive material layer (e.g., the first conductive material layer), the impact of the fabrication process of the earlier formed sub-pixels on the isolation structure 140 corresponding to the later formed sub-pixels can be reduced, thereby ensuring the effectiveness and / or consistency of the subsequent electrode evaporation and bonding of each sub-pixel and ensuring the display yield.

[0111] In some possible implementations, the pre-set etching solution does not etch the isolation structure within the second isolation opening, or the isolation structure 140 does not react with the pre-set etching solution. This avoids the impact of the fabrication process of earlier-formed sub-pixels on the isolation structure 140 corresponding to later-formed sub-pixels, thereby ensuring the effectiveness and / or consistency of subsequent electrode deposition and bonding for each sub-pixel, and guaranteeing display yield.

[0112] In some possible implementations, the pre-defined etching solution includes citric acid (C6H8O7).

[0113] Furthermore, in some possible implementations, the components of the pre-defined etching solution include C6H8O7, HNO3, and CH3COOH.

[0114] Optionally, the mass fraction of C6H8O7 in the preset etching solution is greater than or equal to 15% and less than or equal to 30%, for example, the mass fraction of C6H8O7 can be 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, or 30%. The mass fraction of HNO3 (which can be called nitric acid) is greater than or equal to 5% and less than or equal to 10%, for example, the mass fraction of HNO3 can be 5%, 6%, 7%, 8%, 9%, or 10%. The mass fraction of CH3COOH (which can be called acetic acid) is greater than or equal to 5% and less than or equal to 10%, for example, the mass fraction of CH3COOH can be 5%, 6%, 7%, 8%, 9%, or 10%.

[0115] For example, the mass fraction of C6H8O7 is greater than or equal to 21.5% and less than or equal to 30%, the mass fraction of HNO3 is greater than or equal to 5% and less than or equal to 9%, and the mass fraction of CH3COOH is greater than or equal to 5% and less than or equal to 9%.

[0116] For example, the mass fraction of C6H8O7 is greater than or equal to 20% and less than or equal to 28.8%, the mass fraction of HNO3 is greater than or equal to 5% and less than or equal to 8.8%, and the mass fraction of CH3COOH is greater than or equal to 5% and less than or equal to 8.8%.

[0117] In some possible implementations, step S120 may include the following sub-steps.

[0118] Step S121: An isolation layer is formed on one side of the substrate 110.

[0119] In step S122, the isolation layer is patterned by etching to form an isolation structure 140 with multiple spaced-apart isolation openings. The isolation structure 140 includes a support portion 141 and a shielding portion 142 sequentially stacked along a direction away from the substrate 110. The orthographic projection of the support portion 141 onto the substrate 110 lies within the orthographic projection of the shielding portion 142 onto the substrate 110. The orthographic projection area of ​​the support portion 141 onto the substrate 110 may be smaller than the orthographic projection area of ​​the shielding portion 142 onto the substrate 110. The corrosion resistance of the support portion 141 to the preset etching solution is greater than that of the first conductive material layer 1610 to the preset etching solution. The corrosion resistance of the shielding portion 142 to the preset etching solution is greater than that of the first conductive material layer 1610 to the preset etching solution. The material reactivity of the shielding portion 142 may be less than that of the support portion 141.

[0120] The first undercut lengths of the isolation structures 140 corresponding to the first isolation opening and the second isolation opening are equal or the absolute value of the difference is less than or equal to 0.1 micrometers (e.g., due to differences caused by process fluctuations). The first undercut length is the distance between the orthographic projection of the end of the support portion 141 near the isolation opening on the substrate 110 and the orthographic projection of the end of the shielding portion 142 near the isolation opening on the substrate 110.

[0121] For example, please refer to Figure 5 In this embodiment, in the isolation structure 140 fabricated in step S120, the first undercut length SA1 corresponding to the first isolation opening used to form the first sub-pixel P1, the first undercut length SA2 corresponding to the second isolation opening used to form the second sub-pixel P2, and the first undercut length SA3 corresponding to the third isolation opening used to form the third sub-pixel P3 are all equal, that is, in step S120, SA1 = SA2 = SA3. Alternatively, the absolute value of the difference between any two of the first undercut length SA1 corresponding to the first isolation opening used to form the first sub-pixel P1, the first undercut length SA2 corresponding to the second isolation opening used to form the second sub-pixel P2, and the first undercut length SA3 corresponding to the third isolation opening used to form the third sub-pixel P3 is less than or equal to 0.1 micrometers.

