A transfer device for wafer film sticking

Abstract

A transfer device for wafer film sticking, which relates to the field of semiconductor processing, includes: a workbench, with a vertically moving top plate in the center for jacking up a storage plate; a carrying mechanism, including two limiting plates respectively arranged on both sides of the workbench, two connecting plates are arranged between the limiting plates, long strip holes are provided on the sides of the limiting plates and the connecting plates, and a support plate moving along its length direction is arranged in the long strip holes for supporting the storage plate, a plurality of support bars arranged at intervals in the circumferential direction and moving towards each other are arranged between the limiting plates for carrying wafers; a transfer mechanism, including a carrying plate arranged above the workbench and moving along its length direction and vertically for carrying wafers, the carrying plate is rotatably arranged around its own axis, and two symmetrically arranged and vertically moving limiting bars are arranged on the top surface for circumferentially limiting the wafers and for transferring the wafers to the support bars. This device can avoid the wafers from falling during the transfer process, ensure the smooth progress of production, and also avoid their damage.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular relates to a transfer device for wafer film pasting. Background Art

[0002] In the process of semiconductor chip processing, a protective film is usually covered on the surface of the wafer in multiple processes. When pasting the film on the surface of the wafer, a suction cup is usually used to transfer the wafer to the tooling, and then a film pasting mechanism is used to cover the protective film on the surface of the wafer. After that, the suction cup is used again to transfer the wafer covered with the protective film away from the tooling and move it to the storage board. Finally, the storage board is transferred to the cassette. In the actual operation process, since the wafer is placed in the cassette, it is necessary to first take out the wafer from the cassette and then use the suction cup to transfer the wafer to the tooling. However, due to the vibration during the operation of the equipment, the suction cup may shake, which may cause the wafer to fall below the suction cup, which is not conducive to the smooth progress of production; and since the protective film covered on the surface of the wafer usually extends beyond the surface of the wafer, and the protective film is a flexible material, after the suction cup sucks the wafer after film pasting, the protective film will bend under its own gravity, and during the transfer process, the part of the protective film extending beyond the wafer will bend further, which may cause the wafer to fall under the action of air resistance. Moreover, when the wafer after film pasting is placed on the storage board and when the wafer is transferred to the tooling, the protective film may be folded under the wafer, which may cause damage to the wafer. Summary of the Invention

[0003] In view of the deficiencies of the above-mentioned related prior art, the present application provides a transfer device for wafer film pasting, which can avoid the wafer from falling during the transfer process, ensure the smooth progress of production, and also avoid its damage, and has strong practicability.

[0004] To achieve the above object, the present invention adopts the following technology:

[0005] A transfer device for wafer film pasting, comprising: a workbench, a carrying mechanism, and a transfer mechanism.

[0006] The workbench is provided with a top plate that moves vertically to jack up a storage plate for placing wafers; the loading mechanism includes two limit plates respectively installed on both sides at one end of the workbench. There are two connecting plates between the limit plates. Long strip holes are provided on the sides of the limit plates and the connecting plates. A support plate that moves along the depth direction of the long strip hole is inserted through the long strip hole to support the storage plate for placing wafers. During application, the storage plate passes through the long strip hole on the limit plate. A plurality of support bars are arranged at intervals along the circumferential direction on the periphery of the top plate and move synchronously along the radial direction to carry wafers; the transfer mechanism includes a carrier plate arranged above the workbench and moving along its length direction and vertical direction to carry wafers. The carrier plate is rotatably arranged around its own axis, and two symmetrically arranged, adjustable-spacing and vertically moving limit bars are provided on the top surface to limit the circumference of the wafer. During application, the carrier plate is located between the support bars and transfers the wafer to the support bars.

[0007] Further, the support plate is in an inverted L shape, and the horizontal section is located inside the limit plate / connecting plate, and the bottom of the horizontal section is arc-shaped. The vertical section is located outside the limit plate / connecting plate and is sleeved on a guide rod. The guide rod is installed on the limit plate / connecting plate. A first retaining ring is provided at the end of the guide rod. A first spring is sleeved on the guide rod. The two ends of the first spring respectively abut against the vertical section of the support plate and the first retaining ring and are always in a compressed state.

