Photovoltaic bypass diode module unit and processing method thereof

Abstract

The invention relates to a photovoltaic bypass diode module unit and a processing method thereof, and relates to the technical field of diodes, the photovoltaic bypass diode module unit comprises a first frame, a second frame, an assembling chip and a packaging body, the second frame is provided with a first assembling groove, the first frame is provided with a first assembling block, the first assembling block is inserted into the first assembling groove, and the packaging body is provided with a second assembling groove. The first frame is provided with a second assembling groove, the second frame is provided with a second assembling block, the second assembling block is inserted into the second assembling groove, the packaging body is arranged on the first frame and the second frame in a sleeved mode, and the assembling chip is arranged on the second frame and arranged in the packaging body. And the internal circuit of the first frame is connected with the internal circuit of the second frame in a conducting manner. The device has the effect of improving the production quality of the photovoltaic bypass diode.

Description

Technical Field

[0001] The present invention relates to the technical field of diodes, and in particular to a photovoltaic bypass diode module unit and a processing method thereof. Background Art

[0002] During the use of solar cell modules, some parts may be shielded, which then consumes energy and generates heat as a load. This is the hot spot effect, which has a serious destructive effect on the module. Connecting a bypass diode in parallel at both ends of the solar cell module can effectively prevent the hot spot effect from damaging the cell module. With the development of technologies such as large silicon wafers and double-sided double-glass in the photovoltaic module industry, the power of the module continues to increase, and higher requirements are placed on the current carrying capacity of the diode.

[0003] Common photovoltaic bypass diodes usually include frame one, frame two and a chip. The chip is set on frame one or frame two. Frame one and frame two are placed side by side so that when the internal circuit is turned on, the chip is packaged by injection molding to make a photovoltaic bypass diode.

[0004] However, in the actual production process of the photovoltaic bypass diode, when the frame one and the frame two are placed together and injection-molded, the frame one and the frame two are placed in the injection mold with each other tightly together. During the injection molding, the frame one and the frame two are prone to shaking under the injection pressure in the injection mold, resulting in a gap between the frame one and the frame two after injection molding, resulting in unstable connectivity of the photovoltaic bypass diode circuit, thereby affecting the production quality of the photovoltaic bypass diode. Summary of the invention

[0005] In order to improve the production quality of photovoltaic bypass diodes, the present application provides a photovoltaic bypass diode module unit and a processing method thereof.

[0006] A photovoltaic bypass diode module unit and a processing method thereof provided in the present application adopt the following technical solutions: A photovoltaic bypass diode module unit comprises a first frame, a second frame, an assembly chip and a package body, wherein the second frame is provided with a first assembly groove, the first frame is provided with a first assembly block, the first assembly block is inserted into the first assembly groove, the first frame is provided with a second assembly groove, the second frame is provided with a second assembly block, the second assembly block is inserted into the second assembly groove, the package body is sleeved on the first frame and the second frame, the assembly chip is provided on the second frame and in the package body, and the internal circuit of the first frame is conductively connected to the internal circuit of the second frame.

[0007] By adopting the above technical solution, the first assembly block is inserted into the first assembly groove, and the second assembly block is inserted into the second assembly groove to form a plug-in structure, which can effectively improve the stability of the connection between the first frame and the second frame, and at the same time improve the stability of the circuit conduction between the first frame and the second frame, reduce the possibility of the first frame or the second frame shaking in the mold during the injection molding process, resulting in a gap between the first frame and the second frame after the injection molding package, improve the stability of the connection of the photovoltaic bypass diode circuit, and thus improve the production quality of the photovoltaic bypass diode.

[0008] Preferably, the second assembly block is provided with a limiting block, the first frame is provided with a limiting groove communicating with the second assembly groove, the limiting block is inserted into the limiting groove and abuts against the inner wall of the limiting block.

[0009] By adopting the above technical solution, the limit block is inserted into the limit groove, thereby further improving the stability of the connection between the first frame and the second frame, so as to improve the stability of the internal circuit conduction, thereby improving the stability of the photovoltaic bypass diode circuit connection and the quality of photovoltaic bypass diode production.

[0010] Preferably, the limiting block is provided with an auxiliary card block, the inner wall of the limiting slot is provided with an auxiliary card slot, the auxiliary card block is inserted into the auxiliary card slot, the inner wall of the auxiliary card slot is provided with an elastic sheet, and the auxiliary card block is arranged in contact with the elastic sheet.

[0011] By adopting the above technical solution, the auxiliary card block is inserted into the auxiliary card slot to further improve the stability of the connection between the first frame and the second frame, thereby improving the production quality of the photovoltaic bypass diode. At the same time, the auxiliary card block is fitted with the elastic sheet. The auxiliary card block compresses the elastic sheet to increase the resistance to pulling out the auxiliary card block on the one hand, so as to further improve the stability of the connection between the first frame and the second frame. On the other hand, a plug and socket structure is formed by fitting the elastic sheet and the auxiliary card block, thereby improving the stability of the circuit connection between the first frame and the second frame, thereby improving the production quality of the photovoltaic bypass diode.

[0012] A photovoltaic bypass diode module unit processing method comprises the following steps: Step 1: Process the first frame, the second frame and the internal circuit, and produce the assembled chip; Step 2: Use chip identification and selection equipment to screen and load the assembled chips; Step 3: Assemble the first frame, the second frame and the chip; Step 4: Place the assembled first frame, second frame and assembled chip into an injection mold to form an injection package.

[0013] By adopting the above technical solution, the processing of parts is completed, and the most critical assembly chips are identified and selected, the damaged and defective assembly chips are screened out, and assembly injection molding is performed to complete the processing and production of photovoltaic bypass diodes. At the same time, by screening the assembly chips, the assembly production of unqualified assembly chips is reduced, thereby improving the production quality of photovoltaic bypass diodes.

