Double-layer test equipment

Abstract

The invention relates to the technical field of automation equipment, and discloses double-layer test equipment, which comprises a top plate, an upper needle plate module, a lower needle plate module, a rack module and a first driving module, the FPC board in the high-frequency signal transmission and interface module is designed to be electrically connected with the BG board in the upper needle board module through the switching probe, so that the FPC board and the BG board do not need to be repeatedly welded and desoldered, the operation convenience of the test equipment is greatly improved, the use efficiency of the equipment is improved, the reliability of the equipment is enhanced, and the test cost is reduced. Tediousness and complexity of traditional welding and dewelding processes are effectively avoided, actual test requirements can be better met, and normal use of equipment and accuracy of test results are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and in particular to a double-layer testing equipment. Background Art

[0002] At present, in the existing test equipment, when it is necessary to test the device under test, the device under test is placed on the lower needle plate module, and then the driving module drives the upper needle plate module to move downward, so as to realize the pressing test operation of the device under test. However, in the process of actual application, the problem is that since the FPC board in the high-frequency signal transmission and interface module and the BG board in the upper needle plate module are connected by welding, when using the test equipment to perform pressing tests on different types of devices under test, if different high-frequency signal transmission and interface modules need to be replaced, the welding connection between the FPC board and the BG board must be removed first. After the removal is completed, the FPC board in the replaced high-frequency signal transmission and interface module is re-welded and connected to the BG board in the upper needle plate module. This operation process is not only cumbersome and complicated, time-consuming and labor-intensive, but also in the process of welding and desoldering, it is easy to cause physical damage or destruction to the FPC board and the BG board, thereby affecting the normal use of the test equipment and the accuracy of the test results.

[0003] Therefore, in view of the above-mentioned deficiencies and defects in the prior art, there is an urgent need to make necessary improvements and optimizations to the prior art to improve the operational convenience, use efficiency and reliability of the test equipment, so as to better meet the actual test needs.

[0004] The above information is presented as background information only to assist with understanding the present disclosure and no determination or admission is made as to whether any of the above may be used as prior art with respect to the present disclosure. Summary of the invention

[0005] The invention provides a double-layer testing device to solve the problems existing in the prior art.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A double-layer testing device includes a top plate, an upper needle plate module, a lower needle plate module, a frame module and a first drive module; wherein,

[0008] The top plate, the upper needle plate module, the lower needle plate module, and the frame module are arranged in sequence from top to bottom;

[0009] The lower needle plate module is arranged on the upper surface of the frame module;

[0010] The upper needle plate module is arranged on the lower surface of the top plate;

[0011] The first driving module is arranged on the frame module, and the driving end of the first driving module is connected to the top plate, and is used to drive the top plate and the upper needle plate module to move in the vertical direction so as to approach the lower needle plate module and be electrically connected to the lower needle plate module;

[0012] The upper surface of the upper needle plate module is provided with a slot, and a high-frequency signal transmission and interface module is arranged in the slot;

[0013] The upper needle board module includes a PCB board, a CG board, a BG board and an Interposer board;

[0014] The high-frequency signal transmission and interface module includes an FPC board;

[0015] The FPC board, BG board, Interposer board, CG board and PCB board are arranged in sequence from top to bottom;

[0016] The PCB board is electrically connected to the CG board via a test probe;

[0017] The CG board is in direct contact with the Interposer board to establish an electrical connection;

[0018] The Interposer board and the BG board are electrically connected via a transfer probe;

[0019] The FPC board and the BG board are electrically connected via another transfer probe.

[0020] Further, in the double-layer test equipment, the high-frequency signal transmission and interface module also includes a radio frequency probe;

[0021] The radio frequency probe is electrically connected to the BG board through the FPC board.

[0022] Further, in the double-layer test equipment, the rack module includes a bottom plate, a first support plate and a second support plate;

[0023] The lower needle plate module and the first driving module are respectively arranged on the bottom plate;

[0024] The first support plate is slidably mounted on the bottom plate in the horizontal direction and is detachably provided with a carrier plate module;

[0025] The second support plate is slidably mounted on the first support plate in a horizontal direction and is detachably provided with another carrier plate module.

