A simultaneous dual-polarization TR module and its manufacturing method

Abstract

The present invention relates to the field of phased array antennas, and discloses a simultaneous dual-polarization TR module and a preparation method thereof. Among them, the TR module includes: a PCB multi-layer antenna board; the PCB multi-layer antenna board includes: a V polarization layer and an H polarization layer; a first multifunctional chip for amplifying and adjusting the amplitude and phase of the signal of the V polarization link is arranged in the V polarization layer, and a second multifunctional chip for amplifying and adjusting the amplitude and phase of the signal of the H polarization link is arranged in the H polarization layer, and the second multifunctional chip is located directly below the first multifunctional chip; the first multifunctional chip is connected to a first RF insulator, and the first RF insulator is connected to the V polarization port of the antenna; the second multifunctional chip is connected to a second RF insulator, and the second RF insulator is connected to the H polarization port of the antenna. The present invention has higher integration, smaller size and lighter weight, reduces system complexity and signal transmission loss, and has higher production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of phased array antennas, and more particularly, to a simultaneous dual-polarization TR module and a preparation method thereof. Background Art

[0002] Existing TR modules that can achieve simultaneous dual polarization include brick-type TR modules. By increasing the length of the TR module to place two polarized TR channels, the following defects exist: First, compared with single-polarization TR modules, the number of required TR channels doubles, resulting in an increase in module size and a decrease in integration. Second, the low integration requires a large number of electrical and mechanical connections during system use, and the number and complexity of software control interfaces also increase accordingly, leading to an increase in system complexity. Third, since both polarization links are connected to the antenna, it is necessary to increase the isolation between TR channels by staggering the two polarization links, but this will increase the length of the TR module, resulting in an increase in the signal transmission path, and thus increasing the signal transmission loss, affecting the performance and efficiency of the system. Fourth, the low integration results in more components being required for assembling the simultaneous dual-polarization TR module, reducing the production efficiency.

[0003] In view of this, the present application is specifically proposed. Summary of the Invention

[0004] The technical problem to be solved by the present invention is that the existing TR modules that can achieve simultaneous dual polarization have large size, high system complexity, large signal transmission loss, and low production efficiency.

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] In a first aspect, a simultaneous dual-polarization TR module is provided, including: a PCB multi-layer antenna board; the PCB multi-layer antenna board includes: a V polarization layer and an H polarization layer; a first multifunctional chip for amplifying and adjusting the amplitude and phase of the signal of the V polarization link is arranged in the V polarization layer, and a second multifunctional chip for amplifying and adjusting the amplitude and phase of the signal of the H polarization link is arranged in the H polarization layer, and the second multifunctional chip is located directly below the first multifunctional chip; the first multifunctional chip is connected to a first radio frequency insulator, and the first radio frequency insulator is connected to the V polarization port of the antenna; the second multifunctional chip is connected to a second radio frequency insulator, and the second radio frequency insulator is connected to the H polarization port of the antenna.

[0007] Furthermore, the V-polarization layer is located on the top layer of the PCB multi-layer antenna board, and the H-polarization layer is located on the bottom layer of the PCB multi-layer antenna board; the V-polarization layer further includes: a first blind slot with an upward opening; the H-polarization layer further includes: a second blind slot with a downward opening; the first multi-functional chip is located in the first blind slot, and the second multi-functional chip is located in the second blind slot.

[0008] Furthermore, the V-polarization layer further includes: a first wave-absorbing material, and the H-polarization layer further includes: a second wave-absorbing material; the second blind slot has a blind slot step; the first wave-absorbing material covers the opening of the first blind slot and is pasted on the upper surface of the V-polarization layer; the second wave-absorbing material covers the opening of the second blind slot and is pasted on the blind slot step.

[0009] Furthermore, the PCB multi-layer antenna board further includes: a shielding layer and isolation ground vias; the shielding layer is located between the V-polarization layer and the H-polarization layer; the isolation ground vias are arranged inside the PCB multi-layer antenna board.

[0010] Furthermore, the simultaneous dual-polarization TR module further includes: a cavity; the PCB multi-layer antenna board is welded inside the cavity; both the first radio frequency insulator and the second radio frequency insulator are welded on the cavity.

[0011] Furthermore, the simultaneous dual-polarization TR module further includes: a label control device; the label control device is located inside the cavity and is connected to the upper surface of the V-polarization layer.

[0012] Furthermore, the simultaneous dual-polarization TR module further includes: a cover plate; the cover plate is welded on the top of the cavity.