[0008] Further, a plurality of limit holes that penetrate up and down and extend radially along the top plate are provided on the top surface of the workbench in the circumferential direction. The length direction of the limit holes is parallel to the moving direction of the support bars. A moving ring is slidably fitted in the limit holes. A support rod is inserted through the moving ring. The support bars are installed on the support rod. An installation block is sleeved on the support rod. The inner side of the installation block is rotatably connected to one end of a connecting rod. The other end of the connecting rod is rotatably connected to a lifting plate. The lifting plate is sleeved on a first screw rod and locked with a nut. The first screw rod 212 is installed at the bottom of the workbench 100. The lower end of the support rod is slidably fitted in a lifting frame. The lifting frame is connected to the moving end of a third vertical lifting mechanism. The third vertical lifting mechanism is installed at the bottom of the workbench.

[0009] Further, a rectangular ring is provided above the limit plate. The rectangular ring is connected to the moving end of a first vertical lifting mechanism. The first vertical lifting mechanism is installed on the connecting plate. A plurality of limit rods are provided at the bottom of the rectangular ring. When the rectangular ring is at the lowest point of its stroke, the bottom of the limit rods is lower than the horizontal section of the support plate. During application, the limit rods pass through the storage plate.

[0010] Further, a push rod is provided inside the connecting plate. The push rod is in a U shape, and both sides are located in the long strip holes of the connecting plate, and the bottom end is located in the long strip hole of one of the limit plates. The inner sides of the push rod are flush with the inner walls of the limit plate and the connecting plate. One end of the push rod is connected to the moving end of a first horizontal linear mechanism. The first horizontal linear mechanism is installed on the connecting plate.

[0011] Further, a first through groove and a second through groove are respectively provided at both ends of the carrier plate for passing through the limiting strip. A sliding groove extending towards the center of the carrier plate is provided on the side wall of the first through groove. The lower end of the limiting strip is detachably mounted on the slider. The slider is sleeved on the sliding rod, and a thread is provided on the sliding rod below the second through groove, and a nut is sleeved thereon for locking the slider. Both ends of the sliding rod are sleeved on the vertical rod. The vertical rod is mounted on the bottom of the carrier plate, and a second retaining ring is provided at the lower end. A second spring is sleeved on the vertical rod, and both ends of the second spring respectively abut against the sliding rod and the second retaining ring and are always in a compressed state.

[0012] Further, one end of the slider below the first through groove is slidably fitted in the connecting block in the vertical direction. One end of the connecting block is connected to the moving end of the second horizontal linear mechanism. The second horizontal linear mechanism is mounted on the bottom of the carrier plate.

[0013] Further, the transfer mechanism further includes a support seat provided above one end of the workbench. The center of the support seat is provided with a through hole and is rotatably mounted with a clamping ring. Two symmetrically arranged clamping grooves are provided on the inner side of the clamping ring. During application, both ends of the carrier plate are fitted in the clamping grooves, and a pressing block is provided in one of the clamping grooves. A notch is provided outside the first through groove. The pressing block is fitted in the notch and abuts against the top surface of the limiting strip.

[0014] Further, the bottom of the carrier plate is rotatably mounted in the support ring. The support ring is connected to the moving end of the second vertical lifting mechanism. The second vertical lifting mechanism is mounted on the support frame. The support frame is movably arranged along the length direction of the workbench. The bottom surface of the carrier plate is provided with a first positioning rod, a central rod and a support plate. The axis of the central rod is located on the rotation axis of the clamping ring and passes through the support frame. When the carrier plate is at the lowest point of its vertical stroke, the first positioning rod passes through the support frame. A second positioning rod is provided at the bottom of the clamping ring. When the carrier plate is at the highest point of its vertical stroke, the second positioning rod passes through the support plate.

[0015] Further, baffles are provided on both sides of the top surface of the support seat. Brackets are provided on the baffles. The brackets are all sleeved on the second screw rod. Both ends of the second screw rod are mounted on the convex plates. The convex plates are mounted on the support seat. Third springs and nuts are sleeved on both ends of the second screw rod. The nuts are used to abut against the inner sides of the brackets. Both ends of the third spring respectively abut against the convex plate and the bracket and are always in a compressed state.