[0122] Based on this, in step S150, the conductive material layer is patterned by using the preset etching solution provided in this embodiment, which can reduce the influence of the etching solution on the support portion 141 of the isolation structure 140, thereby ensuring that the first undercut length corresponding to each isolation opening remains unchanged as much as possible.

[0123] By using a preset etching solution that has minimal impact on the support portion 141 in the isolation structure to pattern the conductive material layer, the impact of the earlier-formed sub-pixel fabrication process on the receiving portion in the isolation structure of the later-formed sub-pixels can be reduced. This improves the overlap effectiveness between the second electrode 160 of the light-emitting devices of different colors and the support portion 141, the consistency of the overlap width, and the consistency and effectiveness of the electrical connection effect, thereby ensuring the display yield.

[0124] For example, please refer to Figure 3After the fabrication of the first sub-pixel P1 is completed, the first undercut length SA1 corresponding to the isolation opening of the first sub-pixel P1, the first undercut length SA2 corresponding to the isolation opening used to form the second sub-pixel P2, and the first undercut length SA3 corresponding to the isolation opening used to form the third sub-pixel P3 are all equal or differ by less than or equal to 0.1 micrometers. Thus, when the second electrode 160 of the second sub-pixel P2 and the second electrode 160 of the third sub-pixel P3 are subsequently formed by vapor deposition, using the same vapor deposition angle or vapor deposition process can ensure the effectiveness and / or consistency of the overlap between the second electrode 160 and the isolation structure 140.

[0125] In some possible implementations, in step S121, a support layer and a shielding layer stacked sequentially can be formed on one side of the substrate 110 as an isolation layer.

[0126] In step S122, the shielding layer and the support layer can be processed by dry etching to form the shielding portion 142 and the original support portion. Then, the original support portion is side-etched by wet etching to form the support portion 141.

[0127] In some possible implementations, the display panel provided in this embodiment may include sub-pixels of multiple luminescent colors, and each sub-pixel may be patterned and etched using a preset etching solution provided in this embodiment to form a conductive material layer. In this case, the isolation opening corresponding to the currently fabricated light-emitting device is the first isolation opening, and the isolation openings other than the first isolation opening include the second isolation opening.

[0128] If the light-emitting device corresponding to the first isolation opening is fabricated before the light-emitting device corresponding to the second isolation opening, step S160 may further include: sequentially forming a second light-emitting material layer, a second conductive material layer, and a second encapsulation material layer at the second isolation opening. The first light-emitting material layer and the second light-emitting material layer emit different colors. This configuration forms the light-emitting unit 150, the second electrode 160, and the encapsulation unit 170 of the light-emitting device for the second sub-pixel P2 corresponding to the second isolation opening.

[0129] In some other possible implementations, the patterning etching process for only a portion of the conductive material layer of the sub-pixels may employ the preset etching solution provided in this embodiment. In this case, the isolation opening may also include a third isolation opening.

[0130] Through steps S130 to S160, a light-emitting device corresponding to the first sub-pixel P1 of the first isolation opening can be formed. This light-emitting device includes a light-emitting unit 150, a second electrode 160, and a packaging unit 170, all located at least partially within the first isolation opening. Figure 6 As shown.

[0131] In step S140, the first encapsulation material layer 1710 in the third isolation opening can be removed simultaneously with the removal of the first encapsulation material layer 1710 in the second isolation opening.

[0132] In step S150, the first conductive material layer 1610 in the third isolation opening can be removed simultaneously with the removal of the first conductive material layer 1610 in the second isolation opening. For example, the etching solution is preset not to etch the isolation structure in the second isolation opening.

[0133] In step S160, the first light-emitting material layer 1510 in the third isolation opening can be removed simultaneously with the removal of the first light-emitting material layer 1510 in the second isolation opening.

[0134] After step S160, the method provided in this embodiment may further include the following steps.

[0135] In step S210, a second light-emitting material layer, a second conductive material layer, and a second encapsulation material layer are sequentially formed on the side of the substrate 110 where the isolation structure 140 is provided. At least a portion of the second light-emitting material layer, the second conductive material layer, and the second encapsulation material layer are located within the first isolation opening, the second isolation opening, and the third isolation opening.