[0013] Furthermore, the simultaneous dual-polarization TR module further includes: a radio frequency SMP connector; the radio frequency SMP connector is embedded in the cover plate and is connected to the PCB multi-layer antenna board.

[0014] Second aspect, a preparation method of a simultaneous dual-polarization TR module is provided, including the following steps: S1: Solder a first multifunctional chip on the top layer of a PCB multi-layer antenna board, and solder a second multifunctional chip on the bottom layer of the PCB multi-layer antenna board, such that the second multifunctional chip is directly below the first multifunctional chip; the first multifunctional chip is used for amplifying and adjusting the amplitude and phase of signals of the V polarization link, and the second multifunctional chip is used for amplifying and adjusting the amplitude and phase of signals of the H polarization link; S2: Connect the first multifunctional chip to a first RF insulator, and connect the first RF insulator to the V polarization port of the antenna; connect the second multifunctional chip to a second RF insulator, and connect the second RF insulator to the H polarization port of the antenna.

[0015] Further, before the step S1, the following steps are further included: Process a first blind via on the top layer of the PCB multi-layer antenna board, and process a second blind via with a step on the bottom layer of the PCB multi-layer antenna board, such that the second blind via is directly below the first blind via; Solder the first RF insulator and the second RF insulator on a cavity; Assemble an RF SMP connector on a cover plate.

[0016] Further, the method for soldering the first multifunctional chip and the second multifunctional chip is: Use a reflow soldering process to solder the first multifunctional chip in the first blind via, and use the reflow soldering process to solder the second multifunctional chip in the second blind via.

[0017] Further, after the step S1 and before the step S2, the following steps are further included: Cover a first wave-absorbing material at the opening of the first blind via, bond the edge of the first wave-absorbing material to the upper surface of the PCB multi-layer antenna board, cover a second wave-absorbing material at the opening of the second blind via, bond the edge of the second wave-absorbing material to the step of the second blind via; Solder the PCB multi-layer antenna board with the first wave-absorbing material and the second wave-absorbing material in the cavity.

[0018] Further, after the step S2, the following steps are further included: Solder the cover plate on the top of the cavity, and connect the RF SMP connector to the PCB multi-layer antenna board.

[0019] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0020] 1. It makes full use of the thickness of the PCB multi-layer antenna board, realizes the hierarchical arrangement of the V polarization mode and the H polarization mode in the longitudinal space, and can achieve the dual-polarization function within the size of a single-polarization TR module. First, compared with the traditional dual-polarization TR module that cross-arranges the V polarization link and the H polarization link on the same layer, it has higher integration, smaller size and lighter weight. The hierarchical arrangement can also reduce the mutual interference between the two polarization modes. Second, the high integration also makes it unnecessary to carry out a large number of electrical connections and mechanical connections when the system is used, that is, it reduces the system complexity. Third, the hierarchical arrangement can also shorten the signal transmission path and reduce the signal transmission loss, that is, it can avoid increasing the length of the TR module by staggering the two polarization links on the same layer. Fourth, the high integration makes the connection and disassembly inside the TR component more convenient, so there are fewer assembly processes in the production process of the dual-polarization TR module and the production efficiency is higher.

[0021] 2. By respectively arranging blind slots for embedding multi-functional chips in the V polarization layer and the H polarization layer, cooperating with the shielding layer and isolation ground holes of the PCB multi-layer antenna board, and the wave-absorbing material covering the surface of the multi-functional chip, signal interference and crosstalk phenomena can be avoided, and the isolation degree between the two polarization channels can be improved; at the same time, the blind slot design also makes use of the longitudinal space of the PCB multi-layer antenna board to improve the integration of the dual-polarization TR module.

[0022] The double-sided blind slot design provides the possibility for the embedded assembly of the wave-absorbing material, and the wave-absorbing material in the H polarization layer does not exceed the PCB multi-layer antenna board, so that there is a better fit between the PCB multi-layer antenna board and the cavity, realizing better grounding and shielding. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0024] Figure 1 It is a cross-sectional view of the simultaneous dual-polarization TR module provided by the embodiment of the present invention;

[0025] Figure 2 It is a cross-sectional view of the PCB multi-layer antenna board provided by the embodiment of the present invention;

[0026] Figure 3 It is a plan view of the V polarization layer provided by the embodiment of the present invention;

[0027] Figure 4 It is a plan view of the H polarization layer provided by the embodiment of the present invention.