[0016] The beneficial effects of the present invention are as follows: The wafer is transferred by pushing, and the wafer is placed on the support strip by using the carrier plate, which can avoid the wafer from falling during the transfer process and ensure the smooth progress of production; when the wafer is pasted with a film, the wafer is directly received by the storage plate. After the film pasting is completed, the storage plate can be directly transferred, thus avoiding the secondary transfer of the wafer, improving the production efficiency, and also avoiding the damage of the wafer after film pasting. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are only for illustrating selected embodiments and not all possible implementation manners, let alone intended to limit the scope of the present invention.

[0018] Figure 1 It is a three-dimensional schematic diagram of the overall structure of an embodiment of the present application.

[0019] Figure 2 It is a three-dimensional schematic diagram of the bearing mechanism of an embodiment of the present application.

[0020] Figure 3 It is a three-dimensional sectional structure schematic diagram of the bearing mechanism of an embodiment of the present application.

[0021] Figure 4 It is Figure 3 an enlarged schematic diagram of part A of

[0022] Figure 5 It is a sectional view of the bearing mechanism of an embodiment of the present application.

[0023] Figure 6 It is a three-dimensional schematic diagram of the bearing plate of an embodiment of the present application.

[0024] Figure 7 It is a sectional structure schematic diagram of the bearing plate of an embodiment of the present application.

[0025] Figure 8 It is Figure 7 an enlarged schematic diagram of part B of

[0026] Figure 9 It is a schematic diagram of the baffle installation of an embodiment of the present application.

[0027] Figure 10 It is a schematic diagram of the cooperation between the bearing plate and the snap ring of an embodiment of the present application.

[0028] Description of reference numerals: 100 - workbench, 200 - carrying mechanism, 300 - transfer mechanism, 101 - top plate, 102 - limiting hole, 103 - moving ring, 201 - limiting plate, 202 - connecting plate, 203 - long slot, 204 - support plate, 205 - support bar, 206 - guide rod, 207 - first retaining ring, 208 - first spring, 209 - support rod, 210 - connecting rod, 211 - lifting plate, 212 - first screw rod, 213 - rectangular ring, 214 - limiting rod, 215 - push rod, 216 - mounting block, 217 - lifting frame, 301 - carrying plate, 302 - limiting strip, 303 - first through slot, 304 - second through slot, 305 - sliding slot, 306 - slider, 307 - sliding rod, 308 - vertical rod, 309 - second retaining ring, 310 - second spring, 311 - support seat, 312 - snap ring, 313 - clamping slot, 314 - pressing block, 315 - notch, 316 - support ring, 317 - support frame, 318 - first positioning rod, 319 - support plate, 320 - second positioning rod, 321 - central rod, 322 - baffle plate, 323 - support, 324 - second screw rod, 325 - convex plate, 326 - third spring. Detailed implementation manners

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following describes the implementation manners of the present invention in detail with reference to the accompanying drawings. However, the embodiments described herein are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0030] As Figures 1 to 10 shown, the embodiment of the present application provides a transfer device for wafer film pasting, including: a workbench 100, a carrying mechanism 200, and a transfer mechanism 300.

[0031] The workbench 100 is provided with a top plate 101 that moves vertically to lift the storage plate. A stop bar can be arranged on the workbench 100 to abut against one side of the storage plate to prevent it from moving too far during the process of being pushed onto the workbench 100. The carrying mechanism 200 includes two limit plates 201 respectively installed on both sides at one end of the workbench 100. There are two connecting plates 202 between the limit plates 201. When the storage plate is on the workbench 100, the four sides of the storage plate are flush with the inner walls of the limit plates 201 and the connecting plates 202. During the process of the storage plate moving upward vertically, the limit of the storage plate is ensured. Long strip holes 203 are provided on the sides of the limit plates 201 and the connecting plates 202. A support plate 204 that moves along its length direction is inserted through the long strip holes 203 to support the storage plate for placing wafers. After the wafer is pasted with film, the storage plate passes through the long strip holes 203 on the limit plates 201. There are multiple support bars 205 arranged at intervals in the circumferential direction between the limit plates 201. If the top plate 101 is set as circular, the length direction of the support bars 205 is parallel to the radius of the top plate 101, and the support bars 205 move synchronously along the radial direction of the top plate 101 to carry the wafers. The transfer mechanism 300 includes a carrying plate 301 arranged above the workbench 100 and moving along its length direction and vertical direction to carry the wafers. The carrying plate 301 is rotatably arranged around its own axis, and two symmetrically arranged, spacing-adjustable and vertically moving limit bars 302 are provided on the top surface to limit the circumferential side of the wafer. When the carrying plate 301 is between the two limit plates 201 and between the support bars 205, the carrying plate 301 moves downward from top to bottom to transfer the wafer to the support bars 205.