[0014] A chip identification and selection device for a photovoltaic bypass diode processing method includes a base, a controller and a column arranged on the base, the base is provided with a first mounting block, the first mounting block is detachably provided with a first mounting disk, the base is provided with a first moving component, the first moving component is used to drive the first mounting block to move, the base is provided with a second mounting block, the second mounting block is detachably provided with a second mounting disk, the base is provided with a second moving component, the second moving component is used to drive the second mounting block to move, the column is provided with a camera connected to a controller signal, the column is rotatably provided with a rotating shaft, the column is provided with a rotating driving member connected to the controller signal, the rotating driving member is used to drive the rotating shaft to rotate, the rotating shaft is provided with an adsorption member, the adsorption member is used to adsorb assembled chips, and the controller is used to identify according to an image taken by the camera and control the rotating driving member to rotate to transport the assembled chips.

[0015] By adopting the above technical scheme, the first moving component and the second moving component drive the first mounting plate and the second mounting plate to move horizontally and vertically, so as to drive the first mounting plate and the second mounting plate to move in all directions on the machine base, and at the same time, the rotating shaft rotates, thereby driving the adsorption component to move between the first mounting plate and the second mounting plate, and moving the assembled chip by adsorption. In this process, the chips in the second mounting plate are photographed in sequence by the camera, and the photographed pictures are transmitted to the controller. The controller compares and identifies the chips through the pre-set standard pictures. When the assembled chip in the identification picture is broken, the rotating drive component is controlled not to start and not to move the assembled chip. When it is identified that the assembled chip is intact, the controller controls the rotating drive component to move, thereby moving the assembled chip to the first mounting plate, thereby completing the screening of the assembled chips. The operation is simple and convenient, and it is easy to use.

[0016] Preferably, the second moving assembly includes a third moving motor, a third moving screw, a third moving block, a fourth moving motor, a fourth moving screw and a fourth moving block, the third moving screw being rotatably arranged on the machine base, the third moving motor being arranged on the machine base and the third moving motor shaft being connected to the third moving screw, the third moving block being slidably arranged on the machine base, the third moving screw penetrating the third moving block and being threadedly connected to the third moving block, the fourth moving screw being rotatably arranged on the third moving block, the fourth moving motor being arranged on the third moving block and the fourth moving motor shaft being connected to the fourth moving screw, the fourth moving block being slidably arranged on the third moving block, the fourth moving screw penetrating the fourth moving block and being threadedly connected to the fourth moving block, and the second mounting block being arranged on the fourth moving block.

[0017] By adopting the above technical solution, the third moving motor is started to drive the third moving screw to rotate and then drive the third moving block to move on the machine base, and the fourth moving motor is started to drive the fourth moving screw to rotate so that the fourth moving block moves on the third moving block. The third moving screw and the fourth moving screw are vertically arranged, so that the second mounting plate arranged on the fourth moving block can move horizontally and vertically, so that the assembled chips on the second mounting plate can be captured and identified by the camera below, so as to facilitate the screening of the assembled chips, and the operation is simple and convenient, which improves the convenience of use.

[0018] Preferably, the first moving assembly includes a first moving motor, a first moving screw, a first moving block, a second moving motor, a second moving screw and a second moving block, the first moving screw being rotatably arranged on a machine base, the first moving motor being arranged on the machine base and the first moving motor shaft being connected to the first moving screw, the first moving block being slidably arranged on the machine base, the first moving screw penetrating the first moving block and being threadedly connected to the first moving block, the second moving screw being rotatably arranged on the first moving block, the second moving motor being arranged on the first moving block and the second moving motor shaft being connected to the second moving screw, the second moving block being slidably arranged on the first moving block, the second moving screw penetrating the second moving block and being threadedly connected to the second moving block, and the first mounting block being arranged on the second moving block.

[0019] By adopting the above technical solution, the first moving lead screw and the second moving lead screw are vertically arranged, the first moving motor cooperates with the first moving lead screw to drive the first moving block to move in one direction, and the second moving motor cooperates with the second moving lead screw to drive the second moving block to move in one direction, thereby driving the first mounting plate on the second moving block to move to various positions, so that the assembled chip can be placed in various positions on the first mounting plate, and the operation is simple and convenient.

[0020] Preferably, the second moving assembly includes a first auxiliary block, a second auxiliary block, a first auxiliary screw, a second auxiliary screw, a first auxiliary gear and a second auxiliary gear, the first auxiliary block is slidably arranged on the machine base, the first auxiliary screw is rotatably arranged on the machine base and is connected to the first moving screw, the first auxiliary screw passes through the first auxiliary block and is threadedly connected to the first auxiliary block, the second auxiliary screw is rotatably arranged on the first auxiliary block, the second auxiliary block is slidably arranged on the first auxiliary block, the second auxiliary screw passes through the second auxiliary block and is threadedly connected to the second auxiliary block, the first auxiliary gear and the second auxiliary gear are rotatably arranged on the machine base, the first auxiliary gear is connected to the second moving screw, the second auxiliary gear is connected to the second auxiliary screw, the first auxiliary gear is meshed with the second auxiliary gear, and the second mounting plate is detachably arranged on the second auxiliary block.

[0021] By adopting the above technical scheme, when the first moving motor is started, the first auxiliary screw and the first moving screw are synchronously driven to rotate, thereby synchronously driving the first auxiliary block and the first moving block to move. At the same time, when the second moving motor is started, it drives the second moving screw to rotate while driving the second auxiliary screw to rotate through the transmission of the first auxiliary gear and the second auxiliary gear, thereby synchronously driving the second moving block and the second auxiliary block to move along a connected trajectory. On the one hand, the number of motors is reduced, the cost is reduced, and energy is saved and consumption is reduced. On the other hand, the first mounting plate and the second mounting plate move synchronously, which is convenient for controlling the movement and transportation of assembled chips before and after screening, thereby improving the convenience of use.