[0136] Step S220: Remove the second encapsulation material layer from the first isolation opening and the third isolation opening.

[0137] In step S230, a preset etching solution is used to etch the second conductive material layer, removing the second conductive material layer within the first and third isolation openings. The isolation structure has a higher corrosion resistance to the preset etching solution than the second conductive material layer. The support portion has a higher corrosion resistance to the preset etching solution than the second conductive material layer. The shielding portion has a higher corrosion resistance to the preset etching solution than the second conductive material layer.

[0138] Step S240: Remove the second light-emitting material layer from the first isolation opening and the third isolation opening.

[0139] Through steps S210 to S240, a light-emitting device corresponding to the second sub-pixel P2 of the second isolation opening can be formed. This light-emitting device includes a light-emitting unit 150, a second electrode 160, and a packaging unit 170, all at least partially located within the second isolation opening. Figure 7 As shown.

[0140] The first sub-pixel P1 corresponding to the first isolation opening and the second sub-pixel P2 corresponding to the second isolation opening are formed earlier. Therefore, in the fabrication process of the first sub-pixel P1 and the second sub-pixel P2, a preset etching solution is used to formulate patterned etching, which can avoid the influence of the etching process on the isolation structure 140 of the third sub-pixel P3.

[0141] In step S310, a third light-emitting material layer, a third conductive material layer, and a third encapsulation material layer are sequentially formed on the side of the substrate 110 where the isolation structure 140 is located. At least a portion of the third light-emitting material layer, the third conductive material layer, and the third encapsulation material layer are located within the first isolation opening, the second isolation opening, and the third isolation opening, respectively. The first light-emitting material layer, the second light-emitting material layer, and the third light-emitting material layer emit different colors.

[0142] Step S320: Remove the third encapsulation material layer from the first isolation opening and the second isolation opening.

[0143] In step S330, the third conductive material layer is etched using a preset etching solution or an etching solution different from the preset etching solution to remove the third conductive material layer within the first and second isolation openings. The corrosion resistance of the isolation structure to the preset etching solution is greater than that of the third conductive material layer. The corrosion resistance of the support portion to the preset etching solution is greater than that of the third conductive material layer. The corrosion resistance of the shielding portion to the preset etching solution is greater than that of the third conductive material layer.

[0144] Step S340: Remove the third luminescent material layer from the first isolation opening and the second isolation opening.

[0145] After step S240, since the sidewall of the isolation structure 140 corresponding to the first sub-pixel P1 is covered and protected by the encapsulation unit 170 corresponding to the first sub-pixel P1, and the sidewall of the isolation structure 140 corresponding to the second sub-pixel P2 is covered and protected by the encapsulation unit 170 corresponding to the second sub-pixel P2, they will no longer be affected by the etching solution. Furthermore, after the third sub-pixel P3, no other pixels need to be fabricated. Therefore, when fabricating the third sub-pixel P3, the isolation opening corresponding to the third sub-pixel P3 is the third isolation opening. The preset etching solution provided in this embodiment can be used, or the patterning etching of the conductive material layer corresponding to the third sub-pixel P3 can be performed without using the preset etching solution provided in this embodiment.

[0146] Through steps S310 to S340, a light-emitting device for the third sub-pixel P3 corresponding to the third isolation opening can be formed. This light-emitting device includes a light-emitting unit 150, a second electrode 160, and a packaging unit 170, all at least partially located within the third isolation opening. Figure 8 As shown.

[0147] Please refer to Figure 10 and Figure 11 The isolation structure 140 also includes a receiving portion 143 located on the side of the support portion 141 near the substrate 110. The orthographic projection of the support portion 141 on the substrate 110 lies within the orthographic projection of the receiving portion 143 on the substrate 110. The area of ​​the orthographic projection of the support portion 141 on the substrate 110 is smaller than the area of ​​the orthographic projection of the receiving portion 143 on the substrate 110. The corrosion resistance of the receiving portion to the preset etching solution is greater than that of the first conductive material layer to the preset etching solution. The corrosion resistance of the receiving portion to the preset etching solution may be greater than that of the third conductive material layer to the preset etching solution. The corrosion resistance of the receiving portion to the preset etching solution may be greater than that of the second conductive material layer to the preset etching solution.