[0026] Furthermore, the double-layer testing device further includes a second driving module and a third driving module;

[0027] The second driving module and the third driving module are respectively arranged on the bottom plate;

[0028] The driving end of the second driving module is connected to the first supporting plate, and is used to drive the first supporting plate and the second supporting plate to move in the horizontal direction, so that the first supporting plate and the second supporting plate move to the bottom of the upper needle plate module, or move to the front of the upper needle plate module;

[0029] The driving end of the third driving module is connected to the second pallet, and is used to drive the second pallet to move in the horizontal direction, so that the second pallet moves to the bottom of the first pallet, or moves to the front of the first pallet.

[0030] Further, in the double-layer testing device, the lower needle plate module is located between the first support plate and the second support plate;

[0031] The lower needle plate module is provided with a double-ended probe, and the double-ended probe is electrically connected to the device to be tested on the first support plate and the device to be tested on the second support plate respectively.

[0032] Furthermore, in the double-layer test equipment, positioning components for fixing the device under test are respectively provided on the carrier modules.

[0033] Further, in the double-layer testing device, the positioning assembly includes a coarse positioning column and a fine positioning column;

[0034] The coarse positioning column is used for rough guiding and positioning;

[0035] The precise positioning column is used to further perform precise guiding and positioning based on the rough guiding and positioning.

[0036] Furthermore, in the double-layer testing device, the testing probe, the transfer probe and the double-headed probe are all elastic probes.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] A double-layer testing device provided by the present invention is designed to electrically connect an FPC board and a BG board through a transfer probe, thereby eliminating the need to repeatedly solder and desolder the FPC board and the BG board, thereby improving the operating convenience, use efficiency and reliability of the testing device, being able to better meet actual testing needs, and ensuring the normal use of the testing device and the accuracy of the test results.

[0039] The present invention has other features and advantages, which will be apparent from or will be described in detail in the accompanying drawings and the following detailed description incorporated herein, which together serve to explain the specific principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 This is one of the structural schematic diagrams (stereoscopic front and side view) of a double-layer testing device provided by an embodiment of the present invention;

[0042] Figure 2 1 is a schematic structural diagram (stereoscopic rear side view) of a double-layer testing device provided by an embodiment of the present invention;

[0043] Figure 3 This is the second structural schematic diagram (stereoscopic front and side view) of a double-layer testing device provided by an embodiment of the present invention;

[0044] Figure 4 is a schematic structural diagram (side view) of a double-layer testing device provided by an embodiment of the present invention;

[0045] Figure 5 It is a (three-dimensional) structural schematic diagram of an upper needle plate module, an FPC board and a radio frequency probe provided in an embodiment of the present invention;

[0046] Figure 6 yes Figure 5 The enlarged schematic diagram at A in the middle;

[0047] Figure 7 It is a (three-dimensional) structural schematic diagram of a carrier module provided in an embodiment of the present invention.

[0048] Reference numerals:

[0049] Top plate 1, upper needle plate module 2, lower needle plate module 3, rack module 4, first drive module 5, high-frequency signal transmission and interface module 6, test probe 7, transfer probe 8, carrier module 9, second drive module 10, third drive module 11, positioning assembly 12;

[0050] PCB board 201, CG board 202, BG board 203, Interposer board 204;

[0051] Bottom plate 401, first support plate 402, second support plate 403;

[0052] FPC board 601, RF probe 602;

[0053] Rough positioning column 1201, fine positioning column 1202. DETAILED DESCRIPTION

[0054] In order to explain in detail the possible application scenarios, technical principles, specific schemes that can be implemented, and the purposes and effects that can be achieved, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0055] Reference to "embodiment" herein means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The term "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the various technical features mentioned in the embodiments can be combined in any way to form a corresponding implementable technical solution.

[0056] Unless otherwise defined, the technical terms used in this document have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms in this document is only for describing specific embodiments and is not intended to limit this application.

[0057] In the description of this application, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships may exist, for example, A and / or B, which means: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally indicates that the objects before and after are in an "or" logical relationship.

[0058] In the present application, terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.

[0059] Without further limitations, in this application, the words "include", "comprises", "has" or other similar expressions used in the sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.

[0060] In this application, expressions such as "greater than", "less than", "exceed" and the like are understood to exclude the number itself; expressions such as "above", "below", "within" and the like are understood to include the number itself. In addition, in the description of the embodiments of this application, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically limited.