[0022] Preferably, the machine base is provided with a placing block, and the placing block is rotatably provided with a positioning rod, and the positioning rod can be abutted against the first mounting plate, the first mounting block is provided with a mounting groove, the first mounting plate is inserted into the mounting groove, and the placing block can be inserted into the mounting groove, and the inner wall of the mounting groove is provided with a moving groove, and a first abutting rod is slidably provided in the moving groove, and an abutting spring connected to the first abutting rod is provided in the moving groove, the placing block is provided with a sliding groove, and a second abutting rod is slidably provided in the sliding groove, and a transmission assembly is provided between the second abutting rod and the positioning rod, and the transmission assembly is used to drive the positioning rod to rotate according to the movement of the second abutting rod, the positioning rod can abut the first mounting plate, the first abutting rod can abut against the second abutting rod and push the second abutting rod to move, and the first abutting rod and the second abutting rod are both made of magnetic material and are magnetically attracted to each other.

[0023] By adopting the above technical scheme, when the screening of the assembled chips on the second mounting plate is completed, the qualified assembled chips are all moved to the first mounting plate, and the second moving motor is started at this time to drive the second moving block to move, and the first mounting block and the first mounting plate are moved synchronously, and the placement block is inserted into the mounting groove under the first mounting plate. During this process, the second abutment rod is attracted to abut against the first abutment rod and pushes the first abutment rod to move in the moving groove and stretch the abutment spring. When the first abutment rod moves and abuts against the inner wall of the moving groove, the first mounting block continues to move so that the placement block continues to penetrate into the mounting groove. During this process, the first abutment rod pushes the second abutment rod to move in the sliding groove and drives the positioning rod to rotate and erect through the transmission assembly. At this time, the second moving motor can be started to drive the first mounting block to move back. During this process, the positioning rod abuts against the first mounting plate so that the first mounting plate gradually separates from the mounting groove together with the placement block, thereby completing the automatic disassembly of the first mounting plate and improving the convenience of use.

[0024] Preferably, the transmission assembly includes a transmission rack, a first transmission gear and a second transmission gear. The transmission rack is slidably arranged in a sliding groove and is connected to a second abutment rod. The first transmission gear and the second transmission gear are both rotatably arranged in the sliding groove and mesh with each other. The first transmission gear and the transmission rack are meshed with each other. The positioning rod is arranged on the second transmission gear. First magnetic sheets are arranged at both ends of the transmission gear. Second magnetic sheets are arranged on the inner walls of both sides of the sliding groove. The first magnetic sheet and the second magnetic sheet are magnetically attracted to each other.

[0025] By adopting the above technical solution, when the placement block is inserted into the installation groove, the first abutment rod pushes the second abutment rod to move, and the second abutment rod pushes the transmission rack to move so that the first magnetic piece at one end of the transmission rack is separated from the second magnetic piece, until the end wall of the transmission rack fits the inner wall of the sliding groove so that the first magnetic piece and the second magnetic piece at the other end of the transmission rack are magnetically attracted to each other. In this process, the transmission rack drives the first transmission gear to rotate, and the rotation of the first transmission gear drives the second transmission gear to rotate, thereby driving the positioning rod to rotate and stand upright. When the placement block is separated from the installation groove, the positioning rod abuts against the first mounting plate and pushes the first mounting plate to separate from the mounting groove. In this process, at the beginning, the sum of the pulling force of the abutment spring recovery and the magnetic force of the first magnetic piece and the second magnetic piece is less than the magnetic force between the first abutment rod and the second abutment rod. Therefore, the first abutment rod moves relatively to restore the abutment spring, and the first abutment The rod continues to move and pushes the abutment spring to compress until the elastic force of the abutment spring recovery is greater than the magnetic force between the first magnetic sheet and the second magnetic sheet but less than the magnetic force between the first abutment rod and the second abutment rod. At this time, the first abutment rod pulls the second abutment rod under the push of the abutment spring to separate the first magnetic sheet at one end of the transmission rack from the second magnetic sheet, and the second abutment rod drives the transmission rack to slide until the first magnetic sheet at the other end of the transmission rack fits into the inner wall of the sliding groove and attracts the second magnetic sheet. At this time, the positioning rod is retracted under the drive of the transmission assembly, and the placement block continues to disengage from the mounting groove, causing the first abutment rod to move and compress the abutment spring until the elastic force of the compression of the abutment spring is greater than the magnetic force between the first abutment rod and the second abutment rod, causing the first abutment rod to separate from the second abutment rod. The operation is simple and convenient, and the erection and retraction of the positioning rod are automatically completed during the movement of the first mounting block, thereby improving the convenience of use.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. By setting a first frame, a second frame, an assembly chip, a package body, a first assembly groove, a second assembly groove, a first assembly block and a second assembly block, the first assembly block on the first frame is inserted into the first assembly groove on the second frame, and the second assembly block on the second frame is inserted into the second assembly groove on the first frame, thereby forming a plug-in structure, thereby improving the stability of the connection between the first frame and the second frame. During injection molding, the package body encapsulates the assembly chip inside. At the same time, the plug-in structure reduces the possibility of shaking of the first frame and the second frame, reduces the possibility of disconnection of the internal circuits of the first frame and the second frame after injection molding, and improves the production quality of photovoltaic bypass diodes; 2. By setting a limit block and a limit groove, the limit block is adapted to be inserted into the limit groove, thereby reducing the possibility of left and right shaking between the first frame and the second frame, further improving the stability of the connection between the first frame and the second frame, and at the same time, the limit block and the inner wall of the limit groove can be connected to the internal circuit, so that the limit block fits the inner wall of the limit groove and connects the internal circuit of the first frame and the second frame at the same time, so as to improve the stability of the internal circuit of the first frame and the second frame, thereby improving the production quality of the photovoltaic bypass diode; 3. By providing an auxiliary card block, an auxiliary card slot and an elastic sheet, the auxiliary card block is inserted into the auxiliary card slot, thereby improving the stability of the connection between the first frame and the second frame, reducing the possibility of separation of the first frame and the second frame, thereby improving the stability of the internal circuit connection between the first frame and the second frame. At the same time, when the auxiliary card block is inserted into the auxiliary card slot, the elastic sheet is squeezed so that the elastic sheet fits the auxiliary card block, and the elastic sheet and the auxiliary card block are both connected to the internal circuit of the frame, thereby forming a plug and socket structure, improving the stability of the circuit connection between the first frame and the second frame, and improving the production quality of photovoltaic bypass diodes. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is an overall schematic diagram of a photovoltaic bypass diode module unit provided in an embodiment of the present application.