[0148] The second undercut lengths of the isolation structures corresponding to the first isolation opening and the second isolation opening are equal or the absolute value of the difference is less than or equal to 0.1 micrometers (e.g., due to differences caused by process fluctuations). The second undercut length is the distance between the orthographic projection of the end of the receiving part near the isolation opening on the substrate and the orthographic projection of the end of the shielding part near the isolation opening on the substrate.

[0149] Optionally, the first conductive material layer (i.e., the second electrode) of the light-emitting device corresponding to the first sub-pixel P1 is in electrical contact with the receiving portion. The second conductive material layer (i.e., the second electrode) of the light-emitting device corresponding to the second sub-pixel P2 is in electrical contact with the receiving portion. The third conductive material layer (i.e., the second electrode) of the light-emitting device corresponding to the third sub-pixel P3 is in electrical contact with the receiving portion.

[0150] By using a pre-defined etching solution that has minimal impact on the receiving portion in the isolation structure to pattern the conductive material layer, the impact of the earlier-formed sub-pixel fabrication process on the receiving portion in the isolation structure of the later-formed sub-pixels can be reduced. This improves the overlap effectiveness between the second electrode 160 of different color light-emitting devices and the receiving portion 143, the consistency of the overlap width, and the consistency and effectiveness of the electrical connection, thus ensuring the display yield.

[0151] Based on the same concept, this embodiment also provides a display panel, which can be manufactured by the manufacturing method of the display panel provided in this embodiment. Please refer to [link / reference]. Figure 8 The display panel includes a substrate 110 and an isolation structure 140. The display panel also includes various light-emitting devices with different emitting colors. At least a portion of the light-emitting devices is located within the isolation opening.

[0152] The isolation structure 140 is located on one side of the substrate 110. The isolation structure 140 includes a plurality of isolation openings spaced apart. The isolation structure 140 includes a support portion 141 and a shielding portion 142 stacked sequentially in a direction away from the substrate 110. The orthographic projection of the support portion 141 on the substrate 110 is located within the orthographic projection of the shielding portion 142 on the substrate 110.

[0153] The first undercut lengths of the isolation structures 140 corresponding to the isolation openings of at least two light-emitting devices with different emission colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers. The first undercut length is the distance between the orthographic projection of the end of the support portion 141 near the isolation opening on the substrate 110 and the orthographic projection of the end of the shielding portion 142 near the isolation opening on the substrate 110.

[0154] For example, the first undercut length SA1 corresponding to the first sub-pixel P1, the first undercut length SA2 corresponding to the second sub-pixel P2, and the first undercut length SA3 corresponding to the third sub-pixel P3 are equal or differ by less than or equal to 0.1 micrometers.

[0155] By using a preset etching solution that has minimal impact on the support portion 141 in the isolation structure to pattern the conductive material layer, the impact of the earlier-formed sub-pixel fabrication process on the support portion 141 in the isolation structure of the later-formed sub-pixels can be reduced. This ensures the effectiveness and / or consistency of the overlap of the subsequent electrode deposition angles of each sub-pixel, thereby guaranteeing the display yield.

[0156] In some possible implementations, the isolation structure 140 includes at least two isolation openings with different opening sizes, the opening size being the size of the orthographic projection of the isolation opening onto the substrate 110. The first undercut lengths of the isolation structures 140 corresponding to the isolation openings with different sizes are equal or the absolute value of the difference is less than or equal to 0.1 micrometers.

[0157] Optionally, the display panel includes at least two light-emitting devices with different emitting colors, and the opening sizes of the isolation openings corresponding to the at least two light-emitting devices with different emitting colors are different.

[0158] Optionally, the display panel includes at least three light-emitting devices with different emitting colors. The first undercut lengths of the isolation structures 140 corresponding to the isolation openings of the light-emitting devices with different emitting colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers.

[0159] For example, please refer to Figure 9The display panel provided in this embodiment may include a first sub-pixel P1, a second sub-pixel P2, and a third sub-pixel P3, and the light-emitting devices corresponding to the first sub-pixel P1, the second sub-pixel P2, and the third sub-pixel P3 emit different colors. In this case, at least two of the following dimensions are different: the size W1 of the isolation opening corresponding to the first sub-pixel P1, the size W2 of the isolation opening corresponding to the second sub-pixel P2, and the size W3 of the isolation opening corresponding to the third sub-pixel P3.