[0061] In the description of the embodiments of the present application, space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present application or facilitating the reader's understanding, and do not indicate or imply that the referred device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0062] Unless otherwise expressly specified or limited, in the description of the embodiments of the present application, the terms such as "install", "connect", "connect", "fix", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For technicians in the technical field to which the present application belongs, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0063] In view of the above-mentioned defects in the prior art, the applicant, based on many years of rich practical experience and professional knowledge in design and manufacturing in this field, and in conjunction with the application of theory, actively conducts research and innovation in the hope of creating a technology that can solve the defects in the prior art. After continuous research and design, and after repeated trial production and improvement, the present invention with real practical value was finally created.

[0064] Please refer to Figure 1-6 The embodiment of the present invention provides a double-layer testing device, including a top plate 1, an upper needle plate module 2, a lower needle plate module 3, a frame module 4 and a first driving module 5; the following is a detailed description of each component and its relationship:

[0065] First of all, from the overall layout of the equipment, the top plate 1, the upper needle plate module 2, the lower needle plate module 3 and the rack module 4 are arranged in order from top to bottom. This hierarchical structural design not only ensures the orderly arrangement of the various components of the equipment, but also provides a solid foundation for the stable operation of the equipment.

[0066] Specifically, the lower needle plate module 3 is precisely mounted on the upper surface of the frame module 4, and the upper needle plate module 2 is arranged on the lower surface of the top plate 1. This arrangement enables the upper needle plate module 2 and the lower needle plate module 3 to press the device under test when they move relative to each other in the vertical direction, which provides convenience for subsequent test operations.

[0067] Furthermore, the first driving module 5 is cleverly mounted on the frame module 4, and its driving end is closely connected to the top plate 1. The main function of the first driving module 5 is that it can drive the top plate 1 and the upper needle plate module 2 connected thereto to move in the vertical direction. When testing is required, the first driving module 5 will drive the top plate 1 and the upper needle plate module 2 to move downward, so that they are close to the lower needle plate module 3, and are electrically connected to the lower needle plate module 3.

[0068] A slot structure is specially designed on the upper surface of the upper needle plate module 2 for installing the high-frequency signal transmission and interface module 6. The setting of this module greatly improves the performance of the device in terms of high-frequency signal transmission.

[0069] The upper needle board module 2 is mainly composed of PCB board 201, CG board 202, BG board 203 and Interposer board 204. These boards play a vital role in the device. Interposer board is an intermediate layer that can help nodes in the upper or lower layers exchange information.

[0070] The high frequency signal transmission and interface module 6 is mainly composed of an FPC board 601. The FPC board 601, the BG board 203, the Interposer board 204, the CG board 202 and the PCB board 201 are also arranged in order from top to bottom.

[0071] In terms of electrical connection, the PCB board 201 and the CG board 202 are electrically connected through the test probe 7; the CG board 202 and the Interposer board 204 are electrically connected by direct contact; and the Interposer board 204 and the BG board 203, as well as the FPC board 601 and the BG board 203, are electrically connected through the transfer probe 8 respectively.

[0072] It is particularly worth mentioning that this embodiment greatly improves the convenience of operation of the test equipment by innovatively designing the electrical connection between the FPC board 601 and the BG board 203 through the transfer probe 8. This connection method avoids the tediousness and complexity of the traditional welding and desoldering process, which not only improves the efficiency of the equipment, but also enhances the reliability of the equipment. Therefore, the double-layer test equipment of this embodiment can better meet the actual test needs, ensure the normal use of the equipment and the accuracy of the test results.

[0073] Please refer again Figure 6 , regarding a specific implementation of this embodiment, the composition of the high-frequency signal transmission and interface module 6 is further refined and explained.

[0074] In this embodiment, the high-frequency signal transmission and interface module 6 includes not only the FPC board 601 mentioned above, but also a key component, the radio frequency probe 602. The radio frequency probe 602 plays a vital role in high-frequency signal transmission and testing, and is responsible for receiving and sending high-frequency signals to ensure accurate transmission and effective reception of signals.

[0075] The radio frequency probe 602 is electrically connected to the BG board 203 via the FPC board 601. This connection method ensures that the radio frequency probe 602 can stably and reliably transmit high-frequency signals, and is also beneficial to the overall layout of the device and the optimization of the signal path.

[0076] Please refer again Figure 3-4 Regarding a specific implementation of this embodiment, the structure of the rack module 4 and its assembly relationship with the lower needle plate module 3, the first drive module 5 and the carrier module 9 are explained in detail.