[0032] During use, the carrying plate 301 carrying the wafers is moved between the two limit plates 201. Then the carrying plate 301 is moved downward, and the support bars 205 will lift the wafers. Then the carrying plate 301 is moved out from between the two limit plates 201. Then the top plate 101 is moved upward to lift the storage plate on the workbench 100. At the same time, the support bars 205 are moved downward so that the storage plate lifts the wafers until the storage plate is above the support plate 204, and the support plate 204 supports the storage plate. Subsequently, the wafer pasting operation can be carried out. After the pasting is completed, the storage plate can be pushed away from the long strip holes 203.

[0033] Specifically, as Figures 1 - 4As shown, the support plate 204 is in an inverted L-shape, and the horizontal section is located on the inner side of the limiting plate 201 / connecting plate 202, and the bottom of the horizontal section is arc-shaped, and the vertical section is located on the outer side of the limiting plate 201 / connecting plate 202, and is sleeved on the guide rod 206, and the guide rod 206 is installed on the limiting plate 201 / connecting plate 202. A first retaining ring 207 is provided at the end of the guide rod 206, and a first spring 208 is sleeved on the guide rod 206. The two ends of the first spring 208 are respectively abutted against the vertical section of the support plate 204 and the first retaining ring 207, and are always in a compressed state. When the storage is needed, When the plate receives the wafer, the storage plate is driven to move upward through the top plate 101, and the storage plate passes through the support bar 205. The wafer on the support bar 205 will be lifted by the storage plate. As the storage plate continues to move upward, the edge of the storage plate will contact the arc-shaped part of the support plate 204, and will force the support plate 204 to move, and the first spring 208 will be further compressed. After the storage plate completely passes through the support plate 204, the support plate 204 will be reset under the action of the first spring 208 to support the storage plate, and then the wafer can be filmed.

[0034] Specifically, Figures 2 - 3 As shown, during the resetting process of the support plate 204, the limiting plate 201 and other components will be impacted. In order to prevent the storage plate from being displaced due to the impact, a rectangular ring 213 is provided above the limiting plate 201. The rectangular ring 213 is connected to the moving end of the first vertical lifting mechanism. The first vertical lifting mechanism is installed on the connecting plate 202. A plurality of limiting rods 214 are provided at the bottom of the rectangular ring 213. When the storage plate moves upward, the rectangular ring 213 is driven downward by the first vertical lifting mechanism so that the rectangular ring 213 is located at the lowest point of its travel. At this time, the bottom of the limiting rod 214 is lower than the horizontal section of the support plate 204. When the storage plate has not yet contacted the support plate 204, the limiting rod 214 will first pass through the storage plate to limit the storage plate.

[0035] Specifically, Figures 2 - 5As shown in the figure, in order to be able to adapt to wafers of different sizes and improve the versatility of the device, a plurality of spacing - arranged and vertically - penetrating limiting holes 102 are provided along the circumferential direction on the top surface of the workbench 100. The length direction of the limiting holes 102 is parallel to the moving direction of the support strip 205. A moving ring 103 is slidably fitted in the limiting hole 102. A support rod 209 is passed through the moving ring 103. The support strip 205 is installed on the support rod 209. An installation block 216 is sleeved on the support rod 209. The inner side of the installation block 216 is rotatably connected to one end of a connecting rod 210. The other end of the connecting rod 210 is rotatably connected to a lifting plate 211. The lifting plate 211 is sleeved on a first screw rod 212 and locked with a nut. The first screw rod 212 is installed at the bottom of the workbench 100. By driving the lifting plate 211 to move up and down, the support strips 205 can be synchronously driven to approach or move away from each other. The lower end of the support rod 209 is slidably fitted in a lifting frame 217. The lifting frame 217 is connected to the moving end of a third vertical lifting mechanism. The third vertical lifting mechanism is installed at the bottom of the workbench 100. During the process of the storage plate moving upward, the lifting frame 217 is synchronously driven to move downward by the third vertical lifting mechanism, so that the support strips 205 move downward synchronously, and the storage plate lifts the wafer, facilitating the subsequent wafer film - sticking operation. In order to facilitate the transfer of a new storage plate onto the workbench 100, the top of the support rod 209 is flush with the top of the workbench 100. After the storage plate is transferred onto the workbench 100, the support strips 205 can be driven to move upward again through the third vertical lifting mechanism, so that they pass through the storage plate and wait for the wafer to be placed on the support strips 205. This enables the pushing operation of the storage plate and the wafer film - sticking operation to be carried out simultaneously, thereby improving production efficiency.