[0160] In some possible implementations, the display panel includes at least two light-emitting devices with different emitting colors, at least a portion of which is located within an isolation opening, and the first undercut lengths of the isolation structures corresponding to the isolation openings of the light-emitting devices with different emitting colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers.

[0161] Please refer again to some possible implementation methods. Figure 8 The display panel may also include a pixel delimiting layer 130.

[0162] The pixel defining layer 130 includes a pixel opening, and the orthographic projection of the pixel opening onto the substrate 110 lies within the orthographic projection of the isolation opening onto the substrate 110. The pixel opening and the isolation opening are connected to each other.

[0163] Optionally, the pixel defining layer 130 is located between the isolation structure 140 and the substrate 110. Alternatively, the pixel defining layer 130 is provided with a clearance opening, and the isolation structure 140 is located within the clearance opening.

[0164] Optionally, in this embodiment, the material of the pixel defining layer 130 may include an inorganic insulating material.

[0165] In some possible implementations, the display panel may also include light-emitting devices.

[0166] At least a portion of the light-emitting device is located within an isolation opening. The light-emitting device includes a first electrode 120, a light-emitting unit 150, and a second electrode 160 sequentially stacked in a direction away from the substrate. One of the first electrode 120 and the second electrode 160 may be an anode, and the other may be a cathode. For example, the first electrode 120 may be a cathode.

[0167] For example, the first electrode 120 may be located on one side of the substrate 110, and the pixel defining layer 130 may be located on the side of the first electrode 120 away from the substrate 110. The pixel opening and the isolation opening may together expose at least a portion of the first electrode 120. At least a portion of the light-emitting unit 150 and the second electrode 160 are located within the pixel opening and / or the isolation opening. The isolation structure 140 is conductive, and the second electrode 1600 is electrically connected to the isolation structure 140. For example, the second electrode 160 extends from within the isolation opening to contact the sidewall of the isolation structure 140 facing the isolation opening.

[0168] In some possible implementations, the material of the support portion 141 is more reactive than the material of the shielding portion 142. The support portion 141 may be made of a metallic material. The shielding portion 142 may also be made of a metallic material. For example, the material of the support portion 141 may be aluminum, and the material of the shielding portion 142 may be titanium.

[0169] For some possible implementations, please refer to Figure 10 The isolation structure 140 also includes a receiving portion 143 located on the side of the support portion 141 near the substrate 110, wherein the orthographic projection of the support portion 141 on the substrate 110 lies within the orthographic projection of the receiving portion 143 on the substrate 110. The area of ​​the orthographic projection of the support portion 141 on the substrate 110 is smaller than the area of ​​the orthographic projection of the receiving portion 143 on the substrate 110. The cross-section of the isolation structure 140 may be I-shaped.

[0170] The receiving part 143 may include a metallic material. Optionally, the material of the receiving part 143 may include molybdenum.

[0171] Optionally, the second undercut lengths of the isolation structures corresponding to the isolation openings of at least two light-emitting devices with different emission colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers. The second undercut length is the distance between the orthographic projection of the end of the receiving part near the isolation opening on the substrate and the orthographic projection of the end of the shielding part near the isolation opening on the substrate.

[0172] By using a pre-defined etching solution that has minimal impact on the bonding portion in the isolation structure to pattern the conductive material layer, the impact of the fabrication process of earlier-formed sub-pixels on the bonding portion in the isolation structure of later-formed sub-pixels can be reduced. This ensures the effectiveness and / or consistency of subsequent electrode evaporation and bonding of each sub-pixel, thereby guaranteeing display yield.

[0173] Optionally, the display panel includes at least three light-emitting devices with different emitting colors, and the second undercut lengths of the isolation structures corresponding to the isolation openings of the light-emitting devices with different emitting colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers.

[0174] Optionally, there are multiple light-emitting devices with different emission colors, including light-emitting devices for emitting red light, light-emitting devices for emitting green light, and light-emitting devices for emitting blue light.