[0028] Figure 2 It is a cross-sectional view of a photovoltaic bypass diode module unit provided in Example 1 of the present application.

[0029] Figure 3 It is an overall schematic diagram of a chip identification and selection device provided in Example 1 of the present application.

[0030] Figure 4 It is a cross-sectional view used to reflect the overall structure of the lifting box.

[0031] Figure 5 It is a cross-sectional view of a photovoltaic bypass diode module unit provided in Example 2 of the present application.

[0032] Figure 6 This is a cross-sectional view used to show the internal structure of the gear block.

[0033] Figure 7 It is a cross-sectional view used to reflect the positional relationship between the first abutting rod and the second abutting rod.

[0034] Description of reference numerals: 1. first frame; 11. first assembly block; 12. second assembly slot; 121. limit slot; 122. auxiliary card slot; 124. elastic sheet; 2. second frame; 21. second assembly block; 211. limit block; 212. auxiliary card block; 22. first assembly slot; 23. package body; 24. assembly chip; 3. base; 31. column; 311. rotating shaft; 312. rotating rod; 314. rotating motor; 315. display screen; 316. camera camera; 33, first mounting block; 331, mounting slot; 332, mounting slide slot; 333, extension block; 334, moving slot; 335, second abutment rod; 336, abutment spring; 34, second mounting block; 35, lighting lamp; 36, first mounting plate; 37, second mounting plate; 4, first moving assembly; 41, first moving motor; 42, first moving screw rod; 43, first moving block; 44, second moving motor; 45, second moving screw rod; 46, second moving block ; 5, second moving assembly; 51, third moving motor; 52, third moving screw; 53, third moving block; 54, fourth moving motor; 55, fourth moving screw; 56, fourth moving block; 6, gear block; 61, first auxiliary block; 62, second auxiliary block; 63, first auxiliary screw; 64, second auxiliary screw; 65, first auxiliary gear; 66, second auxiliary gear; 67, matching gear; 68, gear cavity; 7, discharge plate; 71, discharge screw; 71 1. Discharging motor; 72. Discharging block; 721. First discharging rod; 722. Second discharging rod; 73. Lifting cylinder; 731. Lifting plate; 732. Receiving box; 733. Receiving trough; 734. Lifting trough; 8. Placement block; 81. Placement plate; 82. Positioning rod; 83. Sliding groove; 831. First abutting rod; 832. Second magnetic sheet; 9. Transmission assembly; 91. Transmission rack; 911. First magnetic sheet; 92. First transmission gear; 93. Second transmission gear. DETAILED DESCRIPTION

[0035] The following is combined with Figure 1-7 This application is described in further detail.

[0036] Embodiment 1 of the present application discloses a photovoltaic bypass diode module unit. Figure 1 to Figure 2, which comprises a first frame 1, a second frame 2, an assembly chip 24 and a package body 23. The side wall of the first frame 1 is provided with a second assembly groove 12 and a first assembly block 11, the side wall of the second frame 2 is provided with a first assembly groove 22 and a second assembly block 21, the first assembly block 11 is adapted to be inserted into the first assembly groove 22, and the second assembly block 21 is adapted to be inserted into the second assembly groove 12. The package body 23 wraps the first frame 1 and the second frame 2, the assembly chip 24 is arranged on the second assembly block 21 and communicates with the internal circuit of the second frame 2, and the assembly chip 24 is arranged in the package body 23. The second assembly block 21 is integrally fixed with two groups of limit blocks 211, the top wall of the first frame 1 is provided with a limit groove 121 communicating with the second assembly groove 12, and the limit block 211 is adapted to be inserted into the limit groove 121. The bottom wall of the limit block 211 is fixedly provided with an auxiliary card block 212, which is conductive and connected to the internal circuit of the second frame 2 through the limit block 211. The inner wall of the auxiliary card slot 122 is provided with a conductive elastic sheet 124, which is connected to the internal circuit of the first frame 1. The auxiliary card block 212 fits against the elastic sheet 124, thereby connecting the internal circuits of the first frame 1 and the second frame 2. By setting the plug-in structure, the stability of the connection between the first frame 1 and the second frame 2 during the packaging process is improved, thereby improving the stability of the circuit connection between the first frame 1 and the second frame 2 after packaging, and improving the quality of the produced photovoltaic bypass diodes.