[0077] In this embodiment, the rack module 4 is used as the support frame of the entire test equipment, and its structural design is particularly critical. The rack module 4 is mainly composed of three parts: a bottom plate 401, a first support plate 402, and a second support plate 403. These three parts cooperate with each other to form a stable foundation for the equipment.

[0078] Specifically, the lower needle plate module 3 and the first drive module 5 are precisely mounted on the bottom plate 401. The lower needle plate module 3 is responsible for electrically connecting with the device under test, while the first drive module 5 is responsible for driving the top plate 1 and the upper needle plate module 2 to move in the vertical direction to achieve docking with the lower needle plate module 3.

[0079] The first support plate 402 is slidably mounted on the bottom plate 401 in the horizontal direction. This sliding design allows the first support plate 402 to adjust its position according to actual needs so as to take and place the device under test. In addition, a carrier module 9 is detachably provided on the first support plate 402, and the carrier module 9 is used to carry and fix the device under test to ensure the stability and accuracy of the test process.

[0080] The second support plate 403 is slidably mounted on the first support plate 402 in the horizontal direction, and also adopts a sliding design, so that the second support plate 403 can also be adjusted as needed to take and place the device under test. Similar to the first support plate 402, another carrier module 9 can also be detachably provided on the second support plate 403 for carrying and fixing another device under test.

[0081] In summary, this embodiment achieves high flexibility, high stability and high accuracy of the test equipment by carefully designing the structure of the rack module 4 and its assembly relationship with the lower needle plate module 3, the first drive module 5 and the carrier module 9. This design not only meets the actual test needs, but also provides more possibilities for subsequent upgrades and expansions of the equipment.

[0082] Please refer again Figure 2 Regarding another specific implementation of this embodiment, the further functional expansion of the double-layer test device will be introduced in detail, especially the introduction of the second drive module 10 and the third drive module 11 to enhance the flexibility and test efficiency of the device.

[0083] In this embodiment, the double-layer test device is newly equipped with a second drive module 10 and a third drive module 11 on the basis of the original device. Both drive modules are carefully installed on the bottom plate 401 and are tightly integrated with other parts of the device.

[0084] The driving end of the second driving module 10 is connected to the first pallet 402. This design enables the second driving module 10 to drive the first pallet 402 and the second pallet 403 and the carrier module 9 mounted thereon to move in the horizontal direction. Specifically, the second driving module 10 can drive the first pallet 402 and the second pallet 403 to move to the right below the upper needle plate module 2 for test docking; or drive them to move to the front of the upper needle plate module 2 to provide space for replacing the device under test or performing other operations.

[0085] The driving end of the third driving module 11 is connected to the second pallet 403. This means that the third driving module 11 can independently drive the second pallet 403 and the carrier module 9 thereon to move in the horizontal direction. Similarly, the third driving module 11 can drive the second pallet 403 to move to the right below the first pallet 402 to align with other components or test positions on the first pallet 402; or drive the second pallet 403 to move to the front of the first pallet 402, providing convenience for operating or replacing the device under test on the second pallet 403 separately.

[0086] Through this design, the double-layer test device not only realizes up and down movement in the vertical direction (driven by the first drive module 5), but also realizes flexible movement in the horizontal direction (driven by the second drive module 10 and the third drive module 11). This multi-dimensional mobility greatly improves the flexibility and test efficiency of the device, allowing the device to adapt to different test requirements more quickly and more conveniently replace and operate the device under test.

[0087] In summary, this embodiment achieves flexible horizontal movement of the double-layer test equipment by introducing the second drive module 10 and the third drive module 11 and carefully designs their drive modes and connection relationships with other parts of the equipment, thereby further improving the testing capability and usage efficiency of the equipment.

[0088] In a specific implementation of this embodiment, the position and function of the lower needle plate module 3 are further optimized and designed.

[0089] Specifically, the lower needle plate module 3 is cleverly placed between the first support plate 402 and the second support plate 403. Such a position layout not only fully utilizes the space inside the device, but also provides the possibility of testing two devices under test at the same time.

[0090] More importantly, a double-ended probe is provided on the lower needle plate module 3. The design of this double-ended probe is very innovative, one end of which is electrically connected to the device under test on the first support plate 402, and the other end is electrically connected to the device under test on the second support plate 403. In this way, when the device is tested, the double-ended probe can establish electrical connections with two devices under test at the same time to achieve synchronous transmission and reception of signals.