[0175] For example, please refer to Figure 11 After the fabrication of the first sub-pixel P1 is completed, the second undercut length SA4 corresponding to the isolation opening of the first sub-pixel P1, the second undercut length SA5 corresponding to the isolation opening used to form the second sub-pixel P2, and the second undercut length SA6 corresponding to the isolation opening used to form the third sub-pixel P3 are still equal or have a difference of less than or equal to 0.1 micrometers.

[0176] Alternatively, see [link to relevant documentation] for some possible implementations. Figure 12 The second electrode 160 may extend to contact the side of the support 141 facing the isolation opening. See also some other possible implementations. Figure 13 The second electrode 160 may extend only to contact the receiving portion 143. The second electrode 160 may or may not make electrical contact with the support portion.

[0177] By using a pre-defined etching solution that has minimal impact on the receiving portion in the isolation structure to pattern the conductive material layer, the impact of the earlier-formed sub-pixel fabrication process on the receiving portion in the isolation structure of the later-formed sub-pixels can be reduced. This improves the effectiveness of the overlap between the second electrode 160 of different color light-emitting devices and the receiving portion 143, the consistency of the overlap width, and the consistency and effectiveness of the conductivity, thereby ensuring the display yield.

[0178] In some possible implementations, the display panel also includes a packaging unit 170 located on the side of the light-emitting device away from the substrate 110, the packaging unit 170 extending from the isolation opening to the side of the isolation structure 140 away from the substrate 110.

[0179] Optionally, there is a gap between the packaging units 170 corresponding to adjacent isolation openings, and the gap is located on the side of the isolation structure 140 away from the substrate 110.

[0180] See also: [Information on possible implementations] Figure 14 The display panel also includes a second encapsulation layer 180 and a third encapsulation layer 190 located on the side of the first encapsulation layer composed of encapsulation units 170 away from the substrate 110, and sequentially stacked in a direction away from the substrate 111.

[0181] Optionally, the materials of the first and third encapsulation layers 190 include inorganic materials, and the material of the second encapsulation layer 180 includes organic materials. For example, the first and third encapsulation layers 190 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 180 can be formed by inkjet printing (IJP).

[0182] This embodiment also provides an electronic device, which includes a display panel manufactured using the method described in this embodiment, or includes the display panel described in this embodiment. The electronic device may include devices with display functions such as mobile phones, tablets, smart wearable devices, televisions, laptops, and monitors.

[0183] In summary, the manufacturing method, display panel, and electronic device provided in this application can reduce the impact of the earlier-formed sub-pixel fabrication process on the isolation structure of the later-formed sub-pixels by using a preset etching solution that has minimal impact on the isolation structure. This ensures the effectiveness and / or consistency of the subsequent electrode deposition and bonding of each sub-pixel, thereby guaranteeing the display yield.

[0184] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0185] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, The method includes: Provide substrate; An isolation structure is formed on one side of a substrate, the isolation structure including a plurality of spaced-apart isolation openings; the plurality of isolation openings include a first isolation opening and a second isolation opening; A first light-emitting material layer, a first conductive material layer, and a first encapsulation material layer are sequentially formed on the side of the substrate where the isolation structure is provided. At least a portion of the first light-emitting material layer, the first conductive material layer, and the first encapsulation material layer are located within the first isolation opening and the second isolation opening. The first light-emitting material layer is used to emit red light, green light, or blue light. Remove the first encapsulation material layer from the second isolation opening; The first conductive material layer is etched using a preset etching solution to remove the first conductive material layer in the second isolation opening; the isolation structure is conductive, and the first conductive material layer is electrically connected to the isolation structure; Remove the first luminescent material layer from the second isolation opening; The isolation structure has a greater resistance to the preset etching solution than the first conductive material layer has to the preset etching solution.

2. The method according to claim 1, characterized in that, The components of the preset etching solution include , and .

3. The method according to claim 2, characterized in that, The preset etching solution The mass fraction is greater than or equal to 15% and less than or equal to 30%. The mass fraction is greater than or equal to 5% and less than or equal to 10%. The mass fraction is greater than or equal to 5% and less than or equal to 10%.