[0037] Embodiment 1 of the present application discloses a method for processing a photovoltaic bypass diode module unit, comprising the following steps: Step 1: Processing the first frame 1 and the second frame 2 and the internal circuit, and producing the assembly chip 24; Step 2: Screen and load the assembled chips 24 by using a chip identification and selection device; Step 3: Assemble the assembly chip 24 onto the second frame 2, and assemble the first frame 1 and the second frame 2 so that the internal circuits of the first frame 1 and the second frame 2 are connected; Step 4: Put the assembled first frame 1 , second frame 2 and assembled chip 24 into an injection mold to inject the package body 23 .

[0038] Embodiment 1 of the present application discloses a chip identification and selection device used in the processing of a photovoltaic bypass diode module unit. Figure 3 and Figure 4It includes a base 3, a controller and an L-shaped column 31 fixedly arranged on the surface of the base 3, a rotating shaft 311 is rotatably arranged in the column 31, the rotating shaft 311 passes through the bottom of the protruding part of the column 31, a rotating rod 312 is fixedly arranged on the bottom wall of the rotating shaft 311, the rotating rod 312 is rotatably arranged between the protruding part of the column 31 and the base 3, a suction cup is arranged on the rotating rod 312 as an adsorption part through an air pipe, the air pipe is connected to a vacuum pump (not shown in the figure) connected to the controller signal, a rotating motor 314 connected to the controller signal is arranged inside the column 31 as a rotating driving part, and the rotating shaft of the rotating motor 314 is connected to the rotating shaft 311. The column 31 is provided with two groups of cameras 316 connected to the controller signal. The first mounting block 33 and the second mounting block 34 are slidably provided on the base 3. The first mounting block 33 is detachably provided with a square first mounting plate 36, and the second mounting block 34 is detachably provided with a round second mounting plate 37. The first mounting plate 36 and the second mounting plate 37 are both provided with a plurality of slots (not shown) for placing the assembly chip 24. The base 3 is provided with a first moving component 4 for driving the first mounting block 33 to move, and the base 3 is provided with a second moving component 5 for driving the second mounting block 34 to move. The controller is used to identify and control the rotating motor 314 and the vacuum pump to carry the assembly chip 24 according to the image taken by the camera 316. The top of the column 31 is provided with a display screen 315 connected to the controller signal, and the display screen 315 displays the image taken by the camera 316. The camera 316 takes an image of the assembly chip 24 and transmits it to the controller for image recognition. The controller controls the rotating motor 314 and the vacuum pump to identify and select the assembly chip 24, which is convenient to use.

[0039] To improve the convenience of use, refer to Figure 3The first moving assembly 4 includes a first moving motor 41, a first moving screw 42, a first moving block 43, a second moving motor 44, a second moving screw 45 and a second moving block 46. The first moving screw 42 is rotatably arranged on the surface of the base 3. The first moving screw 42 penetrates the first moving block 43 slidably arranged on the surface of the base 3 and is threadedly connected with the first moving block 43. The first moving motor 41 is fixedly arranged on the base 3 and the rotating shaft of the first moving motor 41 is connected with the first moving screw 42. The second moving screw 45 is rotatably arranged on the first moving block 43 and is perpendicular to the first moving screw 42. The second moving block 46 is slidably arranged on the first moving block 43 and is threadedly penetrated by the second moving screw 45. The second moving motor 44 is fixedly arranged on the first moving block 43 and the rotating shaft of the second moving motor 44 is coaxially fixedly connected with the second moving screw 45. The second moving block 46 is provided with a square mounting groove 331, and the first mounting plate 36 is adapted to be inserted into the mounting groove 331. The controller is connected to the first moving motor 41 and the second moving motor 44 and is used to control the movement of the first mounting plate 36 according to parameters such as time and the number of motor rotations and the image recognition result of the assembly chip 24, so that each grid of the first mounting plate 36 moves to the position where the suction cup moves in sequence. The first moving motor 41 and the second moving motor 44 drive the first mounting plate 36 to move, and the operation is simple and convenient.

[0040] To improve the convenience of use, refer to Figure 3The second moving assembly 5 includes a third moving motor 51, a third moving screw 52, ​​a third moving block 53, a fourth moving motor 54, a fourth moving screw 55 and a fourth moving block 56. The third moving screw 52 is rotatably arranged on the surface of the base 3. The third moving screw 52 penetrates the third moving block 53 slidably arranged on the surface of the base 3 and is threadedly connected with the third moving block 53. The third moving motor 51 is fixedly arranged on the base 3 and the rotating shaft of the third moving motor 51 is connected with the third moving screw 52. The fourth moving screw 55 is rotatably arranged on the third moving block 53 and is perpendicular to the third moving screw 52. The fourth moving block 56 is slidably arranged on the third moving block 53 and is threadedly penetrated by the fourth moving screw 55. The fourth moving motor 54 is fixedly arranged on the third moving block 53 and the rotating shaft of the fourth moving motor 54 is coaxially fixedly connected with the fourth moving screw 55. The fourth moving block 56 is provided with a circular mounting groove 331, and the second mounting plate 37 is adapted to be inserted into the mounting groove 331. The fourth moving block 56 is tilted, the base 3 is provided with an illumination lamp 35, the illumination lamp 35 is located below a group of cameras 316, and the second mounting plate 37 can be moved between the illumination lamp 35 and the cameras 316. The controller is connected to the third moving motor 51 and the fourth moving motor 54 signals and is used to control the movement of the second mounting plate 37 according to parameters such as time and the number of motor rotations. Each grid of the second mounting plate 37 moves to the position where the suction cup moves. The controller controls the rotating motor 314 and the vacuum pump to absorb and move the assembly chip 24 on the second mounting plate 37 that has been inspected and determined to be qualified to the grid of the first mounting plate 36 through the suction cup. In this process, the second mounting plate 37 moves according to the size of the built-in grid, and the first mounting plate 36 moves the distance of the built-in grid size after the assembly chip 24 is determined to be qualified. The operation is simple and convenient, and it is easy to use.