[0028] Reference numerals in the drawings and corresponding component names:

[0029] 1 - PCB multi - layer antenna board, 2 - cavity, 3 - label control device, 4 - cover plate, 5 - RF SMP connector, 11 - V - polarization layer, 12 - H - polarization layer, 13 - shielding layer, 14 - isolation ground hole, 111 - first multi - functional chip, 112 - first RF insulator, 113 - first blind slot, 114 - first wave - absorbing material, 121 - second multi - functional chip, 122 - second RF insulator, 123 - second blind slot, 124 - second wave - absorbing material. Detailed implementation manners

[0030] To make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below in conjunction with the embodiments and the drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and do not limit the present invention.

[0031] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is obvious to those of ordinary skill in the art that the present invention does not have to be practiced with these specific details. In other embodiments, well - known structures, circuits, materials or methods are not specifically described to avoid obscuring the present invention.

[0032] Throughout the specification, the reference to "one embodiment", "an embodiment", "one example" or "an example" means that the specific features, structures or characteristics described in connection with the embodiment or example are included in at least one embodiment of the present invention. Therefore, the phrases "one embodiment", "an embodiment", "one example" or "an example" appearing throughout the specification do not necessarily all refer to the same embodiment or example. In addition, the specific features, structures or characteristics can be combined in any suitable combination and / or sub - combination in one or more embodiments or examples. In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0033] In the description of the present invention, the orientation or positional relationship indicated by terms such as "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present invention.

[0034] Embodiment: As Figure 1As shown, a simultaneous dual-polarization TR module has a PCB multi-layer antenna board 1, a cavity 2, a label control device 3, a cover plate 4, and a radio frequency SMP connector 5. As Figure 2 shown, the PCB multi-layer antenna board 1 has a V polarization layer 11 on the top layer, a shielding layer 13 in the middle layer, and an H polarization layer 12 on the bottom layer. Further, the V polarization layer 11 has a plurality of V polarization channels, the H polarization layer 12 has a plurality of H polarization channels, and the H polarization channels are directly below the V polarization channels and correspond to the V polarization channels one by one. For a more concise illustration, Figure 1 only the cross-sectional structure of one of the V polarization channels and the cross-sectional structure of the H polarization channel corresponding to the V polarization channel are shown. The V polarization channel includes a first blind groove 113, a first multifunctional chip 111 for amplifying and adjusting the amplitude and phase of the signal of the V polarization link, and a first wave-absorbing material 114 for shielding signal interference. Figure 2 In, SOC on the first multifunctional chip 111 represents a system-on-chip. Among them, the opening of the first blind groove 113 faces upward, the first multifunctional chip 111 is welded in the first blind groove 113 by a reflow soldering process, the first wave-absorbing material 114 covers the opening of the first blind groove 113, and the edge of the first wave-absorbing material 114 is bonded to the upper surface of the PVB multi-layer antenna board. Further, the H polarization channel includes a second blind groove 123 with a step, a second multifunctional chip 121 for amplifying and adjusting the amplitude and phase of the signal of the H polarization link, and a second wave-absorbing material 124 for shielding signal interference. Figure 2 In, SOC on the second multifunctional chip 121 represents a system-on-chip. Among them, the opening of the second blind groove 123 faces upward, the second multifunctional chip 121 is welded in the second blind groove 123 by a reflow soldering process and is directly below the first multifunctional chip 111, the second wave-absorbing material 124 covers the opening of the second blind groove 123, and the edge of the second wave-absorbing material 124 is bonded to the step of the second blind groove 123. In addition, the PCB multi-layer antenna board 1 also has Figure 2 the isolation ground holes 14 shown for improving the isolation of the TR module.

[0035] Continue to refer to as Figure 1 , a first radio frequency insulator 112 and a second radio frequency insulator 122 are welded on the cavity 2. The above-mentioned PCB multi-layer antenna board 1 with the first blind groove 113, the second blind groove 123, the first multifunctional chip 111, the second multifunctional chip, the first wave-absorbing material 114, and the second wave-absorbing material 124 is welded in the cavity 2, and the first multifunctional chip 111 is connected to the first radio frequency insulator 112 according to Figure 3 shown connection method, and the second multifunctional chip 121 is connected to the second radio frequency insulator 122 according to Figure 4The connection method shown is connected to the second RF insulator 122. After the first RF insulator 112 is connected to the first functional chip, it is connected to the V polarization port of the antenna. After the second RF insulator 122 is connected to the second multifunctional chip, it is connected to the H polarization port of the antenna. In addition to the above-mentioned PVB multi-layer antenna board, the cavity 2 also includes a label control device 3, and the label control device 3 is connected to the upper surface of the PCB multi-layer antenna board 1.