[0091] This design greatly improves the test efficiency, allowing the equipment to complete the test of two devices under test at the same time without having to test them separately. This not only saves time, but also reduces test costs and improves equipment utilization.

[0092] In summary, this embodiment achieves the function of testing two devices under test at the same time by optimizing the position design of the lower needle plate module 3 and equipping it with a double-headed probe, thereby further improving the testing capability and efficiency of the equipment.

[0093] Please refer to Figure 7 Regarding another specific implementation of this embodiment, the structure of the carrier module 9 is further refined and improved, especially a positioning component 12 for fixing the device under test is provided thereon.

[0094] In this embodiment, the carrier module 9 is an important component for carrying and fixing the device under test, and its design is directly related to the accuracy and stability of the test. Therefore, a positioning component 12 is carefully arranged on the carrier module 9 to ensure that the device under test can be firmly and accurately fixed on the carrier module 9.

[0095] The specific form of the positioning assembly 12 can be customized according to the shape, size and test requirements of the device under test.

[0096] By providing the positioning assembly 12, the device under test can be effectively prevented from moving or shaking during the test, thereby ensuring the accuracy and reliability of the test. At the same time, the design of the positioning assembly 12 also takes into account the requirements of easy operation and disassembly, making it more convenient and quick to replace the device under test or perform other operations.

[0097] In summary, this embodiment further improves the test accuracy and stability of the device by setting the positioning assembly 12 on the carrier module 9, and provides a strong guarantee for the normal use of the device and the accuracy of the test results.

[0098] Please refer again Figure 7 The specific design of the positioning assembly 12 of this embodiment is described in more detail, especially the innovative design of the coarse positioning column 1201 and the fine positioning column 1202 is introduced.

[0099] In this embodiment, the positioning assembly 12 is composed of two parts: a coarse positioning column 1201 and a fine positioning column 1202 . The two parts cooperate with each other to achieve accurate and stable fixation of the device under test.

[0100] The main function of the coarse positioning column 1201 is to perform rough guiding and positioning. When the device under test is placed on the carrier module 9, the coarse positioning column 1201 can quickly guide the device under test into the roughly correct position, providing a basis for subsequent precise positioning. The design of the coarse positioning column 1201 is usually relatively loose to accommodate the slight deviation that may exist in the device under test during the placement process.

[0101] The fine positioning column 1202 is used to further perform precise positioning based on the rough positioning. After the device under test is roughly positioned by the rough positioning column 1201, the fine positioning column 1202 will cooperate with the precise positioning hole or structure on it to ensure that the device under test can be accurately and stably fixed on the carrier module 9. The design of the fine positioning column 1202 is usually more sophisticated to ensure the accuracy and stability of positioning.

[0102] This coarse and fine two-stage positioning design can effectively improve the positioning accuracy and fixing stability of the device under test. The coarse positioning column 1201 can quickly guide the device under test into the approximate position, while the fine positioning column 1202 can ensure its accurate fixation in the final position. This design not only improves the efficiency of the test, but also ensures the accuracy of the test results.

[0103] In summary, this embodiment achieves accurate and stable fixation of the device under test by introducing the positioning component design of the coarse positioning column 1201 and the fine positioning column 1202, which provides a strong guarantee for the normal use of the equipment and the accuracy of the test results.

[0104] In a specific implementation of this embodiment, the materials and characteristics of the test probe 7, the transfer probe 8 and the double-headed probe are specially selected, that is, they are all elastic probes.

[0105] The design of the elastic probe has many advantages. First, the elastic probe can provide good contact performance. During the test process, the probe needs to be in close contact with the pins or test points of the device under test to ensure accurate signal transmission. Due to its own elastic properties, the elastic probe can adapt to slight deformation or position deviation of the device under test, thereby maintaining stable contact.

[0106] Secondly, the elastic probe has a long service life. During frequent testing, the probe will experience multiple plugging and unplugging and contact, which is prone to wear or damage. However, due to the elasticity and wear resistance of its material, the elastic probe can better resist such wear and extend its service life.

[0107] Furthermore, the elastic probe also helps to improve the accuracy and reliability of the test. Due to its good contact performance and stable electrical connection, the elastic probe can ensure the accurate transmission and reception of the test signal, reducing errors and interference during the test process.

[0108] In summary, the present embodiment selects to use elastic probes as the test probes 7 , the transfer probes 8 and the double-headed probes, thereby improving the contact performance, service life and accuracy of the test.