[0041] In order to facilitate the discharging and receiving of materials, refer to Figure 3 and Figure 4The machine base 3 is provided with a discharge plate 7, on which a discharge block 72 is slidably provided, and a discharge screw 71 (the thread of the discharge screw 71 is not shown in the figure) which is threaded through the discharge block 72 is rotatably provided on the discharge plate 7, and a discharge motor 711 connected to the controller signal is fixedly provided on the discharge plate 7, and the rotating shaft of the discharge motor 711 is connected to the discharge screw 71. A first discharge rod 721 is fixedly provided on the discharge block 72, and a second discharge rod 722 which can be abutted against the first discharge rod 721 is provided on the first mounting plate 36. The machine base 3 is provided with a lifting groove 734, in which a lifting plate 731 is slidably provided, and a lifting cylinder 73 connected to the controller signal is provided in the lifting groove 734, and the piston rod of the lifting cylinder 73 is connected to the lifting plate 731, and a material receiving box 732 is provided on the lifting plate 731, and the material receiving box 732 is provided with a plurality of material receiving grooves 733 for the first mounting plate 36 to be placed. In another embodiment, a distance sensor connected to the controller signal can be set on the lifting plate 731, the first moving block 43, the second moving block 46, the third moving block 53, and the fourth moving block 56 to facilitate the controller to control the movement of each component. When the first mounting plate 36 is fully loaded with the assembled chips 24, the controller controls the second moving motor 44 and the first moving motor 41 according to the number of rotations of the first moving motor 41 and the second moving motor 44 to drive the first mounting block 33 to move close to the discharge block 72 and the receiving box 732. At this time, the controller starts the discharge motor 711 to drive the discharge block 72 to move, so that the first discharge rod 721 is against the second discharge rod 722, thereby pushing the first mounting plate 36 out of the mounting groove 331 and into the receiving groove 733 of the receiving box 732. After that, the controller starts the lifting cylinder 73 according to the number of rotations of the discharge motor 711 to rise to a distance equivalent to the height of the receiving groove 733, thereby waiting for the next discharge. The operation is simple and convenient to use.

[0042] Embodiment 2 of the present application discloses a chip identification and selection device used in the processing of a photovoltaic bypass diode module unit. Figures 5 to 7, (the threads on the first movable screw rod 42 and the first auxiliary screw rod 63 are not drawn in the figure) the difference between it and the chip identification and selection device in the first embodiment is that the second mounting plate 37 and the first mounting plate 36 are both square in specifications, the two have different discharge structures and the second movable assembly 5 is different, the second movable assembly 5 in the second embodiment includes a first auxiliary block 61, a second auxiliary block 62, a first auxiliary screw rod 63, a second auxiliary screw rod 64, a first auxiliary gear 65, a second auxiliary gear 66 and a matching gear 67, the first movable screw rod 42 is horizontally rotatably arranged on the machine base 3, and the first movable screw rod 42 is coaxially fixedly connected with the second auxiliary screw rod 64, the first auxiliary block 61 is slidably arranged on the machine base 3 and is threadedly penetrated by the first auxiliary screw rod 63, the second auxiliary block 62 is slidably arranged on the first auxiliary block 61, the second auxiliary screw rod 64 is rotatably arranged on the first auxiliary block 61 and is threadedly penetrated by the second auxiliary block 62, and the second auxiliary screw rod 64 is parallel to the second movable screw rod 45. The surface of the base 3 is provided with a gear block 6 for sliding. The gear block 6 is fixedly connected to the first moving block 43 and the first auxiliary block 61. A gear cavity 68 is provided inside the gear block 6. The first auxiliary gear 65, the second auxiliary gear 66 and the matching gear 67 are all rotatably arranged in the gear cavity 68. The matching gear 67 is meshedly arranged between the first auxiliary gear 65 and the second auxiliary gear 66. The second moving motor 44 is fixedly arranged on the gear block 6. The second moving screw 45 is inserted into the gear cavity 68 and is coaxially fixedly connected to the first auxiliary gear 65. The second auxiliary screw 64 is inserted into the gear cavity 68 and is coaxially fixedly connected to the second auxiliary gear 66. The first mounting plate 36 and the second mounting plate 37 are consistent in size and shape. Through gear transmission, the second moving motor 44 cooperates with the first moving motor 41 to synchronously drive the first mounting plate 36 and the second mounting plate 37 to move synchronously, thereby reducing costs and saving energy.

[0043] To improve the convenience of use, refer to Figure 5 and Figure 7The first mounting block 33 and the second mounting block 34 are both provided with mounting grooves 332 on the side walls of the mounting grooves 331, and the first mounting plate 36 and the second mounting plate 37 can be inserted into the mounting grooves 332. The base 3 is provided with a placement plate 81, and two placement blocks 8 are fixedly provided on the side walls of the placement plate 81. The placement block 8 is provided with a sliding groove 83 at one end away from the placement plate 81, and a positioning rod 82 is rotatably provided in the sliding groove 83, and a second abutting rod 335 is slidably provided in the sliding groove 83. A transmission assembly 9 is provided between the second abutting rod 335 and the positioning rod 82 for driving the positioning rod 82 to rotate according to the movement of the second abutting rod 335, and the positioning rod 82 can abut the first mounting plate 36 or the second mounting plate 37. The first mounting block 33 and the second mounting block 34 are both fixed as a whole and are also provided with an extension block 333. The extension block 333 is provided with a moving groove 334, the moving groove 334 is T-shaped and a T-shaped second abutting rod 335 is slidably arranged in the moving groove 334, and an abutting spring 336 connected to the second abutting rod 335 is also arranged in the moving groove 334. The first abutting rod 831 can abut against the second abutting rod 335 and push the second abutting rod 335 to move. The first abutting rod 831 and the second abutting rod 335 are both made of magnetic materials and are magnetically attracted to each other. The transmission assembly 9 includes a transmission rack 91, a first transmission gear 92 and a second transmission gear 93. The transmission rack 91 is slidably arranged in the sliding groove 83 and is integrally fixedly connected with the second abutting rod 335. Both ends of the transmission gear are provided with a fixed first magnetic sheet 911, and the inner walls on both sides of the sliding groove 83 are fixedly provided with a second magnetic sheet 832 that can be magnetically attracted to the first magnetic sheet 911. The first transmission gear 92 and the second transmission gear 93 are both rotatably disposed in the sliding groove 83 and mesh with each other. The first transmission gear 92 and the transmission rack 91 mesh with each other, and the positioning rod 82 is disposed on the second transmission gear 93 .