[0036] Continue to refer to Figure 1 , a cover plate 4 is welded to the top of the above-mentioned cavity 2, and an RF SMP connector 5 is configured in the cover plate 4, and the RF SMP connector 5 is connected to the PCB multi-layer antenna board 1.

[0037] In summary, a simultaneous dual-polarization TR module proposed in this embodiment makes full use of the thickness of the PCB multi-layer antenna board, and realizes a hierarchical layout of the V polarization mode and the H polarization mode in the longitudinal space, and can realize the dual-polarization function within the size of a single-polarization TR module. First, compared with the traditional dual-polarization TR module in which the V polarization link and the H polarization link are cross-arranged on the same layer, it has higher integration, smaller size and lighter weight. The hierarchical layout can also reduce the mutual interference between the two polarization modes; second, the high integration also enables the system to use without a large number of electrical connections and mechanical connections, that is, reduces the system complexity; third, the hierarchical layout can also shorten the signal transmission path and reduce the signal transmission loss, that is, it can avoid increasing the length of the TR module by staggering the two polarization links on the same layer; fourth, the high integration makes the connection and disassembly inside the TR component more convenient, so there are fewer assembly processes in the production process of the dual-polarization TR module and higher production efficiency. In addition, by respectively arranging blind slots for embedding multifunctional chips in the V polarization layer and the H polarization layer, cooperating with the shielding layer and isolation via holes of the PCB multi-layer antenna board, and the wave-absorbing material covering the surface of the multifunctional chip, signal interference and crosstalk phenomena can be avoided, and the isolation degree between the two polarization channels can be improved; at the same time, the blind slot design also utilizes the longitudinal space of the PCB multi-layer antenna board to improve the integration of the dual-polarization TR module.

[0038] The second aspect of this embodiment provides a preparation method for a simultaneous dual-polarization TR module, including the following steps:

[0039] Step 1: Process a first blind slot on the top layer of the PCB multi-layer antenna board, and process a second blind slot with a step on the bottom layer of the PCB multi-layer antenna board, so that the second blind slot is directly below the first blind slot.

[0040] Step 2: Weld the first RF insulator and the second RF insulator to the cavity.

[0041] Step 3: Assemble the RF SMP connector on the cover plate.

[0042] Step 4: Use the reflow soldering process to solder the first multifunctional chip in the first blind slot, and use the reflow soldering process to solder the second multifunctional chip in the second blind slot, so that the second multifunctional chip is directly below the first multifunctional chip. Among them, the first multifunctional chip is used to amplify and adjust the amplitude and phase of the signal of the V polarization link, and the second multifunctional chip is used to amplify and adjust the amplitude and phase of the signal of the H polarization link.

[0043] Step 5: Perform PCBA testing on the PCB multi-layer antenna board processed in Step 4; after the testing is completed, cover the opening of the first blind slot with the first wave-absorbing material, bond the edge of the first wave-absorbing material to the upper surface of the PCB multi-layer antenna board, cover the opening of the second blind slot with the second wave-absorbing material, and bond the edge of the second wave-absorbing material to the step of the second blind slot.

[0044] Step 6: Solder the label control device on the upper surface of the PCB multi-layer antenna board.

[0045] Step 7: Solder the PCB multi-layer antenna board processed in Step 6 into the cavity processed in Step 2, connect the first multifunctional chip to the first RF insulator, connect the first RF insulator to the V polarization port of the antenna, and connect the second multifunctional chip to the second RF insulator, and connect the second RF insulator to the H polarization port of the antenna.

[0046] Step 8: Solder the cover plate processed in Step 3 on the top of the cavity, and connect the RF SMP connector to the PCB multi-layer antenna board to obtain the simultaneously dual-polarized TR module described in this embodiment.

[0047] Step 9: Perform electrical performance index testing on the simultaneously dual-polarized TR module.

[0048] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A simultaneous dual-polarization TR module, characterized in that Including: A PCB multi-layer antenna board (1); the PCB multi-layer antenna board (1) includes: a V polarization layer (11) and an H polarization layer (12); a first multi-functional chip (111) for amplifying and adjusting the amplitude and phase of the signal of the V polarization link is arranged in the V polarization layer (11), and a second multi-functional chip (121) for amplifying and adjusting the amplitude and phase of the signal of the H polarization link is arranged in the H polarization layer (12), and the second multi-functional chip (121) is directly below the first multi-functional chip (111); the first multi-functional chip (111) is connected to a first RF insulator (112), and the first RF insulator (112) is connected to the V polarization port of the antenna; the second multi-functional chip (121) is connected to a second RF insulator (122), and the second RF insulator (122) is connected to the H polarization port of the antenna; The V polarization layer (11) further includes: a first blind groove (113) with an upward opening; the H polarization layer (12) further includes: a second blind groove (123) with a downward opening; the first multi-functional chip (111) is located in the first blind groove (113), and the second multi-functional chip (121) is located in the second blind groove (123); The V polarization layer (11) further includes: a first wave-absorbing material (114), and the H polarization layer (12) further includes: a second wave-absorbing material (124); the first wave-absorbing material (114) covers the opening of the first blind groove (113), and the second wave-absorbing material (124) covers the opening of the second blind groove (123).