4. The method according to claim 1, characterized in that, The step of forming an isolation structure on one side of the substrate includes: An isolation layer is formed on one side of the substrate; The isolation layer is patterned and etched to form the isolation structure, wherein the isolation structure includes a support portion and a shielding portion sequentially stacked along a direction away from the substrate, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate; the first undercut lengths of the isolation structures corresponding to the first isolation opening and the second isolation opening are equal or the absolute value of the difference is less than or equal to 0.1 micrometers, the first undercut length being the distance between the orthographic projection of the end of the support portion near the isolation opening on the substrate and the orthographic projection of the end of the shielding portion near the isolation opening on the substrate; The support portion has greater corrosion resistance to the preset etching solution than the first conductive material layer.

5. The method according to claim 4, characterized in that, The isolation structure also includes a receiving portion located on the side of the support portion closer to the substrate, wherein the orthographic projection of the support portion on the substrate is located within the orthographic projection of the receiving portion on the substrate; The area of ​​the support portion projected onto the substrate is smaller than the area of ​​the receiving portion projected onto the substrate. The receiving part has greater corrosion resistance to the preset etching solution than the first conductive material layer. The second undercut lengths of the isolation structures corresponding to the first isolation opening and the second isolation opening are equal or the absolute value of the difference is less than or equal to 0.1 micrometers. The second undercut length is the distance between the orthographic projection of the end of the receiving part near the isolation opening on the substrate and the orthographic projection of the end of the shielding part near the isolation opening on the substrate.

6. The method according to claim 5, characterized in that, The first conductive material layer is in electrical contact with the receiving part.

7. The method according to claim 1, characterized in that, After removing the first luminescent material layer from the second isolation opening, the process further includes: A second light-emitting material layer, a second conductive material layer, and a second encapsulation material layer are formed within the second isolation opening; the first light-emitting material layer and the second light-emitting material layer emit different colors. Alternatively, the isolation opening may further include a third isolation opening; At the same time, remove the first encapsulation material layer in the second isolation opening and remove the first encapsulation material layer in the third isolation opening; At the same time, remove the first conductive material layer in the second isolation opening and remove the first conductive material layer in the third isolation opening. While removing the first luminescent material layer in the second isolation opening, remove the first luminescent material layer in the third isolation opening; After removing the first luminescent material layer from the second isolation opening, the method further includes: A second light-emitting material layer, a second conductive material layer, and a second encapsulation material layer are sequentially formed on one side of the substrate where the isolation structure is provided. At least a portion of the second light-emitting material layer, the second conductive material layer, and the second encapsulation material layer are located within the first isolation opening, the second isolation opening, and the third isolation opening. Remove the second encapsulation material layer from the first isolation opening and the third isolation opening; The second conductive material layer is etched using the preset etching solution to remove the second conductive material layer within the first isolation opening and the third isolation opening; the isolation structure has greater corrosion resistance to the preset etching solution than the second conductive material layer has. Remove the second luminescent material layer from the first isolation opening and the third isolation opening; A third light-emitting material layer, a third conductive material layer, and a third encapsulation material layer are sequentially formed on the side of the substrate where the isolation structure is provided. At least a portion of the third light-emitting material layer, the third conductive material layer, and the third encapsulation material layer are located within the first isolation opening, the second isolation opening, and the third isolation opening. The first light-emitting material layer, the second light-emitting material layer, and the third light-emitting material layer emit different colors. Remove the third encapsulation material layer from the first isolation opening and the second isolation opening; The third conductive material layer is etched using the preset etching solution or an etching solution different from the preset etching solution to remove the third conductive material layer within the first isolation opening and the second isolation opening; the isolation structure has greater corrosion resistance to the preset etching solution than the third conductive material layer has. Remove the third luminescent material layer from the first isolation opening and the second isolation opening.

8. The method according to claim 1, characterized in that, The isolation structure does not react with the preset etching solution.

9. A display panel, characterized in that, The display panel is manufactured by the manufacturing method of the display panel according to any one of claims 1-8, and the display panel comprises: Substrate; An isolation structure located on one side of a substrate, the isolation structure including a plurality of isolation openings spaced apart; the isolation structure including a support portion and a shielding portion stacked sequentially in a direction away from the substrate, wherein the orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate; Multiple light-emitting devices with different emission colors, at least a portion of which are located within the isolation opening, wherein the first undercut lengths of the isolation structures corresponding to the isolation openings of at least two light-emitting devices with different emission colors are equal or the absolute value of their difference is less than or equal to 0.1 micrometers, and the first undercut length is the distance between the orthographic projection of the end of the support portion near the isolation opening on the substrate and the orthographic projection of the end of the shielding portion near the isolation opening on the substrate.