[0036] Specifically, as Figure 3 、 Figure 5 shown, a push rod 215 is provided inside the connecting plate 202. The push rod 215 is U - shaped, and both sides are located in the long - slot holes 203 of the connecting plate 202, and the bottom end is located in the long - slot hole 203 of one of the limiting plates 201. The inner sides of the push rod 215 are flush with the inner walls of the limiting plate 201 and the connecting plate 202. One end of the push rod 215 is connected to the moving end of a first horizontal linear mechanism. The first horizontal linear mechanism is installed on the connecting plate 202. After the wafer film - sticking operation is completed, the push rod 215 can be driven to move through the first horizontal linear mechanism to move the storage plate away from the area between the limiting plates 201.

[0037] Specifically, as Figures 6 - 8As shown in the figure, first through slots 303 and second through slots 304 are respectively provided at both ends of the carrier plate 301 for passing through the limiting strip 302. A sliding slot 305 extending towards the center of the carrier plate 301 is provided on the side wall of the first through slot 303 for passing through the limiting strip 302. The lower end of the limiting strip 302 is detachably mounted on the slider 306. The slider 306 is sleeved on the slide bar 307, and a thread is provided on the slide bar 307 below the second through slot 304, and a nut is sleeved thereon for locking the slider 306. By rotating the nut, the slider 306 can be moved, and then the distance between the limiting strip 302 and the center of the carrier plate 301 can be adjusted to adapt to wafers of different sizes. After that, the slider 306 can be locked again with the nut. The two ends of the slide bar 307 are sleeved on the vertical bars 308. The vertical bars 308 are mounted on the bottom of the carrier plate 301, and a second retaining ring 309 is provided at the lower end. A second spring 310 is sleeved on the vertical bar 308. The two ends of the second spring 310 respectively abut against the slide bar 307 and the second retaining ring 309 and are always in a compressed state. Under the action of the second spring 310, the limiting strip 302 always has a tendency to move upward, ensuring the limiting effect on the wafer. Before pushing the wafer onto the carrier plate 301, only an external downward force needs to be applied to the limiting strip 302 above the first through slot 303 to make its top surface flush with the top surface of the carrier plate 301. During the transfer of the wafer, the wafer is carried by the carrier plate 301, and then the carrier plate 301 carrying the wafer is moved into the area surrounded by the limiting plate 201 and the connecting plate 202. After that, the carrier plate 301 is moved downward, and the wafer can be placed on the support strip 205.

[0038] Specifically, as Figures 7 - 8 shown in the figure, in order to conveniently adapt to wafers of different sizes, one end of the slider 306 below the first through slot 303 can be slidably matched in the vertical direction in the connecting block. One end of the connecting block is connected to the moving end of the second horizontal linear mechanism. The second horizontal linear mechanism is mounted on the bottom of the carrier plate 301. When the limiting strip 302 is above the carrier plate 301, the connecting block can be driven by the second horizontal linear mechanism to move towards the center of the carrier plate 301.