2. The simultaneous dual-polarized TR module according to claim 1, wherein The V polarization layer (11) is located at the top layer of the PCB multi-layer antenna board (1), and the H polarization layer is located at the bottom layer of the PCB multi-layer antenna board (1).

3. The simultaneous dual-polarized TR module according to claim 2, characterized in that The first wave-absorbing material (114) is pasted on the upper surface of the V polarization layer (11); the second blind groove (123) has a blind groove step; the second wave-absorbing material (124) is pasted on the blind groove step.

4. A simultaneous dual-polarized TR module according to any one of claims 1-3, characterized in that, The PCB multi-layer antenna board (1) further includes: a shielding layer (13) and isolation ground vias (14); the shielding layer (13) is located between the V polarization layer (11) and the H polarization layer (12); the isolation ground vias (14) are arranged in the PCB multi-layer antenna board (1).

5. A simultaneous dual-polarized TR module according to any one of claims 1-3, characterized in that Also including: A cavity (2); the PCB multi-layer antenna board (1) is welded in the cavity (2); Both the first RF insulator and the second RF insulator are welded on the cavity (2).

6. The simultaneous dual-polarized TR module according to claim 5, wherein Also including: A label control device (3); the label control device (3) is located in the cavity (2), and the label control device (3) is connected to the upper surface of the V polarization layer (11).

7. A simultaneously dual-polarized TR module according to claim 5, wherein Also including: A cover plate (4); the cover plate (4) is welded on the top of the cavity (2).

8. A simultaneous dual-polarization TR module according to claim 7, characterized in that Also including: Radio frequency SMP connector (5); the radio frequency SMP connector (5) is embedded in the cover plate (4), and the radio frequency SMP connector (5) is connected to the PCB multi-layer antenna board (1).

9. A preparation method of a simultaneous dual-polarization TR module, characterized in that, It includes the following steps: S1: Weld the first multi-functional chip on the top layer of the PCB multi-layer antenna board, and weld the second multi-functional chip on the bottom layer of the PCB multi-layer antenna board, so that the second multi-functional chip is directly below the first multi-functional chip; the first multi-functional chip is used to amplify and adjust the amplitude and phase of the signal of the V polarization link, and the second multi-functional chip is used to amplify and adjust the amplitude and phase of the signal of the H polarization link; S2: Connect the first multi-functional chip to the first radio frequency insulator, and connect the first radio frequency insulator to the V polarization port of the antenna; connect the second multi-functional chip to the second radio frequency insulator, and connect the second radio frequency insulator to the H polarization port of the antenna; Before the step S1, it further includes the following steps: Process a first blind groove on the top layer of the PCB multi-layer antenna board, and process a second blind groove on the bottom layer of the PCB multi-layer antenna board; The method of welding the first multi-functional chip and the second multi-functional chip is: Weld the first multi-functional chip in the first blind groove, and weld the second multi-functional chip in the second blind groove; Before the step S2 after the step S1, it further includes the following steps: Cover a first wave-absorbing material at the opening of the first blind groove, and cover a second wave-absorbing material at the opening of the second blind groove.

10. The preparation method of a simultaneous dual-polarization TR module according to claim 9, characterized in that The second blind groove has a blind groove step; the second blind groove is directly below the first blind groove; Before the step S1, it further includes the following steps: Weld the first radio frequency insulator and the second radio frequency insulator on the cavity; Assemble the radio frequency SMP connector on the cover plate; The process of welding the first multi-functional chip and the second multi-functional chip is: Reflow soldering process; Before the step S2 after the step S1, it further includes the following steps: Bond the edge of the first wave-absorbing material on the upper surface of the PCB multi-layer antenna board, and bond the edge of the second wave-absorbing material on the blind groove step of the second blind groove; Weld the PCB multi-layer antenna board with the first wave-absorbing material and the second wave-absorbing material in the cavity; After the step S2, it further includes the following steps: Weld the cover plate on the top of the cavity, and connect the radio frequency SMP connector to the PCB multi-layer antenna board.

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