10. The display panel according to claim 9, characterized in that, The display panel includes at least three light-emitting devices with different emitting colors, and the first undercut lengths of the isolation structures corresponding to the isolation openings of the light-emitting devices with different emitting colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers.

11. The display panel according to claim 10, characterized in that, The various light-emitting devices with different emission colors include light-emitting devices for emitting red light, light-emitting devices for emitting green light, and light-emitting devices for emitting blue light.

12. The display panel according to claim 9, characterized in that, The display panel also includes: A pixel defining layer, the pixel defining layer including a pixel opening, the pixel opening corresponding to and communicating with the isolation opening, the orthographic projection of the pixel opening on the substrate being located within the orthographic projection of the isolation opening on the substrate.

13. The display panel according to claim 12, characterized in that, The pixel defining layer is located between the isolation structure and the substrate, or the pixel defining layer is provided with a clearance opening, and the isolation structure is located at the clearance opening.

14. The display panel according to claim 9, characterized in that, The light-emitting device includes a first electrode, a light-emitting unit, and a second electrode stacked sequentially in a direction away from the substrate.

15. The display panel according to claim 14, characterized in that, The isolation structure is conductive, and the second electrode is electrically connected to the isolation structure.

16. The display panel according to claim 15, characterized in that, The second electrode extends from the isolation opening to contact the sidewall of the isolation structure facing the isolation opening.

17. The display panel according to claim 16, characterized in that, The second electrode is in electrical contact with the support portion.

18. The display panel according to claim 15, characterized in that, The material of the support portion is more reactive than the material of the shielding portion.

19. The display panel according to claim 18, characterized in that, The material of the support portion includes aluminum, and the material of the shielding portion includes titanium.

20. The display panel according to claim 14, characterized in that, The isolation structure also includes a receiving portion located on the side of the support portion closer to the substrate, wherein the orthographic projection of the support portion on the substrate is located within the orthographic projection of the receiving portion on the substrate; The area of ​​the support portion projected onto the substrate is smaller than the area of ​​the receiving portion projected onto the substrate.

21. The display panel according to claim 20, characterized in that... The second electrode is in electrical contact with the receiving part.

22. The display panel according to claim 20, characterized in that, The second undercut lengths of the isolation structures corresponding to the isolation openings of at least two light-emitting devices with different emission colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers. The second undercut length is the distance between the orthographic projection of the end of the receiving part near the isolation opening on the substrate and the orthographic projection of the end of the shielding part near the isolation opening on the substrate.

23. The display panel according to claim 22, characterized in that, The display panel includes at least three light-emitting devices with different emitting colors, and the second undercut lengths of the isolation structures corresponding to the isolation openings of the light-emitting devices with different emitting colors are equal or the absolute value of the difference is less than or equal to 0.1 micrometers.

24. The display panel according to claim 23, characterized in that, The material of the receiving part includes molybdenum.

25. The display panel according to claim 9, characterized in that, The display panel also includes a packaging unit located on the side of the light-emitting device away from the substrate, the packaging unit extending from the isolation opening to the side of the isolation structure away from the substrate.

26. The display panel according to claim 25, characterized in that, There is a gap between the packaging units corresponding to adjacent isolation openings, and the gap is located on the side of the isolation structure away from the substrate.

27. The display panel according to claim 25, characterized in that, The display panel further includes a second encapsulation layer and a third encapsulation layer, which are located on the side of the encapsulation unit away from the substrate and are stacked sequentially in a direction away from the substrate.

28. The display panel according to claim 27, characterized in that, The materials of the packaging unit and the third packaging layer include inorganic materials, while the material of the second packaging layer includes organic materials.

29. The display panel according to claim 9, characterized in that, The isolation structure includes at least two isolation openings with different opening sizes, the opening size being the size of the orthographic projection of the isolation opening onto the substrate.

30. The display panel according to claim 29, characterized in that, The opening sizes of the isolation openings are different for at least two light-emitting devices with different emitting colors.

31. An electronic device, characterized in that, The electronic device includes a display panel manufactured by the method of manufacturing a display panel according to any one of claims 1-8, or includes a display panel according to any one of claims 9-30.

Images