[0044] Reference Figure 5 and Figure 7The controller determines that the screening of the assembled chips 24 on the first mounting plate 36 and the second mounting plate 37 is completed according to the number of revolutions of the first moving motor 41 and the second moving motor 44. Then, the controller starts the first moving motor 41 and the second moving motor 44 to drive the first mounting block 33 and the second mounting block 34 to move so that the placement block 8 is inserted into the mounting groove 331 below the first mounting plate 36 or the second mounting plate 37. In this process, the first abutment rod 831 and the second abutment rod 335 are pushed and the spring magnet and other components are cooperated to drive the positioning through the transmission assembly 9. When the rod 82 is erected, the controller determines that the placement block 8 is inserted into the installation groove 331 according to the number of rotations of the shaft of the second moving motor 44, and starts the second moving motor 44 to rotate in the opposite direction, so that the placement block 8 is pulled out of the installation groove 331, and the first installation plate 36 or the second installation plate 37 is left on the placement block 8 through the positioning rod 82. Through the relative movement of the placement block 8 and the inner wall of the installation groove 331, with the cooperation of the first abutment rod 831 and the second abutment rod 335 and the spring magnet, the positioning rod 82 is driven to be flat through the transmission assembly 9 to complete the discharging, and the operation is simple and convenient.

[0045] Taking Example 1 as an example, the implementation principle of a photovoltaic bypass diode module unit and its processing method of the present application is: by setting a first assembly block 11 inserted into the first assembly groove 22, a second assembly block 21 inserted into the second assembly groove 12, and by inserting the limit block 211 into the limit groove 121, and inserting the auxiliary card block 212 into the auxiliary card slot 122 and other structures to strengthen the stability of the connection between the first frame 1 and the second frame 2, so as to reduce the possibility of relative movement of the first frame 1 and the second frame 2 during the injection molding packaging process, thereby reducing the possibility of non-conduction of the internal circuit of the produced photovoltaic bypass diode, and at the same time, by screening the assembly chip 24 to ensure the performance of the assembly chip 24, and cooperating with the auxiliary card block 212 to resist and connect the elastic sheet 124, thereby further improving the stability of the normal conduction of the internal circuit of the photovoltaic bypass diode, thereby improving the production quality of the photovoltaic bypass diode.

[0046] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A photovoltaic bypass diode module unit, characterized in that: The invention comprises a first frame (1), a second frame (2), an assembly chip (24) and a packaging body (23); the second frame (2) is provided with a first assembly groove (22); the first frame (1) is provided with a first assembly block (11), the first assembly block (11) is inserted into the first assembly groove (22); the first frame (1) is provided with a second assembly groove (12); the second frame (2) is provided with a second assembly block (21), the second assembly block (21) is inserted into the second assembly groove (12); the packaging body (23) is sleeved on the first frame (1) and the second frame (2); the assembly chip (24) is provided on the second frame (2) and in the packaging body (23); the internal circuit of the first frame (1) is electrically connected to the internal circuit of the second frame (2).

2. A photovoltaic bypass diode module unit according to claim 1, characterized in that: The second assembly block (21) is provided with a limiting block (211), the first frame (1) is provided with a limiting groove (121) communicating with the second assembly groove (12), and the limiting block (211) is inserted into the limiting groove (121) and abuts against the inner wall of the limiting block (211).

3. A photovoltaic bypass diode module unit according to claim 2, characterized in that: The limiting block (211) is provided with an auxiliary card block (212); the inner wall of the limiting slot (121) is provided with an auxiliary card slot (122); the auxiliary card block (212) is inserted into the auxiliary card slot (122); the inner wall of the auxiliary card slot (122) is provided with an elastic sheet (124); and the auxiliary card block (212) is arranged in contact with the elastic sheet (124).

4. A processing method for producing a photovoltaic bypass diode module unit according to claim 1, characterized in that: The steps include: The first step: processing the first frame (1) and the second frame (2) and the internal circuit, and producing the assembly chip (24); Step 2: Screening and loading the assembled chips (24) by using a chip identification and selection device; Step 3: assembling the first frame (1), the second frame (2) and the assembly chip (24); Step 4: Place the assembled first frame (1), second frame (2) and assembled chip (24) into an injection mold to form an injection-molded package (23).

5. A chip identification and selection device, characterized in that: A photovoltaic bypass diode module processing method as described in claim 4, comprising a machine base (3), a controller and a column (31) arranged on the machine base (3), wherein the machine base (3) is provided with a first mounting block (33), and the first mounting block (33) is detachably provided with a first mounting plate (36), the machine base (3) is provided with a first moving component (4), and the first moving component (4) is used to drive the first mounting block (33) to move, the machine base (3) is provided with a second mounting block (34), and the second mounting block (34) is detachably provided on a second mounting plate (37), and the machine base (3) is provided with a second moving component ( 5), the second moving component (5) is used to drive the second mounting block (34) to move, the column (31) is provided with a camera (316) connected to the controller signal, the column (31) is rotatably provided with a rotating shaft (311), the column (31) is provided with a rotating driving member connected to the controller signal, the rotating driving member is used to drive the rotating shaft (311) to rotate, the rotating shaft (311) is provided with an adsorption member, the adsorption member is used to adsorb the assembled chip (24), the controller is used to identify according to the image taken by the camera (316) and control the rotation of the rotating driving member to transport the assembled chip (24).