[0039] Specifically, as Figure 1 、 Figures 9 - 10As shown, in order to facilitate the pushing of the wafer onto the carrier plate 301, the transfer mechanism 300 further includes a support base 311 disposed above one end of the workbench 100. The center of the support base 311 is provided with a through hole, and a clamping ring 312 is rotatably installed therein. Two symmetrically arranged clamping grooves 313 are provided on the inner side of the clamping ring 312, and a pressing block 314 is provided in one of the clamping grooves 313. A notch 315 is provided outside the first through groove 303. After the carrier plate 301 is moved out of the area of the loading mechanism 200, the carrier plate 301 is driven to move upward, so that both ends of the carrier plate 301 are fitted into the clamping grooves 313, and the top surface of the carrier plate 301 is flush with the top surface of the clamping ring 312. The pressing block 314 is fitted into the notch 315 and abuts against the top surface of the limiting strip 302. Under the action of the pressing block 314, the limiting strip 302 above the first through groove 303 will be forced to move downward to be flush with the top surface of the carrier plate 301, ensuring that the wafer can be smoothly pushed between the two limiting strips 302. Then, the clamping ring 312 is rotated 90 degrees, and the carrier plate 301 is driven to rotate synchronously, facilitating the transfer of the wafer. The rotation of the clamping ring 312 can adopt the structure of a gear and a toothed ring. That is, a toothed ring is provided on the outer side of the clamping ring 312, and the toothed ring meshes with the gear. The rotation of the clamping ring 312 can be realized by driving the gear to rotate through a power device.

[0040] Specifically, as Figures 9 - 10As shown, in order to ensure that the wafer can be smoothly pushed onto the carrier plate 301, baffles 322 are provided on both sides of the top surface of the support base 311. Brackets 323 are provided on the baffles 322. The brackets 323 are all sleeved on the second screw 324. Both ends of the second screw 324 are installed on the convex plate 325. The convex plate 325 is installed on the support base 311. Both ends of the second screw 324 are sleeved with third springs 326 and nuts. The nuts are located between the two brackets 323 and are used to abut against the inner sides of the brackets 323. Both ends of the third spring 326 respectively abut against the convex plate 325 and the bracket 323 and are always in a compressed state. By rotating the nuts, the distance between the two baffles 322 can be adjusted, thereby adapting to wafers of different sizes. During the upward movement of the carrier plate 301, one of the limit strips 302 is located in the first through groove 303, and then until the top surface of the carrier plate 301 is flush with the top surface of the snap ring 312. At this time, one of the limit strips 302 moves downward to be flush with the top surface of the carrier plate 301 under the action of the pressing block 314. The other limit strip 302 moves downward to be flush with the top surface of the carrier plate 301 under the action of one of the baffles 322. Then the carrier plate 301 is rotated 90 degrees so that the two limit strips 302 are located between the two baffles 322, and the line connecting the centers of the two limit strips 302 is parallel to the length direction of the baffle 322. And during the rotation of the carrier plate 301, the other limit strip 302 gradually disengages from the bottom surface of the baffle 322, enabling the limit strip 302 to pop out under the action of the second spring 310. Then the wafer can be pushed onto the carrier plate 301 so that the wafer abuts against the limit strip 302. After that, the carrier plate 301 is reversed and reset. During the reverse rotation, the other limit strip 302 will contact the inner side of the baffle 322 and force one of the baffles 322 to move away from the center of the snap ring 312. After reversing 90 degrees, the carrier plate 301 is moved downward, and one of the limit strips 302 will gradually protrude beyond the top surface of the carrier plate 301. Until the carrier plate 301 is completely lower than the snap ring 312, one of the limit strips 302 can be driven to move towards the center of the carrier plate 301 to realize the limitation of the wafer and prevent it from shifting during the transfer process.

[0041] Specifically, as Figures 7 - 10As shown, the bottom of the bearing plate 301 is rotatably installed in the support ring 316. The support ring 316 is connected to the mobile end of the second vertical lifting mechanism. The second vertical lifting mechanism is installed on the support frame 317. The support frame 317 moves along the length direction of the workbench 100. The bottom surface of the bearing plate 301 is provided with a first positioning rod 318, a central rod 321 and a support plate 319. The axis of the central rod 321 is located on the rotation axis of the clamping ring 312 and passes through the support frame 317. A second positioning rod 320 is provided at the bottom of the clamping ring 312. When the bearing plate 301 is at the highest point of its vertical stroke, the second positioning rod 320 passes through the support plate 319, while the first positioning rod 318 does not pass through the support frame 317. When the bearing plate 301 is at the lowest point of its vertical stroke, the first positioning rod 318 passes through the support frame 317, while the second positioning rod 320 does not pass through the support plate 319. Moreover, during the upward movement of the bearing plate 301, there is at least a period of time when the first positioning rod 318 passes through the support frame 317 and at the same time the second positioning rod 320 also passes through the support plate 319, so as to realize the limit of the bearing plate 301 throughout the process and prevent it from rotating arbitrarily.