[0109] Although the terms FPC board, BG board, etc. are used more frequently in this application, the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention.

[0110] A double-layer testing device provided in an embodiment of the present invention is designed to electrically connect the FPC board and the BG board through a transfer probe, so that there is no need to repeatedly solder and desolder the FPC board and the BG board, thereby improving the operating convenience, use efficiency and reliability of the testing device, and can better meet actual testing needs, ensuring the normal use of the testing equipment and the accuracy of the test results.

[0111] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concept of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.

Claims

1. A double-layer testing device, characterized in that: It comprises a top plate (1), an upper needle plate module (2), a lower needle plate module (3), a frame module (4) and a first drive module (5); wherein: The top plate (1), the upper needle plate module (2), the lower needle plate module (3), and the frame module (4) are arranged in sequence from top to bottom; The lower needle plate module (3) is arranged on the upper surface of the frame module (4); The upper needle plate module (2) is arranged on the lower surface of the top plate (1); The first driving module (5) is arranged on the frame module (4), and a driving end of the first driving module (5) is connected to the top plate (1), and is used to drive the top plate (1) and the upper needle plate module (2) to move in a vertical direction so as to approach the lower needle plate module (3) and be electrically connected to the lower needle plate module (3); The upper surface of the upper needle plate module (2) is provided with a slot, and a high-frequency signal transmission and interface module (6) is provided in the slot; The upper needle board module (2) comprises a PCB board (201), a CG board (202), a BG board (203) and an Interposer board (204); The high-frequency signal transmission and interface module (6) comprises an FPC board (601); The FPC board (601), the BG board (203), the Interposer board (204), the CG board (202) and the PCB board (201) are arranged in sequence from top to bottom; The PCB board (201) and the CG board (202) are electrically connected via a test probe (7); The CG board (202) is in direct contact with the Interposer board (204) to establish an electrical connection; The Interposer board (204) and the BG board (203) are electrically connected via a transfer probe (8); The FPC board (601) and the BG board (203) are electrically connected via another transfer probe (8).

2. The double-layer testing device according to claim 1, characterized in that: The high-frequency signal transmission and interface module (6) further comprises a radio frequency probe (602); The radio frequency probe (602) is electrically connected to the BG board (203) via the FPC board (601).

3. The double-layer testing device according to claim 1, characterized in that: The frame module (4) comprises a bottom plate (401), a first support plate (402) and a second support plate (403); The lower needle plate module (3) and the first drive module (5) are respectively arranged on the bottom plate (401); The first support plate (402) is slidably mounted on the bottom plate (401) in a horizontal direction, and is detachably provided with a carrier plate module (9); The second support plate (403) is slidably mounted on the first support plate (402) in a horizontal direction and is detachably provided with another carrier plate module (9).

4. The double-layer testing device according to claim 3, characterized in that: It also includes a second drive module (10) and a third drive module (11); The second driving module (10) and the third driving module (11) are respectively arranged on the bottom plate (401); The driving end of the second driving module (10) is connected to the first supporting plate (402) and is used to drive the first supporting plate (402) and the second supporting plate (403) to move in a horizontal direction, so that the first supporting plate (402) and the second supporting plate (403) move to the bottom of the upper needle plate module (2), or move to the front of the upper needle plate module (2); The driving end of the third driving module (11) is connected to the second pallet (403) and is used to drive the second pallet (403) to move in a horizontal direction, so that the second pallet (403) moves to the bottom of the first pallet (402), or moves to the front of the first pallet (402).

5. The double-layer testing device according to claim 3, characterized in that: The lower needle plate module (3) is located between the first support plate (402) and the second support plate (403); The lower needle plate module (3) is provided with a double-ended probe, and the double-ended probe is electrically connected to the device to be tested on the first support plate (402) and the device to be tested on the second support plate (403) respectively.

6. The double-layer testing device according to claim 3, characterized in that: Positioning components (12) for fixing the device under test are respectively arranged on the carrier module (9).

7. The double-layer testing device according to claim 6, characterized in that: The positioning assembly (12) comprises a coarse positioning column (1201) and a fine positioning column (1202); The coarse positioning column (1201) is used for rough guiding and positioning; The precise positioning column (1202) is used to further perform precise guiding positioning on the basis of rough guiding positioning.

8. The double-layer testing device according to claim 1, characterized in that: The test probe (7), the transfer probe (8) and the double-headed probe are all elastic probes.

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