6. A chip identification and selection device according to claim 5, characterized in that: The second moving assembly (5) comprises a third moving motor (51), a third moving screw (52), a third moving block (53), a fourth moving motor (54), a fourth moving screw (55) and a fourth moving block (56); the third moving screw (52) is rotatably arranged on the machine base (3); the third moving motor (51) is arranged on the machine base (3) and the rotating shaft of the third moving motor (51) is connected to the third moving screw (52); the third moving block (53) is slidably arranged on the machine base (3); the third moving screw (52) passes through the third moving block (53) and is threadedly connected to the third moving block (53); the fourth moving screw rod (55) is rotatably arranged on the third moving block (53); the fourth moving motor (54) is arranged on the third moving block (53) and the rotating shaft of the fourth moving motor (54) is connected to the fourth moving screw rod (55); the fourth moving block (56) is slidably arranged on the third moving block (53); the fourth moving screw rod (55) passes through the fourth moving block (56) and is threadedly connected to the fourth moving block (56); and the second mounting block (34) is arranged on the fourth moving block (56).

7. The chip identification and selection device according to claim 5, characterized in that: The first moving assembly (4) comprises a first moving motor (41), a first moving screw (42), a first moving block (43), a second moving motor (44), a second moving screw (45) and a second moving block (46); the first moving screw (42) is rotatably arranged on the machine base (3); the first moving motor (41) is arranged on the machine base (3) and the rotating shaft of the first moving motor (41) is connected to the first moving screw (42); the first moving block (43) is slidably arranged on the machine base (3); the first moving screw (42) passes through the first moving block (43) and is threadedly connected to the first moving block (43); the second moving screw (45) is rotatably arranged on the first moving block (43); the second moving motor (44) is arranged on the first moving block (43) and the rotating shaft of the second moving motor (44) is connected to the second moving screw (45); the second moving block (46) is slidably arranged on the first moving block (43); the second moving screw (45) passes through the second moving block (46) and is threadedly connected to the second moving block (46); and the first mounting block (33) is arranged on the second moving block (46).

8. The chip identification and selection device according to claim 7, characterized in that: The second moving assembly (5) comprises a first auxiliary block (61), a second auxiliary block (62), a first auxiliary screw rod (63), a second auxiliary screw rod (64), a first auxiliary gear (65) and a second auxiliary gear (66); the first auxiliary block (61) is slidably arranged on the machine base (3); the first auxiliary screw rod (63) is rotatably arranged on the machine base (3) and is connected to the first moving screw rod (42); the first auxiliary screw rod (63) passes through the first auxiliary block (61) and is threadedly connected to the first auxiliary block (61); the second auxiliary screw rod (64) is rotatably arranged on the first auxiliary block (61); The second auxiliary block (62) is slidably arranged on the first auxiliary block (61); the second auxiliary screw rod (64) passes through the second auxiliary block (62) and is threadedly connected to the second auxiliary block (62); the first auxiliary gear (65) and the second auxiliary gear (66) are rotatably arranged on the machine base (3); the first auxiliary gear (65) is connected to the second movable screw rod (45); the second auxiliary gear (66) is connected to the second auxiliary screw rod (64); the first auxiliary gear (65) is meshed with the second auxiliary gear (66); and the second mounting plate (37) is detachably arranged on the second auxiliary block (62).

9. The chip identification and selection device according to claim 7, characterized in that: The machine base (3) is provided with a placement block (8), and the placement block (8) is rotatably provided with a positioning rod (82), and the positioning rod (82) can abut against the first mounting plate (36), and the first mounting block (33) is provided with a mounting groove (331), and the first mounting plate (36) is inserted into the mounting groove (331), and the placement block (8) can be inserted into the mounting groove (331), and the inner wall of the mounting groove (331) is provided with a movable groove (334), and a first abutting rod (831) is slidably provided in the movable groove (334), and an abutting spring (336) connected to the first abutting rod (831) is provided in the movable groove (334), and the The placement block (8) is provided with a sliding groove (83), and a second abutment rod (335) is slidably provided in the sliding groove (83). A transmission assembly (9) is provided between the second abutment rod (335) and the positioning rod (82). The transmission assembly (9) is used to drive the positioning rod (82) to rotate according to the movement of the second abutment rod (335). The positioning rod (82) can abut against the first mounting plate (36). The first abutment rod (831) can abut against the second abutment rod (335) and push the second abutment rod (335) to move. The first abutment rod (831) and the second abutment rod (335) are both made of magnetic materials and are magnetically attracted to each other.

10. A chip identification and selection device according to claim 9, characterized in that: The transmission assembly (9) comprises a transmission rack (91), a first transmission gear (92) and a second transmission gear (93); the transmission rack (91) is slidably arranged in a sliding groove (83) and is connected to a second abutting rod (335); the first transmission gear (92) and the second transmission gear (93) are both rotatably arranged in the sliding groove (83) and mesh with each other; the first transmission gear (92) and the transmission rack (91) are meshed with each other; the positioning rod (82) is arranged on the second transmission gear (93); first magnetic sheets (911) are arranged at both ends of the transmission gear; second magnetic sheets (832) are arranged on the inner walls of both sides of the sliding groove (83); the first magnetic sheet (911) and the second magnetic sheet (832) are magnetically attracted to each other.

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