[0042] During the actual operation process, the support frame 317 is moved below the support base 311, and then the support ring 316 is driven to move upward by the second vertical lifting mechanism, and the bearing plate 301 is also driven to move upward synchronously. As the bearing plate 301 moves, the second positioning rod 320 passes through the support plate 319. After that, the first positioning rod 318 moves out of the support frame 317 until both ends of the bearing plate 301 are fitted in the card slots 313 and the top surface of the bearing plate 301 is flush with the top surface of the clamping ring 312. Then the clamping ring 312 can drive the bearing plate 301 to rotate 90 degrees. For the movement of the support frame 317, a gear-rack structure can be adopted, which can also enhance the supporting effect on the support frame 317.

[0043] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. A transfer device for wafer film bonding, characterized in that: include: A workbench (100) is movable in a vertical direction and is provided with a top plate (101) for lifting a storage plate for placing wafers; The carrying mechanism (200) comprises two limit plates (201) respectively arranged on both sides of the workbench (100) and two connecting plates (202) arranged between the limit plates (201); the limit plates (201) and the connecting plates (202) are both provided with elongated holes (203); a supporting plate (204) is passed through the elongated holes (203) and is arranged to move along the depth direction thereof, and is used to support a storage plate; when in use, the storage plate passes through the elongated holes (203) on the limit plates (201); a plurality of supporting bars (205) are arranged at intervals along the circumferential direction and are synchronously arranged to move along the radial direction, and are used to carry wafers; The transfer mechanism (300) comprises a carrier plate (301) disposed above the workbench (100) and movably disposed along the length direction and the vertical direction thereof, and used for carrying wafers. The carrier plate (301) is rotatably disposed around its own axis, and a top surface is provided with two symmetrically arranged limiting bars (302) with adjustable spacing and movably disposed along the vertical direction, and used for limiting the circumferential side of the wafer. When in use, the carrier plate (301) is located between the support bars (205), and the wafer is transferred to the support bars (205).

2. The wafer film transfer device according to claim 1, characterized in that: The support plate (204) is in an inverted L-shape, and the horizontal section is located inside the limiting plate (201) / the connecting plate (202), and the bottom is arc-shaped, and the vertical section is located outside the limiting plate (201) / the connecting plate (202) and is sleeved on the guide rod (206), the guide rod (206) is installed on the limiting plate (201) / the connecting plate (202), a first retaining ring (207) is provided at the end of the guide rod (206), and a first spring (208) is sleeved on the guide rod (206), and the two ends of the first spring (208) respectively abut against the vertical section of the support plate (204) and the first retaining ring (207), and are always in a compressed state.

3. The wafer film transfer device according to claim 1, characterized in that: The top surface of the workbench (100) is provided with a plurality of limiting holes (102) extending radially along the top plate (101) and penetrating up and down along the circumferential direction; a moving ring (103) is slidably fitted in the limiting hole (102); a support rod (209) is passed through the moving ring (103); the support bar (205) is mounted on the support rod (209); a mounting block (216) is sleeved on the support rod (209); the inner side of the mounting block (216) is rotatably connected to the connecting rod ( The connecting rod (210) is connected to one end of the connecting rod (210), and the other end of the connecting rod (210) is rotatably connected to the lifting plate (211). The lifting plate (211) is sleeved on the first screw rod (212) and locked with a nut. The first screw rod (212) is installed at the bottom of the workbench (100). The lower end of the support rod (209) is slidably matched in the lifting frame (217). The lifting frame (217) is connected to the moving end of the third vertical lifting mechanism. The third vertical lifting mechanism is installed at the bottom of the workbench (100).

4. The wafer film transfer device according to claim 2, characterized in that: A rectangular ring (213) is provided above the limit plate (201). The rectangular ring (213) is connected to the movable end of a first vertical lifting mechanism. The first vertical lifting mechanism is installed on the connecting plate (202). A plurality of limit rods (214) are provided at the bottom of the rectangular ring (213). When the rectangular ring (213) is located at the lowest point of its travel, the bottom of the limit rod (214) is lower than the horizontal section of the support plate (204). When in use, the limit rod (214) passes through the storage plate.

5. The wafer film transfer device according to claim 1, characterized in that: A push rod (215) is provided on the inner side of the connecting plate (202). The push rod (215) is U-shaped, and both sides are located in the long holes (203) of the connecting plate (202). The bottom end is located in the long holes (203) of one of the limiting plates (201). The inner side of the push rod (215) is flush with the inner walls of the limiting plate (201) and the connecting plate (202). One end of the push rod (215) is connected to the moving end of the first horizontal linear mechanism, and the first horizontal linear mechanism is installed on the connecting plate (202).

6. The wafer film transfer device according to claim 1, characterized in that: The two ends of the bearing plate (301) are respectively provided with a first through slot (303) and a second through slot (304) for passing the limiting strip (302); the side wall of the first through slot (303) is provided with a sliding slot (305) extending towards the center of the bearing plate (301); The lower end of the limit bar (302) is detachably mounted on the slider (306). The slider (306) is sleeved on the slide bar (307). The slide bar (307) located below the second through slot (304) is provided with a thread and a nut for locking the slider (306). Both ends of the slide bar (307) are sleeved on the vertical bar (308). The vertical bar (308) is mounted on the bottom of the bearing plate (301) and has a second retaining ring (309) at the lower end. A second spring (310) is sleeved on the vertical bar (308). Both ends of the second spring (310) are respectively abutted against the slide bar (307) and the second retaining ring (309) and are always in a compressed state.

7. The wafer film transfer device according to claim 6, characterized in that: One end of the sliding block (306) located below the first through slot (303) is slidably engaged in a connecting block in a vertical direction, and one end of the connecting block is connected to a moving end of a second horizontal linear mechanism, and the second horizontal linear mechanism is installed at the bottom of the supporting plate (301).

8. The wafer film transfer device according to claim 6, characterized in that: The transfer mechanism (300) further comprises a support seat (311) arranged above one end of the workbench (100); the support seat (311) is provided with a through-center and a snap ring (312) rotatably mounted thereon; two symmetrically arranged snap grooves (313) are provided on the inner side of the snap ring (312); when in use, the two ends of the carrier plate (301) fit into the snap grooves (313), and a pressure block (314) is provided in one of the snap grooves (313); a notch (315) is provided on the outer side of the first through groove (303); the pressure block (314) fits into the notch (315) and abuts against the top surface of the limit strip (302).

9. The wafer film transfer device according to claim 8, characterized in that: The bottom of the bearing plate (301) is rotatably mounted in a support ring (316), the support ring (316) is connected to a movable end of a second vertical lifting mechanism, the second vertical lifting mechanism is mounted on a support frame (317), the support frame (317) is movably arranged along the length direction of the workbench (100), the bottom surface of the bearing plate (301) is provided with a first positioning rod (318), a center rod (321) and a support plate (319), the axis of the center rod (321) is located on the rotation axis of the clamping ring (312), and is passed through the support frame (317), when the bearing plate (301) is located at the lowest point of its vertical travel, the first positioning rod (318) is passed through the support frame (317); A second positioning rod (320) is provided at the bottom of the clamping ring (312); when the bearing plate (301) is located at the highest point of its vertical travel, the second positioning rod (320) is inserted into the support plate (319).

10. The wafer film transfer device according to claim 8, characterized in that: Baffles (322) are provided on both sides of the top surface of the support seat (311), and brackets (323) are provided on the baffles (322). The brackets (323) are sleeved on the second screw rod (324), and both ends of the second screw rod (324) are mounted on the convex plate (325). The convex plate (325) is mounted on the support seat (311). Both ends of the second screw rod (324) are sleeved with a third spring (326) and a nut, and the nut is used to abut against the inner side of the bracket (323). Both ends of the third spring (326) abut against the convex plate (325) and the bracket (323) respectively, and are always in a compressed state.

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